WO2017059888A1

WO2017059888A1 - Edge exclusion mask

Info

Publication number: WO2017059888A1
Application number: PCT/EP2015/072946
Authority: WO
Inventors: Oliver Ullmann; Simon Lau; Claus ZENGEL
Original assignee: Applied Materials, Inc.
Priority date: 2015-10-05
Filing date: 2015-10-05
Publication date: 2017-04-13

Abstract

An edge exclusion mask (200) for masking an edge region of a substrate in a layer deposition process is provided. The edge exclusion mask includes a masking surface (210) adapted for facing a deposition source arrangement. The masking surface has an inclination angle of 30 degrees or below and larger than zero with respect to a substrate receiving plane. The edge exclusion mask further includes an opposing surface (220) opposing the masking surface and being adapted for receiving a first cooling surface of a cooling arrangement (350). The edge exclusion mask further includes an undercut surface (231, 232, 233) forming an undercut of the edge exclusion mask. The undercut surface is adapted for mounting the edge exclusion mask to the cooling arrangement.

Description

EDGE EXCLUSION MASK

FIELD [0001] Embodiments described herein relate to masks and masking arrangements for layer deposition processes. Embodiments described herein specifically relate to edge exclusion masks for masking an edge region of a substrate in a layer deposition process and to masking arrangements for controlling deposition on a substrate.

BACKGROUND

[0002] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process etc. The process is performed in a process apparatus or process chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, but also oxides, nitrides or carbides thereof, may be used for deposition on a substrate.

[0003] Coated materials may be used in several applications and in several technical fields. For instance, an application lies in the field of microelectronics, such as generating semiconductor devices. Also, substrates for displays are often coated by a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT, color filters or the like.

[0004] In coating processes, it may be useful to use masks, for instance, in order to better define the area to be coated. In some applications, only parts of the substrate should be coated and the parts not to be coated are covered by a mask. In some applications, such as in large area substrate coating apparatuses, it can be useful to exclude the edge of the substrate from being coated. With the exclusion of the edge, e.g. by an edge exclusion mask, it is possible to provide coating free substrate edges and to prevent a coating of the backside of the substrate. For example, LCD TV layer deposition, as one of many other applications, requires a non-coated substrate edge. The above-described mask covers this area of the substrate. The masking or blocking with the mask can, however, result in further, additional shadowing effects of arriving atoms, molecules and clusters, which can result in the layer thickness being unreliable and sheet resistance uniformity. [0005] However, the mask in a material deposition process, which may be an edge exclusion mask, is also exposed to the deposition material due to the location of the mask in front of the substrate. The influences of the non-coated and coated masks can be complex and may depend upon the material to be deposited.

[0006] In view of the above, there is a need for improved masks and masking arrangements for layer deposition processes.

SUMMARY

[0007] According to an embodiment, an edge exclusion mask for masking an edge region of a substrate in a layer deposition process is provided. The edge exclusion mask includes a masking surface adapted for facing a deposition source arrangement. The masking surface has an inclination angle of 30 degrees or below and larger than zero with respect to a substrate receiving plane. The edge exclusion mask further includes an opposing surface opposing the masking surface and being adapted for receiving a first cooling surface of a cooling arrangement. The edge exclusion mask further includes an undercut surface forming an undercut structure of the edge exclusion mask. The undercut surface is adapted for mounting the edge exclusion mask to the cooling arrangement.

[0008] According to a further embodiment, a masking arrangement for controlling deposition on a substrate is provided. The masking arrangement includes an edge exclusion mask adapted for masking an edge region of the substrate and a cooling arrangement adapted for cooling the edge exclusion mask. The edge exclusion mask includes a masking surface adapted for facing a deposition source arrangement. The masking surface has an inclination angle of 30 degrees or below and larger than zero with respect to a substrate receiving plane. The edge exclusion mask further includes an opposing surface opposing the masking surface. The edge exclusion mask further includes an undercut surface forming an undercut structure of the edge exclusion mask. The cooling arrangement includes a first cooling surface in contact with the opposing surface. The undercut surface engages with the cooling arrangement to mount the edge exclusion mask to the cooling arrangement.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] So that the manner in which the above recited features of the present embodiments can be understood in detail, a more particular description of embodiments, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments and are described in the following:

Fig. 1 illustrates the notion of an edge region of a substrate according to embodiments described herein;

Fig. 2 shows an edge exclusion mask according to embodiments described herein;

Fig. 3 shows a masking arrangement according to embodiments described herein;

Fig. 4 shows an edge exclusion masks according to embodiments described herein;

Figs. 5-7 show masking arrangements according to embodiments described herein;

Fig. 8 shows an edge exclusion masks according to embodiments described herein;

Fig. 9 shows a masking arrangement according to embodiments described herein; Fig. 10 shows an edge exclusion mask according to embodiments described herein;

Fig. 11 shows a masking arrangement according to embodiments described herein; Fig. 12 shows a portion of a cooling arrangement according to embodiments described herein; and

Figs. 13-14 shows masking arrangements according to embodiments described herein, including a carrier system;

DETAILED DESCRIPTION

[0010] Reference will now be made in detail to the various embodiments described herein, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the embodiments and is not meant as a limitation of the embodiments. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0011] A "layer deposition process", as used herein, refers to a process where a material is deposited on a substrate to form a layer of deposited material on the substrate. A layer deposition process may, for example, refer to a sputtering process, a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, and the like. A layer deposition process may be performed in a process chamber, in particular in a vacuum process chamber, where the substrate to be coated is located. The term "layer deposition process" will be used synonymously with "coating process".

[0012] A substrate may be made from any material suitable for material deposition. For instance, the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0013] According to some embodiments, which can be combined with other embodiments described herein, the substrate may be a large area substrate. Large area substrates may have a size of at least 0.67 m². The size can be about 0.67 m² to about 8 m², more particularly about 2 m² to about 9 m² or even up to 12 m². The substrates for which the edge exclusion masks and masking arrangements according to embodiments described herein are provided are large area substrates. For instance, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m² substrates (0.73 m x 0.92 m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. For example, a large area substrate for which the edge exclusion masks and masking arrangements according to embodiments described herein are provided can be a GEN 6 substrate and/or can have dimensions of 1.85 m x 1.55 m.

