CN106165056B - Retaining piece, the carrier with the retaining piece and the method for fixed substrate - Google Patents

Retaining piece, the carrier with the retaining piece and the method for fixed substrate Download PDF

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Publication number
CN106165056B
CN106165056B CN201480077927.3A CN201480077927A CN106165056B CN 106165056 B CN106165056 B CN 106165056B CN 201480077927 A CN201480077927 A CN 201480077927A CN 106165056 B CN106165056 B CN 106165056B
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China
Prior art keywords
substrate
retaining piece
carrier
floating part
fixed
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Active
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CN201480077927.3A
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Chinese (zh)
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CN106165056A (en
Inventor
A·布吕宁
O·海梅尔
R·欣特舒斯特
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN106165056A publication Critical patent/CN106165056A/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H01J37/32376—Scanning across large workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A kind of carrier for the supporting substrate in the substrate processing chamber being vacuum-treated is described.The carrier includes at least two retaining pieces, wherein each retaining piece includes: fixed part, the fixed part is configured to be attached to carrier element, and has the fixation position relative to the carrier element；Floating part, the floating part can be moved relative to the fixed part along at least one direction；And fixed mechanism, the fixed mechanism is provided in the fixed position relative to floating part, and is configured to the substrate clamping in the retaining piece.Furthermore, the floating part can be moved to the second end position from the first end position along at least one described direction, and the floating part further comprises power arrangement, and the power arrangement is configured to make substrate be positioned at center in the carrier at least one described direction or pull substrate.

Description

Retaining piece, the carrier with the retaining piece and the method for fixed substrate
Technical field
Embodiments of the present invention are related to the carrier for processing substrate (for example, depositing for layer).Implementation of the invention Mode is particularly used for supporting the carrier with the large-area substrates of thin thickness in processing substrate machine and for handling The equipment of large-area substrates.
Background technique
If known drying method is used to material being deposited on substrate.For example, physical vapour deposition (PVD) can be passed through (physical vapor deposition, PVD) technique, chemical vapor deposition (chemical vapor deposition, CVD) technique, plasma enhanced chemical vapor deposition (plasma enhanced chemical vapor deposition, PECVD) technique etc. carrys out coated substrates.In general, executing technique in process equipment or processing chamber, substrate to be coated is located at In the process equipment or processing chamber.Deposition materials provide in a device.Multiple material, there are also their oxides, nitridation Object or carbide can be used for the deposition on substrate.In addition, other processing movement (such as etching, structuring, annealing) can also be It is carried out in processing chamber housing.
Coating material can be used in several applications and several technical fields.For example, a kind of application is for microelectronics Field, such as generation semiconductor devices.In addition, the substrate of display is usually coated with by PVD process.In addition application include every From panel, Organic Light Emitting Diode (organic light emitting diode, OLED) panel, with thin film transistor (TFT) Substrate, colour filter etc..
For the field of the production of such as display, thin-film solar cells manufacture and similar application, big face is handled Product glass substrate.Past is continued for increasing substrate size, advanced still to keep punching in this regard.Increase glass substrate ruler It is very little to make board carrying, support and processing more and more challenging in the case where not sacrificing yield because of glass rupture.
In general, glass substrate may be supported on carrier during the processing of glass substrate.Carrier drives glass or substrate Across handling machine.Carrier is usually formed frame or plate, along the peripheral support substrate surface of substrate, or in the latter cases, With plate support surface itself.Specifically, the carrier of frame shape can also be used for masking glass substrate, wherein by frame loops around load Intracorporal hole provides for being coated with to be deposited on the hole of the material in exposure substrate portion, or passes through hole for acting on And the hole of other processing movement in the substrate portion of exposure.
Bigger also thinner substrate trend may cause substrate protuberance, this is specifically attributed to applies during the deposition of layer The pressure being added on substrate, wherein protuberance causes problems due to may and then increasing because rupture a possibility that.In addition, protuberance can Quality can be reduced, such as the uniformity of the material layer deposited.Therefore, it is necessary to reduce protuberance, and it is larger so that carrier is transmitted And relatively thin substrate and crack-free, and improve the quality of be coated with material layer.
