WO2018133952A1

WO2018133952A1 - Holder for substrates

Info

Publication number: WO2018133952A1
Application number: PCT/EP2017/051328
Authority: WO
Inventors: Simon Lau; Ralph Lindenberg; Oliver Ullmann; Claus ZENGEL; Harald Wurster
Original assignee: Applied Materials, Inc.
Priority date: 2017-01-23
Filing date: 2017-01-23
Publication date: 2018-07-26
Also published as: TWI657532B; KR20190110593A; KR102353238B1; CN110168131B; CN110168131A; JP2020505513A; TW201828406A

Abstract

A holder configured to be attached to a carrier body for holding a substrate is described. The holder includes a front portion arranged to face a material source or a mask; a rear portion arranged to face away from a material source, wherein the rear portion includes a beveled portion with an inclined surface; and a groove for receiving a substrate provided between the front portion and the rear portion.

Description

HOLDER FOR SUBSTRATES

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to holders for holding a substrate during processing, e.g., for layer deposition. Embodiments of the present disclosure particularly relate to holders configured to be attached to carrier bodies of carriers for holding a substrate during vacuum layer deposition. Specifically, embodiments of the present disclosure relate to a holder configured to be attached to a carrier body of a carrier for holding a substrate, a carrier for holding one or more substrates, and a method for fixing a substrate in a carrier having a carrier body.

BACKGROUND

[0002] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process etc. Typically, the process is performed in a process apparatus or process chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, but also oxides, nitrides or carbides thereof, may be used for deposition on a substrate. Further, other processing actions like etching, structuring, annealing, or the like can be conducted in processing chambers. [0003] Coated materials may be used in several applications and in several technical fields. For instance, an application lies in the field of microelectronics, such as generating semiconductor devices. Further, substrates for displays are often coated by a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT, color filters or the like. [0004] Typically, glass substrates can be supported on carriers during processing thereof. A carrier supports the glass or the substrate and is driven through the processing machine. That is, the carrier drives the glass or substrate. The carriers typically form a frame or a plate, which supports the substrate along the periphery thereof or, in the latter case, supports the surface as such.

[0005] To fix the substrate in the carrier, there are different holding arrangements available, e.g., glass holders. Due to increased particle requirements, e.g. for TFT applications, the avoidance of particle generation becomes more important. Side deposition on a carrier and a holder, e.g. a clamp, as well as glass movement inside the holder, e.g. the glass clamp, are major particle generators near the glass surface.

[0006] In view of the above, it is beneficial to provide a holder, particularly a holder configured to be attached to a carrier body for holding a substrate that overcomes at least some of the problems in the art.

SUMMARY

[0007] In light of the above, a holder configured to be attached to a carrier body of a carrier for holding a substrate, a carrier, and a method for fixing a substrate in a carrier are provided. Further aspects, advantages, and features of the present disclosure are apparent from the dependent claims, the description, and the accompanying drawings. [0008] According to one embodiment, a holder configured to be attached to a carrier body for holding a substrate is provided. The holder includes a front portion arranged to face a material source or a mask; a rear portion arranged to face away from a material source, wherein the rear portion includes a beveled portion with an inclined surface; and a groove for receiving a substrate provided between the front portion and the rear portion.

[0009] According to another aspect, a carrier including at least one holder is provided. The at least one holder includes. The holder includes a front portion arranged to face a material source or a mask; a rear portion arranged to face away from a material source, wherein the rear portion includes a beveled portion with an inclined surface; and a groove for receiving a substrate provided between the front portion and the rear portion.

