TW202206909A - Display device - Google Patents

Abstract

Provided is a display device including a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes an inner lead exposed at a side of the display panel. The conductive pad is disposed on the side of the display panel and connected with the inner lead. The external circuit board is disposed at the side of the display panel and includes an outer lead, wherein a conductive protrusion structure is disposed on the outer lead, and the conductive protrusion structure is at least in contact with the conductive pad, such that the external circuit board is electrically connected to the display panel. The adhesive layer is disposed between the external circuit board and the display panel.

Description

display device

The present invention relates to a display device, and more particularly, to a display device having an external circuit board with side bonding.

In the current side bonding process of the display device, conductive glue is mostly used to connect the outer pins of the external circuit board to the inner pins of the display panel, so that the conductive particles in the conductive glue make the external circuit board pass through as The conductive pads of the side electrodes are electrically connected with the inner pins in the display panel.

However, since the external circuit board is attached to the side of the display panel by side bonding, it is impossible to observe the distribution of conductive particles in the conductive adhesive and the pressing state from the side of the display panel, so the external circuit cannot be accurately calculated. The minimum contact area when the board is electrically connected to the display panel. In addition, the bonding of the external circuit board and the display panel through the conductive adhesive requires a high temperature process. As a result, the components in the display device are easily damaged by the high temperature process.

The invention provides a display device, which electrically connects the external circuit board and the display panel through the conductive protrusion structures on the outer pins of the external circuit board.

The display device of the present invention includes a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes inner pins exposed at the sides. The conductive pads are arranged on the side of the display panel and are connected with the inner pins. The external circuit board is disposed at the side of the display panel and includes outer pins, wherein the outer pins are provided with conductive protrusion structures, and the conductive protrusion structures at least contact the conductive pads, so that the The external circuit board is electrically connected to the display panel. The adhesive layer is disposed between the external circuit board and the display panel.

Based on the above, in the display device of the present invention, the outer pins of the external circuit board are provided with conductive protrusion structures, and the conductive protrusion structures contact the conductive pads on the sides of the display panel (even penetrate into the conductive pads), So that the external circuit board is electrically connected with the display panel. In this way, the minimum contact area when the external circuit board and the display panel are electrically connected can be easily calculated, and the external circuit board and the display panel do not need to be bonded by conductive glue and do not need to perform a high temperature process.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

The following examples will be described in detail with the accompanying drawings, but the provided examples are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn in full scale. In order to facilitate understanding, the same elements will be described with the same symbols in the following description.

The terms "including", "including", "having", etc. mentioned in the text are all open-ended terms, that is, "including but not limited to".

In addition, the directional terms such as "up", "down", "left" and "right" mentioned in the text are only used to refer to the direction of the drawings, and are not used to limit the present invention.

When describing elements in terms of "first", "second", etc., they are only used to distinguish these elements from each other and do not limit the order or importance of the elements. Therefore, in some cases, the first element may also be referred to as the second element, and the second element may also be referred to as the first element, without departing from the scope of the patent application.

The display device of the present invention includes a display panel, conductive pads (as side electrodes) disposed on the side of the display panel, an external circuit board disposed on the side of the display panel, and an external circuit board disposed between the external circuit board and the display panel. adhesive layer in between. These components will be described in detail below.

FIG. 1 is a schematic side view of a display panel according to an embodiment of the present invention. In the present invention, the type of the display panel will not be limited. For example, in this embodiment, the display panel includes two substrates disposed opposite to each other, but the present invention is not limited thereto. In other embodiments, the display panel may also include only one substrate. In addition, in order to facilitate the description of the present invention, FIG. 1 simply shows the thin film transistor substrate, the color filter substrate and the sealant for bonding the thin film transistor substrate and the color filter substrate constituting the display panel. The present invention is not limited thereto, and these components are well known to those skilled in the art and will not be further described herein. Depending on actual needs, those skilled in the art can make appropriate changes to the structure of the display panel in this embodiment.