In view of above content, a kind of carrier overcoming the problems, such as at least some of this field is provided, is specifically had extremely The carrier and a kind of retaining piece for carrier of few two retaining pieces are beneficial.
Summary of the invention
In view of above content, a kind of retaining piece is provided, the retaining piece is configured to be attached to carrier element, to hold Substrate.According to another embodiment, a kind of carrier and the carrier including at least two retaining pieces are provided.Other side of the invention Face, advantages and features can be apparent from dependent claims, the description and the appended drawings.
According to one embodiment, a kind of retaining piece is provided, the retaining piece is configured to be attached to carrier element, so as to Substrate is held in substrate processing chamber.The retaining piece includes: fixed part, and the fixed part is configured to be attached to institute Carrier element is stated, and there is the fixation position relative to the carrier element；Floating part, the floating part can be relative to The fixed part is moved along at least one direction；And fixed mechanism, the fixed mechanism are provided relative to described floating The fixed position of dynamic part, and be configured to the substrate clamping in the retaining piece.
According to another embodiment, a kind of method for fixed substrate in the carrier is provided.The described method includes: by base Plate loads on the carrier；At least one direction, from middle position towards the first end position or the second end position relative to Carrier element moves at least one retaining piece, wherein the retaining piece is attached to the carrier element；And using at least Two retaining pieces clamp the substrate, wherein at least one retaining piece at least two retaining piece is located in its centre Outside position.
A kind of equipment for layer to be deposited in large-area glass substrate, the equipment packet are provided according to another aspect, Include: vacuum chamber, the vacuum chamber are suitable for carrying out layer deposition wherein；Transmission system, the Transmission system are suitable for transmission and carry Body, wherein the carrier includes at least two retaining pieces.Carrier element is configured to attach to hold the retaining piece packet of substrate Include: fixed part, the fixed part is configured to be attached to the carrier element, and has relative to the carrier element Fixation position；Floating part, the floating part can move at least one direction relative to the fixed part；And Fixed mechanism, the fixed mechanism is provided in the fixed position relative to the floating part, and being configured to will be described Substrate clamping is in the retaining piece.The equipment further comprises the sedimentary origin for depositing cambial material.
Detailed description of the invention
Therefore, in order to be understood in detail embodiments of the present invention features described above mode, it is above it is summarized more Specific description can be obtained in a manner of reference implementation.Attached drawing is related to embodiments of the present invention, and is described as follows:
Figure 1A, Figure 1B, Fig. 1 C and Fig. 1 D describe the carrier according to embodiment described herein, and each carrier has fixing Part, and wherein substrate is provided in the substrate regions of the carrier；
The example that Fig. 2A, Fig. 2 B, Fig. 2 C show the retaining piece that could attach to carrier according to embodiment described herein；
Fig. 3 shows another example of the retaining piece that could attach to carrier according to embodiment described herein；
Fig. 4 shows the view of the equipment for depositing layer of material on substrate using carrier according to embodiment described herein Figure.
Specific embodiment
With detailed reference to various embodiments of the invention, one or more example delineations of these embodiments are in attached drawing In.In the description below to attached drawing, similar elements symbology same parts.In general, only describing relative to individual The difference of embodiment.Each example is provided as explanation of the invention, and is not intended as limitation of the invention.In addition, making For the part of an embodiment come the feature describing or describe can also be used for other embodiments or with other embodiments knot It closes, to generate another embodiment.It is expected that description includes such modifications and variations.
According to embodiment described herein, a kind of carrier including at least two retaining pieces is proposed.Described at least two is solid Gripping member be configured to reduce because due to pressure substrate bending or protuberance, especially on substrate the introduced pressure of sedimentary, Or the introduced pressure of thermal expansion of substrate or carrier；Or the introduced pressure of weight of substrate.Retaining piece provides two parts master Body has fixed part and floating part.Two parts main body passes through sufficient tension (for example, of substrate edges per unit length Power) it is bent reduce substrate.