[0014] Embodiments described herein relate to edge exclusion masks and masking arrangements for controlling deposition of material on a substrate in a layer deposition process. An edge exclusion mask is desirable when an edge region of a substrate should be kept free or substantially free from deposition material. This may be the case when only a defined area of the substrate should be coated due to the later application and/or handling of the coated substrate. For instance, a substrate which will be used as a display part, should have predefined dimensions. Large area substrates are coated using an edge exclusion mask in order to mask an edge region of the substrate and/or to prevent backside coating of the substrate. This approach allows for reliable, constant coating on substrates.

[0015] The notion of "masking" the edge region of the substrate, as described herein, may include reducing and/or hindering a deposition of material on the edge region of the substrate. [0016] FIG. 1 shows an example of a substrate 100 with edge region 110 according to embodiments described herein. The edge region includes an edge 120 of the substrate. The terminology of an "edge region" of the substrate, as used herein, may refer to a thin region of the substrate at or near an edge of the substrate. An edge region may include an edge of the substrate, as illustrated in Fig. 1. The terminology of an "edge" of the substrate may refer to a line-like limiting portion of the substrate where the material of the substrate terminates. In relation to an edge exclusion mask according to embodiments described herein, the edge region of the substrate may refer to the region of the substrate being masked by the edge exclusion mask in the layer deposition process. According to embodiments, which can be combined with other embodiments described herein, the edge region of the substrate may have an area of about 5% or less of the area of the substrate, more particularly about 2% or less, still more particularly between about 1 %c to about 2% of the area of the substrate.

[0017] As shown in Fig. 1, the edge region may have a width W. According to some embodiments, which be combined with other embodiments described herein, the width of the edge region may be 8 mm or less, more particularly 6 mm or less. The width of the edge region may be symmetrical for the whole substrate, such that e.g. each corner area and each side portion of the substrate has the same width, but may also vary from side to side, depending on the application for which the substrate is considered. For example, the width of the edge region at a side portion of the substrate may be from 3 mm to 6 mm. The width of the edge region at a corner area of the substrate may, e.g., be from 0 to 6 mm.

[0018] Fig. 2 shows a schematic illustration of an edge exclusion mask 200 according to an embodiment. The edge exclusion mask 200 includes a masking surface 210 adapted for facing a deposition source arrangement. [0019] The edge exclusion mask 200 shown in Fig. 2 includes an opposing surface 220 opposing the masking surface 210. The opposing surface 220 schematically shown in Fig. 2 is formed by opposing surface portion 221 and by opposing surface portion 222. As shown in Fig. 2, the masking surface 210 and the opposing surface 220 are opposing surfaces of a common body 240 of the edge exclusion mask 200. [0020] The edge exclusion mask 200 shown in Fig. 2 includes an undercut surface 230 forming an undercut of the edge exclusion mask 200. The undercut surface 230 schematically shown in Fig. 2 is formed by undercut surface portions 231 to 234. In the embodiment shown in Fig. 2, the undercut surface 230 includes a protrusion 250 formed by undercut surface portions 232, 233 and 234. The protrusion 250 defines the undercut of the undercut surface 230. As shown, the protrusion 250 and/or the undercut may be formed in a peripheral portion of the undercut surface 230. As further shown, the protrusion 250 may be shaped as a ridge. The ridge-shaped protrusion shown in Fig. 2 extends perpendicularly to the drawing plane substantially along the length of the edge exclusion mask 200.

[0021] Fig. 3 shows the edge exclusion mask 200 of Fig. 2 in a state of operation in a layer deposition process. In the layer deposition process, material is emitted from a deposition source arrangement (not shown). The deposition source arrangement may e.g. include a crucible, a target or the like. The edge exclusion mask 200 or at least an edge exclusion portion 310 of the edge exclusion mask may be located between the deposition source arrangement and a substrate 100. [0022] As indicated in Fig. 3 by the arrows 302, the material is emitted towards the substrate 100 to coat the substrate 100. The substrate 100 has an edge region 110. In the layer deposition process, part of the material emitted by the deposition source arrangement may impinge onto the masking surface 210, e.g. onto the edge exclusion portion 310 of the masking surface 210, and hence not reach the edge region 110 of the substrate 100. Accordingly, the deposition of material onto the edge region 110 of the substrate 100 is reduced or hindered by the edge exclusion mask 200.

[0023] The substrate 100 defines a substrate receiving plane 390. In the embodiment illustrated in Figs. 2 and 3, the substrate 100 and the substrate receiving plane 390 are arranged perpendicularly to the drawing plane. The masking surface 210 has an inclination angle 314 with respect to the substrate receiving plane 390. According to embodiments, which can be combined with other embodiments described herein, the inclination angle 314 is 30 degrees or less and may be larger than zero. The inclination angle 314 may be chosen in view of the geometry and directional characteristics of the deposition source arrangement. [0024] The edge exclusion mask 200 shown in Fig. 3 is included in a masking arrangement 300 according to embodiments described herein. The masking arrangement 300 includes a cooling arrangement 350. The cooling arrangement 350 may include or may be a cooling frame. The cooling arrangement 350 may include a cooling frame and an additional layer provided on the cooling frame. In the layer deposition process, the edge exclusion mask may be subjected to high temperatures up to 250° C. The cooling arrangement 350 is adapted for cooling the edge exclusion mask 200, e.g. during the coating of the substrate. Alternatively or additionally, the cooling arrangement may be adapted for cooling the edge exclusion mask 200 after a deposition cycle of the layer deposition process. According to embodiments, which can be combined with other embodiments described herein, the opposing surface of the edge exclusion mask 200 may be in contact with a first cooling surface of the cooling arrangement 350. In the schematic illustration shown in Fig. 3, the first cooling surface is formed by first cooling surface portion 321 and first cooling surface portion 322. The edge exclusion mask 200 is cooled by the cooling arrangement 350 via the first cooling surface contacting the opposing surface of the edge exclusion mask 200.

