CN113934320A - Touch control display device - Google Patents
Touch control display device Download PDFInfo
- Publication number
- CN113934320A CN113934320A CN202111098171.9A CN202111098171A CN113934320A CN 113934320 A CN113934320 A CN 113934320A CN 202111098171 A CN202111098171 A CN 202111098171A CN 113934320 A CN113934320 A CN 113934320A
- Authority
- CN
- China
- Prior art keywords
- signal line
- display device
- touch display
- layer
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims abstract description 20
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 159
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 16
- 239000002356 single layer Substances 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 4
- 230000010363 phase shift Effects 0.000 claims description 4
- 238000002161 passivation Methods 0.000 description 20
- 239000010408 film Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 13
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 11
- 238000012546 transfer Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- -1 siloxane (siloxane) Chemical class 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006001 poly(vinyl alcohol-co-ethylene) Polymers 0.000 description 1
- 229920002338 polyhydroxyethylmethacrylate Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
Abstract
The invention discloses a touch display device which is provided with a display area and a peripheral area and comprises a substrate, signal lines, connecting pads and a protective layer. The signal line is positioned on the substrate and extends from the display area to the peripheral area. The connecting pad is positioned in the peripheral area and is electrically connected with the signal line. The protective layer is located on the signal line and the connecting pad, has a through hole overlapping the connecting pad, and comprises a flat part and an annular hole part, wherein the flat part surrounds the annular hole part and has a first height, the annular hole part forms the side wall of the through hole and has a second height, and the first height is greater than the second height.
Description
Technical Field
The present invention relates to a touch display device, and more particularly, to a touch display device having improved scratch resistance.
Background
Touch display devices can be roughly classified into an out-cell (out-cell), an on-cell (on-cell), and an in-cell (in-cell) according to the relative position of a touch electrode and a display panel, wherein the out-cell touch display device has the advantages of being lighter and thinner than the out-cell touch display device and having lower technical difficulty than the in-cell touch display device, and is widely applied to various electronic products.
The external-embedded touch display device is configured to dispose the touch related element on the back surface of the color filter substrate, and therefore, a single-board double-sided fabrication process is required in the manufacturing process to form the touch related element and the color filter element on two opposite surfaces of the substrate, respectively, and then perform a film flip-chip Bonding (COF) process by using, for example, an Outer Lead Bonding (Outer Lead Bonding) technique. However, when the substrate is turned over after the touch related device is formed to perform the color filter device fabrication process, the touch related device is often scratched due to the contact with the transmission mechanism (e.g., the conveying roller) during the transmission process.
Disclosure of Invention
The invention provides a touch display device with improved scratch resistance.
One embodiment of the present invention provides a touch display device, which has a display area and a peripheral area, and includes: a substrate; the signal line is positioned on the substrate and extends from the display area to the peripheral area; the connecting pad is positioned in the peripheral area and is electrically connected with the signal line; and a protective layer located on the signal line and the pad, having a through hole overlapping the pad, and including a flat portion and an annular hole portion, wherein the flat portion surrounds the annular hole portion and has a first height, the annular hole portion constitutes a sidewall of the through hole and has a second height, and the first height is greater than the second height.
In an embodiment of the invention, a difference between the second height and the height of the pad is less than or equal to 0.8 μm.
In an embodiment of the invention, the pad includes a single-layer structure or a multi-layer structure.
In an embodiment of the invention, the pad includes a first conductive layer and a second conductive layer, the second conductive layer completely covers the first conductive layer, and the sidewall of the through hole completely covers the periphery of the second conductive layer.
In an embodiment of the invention, the signal line includes a first signal line and a second signal line, and the first conductive layer and the first signal line belong to a same film layer, and the second conductive layer and the second signal line belong to a same film layer.
In an embodiment of the invention, the touch display device further includes a transfer wire, wherein the transfer wire is electrically connected to the second signal line and the first conductive layer, and the transfer wire and the first signal line belong to the same film layer.
In an embodiment of the invention, the second signal line is electrically connected to the transfer conductive line through the through hole.
In an embodiment of the invention, the protection layer is formed by a phase shift photomask, a half-tone photomask or a gray scale photomask.
In an embodiment of the invention, the signal line is separated from the pad.
In an embodiment of the invention, the signal line bridges the pad through the transparent conductive line.
In an embodiment of the invention, the protection layer includes an organic material.
In an embodiment of the invention, the signal line includes an end wide portion overlapping the transparent conductive line, and a line width of the end wide portion is smaller than a line width of the transparent conductive line.
In an embodiment of the invention, a difference between the line width of the transparent conductive line and the line width of the end wide portion is greater than or equal to 6 μm.
