TW202206909A - Display device - Google Patents
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- TW202206909A TW202206909A TW109141519A TW109141519A TW202206909A TW 202206909 A TW202206909 A TW 202206909A TW 109141519 A TW109141519 A TW 109141519A TW 109141519 A TW109141519 A TW 109141519A TW 202206909 A TW202206909 A TW 202206909A
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Abstract
Description
本發明是有關於一種顯示裝置,且特別是有關於一種具有側邊接合(side bonding)的外接線路板的顯示裝置。The present invention relates to a display device, and more particularly, to a display device having an external circuit board with side bonding.
在目前的顯示裝置的側邊接合製程中,大多使用導電膠來將外接線路板的外引腳連接至顯示面板的內引腳,以藉由導電膠中的導電粒子來使外接線路板經由作為側邊電極的導電接墊而與顯示面板中的內引腳電性連接。In the current side bonding process of the display device, conductive glue is mostly used to connect the outer pins of the external circuit board to the inner pins of the display panel, so that the conductive particles in the conductive glue make the external circuit board pass through as The conductive pads of the side electrodes are electrically connected with the inner pins in the display panel.
然而,由於外接線路板是以側邊接合的方式附接在顯示面板的側面處,因此無法自顯示面板的側面觀測導電膠中的導電粒子分佈與壓合情形,因而無法準確地計算出外接線路板與顯示面板電性連接時的最小接觸面積。此外,經由導電膠來接合外接線路板與顯示面板,必須經歷高溫製程。如此一來,顯示裝置中的元件容易因高溫製程而受損。However, since the external circuit board is attached to the side of the display panel by side bonding, it is impossible to observe the distribution of conductive particles in the conductive adhesive and the pressing state from the side of the display panel, so the external circuit cannot be accurately calculated. The minimum contact area when the board is electrically connected to the display panel. In addition, the bonding of the external circuit board and the display panel through the conductive adhesive requires a high temperature process. As a result, the components in the display device are easily damaged by the high temperature process.
本發明提供一種顯示裝置,其藉由外接線路板的外引腳上的導電突起結構來使外接線路板與顯示面板電性連接。The invention provides a display device, which electrically connects the external circuit board and the display panel through the conductive protrusion structures on the outer pins of the external circuit board.
本發明的顯示裝置包括顯示面板、導電接墊、外接線路板以及黏著層。所述顯示面板包括暴露於側邊處的內引腳。所述導電接墊設置於所述顯示面板的側邊上且與所述內引腳連接。所述外接線路板設置所述顯示面板的側邊處,且包括外引腳,其中所述外引腳上設置有導電突起結構,且所述導電突起結構至少接觸所述導電接墊,以使所述外接線路板電性連接至所述顯示面板。所述黏著層設置於所述外接線路板與所述顯示面板之間。The display device of the present invention includes a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes inner pins exposed at the sides. The conductive pads are arranged on the side of the display panel and are connected with the inner pins. The external circuit board is disposed at the side of the display panel and includes outer pins, wherein the outer pins are provided with conductive protrusion structures, and the conductive protrusion structures at least contact the conductive pads, so that the The external circuit board is electrically connected to the display panel. The adhesive layer is disposed between the external circuit board and the display panel.
基於上述,在本發明的顯示裝置中,外接線路板的外引腳上設置有導電突起結構,且導電突起結構接觸顯示面板的側邊上的導電接墊(甚至穿入導電接墊中),以使外接線路板與顯示面板電性連接。如此一來,可易於計算出外接線路板與顯示面板電性連接時的最小接觸面積,且外接線路板與顯示面板之間可不需藉由導電膠來結合而不需進行高溫製程。Based on the above, in the display device of the present invention, the outer pins of the external circuit board are provided with conductive protrusion structures, and the conductive protrusion structures contact the conductive pads on the sides of the display panel (even penetrate into the conductive pads), So that the external circuit board is electrically connected with the display panel. In this way, the minimum contact area when the external circuit board and the display panel are electrically connected can be easily calculated, and the external circuit board and the display panel do not need to be bonded by conductive glue and do not need to perform a high temperature process.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合附圖作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
下文列舉實施例並配合所附圖來進行詳細地說明,但所提供的實施例並非用以限制本發明所涵蓋的範圍。此外,附圖僅以說明為目的,並未依照原尺寸作圖。為了方便理解,在下述說明中相同的元件將以相同的符號標示來說明。The following examples will be described in detail with the accompanying drawings, but the provided examples are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn in full scale. In order to facilitate understanding, the same elements will be described with the same symbols in the following description.