[0025] The first cooling surface of the cooling arrangement, as used herein, may be understood as the portion of the cooling arrangement contacting the opposing surface of the edge exclusion mask. With reference to Fig. 3, it shall be understood that first cooling surface portion 322 extends until the dashed line 324 indicating the extent of the opposing surface along the x-direction 382. As shown in Fig. 3, the shape of the opposing surface matches the shape of the first cooling surface of the cooling arrangement. First cooling surface portion 321 may be in contact with opposing surface portion 221. First cooling surface portion 322 may be in contact with opposing surface portion 222. [0026] The undercut and/or undercut surface of the edge exclusion mask is adapted for mounting the edge exclusion mask 200 to the cooling arrangement 350. The undercut and/or undercut surface may engage with the cooling arrangement to mount the edge exclusion mask 200 to the cooling arrangement 350. According to embodiments, which can be combined with other embodiments described herein, the undercut surface may be adapted for receiving a second cooling surface of the cooling arrangement 350. In the schematic illustration shown in Fig. 3, the second cooling surface is formed by second cooling surface portions 331 to 333. As shown in Fig. 3, the first cooling surface and the second cooling surface are surfaces of a common body 352 of the cooling arrangement 350. The second cooling surface may be in contact with the undercut surface of the edge exclusion mask 200. The edge exclusion mask 200 may be cooled by the cooling arrangement 350 via the second cooling surface contacting the undercut surface of the edge exclusion mask 200. Second cooling surface portions 331, 332 and/or 333 may be in contact with undercut surface portions 231, 232 and/or 233, respectively. As shown in Fig. 3, the shape of the undercut surface of the edge exclusion mask 200 matches the shape of the second cooling surface of the cooling arrangement 350. In the embodiment shown in Fig. 3, the second cooling surface of the cooling arrangement includes a recess formed by second cooling surface portions 332 and 333. The shape of the recess matches the ridgelike shape of the protrusion 250 of the undercut surface, i.e. the protrusion defining the undercut of the undercut surface. A portion of the protrusion 250 of the undercut surface is provided in the recess of the second cooling surface. The cooling arrangement 350 is mounted to the edge exclusion mask 200 at the protrusion 250 of the undercut surface. The protrusion 250 may extend along the length of the cooling arrangement. The cooling arrangement 350 may be fixed to the edge exclusion mask 200 at the protrusion 250.

[0027] According to embodiments described herein, which can be combined with other embodiments described herein, the undercut surface 230 forming the undercut of the edge exclusion mask 200 is configured to reduce or avoid warping or bending of the edge exclusion mask 200, particularly the tip portion of the edge exclusion mask 200 positioned above the substrate 100 during operation. A reduction of warping or bending of the edge exclusion mask 200 provides a more constant distance between the edge exclusion mask 200 and the substrate 100, which may in turn result in a better uniformity of the deposited layer in the vicinity of the edge exclusion mask 200.

[0028] In light of the above, according to an embodiment, an edge exclusion mask for masking an edge region of a substrate in a layer deposition process is provided. The edge exclusion mask includes a masking surface adapted for facing a deposition source arrangement. The masking surface has an inclination angle with respect to a substrate receiving plane. The inclination angle is 30 degrees or less, more particularly 24 degrees or less. The inclination angle can be larger than zero. The edge exclusion mask further includes an opposing surface opposing the masking surface and being adapted for receiving a first cooling surface of a cooling arrangement. The edge exclusion mask further includes an undercut surface forming an undercut of the edge exclusion mask. The undercut surface or undercut is adapted for mounting the edge exclusion mask to the cooling arrangement.

[0029] By providing the inclination angle of 30 degrees or less, or even smaller angles, embodiments described herein allow reducing shadowing effects. Accordingly, embodiments described herein provide for a better uniformity of the layers deposited on the substrate and an increased edge region lifetime when using an edge exclusion mask in layer deposition processes.

[0030] The undercut surface forming the undercut allows fixing the edge exclusion mask to the cooling arrangement at the undercut surface. Accordingly, unwanted movements and/or deformations the edge exclusion mask due to high temperature influences can be reduced or avoided, which can result in further improvement of the uniformity of the layers. For example, bending or warping of the edge exclusion mask, e.g. at or near the edge exclusion portion 310 shown in Fig. 3, can be reduced or avoided.

[0031] According to embodiments, which can be combined with other embodiments described herein, the undercut surface forming the undercut is adapted for engaging with the cooling arrangement to mount the edge exclusion mask to the cooling arrangement. [0032] According to embodiments, which can be combined with other embodiments described herein, the undercut surface of the edge exclusion mask may be different from the opposing surface of the edge exclusion mask. The undercut surface and the opposing surface may be separate surfaces of the edge exclusion mask. The undercut surface and the opposing surface may be adjoining surfaces of the edge exclusion mask. The undercut surface may not be a portion of the opposing surface.

[0033] According to embodiments, which can be combined with other embodiments described herein, the undercut surface is adapted for receiving a second cooling surface of the cooling arrangement, as illustrated in e.g. Fig. 3. The first cooling surface of the cooling arrangement may be different from the second cooling surface of the cooling arrangement. The first cooling surface and the second cooling surface may be separate surfaces of the cooling arrangement. The first cooling surface and the second cooling surface may be adjoining surfaces of the cooling arrangement. The second cooling surface may not be a portion of the first cooling surface. [0034] According to embodiments, which can be combined with other embodiments described herein, the substrate receiving plane may refer to a plane in which the substrate is provided during the layer deposition process. Coating of the substrate may be undertaken while the substrate is in provided in a substrate receiving area. The substrate receiving area may be contained in the substrate receiving plane. The substrate may be transported into and/or out of the substrate receiving area along a substrate transport direction. The substrate transport direction may be parallel to the substrate receiving plane. In Fig. 3, the substrate transport direction is the y-direction 386 perpendicular to the drawing plane.

[0035] According to embodiments, which can be combined with other embodiments described herein, the masking surface of the edge exclusion mask may be arranged between the substrate receiving plane and the deposition source arrangement.

[0036] According to embodiments, which can be combined with other embodiments described herein, the masking surface may extend along the entire length of the substrate in a direction parallel to the substrate receiving plane, e.g. in the y-direction 386 indicated in Fig. 3. A minimal distance between the masking surface and the substrate may be from 0 to 6mm in the direction perpendicular to the substrate receiving plane, e.g. the z-direction 384 indicated in Fig. 3. The minimal distance between the masking surface and the substrate may be a distance between the edge of the edge exclusion portion and the substrate receiving plane.

[0037] According to embodiments, which can be combined with other embodiments described herein, the portion of the edge exclusion mask covering the substrate surface may not be in contact with the substrate. According to other embodiments, the edge exclusion mask can also be in direct contact with the substrate.

[0038] According to embodiments, which can be combined with other embodiments described herein, the masking surface may include a single inclination angle with respect to the substrate receiving plane. The masking surface may be a planar surface or may be a substantially planar surface. Therein, a "substantially planar" surface may refer to a surface including a planar surface portion, wherein the area of the planar surface portion is from 70% to 100% of the area of the surface. For example, in the embodiment shown in Fig. 3, the masking surface 210 is a planar surface perpendicular to the drawing plane. The inclination angle 314 shown in Fig. 3 is a single inclination angle of the masking surface 210 with respect to the substrate receiving plane 390. Having a single inclination angle provides for a more simplified design of the edge exclusion mask.

[0039] According to other embodiments, which can be combined with other embodiments, the masking surface may include two or more different inclination angles with respect to the substrate receiving plane. The two or more different inclination angles may be from 0 to 70 degrees, more particularly from 0 to 60 degrees, still more particularly from 10 to 50 degrees. The masking surface may include an inclination angle with respect to the substrate receiving plane, as described herein, and a further inclination angle with respect to the substrate receiving plane. An edge exclusion mask with two or more different inclination angles has the advantage of providing sufficient height and at the same time providing a flat masking surface at the edge exclusion portion. A sufficient height of the edge exclusion mask is beneficial for receiving different arrangements, such as a support arrangement, a protection shield or a substrate carrier. A flat masking surface at the edge exclusion portion reduces or eliminates any inhomogeneity of the coating on the substrate by reducing or eliminating shadowing effects that may occur when the edge exclusion mask has a too large thickness at the edge exclusion portion. A low thickness of the edge exclusion mask at the edge exclusion portion further increases the edge lifetime.

[0040] The opposing surface of the edge exclusion mask may face the substrate receiving plane. The opposing surface may be arranged between the masking surface and the cooling arrangement.

[0041] According to embodiments, which can be combined with other embodiments described herein, the first cooling surface may refer to the portion of the cooling arrangement in contact with the opposing surface of the edge exclusion mask. According to embodiments, which can be combined with other embodiments described herein, the area of the opposing surface may be substantially the same as the area of the first cooling surface of cooling arrangement. Therein, the terminology "substantially the same" may refer to an area of the opposing surface being between 90% and 110% of the area of the first cooling surface of the cooling arrangement.

[0042] According to embodiments, which can be combined with other embodiments described herein, the undercut surface includes a protrusion, such as e.g. protrusion 250 shown in Fig. 3, for mounting the edge exclusion mask to the cooling arrangement. The protrusion may be an undercut-defining protrusion defining the undercut of the edge exclusion mask. As shown in Fig. 3, and as discussed above, the protrusion may be shaped as a ridge and/or may be formed in a peripheral portion of the undercut surface. The protrusion may extend substantially along a length of the edge exclusion mask. Therein, the term "substantially" refers to a protrusion having a length from 70% to 100% of the length of the edge exclusion mask. The second cooling surface of the cooling arrangement may include a recess adapted for receiving at least a portion of the protrusion of the undercut surface. The recess may be an undercut-receiving recess for receiving at least a portion of the undercut-defining protrusion.

[0043] Alternatively or additionally, the undercut surface may include a recess, e.g an undercut-defining recess of the undercut surface, for mounting the edge exclusion mask to the cooling arrangement. The second cooling surface of the cooling arrangement may include a protrusion. The recess of the undercut surface may be adapted for receiving the protrusion of the second cooling surface of the cooling arrangement. The protrusion may be provided in the recess for fixing the edge exclusion mask to the cooling arrangement.

[0044] According to embodiments, which can be combined with other embodiments described herein, the cooling arrangement is mounted to the edge exclusion mask at the protrusion of the undercut surface. [0045] Alternatively or additionally, the cooling arrangement may be mounted to the edge exclusion mask at the recess of the undercut surface.

[0046] Having an undercut surface with a protrusion and/or recess allows fixing the edge exclusion mask to the cooling arrangement, so that unwanted movement and/or deformations of the edge exclusion due to high-temperature conditions mask are reduced. [0047] Fig. 4 shows an example of an edge exclusion mask 200 according to an embodiment. As shown, a fastener 432, e.g. a plug, screw or the like, is provided in a bulk portion of the undercut surface.. The fastener 432 is plugged in a recess 434 formed in undercut surface portion 231 of the undercut surface 230. The fastener 432 is held in a fixed position in the recess 434.

[0048] Fig. 5 shows a masking arrangement 300 including the edge exclusion mask 200 according to the embodiment shown in Fig. 4. As shown in Fig. 5, the fastener 432 is provided in a recess of the second cooling surface formed by second cooling surface portions 532, 533 and 534 to attach the edge exclusion mask 200 to the cooling arrangement 350. Accordingly, the fastener is configured for reducing unwanted movement of the edge exclusion mask, e.g. warping or bending of the edge exclusion mask.

[0049] The masking arrangement shown in Fig, 5 includes a shield 550 adapted for shielding a portion of the cooling arrangement 350 not being covered by the edge exclusion mask 200. The shield 550 prevents material from being deposited on the cooling arrangement 350.

[0050] According to embodiments, which can be combined with other embodiments described herein, the edge exclusion mask can include one or more fasteners, e.g. a plurality of fasteners, for fixing the edge exclusion mask to the cooling arrangement. The one or more fasteners may be adapted for fixing the undercut surface of the edge exclusion mask to the second cooling surface of the cooling arrangement. The one or more fasteners may be provided in the undercut surface and/or in the second cooling surface.