In an embodiment of the invention, a line width of the end wide portion is greater than a line width of the signal line in the display area.
In an embodiment of the invention, the touch display device further includes a polarizer covering the signal lines and a portion of the transparent conductive lines, and a distance between the end wide portion and an edge of the polarizer is greater than or equal to 500 μm.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1A is a schematic top view of a touch display device 10 according to an embodiment of the invention;
FIG. 1B is a schematic cross-sectional view taken along section line A-A' of FIG. 1A;
FIG. 1C is a schematic cross-sectional view taken along section line B-B' of FIG. 1A;
fig. 2A is a schematic top view of a touch display device 20 according to an embodiment of the invention;
FIG. 2B is a schematic cross-sectional view taken along section line C-C' of FIG. 2A;
FIG. 2C is a schematic cross-sectional view taken along section line D-D' of FIG. 2A;
FIG. 2D is a schematic cross-sectional view taken along section line E-E' of FIG. 2A;
FIG. 3 is a flowchart of a method for manufacturing the touch display device 20 shown in FIG. 2A;
fig. 4A is a schematic top view of a touch display device 30 according to an embodiment of the invention;
FIG. 4B is a schematic cross-sectional view taken along section line F-F' of FIG. 4A;
FIG. 4C is a schematic cross-sectional view taken along section line G-G' of FIG. 4A;
FIG. 4D is a schematic sectional view taken along section line H-H' of FIG. 4A;
FIG. 4E is an enlarged schematic view of a region I of the touch display device 30 of FIG. 4A;
fig. 5 is a flowchart of a manufacturing method of the touch display device 30 of fig. 4A.
Description of the symbols
10. 20, 30: touch control display device
110: substrate
120. 320, and (3) respectively: signal line
121. 321: first signal line
122. 322: second signal line
122T: switching wire
130. 230, 330: connecting pad
131. 231, 331: first conductive layer
132. 232, 332: second conductive layer
140. 340, and (3): protective layer
141. 341: flat part
142. 342: annular hole part
233: third conductive layer
351. 352: transparent conductor
360: polaroid
AA: display area
A-A ', B-B', C-C ', D-D', E-E ', F-F', G-G ', H-H': section line AD: conductive adhesive
BA: peripheral zone
COF: inverted film
D1: depth of field
E1: end wide part
E2: end wide part
H1: first height
H2: second height
H3: height
I: region(s)
I1: insulating layer
I2: organic insulating layer
I3: organic protective layer
LD: pin
O1: opening of the container
Rx: touch sensing electrode
S11, S12, S13, S14, S15: step (ii) of
S21, S22, S23, S24, S25: step (ii) of
TH: through hole
Tx: touch driving electrode
V1: through hole
X0, X1, X2: line width
Y: distance between two adjacent plates
Detailed Description
Fig. 1A is a schematic top view of a touch display device 10 according to an embodiment of the invention. FIG. 1B is a schematic cross-sectional view taken along section line A-A' of FIG. 1A. FIG. 1C is a schematic cross-sectional view taken along section line B-B' of FIG. 1A. In order to make the representation of the drawings simpler, the leads LD and the conductive paste AD in fig. 1B are omitted from fig. 1A.
Referring to fig. 1A to fig. 1C, the touch display device 10 has a display area AA and a peripheral area BA, and includes a substrate 110, a signal line 120, a pad 130, and a protection layer 140. The signal lines 120 are disposed on the substrate 110 and extend from the display area AA to the peripheral area BA. The pad 130 is located in the peripheral area BA and electrically connected to the signal line 120. The passivation 140 is disposed on the signal line 120 and the pad 130, has a through hole TH overlapping the pad 130, and includes a flat portion 141 and a ring hole portion 142, wherein the flat portion 141 surrounds the ring hole portion 142 and has a first height H1, the ring hole portion 142 constitutes a sidewall of the through hole TH and has a second height H2, and the first height H1 is greater than the second height H2.
In view of the above, in the touch display device 10 according to the embodiment of the invention, the depth of the through hole TH is controlled by the small-height annular hole portion 142 in the protection layer 140, which is helpful for bonding the pad 130. Meanwhile, the flat portion 141 with a larger height in the protection layer 140 covers the signal line 120 and surrounds the annular hole portion 142, so that the signal line 120 and the pad 130 are prevented from being scratched in the manufacturing process, and the touch display device 10 has improved scratch resistance.
Hereinafter, embodiments of each element and film layer of the touch display device 10 will be described with reference to the drawings, but the invention is not limited thereto.