關於文中所提到「包含」、「包括」、「具有」等的用語均為開放性的用語,也就是指「包含但不限於」。The terms "including", "including", "having", etc. mentioned in the text are all open-ended terms, that is, "including but not limited to".
此外,文中所提到「上」、「下」、「左」、「右」等的方向性用語,僅是用以參考圖式的方向,並非用以限制本發明。In addition, the directional terms such as "up", "down", "left" and "right" mentioned in the text are only used to refer to the direction of the drawings, and are not used to limit the present invention.
當以「第一」、「第二」等的用語來說明元件時,僅用於將這些元件彼此區分,並不限制這些元件的順序或重要性。因此,在一些情況下,第一元件亦可稱作第二元件,第二元件亦可稱作第一元件,且此不偏離申請專利範圍的範疇。When describing elements in terms of "first", "second", etc., they are only used to distinguish these elements from each other and do not limit the order or importance of the elements. Therefore, in some cases, the first element may also be referred to as the second element, and the second element may also be referred to as the first element, without departing from the scope of the patent application.
本發明的顯示裝置包括顯示面板、設置於顯示面板的側邊上的導電接墊(作為側邊電極)、設置於顯示面板的側邊處的外接線路板以及設置於外接線路板與顯示面板之間的黏著層。以下將對這些構件作詳細說明。The display device of the present invention includes a display panel, conductive pads (as side electrodes) disposed on the side of the display panel, an external circuit board disposed on the side of the display panel, and an external circuit board disposed between the external circuit board and the display panel. adhesive layer in between. These components will be described in detail below.
圖1為本發明實施例的顯示面板的側視示意圖。在本發明中,將不對顯示面板的種類作限制。舉例來說,在本實施例中,顯示面板包括相對設置的兩個基板,但本發明不限於此。在其他實施例中,顯示面板也可僅包括一個基板。此外,為了便於對本發明進行說明,圖1中僅簡單繪示出構成顯示面板的薄膜電晶體基板、彩色濾光器基板以及用以接合薄膜電晶體基板與彩色濾光器基板的框膠,但本發明不限於此,且這些構件為本領域技術人員所熟知,於此將不再另行說明。視實際需求,本領域技術人員可對本實施例中的顯示面板的結構進行合適的變更。FIG. 1 is a schematic side view of a display panel according to an embodiment of the present invention. In the present invention, the type of the display panel will not be limited. For example, in this embodiment, the display panel includes two substrates disposed opposite to each other, but the present invention is not limited thereto. In other embodiments, the display panel may also include only one substrate. In addition, in order to facilitate the description of the present invention, FIG. 1 simply shows the thin film transistor substrate, the color filter substrate and the sealant for bonding the thin film transistor substrate and the color filter substrate constituting the display panel. The present invention is not limited thereto, and these components are well known to those skilled in the art and will not be further described herein. Depending on actual needs, those skilled in the art can make appropriate changes to the structure of the display panel in this embodiment.