[0010] According to yet another aspect, a method for fixing a substrate in a carrier having a carrier body is provided. The method includes loading a substrate on the carrier; moving at least one holder relative to the carrier body towards the substrate, the at least one holder comprising a beveled portion; and guiding the substrate in a first portion of a groove with the beveled portion.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above-recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be provided by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described as follows:

FIG. 1 illustrates carriers according to embodiments described herein and having at least one holder;

FIG. 2 shows a holder for illustrating improvements embodiments of the present disclosure;

FIG. 3 illustrates a holder according to embodiments described herein;

FIGS. 4A and 4B show different views of a further holder according to embodiments described herein;

FIGS. 5 A and 5B show different views of a further holder according to embodiments described herein; FIG. 6 shows a carrier having holders according to embodiments described herein and illustrates loading with a robot arm;

FIG. 7 illustrates a flowchart of a method for fixing a substrate in a carrier having a carrier body according to embodiments described herein; and

FIG. 8 illustrates a schematic view of a deposition chamber according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0013] According to embodiments described herein, a carrier including at least one holder is provided. The at least one holder is configured to hold or clamp a substrate. The holder includes a beveled portion to form a portion of a groove guiding the substrate in a further groove portion having a small clearance, for example a clearance of 0.5 mm or below, such as about 0.1 mm.

[0014] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm and the holder can be adapted for such substrate thicknesses. It may be particularly beneficial when the substrate thickness is about 0.9 mm or below, such as 0.7 mm or 0.5 mm or 0.3 mm and the holders are specifically adapted for such substrate thicknesses. The holders may also be adapted for smaller or larger substrate thickness. According to some embodiments, which can be combined with other embodiments described herein, a holder or a carrier including at least one holder can be adapted for a specific glass thickness. Glass substrates with a smaller thickness as compared to the specific glass thickness may also be supported by a holder or carrier including a holder.

[0015] According to some embodiments, which could be combined with other embodiments described herein, large area substrates may have a size of at least 0.174 m². The size can be about 1.375 m 2 to about 10 m 2 , more typically about 2 m 2 to about 11 m² or even up to 12 m². Typically, the rectangular substrates, for which the mask structures, apparatuses, and methods according to embodiments described herein are provided, are large area substrates as described herein. For instance, a large area substrate can be GEN 5, which corresponds to about 1.4 m substrates (1.1 m x 1.3 m),

GEN 7.5, which corresponds to about 4.39 m substrates (1.95 m x 2.25 m), GEN 8.5, which corresponds to about 5.5 m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. However, the person skilled in the art may understand the holders may be used for any substrate size, i.e. even a smaller or larger substrate size than outlined above.

[0016] Typically, the substrate may be made from any material suitable for material deposition. For instance, the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0017] FIG. 1 illustrates a carrier 100 according to embodiments described herein, and having at least one holder 200. The carrier 100 is configured for supporting a substrate 101. As shown in FIG. 1, the substrate 101 is provided in a position within the carrier 100, particularly when processed in a processing chamber. The carrier 100 includes a frame or carrier body 160. For example, the carrier body may define a window or aperture. According to typical implementations, the carrier body 160 provides a substrate-receiving surface.

[0018] FIG. 1 further shows a guiding bar 162, for example a rod, which may be arranged at a lower portion of the carrier 100. During operation, the guiding bar 162 may be provided below the carrier body 160. The guiding bar can be configured to be in contact with a transportation system, for example a roller arrangement. The carrier 100 may also include an upper guiding arrangement 164. The upper guiding arrangement 164 can be configured to support the position of the carrier 100 with an upper portion of the transportation system. [0019] According to yet further embodiments, the carrier may be configured for contactless transportation, for example with a magnetic levitation system. An arrangement of a carrier for contactless transportation may have a magnetic element at an upper portion of the carrier configured for interacting with a magnetic levitation system. The lower portion of the carrier may be configured for a transversal stabilization of the carrier or the carrier body 160 may be hanging in a contactless transportation arrangement.