According to embodiment described herein, carrier includes at least two retaining pieces.At least two can be distributed around substrate peripheral Retaining piece, to be effectively prevented from or reduce bending or the protuberance of substrate.Each retaining piece includes: fixed part, is configured to be attached To carrier element and with the fixation position relative to carrier element；Floating part, relative to fixed part at least one side It is removable upwards；And fixed mechanism, it provides in the fixation position relative to floating part and is configured to exist substrate clamping In retaining piece or at carrier element.Floating part relative to fixed part relative motion provide one aspect be considered as Reduce the bending of substrate.In addition, power arranges (force arrangement) (for example, at least a spring or at least one air pressure Cylinder (pneumatic cylinder) etc.) be provided, and be configured in the carrier, pull substrate at least one direction.Power Arrangement and floating part relative to the relative motion of fixed part provide tension in a substrate in combination to avoid substrate Bending or protuberance.
According to can with the exemplary embodiment in conjunction with other embodiments described herein, substrate thickness can from 0.1 to 1.8mm, and retaining piece may be adapted to such substrate thickness.However, particularly useful, if substrate thickness is about 0.9mm or more The case where small (such as 0.7mm, 0.5mm or 0.3mm) and retaining piece are still suitable to such substrate thickness.
According to some embodiments, large-area substrates can have at least 0.174m2Size.In general, size can be about 1.4m2To about 8m2, more generally about 2m2To about 9m2, or even up to 12m2.In general, providing according to embodiment described herein Mask arrangement, the targeted rectangular substrate of device and method be large-area substrates as described herein.For example, large area Substrate can be the 5th generation, the 7.5th generation, the 8.5th generation or even the 10th generation, and the 5th generation corresponded to about 1.4m2Substrate (1.1m × 1.3m), in the 7.5th generation, corresponded to about 4.39 square metres of substrate (1.95m × 2.25m), and the 8.5th generation is corresponding to about 5.5m2Base In plate (2.2m × 2.5m), the 10th generation, correspond to about 8.7m2Substrate (2.85m × 3.05m).The even higher generation the (the such as the 11st Generation and the 12nd generation) and counterpart substrate area can all be similarly effected.Base of the embodiments of the present invention especially beneficial to about 0.3mm Plate thickness and the 8.5th generation large-area substrates.
Figure 1A shows carrier 100.Carrier 100 is configured to support large area thin substrate 101.As shown in Figure 1A, substrate 101 It provides in the position in carrier 100, especially when handling in the processing chamber.Carrier 100 includes frame or carrier element 160, frame or carrier element 160 limit window or hole.According to exemplary embodiment, frame provides substrate receiving surface.It is logical Often, during operation, that is, when loading substrate, substrate receiving surface is configured to contact substrate peripheral part.
In general, substrate 101 can be as made by any material for being suitable for material deposition.For example, substrate can be by selected from by glass Glass (for example, soda-lime glass, pyrex etc.), metal, polymer, ceramics or can be applied compound-material by depositing operation The material in group that any other materials of cloth or the group of these materials are combined into is made.It may also influence the protuberance of processing substrate It can be by being reduced according to the carrier of embodiment described herein.For glass substrate or ceramic substrate, it is in rupture In the case where another problem, carrier can also substantially reduce substrate breakage, and rupture can reduce production technology production because of increased loss Amount.
According to some embodiments, frame 160 can be made of aluminium, aluminium alloy, titanium and its alloy, stainless steel etc..For phase For small large-area substrates, such as the 5th generation or lower, frame 160 can be made of single-piece, i.e., frame is integrally formed. However, according to that can may include two or more with some embodiments in conjunction with other embodiments described herein, frame 160 Element, such as mandril, side lever and bottom bar.Specifically, for overlarge area substrate, carrier or carrier element be may be made in With multiple portions.These parts of carrier element are assembled to provide frame 160, to be used to support substrate 101.Frame 160 It is configured specifically for receiving substrate 101 in substrate regions.
Carrier 100 shown in Figure 1A further comprises multiple retaining pieces.In the example shown in Figure 1A, two retaining pieces 120 are mentioned For the top sides in frame or carrier element 160.According to some embodiments, described two fixings of the top sides of frame 160 The floating part of part 120 can be relative to fixing position, moving in one direction, wherein the side for being oriented parallel to substrate Edge, as shown by arrows.According to some embodiments, this two retaining pieces be can also provide in the left side and right side of carrier Between.According to some embodiments, floating part 123 is alternatively, or in addition gone back relative to the moving direction of fixed part 122 Edge perpendicular to substrate and being located at is arranged essentially parallel in the plane of substrate 101.
