TW201607370A - Substrate edge masking system and apparatus having the same and method for masking edges of a substrate - Google Patents

Abstract

A substrate edge masking system is described. The substrate edge masking system includes a a substrate fixation element for holding a substrate, a masking element to cover at least a part of an edge of the substrate, and a substrate contact element connected to the masking element and for contacting the substrate. (Fig. 4).

Description

Substrate edge mask system

Embodiments of the present disclosure are directed to, for example, a substrate edge masking system for depositing layers. Embodiments of the present disclosure are particularly directed to substrate edge mask systems in substrate processing machines.

Some methods are known for depositing materials on a substrate. For example, the substrate can be subjected to a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, or a plasma enhanced chemical vapor deposition (PECVD) process. The process or the like is coated. In general, the process is carried out in a process equipment or process chamber in which the substrate to be coated is placed. The deposition material is provided in the device. A plurality of materials, as well as oxides, nitrides or carbides of the foregoing materials, can be used for deposition on a substrate. Furthermore, other process techniques such as etching, forming, annealing, or the like can be performed in the process chamber.

The coated materials can be used in a variety of applications and in a variety of technical fields. For example, applications in the field of microelectronics, such as the production of semiconductor devices. In addition, substrates for displays are often coated by a PVD process. Other applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters or the like.

Particularly in the field of, for example, display products, fabrication of thin film solar cells, and similar applications, large area glass substrates are used for processing. In the past, the size of the substrate has continued to increase and continues to increase. The increase in the size of the glass substrate does not cause the handling, support, and handling of the glass substrate to be more challenging without sacrificing throughput due to glass breakage.

In general, the glass substrate can be supported on a carrier during the process of the glass substrate. The carrier drives the glass or substrate through the processing machine. The carrier generally forms a carrier frame or a carrier plate that supports the surface of the substrate along the periphery of the substrate or, in the case described below, also supports the surface. In particular, a frame-shaped carrier can also be used to cover the glass substrate, wherein an opening in the carrier (the carrier is surrounded by the carrier frame) provides an opening for coating the material to be deposited on the exposed substrate portion, Or an opening for other process techniques applied to the substrate portion, the substrate portion being exposed by the opening.

A masking element may be further provided to cover portions of the carrier, particularly to avoid handling of these portions. The mask element typically provides a mask aperture. When the masking element is used with the carrier, the masking element and the carrier are generally aligned relative to each other, particularly the masking apertures are aligned with the apertures in the carrier. However, mismatching of the carrier with the masking element may occur resulting in non-uniform processing of the substrate. Therefore, there is a goal to reduce alignment mismatch between the carrier and the masking element and to improve the quality of the coated material layer.

In view of the above, the present disclosure primarily provides substrate edge masking systems, particularly substrate edge masking systems having substrate contact elements that overcome at least some of the technical problems.

According to the above, a substrate edge mask system as set forth in the first item of the patent application scope is provided. Further aspects, advantages, and features of the present disclosure are apparent from the appended claims, the description, and accompanying drawings.

According to an embodiment, a substrate edge mask system is provided. The substrate edge mask system can include a substrate securing element, a masking element, and a substrate contact element. The substrate fixing member is for holding the substrate. The mask element covers at least a portion of the edge of the substrate. A substrate contact element is coupled to the mask element and is adapted to contact the substrate.

According to another embodiment, a substrate edge mask system is provided. The substrate edge mask system can include a carrier, a masking element, and a substrate contact element. The carrier has a carrier frame and a substrate fixing member for holding the substrate. The masking element is used to mask at least the edge of the substrate and at least partially prevent the carrier from being coated. The substrate contact element is coupled to the mask element and faces the substrate. The substrate contact elements are placed on the substrate during processing of the substrate.

According to another aspect, an apparatus for depositing a layer on a substrate is provided that includes a chamber, a substrate edge mask system, and a deposition source. A chamber is used to deposit a layer in the chamber. The substrate edge mask system is in the chamber. A deposition source is used to deposit the material forming the layer. The substrate edge masking system can include a carrier having a carrier frame and a substrate securing element for holding the substrate, a masking element for masking at least the edge of the substrate and at least partially preventing the carrier from being coated, and connecting to the mask The component faces the substrate contact element of the substrate, and the substrate contact component is placed on the substrate during processing of the substrate.