Referring to fig. 1A to fig. 1C, the substrate 110 of the touch display device 10 may be a transparent substrate, and the material of the transparent substrate includes a quartz substrate, a glass substrate, a polymer substrate, and the like, but the invention is not limited thereto. Various film layers such as touch electrodes, signal lines, pads, color filter elements, black matrixes, switching elements, and the like may be formed on the substrate 110. In some embodiments, the touch display device 10 may include another substrate (e.g., a pixel array substrate) and a display medium disposed between the another substrate and the substrate 110, but fig. 1A to 1C omit the another substrate and the display medium for clarity of the drawings.
The signal lines 120 of the touch display device 10 are conductive lines for transmitting signals, and the signal lines 120 may include a first signal line 121 and a second signal line 122, and the first signal line 121 and the second signal line 122 may be used for transmitting signals with different attributes. For example, in the present embodiment, the touch display device 10 may include a plurality of touch driving electrodes Tx and a plurality of touch sensing electrodes Rx alternately disposed in the display area AA, and the first signal lines 121 may be connected to the touch driving electrodes Tx, and the second signal lines 122 may be connected to the touch sensing electrodes Rx. When an object (e.g., a stylus) touches the touch display device 10, the capacitance between the touch driving electrode Tx and the touch sensing electrode Rx is changed, and the touch driving electrode Tx and the touch sensing electrode Rx can respectively lead out a signal of the sensed capacitance change to the peripheral area BA through the first signal line 121 and the second signal line 122.
In some embodiments, the touch display device 10 further includes a flip-Chip On Film (COF). The flip-chip film COF has a plurality of leads LD disposed thereon, one end of each of the leads LD is electrically connected to a chip on the flip-chip film COF, for example, and the other end of each of the leads LD may be bonded to the pad 130 in the peripheral area BA by a conductive paste AD or other conductive material. Therefore, the first signal line 121 and the second signal line 122 can transmit the capacitance variation signal to the chip on the flip-chip film COF through the pad 130 to calculate the coordinates of the contact point.
In other embodiments, the touch display device 10 may include a plurality of switch elements located in the display area AA. The switching element is, for example, a thin film transistor having a gate, a semiconductor channel, a source, and a drain, and the first signal line 121 may be connected to the gate of the switching element as a scanning line, while the second signal line 122 may be connected to the source of the switching element as a data line. Similarly, when the touch display device 10 performs a display operation, the chip on the flip-chip film COF can turn on or off the switching element by transmitting a signal through the pad 130 and the first signal line 121, and when the switching element is turned on, a signal transmitted to the source of the switching element through the pad 130 and the second signal line 122 can be transmitted to the drain of the switching element.
The pad 130 of the touch display device 10 may have a single-layer or multi-layer structure. Referring to fig. 1C, in the embodiment, the pad 130 has a double-layer structure and includes a first conductive layer 131 and a second conductive layer 132, wherein the second conductive layer 132 covers the first conductive layer 131, but the invention is not limited thereto. For example, the first conductive layer 131 may be the same as the first signal line 121 or the second signal line 122 in terms of film layer, and include the same material as the first signal line 121 or the second signal line 122, such as metal with good conductivity, e.g., aluminum, molybdenum, titanium, and the like.
In the present embodiment, the first signal lines 121 and the second signal lines 122 respectively extend from the display area AA to the peripheral area BA, and the first signal lines 121 and the second signal lines 122 are respectively electrically connected to the pads 130. In some embodiments, the first signal line 121 and the second signal line 122 may be electrically connected to the first conductive layer 131 of the pad 130, respectively. In some embodiments, the first conductive layer 131 and the first signal line 121 may belong to the same film layer, and the first signal line 121 is physically connected to the first conductive layer 131 of the pad 130, and the second signal line 122 is electrically connected to the pad 130 through another conductive structure or conductive element. In some embodiments, the first conductive layer 131 and the second signal line 122 may belong to the same film layer, and the second signal line 122 is physically connected to the first conductive layer 131 of the pad 130, and the first signal line 121 is electrically connected to the pad 130 through another conductive structure or conductive element. In some embodiments, the first conductive layer 131 may belong to a portion of the first signal line 121 or the second signal line 122, for example, an end portion of the first signal line 121 and the second signal line 122 in the peripheral area BA may be used as the first conductive layer 131.
In some embodiments, the material of the second conductive layer 132 may be a metal oxide to protect the first conductive layer 131 from being attacked by the etchant in the subsequent etching process. For example, the material of the second conductive layer 132 may be indium tin oxide, indium zinc oxide, indium gallium zinc oxide, or other transparent conductive materials, but the invention is not limited thereto.