Although showing two retaining pieces 120 of the top sides of frame 160 in figure 1A, the present invention is not limited thereto.It is more than Two retaining pieces 120 may be provided on the top sides of frame 160.In addition, more than one retaining piece 120 may be provided on substrate On 101 one or more edges, it will be such as described in detail with reference to Figure 1B.
Carrier 100 shown in Figure 1A provides the floating part and power arrangement of this two retaining pieces, the float portion of the retaining piece Divide and is moved along the first direction, and power arrangement is configured to pull substrate in said direction.It can be floated by having One or more partial retaining pieces compensate the extension or other movements of substrate, and the floating part is removable relative to fixed part It is dynamic, such as moved in the plane for being arranged essentially parallel to carrier element and/or substrate.Substrate 101 is as defined by frame 160 Position in substrate regions can precisely adjust and be positioned at center.Enable substrate according to the retaining piece of embodiment described herein It is enough to extend on the opposite sides and/or to bottom.According to can with some embodiments in conjunction with other embodiments as described herein, Carrier as described herein and the equipment as described herein using carrier are for vertical processing substrate.Term " vertical processing substrate " It can be regarded as being different from horizontal base plate processing.That is, vertical processing substrate refers to carrier and substrate at substrate Substantially vertical orientation during reason, wherein and be accurately vertically oriented the deviation several years (such as reach 10 ° or be even up to 15 °) still it is considered as vertical processing substrate.Vertical substrate orientation with small inclination for example can lead to more stable board carrying or Reduce the risk of particle pollution sedimentary.
According to embodiment described herein, and as being described in detail referring to figs. 2 and 3, retaining piece provides at least one side Upward tension is to reduce substrate in the bending of its peripheral region.In addition, retaining piece can provide fixing or support force in carrier In steadily supporting substrate.By floating part relative to the relative motion of fixed part and by being configured at least one The power that side pulls up substrate is arranged to provide the tension of retaining piece.This is provided beneficial to tension, to reduce the bending of substrate Or protuberance.
Figure 1B shows another example of the carrier 100 according to some embodiments.Figure 1B illustrated embodiment is similar to figure 1A illustrated embodiment.The carrier 100 of Figure 1B includes four retaining pieces 120, wherein each retaining piece is located in carrier or carrier On each turning of main body.According to some embodiments, four retaining pieces also may be provided on each of carrier or carrier element The centre of side.According to some embodiments, in the floating part of at least four retaining pieces 120 one or more also in a second direction Removable, wherein this second direction (as shown by arrows) is in the plane for being arranged essentially parallel to substrate perpendicular to the first party To.
According to can with some embodiments in conjunction with other embodiments described herein, at least one retaining piece provide exist On at least two sides of frame 160, and selectively even provide on every side of frame 160.
According to the further embodiment that can additionally or alternatively implement, retaining piece is fixed to the position of substrate around base The periphery distribution of plate, such as be evenly distributed.For example, retaining piece can surround substrate edges, every 300mm to every 1000mm It (such as, is provided every 300mm to 800mm).In general, retaining piece can also provide on pairs of position.For example, the 8.5th generation Substrate can also reduce bending by the retaining piece at 24 positions or 12 pairs of positions respectively.
Fig. 1 C shows another example of carrier 100.According to can be with some realities in conjunction with other embodiments as described herein Mode is applied, carrier 100 includes the first setting element 151 and the second setting element 152, for substrate 101 to be located in substrate In region.First setting element 151 can be fixedly attached to frame 160.It can provide one or more first setting elements 151.The Two setting elements 152 can be arranged essentially parallel to substrate regions (being arranged essentially parallel to the surface of substrate) and be parallel to substrate 101 respective edges and move, as shown by arrows.
For example, the first setting element 151 and the second setting element 152 may include fixture or guiding device.According to one A little embodiments, the setting element 151,152 (such as at side or bottom) being such as exemplarily illustrated in fig. 1 c can design At the compensation of power caused by making setting element not contribute the bending by substrate substantially or swell.On the contrary, setting element is suitable Be made into avoid substrate 101 move freely and/or be provided as in the substrate receiving surface of frame 160 fixing 50% or more Substrate weight.
Carrier 100 further comprises at least two retaining pieces 120, such as on the top side or upside of frame 160.For dropping Low curved two retaining pieces 120 of substrate are shown in Figure 1C.However, fixing can be adapted to according to embodiment as described herein The quantity of part and corresponding fixed position.According to some embodiments, two or more retaining pieces 120 are provided.Particularly, two Or multiple retaining pieces 120 may be provided in the one side or the multi-lateral of substrate, such as shown in Figure 1B.
Fig. 1 D shows another carrier 100.Carrier 100 is configured to support large-area substrates.The carrier of Fig. 1 D includes first Setting element 151 is configured to provide predetermined substrate position to be used to for substrate 101 being located in substrate regions.First positioning Element 151 can be fixedly attached to frame 160.According to can with some embodiments in conjunction with other embodiments described herein, One or more first setting elements 151 for being fixedly attached to frame are provided.According to can be with other embodiments knot described herein The some embodiments closed, provide three the first setting elements 151.For example, two the first positioning members being permanently connected Part is provided at the bottom part of frame, and first setting element provides a lateral section in frame.First is fixed Bit unit can have gap to be inserted into substrate, or with for other means by substrate arranged in the first setting element, The edge for being configured to contact substrate and the edge contact surface for limiting contact position are wherein provided.Contact position limits carrier Interior predetermined substrate position.
Carrier 100 shown in Fig. 1 D further comprises multiple retaining pieces 120, these retaining pieces 120 can be relative to carrier frame Or the periphery (being parallel to the surface of received substrate in carrier) of carrier element is mobile.It is described in more detail referring to figs. 2 and 3 These retaining pieces.According to can with the exemplary embodiment in conjunction with other embodiments described herein, retaining piece can be along frame 160 Side provides and/or distribution.
According to can provide with some embodiments in conjunction with other embodiments described herein, retaining piece 120 in addition On frame.These retaining pieces are equivalent to for retaining piece described in Fig. 2 and Fig. 3 figure；However, the difference is that these hold Part and the protruding portion for not having the edge for being configured to contact substrate.That is, the protrusion shown in figure 2 and figure 3 respectively Portion 121 is omitted or is arranged towards frame (far from substrate receiving area), so that retaining piece is not in contact with substrate edges.According to It can be provided with the exemplary embodiment in conjunction with other embodiments described herein, retaining piece 120 in addition along the side of frame 160 And/or distribution, these sides are identical as the side of the first setting element is provided.The omission of the protruding portion of other retaining piece 120 Cause the substrate predetermined position limited by the first setting element 151.
As shown in Fig. 2A, 2B, 2C, according to embodiment described herein, retaining piece 120 includes fixed part 122 and floats Part 123, wherein fixed part has the fixation position relative to carrier element, and wherein floating part can be relative to fixation It moves in one direction part.Floating part 123 has substantially planar or plane first surface 124 to contact substrate 101 first substrate surface 102.Fixed mechanism 150 has lever arm (lever arm) 153, and Caused by Lever Arm includes substantially planar Or the second surface 125 of plane is to contact the second substrate surface 103 opposite with first substrate surface 102 of substrate 101.According to Some embodiments, first surface 124 and second surface 125 are substantially parallel to each other.Second surface 125 is also possible to rubber The surface of shape (rubber-like) part 125a, rubber-like part 125a are fixed to lever arm, such as shown in Figure 2 C.According to Embodiment described herein, fixed mechanism can be actuator, fixture, lever arm, knee lever system (knee lever system), Fixture or another element with one or more springs, to clamp substrate with floating part 123.
During operation, i.e., when substrate is transported by carrier, the insertion of substrate 101 is (interpose) or sandwiched (sandwich) between first surface 124 and second surface 125.The edge (for example, transverse sides) of substrate 101 is accessible floating The protruding portion 121 of dynamic part 123, wherein the protruding portion is upwardly extended in the first party for being parallel to the substrate edges.According to Protruding portion can be parallel to some embodiments in conjunction with other embodiments described herein, the moving direction of floating part 123 The first direction extended.Protruding portion can also provide for the surface of the barrier element in retaining piece.According to some embodiments, Floating part 123 also alternatively, or in addition is normal to the extension of protruding portion 121 relative to the moving direction of fixed part 122 Direction, and be located at and be arranged essentially parallel in the plane of substrate 101.