Referring to FIG. 1 , in this embodiment, the display panel 10 includes a first substrate 102 and a second substrate 104 disposed opposite to each other and a sealant 105 for bonding the first substrate 102 and the second substrate 104 . The first substrate 102 is, for example, a thin film transistor substrate, and may have components such as active elements, circuit patterns, pins, etc., wherein the pins extend from the inside of the first substrate 102 to the sides and are exposed at the sides to communicate with the outside. Component connection. In this embodiment, the pins extending from the inside of the first substrate 102 to the sides and exposed at the sides are called inner pins 102a. In this embodiment, the number of the inner pins 102a shown is only for example, which is not limited in the present invention. In addition, the second substrate 104 is, for example, a color filter substrate, and may have components such as color filters, electrode patterns, and the like, wherein the electrode patterns are disposed on the second substrate 104 . In this embodiment, the electrode pattern 104a is disposed on the second substrate 104 and does not extend to the side of the second substrate 104 but is exposed at the side, that is, the edge of the electrode pattern 104a is spaced from the edge of the second substrate 104 some distance.

The sealant 105 is disposed between the first substrate 102 and the second substrate 104 for bonding the first substrate 102 and the second substrate 104 . In this embodiment, the sealant 105 is disposed adjacent to the edge of the display panel 10 and defines a space for accommodating the liquid crystal in the central area of the display panel 10 .

In addition, in this embodiment, a polarizing plate 106 a is provided on the front surface 100 a of the display panel 10 , and a polarizing plate 106 b is provided on the back surface 100 b of the display panel 10 .

The conductive pads 108 are disposed on the side of the display panel 10 and connected to the inner pins. In this embodiment, the conductive pads 108 are disposed on the side of the display panel 10, and each of the conductive pads 108 is connected to the corresponding inner pin 102a. In this way, the external elements can be electrically connected to the display panel 10 through the conductive pads 108 . In the present invention, the arrangement of the conductive pads 108 is not limited, and those skilled in the art can make changes according to actual needs. In this embodiment, the conductive pads 108 may be silver pads, for example.

2A is a schematic cross-sectional view of a part of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pin in FIG. 2A . The external circuit board mainly includes a substrate, circuit patterns arranged on the substrate, external pins for connecting with external components, and a chip arranged on the circuit patterns. In addition, in order to facilitate the description of the present invention, only a partial external circuit board is simply shown in FIG. 2 , which includes a substrate and external pins arranged on the substrate, and components in other areas are well known to those skilled in the art. No further explanation is required here.

Please refer to FIG. 2A and FIG. 2B at the same time. In this embodiment, the external circuit board 20 is, for example, a chip on film (COF) circuit board. The external circuit board 20 includes a substrate 200 , external pins 202 and circuit patterns disposed on the substrate 200 , and a chip disposed on the circuit patterns. For the sake of clarity and convenience, the circuit patterns and chips are not shown. The external pins 202 are disposed on the substrate 200 for connecting with external components (eg, the display panel 10 in FIG. 1 ), so that the external circuit board 20 can be electrically connected to the external components. In this embodiment, the number, width, thickness, length, and number of film layers of the outer pins 202 are not limited. Those skilled in the art can adjust the number, width, thickness, length, and film layers of the outer pins 202 according to actual needs. number. In this embodiment, conductive protrusion structures 204 are disposed on the outer pins 202 . These conductive protrusion structures 204 are distributed on the surface of the outer lead 202 without contacting each other. In this embodiment, the conductive protrusion structures 204 are disposed on the surface of the outer leads 202 in an array manner and are located at the ends of the outer leads 202 , but the invention is not limited thereto. In addition, in this embodiment, the conductive protrusion structure 204 is a tapered structure. In this embodiment, the conductive protrusion structure 204 is a quadrangular pyramid structure, but the present invention is not limited thereto. In other embodiments, the conductive protrusion structures may be conical structures or other types of three-dimensional structures.

As shown in FIG. 3A , the conductive protrusion structures 204a disposed on the surfaces of the outer pins 202 may be columnar structures with a top width smaller than a bottom width. As shown in FIG. 3B , the conductive protrusion structures 204b disposed on the surfaces of the outer pins 202 may be columnar structures with a top width equal to a bottom width. As shown in FIG. 3C , the conductive protrusion structures 204c disposed on the surfaces of the outer pins 202 may be spherical structures.

In addition, the conductive protrusion structures are not only disposed on the surface of the outer leads 202 in an array manner, but also can be arranged on the surface of the outer leads 202 in a strip-like manner that is parallel to each other. As shown in FIG. 3D , the conductive protrusion structures 204d disposed on the surface of the outer pins 202 are strip-shaped structures, and the extension direction of the conductive protrusion structures 204d is parallel to the extension direction of the outer pins 202 . As shown in FIG. 3E , the conductive protrusion structures 204 e disposed on the surface of the outer pins 202 are strip-shaped structures, and the extension directions of the conductive protrusion structures 204 e and the extension directions of the outer pins 202 are staggered. In addition, in the case where the conductive protrusion structures are strip-like structures, the shape of the cross section of each conductive protrusion structure perpendicular to the extending direction thereof may also be triangular, rectangular or spherical.