According to another aspect, a method for masking an edge of a substrate is provided. The method can include providing a substrate securing element that forms an opening, positioning the substrate in the opening, providing a masking element having the substrate contact element, and placing the substrate contact element on the substrate.

Various embodiments of the present disclosure will now be described in detail, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same element symbols mean the same elements. In general, only the differences of the individual embodiments are described. The various examples are provided as a means of explaining the disclosure and are not intended to be limiting. Furthermore, features illustrated or described as part of one embodiment can be used in other embodiments or in conjunction with other embodiments to yield a further embodiment. Modifications and variations of the invention are intended to be included in the description.

In accordance with the described embodiments, the system provides a substrate edge mask system having substrate contact elements. The substrate contact elements can be configured to improve uniformity, and the substrate can be processed with the substrate contact elements. The substrate contact elements can help improve the alignment of the mask elements with the substrate. In particular, the substrate contact elements can provide a smaller gap between the masking element and the substrate, providing a reduction in the corresponding shadowing effect during processing of the substrate. That is, the useful life of the device that can grow the masking element and/or the support substrate and be covered by the masking element and/or the device that is processed using the substrate edge masking system.

In accordance with the described embodiments, the substrate edge mask system can include one or more substrate contact elements. They may be interspersed in regions corresponding to the perimeter or perimeter of the substrate to effectively support the mask elements to the substrate. Each of the substrate contact elements can include a substrate contact surface configured to contact the substrate and define a contact location that is advantageously untreated, such as coated.

According to an exemplary embodiment that can be combined with the other embodiments, the substrate thickness can be from 0.1 to 1.8 mm, and the substrate edge masking system, particularly the substrate fixing component 120 and the substrate contact component 300, can be adapted to the substrate thickness. However, a particularly advantageous substrate thickness is about 0.3 to 0.7 mm, such as 0.6 mm or 0.4 mm, and the substrate edge masking system, particularly the substrate holding component 120 and the substrate contact component 300, is suitable for this substrate thickness. According to an exemplary embodiment that can be combined with the other embodiments, the substrate can be a glass substrate. According to this embodiment, the substrate for the thin device can be processed. Furthermore, the substrate for the optical device can be processed.

The phrase "substrate edge" or "subsequent substrate edges" as used herein refers to a lateral surface of a substrate, that is, a surface along the thickness direction of the substrate. For example, the edge may be a surface on which the substrate is connected to the front side of the substrate and the back side of the substrate. In addition to the side surfaces, the substrate has two extended surfaces. One of the extended surfaces of the substrate may be a surface to be treated, such as a surface to be coated, and may be referred to as the front side of the substrate. Another extended surface relative to the extended surface to be treated may be referred to as the back side of the substrate. However, according to some embodiments, it is also possible to have two extended surfaces processed. Accordingly, it can be understood that the substrate has four side surfaces.

The phrase "substrate edge mask system" may refer to a system that provides a masking effect on the edge of the substrate, ie, protecting the edges of the substrate from being processed. Furthermore, the term "substrate edge masking system" may refer to a system that provides a masking effect to the carrier, that is, a device that protects the carrier or carrier from being processed. Furthermore, the term "substrate edge mask system" may refer to a system that provides a masking effect on a substrate, that is, a mask for processing a substrate, the mask pattern being dispersed over the substrate. Still further, the phrase "substrate edge masking system" may refer to a system that provides a masking effect on the carrier and/or substrate and/or substrate edge.

Figure 1A shows the carrier 102. The carrier 102 is configured to support the substrate 101. As shown in FIG. 1A, the substrate 101 is provided in a position in the carrier 102, particularly when processed in a process chamber. Carrier 102 includes a carrier frame 160 that defines a window or aperture. According to an exemplary embodiment, the carrier frame provides a substrate receiving surface. Typically, the substrate receiving surface is configured to contact the edge portion of the substrate during operation, that is, when the substrate is loaded.

Typically, substrate 101 can be made of any material suitable for deposition of materials. For example, the substrate may be selected from glass (eg, soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite or any other material or may be deposited by a deposition process The material of the group of coated materials is made up of a group of materials.