Power arrangement 130 at least one direction, tension 140 is provided in a substrate.Especially during depositing operation, Power 140 reduces for firm fixing substrate 101 or even avoids the protuberance of substrate 101.
Power arrangement 130 is configured to provide together with relative motion of the floating part 123 relative to fixed part 122 enough Tension is to reduce the bending (such as caused by the deposition of layer be bent) of substrate.Correspondingly, power arrangement 130 is configured to maintain Substrate orientation, especially at external substrate peripheral region, the substrate is oriented parallel to carrier element.That is, tending to It not will lead to bending or protuberance in generating the curved pressure of substrate, moved because retaining piece can be parallel to substrate edges, with example Such as compensate the extension of substrate.Before clamping substrate in the case where preloaded power arrangement, substrate can be further tensioned (tensioned)。
Floating part 123 is combined relative to the relative movement of fixed part 122 with power arrangement 130, along at least floating part 123 provide tension relative to the moving direction of fixed part 122 in a substrate.
In other words, when the torque 141 caused by the pressure (such as power) because being applied to substrate 101 occurs, float portion Tension defined by 123 relative motion and the power arrangement 130 relative to fixed part 122 is divided to will lead to less bending.Power arrangement 130 can also according to substrate form (material, thickness, size etc.), by the quantity of deposition layer on the substrate 101, will sink The type of long-pending material comes at least one of thickness of the one layer or more of deposition, processing chamber type, process time etc. Differently select.
It can be relative to the floating part that fixed part moves in one direction (such as Fig. 2A institute although retaining piece 120 includes Show), however, the present invention is not limited thereto.Retaining piece 120, which may also comprise, to float relative to fixed part along what at least two directions be moved Dynamic part, such as will be described in detail for Fig. 3.
Fig. 3 shows another example of the retaining piece 120 according to some embodiments.Fig. 3 illustrated embodiment is similar to Fig. 2 Shown in embodiment.The floating part of the retaining piece 120 of Fig. 3 can also be moved along second direction, wherein the second direction Perpendicular to first direction and be located at be arranged essentially parallel in the plane of substrate.In addition, another power arrangement 130a is in the second party Tension 140a is supplied to substrate to middle.During depositing operation, tension 140a is used to consolidate fixing in the second direction Substrate 101 avoids the protuberance of substrate 101 with reduction or even.
According to some embodiments, such as the example as shown in Figure 1A, 1B, 1C, the offer of one or more retaining pieces 120 is, for example, Every substrate edges unit length [1m] 0.1N to 10N or bigger tension.Edge length unit can be the length of substrate edges, For example, the side of the substrate of substantial rectangular.Therefore, the normalization of the tension to substrate peripheral length can be executed (normalization), so that tension values can be normalized to the tension of every 1 meter of substrate peripheral length.About Figure 1A, 1B, 1C can be determined based on the overall tension (or tension of every substrate edges unit length) for being applied to substrate for substrate 101 The quantity of the retaining piece 120 of every a side.In addition, according to some embodiments, the distribution on substrate side of retaining piece 120 It may be selected further to reduce the protuberance of substrate 101.
According to some embodiments, at least floating parts of two retaining pieces can relative to fixed part in one direction and It moves in the plane of the substrate.Power arrangement 130 is configured to the relative motion one with floating part 123 relative to fixed part 122 It rises to substrate 101 and tension 140 is provided.
According to some embodiments described herein, one or more power arrangement 130 provides tension 140 to moveable float portion Divide 123, so that substrate 101 is tensioned.
Alternatively, floating part 123 can move in two directions relative to fixed part.In this case, one Or multiple power arrangements 130,130a can provide and provide tension 140,140a to substrate at least two directions.
According to can with some embodiments in conjunction with other embodiments as described herein, power arrangement 130 include at least one A spring element.However, the present invention is not limited to spring elements, and the other elements for being suitable for generating tension can also be used. Example includes but is not limited to bar, compressed spring, piezo-electric device or pneumatic device.
According to different embodiments, carrier 100 can be used to be repaired in PVD deposition technique, CVD deposition, board structure Side, heating (for example, annealing) or any type processing substrate.The embodiment of carrier as described herein and use are such The method of carrier is particularly useful for non-static (non-stationary) (that is, continuous substrate processing).In general, perpendicular for processing The large-area glass substrate being directly orientated provides carrier.Non-static processing usually requires that carrier also provides masking element for technique.