The display device of the present invention can be constructed by connecting the external circuit board 20 to the display panel 10 , which will be described in detail below.

4 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. In this embodiment, for the sake of clarity, only the inner pins inside the display panel 10 are shown, and other internal components are not shown.

1 , 2A , 2B and 4 , the display device 40 includes a display panel 10 , conductive pads 108 , an external circuit board 20 disposed at the side of the display panel 10 , and an external circuit board 20 and an external circuit board 20 . The adhesive layer 402 between the display panels 10 . When the external circuit board 20 is engaged with the display panel 10 , an outer pin 202 of the external circuit board 20 is aligned and in contact with a conductive pad 108 on the side of the display panel 10 , and the conductive pads 108 on the surface of the outer pin 202 are in contact with each other. The protruding structures 204 penetrate into the conductive pads 108 so that the external circuit board 20 can be electrically connected to the display panel 10 . In addition, in another embodiment, the conductive protrusion structures 204 may only contact the conductive pads 108 without penetrating into the conductive pads 108 .

In this embodiment, the height of the conductive protrusions 204 is smaller than the thickness of the conductive pads 108 to avoid damage to the inner leads 102 a when the conductive protrusions 204 penetrate the conductive pads 108 . In another embodiment, the height of the conductive protrusions 204 can be equal to the thickness of the conductive pads 108 , that is, when the conductive protrusions 204 penetrate the conductive pads 108 , they only contact the surface of the inner leads 102 a without excessively damaging the inner leads feet 102a. In addition, in this embodiment, the heights of each conductive protrusion structure 204 are equal, but the present invention is not limited thereto. In other embodiments, the conductive bump structures 204 may have different heights depending on the thickness of the conductive pads 108 . For example, when the thickness of the central portion of the conductive pad 108 is greater than the thickness of the peripheral portion, the height of the conductive protrusion structures 204 on the surface of the outer lead 202 corresponding to the peripheral portion of the conductive pad 108 may be greater than that corresponding to the conductive pad 108 . The height of the conductive protrusion structures 204 in the central portion of the pad 108 is such that all the conductive protrusion structures 204 can penetrate into the conductive pads 108 .

In addition, in another embodiment, as shown in FIG. 5 , before the external circuit board 20 is joined to the display panel 10 , the height of the conductive protrusion structure is greater than the thickness of the conductive pads 108 , so the external circuit board 20 and the display panel 10 are connected with each other. After bonding, the conductive protrusions penetrate into the conductive pads 108 and contact the inner pins 102a, and are then bent. In detail, in the display device 50 of the present embodiment, the conductive protrusion structure contacts the inner pins 102a in the conductive pads 108 and bends the inner pins 102a without damaging the inner pins 102a or excessively damaging the inner pins 102a folded to form a conductive protrusion structure 204f having a folded shape. At this time, the conductive protrusion structure 204f includes a main body portion 204f_1 and an extension portion 204f_2. The main body portion 204f_1 is disposed on the outer lead 202, and the extension portion 204f_2 extends from the main body portion 204f_1 on the surface of the inner lead 102a. Depending on the actual situation, the extension portion 204f_2 may be further located between the first substrate 102 and the second substrate 104. on the side surface. In addition, in the external circuit board 20, the extension parts 204f_2 on the adjacent outer pins 202 do not contact each other, so as to avoid the short circuit problem. In this way, the conductive protrusion structures 204f can be more firmly attached to the conductive pads 108 due to the increased contact area with the conductive pads 108 , thereby improving the bonding strength between the external circuit board 20 and the display panel 10 .