[0020] According to some embodiments, which can be combined with other embodiments described herein, a plurality of the holders 200 can be movable, particularly movable in a direction perpendicular or essentially perpendicular to an edge of the carrier body. For example, the edge of the carrier body can be the edge of the aperture formed by the carrier body. The holders may be movable in a direction perpendicular or essentially perpendicular to a respective edge of the substrate, which is supported by the holder. In FIG. 1, moving of the holders is indicated by arrows 201. According to some embodiments, the holders 200 at one side (left or right) of the carrier body and the holders 200 at the top side or the bottom side of the carrier body, particularly the top side of the carrier body as shown in FIG. 1, can be movable. The carrier body 160 comprising a first side, a second side, a third side, and a fourth side. At least eight holders, particularly at least 24 holders, can be provided, herein on each side of the first side, the second side, the third side, and the fourth side at least two respective holders, of the at least eight holders are mounted. The at least two respective holders of the holders are movably mounted on two adjacent sites of the first side, the second side, the third side and the fourth side.

[0021] The holders can be movable at two adjacent sides of the carrier body, for example the right-hand side and the top side in FIG. 1. Moving the holders allows for retracting the holders 200. The holders 200 can be retracted for loading or unloading a glass substrate in the carrier body. By retracting the holders as indicated by arrows 201 in FIG. 1, the aperture formed by the carrier body or the holders 200 respectively, is increased in size. The increased aperture size provides sufficient space for loading or unloading of the glass substrate.

[0022] According to some embodiments, which could be combined with other embodiments described herein, the carrier body 160 can be made of aluminum, aluminum alloys, titanium, alloys thereof, stainless steel or the like. For comparably small large area substrates, e.g. GEN 5 or below, the carrier body 160 can be manufactured from a single piece, i.e. the frame is integrally formed. However, according to some embodiments, which can be combined with other embodiments described herein, the carrier body 160 can include two or more elements such as a top bar, sidebars and a bottom bar. Particularly for very large area substrates, the carrier or carrier body can be manufactured having several portions. These portions of the carrier body are assembled to provide the carrier body 160 for supporting the substrate 101. The carrier body 160 is particularly configured for receiving the substrate 101 in the substrate area, e.g. an aperture of the carrier body.

[0023] FIG. 2 shows a holder 20, which may be comparable to a common clamp. The holder or clamp has a substrate-receiving portion or groove 30 with a rectangular cross- section, i.e. a rectangular groove. The holder 20 has a rear portion 216, a front portion and an intermediate portion 212. The intermediate portion 212 connects the front portion 214 and the rear portion 216. The front portion 214 is facing the deposited material or the material source. The direction of material deposition is indicated by arrows 25. The rear portion 216 is facing away from the deposited material such that a substrate 101 is provided between the deposition material and the rear portion 216. [0024] For a holder or a clamp with a rectangular substrate-receiving portion 30, there may be a relatively big clearance between the holder or clamp and the glass, in order to ease the glass feed in to the holder or clamp. For example, FIG. 2 shows a rear gap 21 between the rear portion 216 and the glass of the substrate 101 and a front gap 23 between the front portion 214 and the glass of the substrate 101. The clearance allows the class to move inside the groove of the holder, i.e. the claim.

[0025] As further illustrated in FIG. 2, material, which is deposited along a direction indicated by arrows 25 onto the substrate 101, may result in side deposition 50, i.e. undesired deposition of material on the holder 20. Side deposition 50 can creep particularly into the front gap 23. Friction between the substrate 101 and a holder may lead to particle generation. A glass-mask gap 26 is provided by, e.g. a front gap 23, a width of the holder at the front portion 214 and a mask-holder-gap 27. The glass-mask gap 26 may be relatively large due to the undefined glass position inside the clamp, e.g. resulting in a larger front gap 23. The front gap 23 is provided relative to the holder, between the holder and the glass. The holder or clamp can be provided separate from each other, resulting e.g. in a mask-holder-gap 27 between holder and mask 70. Since the holder or clamp cannot be covered properly in light of an undefined distance to a mask 70, such as an edge exclusion mask, a comparably large amount of side deposition is accumulated on the holder or clamp. As illustrated in FIG. 2, it is possible that side deposition gets into the clamp's groove, i.e. the gap between the front portion 214 and the substrate 101. A glass movement inside the holder loosens the side deposition, which further increases the particle generation.