請參照圖1,在本實施例中,顯示面板10包括相對設置的第一基板102與第二基板104以及用以接合第一基板102與第二基板104的框膠105。第一基板102例如為薄膜電晶體基板,且其可具有主動元件、線路圖案、引腳等構件,其中引腳自第一基板102的內部延伸至側邊且暴露於側邊處,以與外部元件連接。在本實施例中,自第一基板102的內部延伸至側邊且暴露於側邊處的引腳稱為內引腳102a。在本實施例中,繪示出的內引腳102a的數量僅為示例之用,本發明不對此進行限制。此外,第二基板104例如為彩色濾光器基板,且其可具有彩色濾光器、電極圖案等構件,其中電極圖案設置於第二基板104上。在本實施例中,電極圖案104a設置於第二基板104上,且不延伸至第二基板104的側邊而暴露於側邊處,亦即電極圖案104a的邊緣與第二基板104的邊緣相隔一段距離。Referring to FIG. 1 , in this embodiment, the
框膠105設置於第一基板102與第二基板104之間,用以接合第一基板102與第二基板104。在本實施例中,框膠105設置於鄰近顯示面板10的邊緣,且於顯示面板10的中央區域界定出用以容置液晶的空間。The
此外,在本實施例中,顯示面板10的正面100a上設置有偏光板106a,且顯示面板10的背面100b上設置有偏光板106b。In addition, in this embodiment, a polarizing
導電接墊108設置於顯示面板10的側邊上且與內引腳連接。在本實施例中,導電接墊108設置於顯示面板10的側邊上,且每一個導電接墊108皆與相應的內引腳102a連接。如此一來,外部元件可經由導電接墊108而與顯示面板10電性連接。在本發明中,不對導電接墊108的設置方式進行限定,本領域技術人員可視實際需求進行變更。在本實施例中,導電接墊108可例如為銀接墊。The
圖2A為本發明實施例的外接線路板的局部的剖面示意圖。圖2B為圖2A中的外引腳的上視示意圖。外接線路板主要包括基板、設置於基板上的線路圖案與用以與外部元件連接的外引腳以及設置於線路圖案上的晶片。此外,為了便於對本發明進行說明,圖2中僅簡單繪示出局部的外接線路板,其包括基板以及設置於基板上的外引腳,而其他區域中的構件為本領域技術人員所熟知,於此不再另行說明。2A is a schematic cross-sectional view of a part of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pin in FIG. 2A . The external circuit board mainly includes a substrate, circuit patterns arranged on the substrate, external pins for connecting with external components, and a chip arranged on the circuit patterns. In addition, in order to facilitate the description of the present invention, only a partial external circuit board is simply shown in FIG. 2 , which includes a substrate and external pins arranged on the substrate, and components in other areas are well known to those skilled in the art. No further explanation is required here.
請同時參照圖2A與圖2B,在本實施例中,外接線路板20例如為覆晶薄膜(chip on film,COF)線路板。外接線路板20包括基板200、設置於基板200上的外引腳202與線路圖案以及設置於線路圖案的晶片,其中為使圖示清楚以及便於說明,未繪示出線路圖案以及晶片。外引腳202設置於基板200上,用以與外部元件(例如圖1中的顯視面板10)連接,以使外接線路板20能夠電性連接至外部元件。在本實施例中,不對外引腳202的數量、寬度、厚度、長度以及膜層數進行限制,本領域技術人員可視實際需求來調整外引腳202的數量、寬度、厚度、長度以及膜層數。在本實施例中,外引腳202上設置有導電突起結構204。這些導電突起結構204彼此不接觸地分佈於外引腳202的表面上。在本實施例中,導電突起結構204以陣列的方式設置於外引腳202的表面上且位於外引腳202的末端處,但本發明不限於此。此外,在本實施例中,導電突起結構204為錐狀結構。在本實施例中,導電突起結構204為四角錐結構,但本發明不限於此。在其他實施例中,導電突起結構可為圓錐結構或其他型式的立體結構。Please refer to FIG. 2A and FIG. 2B at the same time. In this embodiment, the external circuit board 20 is, for example, a chip on film (COF) circuit board. The external circuit board 20 includes a
如圖3A所示,設置於外引腳202的表面上的導電突起結構204a可為頂部寬度小於底部寬度的柱狀結構。如圖3B所示,設置於外引腳202的表面上的導電突起結構204b可為頂部寬度等於底部寬度的柱狀結構。如圖3C所示,設置於外引腳202的表面上的導電突起結構204c可為球狀結構。As shown in FIG. 3A , the
此外,導電突起結構除了以陣列的方式設置於外引腳202的表面上之外,還可採用彼此平行的條狀方式設置於外引腳202的表面上。如圖3D所示,設置於外引腳202的表面上的導電突起結構204d為條狀結構,且導電突起結構204d的延伸方向與外引腳202的延伸方向平行。如圖3E所示,設置於外引腳202的表面上的導電突起結構204e為條狀結構,且導電突起結構204e的延伸方向與外引腳202的延伸方向交錯。此外,在導電突起結構為條狀結構的情況下,每一個導電突起結構的垂直於其延伸方向的剖面的形狀也可是三角形、矩形或球形。In addition, the conductive protrusion structures are not only disposed on the surface of the outer leads 202 in an array manner, but also can be arranged on the surface of the outer leads 202 in a strip-like manner that is parallel to each other. As shown in FIG. 3D , the