The flat portion 141 of the protection layer 140 may be located in the display area AA and the peripheral area BA. In the display area AA, the flat portion 141 may cover the signal lines 120, the touch driving electrodes Tx and the touch sensing electrodes Rx, and in the peripheral area BA, the flat portion 141 may surround the annular hole portion 142. The flat portion 141 has sufficient thickness and hardness to protect the above components in the display area AA and the pad 130 in the peripheral area BA from being scratched or damaged in the manufacturing process. For example, when the touch display device 10 is transported by a Roller (Roller), the passivation layer 140 may contact the Roller, and the flat portion 141 may support the Roller so that the Roller does not contact the annular hole portion 142, and thus the Roller cannot contact the pad 130 naturally, thereby protecting the pad 130 from being scratched by the Roller.
The through holes TH of the passivation layer 140 expose the pads 130, so that the pads 130 can be bonded to other devices. However, the depth D1 of the through hole TH should not be too large, so that the conductive particles in the conductive paste AD can electrically connect the pad 130 and the lead LD. Therefore, the ring hole portions 142 having a low height are utilized as sidewalls of the through holes TH, that is, the through holes TH are formed in the ring hole portions 142. In some embodiments, the depth D1 of the through hole TH is substantially equal to the difference between the second height H2 of the ring hole portion 142 and the height H3 of the pad 130, and the depth D1 is preferably less than or equal to 0.8 μm, for example, the depth D1 may be 0.8 μm, 0.6 μm or 0.4 μm, but the invention is not limited thereto.
On the other hand, the annular hole portion 142 may cover the periphery of the pad 130 to protect the periphery of the pad 130 from being corroded by the manufacturing process or the testing environment. For example, in the present embodiment, the second conductive layer 132 completely covers the first conductive layer 131, and the annular hole portion 142 completely covers the periphery of the second conductive layer 132. In some embodiments, the annular ring portion 142 may also completely overlap the periphery of the first conductive layer 131 and the periphery of the second conductive layer 132.
In some embodiments, the protective layer 140 may include an organic insulating layer suitable for Ultra High Aperture (UHA) technology. For example, the material of the protection layer 140 may include a transparent insulating material, such as an organic material, an acrylic material, a siloxane (siloxane) material, a polyimide (polyimide) material, an epoxy (epoxy) material, and the like, but the invention is not limited thereto. The flat portion 141, the annular hole portion 142 and the through hole TH of the protection layer 140 may be formed by performing an exposure and development process and a subsequent curing process on a phase shift mask (phase shift mask), a half tone mask (half tone mask) or a gray tone mask (gray tone mask). That is, after one exposure process, the insulating material can be formed into different exposure levels of the highly exposed portion, the semi-exposed portion and the unexposed portion, and after the development process, the insulating material can be patterned into the passivation layer 140 having the flat portion 141, the annular portion 142 and the through hole TH with different heights. After development, a curing process may be performed to densify the structure of the protective layer 140 and to ensure curing.
Hereinafter, other embodiments of the present invention will be described with reference to fig. 2A to 2D; further, the reference numerals and related contents of the elements of the embodiment of fig. 1A to 1C are used, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the embodiments of fig. 1A to 1C, which will not be repeated in the following description.
Fig. 2A is a schematic top view of a touch display device 20 according to an embodiment of the invention. FIG. 2B is a schematic cross-sectional view taken along section line C-C' of FIG. 2A. FIG. 2C is a schematic cross-sectional view taken along section line D-D' of FIG. 2A. FIG. 2D is a schematic cross-sectional view taken along section line E-E' of FIG. 2A.
Compared with the touch display device 10 shown in fig. 1A to 1C, the touch display device 20 shown in fig. 2A to 2D is different in that: an insulating layer I1 is further included between the passivation layer 140 and the signal line 120, and the pad 230 includes a first conductive layer 231, an insulating layer I1, a second conductive layer 232, and a third conductive layer 233.
Referring to fig. 2A to 2D, in the embodiment, the passivation layer 140 has a through hole TH overlapping the pad 230, and includes a flat portion 141 and an annular hole portion 142. The passivation layer 140 is disposed on the insulating layer I1, and the insulating layer I1 is disposed between the first conductive layer 231 and the second conductive layer 232. The insulating layer I1 has an opening O1, and the second conductive layer 232 can be connected to the first conductive layer 231 through the opening O1. The insulating layer I1 may be formed by a high temperature fabrication process, for example, the insulating layer I1 may be formed by a Chemical Vapor Deposition (CVD) fabrication process above 200 ℃. The material of the insulating layer I1 may include a transparent insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, etc. Therefore, the structure of the touch display device 20 is similar to that formed by the touch device fabrication process performed before the color filter substrate and the pixel array substrate are laminated.