[0026] FIG. 3 shows a holder 200 according to embodiments described herein. The holder 200 includes a front portion 214, and a rear portion 216. A groove 300, which may be configured for insertion of a substrate 101 in the holder 200, includes a beveled portion 220 having an inclined surface. The beveled portion 220 provides a semi-V- shape holder or clamp, i.e. one side of a groove for the substrate is V-shaped. Another side of a groove for the substrate may not be V-shaped, i.e. may be straight. A semi-V- shape clamp design addresses some or all of the disadvantages that have been described above. An intermediate portion 212 may connect the front portion and the rear portion. [0027] On the one hand, loading or feeding-in of the substrate is eased by the large holder mouth to the rear side of the glass at the rear portion. On the other hand, glass movement inside the holder is limited by the small clearance of e.g. 0.1mm. The groove portion with the small clearance forms a first portion of the groove. The groove portion with the large holder mouth, i.e. the beveled portion or semi-V-shape portion, forms a second portion of the groove. A holder having a first groove portion and a second groove portion different in shape can be provided according to embodiments of the present disclosure.

[0028] According to some embodiments, the holder or clamp may be customized to the used glass thickness to have all or most of the benefit of the small clearance. Alternatively, several glass thicknesses may be used in a processing system without holder exchange of holders of a carrier, wherein it is possible to use the holder or clamp for the thickest glass processed in a processing system even for thinner glasses.

[0029] According to embodiments of the present disclosure, which can be combined with other embodiments described herein, the groove 300 may have a first portion, for example a lower portion in FIG. 3. The first portion of the groove can have essentially parallel surfaces, for example, an inner surface of the front portion 214 and an inner surface of the rear portion 216. The first portion can be a parallel portion. For example, the first portion can have a first angle between the opposing surfaces of the front portion and the rear portion of 5° or below, particularly of 0°. The groove 300 has a second portion with a second angle between the opposing surfaces larger than the first angle due to the beveled portion 220. The second angle can be provided between the inclined surface of the beveled portion 220 and the inner surface of the front portion 214. The second angle can be 10° or larger, e.g. about 15°. The inner surface of the front portion 214 forming the first angle and the inner surface of the front portion 214 forming the second angle can be the same inner surface, i.e. one flat surface.

[0030] According to embodiments of the present disclosure, a small clearance, particularly at the first portion, e.g. the bottom, of the groove 300, i.e. at the groove portion adjacent to the intermediate portion 212, may further lead to a better or straighter glass edge of the substrate 101. This enables also a smaller gap between the glass surface of the substrate 101 and a mask 70, for example an edge exclusion mask. The smaller gap between the glass and the mask increases uniformity and reduces side deposition onto the holder or clamp. Furthermore, the inside of the clamp is better protected against side deposition by the defined glass position inside the clamp. A glass-mask gap 326 is provided by, e.g. a small front gap, a width of the holder at the front portion 214, and a mask-holder-gap 27. The glass-mask gap 326 can be reduced due to the glass position inside the clamp, e.g. resulting in a small front gap. As shown in FIG. 3, the side deposition 250 from material deposited along arrows 25 is reduced as compared to the side deposition 50 in FIG. 2. FIG. 3 further shows a rotatable or rotary cathode 330, which can be rotated as indicated by arrow 335 e.g. during sputtering of target material during materials deposition. According to other embodiments, planar cathodes or other sources for material deposition may be used.