[0051] According to embodiments, which can be combined with other embodiments described herein, the masking surface includes an edge exclusion portion having an edge. The terminology of an "edge exclusion portion" may refer to a portion of the masking surface covering the edge region of the substrate in the layer deposition process. The terminology of an "edge" of the edge exclusion portion may refer to a line-like, limiting portion at the periphery of the edge exclusion portion. The first cooling surface may terminate at the edge of the edge exclusion portion. In Fig. 3, the edge of the edge exclusion portion 310 is indicated with reference numeral 312. The edge exclusion portion may have an area from 100% to 200% of the area of the edge region of the substrate. The edge exclusion portion may be arranged between the substrate receiving plane and the deposition source arrangement. The edge exclusion portion may be a planar edge exclusion portion. The edge exclusion portion may be inclined with respect to the substrate receiving plane. The inclination angle of the masking surface with respect to the substrate receiving plane, as described herein, may be an inclination angle of the edge exclusion portion with respect to the substrate receiving plane.

[0052] According to embodiments, and as illustrated in Fig. 6, a distance 660 along a first direction parallel to the substrate receiving plane, e.g. the x-direction 382, may exist between the undercut surface 230 of the edge exclusion mask 200 and the edge 312 of the edge exclusion portion 310. According to embodiments, which can be combined with other embodiments described herein, the distance 660 may be 200 mm or less, for example from 80 mm to 110 mm. The distance 660 may be a minimal distance between the edge 312 and the undercut surface 230 along the first direction. The distance between any point on the edge 312 and any point on the undercut surface along the first direction may be equal to or larger than the distance 660. In Fig. 6, the distance 660 is the distance between the edge 312 and undercut surface portion 231.

[0053] According to embodiments, which can be combined with other embodiments described herein, a distance between the edge of the edge exclusion portion and the cooling arrangement is 200mm or less along the first direction. As illustrated in Fig. 6, the distance between the edge of the edge exclusion mask and the cooling arrangement may refer to the distance 680 along the x-direction 382 between the edge 312 and the second cooling surface portion 331. The distance between the edge of the edge exclusion portion and the cooling arrangement along the first direction (e.g., distance 680) may be equal to the distance between the edge of the edge exclusion portion and the undercut surface along the first direction (e.g., distance 660), e.g. in embodiments according to which the undercut surface is in contact with the second cooling surface. Having an undercut surface in contact with the second cooling surface provides for a better cooling of the edge exclusion mask when compared to a situation where these surfaces are not in contact with each other. In the latter case of non-contacting surfaces, heat transfer can only occur via radiation, whereas in the case of contacting surfaces the cooling additionally occurs via the contact between the undercut surface and the second cooling surface.

[0054] In order to allow for a clear illustration of the distances 660 and 680 in Fig. 6, the undercut surface 230 and the second cooling surface 330 in Fig. 6 are schematically shown with a small spacing in between. Yet, it shall be understood that the schematic representation of Fig. 6 is provided for illustrative purposes only and, according to embodiments described herein, the undercut surface 230 is provided in contact with the first cooling surface 330, so that the distance 660 is equal to the distance 680.

[0055] Having small distances 660 and/or 680 provides for an edge exclusion mask where the cooling arrangement 350 can be arranged in close proximity to the edge exclusion portion 310 of the edge exclusion mask 200. Accordingly, compared to cooling arrangements being at a greater distance from the edge exclusion portion, a better cooling of the edge exclusion mask at or near the edge exclusion portion can be provided, e.g. for reducing bending of the edge exclusion mask due to high-temperature influences. [0056] As further illustrated in Fig. 6, the cooling arrangement 350 may be distanced from the substrate 100 along the first direction, e.g. the x-direction 382. A gap 690 may exist between the substrate 100 and the cooling arrangement 350 along the first direction. As shown in Fig. 6, at least a portion of the undercut surface 230 of the edge exclusion mask may be provided in the gap 690 between the substrate 100 and the cooling arrangement 350.

[0057] According to embodiments, which can be combined with other embodiments described herein, an angle between the opposing surface of the edge exclusion mask and the substrate receiving plane is from 0 to 30 degrees, more particularly from 8 to 25 degrees. Fig. 7 illustrates an embodiment according to which the opposing surface 220 makes an angle 722 with respect to the substrate receiving plane 390. The angle 722 is nonzero. The angle 722 is an inclination angle of the opposing surface portion 221 with respect to the substrate receiving plane 390. The first cooling surface portion 322 is parallel to the substrate receiving plane 390. Accordingly, the angle between the first cooling surface portion 322 and the substrate receiving plane 390 is zero. [0058] According to embodiments, which can be combined with other embodiments described herein, an angle between the first cooling surface of the cooling arrangement and the substrate receiving plane is from 0 to 60 degrees. As shown in Fig. 7, the first cooling surface of the cooling arrangement 350 makes an angle 724 with respect to the substrate receiving plane 390. The angle 724 is nonzero. The angle 724 is an inclination angle of the first cooling surface portion 321 with respect to the substrate receiving plane 390. As shown in Fig. 7, the angle 722 is equal to the angle 724. The first cooling surface portion 322 is parallel to the substrate receiving plane 390. Accordingly, the angle between the first cooling surface portion 322 and the substrate receiving plane 390 is zero. [0059] According to embodiments, which can be combined with other embodiments described herein, the angle of the opposing surface with respect to the substrate receiving plane and/or the angle of the first cooling surface with respect to the substrate receiving plane may be 30 degrees or less. Having such small angles provides for a large contact area between the edge exclusion mask and the cooling arrangement. The large contact area allows for a better cooling of the edge exclusion mask. According to embodiments, which can be combined with other embodiments described herein, a contact area between the first cooling surface of the cooling arrangement and the opposing surface of the edge exclusion mask is 30% or more of the area of the masking surface, more particularly 50% or more, still more particularly 70% or more. The contact area may be the same as the area of the first cooling surface and/or the same as the area of the opposing surface. It shall be understood that the area of physical contact between the edge exclusion mask and the cooling arrangement may depend on, e.g., the pressure applied to bring these components into contact with each other. Irrespective of such considerations, the terminology of a "contact area" between the first cooling surface of the cooling frame and the opposing surface of the edge exclusion mask refers to an overlap area or interface area between these two surfaces by way of which the cooling of the edge exclusion mask can occur.

[0060] According to embodiments, which can be combined with other embodiments described herein, the opposing surface has an area of 30% or more of the area of the masking surface, more particularly 50% or more, still more particularly 70% or more. According to embodiments, which can be combined with other embodiments described herein, the first cooling surface of the cooling arrangement has an area from 30% or more of the area of the masking surface, more particularly 50% or more, still more particularly 70% or more.