In this embodiment, the first conductive layer 231 and the first signal line 121 may belong to the same layer, and the second conductive layer 232 and the second signal line 122 may belong to the same layer, but the invention is not limited thereto. In some embodiments, the second signal line 122 may be connected to the via wire 122T through the via V1 in the insulating layer I1, the via wire 122T is further electrically connected to the first conductive layer 231 of the pad 230, and the via wire 122T and the first conductive layer 231 are both in the same layer as the first signal line 121, while the second signal line 122 and the first signal line 121 are in different layers. As a result, the transfer wire 122T can electrically connect the second signal line 122 and the first conductive layer 231 of the pad 230. In some embodiments, the first conductive layer 231 and the second conductive layer 232 may include a metal with good conductivity, such as aluminum, molybdenum, titanium, and the like.
The third conductive layer 233 may be made of metal oxide, so as to protect the second conductive layer 232 and the first conductive layer 231 from the etchant in the subsequent etching process. For example, the material of the third conductive layer 233 may be indium tin oxide, indium zinc oxide, indium gallium zinc oxide, or other transparent conductive materials, but the invention is not limited thereto.
Fig. 3 is a flowchart of a manufacturing method of the touch display device 20 shown in fig. 2A. Referring to fig. 2A to 2D and fig. 3, in step S11, a first signal line 121, a first conductive layer 231 and a via wire 122T are formed on the substrate 110, wherein the first signal line 121 is electrically connected to the first conductive layer 231, and the via wire 122T is electrically connected to the first conductive layer 231. In this step, a plurality of touch driving electrodes Tx may also be formed simultaneously. Next, in step S12, an insulating layer I1 having an opening O1 and a via V1 is formed on the substrate 110, the opening O1 overlaps the first conductive layer 231, and the via V1 overlaps the transfer wire 122T. Next, in step S13, a second signal line 122 and a second conductive layer 232 are formed on the substrate 110, wherein the second signal line 122 overlaps the through hole V1, and the second signal line 122 can be electrically connected to the transfer lead 122T through the through hole V1; the second conductive layer 232 overlaps the opening O1, and the second conductive layer 232 can be electrically connected to the first conductive layer 231 through the opening O1. In this step, a plurality of touch sensing electrodes Rx may be formed simultaneously, and the signal lines 120 include first signal lines 121 and second signal lines 122. Next, in step S14, a third conductive layer 233 is formed on the second conductive layer 232, and the pad 230 includes the first conductive layer 231, the insulating layer I1, the second conductive layer 232, and the third conductive layer 233. Next, in step S15, the passivation layer 140 is formed on the signal line 120 and the pad 230 by using, for example, a half tone mask (half tone mask), and the passivation layer 140 may include a flat portion 141 and an annular hole portion 142, a first height H1 of the flat portion 141 is greater than a second height H2 of the annular hole portion 142, and the annular hole portion 142 has a through hole TH overlapping the pad 230. In this way, through the structural design of the flat portions 141, the annular hole portions 142 and the through holes TH with different heights, the contact pads 230 can be prevented from being scratched during the manufacturing process when the contact pads 230 have a structure suitable for bonding, so that the touch display device 20 has improved scratch resistance.
Fig. 4A is a schematic top view of a touch display device 30 according to an embodiment of the invention. FIG. 4B is a schematic cross-sectional view taken along section line F-F' of FIG. 4A. FIG. 4C is a schematic cross-sectional view taken along section line G-G' of FIG. 4A. FIG. 4D is a schematic sectional view taken along section line H-H' of FIG. 4A. Fig. 4E is an enlarged schematic view of the area I of the touch display device 30 in fig. 4A.
Compared with the touch display device 10 shown in fig. 1A to 1C, the touch display device 30 shown in fig. 4A to 4E is different in that: the first signal line 321 and the second signal line 322 of the signal line 320 bridge the pad 330 through transparent wires 351 and 352, respectively; the flat portion 341 of the protection layer 340 includes an organic insulation layer I2 and an organic protection layer I3, and the annular ring portion 342 of the protection layer 340 includes an organic protection layer I3; and the organic insulating layer I2 is sandwiched between the layers forming the first signal line 321 and the second signal line 322.
Referring to fig. 4A to 4E, in the embodiment, the pad 330 may include a double-layer structure in which the first conductive layer 331 and the second conductive layer 332 are stacked, the first conductive layer 331 and the first signal line 321 may belong to the same film layer, and the second conductive layer 332 and the second signal line 322 may belong to the same film layer. In some embodiments, the pad 330 may also have a single-layer structure similar to the first conductive layer 131. In other embodiments, the pad 330 may also have a structure with three or more conductive layers stacked.