Returning to FIG. 1 , FIG. 2A , FIG. 2B and FIG. 4 , the adhesive layer 402 is disposed between the external circuit board 20 and the display panel 10 to provide adhesion between the external circuit board 20 and the display panel 10 . The material of the adhesive layer 402 is, for example, resin, but the present invention is not limited thereto. Furthermore, since the external circuit board 20 and the display panel 10 are electrically connected to each other through the conductive protrusions 204 and the conductive pads 108 , the adhesive layer 402 only needs to provide adhesion between the external circuit board 20 and the display panel 10 , without the need for additional conductive paths. In other words, in this embodiment, the conductive adhesive is not required to be used as the material of the adhesive layer 402 . Therefore, in the process of bonding the external circuit board 20 and the display panel 10 , it is not necessary to go through a high temperature process, so as to avoid damage to the components in the display device. In addition, the adhesive layer 402 can also provide a good buffer force between the external circuit board 20 and the display panel 10 , and prevent external moisture from entering the display device 40 and causing damage to the conductive pads 108 .

In addition, in this embodiment, the external circuit board 20 and the display panel 10 are electrically connected to each other through the conductive protrusion structures and the conductive pads 108 . In this way, the minimum contact area required for the electrical connection between the external circuit board 20 and the display panel 10 can be accurately calculated through the preset conductive protrusion structure, and the distribution and pressure of the conductive particles in the conductive adhesive cannot be observed because of the inability to observe. An accurate calculation cannot be achieved due to the circumstances.

It is also mentioned that in the case where the conductive protrusion structure is a strip structure and the extension direction of the conductive protrusion structure and the extension direction of the outer pins are staggered (for example, the conductive protrusion structure 204e), the external circuit board 20 and the display panel can be further improved. Engagement accuracy between 10. In detail, during the bonding process of the external circuit board 20 and the display panel 10 , since the extending direction of the conductive protrusion structures 204 e of the strip-like structure is staggered with the extending direction of the external pins 202 , the external pins 202 are connected to the conductive When the pads 108 are aligned, even if there is an alignment deviation between the outer pins 202 and the conductive pads 108 , the conductive protrusions 204e can still accurately penetrate into the conductive pads 108 to avoid reducing the contact area with the conductive pads 108 resulting in electrical problems.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10: Display panel 20: External circuit board 40, 50: Display device 100a: front 100b: Back 102: The first substrate 102a: inner pin 104: Second substrate 104a: Electrode Pattern 105: Frame glue 106a, 106b: polarizer 108: Conductive pads 200: Substrate 202: Outer pin 204, 204a, 204b, 204c, 204d, 204e, 204f: conductive protrusion structures 402: Adhesive layer 204f_1: main body 204f_2: Extensions

FIG. 1 is a schematic side view of a display panel according to an embodiment of the present invention. 2A is a schematic cross-sectional view of a part of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pin in FIG. 2A . 3A is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3B is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3C is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3D is a schematic top view of an outer pin according to another embodiment of the present invention. 3E is a schematic top view of an outer pin according to another embodiment of the present invention. 4 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a display device according to another embodiment of the present invention.

40: Display device

102: The first substrate

102a: inner pin

104: Second substrate

104a: Electrode Pattern

105: Frame glue

106a, 106b: polarizer

108: Conductive pads

200: Substrate

202: Outer pin

204: Conductive protrusion structure

402: Adhesive layer

Claims (9)

A display device, comprising: a display panel, including inner pins exposed at the sides; a conductive pad, disposed on the side of the display panel and connected to the inner pin; The external circuit board is arranged at the side of the display panel and includes outer pins, wherein the outer pins are provided with conductive protrusion structures, and the conductive protrusion structures at least contact the conductive pads, so that the the external circuit board is electrically connected to the display panel; and The adhesive layer is arranged between the external circuit board and the display panel. The display device according to claim 1, wherein the conductive protrusion structure is a cone-shaped structure, a column-shaped structure, a spherical structure or a strip-shaped structure. The display device according to claim 2, wherein the extending direction of the strip-shaped structure is parallel to the extending direction of the outer pins. The display device according to claim 2, wherein the extending direction of the strip-shaped structure is staggered with the extending direction of the outer pins. The display device of claim 1, wherein the height of the conductive protrusion structure does not exceed the thickness of the conductive pad. The display device according to claim 1, wherein the conductive protrusion structure comprises a main body part and an extension part, the main body part is disposed on the outer pin, and the extension part extends from the main body part to the extension part on the surface of the inner pin. The display device of claim 1, wherein the material of the adhesive layer includes resin. The display device according to claim 1, further comprising a polarizing plate disposed on the front and back of the display panel. The display device according to claim 1, wherein the conductive protrusion structure penetrates into the conductive pad.

Images