將外接線路板20與顯示面板10接合即可構成本發明的顯示裝置,以下將對此作詳細說明。The display device of the present invention can be constructed by connecting the external circuit board 20 to the
圖4為本發明實施例的顯示裝置的剖面示意圖。在本實施例中,為使圖示清楚,僅繪示出顯示面板10內部的內引腳而未繪示出其他內部構件。4 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. In this embodiment, for the sake of clarity, only the inner pins inside the
請同時參照圖1、圖2A、圖2B與圖4,顯示裝置40包括顯示面板10、導電接墊108、設置於顯示面板10的側邊處的外接線路板20以及設置於外接線路板20與顯示面板10之間的黏著層402。外接線路板20與顯示面板10接合時,外接線路板20的一個外引腳202與顯示面板10的側邊上的一個導電接墊108對準且接觸,而外引腳202的表面上的導電突起結構204穿入導電接墊108中,以使外接線路板20能夠電性連接至顯示面板10。此外,在另一實施例中,導電突起結構204可僅與導電接墊108接觸而不穿入導電接墊108中。1 , 2A , 2B and 4 , the
在本實施例中,導電突起結構204的高度小於導電接墊108的厚度,以避免導電突起結構204穿入導電接墊108時造成內引腳102a損壞。在另一實施例中,導電突起結構204的高度可等於導電接墊108的厚度,亦即導電突起結構204穿入導電接墊108時僅接觸內引腳102a的表面而不會過度損壞內引腳102a。此外,在本實施例中,每一個導電突起結構204的高度相等,但本發明不限於此。在其他實施例中,取決於導電接墊108的厚度,導電突起結構204可具有不同的高度。舉例來說,當導電接墊108的中央部分的厚度大於周邊部分的厚度時,在外引腳202的表面上對應於導電接墊108的周邊部分的導電突起結構204的高度可大於對應於導電接墊108的中央部分的導電突起結構204的高度,以使所有的導電突起結構204能夠穿入導電接墊108中。In this embodiment, the height of the
此外,在另一實施例中,如圖5所示,在外接線路板20與顯示面板10接合之前,導電突起結構的高度大於導電接墊108的厚度,因此在外接線路板20與顯示面板10接合之後,導電突起結構穿入導電接墊108中並接觸內引腳102a,且進而彎折。詳細地說,在本實施例的顯示裝置50中,在不傷害損壞內引腳102a或不過度損壞內引腳102a的情況下,導電突起結構在導電接墊108中接觸內引腳102a且彎折,形成具有彎折形狀的導電突起結構204f。此時,導電突起結構204f包括主體部204f_1以及延伸部204f_2。主體部204f_1設置於外引腳202上,且延伸部204f_2自主體部204f_1延伸在內引腳102a的表面上,且視實際情況,延伸部204f_2可進一步位於第一基板102與第二基板104的側表面上。此外,在外接線路板20中,相鄰的外引腳202上的延伸部204f_2彼此不接觸,以避免發生短路問題。如此一來,可使導電突起結構204f因與導電接墊108的接觸面積增加而更穩固地附接於導電接墊108,進而提高外接線路板20與顯示面板10之間的接合強度。In addition, in another embodiment, as shown in FIG. 5 , before the external circuit board 20 is joined to the
回到圖1、圖2A、圖2B與圖4,黏著層402設置於外接線路板20與顯示面板10之間,以提供外接線路板20與顯示面板10之間的附著力。黏著層402的材料例如為樹脂,但本發明不限於此。進一步說,由於外接線路板20與顯示面板10之間透過導電突起結構204以及導電接墊108而彼此電性連接,因此黏著層402僅需提供外接線路板20與顯示面板10之間的附著力,而不需額外提供導電路徑。換句話說,在本實施例中,不需使用導電膠來作為黏著層402的材料。因此,在接合外接線路板20與顯示面板10的過程中不須經歷高溫製程,以避免顯示裝置中的元件受損。另外,黏著層402也可在外接線路板20與顯示面板10之間提供良好的緩衝力,以及避免外界的濕氣進入顯示裝置40中而造成導電接墊108損壞。Returning to FIG. 1 , FIG. 2A , FIG. 2B and FIG. 4 , the
此外,在本實施例中,外接線路板20與顯示面板10之間透過導電突起結構以及導電接墊108而彼此電性連接。如此一來,可經由預先設置的導電突起結構來準確地計算出外接線路板20與顯示面板10電性連接時所需的最小接觸面積,不會因無法觀測導電膠中的導電粒子分佈與壓合情形而無法達成準確計算。In addition, in this embodiment, the external circuit board 20 and the
另外一提的是,在導電突起結構為條狀結構且導電突起結構的延伸方向與外引腳的延伸方向交錯的情況下(例如導電突起結構204e),可進一步提高外接線路板20與顯示面板10之間的接合準確度。詳細地說,在外接線路板20與顯示面板10的接合過程中,由於條狀結構的導電突起結構204e的延伸方向與外引腳202的延伸方向交錯,因此在將外引腳202與導電接墊108對準時,即使外引腳202與導電接墊108之間存在對準偏差,導電突起結構204e仍可以準確地穿入導電接墊108中而避免與導電接墊108之間的接觸面積減少而產生電性問題。It is also mentioned that in the case where the conductive protrusion structure is a strip structure and the extension direction of the conductive protrusion structure and the extension direction of the outer pins are staggered (for example, the
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視所附的申請專利範圍所界定者為準。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.