In the embodiment, the first signal line 321 is structurally separated from the pad 330, and the second signal line 322 is structurally separated from the pad 330. In addition, the transparent conductive line 351 covers the end portion E1 of the first signal line 321 and the pad 330, and the transparent conductive line 351 bridges the end portion E1 and the pad 330, that is, the first signal line 321 bridges the pad 330 through the transparent conductive line 351. Meanwhile, the transparent conductive line 352 covers the end wide portion E2 and the pad 330 of the second signal line 322, and the transparent conductive line 352 bridges the end wide portion E2 and the pad 330, that is, the second signal line 322 bridges the pad 330 through the transparent conductive line 352. In some embodiments, the end wide portions E1, E2 may each comprise a single layer or a multi-layer structure, such as a stacked structure of multiple conductive layers. Furthermore, the through holes TH only overlap the central portions of the pads 330, and the annular hole portions 342 of the passivation layer 340 overlap the peripheries of the pads 330. The annular hole portion 342 of the passivation layer 340 covers the pad 330 and the peripheries of the transparent wires 351 and 352, so that the pad 330 can be protected from being corroded by the manufacturing process or the testing environment.
Referring to fig. 4E, in some embodiments, the line width X1 of the end wide portion E2 of the second signal line 322 is greater than the line width X0 of the second signal line 322 in the display area AA, so that the contact area between the second signal line 322 and the transparent conductive line 352 can be increased to reduce the contact resistance between the second signal line 322 and the transparent conductive line 352, thereby improving the current stress resistance (current stress) of the second signal line 322. Similarly, the width of the end portion E1 of the first signal line 321 is also greater than the width of the first signal line 321 in the display area AA.
In some embodiments, the line width X1 of the end wide portion E2 of the second signal line 322 may be smaller than the line width X2 of the transparent conductive line 352, so that the transparent conductive line 352 may completely cover the end wide portion E2 of the second signal line 322. In some embodiments, the difference between the line width X2 of the transparent conductive line 352 and the line width X1 of the end wide portion E2 may be greater than or equal to 6 μm, i.e., X2-X1 ≧ 6 μm, such as X2-X1 ═ 6 μm, X2-X1 ═ 8 μm, or X2-X1 ≧ 10 μm, to ensure that the transparent conductive line 352 may completely cover the end wide portion E2 of the second signal line 322. Similarly, the line width E1 of the first signal line 321 may be smaller than the line width of the transparent conductive line 351, and the difference between the line width of the transparent conductive line 351 and the line width E1 may be greater than or equal to 6 μm.
Referring to fig. 4A and fig. 4E, in some embodiments, the touch display device 30 further includes a polarizer 360, and the polarizer 360 covers, for example, the touch driving electrode Tx, the touch sensing electrode Rx, the first signal line 321, the second signal line 322, and a portion of the transparent conductive lines 351 and 352. Based on the film shrinkage after the polarizer 360 is attached precisely and reliably tested, the distance Y between the end wide portion E2 of the second signal line 322 and the edge of the polarizer 360 may be greater than or equal to 500 μm, for example, the distance Y may be 500 μm, 800 μm or 1,200 μm, so as to ensure that the polarizer 360 can completely cover the end wide portion E2, and thus the second signal line 322, especially the end wide portion E2, can be prevented from causing visual interference due to light reflection. Similarly, the end wide portion E1 of the first signal line 321 may be spaced from the edge of the polarizer 360 by a distance greater than or equal to 500 μm.
The passivation layer 340 includes an organic material, for example, in the embodiment, the flat portion 341 of the passivation layer 340 includes an organic insulating layer I2 and an organic passivation layer I3, and the annular ring portion 342 of the passivation layer 340 includes an organic passivation layer I3. The organic insulating layer I2 and the organic passivation layer I3 may be formed by a low temperature fabrication process, for example, the organic insulating layer I2 and the organic passivation layer I3 may be formed by a spin coating (spin coating) fabrication process at 200 ℃. Therefore, the structure of the touch display device 30 is similar to that formed by a touch device manufacturing process performed after the color filter substrate and the pixel array substrate are laminated.
The material of the organic insulating layer I2 may include various dielectric polymers, such as vinyl polymers obtained by polymerizing one or more acyclic vinyl monomers, polymers derived from one or more vinyl phenol monomers (e.g., poly-4-vinyl phenol (PVP)), or copolymers of vinyl phenol or a vinyl phenol derivative with at least one other vinyl monomer. Examples of the above-mentioned acyclic vinyl monomer include ethylene, propylene, butadiene, styrene, vinylphenol, vinyl chloride, vinyl acetate, acrylic acid esters (e.g., methacrylic acid esters, methyl methacrylate, acrylic acid, methacrylic acid, acrylamide), acrylonitrile, and derivatives thereof. The above vinyl monomer may be an acrylic monomer such as methyl methacrylate, acrylic acid, methacrylic acid, acrylamide or a derivative thereof.