[0061] Fig. 8 shows an edge exclusion mask 200 according to a further embodiment. The opposing surface 220 shown in Fig. 8 is a planar surface. According to embodiments, which can be combined with other embodiments described herein, the opposing surface 220 may be a planar surface or may be a substantially planar surface.

[0062] Fig. 9 shows the edge exclusion mask 200 of Fig. 8 included in a masking arrangement 300 according to an embodiment. In the embodiment shown in Fig. 9, the first cooling surface of the cooling arrangement is a planar first cooling surface 920. The planar first cooling surface 920 and the opposing surface 220 of the edge exclusion mask 200 are parallel to the substrate receiving plane 390. The angle between the opposing surface 220 and the substrate receiving plane 390 is zero. The angle between the planar first cooling surface 920 and the substrate receiving plane 390 is zero.

[0063] Fig. 10 shows an edge exclusion mask according to a further embodiment. The opposing surface 220 shown in Fig. 10 is a planar surface. The opposing surface 220 is parallel to the masking surface 210. In the schematic illustration of Fig. 10, the undercut surface 230 is formed by undercut surface portions 1031, 1032, 1033, 1034 and 1035. The undercut surface 230 includes a protrusion 1050 formed by undercut surface portions 1032, 1033 and 1034. The protrusion 1050 may be an undercut-defining protrusion defining the undercut of the undercut surface, as described herein. A recess is formed by undercut surface portions 1031 and 1032 and by a portion of the opposing surface 220 adjoining the undercut surface portion 1031.

[0064] Fig. 11 shows the edge exclusion mask 200 of Fig. 10 included in a masking arrangement 300 according to an embodiment. In the embodiment illustrated in Fig. 11, the first cooling surface of the cooling arrangement 350 is a planar first cooling surface 920. With reference to Fig. 11, it shall be understood that opposing surface 220 extends until the dashed line 1190 indicating the extent of the planar first cooling surface 920. The opposing surface of the edge exclusion mask, as used herein, may refer to the portion of the edge exclusion mask contacting the first cooling surface of the cooling arrangement. [0065] As shown in Figs. 10 and 11, the first cooling surface of the cooling arrangement 350 and the opposing surface 220 of the edge exclusion mask 200 are inclined with respect to the substrate receiving plane 390. The angle 1182 between the opposing surface 220 and the substrate receiving plane 390 is nonzero. The angle 1184 between the first cooling surface of the cooling arrangement 350 and the substrate receiving plane 390 is nonzero.

[0066] According to embodiments, which can be combined with other embodiments described herein, the angle 1182 may be a single inclination angle of the opposing surface 220 with respect to the substrate receiving plane 390. According to embodiments, which can be combined with other embodiments described herein, the angle 1184 may be a single inclination angle of the first cooling surface with respect to the substrate receiving plane 390. The angle 1182 and/or the angle 1184 may be from 0 to 30 degrees.

[0067] In the embodiment shown in Fig. 11, the angle 1182, the angle 1184 and the inclination angle 314 are equal. The masking surface 210 is parallel to the opposing surface 220 and to the first cooling surface. [0068] According to embodiments, which can be combined with other embodiments described herein, the cooling arrangement 350 may have a third surface 1140 opposing the first cooling surface, as shown in Fig. 11. The third surface 1140 may be parallel to the substrate receiving plane 390. The first cooling surface is inclined with respect to the third surface 1140. [0069] As shown in Fig. 11, the cooling arrangement 350 has a peripheral portion 1150. As shown, the peripheral portion 1150 may be formed from a part of the first cooling surface and from a part of the third surface 1140.

[0070] As further shown in Fig. 11, the peripheral portion 1150 is arranged between the opposing surface 220 and the protrusion 1050 of the undercut surface, i.e. the undercut- defining protrusion. The peripheral portion 1150 is arranged in the recess formed by undercut surface portions 1031 and 1032 and by the portion of the opposing surface 220 adjoining the undercut surface portion 1031. At least a portion of the undercut surface extends around the peripheral portion 1150 so that the cooling arrangement 350 is held in a fixed position by the edge exclusion mask 200. [0071] According to embodiments, which can be combined with other embodiments described herein, the undercut surface may adjoin the opposing surface to provide a recess for mounting the edge exclusion mask to the cooling arrangement. A portion of the cooling arrangement, e.g. a peripheral portion, may be provided in the recess to mount the edge exclusion mask to the cooling arrangement.

[0072] In the embodiment shown in Fig. 11, the cooling arrangement 350 is provided between the substrate receiving plane 390 and the opposing surface 220 of the edge exclusion mask 200.

[0073] The cooling arrangement may have a minimal width in the direction perpendicular to the substrate receiving plane. Fig. 12 illustrates the minimal width 1202 of the cooling arrangement 350 for the embodiment shown in Fig. 11. The minimal width 1202 may be the minimal width of the peripheral portion 1150. The direction perpendicular to the substrate receiving plane may refer to the z-direction 384. The minimal width may be a distance between the first cooling surface and the third surface of the cooling arrangement along the direction perpendicular to the substrate receiving plane. According to embodiments, which can be combined with other embodiments described herein, the minimal width of the cooling arrangement in the direction perpendicular to the substrate receiving plane may be from 0 to 30 mm, more particularly from 2 to 10 mm. Having a small minimal width of the peripheral portion of the cooling arrangement allows for providing the cooling arrangement in close proximity to the edge exclusion portion of the masking surface. A small minimal width of the peripheral portion is e.g. useful in embodiments where the angle of the opposing surface with respect to the substrate receiving plane is small and where only a limited space is available along the z-direction 384 for providing the cooling arrangement, e.g. embodiments involving the carrier system 1300 shown in Fig. 14. A cooling arrangement provided in close proximity to the edge exclusion portion allows for a better cooling of the edge exclusion portion to prevent deformations, e.g. bending, of the edge exclusion mask near the edge exclusion portion.

[0074] According to a further embodiment, a masking arrangement for controlling deposition on a substrate is provided. The masking arrangement includes an edge exclusion mask and a cooling arrangement, as described herein. The edge exclusion mask is adapted for masking an edge region of the substrate. The edge exclusion mask includes a masking surface adapted for facing a deposition source arrangement. The masking surface has an inclination angle with respect to a substrate receiving plane. The inclination angle is 30 degrees or less, more particularly 24 degrees or less. The inclination angle may be larger than zero. The edge exclusion mask further includes an opposing surface opposing the masking surface. The edge exclusion mask further includes an undercut surface forming an undercut of the edge exclusion mask. The cooling arrangement is adapted for cooling the edge exclusion mask. The cooling arrangement includes a first cooling surface in contact with the opposing surface. The undercut or undercut surface engages with the cooling arrangement to mount the edge exclusion mask to the cooling arrangement. [0075] It shall be understood that the masking arrangement may include the embodiments of the edge exclusion mask as described herein. It shall further be understood that the features of the cooling arrangement considered in relation to embodiments of the edge exclusion mask may also be considered as features for the cooling arrangement included in the masking arrangement, and vice versa. [0076] According to embodiments, which can be combined with other embodiments described herein, the cooling arrangement comprises a second cooling surface, as described herein, in contact with the undercut surface.

[0077] The cooling arrangement may be an active cooling arrangement. The active cooling arrangement may provide for an active cooling of the edge exclusion mask. The cooling arrangement may include one or more cooling elements for cooling the edge exclusion mask. The one or more cooling elements may contain water for providing a water cooling of the edge exclusion mask.

[0078] The cooling arrangement may have a width in the direction perpendicular to the substrate receiving plane, e.g. z-direction 384 shown in Fig. 3. The width may vary when traversing the cooling arrangement along a direction parallel to the substrate receiving plane, e.g. along x-direction 382 as shown in Fig. 3. The cooling arrangement may have a maximal width in the direction perpendicular to the substrate receiving plane, e.g. maximal width 380 as shown in Figs. 3 and 12. According to embodiments, which can be combined with other embodiments described herein, the maximal width of the cooling arrangement in the direction perpendicular to the substrate receiving plane may be from 0 to 30 mm, more particularly from 20 to 28 mm.

[0079] Fig. 13 shows a masking arrangement 300 according to an embodiment. The masking arrangement 300 is supported by a carrier system 1300. The carrier system 1300 includes a substrate supporting surface 1310 supporting the substrate 100. The substrate supporting surface 1310 defines the substrate receiving plane 390. The substrate supporting surface 1310 is parallel the substrate receiving plane 390. The substrate 100 is provided between the substrate supporting surface 1310 and the edge exclusion portion 310 of the masking surface 210. [0080] The carrier system 1300 further includes a cooling arrangement receiving surface 1320 receiving the cooling arrangement 350. The cooling arrangement 350 is provided between the cooling arrangement receiving surface 1320 and the opposing surface 220 of the edge exclusion mask 200. The cooling arrangement receiving surface 1320 receives the third surface 1140 of the cooling arrangement 350. The cooling arrangement receiving surface 1320 may be in contact with the cooling arrangement 350. The cooling arrangement receiving surface 1320 may be pressed against the cooling arrangement 350.

[0081] As shown in Fig. 13, the carrier system 1300 covers a gap 1390 between the substrate 100 and the edge exclusion mask 200. Accordingly, side deposition can be avoided. [0082] As shown in Fig. 13, along the direction perpendicular to the substrate receiving plane 390, i.e. the z-direction 384, a distance 1380 exists between the cooling arrangement receiving surface 1320 and the substrate receiving plane 390. Accordingly, compared to apparatuses where the cooling arrangement receiving surface is provided along the substrate receiving plane, more space is provided in the z-direction 384 between the opposing surface of the edge exclusion mask 200 and the cooling arrangement receiving surface 1320. Accordingly, a cooling arrangement having a greater width can be provided between the between the opposing surface 220 and the cooling arrangement receiving surface 1320. [0083] According to other embodiments, and as shown in Fig. 14, the cooling arrangement receiving surface 1320 may extend along the substrate receiving plane 390. Accordingly, both the substrate supporting surface 1310 and the cooling arrangement receiving surface 1320 extend along the substrate receiving plane 390. As shown in Fig. 14, the cooling arrangement 350 and the masking surface 210 may be arranged on the same side of the substrate receiving plane 390. Compared to the embodiment illustrated in Fig. 13, in the embodiment illustrated in Fig. 14 less space is available along the z-direction 384 for providing the cooling arrangement 350 between the opposing surface 220 and the carrier system 1300. To allow for a cooling of the edge exclusion mask 200 at the edge exclusion portion 310, the peripheral portion 1150 has a small minimal width, as described herein, such that the cooling arrangement 350 can be brought in close proximity to the edge exclusion portion 310.

[0084] According to embodiments, the masking arrangement including the edge exclusion mask and the cooling arrangement may be a static masking arrangement provided in a fixed position in a deposition region, e.g. a deposition chamber. The edge exclusion mask may be a static edge exclusion mask. The cooling arrangement may be a static cooling arrangement. The positions of the masking arrangement, the edge exclusion mask and/or the cooling arrangement in the deposition region may be fixed for one or more deposition cycles of the layer deposition process. The carrier system may be a movable carrier system. The carrier system may be transported into and out of the deposition region. The carrier system supporting the substrate at the substrate supporting surface may be transported into the deposition region, e.g. in a substrate transport direction parallel to the substrate receiving plane. The substrate transport direction may refer to y-direction 386 in the figures. The substrate supported by the substrate supporting surface of the carrier system may be positioned with respect to the static masking arrangement in a manner such that the edge region of the substrate is covered by the edge exclusion portion of the edge exclusion mask and such that the cooling arrangement is received by the cooling arrangement receiving surface. The layer deposition process may be performed in the deposition region to coat the substrate. During coating of the substrate, the edge exclusion mask prevents material to be deposited on the edge region of the substrate, as described herein. After coating the substrate, the carrier system supporting the substrate may be transported out of the deposition region, e.g. along the substrate transport direction. The substrate may be transported out of the deposition region to another processing region for further processing of the substrate. A further substrate supported by a further carrier system may be transported into the deposition chamber and positioned with respect to the static masking arrangement. A further layer deposition process may be performed in the deposition region in which the static masking arrangement is arranged. In the further layer deposition process, the further substrate may be coated. During coating, the edge exclusion mask of the static masking arrangement may prevent material to be deposited on a further edge region of the further substrate. The further substrate may be transported out of the deposition region by the further carrier system supporting the further substrate. [0085] According to embodiments, which can be combined with other embodiments described herein, the masking arrangement is adapted to be supported by a carrier system including a substrate supporting surface and a cooling arrangement receiving surface. The substrate supporting surface may define the substrate receiving plane. The substrate supporting surface is adapted for supporting the substrate. The cooling arrangement receiving surface is adapted for receiving the cooling arrangement.

[0086] According to embodiments, which can be combined with other embodiments described herein, the cooling arrangement receiving surface is distanced from the substrate receiving plane in a direction perpendicular to the substrate receiving plane. The distance may be from 3 to 15 mm. The distance may depend on the design of the edge exclusion mask and/or on the distance between the edge 312 of the edge exclusion mask and the substrate in the direction perpendicular to the substrate receiving plane.

[0087] As described herein, the inclination angle between the masking surface of the edge exclusion mask and the substrate receiving plane (e.g. inclination angle 314), the angle between the opposing surface of the edge exclusion mask and the substrate receiving plane (e.g. angle 722), and/or the angle between the first cooling surface of the cooling arrangement and the substrate receiving plane (e.g. angle 724), may be 30 degrees or less. According to other embodiments, which can be combined with embodiments described herein, any of these angles may be 20 degrees or less, more particularly 10 degrees or less. As described above, a small inclination angle between the masking surface and the substrate receiving plane allows further reducing shadowing effects, thus providing for a further improved uniformity of deposited layers and an increased edge region lifetime. As also described above, a small angle of the opposing surface with respect to the substrate receiving plane and/or a small angle of the first cooling surface with respect to the substrate receiving plane provide for a large contact area between the edge exclusion mask and the cooling arrangement. The large contact area allows for a further improved cooling of the edge exclusion mask.

[0088] According to embodiments, the term "edge exclusion mask" is used for a piece of mask material, such as a carbon fiber material or a metal like aluminium, titan, stainless steel, Invar or the like.

[0089] According to embodiments, which can be combined with other embodiments described herein, the edge exclusion mask may be composed of several parts or portions, which can form a frame. The frame of a mask may again have several frame portions or frame parts. This may be advantageous as frames assembled from different parts are believed to be more cost efficient in production than integral frames.

[0090] While the foregoing is directed to embodiments described herein, other and further embodiments may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. Edge exclusion mask (200) for masking an edge region (110) of a substrate (100) in a layer deposition process, comprising: a masking surface (210) adapted for facing a deposition source arrangement, wherein the masking surface has an inclination angle (314) of 30 degrees or below and larger than zero with respect to a substrate receiving plane (390); an opposing surface (220) opposing the masking surface and being adapted for receiving a first cooling surface of a cooling arrangement (350); and an undercut surface (230) forming an undercut of the edge exclusion mask, wherein the undercut surface is adapted for mounting the edge exclusion mask to the cooling arrangement.

2. Edge exclusion mask according to claim 1, wherein the undercut surface is adapted for receiving a second cooling surface of the cooling arrangement.

3. Edge exclusion mask according to claim 1 or claim 2, wherein the undercut surface comprises a protrusion (250, 1050) for mounting the edge exclusion mask to the cooling arrangement.

4. Edge exclusion mask according to any of the preceding claims, wherein the masking surface comprises an edge exclusion portion (310) having an edge (312), wherein a distance (660) between the edge and the undercut surface is 200 mm or less in a direction (382) parallel to the substrate receiving plane.

5. Edge exclusion mask according to any of the preceding claims, wherein an angle (722) between the opposing surface and the substrate receiving plane is from 0 to 30 degrees.

6. Edge exclusion mask according to any of the preceding claims, wherein the opposing surface has an area of 50% or more of an area of the masking surface.

7. Masking arrangement (300) for controlling deposition on a substrate (100), comprising: an edge exclusion mask (200) adapted for masking an edge region (110) of the substrate, comprising: a masking surface (210) adapted for facing a deposition source arrangement, wherein the masking surface has an inclination angle (314) of 30 degrees or below and larger than zero with respect to a substrate receiving plane (390) ; an opposing surface (220) opposing the masking surface; and an undercut surface (230) forming an undercut of the edge exclusion mask; and a cooling arrangement (350) adapted for cooling the edge exclusion mask, wherein the cooling arrangement comprises a first cooling surface in contact with the opposing surface and wherein the undercut surface engages with the cooling arrangement to mount the edge exclusion mask to the cooling arrangement.

8. Masking arrangement according to claim 7, wherein the cooling arrangement comprises a second cooling surface in contact with the undercut surface.

9. Masking arrangement according to claim 7 or claim 8, wherein the cooling arrangement is mounted to the edge exclusion mask at a protrusion (250, 1050) of the undercut surface.

10. Masking arrangement according to any of claims 7 to 9, wherein the masking surface comprises an edge exclusion portion (310) having an edge (312), wherein a distance (680) between the edge and the cooling arrangement is 200 mm or less in a direction (382) parallel to the substrate receiving plane.

11. Masking arrangement according to any of claims 7 to 10, wherein an angle (724) between the first cooling surface of the cooling arrangement and the substrate receiving plane is from 0 to 30 degrees.

12. Masking arrangement according to any of claims 7 to 11, wherein the first cooling surface of the cooling arrangement has an area of 50% or more of an area of the masking surface.

13. Masking arrangement according to any of claims 7 to 12, wherein a minimal width (1202) of the cooling arrangement in a direction (384) perpendicular to the substrate receiving plane is from 0 to 30 mm.

14. Masking arrangement according to any of claims 7 to 13, wherein the masking arrangement is adapted to be supported by a carrier system (1300) comprising a substrate supporting surface (1310) and a cooling arrangement receiving surface (1320), wherein: the substrate supporting surface defines the substrate receiving plane and is adapted for supporting the substrate; and the cooling arrangement receiving surface is adapted for receiving the cooling arrangement.

15. Masking arrangement according to claim 14, wherein the cooling arrangement receiving surface is distanced from the substrate receiving plane in a direction perpendicular to the substrate receiving plane.