According to some embodiments, the carrier frame 160 may be made of aluminum, an aluminum alloy, titanium, an alloy of the foregoing elements, stainless steel, or the like. For relatively small substrates such as the 5th generation (GEN 5) or below, the carrier frame 160 can be made from a single piece, that is, the carrier frame is integrally formed. According to this embodiment, the carrier can be manufactured at low cost and with high reliability. However, according to some embodiments that may be combined with the other embodiments, the carrier frame 160 may include two or more components, such as a top bar, a side bar, and a bottom bar. Furthermore, especially for very large area substrates, the carrier can be manufactured with several parts. These portions of the carrier are assembled to provide a carrier frame 160 for supporting the substrate 101. According to this embodiment, a large substrate can be processed with a relatively small carrier, saving cost. The carrier frame 160 is specifically configured to accommodate the substrate 101 in the substrate region.

The carrier 102 shown in Figure 1A further includes a securing assembly. The stationary component can include a substrate securing element 120. In the example shown in FIG. 1A, two substrate fixing members 120 are provided in the lower left edge portion of the carrier frame 160. According to some embodiments, the two substrate securing elements 120 at the lower left edge portion of the carrier frame 160 are fixed in position and are not moveable.

Although FIG. 1A shows two substrate fixing members 120 in the lower left edge portion of the carrier frame 160, the present disclosure is not limited thereto. Two or more substrate fixing members 120 may be provided in the lower left edge portion of the carrier frame 160. For example, more than one substrate securing element 120 can be provided on each side of the substrate 101.

According to some embodiments, which may be combined with the other embodiments, two substrate fixing elements 120 are provided in the upper right edge portion of the carrier frame 160. According to some embodiments, the two substrate securing elements 120 in the upper right edge portion of the carrier frame 160 can be moved substantially parallel to the substrate region, or substantially parallel to the surface of the substrate as indicated by the arrows, and perpendicular to the substrate. The edge of 101 moves. According to this embodiment, the carrier can be adapted to different substrate sizes. Furthermore, the fixed element can be replaced by moving.

Although the two substrate fixing members 120 are shown in the upper right edge portion of the carrier frame 160 in FIG. 1A, the present disclosure is not limited thereto. Two or more substrate fixing members 120 may be provided in the upper right edge portion of the carrier frame 160. For example, more than one fixed unit 120 may be provided on each side of the substrate 101.

By providing the immovable substrate fixing member 120 in the left (or right) lower edge portion of the substrate 101, and by providing the movable substrate fixing member 120 in the right (or left) upper edge portion of the substrate 101, The position of the substrate 101 in the area of the substrate defined by the carrier frame 160 is precisely adjusted.

The substrate fixing member can provide a holding or supporting force to stably support the substrate in the carrier. The moment of the stationary unit can be provided by at least two surfaces configured to provide on opposite sides of the substrate, wherein the at least two surfaces provide the lever arms and are pressed together to stably clamp the substrate.

FIG. 1B shows other examples of carrier 102 in accordance with some embodiments. The embodiment shown in Figure 1B is similar to the embodiment shown in Figure 1A. The carrier 102 of Figure 1B includes substrate securing elements 120 located on more than two edge portions of the substrate 101, preferably on all of the edge portions. According to some embodiments, one or more of the substrate securing elements 120 are moveable. Furthermore, all of the substrate fixing members 120 can be provided to be movable.

FIG. 2 shows a perspective view of a carrier 102 having a masking element 200 provided on a carrier 102. The masking element 200 can be shaped to have the shape of a frame of two or more masking frame elements 220, 222 that form a masking aperture opening. The mask opening can have the same dimensions as the opening defined by the carrier frame 160. However, the mask opening may be larger than the opening defined by the carrier frame 160. Again, the mask opening can be smaller than the opening defined by the carrier frame 160, as will be particularly pointed out with reference to Figures 4 through 5.

According to some embodiments, which may be combined with the other embodiments, a mask opening is configured to receive or surround the substrate 101. According to some embodiments, the two or more mask frame elements 220, 222 are moveable relative to each other and configured to change the size of the mask opening. This is particularly advantageous for the masking element 200 to be adaptable to substrates 101 of different sizes. Furthermore, the thermal elongation of the mask element 200 can be compensated for.

Figure 3 shows a cross-sectional view of the carrier 102 and the mask element 200 along the dashed line in Figure 2 . As shown in FIG. 3, the carrier 102 can include a carrier frame 160 and a substrate securing element 120. The substrate fixing member 120 may be coupled to the carrier frame 160 to sandwich the substrate. A masking element 200 having a frame, such as a cooling frame 230, for cooling the masking element 200 during processing of the substrate 101 can be provided. In particular, the mask element 200 can be clipped to the cooling frame 230 by a mask clamping element (not shown).

FIG. 3 further shows carrier contact element 240 that may be provided with cooling frame 230. The carrier contact element 240 can provide a mechanical connection between the mask element 200 and the carrier 102. In particular, the mask element 200 can be supported to the carrier 102 by the carrier contact element 240 during processing of the substrate 101. In particular, the carrier contact element 240 can be placed on the carrier frame 160 during processing of the substrate 101.

In general, the mask member 200 is disposed to the front side of the substrate 101 with a specific slit d in a direction perpendicular to the front side of the substrate 101, and the front side of the substrate 101, that is, the substrate 101 faces the surface of the mask member 200. As shown in FIG. 3, the slit d can be maintained by the carrier contact member 240.

The supply of the gap d between the mask member 200 and the substrate 101 may cause a shadowing effect during the processing of the substrate 101 and may cause an uneven process of the substrate 101. In view of this, it is particularly interesting to form a gap d as small as possible. However, in the embodiment illustrated in FIG. 3, the mask member 200 is clipped to the cooling frame 230, and the cooling frame 230 is placed on the carrier frame 160 by the carrier contact member 240, and the carrier frame 160 is attached to the substrate. The substrate 120 sandwiches the substrate 101. This results in a long tolerance chain of interconnect elements, where each element and interconnect provides an aiming gap between the mask element 200 and the substrate 101 and between the mask element 200 and the substrate 101. The error between the actual gap d may be the source. With these errors, the actual gap d between the masking element 200 and the substrate 101 can change over the masking element 200 and/or the substrate 101. In particular, the slit d may have different dimensions from the mask element 200 and/or a portion of the substrate 101 to another portion.

In the embodiment shown in Fig. 3, the slit d may be in the range of 2 to 3 mm. In particular, the gap can be set high enough to compensate for errors along the tolerance chain, the tolerance chain: mask element - mask clip element - cooling frame - carrier contact element - carrier frame - substrate fixing element 120 - substrate.

In order to reduce the gap d between the masking element 200 and the substrate, it may be beneficial to consider the reduction in error when configuring the system. To reduce errors, the number of components in the tolerance chain can be reduced.

Figure 4 shows a substrate edge mask system with a reduced tolerance chain in accordance with an embodiment. According to an embodiment that can be combined with the other embodiments, the substrate edge mask system 100 can include a substrate securing element 120 for holding the substrate 101 to cover at least a portion of the masking element 200 of the edge of the substrate 101, with The substrate contact element 300 is connected to the mask element 200 and is used to contact the substrate 101. That is, the mask member 200 may be further provided together with the substrate contact member 300. Specifically, the substrate contact member 300 is located on the side of the mask member 200 facing the substrate 101, and overlaps the mask member with the substrate 101. In the area. The masking element 200 can be placed on the substrate 101 with the substrate contact element 300 interposed therebetween. That is, the substrate contact member 300 can support or support the mask member 200 to the substrate 101. Further, an element connected to the mask member 200, for example, the cooling frame 230, can be supported to the substrate 101 by the substrate contact member. That is, supporting the mask element 200 to the substrate 101 by the substrate contact element 300 can beneficially reduce the tolerance chain. Furthermore, the amount of error that can be beneficial for compensation can be reduced. Still further, the gap d between the substrate 101 and the mask member 200 can be reduced, the shadowing effect is reduced, and a uniform process of the substrate 101 is provided. According to an embodiment which can be combined with the other embodiments, the gap d between the substrate 101 and the mask member 200 is 1.5 mm or less.

According to embodiments that may be combined with the other embodiments, the substrate edge mask system 100 may further include a carrier frame 160 that is coupled to the substrate securing element 120. According to embodiments that may be combined with the other embodiments, the substrate edge mask system 100 may further include a cooling frame 230 coupled to the mask element 200.

According to an embodiment that can be combined with the other embodiments, the substrate fixing member 120 is coupled to the carrier frame 160 by an elastic support 140. That is, the connection between the substrate holding member 120 and the carrier frame 160 may be elastic to adjust or compensate for the contact of the mask member 200 to the substrate 101. In particular, the resilient support 140 can provide elasticity perpendicular to the front side of the substrate to compensate for movement caused by placement of the substrate contact element 300 to the substrate 101. Moreover, damage to the substrate 101 due to contact of the mask member 200 can be avoided, for example, mechanical shock caused by placing the mask member 200 (particularly placing the substrate contact member 300) onto the substrate 101 can be damped. Alternatively, the substrate fixing member 120 may further include a resilient member (not shown) that provides the elastic support member 140.