The material of the organic protective layer I3 may include a polymer having hydroxyl side chains to react with a carboxylic acid containing a (vinylene or) diene or a derivative thereof. For example, the organic protective layer I3 may include poly (2-hydroxyethyl methacrylate), poly (vinylphenol), poly (vinyl alcohol), and copolymers thereof, such as poly (vinyl alcohol-co-ethylene) or poly (vinylphenol/methyl methacrylate), and the like.
Fig. 5 is a flowchart of a manufacturing method of the touch display device 30 of fig. 4A. In step S21, a first signal line 321 and a first conductive layer 331 are formed on the substrate 110. In this step, a plurality of touch driving electrodes Tx may also be formed simultaneously. Next, in step S22, an organic insulating layer I2 is formed on the substrate 110. Next, in step S23, the second signal line 322 and the second conductive layer 332 are formed on the substrate 110. In this step, a plurality of touch sensing electrodes Rx may be formed simultaneously. Next, in step S24, transparent conductive lines 351 and 352 are formed, wherein the transparent conductive line 351 covers the end width E1 of the first signal line 321 and the second conductive layer 332, and the transparent conductive line 352 covers the end width E2 of the second signal line 322 and the second conductive layer 332. Next, in step S25, an organic passivation layer I3 is formed on the substrate 110, and the organic passivation layer I3 has a through hole TH overlapping the second conductive layer 332. In this way, through the structural design of the flat portions 341 and the annular hole portions 342 with different heights and the through holes TH, the components of the signal lines 320 and the pads 330 can be prevented from being scratched in the manufacturing process while the pads 330 have a structure suitable for bonding, so that the touch display device 30 has improved scratch resistance.
In summary, in the touch display device of the embodiment of the invention, the depth of the through hole is controlled by the annular hole portion with a smaller height in the protection layer, which can facilitate bonding of the pad. Meanwhile, the flat part with larger height in the protective layer covers the signal wire and surrounds the annular hole part, so that the signal wire and the connecting pad can be prevented from being scratched in the manufacturing process, and the touch display device has improved scratch resistance. In addition, the annular hole part is covered on the periphery of the connecting pad, so that the periphery of the connecting pad can be protected from being corroded by a manufacturing process or a testing environment. In addition, the signal line is connected with the transparent conducting wire for bridging the connecting pad by utilizing the widened end wide part, so that the current stress resistance (current stress) performance of the signal line can be improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (15)
1. A touch display device is provided with a display area and a peripheral area and comprises:
a substrate;
the signal line is positioned on the substrate and extends from the display area to the peripheral area;
the connecting pad is positioned on the peripheral area and is electrically connected with the signal line; and
and the protective layer is positioned on the signal line and the connecting pad, is provided with a through hole overlapping the connecting pad, and comprises a flat part and an annular hole part, wherein the flat part surrounds the annular hole part and has a first height, the annular hole part forms the side wall of the through hole and has a second height, and the first height is greater than the second height.
2. The touch display device of claim 1, wherein the difference between the second height and the height of the pad is less than or equal to 0.8 μm.
3. The touch display device of claim 1, wherein the pad comprises a single layer or a multi-layer structure.
4. The touch display device of claim 3, wherein the pad comprises a first conductive layer and a second conductive layer, the second conductive layer completely covers the first conductive layer, and the sidewall of the through hole completely covers a periphery of the second conductive layer.
5. The touch display device according to claim 4, wherein the signal lines comprise a first signal line and a second signal line, the first conductive layer and the first signal line belong to a same film layer, and the second conductive layer and the second signal line belong to a same film layer.
6. The touch display device of claim 5, further comprising a via wire, wherein the via wire is electrically connected to the second signal line and the first conductive layer, and the via wire and the first signal line belong to a same film layer.
7. The touch display device of claim 6, wherein the second signal line is electrically connected to the via wire through a via.
8. The touch display device of claim 1, wherein the protective layer is formed by a phase-shift photomask, half-tone photomask, or grayscale photomask fabrication process.
9. The touch display device of claim 1, wherein the signal line is separated from the pad.
10. The touch display device of claim 9, wherein the signal line bridges the pad through a transparent wire.
11. The touch display device of claim 10, wherein the protective layer comprises an organic material.
12. The touch display device of claim 10, wherein the signal line comprises an end wide portion overlapping the transparent conductive line, and a line width of the end wide portion is smaller than a line width of the transparent conductive line.