[0031] FIGS. 4A to 5B show further embodiments of holders 200. FIGS. 4A and 5A show side views from the side of the front portion 214. FIGS. 4B and 5B show side views similar to FIGS. 2 and 3. FIGS. 4A and 4B show a holder 200 according to one example, which may be used to illustrate modifications that can be combined with embodiments of the present disclosure. The holder has a rear portion 216. For example, the rear portion can have a height of 20 to 40 mm, for example about 30 mm. The front portion 214 extends along the length of the holder 200. According to some embodiments, the length (the dimension from left to right shown in FIG. 4A) can be 30 to 60 mm, for example about 40 mm. The intermediate portion 212 can have a width (the dimension from left to right shown in FIG. 4B) of 5 mm to 15 mm, for example about 7 mm. The groove 300 has a width at a first portion 412, e.g. a bottom portion in FIGS. 4A to 5B, of the groove 300, i.e. at the groove portion facing the intermediate portion 212. The bottom portion in FIGS. 4A to 5B may be a top portion of the groove in the event the holder is mounted at a top side of the carrier. The width of the first portion 412 corresponds to a thickness of the substrate. Typically, the width of the first portion 412 can be 0.05 to 0.2 mm larger than the thickness of the substrate. For example, the width of the first portion can be 0.6 mm, 0.7mm, 0.8mm or 1 mm. According to embodiments, which can be combined with other embodiments described herein, the beveled portion 220 can have an angle of inclination of the inclined surface of 10° to 25°, for example about 13° or about 15°. According to some embodiments, which can be combined with other embodiments described herein, the height of the beveled portion 220 or the inclined surface, respectively, can be such that the width of the beveled portion is 1.5 mm to 5 mm, such as about 3 mm. The width of the beveled portion corresponds to the width increase of the groove at the second portion of the groove. [0032] Further, the holder 200 shown in FIG. 4A includes an opening 416. The opening 416 is configured to mount the holder 200 to a carrier. For example, the opening 416 may include a thread to receive a screw or the like. Opening 416 is configured to mount the holder 200 to a carrier. The holder may be pivotably mounted to the carrier as indicated by arrow 417. A pivoting mount of the holder has the advantage that the holder may rotate, e.g. by a 25° or less, in order to have the glass in full contact with the first portion 412 of the groove. A full contact of the glass along the edge of the glass can be provided at the ground of the groove. This may reduce stress at the glass edge. According to some embodiments, the first portion 412 of the groove 300 may be curved at the side portions thereof. This may be beneficial for gently loading a substrate in the holder 200. The curve may have a radius of 2 mm or larger.

[0033] FIGS. 5 A and 5B show a holder 200 according to one example, which may be used to illustrate modifications that can be combined with embodiments of the present disclosure. As compared to the holder 200 shown in FIGS. 4A and 4B, the holder 200 of the example illustrated in FIGS. 5 A and 5B may have a rear portion 216 with a reduced height of for example 7 mm to 15 mm. According to an additional or alternative modification, the front portion 214 can be a front portion assembly having two front portion segments. A gap can be between the two front portion segments such that the beveled portion 220 is exposed when seen from the side of the front portion, i.e. the side of the material deposition. In light of the reduced height of the rear portion 216, instead of an opening, a blind hole 516 is provided for mounting the holder 200 to a carrier or a carrier body.

[0034] FIG. 6 shows a carrier 100 during the loading operation with a loading arm 602, for example a robot arm. As shown in FIG. 6, the holders 200 on a first side and a second side of the four sides of the carrier body 160 are moved in to a retracted position. Exemplarily, the holders 200 at the top side and the right-hand side in FIG. 6 are shown in the retracted position. The retracted position is provided due to movement of the holders as illustrated by arrows 201 in FIG. 1. For example, the movement into a retracted position and out of the retracted position can be perpendicular to the edge of the rectangular substrate 101, which is to be supported by the holder.

[0035] With the retracted position of the holders 200 on the top side and the right- hand side, the loading arm 602 can move the substrate 101 in an area between the holders since the substrate receiving area between the holders is enlarged. The substrate can be moved as indicated by arrows 603 to be supported in the holders 200 on, for example, the lower side and the left-hand side in FIG. 6. According to some embodiments, which can be combined with other embodiments described herein, the holders 200 on two adjacent sides of the carrier body can be stationary and the holders on the remaining two sides of the four sides of the carrier body may be movable. The remaining two sides can also be adjacent sides of the carrier body.