According to an embodiment that can be combined with the other embodiments, the substrate contact element 300 can be made of plastic. Specifically, the substrate contact member 300 may be a polyether ether ketone (PEEK) or a high-performance polyimide-based plastics such as a trademark manufactured by DuPont. Vespel's plastics are made of materials similar to / equivalent to these materials. That is, the substrate contact member 300 contacting the substrate 101 is made of a plastic material, specifically, a material other than metal. Furthermore, scratches on the surface of the substrate 101 due to the contact of the substrate contact member 300 with the substrate 101 can be avoided. Still further, the substrate contact member 300 can be manufactured at low cost and with high reliability.

According to an embodiment that can be combined with the other embodiments, the substrate thickness can be from 0.1 to 1.8 mm, and the substrate edge mask system 100, and in particular the substrate fixing component 120 and the substrate contact component 300 can be applied to the substrate thicknesses. . However, a particularly advantageous substrate thickness is about 0.3 to 0.7 mm, such as 0.6 mm or 0.4 mm, and the substrate edge masking system 100, and the special substrate fixing component 120 and the substrate contact component 300 are suitable for such substrate thicknesses.

The substrate contact element 300 can be formed substantially along the entire edge of the substrate 101, according to embodiments that can be combined with the other embodiments. That is, the masking element 200 can be provided with the substrate contact element 300, which in the masking element 200 substantially corresponds to a portion of the overlapping area of the masking element 200 and the substrate 101, in particular in the masking element 200 substantially corresponds to a portion of the overlapping area of the mask element 200 and the surrounding portion of the substrate 101. In view of this, the contact area for supporting the mask element 200 can be increased or maximized to reduce the pressure, that is, the weight of the mask element 200 (and the element coupled to the mask element 200) acting on the substrate divided by The contact area of the substrate contact member 300 with the substrate 101 caused by the mask member 200.

According to embodiments that may be combined with the other embodiments, a plurality of substrate contact elements 300 may be provided in an overlapping region of the substrate 101 and the mask element 200. In particular, at least a subset of substrate contact elements 300 may be formed corresponding to or adjacent to substrate fixation elements 120 to protect substrate fixation elements 120 from being processed, such as to provide coating protection for substrate fixation elements 120.

As shown in FIG. 5, according to an embodiment that can be combined with the other embodiments, the substrate edge mask system 100 can further include one or more substrate backside support members 320 disposed in the substrate 101 corresponding to the substrate contacts. A portion of the contact area between the element 300 and the substrate 101. The substrate backside support member 320 can absorb at least a portion of the weight of the mask member 200 and the components that are coupled to the mask member 200 such that the weight of the mask member 200 and the component that is coupled to the mask member 200 does not fully act on the substrate. 101, to avoid damage to the substrate 101 due to mechanical impact of the mask member 200 and the components that are coupled to the mask member 200, such as breakage of the substrate 101. This is particularly advantageous for a thin substrate 101, such as a substrate 101 having a substrate thickness of 0.5 mm or less.

According to an embodiment that can be combined with the other embodiments, the backside support member 320 can provide the same elasticity as the substrate securing member 120 associated with the carrier frame 160 to facilitate the damping described above.

Depending on the embodiment that may be combined with the other embodiments, a masking element 200 having indicia 340 may be provided, the position of the indicia 340 being corresponding to the location or region in which the substrate contacting element 300 is provided. That is, the masking element 200 is provided with visible indicia on the side of the masking element 200 relative to the substrate 101 to define the location or area in which the substrate contact element 300 is formed. The indicia 340 can be used in particular to align the masking element 200 to the substrate 101.

According to various embodiments, the substrate edge masking system can be used in PVD deposition processes, CVD deposition processes, substrate forming edging, heating (eg, annealing), or any kind of substrate processing. Embodiments of the substrate edge mask system and methods for using the substrate edge mask system are particularly useful for non-stationary, ie, continuous, substrate processes.

