CN105849310B - For keeping the holding equipment of substrate during vacuum technology, for the equipment of sedimentary on substrate and for conveying the method for keeping equipment - Google Patents
For keeping the holding equipment of substrate during vacuum technology, for the equipment of sedimentary on substrate and for conveying the method for keeping equipment Download PDFInfo
- Publication number
- CN105849310B CN105849310B CN201380081823.5A CN201380081823A CN105849310B CN 105849310 B CN105849310 B CN 105849310B CN 201380081823 A CN201380081823 A CN 201380081823A CN 105849310 B CN105849310 B CN 105849310B
- Authority
- CN
- China
- Prior art keywords
- equipment
- holding equipment
- contact interfaces
- substrate
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 24
- 238000005516 engineering process Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 92
- 238000000151 deposition Methods 0.000 claims description 30
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 13
- 229920002530 polyetherether ketone Polymers 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 2
- 229920001655 poly(etheretheretherketone) Polymers 0.000 claims 1
- 229920001657 poly(etheretherketoneketone) Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 21
- 238000012545 processing Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000007717 exclusion Effects 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- -1 ether ether ketone Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Abstract
It provides a kind of for keeping the holding equipment (10) of substrate (20) during vacuum layer deposition.The holding equipment (10) include：Frame, the frame have one or more frame elements；And one or more contact interfaces (50,500), one or more contact interfaces offer is at one or more in the frame element, and one or more conveying rollers (60) of contact transportation system are configured to, wherein the Shaw D hardness of the material of one or more contact interfaces (50,500) is in the range of 85 to 90.
Description
Technical field
Embodiments of the present invention are related to a kind of for keeping the holding of substrate during vacuum technology (for example, layer deposition)
Equipment.Embodiments of the present invention are more particularly to a kind of for keeping the holding equipment of substrate during vacuum layer deposits.
Background technique
If known drying method is used in depositing materials on substrates.For example, can by physical vapour deposition (PVD) (PVD) technique,
Chemical vapor deposition (CVD) technique, plasma enhanced chemical vapor deposition (PECVD) technique etc. coated substrates.In general, institute
Technique is stated to execute in the process equipment or processing chamber where substrate to be coated.Deposition materials provide in a device.It is a variety of
Material can be used for carrying out the deposition on substrate there are also their oxide, nitride or carbide.Furthermore it is possible in processing chamber
Other processing steps (such as etching, structuring, annealing) are executed in room.
Coating material can use in several applications and several technical fields.For example, in microelectronics domain into
Row application, such as generates semiconductor devices.In addition, the substrate for display is coated with often through PVD process.In addition it applies and includes
Insulating panel, Organic Light Emitting Diode (OLED) panel, the substrate with TFT, colour filter etc..
In general, the glass substrate can be supported on carrier during handling glass substrate.Carrier is to glass
Or substrate is supported, and is driven through handling machine.Carrier is usually formed frame or plate, and the frame or plate are along substrate
Perimeter support substrate surface, or in the later case, such support surface.Specifically, the carrier of frame shape also can be used
In masking glass substrate, exposed wherein being provided by the hole in the carrier of frame encirclement for material to be deposited to be coated on
Substrate portion on hole or other processing steps for acting in the substrate portion exposed by hole hole.
Carrier is driven through handling machine by transportation system.In general, transportation system includes placing the roller of carrier, make
Carrier is obtained to move by the rotation of roller along transport path.During conveying, it can occur to denude at contact area between roller or grind
Damage.This will cause undesirable particle and generates, so that pollution effect can be generated during depositing operation.The product of sedimentary as a result,
Matter may deteriorate.
In view of the foregoing, one the goal is to provide a kind of holding equipment, specifically a kind of for heavy in vacuum layer
The holding equipment of substrate is kept during product, the holding equipment overcomes at least some of these problems of this field.
Summary of the invention
In view of the foregoing, provide it is a kind of according to independent claims 1 for keeping base during vacuum technology
The holding equipment of plate, a kind of system, one kind for being used to convey this holding equipment according to independent claims 13 are used for
The equipment of sedimentary and a kind of method for conveying holding equipment on substrate.Additional aspects of the present invention, advantage and spy
Sign will be apparent from dependent claims, the description and the appended drawings.