13. The touch display device of claim 12, wherein a difference between the line width of the transparent conductive line and the line width of the end wide portion is greater than or equal to 6 μm.
14. The touch display device of claim 12, wherein the width of the end wide portion is greater than the width of the signal line in the display area.
15. The touch display device of claim 12, further comprising a polarizer covering the signal lines and a portion of the transparent conductive lines, wherein a distance between the end wide portion and an edge of the polarizer is greater than or equal to 500 μm.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063110422P | 2020-11-06 | 2020-11-06 | |
US63/110,422 | 2020-11-06 | ||
TW110113155 | 2021-04-13 | ||
TW110113155A TWI761174B (en) | 2020-11-06 | 2021-04-13 | Touch display device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113934320A true CN113934320A (en) | 2022-01-14 |
CN113934320B CN113934320B (en) | 2023-12-08 |
Family
ID=79276188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111098171.9A Active CN113934320B (en) | 2020-11-06 | 2021-09-18 | Touch display device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113934320B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201504872A (en) * | 2013-07-17 | 2015-02-01 | Wintek Corp | Touch panel and touch display device |
CN104375689A (en) * | 2013-08-16 | 2015-02-25 | 胜华科技股份有限公司 | touch control display device |
TW201604729A (en) * | 2014-07-25 | 2016-02-01 | 勝華科技股份有限公司 | Touch panel |
KR20160054361A (en) * | 2014-11-06 | 2016-05-16 | 엘지디스플레이 주식회사 | Touch panel and touch display device wiht the touch panel |
US20180329552A1 (en) * | 2017-05-11 | 2018-11-15 | Lg Display Co., Ltd. | Display device |
CN110045863A (en) * | 2019-03-01 | 2019-07-23 | 上海天马微电子有限公司 | Touch panel and display device |
-
2021
- 2021-09-18 CN CN202111098171.9A patent/CN113934320B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201504872A (en) * | 2013-07-17 | 2015-02-01 | Wintek Corp | Touch panel and touch display device |
CN104375689A (en) * | 2013-08-16 | 2015-02-25 | 胜华科技股份有限公司 | touch control display device |
TW201604729A (en) * | 2014-07-25 | 2016-02-01 | 勝華科技股份有限公司 | Touch panel |
KR20160054361A (en) * | 2014-11-06 | 2016-05-16 | 엘지디스플레이 주식회사 | Touch panel and touch display device wiht the touch panel |
US20180329552A1 (en) * | 2017-05-11 | 2018-11-15 | Lg Display Co., Ltd. | Display device |
CN110045863A (en) * | 2019-03-01 | 2019-07-23 | 上海天马微电子有限公司 | Touch panel and display device |
Also Published As
Publication number | Publication date |
---|---|
CN113934320B (en) | 2023-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107077261B (en) | Touch panel, method for manufacturing touch panel, and touch panel integrated organic light emitting display device | |
TW526551B (en) | Contact portion of semiconductor device and method for manufacturing the same, and thin film transistor array panel for display device including the contact portion and method for manufacturing the same | |
US20180356925A1 (en) | Touch substrate, method for fabricating the same, touch panel | |
US11003036B2 (en) | Pixel array substrate | |
KR101742753B1 (en) | Touch panel, display device and manufacturing method of touch panel | |
KR101421210B1 (en) | Touch sensing device and manufacturing method thereof | |
WO2015169041A1 (en) | Touch control module and manufacturing method therefor, and display device | |
US10331250B2 (en) | Touch panels and touch display devices | |
TWI412972B (en) | Touch panel and peripheral circuit thereof | |
EP3662355B1 (en) | Touch control array substrate and touch control display apparatus | |
CN109960434B (en) | Touch panel, touch display device and method for manufacturing touch panel | |
US10684713B2 (en) | Display device and manufacturing method of the same | |
JP5333934B2 (en) | Substrate and substrate manufacturing method | |
US20220028933A1 (en) | Array substrate and display device | |
US20200348784A1 (en) | Touch display substrate, method of manufacturing the same and display device | |
US11901375B2 (en) | Array substrate and method for manufacturing the same, and display apparatus | |
CN210324155U (en) | Touch panel and touch display device | |
EP3826069A1 (en) | Array substrate, fabrication method therefor, and display device | |
CN109358770B (en) | Touch panel, manufacturing method thereof and touch display device | |
TWI612453B (en) | Touch panel | |
TW201508601A (en) | Touch panel and touch display panel | |
TW201211624A (en) | Flat display touch panel and fabricating method of the same | |
US9547383B1 (en) | Touch panel | |
TWI614885B (en) | Photo sensing unit and photo sensitive array structure having the same | |
US10583586B2 (en) | Imprint mold and manufacturing method of the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |