TW201504872A - Touch panel and touch display device - Google Patents

Abstract

A touch panel includes a substrate, a patterned decoration layer, a sensor, a buffer layer, a plurality of bonding pads, and a protection layer. The substrate has a transparent region and a peripheral region. The patterned decoration layer is disposed in the peripheral region of the substrate. The sensor is disposed on the surface and a portion of the sensor extends on the patterned decoration layer. The buffer layer is disposed on the patterned decoration layer. The bonding pads are disposed on the buffer layer and electrically connected to the sensor. The protecting layer covers the sensor and has an opening that exposes at least one portion of the buffer layer and the bonding pads.

Description

Touch panel and touch display device

The present invention relates to a touch panel and a touch display device including the touch panel, and more particularly to a touch panel and a touch display device capable of providing a patterned decorative layer protection in a bonding pad region.

Generally, a touch panel usually has no protective layer in a partial area to expose a part of the decorative layer and a conductive pad directly disposed on the surface of the decorative layer, and the exposed conductive pad is bonded to the external wire by a bonding process. Pass signals and operations. However, in the bonding process, the touch panel may be exposed to ultraviolet light or subjected to a high temperature environment, causing peeling, discoloration, or damage of the exposed decorative layer. In addition, the decorative layer exposed on the surface of the touch panel may also be scratched in subsequent processes. Therefore, how to avoid the damage of the decorative layer in the lead pad area during the process is still an issue that needs to be studied in the industry.

One of the main purposes of the present invention is to provide a touch panel and a touch display device including the same, which are provided by providing a buffer layer on the decorative layer to protect the decorative layer to solve the above conventional touch panel. The problem of easy damage due to the decorative layer being exposed to the surface.

To achieve the above objective, an embodiment of the present invention provides a touch panel including a substrate, a patterned decorative layer, a sensing component, a buffer layer, a plurality of conductive pads, and a protective layer. The substrate defines a light transmissive area and a surrounding area. The patterned decorative layer is disposed on the peripheral region on the substrate, and the sensing component is disposed on the substrate and a portion of the sensing component extends onto the patterned decorative layer. The guiding pad is disposed on the buffer layer, and the guiding pad is electrically connected to the sensing element. The protective layer covers the sensing element, and the protective layer has an opening exposing at least a portion of the buffer layer and the via pad.

To achieve the above objective, an embodiment of the present invention further discloses a touch display device comprising a touch panel, a display panel and an adhesive layer as described above. The display panel is disposed on one side of the touch panel, and the adhesive layer is disposed between the display panel and the touch panel for fixing the touch panel to the surface of the display panel.

Since the touch panel of the present invention is provided with a buffer layer between the patterned decorative layer and the conductive pad, and in the opening of the protective layer, the buffer layer covers the patterned decorative layer, thereby providing a protective patterned decorative layer. The effect is that the patterned decorative layer is damaged by high temperature, ultraviolet light irradiation or other factors in the subsequent process, and the product yield can be improved.

10, 10', 101, 102, 103, 104‧‧‧ touch panels

12‧‧‧Substrate

12a, 12b‧‧‧ surface

14, 143, 144‧‧‧ Sensing components

16‧‧‧ patterned decorative layer

161‧‧‧The first patterned decorative layer

162‧‧‧Second patterned decorative layer

163‧‧‧Barrier

18‧‧‧ Buffer layer

20‧‧‧Signal trace

22, 221, 222, 223, 224‧‧ ‧ lead pads

24‧‧‧ Conductive adhesive layer

26‧‧‧Circuit connection board

28‧‧‧Protective layer

281‧‧‧ openings

30‧‧‧ display panel

32‧‧‧Adhesive layer

34‧‧‧Insulation

36‧‧‧Optical matching layer

361‧‧‧First optical matching layer

362‧‧‧Second optical matching layer

100‧‧‧Touch display device

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

C3‧‧‧ Conductive layer

M1‧‧‧ third conductive layer

M2‧‧‧Second conductive layer

M3, M4‧‧‧ conductive layer

R1‧‧‧Light transmission area

R2‧‧‧ surrounding area

Z‧‧‧Vertical projection direction

1 is a partial top plan view of a first embodiment of a touch panel of the present invention.

Fig. 2 is a partial cross-sectional view showing the touch panel of Fig. 1 taken along line A-A'.

FIG. 3 is a schematic cross-sectional view of the touch display device of the present invention.

4 is a partial cross-sectional view showing a modified embodiment of the first embodiment of the touch panel of the present invention.

FIG. 5 is a partial top plan view of a second embodiment of the touch panel of the present invention.

FIG. 6 is a partial cross-sectional view showing a second embodiment of the touch panel of the present invention.

FIG. 7 is a partial top plan view of a third embodiment of the touch panel of the present invention.

Figure 8 is a partial cross-sectional view showing a third embodiment of the touch panel of the present invention.

FIG. 9 is a partial top plan view showing a fourth embodiment of the touch panel of the present invention.

FIG. 10 is a partial cross-sectional view showing a fourth embodiment of the touch panel of the present invention.

11 is a partial cross-sectional view showing a fifth embodiment of the touch panel of the present invention.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a partial top view of the first embodiment of the touch panel of the present invention, and FIG. 2 is a cross-sectional view of the touch panel along the line A-A′ of FIG. 1 . BRIEF DESCRIPTION OF THE DRAWINGS However, it should be noted that FIG. 1 only shows the protective layer 28 and its underlying components, and the circuit connecting plate 26 and the conductive adhesive layer 24 shown in FIG. 2 are not shown. In addition, follow the fifth The top view of the drawing, the seventh drawing and the ninth drawing also does not show the circuit connecting plate 26 and the conductive adhesive layer 24, and will not be described again.

As shown in FIGS. 1 and 2, the touch panel 10 of the present invention includes a substrate 12, which The surface defines a light transmissive region R1 and a surrounding region R2, and the peripheral region R2 is located on at least one side of the light transmissive region R1. For example, the surrounding area R2 of the present embodiment may surround the periphery of the light-transmitting area R1, for example, the surrounding area R2 is an annular closed "mouth" shape. Since FIG. 1 shows only a part of the touch panel 10, only a part of the surrounding area R2 adjacent to the light transmitting area R1 is drawn. It should be noted that the present invention is not limited to the embodiment, and the peripheral region R2 may be disposed adjacent to only a portion of the edge of the light-transmitting region R1 as needed. The touch panel 10 of the present invention further includes a sensing component 14, a patterned decorative layer 16, a buffer layer 18, a plurality of via pads 22, and a protective layer 28. The patterned decorative layer 16 is disposed in the peripheral region R2 of the surface 12a of the substrate 12, and the sensing element 14 is located at least in the transparent region R1 of the surface 12a of the substrate 12. Therefore, the patterned decorative layer 16 and the sensing element 14 are respectively disposed on the surface 12a of a portion of the substrate 12, and at least a part of the two do not overlap each other. It should be noted that in other embodiments, the surrounding area R2 is not necessarily annular or closed "mouth" shape, so the patterned decorative layer 16 does not necessarily have a ring-shaped or closed pattern, for example, the patterned decorative layer 16 may only The display panel 10 is located on the upper and lower sides of the display panel 10, and the left and right sides of the display panel 10 are not patterned, but are not limited thereto. The buffer layer 18 is disposed on the patterned decorative layer 16 and partially covers the patterned decorative layer 16. The conductive pad 22 is disposed on the buffer layer 18 and electrically connected to the sensing element 14, and the buffer layer 18 preferably has an area smaller than The area of the decorative layer 16 is patterned. As shown in FIG. 1, the display panel 10 can include a plurality of via pads 22 that are parallel to each other and spaced apart from each other such that a portion of the buffer layer 18 is exposed between adjacent via pads 22. In a preferred embodiment, one portion of the sensing element 14 extends into the peripheral region R2 of the surface 12a of the substrate 12 to partially cover a portion of the patterned decorative layer 16, and may be disposed on one of the patterned decorative layers 16 to A plurality of signal traces 20 are electrically connected to the pad 22 . Furthermore, the protective layer 28 is disposed on the buffer layer 18, the conductive pad 22, the signal trace 20 and the sensing element 14, covering the surface 12a of the substrate 12 and covering the sensing element 14, and the protective layer 28 has An opening 281, wherein the opening 281 exposes at least a portion of the guiding pad in the vertical projection direction Z 22, the buffer layer 18, the patterned decorative layer 16 and the substrate 12, wherein the area of the buffer layer 18 is greater than or equal to the area of the opening 181, and the area of the buffer layer 18 is preferably larger than the area of the opening 181. It should be noted that, since the buffer layer 18 covers the patterned decorative layer 16 and its area is greater than or equal to the opening 181, the buffer layer 18 completely shields the patterned decorative layer 16 disposed under the opening 181. That is, the film layer which is actually exposed by the opening 181 has only the buffer layer 18 and the via pad 22. In addition, the touch panel 10 can further include a circuit connecting board 26, such as a flexible printed circuit board (FPC), disposed on the protective layer 28 and covering the opening 281. The circuit connecting board 26 can be made of a conductive adhesive layer. 24 is electrically connected to the conductive pad 22, wherein the conductive adhesive layer 24 is disposed in the opening 281 and located between the conductive pad 22 exposed by the opening 281 and the circuit connecting plate 26. The conductive adhesive layer 24 is exemplified by an anisotropic conductive adhesive, but is not limited thereto.

The material and relative positional relationship of the components of the touch panel 10 will be further described below. According to the embodiment, the substrate 12 can be a glass substrate, a thin glass film, a plastic plate, a composite plastic plate or a plastic film, and the transmittance of the substrate 12 is preferably 85% or more. The patterned decorative layer 16 may include any color material, such as an ink layer or a photoresist layer. In this embodiment, the patterned decorative layer 16 is exemplified by a dark ink layer, but is not limited thereto, for example, a pattern. The decorative layer 16 can also be composed of two or more layers. The material of the buffer layer 18 includes at least one of a silicon nitride (SiNx), a silicon oxide (SiOx), and an optical matching material, and a material which can be used as an optical matching material, for example, titanium oxide (titanium oxide) , TiO ₂ ), niobium oxide (NbO _x ), and aluminum oxide (Al ₂ O ₃ ). However, the material of the buffer layer 18 is not limited to the above materials, and any other material capable of protecting the patterned decorative layer 16 can be used as the buffer layer 18. Furthermore, the buffer layer 18 may be a single layer structure or a multi-layer stacked structure. For example, the buffer layer 18 may be composed of at least one of a ruthenium compound layer, an oxynitride layer and an organic material layer, that is, The buffer layer 18 may also be a stack of two or more of the above material layers. In addition, the sensing element 14, the signal trace 20 and the via pad 22 are respectively made of a conductive material, such as a metal oxide, a metal or any other conductive material, such as a film layer containing a nano metal material. In this embodiment, the touch panel 10 is a single-layer multi-touch projected capacitive touch panel, which may include a plurality of sensing elements 14 including, for example, a first axial electrode and a second axial electrode, The insulators are insulated from each other and extend in different directions that may intersect or are perpendicular to each other, wherein the sensing elements 14 (each of the first axial electrodes and the second axial electrodes) are formed by a first conductive layer C1, and a part of the sense The measuring elements 14 are electrically connected to each other by a bridge wire (not shown). The conductive pad 22 and the bridge wire can be formed by the same second conductive layer C2, that is, the bridge wire of the conductive pad 22 and the sensing component 14 can be simultaneously fabricated by the same process step. In this embodiment, the second conductive layer C2 is located on the upper side of the first conductive layer C1, in the order of fabrication or the distance from the surface 12a of the substrate 12 (ie, the height of the two in the horizontal plane). However, in other embodiments, the sensing component 14 may be fabricated by first making a bridge wire. In this case, the sensing component 14 and the conductive pad 22 may also be designed from the same conductive layer. Moreover, in different embodiments, the shape and structure design of the sensing element 14 can also be variously changed. For example, the sensing element 14 can be a plurality of triangular sensing elements arranged side by side and upside down, and a plurality of rectangular shapes that are separated from each other. The sensing element or other geometric sensing element can be connected to the sensing element 14 to form an axial electrode without a bridge connection. In addition, the present invention is not limited to the above, and may be uniformly arranged in the light-transmitting region R1 by using other regular or irregularly shaped sensing elements, for example, a plurality of strip-shaped sensing elements are matched with a plurality of adjacent ones. A block-shaped sensing element between the root strip sensing elements. The first conductive layer C1 and the second conductive layer C2 in this embodiment are respectively transparent conductive layers, such as indium tin oxide (ITO), indium zinc oxide (IZO), and aluminum zinc oxide. Aluminum zinc oxide (AZO) may also be other metal oxide materials or any suitable transparent conductive material. However, in other embodiments, the first conductive layer C1 and the second conductive layer C2 may also include other conductive layers than the transparent conductive material, such as a metal mesh layer, a nano metal layer, or The nano conductive layer or the stacked structure of the above different layers, wherein the material may be metal, metal oxide, carbon nanotube material or nano silver material. The metal mesh layer is, for example, a stack structure of molybdenum/aluminum/molybdenum (Mo/Al/Mo) or molybdenum oxide/aluminum/molybdenum (MoOx/Al/Mo) or molybdenum oxide/molybdenum/aluminum/molybdenum (MoOx/Mo) The stacked structure of /Al/Mo), but not limited thereto, may be a similar stacked structure of other materials, such as a stacked structure of copper (Cu) and metal oxide. The above materials, layer patterns and stacked structures are also applicable to all embodiments of the present invention. In addition, the signal trace 20 for electrically connecting the sensing element 14 and the via pad 22 is made of a third conductive layer M1, and the material thereof is exemplified by metal oxide, metal or other conductive material. When the third conductive layer M1 is a metal layer, the material thereof is exemplified by silver, aluminum, copper, magnesium, molybdenum or an alloy of the above materials. When the third conductive layer M1 is a transparent conductive layer, the material may also include the first And transparent conductive material with the second conductive layer C1, C2, but not limited thereto. The third conductive layer M1 and the first conductive layer C1 and the second conductive layer C2 overlap each other to be electrically connected. The protective layer 28 is composed of at least one of a ruthenium nitride compound (SiNx) layer, an osmium oxide compound (SiOx) layer, and an organic material layer, and when the protective layer 28 is an organic material layer, the thickness is greater than the sense. The thickness of the component 14 is measured. In this embodiment, the protective layer 28 can be used as a flat layer. Therefore, in this embodiment, the patterning decorative layer 16 is formed on the surface 12a of the peripheral region R2 of the substrate 12, and then the sensing element 14 and the buffer layer 18 are fabricated, and then the signal traces 20 and the conductive lines are sequentially formed. The pad 22 finally forms a protective layer 28 on the surface 12a of the substrate 12, and forms an opening 281 in a portion corresponding to the pad 22, and then fixes the circuit connecting plate 26 to the opening 281 by using the conductive adhesive layer 24, so that The circuit board 26 is electrically connected to the pad 22, the signal trace 20 and the sensing element 14. However, the manufacturing sequence of the touch panel 10 of the present invention is not limited to the above. For example, the signal trace 20 may be first formed on the patterned decorative layer 16, and then the sensing component 14 and the conductive pad 22 may be fabricated one by one, or may be made first. The signal trace 20 is used to fabricate the pad 22 and the sensing element 14 in succession.

Referring to FIG. 3 , the touch panel 10 of the present invention can be applied to a touch display device 100 . The touch display device 100 includes the touch panel 10 , a display panel 30 , and an adhesive layer 32 of the present invention. The display panel 30 is disposed on one side of the touch panel 10 , and the adhesive layer 32 is disposed between the display panel 30 and the touch panel 10 for fixing the touch panel 10 to the surface of the display panel 30 . The display panel 30 is exemplified by a liquid crystal display panel, an organic light emitting display panel, an electrowetting display panel, or an electrophoretic display panel, but is not limited thereto. It can be seen from the above that since the buffer layer 18 disposed on the surface of the patterned decorative layer 16 can provide the effect of protecting the patterned decorative layer 16, the subsequent connection process of the circuit board 26 or the touch panel 10 can be fixed to the display. On the panel 30, damage to the patterned decorative layer 16 can be effectively avoided.

The different embodiments of the touch panel of the present invention are described below, and the following description is mainly for the sake of simplification of the description of the embodiments, and the details are not repeated. In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

Referring to FIG. 4, in a modified embodiment of the first embodiment of the touch panel of the present invention, the patterned decorative layer 16 of the touch panel 10' includes a first patterned decorative layer 161 and a second secondary pattern. The decorative layer 162 is sequentially disposed on the surface 12a of the substrate 12 from bottom to top. The color of the first patterned decorative layer 161 is non-black, non-dark or light, such as white or pink, but not limited thereto. The light transmittance of the first patterned decorative layer 161 is greater than the light transmittance of the second patterned decorative layer 162, that is, the optical density of the first patterned decorative layer 161 is smaller than that of the second patterned decorative layer 162. density. Since the first patterned decorative layer 161 includes a non-black material, the shielding property is not avoided, and the user sees the element behind the first patterned decorative layer 161 from the surface 12b side of the substrate 12, so the present variation is implemented. For example, a second patterned decorative layer 162 of low light transmittance is provided to shield other elements on the patterned decorative layer 16, such as the signal trace 20 and the via pads 22, and the like. In the present variation, the first patterned decorative layer 161 and the second patterned decorative layer 162 are both made of a photoresist material, for example, the first patterned decorative layer 161 includes a white photoresist material, and the second The sub-patterned decorative layer 162 includes a black photoresist material, but is not limited thereto. Moreover, in order to avoid opacity of the colors of both the first patterned decorative layer 161 and the second patterned decorative layer 162, between the first patterned decorative layer 161 and the second patterned decorative layer 162 A barrier layer 163 is selectively disposed, and the barrier layer 163 may also extend to the light transmissive region R1 as shown in the figure, and the sensing element 14 is disposed on the barrier layer 163 in the light transmissive region R1, and the barrier layer 163 material Examples include, but not limited to, a nitrogen hydrazine compound, an oxonium compound, and an optical matching material, or may be the same as the material of the buffer layer 18.

Please refer to FIG. 5 and FIG. 6 , which are respectively a partial top view and a partial cross-sectional view of a second embodiment of the touch panel of the present invention. The touch panel 101 of the embodiment and the first embodiment The difference is that the pad 221 and the sensing element 14 are composed of the same first conductive layer C1. Therefore, the conductive pad 221 and the sensing component 14 can be fabricated by the same process, and then the signal trace 20 and the protective layer 28 are sequentially formed on the conductive pad 221 and the sensing component 14. For example, the first conductive layer C1 may include at least one of a metal mesh structure, a metal oxide, or a nano metal layer. However, the order of making the touch panel 101 of the present invention is not limited to the above. For example, the signal trace 20 can be formed first, and then the sensing element 14 and the conductive pad 221 can be fabricated in the same process. In addition, the touch panel 101 of the present embodiment further includes an insulating layer 34 disposed between the substrate 12 and the sensing element 14 and the patterned decorative layer 16. The refractive index of the insulating layer 34 is preferably between 1.4 and 1.9. It is cerium oxide.

Please refer to FIG. 7 and FIG. 8 , which are respectively a partial top view and a partial cross-sectional view of a third embodiment of the touch panel of the present invention. The difference between the touch panel 102 of the present embodiment and the first embodiment is that the conductive pad 222 and the signal trace 20 are formed by the same second conductive layer M2, and can also be regarded as the signal routing in this embodiment. The terminal 20 is directly extended outward to form the conductive pad 222, so that the conductive pad 222 is not separately fabricated with other conductive layers. The material of the second conductive layer M2 may be the same as the material of the third conductive layer M1 described in the first embodiment, such as a metal layer or a metal oxide layer. It should be noted that in the modified embodiment, the signal trace 20 and the conductive pad 222 may be formed first, and then the sensing component 14 is fabricated.

Please refer to FIG. 9 and FIG. 10 , which are respectively a partial top view and a partial cross-sectional view of a fourth embodiment of the touch panel of the present invention. The difference between the present embodiment and the first embodiment is that the sensing component 143, the conductive pad 223 and the signal trace 20 of the touch panel 103 are formed by the same conductive layer M3, in other words, for forming. The conductive layer M3 of the sensing component 143 in the light-transmitting region R1 extends directly to the peripheral region R2 to form the signal trace 20 and the conductive pad 223. Alternatively, the touch panel 103 can also be regarded as the touch panel 103 without the signal trace. Instead, the sensing element 143 extends directly to the peripheral region R2 to interface with the via pad 223. Wherein, the conductive layer M3 may include a metal material or a metal oxide material. In a preferred embodiment, the conductive layer M3 may be composed of a metal material, for example, including a patterned metal mesh structure or the conductive layer M3 itself is a metal mesh. Floor. In various embodiments, the conductive layer M3 may also be a nano metal layer, for example, including a nano silver material, which may be fabricated by a printing process, an inkjet process, or a coating, curing, etching, or the like process. In addition, the conductive layer M3 may also include a carbon nanotube or other suitable conductive material.