According to one embodiment, it provides a kind of for keeping the holding equipment of substrate during vacuum technology.The guarantor
Holding equipment includes：Frame, the frame have one or more frame elements；And one or more contact interfaces, it is described one or more
A contact interface offer is configured to one or more of contact transportation system at one or more in the frame element
Conveying roller, wherein the Shaw D hardness (shore D hardness) of the material of one or more contact interfaces is 85 to 90
In range.
A kind of system for conveying above-mentioned holding equipment is provided according to another aspect,.The system comprises conveying roller, institutes
It states conveying roller and is configured to contact described one or more contact interfaces for keeping equipment to convey the holding equipment.
According to another aspect, a kind of equipment for the sedimentary on substrate is provided.The equipment includes：Chamber, it is described
Chamber is deposited suitable for layer therein；Equipment is kept as described above, and the holding equipment is in the chamber；And sedimentary origin, institute
Sedimentary origin is stated for depositing the material for forming the layer.
According in another aspect, providing a kind of method for conveying above-mentioned holding equipment.The method includes：With contact circle
At least one of face contacts at least one of the conveying roller of the transportation system；And the conveying holding equipment.
Detailed description of the invention
Therefore, in order to mode used in features described above structure of the invention, the sheet summarized above is understood in detail
The more specific description of invention can be carried out in a manner of reference implementation.Attached drawing is related to embodiments of the present invention and is described as follows：
Fig. 1 shows according to embodiment described herein and provides one in the substrate regions for keeping equipment with substrate
Keep equipment；
It is another in the substrate regions for keeping equipment Fig. 2 shows being provided according to embodiment described herein and with substrate
Keep equipment；
Fig. 3 is shown according to embodiment described herein for conveying the detail view for keeping the system of equipment；
Fig. 4 show according to embodiment described herein for using keep equipment by material layer depositions setting on substrate
Standby view；And
Fig. 5 is shown according to embodiment described herein for conveying the flow chart for keeping the method for equipment.
Specific embodiment
With detailed reference to various embodiments of the invention, one or more examples of the invention are shown in the accompanying drawings.?
Below in the description of attached drawing, similar elements symbol indicates same parts.In general, it only describes relative to each embodiment party
The difference of formula.Each example is provided by explanation mode of the invention, rather than as limitation of the invention.In addition, conduct
A part of one embodiment illustrates or the feature of description can be used for other embodiments or in conjunction with other embodiments
It uses, to generate another embodiment.This specification is intended to include such modifications and variations.
Fig. 1 shows the holding equipment 10 or carrier according to embodiment described herein.For in vacuum technology (for example, true
Dead level deposition) during keep substrate 20 holding equipment 10 include：Frame 30, the frame 30 have one or more framework metadatas
Part；And one or more contact interfaces 50, one or more described contact interfaces 50 provide one or more in the frame element
A place, and it is configured to one or more conveying rollers of contact transportation system.The Shaw D of the material of one or more contact interfaces is hard
Degree is in the range of 85 to 90.
During conveying, it can occur to denude at carrier and roller contact area or wear.Due to one or more contact interfaces 50
Material Shaw D hardness in the range of 85 to 90, therefore the particle generated during conveying be mechanically forced into contact circle
Among face 50 (grain catcher (particle trap)) material, and therefore avoid the pollution effect during depositing operation.
The quality of sedimentary is improved as a result,.In other words, the material of one or more contact interfaces 50 is than for example made of metal defeated
The material softness for sending roller, the particle thus generated during conveying are mechanically forced among the material of contact interface 50.
According to some embodiments that can be combined with other embodiments described herein, the material of one or more contact interfaces
The Shaw D hardness of material is in the range of HSD 87 to 89, and specially HSD 87 or HSD 89.As example, one or more are connect
The material for touching interface is PEEK (for example, non-reinforcing PEEK), and the hardness of PEEK is about HSD 87.In another example,
The material of one or more contact interfaces is the PEEK of glass fiber reinforcement, and its hardness is about HSD 89.