[0036] As described above, a groove in the holder can have a first portion with a comparable small clearance for the substrate. The first portion is adjacent to an intermediate portion of the holder. For example, the first portion can be a bottom portion of the groove of a holder on a bottom side of the carrier body 160 and can be a top portion of the groove of a holder on the top side of the carrier body. Further, a groove in the holder can have a second portion including the beveled portion. The beveled portion increases the size of the holder mouth to the rear side of the holder, i.e. the side facing away from a material source during e.g. deposition of material on the substrate.

[0037] For loading of the substrate 101 in the carrier 100, the substrate is moved as indicated by arrows 603. The second portion of the groove including the beveled portion guides a substrate into the grooves. The increased thickness of the grooves at the second portion allows for a smooth insertion of the substrate in the holders. After the movement along arrows 603, the substrate 101 is supported in the first portion of the grooves, wherein the first portion provides a clearance for the substrate that is smaller as compared to the clearance in the second portion. The reduced clearance for holding the substrate in the final position reduces side deposition at the holders, provides stability for the glass substrate in the supported position, and/or allows for masking, for example with an edge exclusion mask, with a reduced substrate-to-mask distance. The reduced substrate-to-mask distance further reduces side deposition. The reduced side deposition and the increased ability reduce particle generation during processing of the substrate.

[0038] After the movement of the substrate along arrow 603, the holders 200 at the top side and the right-hand side in FIG. 6 can be moved from the retracted position in to the un-retracted position. Also during this movement of the holders, the second portion of the groove of the holders guide the substrate in the correct position and the first portion of the groove of the holders provides for increased stability and reduced side deposition in the final position of the holders.

[0039] According to different embodiments, the carrier 100 can be utilized for PVD deposition processes, CVD deposition processes, substrate structuring edging, heating (e.g. annealing) or any kind of substrate processing. Embodiments of carriers as described herein and methods for utilizing such carriers are particularly useful for stationary, i.e. non-continuous substrate processing. Typically, the carriers are provided for processing vertically oriented large area glass substrates. [0040] FIG. 7 illustrates a flowchart of a method 80 for fixing a substrate 101 in a carrier 100 having a carrier body 160 according to embodiments described herein. In block 81, a substrate 101 is loaded on a carrier 100. In block 82, at least one holder 200 is moved relative to the carrier body 160 towards the loaded substrate 101. The at least one holder 200 includes a beveled portion 220, e.g. the beveled portion of the second portion of the groove 300 of the holder. In block 83, the substrate 101 is guided in a portion of the groove with the beveled portion, i.e. the inclined surface of the second portion of the groove.

[0041] The front portion of the holder having a straight inner surface allows for reduced side deposition of the holder. The inclined surface of the beveled portion of the groove, i.e. the second portion of the groove, allows for smooth insertion of the substrate in the holder. The smaller clearance of the substrate in the first portion of the groove as compared to the second portion of the groove allows for reduced particle generation. Particularly, the semi-V-shape, i.e. the one-sided- V-shape, allows for a combination of such advantages. [0042] FIG. 8 illustrates a schematic view of a deposition chamber 600 according to embodiments described herein. The deposition chamber 600 is adapted for a deposition process, such as a PVD or CVD process. A substrate 101 is shown being located within or at a carrier 100 on a substrate transport device 620. A material source 630 for deposition material is provided in chamber 612 facing the side of the substrate 101 to be coated. The material source 630 provides deposition material to be deposited on the substrate 101.

[0043] In FIG. 8, the material source 630 may be a target with deposition material thereon or any other arrangement allowing material to be released for deposition on substrate 101. Typically, the material source 630 may be a rotatable target, i.e. rotary target. According to some embodiments, the material source 630 may be movable in order to position and/or replace the source. According to other embodiments, the material source may be a planar target.

[0044] According to some embodiments, the deposition material may be chosen according to the deposition process and the later application of the coated substrate. For instance, the deposition material of the source may be a material selected from the group consisting of: a metal, such as aluminum, molybdenum, titanium, copper, or the like, silicon, indium tin oxide, and other transparent conductive oxides. Typically, oxide-, nitride- or carbide-layers, which can include such materials, can be deposited by providing the material from the source or by reactive deposition, i.e. the material from the source reacts with elements like oxygen, nitride, or carbon from a processing gas.

[0045] Typically, the substrate 101 is provided within or at the carrier 100. The carrier or a carrier assembly can also serve as or include an edge exclusion mask, particularly for non- stationary deposition processes. Dashed lines 665 show exemplarily the path of the deposition material during operation of the deposition chamber 600.

According to other embodiments, which can be combined with other embodiments described herein, the masking can be provided by a separate edge exclusion mask, which is provided in the chamber 612. A carrier according to embodiments described herein can be beneficial for stationary processes and for non- stationary processes. [0046] According to embodiments, which can be combined with other embodiments described herein, the holder 200 (for easier drawing the sketch is provided without a beveled portion, i.e. a semi-V-shape) firmly holds the edges of the substrate 101 particularly during a deposition process. Embodiments can provide an increased substrate stability and, thus, decrease in substrate breakage, particularly in light of the fact that the substrates are getting bigger in length and height. Further, particle generation, particularly near the substrate can be reduced.

[0047] According to embodiments described herein, which can be combined with other embodiments described herein, the substrates and carriers can be provided in a vertical, i.e. essentially vertical orientation during deposition. Substantially vertically is understood when referring to the substrate orientation, to allow for a deviation from the vertical direction of 20° or below, e.g. of 10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation may result in a more stable substrate position. Alternatively, a deviation in the opposite direction (substrate facing downwardly) may result in a reduced number of particles on a substrate.

[0048] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A holder (200) configured to be attached to a carrier body (160) of a carrier for holding a substrate (101), the holder (200) comprising: a front portion (214) arranged to face a material source or a mask; a rear portion (216) arranged to face away from a material source, wherein the rear portion includes a beveled portion with an inclined surface; and a groove for receiving a substrate provided between the front portion and the rear portion.

2. The holder of claim 1, wherein the groove has a first portion with a first angle between first opposing surfaces of 5° or below and wherein the groove has second portion with a second angle between second opposing surface of 10° or above.

3. The holder of claim 2, wherein the second angle is provided between the inclined surface of the beveled portion and the front portion.

4. The holder of any of claims 2 to 3, wherein the first angle is 0°.

5. The holder of any of claims 2 to 4, wherein the first opposing surfaces are an inner surface of the front portion and an inner surface of the rear portion, and wherein the second opposing surfaces are the inner surface of the front portion and the inclined surface of the beveled portion.

6. The holder of claim 5, wherein the groove comprises a semi-V shape portion and a parallel portion.

7. The holder of any of claims 1 to 6, wherein the front portion is a front portion assembly having at least two front portions segments with a gap between the two front portions segments.

8. The holder of any of claims 1 to 7, further comprising: an opening or a blind hole for mounting the holder to a carrier body.

9. A carrier (100) comprising at least one holder (200) of any of claims 1 to 8.

10. The carrier of claim 9, further comprising a carrier body (160), the carrier body (160) comprising a first side, a second side, a third side, and a fourth side, wherein the at least one holder (200) is at least eight holders, particularly at least 24 holders, and wherein on each side of the first side, the second side, the third side, and the fourth side at least two respective holders, of the at least eight holders are mounted.

11. The carrier of any of claim 10, wherein the at least two respective holders of the at least eight holders are movably mounted on two adjacent sites of the first side, the second side, the third side and the fourth side.

12. A method (80) for fixing a substrate (101) in a carrier (100) having a carrier body (160), comprising: loading a substrate (101) on the carrier (100); moving (82) at least one holder (200) relative to the carrier body (160) towards the substrate (101), the at least one holder (200) comprising a beveled portion (210); and guiding the substrate in a first portion of a groove with the beveled portion.

13. The method of claim 12, further comprising: supporting the substrate in a second portion of the groove, wherein the second portion has a clearance to the substrate of 0.5 mm or below, particularly of 0.2 mm or below.