Please refer to FIG. 11 , which is a partial cross-sectional view showing a fifth embodiment of the touch panel of the present invention. The difference between this embodiment and the first embodiment is that the signal trace 20 and the sensing element 144 are formed by the same conductive layer M4, and the conductive pad 224 is formed by another conductive layer C3, that is, The signal trace 20 can be considered to be formed by the sensing element 144 extending directly to the peripheral region R2 to the surface of the buffer layer 18. The conductive layer C3 and the conductive layer M4 are partially overlapped with each other to electrically connect the signal trace 20 and the via pads 224 to each other. Conductive layer M4 may comprise any of the materials previously described for making the sensing element, and conductive layer C3 may comprise any of the materials previously described for making the via pads. In addition, the touch panel 104 of the present embodiment further includes an optical matching layer 36 disposed on the substrate 12 on the lower side of the sensing element 144 and the patterned decorative layer 16. The optical matching layer 36 may have a single layer structure or a composite layer structure. The optical matching layer 36 of the present embodiment is exemplified by a first optical matching layer 361 and a second optical matching layer 362. The material of the first optical matching layer 361 is exemplified by a nitrogen bismuth compound (SiNx), and the second optical The material of the matching layer 362 is exemplified by a silicon oxide compound (SiOx), but is not limited thereto.

The foregoing embodiments describe mutual process relationships and materials of various sensing components, signal traces, conductive pads, and bridges of sensing components, wherein at least one of the sensing component, the signal trace, the conductive pad, and the bridge wire Both can be made by the same process to save process time and cost. Furthermore, the patterned decorative layer having a multi-layer film layer in the modified embodiment of the first embodiment can also be applied to various embodiments, and the sensing elements, signal traces, and conductive pads of each embodiment are changed. The multi-layer patterned decorative layer design disclosed in the modified embodiment can be applied to various touch display devices of the present invention combined with a display panel, for example, as shown in FIG. 3, and the sensing elements are located in FIGS. 6 and 11. The insulating layer and the optical matching layer with the substrate can also be applied to other embodiments, and thus will not be further described. In addition, the display panel of the present invention is not limited to a single-layer multi-touch projected capacitive touch panel, and may also be a double-layer electrode (double-layer sensing element) touch panel, a dual-substrate touch panel, and a sensing component. Various settings and shapes can also be included.

As can be seen from the above, since the buffer layer of the touch panel and the touch display device of the present invention is greater than or equal to the opening of the protective layer, the buffer layer can completely cover the patterned decorative layer at the opening position, thereby preventing the patterned decorative layer from being exposed on the display panel. The surface can prevent the deformation of the patterned decorative layer, the adhesion, the peeling, the discoloration, etc. in the subsequent processes (such as the process of electrically connecting the conductive pad to the external component or the ultraviolet light irradiation process), and can also be effective. Avoid problems such as scratches or breakage of the patterned decorative layer. Accordingly, by using the present invention to provide a buffer layer between the pad and the patterned decorative layer, the appearance integrity of the touch panel can be maintained and the product yield can be increased.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10‧‧‧Touch panel

12‧‧‧Substrate

12a‧‧‧ surface

14‧‧‧Sensor components

16‧‧‧ patterned decorative layer

18‧‧‧ Buffer layer

20‧‧‧Signal trace

22‧‧‧ Guide pad

24‧‧‧ Conductive adhesive layer

26‧‧‧Circuit connection board

28‧‧‧Protective layer

281‧‧‧ openings

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

M1‧‧‧ third conductive layer

R1‧‧‧Light transmission area

R2‧‧‧ surrounding area

Z‧‧‧Vertical projection direction

Claims (22)

A touch panel includes: a substrate defining a light transmissive area and a surrounding area; a patterned decorative layer disposed on the peripheral area of the substrate; and a sensing component disposed on the substrate And a portion of the sensing element extends to the patterned decorative layer; a buffer layer is disposed on the patterned decorative layer; a plurality of bonding pads are disposed on the buffer layer, and the guiding The pad is electrically connected to the sensing element; and a protective layer covers the sensing element, wherein the protective layer has an opening exposing at least a portion of the buffer layer and the guiding pads. The touch panel of claim 1, further comprising: a circuit connecting plate disposed on the protective layer; and a conductive adhesive layer disposed between the conductive pads and the circuit connecting plate, The circuit connection board is electrically connected to the conductive pads by the conductive adhesive layer. The touch panel of claim 1, wherein the buffer layer has an area greater than or equal to an area of the opening. The touch panel of claim 3, wherein the buffer layer has an area smaller than an area of the patterned decorative layer. The touch panel of claim 3, wherein the buffer layer is composed of at least one of a cerium nitride compound (SiNx) layer, an oxynitride (SiOx) layer, and an organic material layer. The touch panel of claim 1, wherein the material of the buffer layer comprises at least one of a nitrogen cerium compound (SiNx), a silicon oxide compound (SiOx), and an optical matching material. The touch panel of claim 6, wherein the optical matching material is titanium oxide (TiO ₂ ), niobium oxide (NbO _x ) or aluminum oxide (Al ₂ O ₃ ). The touch panel of claim 1, wherein the materials of the conductive pads and the sensing element comprise indium tin oxide (ITO), indium zinc oxide (IZO), and aluminum oxide, respectively. At least one of aluminum zinc oxide (AZO), nanosilver, carbon nanotubes, metal oxides and metals. The touch panel of claim 1, further comprising a plurality of signal traces disposed on the patterned decorative layer, the signal traces being electrically connected to the sensing component, the signal traces and the conductive traces The pads respectively comprise different conductive layers, and the conductive layers are at least partially overlapped to each other for electrical connection. The touch panel of claim 1, wherein the sensing component comprises a conductive layer, and the conductive layer extends to the patterned decorative layer to form a plurality of signal lines and the conductive pads. The touch panel of claim 10, wherein the material of the conductive layer comprises at least one of a metal, a metal oxide, a nano metal, a nano silver wire, and a carbon nanotube. The touch panel of claim 10, wherein the sensing elements, the conductive pads, and the signal traces are formed by the same conductive layer. The touch panel of claim 1, wherein the sensing element comprises a patterned metal mesh. The touch panel of claim 1, wherein the patterned decorative layer comprises two or more layers. The touch panel of claim 14, wherein the patterned decorative layer comprises a first patterned decorative layer and a second patterned decorative layer disposed on the substrate surface from bottom to top, the first The sub-patterned decorative layer comprises a non-black material, and the light transmittance of the first patterned decorative layer is greater than the light transmittance of the second patterned decorative layer. The touch panel of claim 15 , wherein the patterned decorative layer further comprises a barrier layer disposed between the first patterned decorative layer and the second patterned decorative layer. The touch panel of claim 16, wherein the barrier layer extends to the light transmissive region, and the sensing element is disposed on the barrier layer in the light transmissive region. The touch panel of claim 16 or 17, wherein the material of the barrier layer comprises at least one of a nitrogen cerium compound, a cerium compound, and an optical matching material. The touch panel of claim 1, wherein the substrate is a glass substrate, a thin glass film, a plastic plate, a composite plastic plate or a plastic film, and the transmittance of the substrate is greater than or equal to 85%. A touch display device, comprising: one touch panel as claimed in claim 1; a display panel disposed on one side of the touch panel; and an adhesive layer disposed on the display panel and the touch panel For fixing the touch panel to the surface of the display panel. The touch display device of claim 20, wherein at least one insulating layer is disposed between the sensing element and the substrate, and the insulating layer has a refractive index of 1.4 to 1.9. The touch display device of claim 21, wherein the protective layer is composed of at least one of a cerium nitride compound (SiNx) layer, an oxynitride (SiOx) layer, and an organic material layer, wherein The thickness of the organic material layer is greater than the thickness of the sensing element.