Frame 30 is configured to supporting substrate 20.In general, frame 30 may include one or more frame elements.Fig. 1's
In example, frame 30 may include that four frame elements, i.e. two frame elements being vertically oriented and two are horizontally oriented
Frame element.In this example, contact interface can be provided at least one of horizontal frame member place.However, Fig. 1
Frame 30 can also only include a frame element, that is, rectangular frame element.
According to some embodiments, frame 30 limits the aperture for accommodating substrate 20.For example, substrate 20 can be determined
Position is in aperture.As example, substrate 20 can be located in aperture, to cover the boundary or edge of substrate,
To avoid being coated with the boundary or edge.Therefore, edge exclusion mask can be provided by carrier frame.According to some embodiment party
Formula, at least part of support surface for being used to support the fringe region of substrate 20 are provided in aperture.As example, frame
The section of frame 30 can be L shape to provide support surface.According to some implementations that can be combined with other embodiments described herein
Mode, one or more frame elements include polymer, plastics and/or metal.
According to some embodiments that can be combined with other embodiments described herein, shelter (not shown) is mentioned
It is provided with covering the boundary or edge of substrate 20, thus by the boundary or edge exclusion except layer deposition.According to some implementations
Mode, frame 30 inherently can be used as shelter, or can provide other masking.
According to some embodiments that can be combined with other embodiments described herein, the Rockwell C hardness of conveying roller
(Rockwell C hardness；It HRC) is at least HRC 52.In the exemplary implementation, the hardness of conveying roller HRC 52 to
In the range of 61, and specifically in the range of HRC 53 to 60 or HRC 53 to 59.As example, conveying roller is hard
Change roller (for example, one of the Chinese character components board (Cronidur)), for example, its hardness having is in the range of HRC 58 to 60.Therefore, big portion
Divide or even all particles generated during conveying are mechanically forced among the material of contact interface 50.
According to some embodiments that can be combined with other embodiments described herein, one or more contact interfaces 50
Material hardness is less than the material hardness of conveying roller.Therefore, major part or even all particles generated during conveying are mechanical
Ground is pressed among the material of contact interface 50.
It is merely illustrative above for the Shaw D hardness scale(degree) of contact interface and the Rockwell C hardness scale for conveying roller
, and any appropriate hardness scale(degree) can be used in embodiment described herein.Specifically, no matter used in scale such as
What, the material hardness of one or more contact interfaces all needs the material hardness less than conveying roller, so that generated during conveying
Grain is mechanically forced among contact interface material.
As example, it is contemplated that penetration hardness (indentation hardness), (common penetration hardness scale is example
Such as Rockwell, Vickers (Vickers), Shaw and Bu Shi (Brinell)).Penetration hardness measurement is sample to because from sharp object
The resistance of the deformation of material caused by the constant compression of body (for example, ram piston (indenter piston)) loads.This
In test, the critical dimension of the impression left by the pressure head with specific dimensions and load is measured.According to embodiment party described herein
Formula, when using identical pressure head and identical compressive load to execute this test for the material of contact interface material and contact roller
When, the critical dimension (for example, depth of cup) left in contact interface material by pressure head is greater than/is higher than by pressure head in conveying roller
Material in the critical dimension (being in this example depth of cup) that leaves.In other words, contact interface material is softer than conveying
The material of roller, or the material of contact roller are stiffer than contact interface material.
According to some embodiments that can be combined with other embodiments described herein, one or more contact interfaces 50
Material includes polymer, plastics and/or metal, specifically polyether-ketone, PEEK (polyether-ether-ketone, poly ether ether
Ketone), the PEEK, non-of PEEEK (polyethers ether ether ketone, poly ether ether ether ketone), glass fiber reinforcement
The PEEK and/or PEEKK (polyether ether ketone ketone, poly ether ether ketone ketone) of enhancing.It therefore, can be easily
And cost-effectively manufacture contact interface 50.
According to some embodiments that can be combined with other embodiments described herein, one or more contact interfaces 50 packet
Include at least one of material layer, bar (rod), track (rail) and item (bar).Example in Fig. 1 shows the packet of contact interface 50
Include material layer or the embodiment as material layer.In the exemplary implementation, which is provided at frame 30.As reality
Example, one or more frame elements include the material layer in the region of the roller for being configured to contact transportation system of frame 30, and
It and can specifically only include the material layer in the region of the roller for being configured to contact transportation system of frame 30.Implement in typical case
In mode, one or more in frame element can at least partly be coated with material layer or be laminated with material layer.The material layer can
For film or coating, such as with thickness in the range of 100 μm to 300 μm, and specifically about 200 μm.
In the exemplary implementation, one or more frame elements are manufactured from the same material with one or more contact interfaces 50.
In other embodiments, one or more frame elements are made from a different material with one or more contact interfaces 50.It therefore, can root
It is required according to such as technique or other considers (complicated factor or cost that such as manufacture) to design contact interface 50.
According to some embodiments that can be combined with other embodiments described herein, one or more contact interfaces 50 with
It can be provided from the mode that one or more frame elements are dismantled.It is replaceable when contact interface 50 is damaged or denudes as example
Or replacement contact interface 50.
According to some other embodiments that can be combined with other embodiments described herein, one or more frame elements
It is to be made into integration with one or more contact interfaces 50.This keeps holding equipment 10 easy to manufacture and is cost-effective.
According to some embodiments that can be combined with other embodiments described herein, one or more contact interfaces 50 tool
There are round, ellipse or rectangular shape.As example, when contact interface is material layer, provided thereon (for example, coating or layer
Pressure) frame element of contact interface 50 can have round, ellipse or rectangular shape, so that the material layer uses frame element
Shape.
Equipment 10 can kept to be configured to protect in the exemplary embodiment that other embodiments described herein combine
Hold the substrate 20 being vertically oriented.As example, contact interface 50 can be the element for only contacting transportation system of holding equipment 10
The element in the range of (such as roller) or region, the transportation system is relatively moved relative to the holding equipment 10.It therefore, can be with
It is ensured that, most of or even all particles generated during conveying are all absorbed by contact interface 50.
Fig. 2 shows set according to the holding for the holding substrate 20 during vacuum technology of other embodiments described herein
Standby 10.
The holding equipment of Fig. 2 be similar to Fig. 1 holding equipment, the difference is that contact interface 500 include bar, track or
Item.Bar, track or item can be known respectively as " contact bar ", " contact track " and " bow strip ".Term " bar ", " track " and " item "
It may include any slender member or element for being suitable as contact interface.In the exemplary implementation, bar, track or item provide
At one or more in frame element, and it is configured to one or more conveying rollers of contact transportation system.Reality shown in Fig. 2
In example, bar, track or item are for example attached to frame by one or more connecting elements 501 (such as connecting bridge).
According to some embodiments that can be combined with other embodiments described herein, bar, track or item have it is round,
Ellipse or rectangular section.
According to some embodiments, bar, track or item are at least partly covered by the material layer above with reference to described in Fig. 1.
As example, bar, track or item can be made of polymer, plastics and/or metal, and at least partly cover bar, track or item
Material layer may include the contact interface above with reference to described in Fig. 1 material.
Fig. 3 is shown according to embodiment described herein for conveying the detail view for keeping the system of equipment 10.
It include conveying roller 60 for conveying the system for keeping equipment 10, the conveying roller 60 is configured to contact holding equipment
10 one or more contact interfaces 500 keep equipment 10 to convey.
The similar place of the holding equipment of the holding equipment and Fig. 2 of Fig. 3 is that contact interface 500 includes bar, track or item.
Bar, track or item offer are configured to the one of contact transportation system at one or more in one or more frame elements
Or multiple conveying rollers 60.In the present example illustrated in fig. 3, bar, track or item are for example by one or more connecting elements 501 (as connected
Bridge) it is attached to frame.
According to can with some embodiments in conjunction with other embodiments described herein, conveying roller 60 include groove 61.Make
For example, groove 61 is configured to be at least partially accommodated contact interface 500.Contact interface 500 can be configured to and groove 61
It engages (engage).In a typical implementation, groove 61, which is configured to guide during conveying, keeps equipment 10.Although figure
3 show the example that contact interface 500 includes bar, track or item, but the disclosure is not limited to this.Holding equipment in Fig. 3
It can be configured to holding equipment described in reference diagram 1.
According to different embodiments, equipment 10 is kept to can be used for PVD deposition technique, CVD deposition, board structure
Deburring (edging), heating (for example, annealing) or any type processing substrate.The implementation of equipment 10 is kept as described herein
Mode is with the method using this holding equipment 10 for the non-static (non-for the large-area glass substrate being vertically oriented
Stationary it) is particularly useful for (i.e. continuous) processing substrate.Non-static processing usually requires to keep equipment also
The masking element for being used for technique is provided.
Fig. 4 shows the schematic diagram of the chamber 600 (for example, deposition chambers) according to embodiment.Chamber 600 is suitable for deposition work
Skill, such as PVD or CVD technique.Substrate 20 is shown in the guarantor according to embodiment described herein on base plate transmission device 620
In holding equipment 10 or carrier or thereon.Sedimentary origin 630 (for example, material source or sources of deposition) is provided in processing chamber housing 612,
Towards that side to be coated of substrate 20.Sedimentary origin 630 (for example, sources of deposition) provides deposition material on the base plate 20 to be deposited
Material.
In Fig. 4, sedimentary origin 630 can be target (target) thereon with deposition materials, or material is allowed to discharge with heavy
Any other equipment of product on the base plate 20.In general, sedimentary origin 630 can be rotatable target.According to some embodiments, sedimentary origin
630 can be it is moveable, to position and/or replace the source.According to other embodiments, material source can be planar targets.
According to some embodiments, deposition materials can according to the subsequent applications of depositing operation and the substrate having been coated with 20 come
Selection.For example, the deposition materials of sedimentary origin 630 can be the material in the group being made of following item：Metal (such as aluminium, molybdenum,
Titanium, copper etc.), silicon, tin indium oxide and other transparent conductive oxides.Usually, it may include the oxide layer of such material, nitration case
Or carburization zone can be deposited by providing material from source to deposit, or by reactive deposition, the reactive deposition is i.e. from source
Material is reacted with the element (such as oxygen, nitrogen or carbon) from processing gas.According to some embodiments, as silica, silicon oxynitride,
The thin-film-transistor material of silicon nitride, aluminium oxide or aluminum oxynitride is used as deposition materials.
It is keeping in equipment 10 or carrier or is locating in general, substrate 20 provides, the holding equipment 10 or carrier also are used as
Edge exclusion exposure mask, particularly for non-static depositing operation.Dotted line 665 is exemplarily illustrated the deposition during chamber operation
Material path.According to the other embodiments that can be combined with other embodiments described herein, handled using providing
Independent edge exclusion mask in chamber 612 provides masking.As a result, both according to the holding equipment 10 of embodiment described herein
Can also there be the technique for being easy to non-static beneficial to statistical process.
Fig. 5 is shown according to embodiment described herein for conveying the flow chart for keeping the method 100 of equipment.
For convey keep equipment method 100 include：Transportation system is contacted at least one of contact interface
At least one of conveying roller (box 101)；And conveying keeps equipment (box 102).In the exemplary implementation, it keeps setting
It is conveyed for by the rotation of the roller of transportation system.
According to some embodiments, large-area substrates can have at least 0.174m2Size.In general, the size can be
About 1.4m2To about 8m2, more typically about 2m2To about 9m2, or even up to 12m2.In general, according to embodiment described herein
The rectangular substrate that can be used for of holding equipment be large-area substrates as described herein.For example, large-area substrates can be for the 5th generation
(it corresponds to about 1.4m to substrate2Substrate (1.1m x 1.3m)), the 7.5th generation substrate (its correspond to about 4.39m2Substrate (1.95m
X 2.25m)), the 8.5th generation substrate (its correspond to about 5.5m2Substrate (2.2m x 2.5m)), or even the 10th generation substrate (its
Corresponding to about 8.7m2Substrate (2.85m × 3.05m)).It is (such as the 11st generation and the 12nd generation) more of new generation and right to be similarly effected
Answer substrate area.
In general, substrate can be made of any material for being suitable for material deposition.For example, substrate can be by selected from by following item structure
At group in material be made：It is glass (for example, soda-lime glass, borosilicate glass etc.), metal, polymer, ceramics, compound
Material, carbon fibre material or can by depositing operation be coated with any other materials or combination of materials.