FIG. 6 shows a schematic diagram of an apparatus for depositing a layer on a substrate 101. As shown in FIG. 6, an apparatus for depositing a layer on a substrate 101 in accordance with an embodiment includes a deposition chamber 612. The deposition chamber 612 can be used in a deposition process, such as a PVD or CVD process. The substrate 101 is shown to be in or at a carrier on the substrate transfer device 620. A deposition source 630 is provided to face the side of the substrate 612 that faces the substrate to be coated. A deposition source 630 provides a deposition material 635 to be deposited on the substrate. Furthermore, the substrate edge mask system 100 can be provided in the manner described above to mask the edges of the substrate.

In FIG. 6, deposition source 630 can be any target having a target on which the deposited material is or allowing material to be released for deposition on substrate 101. Typically, deposition source 630 can be a rotatable target. According to some embodiments, the deposition source 630 can be movable to place the source in place and/or to replace the source. According to other embodiments, the source of material may be a planar target.

According to some embodiments, the deposition material 635 can be selected according to the deposition process and the application after the coated substrate. For example, the source of deposited material can be a group of materials selected from the group consisting of free metals such as aluminum, molybdenum, titanium, copper, or the like, tantalum, indium tin oxide, and other transparent conductive oxides. Typically, an oxide, nitride or carbide layer of this material may be included, either by providing material deposition from the source, or by reactive deposition, reactive deposition, ie, material from the source and from The reaction gas element (such as oxygen, nitrogen, or carbon) reacts. According to some embodiments, thin film transistor materials such as silicon oxides, silicon oxynitrides, silicon nitrides, aluminum oxide, aluminum oxide nitrides may be used as the deposition material.

Typically, particularly for non-stationary deposition processes, a substrate 101 is provided in or at the carrier 102 with a masking element 200 placed on the substrate 101 by use of the substrate contact elements 300. Dashed line 665 exemplarily shows the path of deposited material 635 during operation of chamber 600. The coated portion may remain in the chamber 612 according to other embodiments that may be combined with the other embodiments described. The substrate edge mask system 100 in accordance with the described embodiments can facilitate a stationary process and facilitate a non-stationary process.

According to an embodiment which can be combined with the other embodiments, the fixing assembly firmly holds the edge of the substrate, particularly during the deposition process. In particular, depending on the fact that the gap between the substrate and the mask element can be reduced, embodiments can provide an increase in process uniformity.

Figure 7 shows a flow chart of a method for masking the edges of a substrate.

According to an embodiment that can be combined with the other embodiments, the method for masking the edge of the substrate can include the step 510 of providing the substrate fixing component 120 forming the opening, step 520: positioning the substrate 101 in the opening, step 530: providing a masking element 200 having a substrate contact element 300; and step 540: placing the substrate contact element 300 on the substrate 101.

According to an embodiment that can be combined with the other embodiments, step 540: placing the substrate contact element 300 on the substrate 101 can include the step of aligning the mask element 200 to the substrate by providing the indicia 340 on the mask element 200. 101.

While embodiments relating to substrate edge mask systems have been described, it is to be understood that the same concepts applied to systems having mask elements are not limited to covering substrate edges, and in particular the same concepts can be applied to have substrates The system of patterned mask elements is disposed with a substrate contact element disposed in a region of the mask element that corresponds to the periphery or periphery of the substrate.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure can be devised without departing from the scope of the disclosure. The scope of the disclosure is determined by the scope of the appended claims.

100‧‧‧Substrate edge mask system
101‧‧‧Substrate
102‧‧‧ Carrier
120‧‧‧Substrate fixing components
140‧‧‧elastic support
160‧‧‧ Carrier Framework
200‧‧‧mask components
220, 222‧‧‧ mask frame components
230‧‧‧Cooling frame
240‧‧‧ Carrier contact elements
300‧‧‧Substrate contact elements
320‧‧‧ Back side support elements
340‧‧‧ mark
510, 520, 530, 540‧ ‧ steps
612‧‧‧ chamber
620‧‧‧Substrate transfer device
630‧‧‧Sedimentary source
635‧‧‧deposited materials
665‧‧‧dotted line
D‧‧‧ gap

In order to understand the details of the above-mentioned features, a brief description of the present disclosure will be provided in conjunction with the embodiments. The drawings are related to the embodiments of the present disclosure and are described as follows: FIGS. 1A and 1B illustrate carriers each having a fixed component, and a substrate provided in a substrate region of the carrier; FIG. 2 shows a mask system 3D view of the carrier; Figure 3 shows the substrate edge mask system; Figure 4 shows the other substrate edge mask system; Figure 5 shows the other substrate edge mask system; Figure 6 shows the deposition layer on the substrate A schematic of the device; and Figure 7 shows a flow chart of a method for masking the edges of the substrate.

100‧‧‧Substrate edge mask system

101‧‧‧Substrate

120‧‧‧Substrate fixing components

140‧‧‧elastic support

160‧‧‧ Carrier Framework

200‧‧‧mask components

230‧‧‧Cooling frame

300‧‧‧Substrate contact elements

340‧‧‧ mark

D‧‧‧ gap

Claims (20)

A substrate edge mask system (100) comprising: a substrate fixing component (120) for holding a substrate (101); a masking component (200) for covering an edge of the substrate (101) At least a portion; and a substrate contact member (300) coupled to the mask member (200) for contacting the substrate (101). The substrate edge mask system (100) of claim 1, further comprising a carrier frame (160) coupled to the substrate fixing component (120). The substrate edge mask system (100) of claim 2, wherein the substrate fixing member (120) is coupled to the carrier frame (160) by an elastic support member (140). The substrate edge masking system (100) of claim 1, wherein the torque of the substrate fixing component (120) is configured by at least two surfaces provided on opposite sides of the substrate (101) Provided. The substrate edge masking system (100) of any one of claims 1 to 4, wherein the substrate contact member (300) is made of plastic. The substrate edge masking system (100) of one of claims 1 to 4, further comprising a cooling frame (230) coupled to the masking element (200). A substrate edge masking system (100) according to any one of claims 1 to 4, wherein a gap (d) between the substrate (101) and the masking element (200) is 1.5 mm or smaller. The substrate edge masking system (100) of any one of claims 1 to 4, wherein the substrate (101) has a thickness of 0.3 mm to 0.7 mm. The substrate edge masking system (100) of any one of claims 1 to 4, wherein the substrate contact element (300) is formed substantially along the entire edge of the substrate (101). A substrate edge masking system (100) according to any one of claims 1 to 4, comprising a plurality of the substrate contact elements (300) along the masking element overlapping the substrate (101) Part of 200) is formed. The substrate edge mask system (100) according to any one of claims 1 to 4, further comprising a substrate back side support member (320) disposed corresponding to the substrate contact member (300) and the substrate A portion of the substrate (101) in a contact region of (101). A substrate edge masking system (100) according to any one of claims 1 to 4, wherein the masking element (200) having a marking (340) is provided, the marking (340) being in contact with the substrate The plurality of locations that the component (300) is provided or are in an area corresponding to the locations. The substrate edge masking system (100) of claim 2, wherein the torque of the substrate fixing component (120) is at least two provided on opposite sides of the substrate (101) by configuration. Provided by a surface. A substrate edge mask system (100) includes: a carrier (102) having a carrier frame (160) and a substrate fixing component (120) for holding a substrate (101); a mask component (200) Covering at least a plurality of edges of the substrate (101) and at least partially preventing the carrier (102) from being coated; and a substrate contact member (300) connected to the mask member (200) And facing the substrate (101), the substrate contact element (300) is placed on the substrate (101) during the processing of the substrate (101). The substrate edge masking system (100) of claim 12, wherein the torque of the substrate fixing component (120) is configured by at least two surfaces provided on opposite sides of the substrate (101) Provided. An apparatus for depositing a layer on a substrate (101), comprising: a chamber (600) for depositing a layer in the chamber; as in any one of claims 1 to 3 of the patent application A substrate edge masking system (100) is positioned in the chamber; and a deposition source (630) for depositing material forming the layer. The apparatus of claim 16, wherein the torque of the substrate fixing member (120) is provided by at least two surfaces provided on opposite sides of the substrate (101). A method for masking an edge of a substrate, the method comprising: providing a substrate fixing component (120) forming an opening (step 510); positioning the substrate (101) in the opening (step 520); providing one A masking component (200) of the substrate contact component (300) (step 530); and placing the substrate contact component (300) on the substrate (101) (step 540). The method of claim 18, wherein placing the substrate contact element (300) on the substrate (101) (step 540) comprises providing a mark (340) on the mask element (200) The mask element (200) is aligned to the substrate (101). The method of claim 18 or 19, wherein the torque of the substrate fixing member (120) is provided by at least two surfaces provided on opposite sides of the substrate (101).