Fig. 4 shows the schematic diagram of the deposition chambers 600 according to embodiment.Deposition chambers 600 are adapted for depositing operation, Such as PVD or CVD technique.Substrate 101 is shown in the carrier on base plate transmission device 620 Nei or at carrier.Sources of deposition 630 are provided in chamber 612, face substrate side to be coated.Sources of deposition 630 is provided to be deposited on the deposition materials on substrate 635。
In Fig. 4, source 630 can be with deposition materials target thereon or to allow material to discharge to be deposited on substrate Any other arrangement on 101.In general, material source 630 can be rotatable target.According to some embodiments, material source 630 can To be moveable, to position and/or replace source.According to other embodiments, material source can be planar targets.
According to some embodiments, deposition materials 635 can according to the subsequent applications of depositing operation and the substrate being applied come Selection.For example, the deposition materials in source can be the material selected from the group being made of following item: metal (such as aluminium, Molybdenum, titanium, copper etc.), silicon, indium tin oxide and other transparent conductive oxides.Usually, it may include oxide, the nitrogen of this material Compound, carbide lamella can be by depositing from source offer material or by reactive deposition, and reaction equation deposition is the material from source Material is reacted with the element (such as oxygen, nitrogen or carbon) from processing gas.
In general, substrate 101 is provided in carrier 100 or at carrier, carrier particularly with non-static depositing operation 100 can serve as edge exclusion mask.Dotted line 665 is exemplarily illustrated the deposition materials 635 during the operation of chamber 600 Path.It, can be independent in chamber 612 by providing according to can be with the other embodiments in conjunction with other embodiments described herein Edge exclusion mask mask is provided.It can be beneficial to statistical process according to the carrier of implementations described herein, can also have Beneficial to non-static technique.
Substrate edges are held according to that can consolidate with the embodiment in conjunction with other embodiments described herein, fixation member, Especially during depositing operation.Embodiment can make substrate reduce rupture, and the length and height particularly in view of substrate are increasingly The fact that big and thickness reduces.It can may also will affect substrate by reducing according to the carrier of embodiment described herein The protuberance of technique.
Although above content is directed to embodiments of the present invention, without departing substantially from base region of the invention the case where, It is also contemplated that of the invention other and further embodiment, and the scope of the present invention is determined by appended claim.

Claims (20)

1. a kind of retaining piece, the retaining piece is configured to be attached to carrier element, to hold substrate, the retaining piece packet It includes:
Fixed part, the fixed part is configured to be attached to the carrier element, and has relative to the carrier master The fixation position of body；
Floating part, the floating part can be arranged essentially parallel to the flat of the surface of the substrate relative to the fixed part It is moved in face and along at least one direction；And
Fixed mechanism, the fixed mechanism are provided in the fixed position relative to the floating part, and be configured to by The substrate clamping is in the retaining piece.
2. retaining piece as described in claim 1, which is characterized in that the floating part can be along at least one described direction from One end position is moved to the second end position, and wherein the floating part further comprises power arrangement, and the power arrangement is matched Being set to is centrally located the floating part relative to the fixed position at least one described direction.
3. retaining piece as claimed in claim 2, which is characterized in that the power arrangement is selected from by least one spring or at least The group of one pneumatic cylinder composition.
4. retaining piece as described in claim 1, which is characterized in that the floating part has protruding portion, the protruding portion quilt Contact substrate edges are configured to, wherein the protruding portion is upwardly extended in the first party for being parallel to the substrate edges, and its Described at least one moving direction of floating part be parallel to the first direction.
5. retaining piece as claimed in claim 2, which is characterized in that the floating part has protruding portion, the protruding portion quilt Contact substrate edges are configured to, wherein the protruding portion is upwardly extended in the first party for being parallel to the substrate edges, and its Described at least one moving direction of floating part be parallel to the first direction.
6. retaining piece as claimed in claim 3, which is characterized in that the floating part has protruding portion, the protruding portion quilt Contact substrate edges are configured to, wherein the protruding portion is upwardly extended in the first party for being parallel to the substrate edges, and its Described at least one moving direction of floating part be parallel to the first direction.
7. retaining piece as described in claim 1, which is characterized in that the fixed mechanism includes lever arm, and the wherein bar Arm is configured to the substrate being fixed to the floating part.
8. retaining piece as claimed in claim 2, which is characterized in that the fixed mechanism includes lever arm, and the wherein bar Arm is configured to the substrate being fixed to the floating part.
9. the retaining piece as described in any one of claim 3 to 6, which is characterized in that the fixed mechanism includes lever arm, and And wherein the lever arm is configured to the substrate being fixed to the floating part.
10. retaining piece as claimed in claim 7 or 8, which is characterized in that the fixed mechanism includes knee lever system, the knee Lever system includes the lever arm.
11. retaining piece as claimed in claim 7 or 8, which is characterized in that the fixed mechanism further comprise be fixed to it is described The rubber-like part of lever arm, and wherein the rubber-like part is configured to contact the substrate.
12. retaining piece according to any one of claims 1 to 8, which is characterized in that the floating part can be at least along Two directions are mobile, wherein the second direction is perpendicular at least one described direction and is being arranged essentially parallel to the flat of the substrate In face.
13. retaining piece as claimed in claim 12, which is characterized in that the floating part can be along the second direction from first End position is moved to the second end position, and wherein the floating part includes another power arrangement, and another power arrangement is matched It is set to and pulls the substrate in this second direction.
14. retaining piece as claimed in claim 13, which is characterized in that another power arrangement selected from by least one spring or The group of at least one pneumatic cylinder composition.
15. a kind of carrier including at least two such as retaining pieces described in any item of the claim 1 to 8.
16. a kind of carrier as claimed in claim 15 further comprises at least one folder for being attached to the carrier element Tool, the fixture have relative to carrier element fixation position and be configured to hold 50% or more the substrate weight Amount.
17. a kind of carrier as described in claim 15 or 16, which is characterized in that the carrier element is rectangle, and its In relative at least two retaining piece of the carrier element be configured that at least two retaining pieces, wherein each fixing Part is located in the carrier element top sides；At least two retaining pieces, wherein each retaining piece is located in the carrier element Among left and right side；Wherein at least two retaining piece is at least four retaining pieces, wherein each retaining piece is located in institute State each corner of carrier element；At least four retaining pieces, wherein each retaining piece is located in the every side of the carrier element Between；Or the combination of at least the two among the above.
18. a kind of method for the fixed substrate in the carrier with carrier element, which comprises
Substrate is loaded on the carrier；
In the plane on surface for being arranged essentially parallel to the substrate and at least one direction from middle position towards first end Position or the second end position move at least one retaining piece at least two retaining pieces relative to the carrier element, wherein At least one described retaining piece is attached to the carrier element；And
The substrate is clamped using at least two retaining piece, wherein at least one of described at least two retaining piece is held Part is located in outside its middle position.
19. method as claimed in claim 18, which is characterized in that at least one described retaining piece is pulled to its by power arrangement Middle position.
20. a kind of carrier, the carrier include:
Carrier element；
At least one fixture, at least one described fixture is attached to the carrier element, and has relative to the carrier The fixation position of main body；
At least two retaining pieces, wherein each retaining piece includes:
Fixed part, the fixed part is configured to be attached to the carrier element, and has relative to the carrier master The fixation position of body；
Floating part, the floating part can be moved relative to the fixed part along at least one direction, wherein described floating Dynamic part has protruding portion, and the protruding portion is configured to contact substrate edges, wherein the protruding portion is being parallel to the base The first party of edges of boards edge upwardly extends, and wherein at least one moving direction of the floating part is parallel to the first party To；And
Fixed mechanism, the fixed mechanism are provided in the fixed position relative to the floating part, and be configured to by The substrate clamping is in the retaining piece, wherein the floating part can be moved along at least one described direction from the first end position It moves to the second end position, and wherein the floating part further comprises power arrangement, the power arrangement is configured to described The substrate is centrally located in the fixed part at least one direction.
CN201480077927.3A 2014-04-17 2014-04-17 Retaining piece, the carrier with the retaining piece and the method for fixed substrate Active CN106165056B (en)

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KR102245762B1 (en) 2021-04-27

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