During conveying, it can occur to denude at contact area between carrier and roller or wear.Since one or more contact boundary
Generated particle is mechanically forced into contact to the Shaw D hardness of the material in face in the range of 85 to 90, therefore during conveying
Among boundary material, and thus avoid the pollution effect during depositing operation.The quality of sedimentary is improved as a result,.
Although the above content is directed to embodiments of the present invention, without departing substantially from base region of the invention the case where
Under, it is also contemplated that of the invention other and further embodiment, and the scope of the present invention be by appended claim Lai
It determines.
Claims (20)
1. one kind, for keeping the holding equipment (10) of substrate (20) during vacuum technology, the holding equipment (10) includes：
Frame (30), the frame have one or more frame elements；And
One or more contact interfaces (50,500), one or more described contact interfaces provide one or more in the frame element
A place, and one or more conveying rollers (60) of contact transportation system are configured to,
Wherein the Shaw D hardness of the material of one or more contact interfaces (50,500) is in the range of 85 to 90.
2. holding equipment (10) according to claim 1, which is characterized in that one or more described contact interfaces (50,500)
Material Shaw D hardness in the range of 87 to 89.
3. holding equipment (10) according to claim 1, which is characterized in that one or more described contact interfaces (50,500)
The Shaw D hardness of material be 87 or 89.
4. holding equipment (10) according to claim 1, which is characterized in that one or more described contact interfaces (50,500)
Including at least one of material layer, bar, track and item.
5. holding equipment (10) according to claim 1, which is characterized in that one or more described contact interfaces (50,500)
The material include at least one of polymer, plastics and metal.
6. holding equipment (10) according to claim 1, which is characterized in that one or more described contact interfaces (50,500)
The material include at least one of polyether-ketone, PEEK, PEEEK, the PEEK of glass fiber reinforcement and PEEKK.
7. holding equipment (10) according to claim 1, which is characterized in that one or more described frame elements include polymerization
At least one of object, plastics and metal.
8. holding equipment (10) according to claim 1, which is characterized in that one or more described frame elements and described one
Or multiple contact interfaces (50,500) are manufactured from the same material.
9. holding equipment (10) according to claim 1, which is characterized in that one or more described frame elements and described one
Or multiple contact interfaces (50,500) are made from a different material.
10. holding equipment (10) according to claim 1, which is characterized in that one or more contact interfaces (50,
500) it is provided in a manner of it can be dismantled from one or more described frame elements.
11. holding equipment (10) according to claim 1, which is characterized in that one or more described frame elements are and institute
One or more contact interfaces (50,500) are stated to be made into integration.
12. holding equipment (10) according to claim 1, which is characterized in that one or more contact interfaces (50,
500) there is round, ellipse or rectangular shape.
13. holding equipment (10) according to claim 1, which is characterized in that the holding equipment (10) is configured to protect
Hold the substrate (20) being vertically oriented.
14. holding equipment (10) according to any one of claim 1 to 13, which is characterized in that it is described one or more connect
The material hardness for touching interface (50,500) is less than the material hardness of the conveying roller (60).
15. a kind of for conveying the system according to any one of claim 1 to 13 for keeping equipment, the system packet
It includes：
Conveying roller (60), the conveying roller (60) are configured to contact described one or more described contact circles for keeping equipment (10)
Face (50) is to convey the holding equipment (10).
16. system according to claim 15, which is characterized in that the material of one or more contact interfaces (50,500)
Hardness is less than the material hardness of the conveying roller (60).
17. equipment (600) of the one kind for the sedimentary on substrate (20), the equipment (600) include：
Chamber (612), the chamber (612) deposit suitable for layer therein；
Holding equipment (10) according to any one of claim 1 to 13, the holding equipment (10) is in the chamber；
And
Sedimentary origin (630), the sedimentary origin is for depositing the material for forming the layer.
18. equipment (600) according to claim 17, which is characterized in that one or more described contact interfaces (50,500)
Material hardness be less than the conveying roller (60) material hardness.