10:顯示面板
20:外接線路板
40、50:顯示裝置
100a:正面
100b:背面
102:第一基板
102a:內引腳
104:第二基板
104a:電極圖案
105:框膠
106a、106b:偏光板
108:導電接墊
200:基板
202:外引腳
204、204a、204b、204c、204d、204e、204f:導電突起結構
402:黏著層
204f_1:主體部
204f_2:延伸部10: Display panel
20:
圖1為本發明實施例的顯示面板的側視示意圖。 圖2A為本發明實施例的外接線路板的局部的剖面示意圖。 圖2B為圖2A中的外引腳的上視示意圖。 圖3A為本發明另一實施例的外引腳的剖面示意圖。 圖3B為本發明另一實施例的外引腳的剖面示意圖。 圖3C為本發明另一實施例的外引腳的剖面示意圖。 圖3D為本發明另一實施例的外引腳的上視示意圖。 圖3E為本發明另一實施例的外引腳的上視示意圖。 圖4為本發明實施例的顯示裝置的剖面示意圖。 圖5為本發明另一實施例的顯示裝置的剖面示意圖。FIG. 1 is a schematic side view of a display panel according to an embodiment of the present invention. 2A is a schematic cross-sectional view of a part of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pin in FIG. 2A . 3A is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3B is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3C is a schematic cross-sectional view of an outer lead according to another embodiment of the present invention. 3D is a schematic top view of an outer pin according to another embodiment of the present invention. 3E is a schematic top view of an outer pin according to another embodiment of the present invention. 4 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a display device according to another embodiment of the present invention.
40:顯示裝置40: Display device
102:第一基板102: The first substrate
102a:內引腳102a: inner pin
104:第二基板104: Second substrate
104a:電極圖案104a: Electrode Pattern
105:框膠105: Frame glue
106a、106b:偏光板106a, 106b: polarizer
108:導電接墊108: Conductive pads
200:基板200: Substrate
202:外引腳202: Outer pin
204:導電突起結構204: Conductive protrusion structure
402:黏著層402: Adhesive layer
Claims (9)
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US63/065,641 | 2020-08-14 |
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TW110104760A TWI751020B (en) | 2020-08-14 | 2021-02-08 | Electronic device and manufacturing method of electronic device |
TW110105874A TWI750034B (en) | 2020-08-14 | 2021-02-19 | Sputtering equipment and operation method thereof |
TW110107470A TWI761100B (en) | 2020-08-14 | 2021-03-03 | Electronic device |
TW110108336A TWI758124B (en) | 2020-08-14 | 2021-03-09 | Flat display device and manufacturing method of flat display device |
TW110112666A TWI763419B (en) | 2020-08-14 | 2021-04-08 | Printing apparatus and printing method |
TW110112830A TWI761171B (en) | 2020-08-14 | 2021-04-09 | Panel device and manufacturing method of panel device |
TW110123670A TWI775506B (en) | 2020-08-14 | 2021-06-29 | Display device and manufacturing method thereof |
TW110124073A TWI758203B (en) | 2020-08-14 | 2021-06-30 | Display device and manufacturing method thereof |
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