19. a kind of for conveying the method (100) according to any one of claim 1 to 13 for keeping equipment, the side
Method includes：
At least one of the conveying roller of (101) described transportation system is contacted at least one of described contact interface；With
And
Convey (102) described holding equipment.
20. according to the method for claim 19 (100), which is characterized in that the material of one or more contact interfaces is hard
Degree is less than the material hardness of the conveying roller.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2013/077921 WO2015096855A1 (en) | 2013-12-23 | 2013-12-23 | Holding arrangement for substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105849310A CN105849310A (en) | 2016-08-10 |
| CN105849310B true CN105849310B (en) | 2018-11-27 |
Family
ID=49880806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380081823.5A Expired - Fee Related CN105849310B (en) | 2013-12-23 | 2013-12-23 | For keeping the holding equipment of substrate during vacuum technology, for the equipment of sedimentary on substrate and for conveying the method for keeping equipment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6303024B2 (en) |
| KR (1) | KR101962787B1 (en) |
| CN (1) | CN105849310B (en) |
| TW (1) | TW201544623A (en) |
| WO (1) | WO2015096855A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017005290A1 (en) * | 2015-07-06 | 2017-01-12 | Applied Materials, Inc. | Carrier for supporting at least one substrate during a sputter deposition process, apparatus for sputter deposition on at least one substrate, and method for sputter deposition on at least one substrate |
| CN108138314A (en) * | 2015-09-21 | 2018-06-08 | 应用材料公司 | Substrate carrier and sputtering deposition device and its application method |
| CN115103926A (en) * | 2020-05-13 | 2022-09-23 | 应用材料公司 | Carrier for a roller transport system, roller transport system and vacuum treatment installation with a roller transport system |
| TWI737520B (en) * | 2020-08-14 | 2021-08-21 | 友達光電股份有限公司 | Display panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641272A (en) * | 2007-04-16 | 2010-02-03 | 株式会社爱发科 | Conveyor, and film-forming apparatus and maintenance method thereof |
| CN101946314A (en) * | 2008-02-21 | 2011-01-12 | 格林策巴赫机械制造有限公司 | Method and device for conveying and rotating impact-sensitive panels in ultra clean rooms |
| CN101980935A (en) * | 2008-03-27 | 2011-02-23 | 格林策巴赫机械制造有限公司 | Method and device for fixing and transporting impact-sensitive sheets in sputter feed systems |
| DE102011017566A1 (en) * | 2010-04-22 | 2011-12-01 | Von Ardenne Anlagentechnik Gmbh | Substrate holder useful for a substrate treatment system, comprises a flat frame with a substrate reception for the substrate to be treated, and contacting unit for electrical contacting of the substrate holder and a coupling plate |
| CN102458336A (en) * | 2009-04-30 | 2012-05-16 | Sca卫生用品公司 | Method for providing an elasticated web |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538093Y2 (en) * | 1973-07-10 | 1978-03-02 | ||
| JP3108980B2 (en) * | 1994-08-11 | 2000-11-13 | 松下電器産業株式会社 | Disk playing device |
| JP2001028389A (en) * | 1999-07-14 | 2001-01-30 | Nichias Corp | Manufacture of silicon wafer holding/transfer jig |
| US20030031548A1 (en) * | 2001-08-09 | 2003-02-13 | Parell Phillip King | Rigid vacuum tip |
| JP2005016589A (en) * | 2003-06-24 | 2005-01-20 | Nsk Ltd | Rotating device |
| US20090071403A1 (en) * | 2007-09-19 | 2009-03-19 | Soo Young Choi | Pecvd process chamber with cooled backing plate |
| JP5554779B2 (en) * | 2008-08-25 | 2014-07-23 | アプライド マテリアルズ インコーポレイテッド | Coating chamber with movable shield |
| US20100163406A1 (en) * | 2008-12-30 | 2010-07-01 | Applied Materials, Inc. | Substrate support in a reactive sputter chamber |
| JP2011061023A (en) * | 2009-09-10 | 2011-03-24 | Kaneka Corp | Substrate holding member and method for manufacturing thin film |
| EP2646594A1 (en) * | 2010-12-01 | 2013-10-09 | Applied Materials, Inc. | Evaporation unit and vacuum coating apparatus |
| WO2012140799A1 (en) * | 2011-04-11 | 2012-10-18 | 株式会社アルバック | Deposition apparatus |
| JP2013120907A (en) * | 2011-12-08 | 2013-06-17 | Olympus Corp | Substrate transfer device |
| JP3199312U (en) * | 2012-01-24 | 2015-08-20 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Aluminum coating or ceramic parts for substrate drive systems |
| JP2014107412A (en) * | 2012-11-28 | 2014-06-09 | Tokyo Electron Ltd | Transport system and deposition device |
-
2013
- 2013-12-23 CN CN201380081823.5A patent/CN105849310B/en not_active Expired - Fee Related
- 2013-12-23 JP JP2016559509A patent/JP6303024B2/en not_active Expired - Fee Related
- 2013-12-23 KR KR1020167020184A patent/KR101962787B1/en active IP Right Grant
- 2013-12-23 WO PCT/EP2013/077921 patent/WO2015096855A1/en active Application Filing
-
2014
- 2014-12-09 TW TW103142747A patent/TW201544623A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641272A (en) * | 2007-04-16 | 2010-02-03 | 株式会社爱发科 | Conveyor, and film-forming apparatus and maintenance method thereof |
| CN101946314A (en) * | 2008-02-21 | 2011-01-12 | 格林策巴赫机械制造有限公司 | Method and device for conveying and rotating impact-sensitive panels in ultra clean rooms |
| CN101980935A (en) * | 2008-03-27 | 2011-02-23 | 格林策巴赫机械制造有限公司 | Method and device for fixing and transporting impact-sensitive sheets in sputter feed systems |
| CN102458336A (en) * | 2009-04-30 | 2012-05-16 | Sca卫生用品公司 | Method for providing an elasticated web |
| DE102011017566A1 (en) * | 2010-04-22 | 2011-12-01 | Von Ardenne Anlagentechnik Gmbh | Substrate holder useful for a substrate treatment system, comprises a flat frame with a substrate reception for the substrate to be treated, and contacting unit for electrical contacting of the substrate holder and a coupling plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6303024B2 (en) | 2018-03-28 |
| WO2015096855A1 (en) | 2015-07-02 |
| KR101962787B1 (en) | 2019-03-27 |
| TW201544623A (en) | 2015-12-01 |
| KR20160102059A (en) | 2016-08-26 |
| JP2017503354A (en) | 2017-01-26 |
| CN105849310A (en) | 2016-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105849310B (en) | For keeping the holding equipment of substrate during vacuum technology, for the equipment of sedimentary on substrate and for conveying the method for keeping equipment | |
| CN106165056B (en) | Retaining piece, the carrier with the retaining piece and the method for fixed substrate | |
| TWI631650B (en) | Carrier for substrates and apparatus therefor | |
| KR200489874Y1 (en) | Substrate edge masking system | |
| US20140209025A1 (en) | Deposition mask and deposition apparatus having the same | |
| CN106460147B (en) | Flat edge design for better uniformity and increased edge life | |
| US9303317B2 (en) | Deposition apparatus | |
| CN105452523A (en) | Holding arrangement for substrates | |
| KR200493207Y1 (en) | Carrier for supporting a substrate and apparatus therefor | |
| JP6549731B2 (en) | Method and support for holding a substrate | |
| KR102177060B1 (en) | Apparatus for processing a substrate, a system for processing a substrate, and methods therefor | |
| WO2013083196A1 (en) | Substrate holder for full area processing, carrier and method of processing substrates | |
| CN107810288A (en) | Self-locking retainer for substrate | |
| KR102183040B1 (en) | Mask arrangement for masking a substrate, apparatus for processing a substrate, and method therefor | |
| Hwang et al. | Belt source and in‐line manufacturing equipment for very large‐size AMOLED | |
| WO2019233601A1 (en) | Static evaporation source, vacuum processing chamber, and method of depositing material on a substrate | |
| KR101578871B1 (en) | Coating apparatus | |
| KR20210013191A (en) | Holder, carrier comprising at least two holders, devices and methods | |
| CN104951133A (en) | Touch screen anti-reflection anti-fouling membrane |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181127 Termination date: 20201223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |