TW201508601A - Touch panel and touch display panel - Google Patents

Touch panel and touch display panel Download PDF

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TW201508601A
TW201508601A TW102131272A TW102131272A TW201508601A TW 201508601 A TW201508601 A TW 201508601A TW 102131272 A TW102131272 A TW 102131272A TW 102131272 A TW102131272 A TW 102131272A TW 201508601 A TW201508601 A TW 201508601A
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Taiwan
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electrode
layer
sensing
transparent conductor
substrate
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TW102131272A
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Chinese (zh)
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TWI512582B (en
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Pei-Jung Wu
Chien-Yu Chen
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Au Optronics Corp
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Priority to TW102131272A priority Critical patent/TWI512582B/en
Priority to CN201310481796.2A priority patent/CN103677406B/en
Publication of TW201508601A publication Critical patent/TW201508601A/en
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Publication of TWI512582B publication Critical patent/TWI512582B/en

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Abstract

A touch panel is provided and includes a substrate, a touch sensing layer in a sensing region and a transfer structure, a contact pad and a connecting line in a periphery region. The transfer structure is electrically connected to the touch sensing layer. The transfer structure includes a conductive electrode, a plurality of transparent conductive island patterns, an insulating layer and a transparent conductive layer. The transparent conductive island patterns are disposed on the conductive electrode, and a plurality of slits is formed between the transparent conductive island patterns and exposes the conductive electrode. The insulating layer covers the transparent conductive island patterns and has a plurality of openings, and the insulating layer is filled in the slits, and contacts and covers a side and a portion of a top surface of each transparent conductive island pattern. The openings expose the transparent conductive island patterns. The transparent conductive layer is disposed on the insulating layer and electrically connected to the transparent conductive island patterns through the openings. The connecting line connects the transfer structure and the contact pad.

Description

觸控面板與觸控顯示面板 Touch panel and touch display panel

本發明是有關於一種面板,且特別是有關於一種觸控面板與觸控顯示面板。 The present invention relates to a panel, and more particularly to a touch panel and a touch display panel.

觸控面板依照其感測方式的不同而大致上區分為電阻式觸控面板、電容式觸控面板、光學式觸控面板、聲波式觸控面板以及電磁式觸控面板。其中,電容式觸控面板(Capacitive Touch Panel)因智慧型手機銷售量快速增長而受到矚目。 The touch panel is roughly classified into a resistive touch panel, a capacitive touch panel, an optical touch panel, an acoustic wave touch panel, and an electromagnetic touch panel according to different sensing methods. Among them, the capacitive touch panel (Capacitive Touch Panel) has attracted attention due to the rapid growth of sales of smart phones.

一般來說,觸控面板包括感測區與周邊區,感測區包括分別在X、Y方向上延伸的感測電極,用以定位出目標物的觸控位置,周邊區則包括感測線(trace line),用以將電路板的驅動訊號傳送至感測電極,以及感測電極所感測到的感測訊號傳送至後端電路進行觸控位置的運算。其中,感測區與周邊區之交界處,感測線透過交界處的介電層之開口與感測電極連接。 Generally, the touch panel includes a sensing area and a peripheral area, and the sensing area includes sensing electrodes respectively extending in the X and Y directions to locate the touch position of the target, and the surrounding area includes the sensing line ( The trace line) is used to transmit the driving signal of the circuit board to the sensing electrode, and the sensing signal sensed by the sensing electrode is transmitted to the back end circuit for the operation of the touch position. Wherein, at the junction of the sensing region and the peripheral region, the sensing line is connected to the sensing electrode through the opening of the dielectric layer at the interface.

然而,由於感測電極與感測線(trace line)具有黏附性(adhesion)不佳的問題,因此在進行後段撕膜製程(諸如移除可剝膠 或移除製程中暫時使用的保護膜等製程)時,交界處的膜層很容易發生剝離(peeling)。如此一來,導致觸控面板的良率下降。 However, since the sensing electrode and the trace line have problems of poor adhesion, the subsequent tear film process is performed (such as removing the peelable glue). When the process such as a protective film temporarily used in the process is removed, the film at the junction is liable to be peeled. As a result, the yield of the touch panel is lowered.

本發明提供一種觸控面板,具有較佳的良率與良好的觸控功能。 The invention provides a touch panel with better yield and good touch function.

本發明另提供一種觸控顯示面板,具有較佳的良率與良好的觸控功能。 The invention further provides a touch display panel with better yield and good touch function.

本發明的觸控面板包括基板、觸控感測層、轉接結構、接觸墊以及連接線。基板具有感測區與周邊區。觸控感測層位於基板的感測區上。轉接結構位於基板的周邊區上,與觸控感測層電性連接。轉接結構包括第一導體電極、多個第一透明導體島狀圖案、絕緣層以及第二透明導體層。第一導體電極配置於基板上。第一透明導體島狀圖案配置於第一導體電極上,其中第一透明導體島狀圖案之間具有多個縫隙,縫隙暴露出第一導體電極。絕緣層覆蓋於第一透明導體島狀圖案上且具有多個第一開口,其中絕緣層填入縫隙中與第一導體電極接觸且覆蓋各第一透明導體島狀圖案的側邊與部份頂表面,各第一開口暴露出對應之第一透明導體島狀圖案。第二透明導體層配置於絕緣層上且經由第一開口與第一透明導體島狀圖案電性連接。接觸墊配置於基板的周邊區上。連接線配置於基板的周邊區上,且位於接觸墊與轉接結構之間,用以連接轉接結構與接觸墊。 The touch panel of the present invention includes a substrate, a touch sensing layer, a transfer structure, a contact pad, and a connecting line. The substrate has a sensing area and a peripheral area. The touch sensing layer is located on the sensing area of the substrate. The switching structure is located on a peripheral area of the substrate and electrically connected to the touch sensing layer. The transition structure includes a first conductor electrode, a plurality of first transparent conductor island patterns, an insulating layer, and a second transparent conductor layer. The first conductor electrode is disposed on the substrate. The first transparent conductor island pattern is disposed on the first conductor electrode, wherein the first transparent conductor island pattern has a plurality of slits therebetween, and the slit exposes the first conductor electrode. The insulating layer covers the first transparent conductor island pattern and has a plurality of first openings, wherein the insulating layer fills the gap and contacts the first conductor electrode and covers the side and part of each of the first transparent conductor island patterns The first opening of the surface exposes a corresponding first transparent conductor island pattern. The second transparent conductor layer is disposed on the insulating layer and electrically connected to the first transparent conductor island pattern via the first opening. The contact pads are disposed on a peripheral region of the substrate. The connecting line is disposed on the peripheral area of the substrate and is located between the contact pad and the transfer structure for connecting the transfer structure and the contact pad.

在本發明的一實施例中,上述的觸控感測層包括至少一個第一感測電極以及至少一個第二感測電極。第一感測電極在第一方向上延伸,第一感測電極包括多個第一電極部與多個第一橋接部,各第一橋接部連接相鄰二個第一電極部。第二感測電極在第二方向上延伸,第二感測電極包括多個第二電極部與多個第二橋接部,各第二橋接部連接相鄰二個第二電極部。 In an embodiment of the invention, the touch sensing layer includes at least one first sensing electrode and at least one second sensing electrode. The first sensing electrode extends in the first direction, and the first sensing electrode includes a plurality of first electrode portions and a plurality of first bridging portions, and each of the first bridging portions connects the adjacent two first electrode portions. The second sensing electrode extends in the second direction, and the second sensing electrode includes a plurality of second electrode portions and a plurality of second bridge portions, and each of the second bridge portions connects the adjacent two second electrode portions.

在本發明的一實施例中,上述的第一橋接部或第二橋接部的材料與第一透明導體島狀圖案的材料相同。 In an embodiment of the invention, the material of the first bridging portion or the second bridging portion is the same as the material of the first transparent conductor island pattern.

在本發明的一實施例中,上述的第一橋接部或第二橋接部的材料與第一導體電極的材料相同。 In an embodiment of the invention, the material of the first bridging portion or the second bridging portion is the same as the material of the first conductor electrode.

在本發明的一實施例中,上述的第一電極部、第二電極部、第二橋接部以及第二透明導體層的材料相同。 In an embodiment of the invention, the materials of the first electrode portion, the second electrode portion, the second bridge portion, and the second transparent conductor layer are the same.

在本發明的一實施例中,上述的接觸墊、連接線以及第一導體電極的材料相同。 In an embodiment of the invention, the contact pads, the connecting wires, and the first conductor electrodes are made of the same material.

在本發明的一實施例中,上述的轉接結構經由第二透明導體層電性連接第一感測電極與第二感測電極中之其中一者。 In an embodiment of the invention, the switching structure is electrically connected to one of the first sensing electrode and the second sensing electrode via the second transparent conductor layer.

在本發明的一實施例中,更包括保護層,配置於基板上且覆蓋觸控感測層以及轉接結構上。 In an embodiment of the invention, a protective layer is further disposed on the substrate and covers the touch sensing layer and the switching structure.

在本發明的一實施例中,上述的轉接結構位於黑色矩陣預備遮蔽區。 In an embodiment of the invention, the transfer structure is located in a black matrix preparation masking area.

本發明的觸控顯示面板包括上述的觸控面板以及顯示面板。顯示面板與觸控面板疊置,顯示面板包含第一基板、第二基 板及夾設於第一基板與第二基板間的顯示介質層,其中,顯示面板具有多個子畫素,每個子畫素至少具有訊號線、畫素電極、以及連接畫素電極與訊號線的主動元件。 The touch display panel of the present invention includes the touch panel and the display panel described above. The display panel and the touch panel are stacked, and the display panel includes a first substrate and a second base And a display medium layer interposed between the first substrate and the second substrate, wherein the display panel has a plurality of sub-pixels, each sub-pixel has at least a signal line, a pixel electrode, and a pixel electrode and a signal line Active component.

基於上述,本發明之觸控面板與觸控顯示面板中,轉接結構具有多個第一透明導體島狀圖案配置於第一導體電極與絕緣層之間。由於絕緣層會填入第一導體電極之間的縫隙中與第一導體電極接觸且覆蓋各第一透明導體島狀圖案的側邊與部份頂表面,使得第一透明導體島狀圖案與絕緣層之間具有良好的附著。如此一來,能避免絕緣層與第一透明導體島狀圖案之間發生剝離。因此,本發明之觸控面板與採用此觸控面板的觸控顯示面板具有較佳的良率與良好的觸控功能。 In the touch panel and the touch display panel of the present invention, the transfer structure has a plurality of first transparent conductor island patterns disposed between the first conductor electrode and the insulating layer. The first transparent conductor island pattern and insulation are insulated because the insulating layer fills the gap between the first conductor electrodes and contacts the first conductor electrode and covers the side and partial top surfaces of each of the first transparent conductor island patterns. There is good adhesion between the layers. In this way, peeling between the insulating layer and the first transparent conductor island pattern can be avoided. Therefore, the touch panel of the present invention and the touch display panel using the touch panel have better yield and good touch function.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧觸控面板 100‧‧‧ touch panel

110‧‧‧基板 110‧‧‧Substrate

112‧‧‧感測區 112‧‧‧Sensing area

114‧‧‧周邊區 114‧‧‧The surrounding area

114a‧‧‧第一側 114a‧‧‧ first side

114b‧‧‧第二側 114b‧‧‧ second side

120‧‧‧觸控感測層 120‧‧‧Touch sensing layer

122‧‧‧第一感測電極 122‧‧‧First sensing electrode

122a‧‧‧第一電極部 122a‧‧‧First electrode

122b‧‧‧第一橋接部 122b‧‧‧First Bridge

124‧‧‧第二感測電極 124‧‧‧Second sensing electrode

124a‧‧‧第二電極部 124a‧‧‧Second electrode

124b‧‧‧第二橋接部 124b‧‧‧Second Bridge

130a、130b‧‧‧轉接結構 130a, 130b‧‧‧ transit structure

132‧‧‧第一導體電極 132‧‧‧First conductor electrode

134‧‧‧第一透明導體島狀圖案 134‧‧‧First transparent conductor island pattern

134a‧‧‧側邊 134a‧‧‧ side

134b‧‧‧頂表面 134b‧‧‧ top surface

136‧‧‧縫隙 136‧‧‧ gap

138‧‧‧絕緣層 138‧‧‧Insulation

138a‧‧‧第一開口 138a‧‧‧first opening

138b‧‧‧第二開口 138b‧‧‧ second opening

140‧‧‧第二透明導體層 140‧‧‧Second transparent conductor layer

150‧‧‧接觸墊 150‧‧‧Contact pads

160a、160b‧‧‧連接線 160a, 160b‧‧‧ connecting lines

170‧‧‧保護層 170‧‧‧Protective layer

180‧‧‧電路板 180‧‧‧ boards

200‧‧‧顯示面板 200‧‧‧ display panel

210‧‧‧第一基板 210‧‧‧First substrate

220‧‧‧子畫素 220‧‧‧Subpixels

230‧‧‧第二基板 230‧‧‧second substrate

240‧‧‧顯示介質層 240‧‧‧Display media layer

250‧‧‧黏著層 250‧‧‧Adhesive layer

300‧‧‧觸控顯示面板 300‧‧‧Touch display panel

A‧‧‧區域 A‧‧‧ area

D1‧‧‧第一方向 D1‧‧‧ first direction

D2‧‧‧第二方向 D2‧‧‧ second direction

DL‧‧‧資料線 DL‧‧‧ data line

PE‧‧‧畫素電極 PE‧‧‧ pixel electrode

TFT‧‧‧主動元件 TFT‧‧‧ active components

SL‧‧‧掃描線 SL‧‧‧ scan line

圖1A為根據本發明之一實施例的一種觸控面板的上視示意圖。 FIG. 1A is a top view of a touch panel according to an embodiment of the invention.

圖1B為圖1A之區域A的放大示意圖。 FIG. 1B is an enlarged schematic view of a region A of FIG. 1A.

圖1C為沿圖1B之I-I’線的剖面示意圖。 Fig. 1C is a schematic cross-sectional view taken along line I-I' of Fig. 1B.

圖1D為沿圖1B之II-II’線的剖面示意圖。 Fig. 1D is a schematic cross-sectional view taken along line II-II' of Fig. 1B.

圖2為根據本發明之一實施例的一種觸控面板的第一感測電 極的剖面示意圖。 2 is a first sensing power of a touch panel according to an embodiment of the invention. A schematic view of the pole.

圖3為根據本發明之一實施例的一種觸控顯示面板的剖面示意圖。 FIG. 3 is a cross-sectional view of a touch display panel according to an embodiment of the invention.

圖1A為根據本發明之一實施例的一種觸控面板的上視示意圖,圖1B為圖1A之區域A的放大示意圖,以及圖1C與圖1D分別為沿圖1B之I-I’線與II-II’線的剖面示意圖。請同時參照圖1A至圖1D,觸控面板100包括基板110、觸控感測層120、轉接結構130a、130b、接觸墊150以及連接線160a、160b。基板110具有感測區112與周邊區114。在本實施例中,基板110係為透明基板,例如是玻璃基板、塑膠基板、可撓基板或其他基板。周邊區114例如是環繞感測區112,且周邊區114例如是與黑色矩陣預備遮蔽區重疊。也就是說,在觸控面板100中,感測區112例如是可視區,周邊區114例如是被黑色矩陣遮蔽的非可視區。在本實施例中,觸控面板100例如是更包括電路板180,配置於周邊區114中。其中,電路板180上的各個導電墊(未標示)會對應連接各個接觸墊150。再者,觸控面板100例如是更包括保護層170,配置於基板110上且覆蓋觸控感測層120以及轉接結構130a、130b上。其中,保護層170可為單層或多層結構,其材料可選自於下述絕緣層138所述的材料。 1A is a top view of a touch panel according to an embodiment of the invention, FIG. 1B is an enlarged schematic view of a region A of FIG. 1A, and FIGS. 1C and 1D are respectively taken along line I-I' of FIG. 1B. Schematic diagram of the II-II' line. Referring to FIG. 1A to FIG. 1D , the touch panel 100 includes a substrate 110 , a touch sensing layer 120 , transfer structures 130 a , 130 b , contact pads 150 , and connecting lines 160 a , 160 b . The substrate 110 has a sensing region 112 and a peripheral region 114. In the present embodiment, the substrate 110 is a transparent substrate, such as a glass substrate, a plastic substrate, a flexible substrate, or other substrate. The peripheral zone 114 is, for example, a surrounding sensing zone 112, and the peripheral zone 114 overlaps, for example, with a black matrix preparation masking zone. That is, in the touch panel 100, the sensing area 112 is, for example, a visible area, and the peripheral area 114 is, for example, a non-visible area that is obscured by a black matrix. In the embodiment, the touch panel 100 further includes a circuit board 180 , for example, disposed in the peripheral area 114 . The conductive pads (not labeled) on the circuit board 180 are connected to the respective contact pads 150. In addition, the touch panel 100 further includes a protective layer 170 disposed on the substrate 110 and covering the touch sensing layer 120 and the transfer structures 130a and 130b. The protective layer 170 may be a single layer or a multilayer structure, and the material thereof may be selected from the materials described in the insulating layer 138 described below.

觸控感測層120位於基板110的感測區112上。在本實 施例中,觸控面板100例如是電容式觸控面板。觸控感測層120包括至少一個第一感測電極122以及至少一個第二感測電極124,第一感測電極122與第二感測電極124絕緣。第一感測電極122例如是在第一方向D1上延伸,第一感測電極122包括多個第一電極部122a與多個第一橋接部122b,各第一橋接部122b連接相鄰二個第一電極部122a。第二感測電極124例如是在第二方向D2上延伸,第二感測電極124包括多個第二電極部124a與多個第二橋接部124b,各第二橋接部124b連接相鄰二個第二電極部124a。在本實施例中,第一方向D1例如是x方向,第二方向D2例如是y方向,但不限於此。在本實施例中,第一電極部122a、第二電極部124a以及第二橋接部124b的材料,較佳地,實質上相同。也就是說,第一電極部122a、第二電極部124a以及第二橋接部124b可以是藉由圖案化同一膜層所形成的,因此第一電極部122a與第二電極部124a實質上位於同一平面,也就是所謂的單層結構。然而,在另一實施例中,第一電極部122a與第二電極部124a也可以分別由不同膜層所形成,因而兩者在垂直方向上具有上下關係,也就是所謂的雙層結構。因此,觸控感測層120中的感測元件實際上可以具有多種構形,不以本實施例中所示為限。再者,在圖1A中所繪示的第一感測電極122與第二感測電極124的數目僅是作為例示,本發明不以此為限。 The touch sensing layer 120 is located on the sensing region 112 of the substrate 110. In this reality In the embodiment, the touch panel 100 is, for example, a capacitive touch panel. The touch sensing layer 120 includes at least one first sensing electrode 122 and at least one second sensing electrode 124. The first sensing electrode 122 is insulated from the second sensing electrode 124. The first sensing electrode 122 extends in a first direction D1, and the first sensing electrode 122 includes a plurality of first electrode portions 122a and a plurality of first bridging portions 122b, and each of the first bridging portions 122b is connected to two adjacent ones. The first electrode portion 122a. The second sensing electrode 124 extends in the second direction D2, for example, the second sensing electrode 124 includes a plurality of second electrode portions 124a and a plurality of second bridging portions 124b, and each of the second bridging portions 124b is connected to the adjacent two The second electrode portion 124a. In the present embodiment, the first direction D1 is, for example, the x direction, and the second direction D2 is, for example, the y direction, but is not limited thereto. In the present embodiment, the materials of the first electrode portion 122a, the second electrode portion 124a, and the second bridge portion 124b are preferably substantially the same. That is, the first electrode portion 122a, the second electrode portion 124a, and the second bridge portion 124b may be formed by patterning the same film layer, and thus the first electrode portion 122a and the second electrode portion 124a are substantially identical Plane, also known as a single layer structure. However, in another embodiment, the first electrode portion 122a and the second electrode portion 124a may also be formed of different film layers, respectively, so that the two have a top-bottom relationship in the vertical direction, that is, a so-called two-layer structure. Therefore, the sensing elements in the touch sensing layer 120 may actually have various configurations, which are not limited to those shown in the embodiment. Moreover, the number of the first sensing electrodes 122 and the second sensing electrodes 124 illustrated in FIG. 1A is only an example, and the invention is not limited thereto.

轉接結構130a、130b位於基板110的周邊區114上,與觸控感測層120電性連接。轉接結構130a、130b為堆疊結構,包 括第一導體電極132、多個第一透明導體島狀圖案134、絕緣層138以及第二透明導體層140。第一導體電極132配置於基板110上。第一透明導體島狀圖案134配置於第一導體電極132上,其中第一透明導體島狀圖案134之間具有多個縫隙136,縫隙136暴露出第一導體電極132。第一透明導體島狀圖案134例如是陣列配置於第一導體電極132上。其中,第一透明導體島狀圖案134可為單層或多層結構,且其材料例如是銦錫氧化物、銦鋅氧化物、氧化鋅、含有奈米金屬或合金顆粒的導電材料、奈米碳管、厚度約小於10奈米之金屬或合金、或其它合適的材料,而第一透明導體島狀圖案134之投影形狀是以正方形為範例,但不限於此。於其它實施例中,第一透明導體島狀圖案134之投影形狀包含三角形、菱形、長方形、四邊形、圓形、楕圓形、曲線形、梳狀、鋸齒狀、十字形、L型、U型、S型、骨頭形、或其它多邊形、或上述至少二種形狀之組合。絕緣層138覆蓋於第一透明導體島狀圖案134上且具有多個第一開口138a。其中,絕緣層138填入縫隙136中與第一導體電極132接觸且覆蓋各第一透明導體島狀圖案134的側邊134a與部份頂表面134b,各第一開口138a暴露出對應之第一透明導體島狀圖案134。換言之,第一透明導體島狀圖案134實質上位於第一開口138a下方。絕緣層138為單層或多層結構,且其材料包含無機材料(例如:氮化矽、氧化矽、氮氧化矽、或其它合適的材料)、有機材料(例如:光阻、聚亞醯胺、聚酯、或其它合適的材料)、或其它合適的材料。另外,第一開口138a的投影形 狀可選自於第一透明導體島狀圖案134所述之投影形狀。第二透明導體層140配置於絕緣層138上且經由第一開口138a與第一透明導體島狀圖案134電性連接。亦即,第二透明導體層140例如是填入第一開口138a以與第一透明導體島狀圖案134接觸。再者,第二透明導體層140亦會覆蓋絕緣層138。 The switching structures 130a and 130b are located on the peripheral region 114 of the substrate 110 and electrically connected to the touch sensing layer 120. The transfer structures 130a, 130b are stacked structures, and the package The first conductor electrode 132, the plurality of first transparent conductor island patterns 134, the insulating layer 138, and the second transparent conductor layer 140 are included. The first conductor electrode 132 is disposed on the substrate 110. The first transparent conductor island pattern 134 is disposed on the first conductor electrode 132, wherein the first transparent conductor island pattern 134 has a plurality of slits 136 therebetween, and the slit 136 exposes the first conductor electrode 132. The first transparent conductor island patterns 134 are, for example, arranged in an array on the first conductor electrode 132. The first transparent conductor island pattern 134 may be a single layer or a multilayer structure, and the material thereof is, for example, indium tin oxide, indium zinc oxide, zinc oxide, conductive material containing nano metal or alloy particles, and nano carbon. The tube, the metal or alloy having a thickness of less than about 10 nm, or other suitable material, and the projected shape of the first transparent conductor island pattern 134 is exemplified by a square, but is not limited thereto. In other embodiments, the projected shape of the first transparent conductor island pattern 134 includes a triangle, a diamond, a rectangle, a quadrangle, a circle, a circle, a curve, a comb, a zigzag, a cross, an L shape, and a U shape. , S-shape, bone shape, or other polygon, or a combination of at least two of the above. The insulating layer 138 covers the first transparent conductor island pattern 134 and has a plurality of first openings 138a. The insulating layer 138 is filled in the gap 136 to be in contact with the first conductor electrode 132 and covers the side 134a and the partial top surface 134b of each of the first transparent conductor island patterns 134, and each of the first openings 138a is exposed to the first one. Transparent conductor island pattern 134. In other words, the first transparent conductor island pattern 134 is substantially below the first opening 138a. The insulating layer 138 is a single layer or a multilayer structure, and the material thereof comprises an inorganic material (for example, tantalum nitride, hafnium oxide, tantalum oxynitride, or other suitable materials), an organic material (for example, photoresist, polyamine, Polyester, or other suitable material), or other suitable material. In addition, the projection shape of the first opening 138a The shape may be selected from the projected shape described in the first transparent conductor island pattern 134. The second transparent conductor layer 140 is disposed on the insulating layer 138 and electrically connected to the first transparent conductor island pattern 134 via the first opening 138a. That is, the second transparent conductor layer 140 is filled, for example, into the first opening 138a to be in contact with the first transparent conductor island pattern 134. Furthermore, the second transparent conductor layer 140 also covers the insulating layer 138.

在本實施例中,第二透明導體層140與第二電極部124a及第二橋接部124b可為單層或多層結構,第二透明導體層140與第二電極部124a及第二橋接部124b的材料例如是實質上相同,此材料例如是銦錫氧化物、銦鋅氧化物、氧化鋅、含有奈米金屬或合金顆粒的導電材料、奈米碳管、厚度約小於10奈米之金屬或合金或其它合適的材料,以及第一橋接部122b的材料與第一導體電極132可為單層或多層結構,第一橋接部122b的材料與第一導體電極132的材料例如是實質上相同,此材料例如是金屬或合金。在另一實施例中,如圖2所示,第一橋接部122b的材料也可以與第一透明導體島狀圖案134的材料例如是實質上相同。換言之,第一橋接部122b與第二橋接部124b的材料不同,且第一橋接部122b與第二橋接部124b中一者的材料可以與第一導體電極132或第一透明導體島狀圖案134的材料例如是實質上相同。絕緣層138例如是更配置於第一橋接部122b與第二橋接部124b之間,使得第一感測電極122與第二感測電極124彼此絕緣。其中,絕緣層138的第二開口138b暴露出第一橋接部122b一部份,使得第一電極部122a經由第二開口138b與第一橋接部122b電性連接。 第二開口138b的投影形狀可選自於第一透明導體島狀圖案134所述之投影形狀。 In this embodiment, the second transparent conductor layer 140 and the second electrode portion 124a and the second bridge portion 124b may be a single layer or a multilayer structure, and the second transparent conductor layer 140 and the second electrode portion 124a and the second bridge portion 124b The material is, for example, substantially the same, such as indium tin oxide, indium zinc oxide, zinc oxide, conductive material containing nano metal or alloy particles, carbon nanotubes, metal having a thickness of less than about 10 nm or The alloy or other suitable material, and the material of the first bridging portion 122b and the first conductor electrode 132 may be a single layer or a multi-layer structure, and the material of the first bridging portion 122b is substantially the same as the material of the first conductor electrode 132, for example. This material is for example a metal or an alloy. In another embodiment, as shown in FIG. 2, the material of the first bridging portion 122b may also be substantially the same as the material of the first transparent conductor island pattern 134, for example. In other words, the material of the first bridging portion 122b and the second bridging portion 124b are different, and the material of one of the first bridging portion 122b and the second bridging portion 124b may be the first conductor electrode 132 or the first transparent conductor island pattern 134. The materials are, for example, substantially identical. The insulating layer 138 is disposed between the first bridge portion 122b and the second bridge portion 124b, for example, such that the first sensing electrode 122 and the second sensing electrode 124 are insulated from each other. The second opening 138b of the insulating layer 138 exposes a portion of the first bridging portion 122b such that the first electrode portion 122a is electrically connected to the first bridging portion 122b via the second opening 138b. The projected shape of the second opening 138b may be selected from the projected shape described by the first transparent conductor island pattern 134.

在本實施例中,轉接結構130a、130b例如是經由第二透明導體層140電性連接第一感測電極122與第二感測電極124中之其中一者。詳細地說,在本實施例中,轉接結構130a、130b例如是位於周邊區114的相鄰兩側114a、114b,位於第一側114a的轉接結構(或稱為第一轉接結構)130a與在第一方向D1上延伸的第一感測電極122電性連接,位於第二側114b的轉接結構(或稱為第二轉接結構)130b與在第二方向D2上延伸的第二感測電極124電性連接。其中,位於第一側114a的轉接結構130a的第二透明導體層140例如是與第一感測電極122的第一電極部122a實質上為一體成形,因此轉接結構130a與第一感測電極122電性連接。位於第二側114b的轉接結構130b的第二透明導體層140例如是與第二感測電極124的第二電極部124a實質上為一體成形,因此轉接結構130b與第二感測電極124電性連接。再者,雖然在本實施例中是以第二透明導體層140與第一感測電極122與第二感測電極124中之其中一者共平面為例,也就是兩者由同一材料層圖案化而形成,但本發明不限於此。在其他實施例中,第二透明導體層140與第一感測電極122與第二感測電極124中之其中一者也可以是具有上下層關係,諸如第二透明導體層140位於第一感測電極122與第二感測電極124中之其中一者之上以覆蓋之,或者是第二透明導體層140位於第一感測電極122與第二感測電極124 中之其中一者之下而兩者具有堆疊關係。 In the present embodiment, the transition structures 130a, 130b are electrically connected to one of the first sensing electrode 122 and the second sensing electrode 124 via the second transparent conductor layer 140, for example. In detail, in the present embodiment, the transfer structures 130a, 130b are, for example, adjacent sides 114a, 114b of the peripheral region 114, and a transfer structure (or referred to as a first transfer structure) on the first side 114a. The 130a is electrically connected to the first sensing electrode 122 extending in the first direction D1, the switching structure (or referred to as the second switching structure) 130b at the second side 114b, and the first extending in the second direction D2 The two sensing electrodes 124 are electrically connected. The second transparent conductor layer 140 of the adapter structure 130a of the first side 114a is, for example, substantially integrally formed with the first electrode portion 122a of the first sensing electrode 122, so the adapter structure 130a and the first sensing The electrode 122 is electrically connected. The second transparent conductor layer 140 of the via structure 130b on the second side 114b is, for example, substantially integrally formed with the second electrode portion 124a of the second sensing electrode 124, and thus the switching structure 130b and the second sensing electrode 124 Electrical connection. Furthermore, in the embodiment, the second transparent conductor layer 140 is coplanar with one of the first sensing electrode 122 and the second sensing electrode 124, that is, the two are patterned by the same material layer. Formed, but the invention is not limited thereto. In other embodiments, the second transparent conductor layer 140 and one of the first sensing electrode 122 and the second sensing electrode 124 may also have an upper and lower layer relationship, such as the second transparent conductor layer 140 is located in the first sense. Above one of the measuring electrode 122 and the second sensing electrode 124 to cover, or the second transparent conducting layer 140 is located at the first sensing electrode 122 and the second sensing electrode 124 Under one of them and the two have a stacked relationship.

接觸墊150配置於基板110的周邊區114上。連接線160a、160b配置於基板110的周邊區114上,且位於接觸墊150與轉接結構130a、130b之間,用以連接轉接結構130a、130b與接觸墊150。詳細地說,接觸墊150例如是與諸如軟性印刷電路板(FPC)等電路板180電性連接,使得驅動訊號經由接觸墊150、連接線160a、160b以及轉接結構130a、130b傳送至觸控感測層120,以及觸控感測層120將所感測到的感測訊號(即電容值變化)經由轉接結構130a、130b、連接線160a、160b以及接觸墊150將感測訊號傳送至電路板180的電路或後端電路以進行觸控位置的運算。在本實施例中,接觸墊150與電路板180例如是位在周邊區114的第二側114b,因此一部分的連接線160a(或稱為第一連接線)由第一側114a延伸至第二側114b,以連接轉接結構130a與接觸墊150,以及一部分的連接線160b(或稱為第二連接線)位於周邊區114的第二側114b,以連接位於轉接結構130b與接觸墊150,但不以此為限。於其它實施例中,接觸墊150可位於其它位置,例如:第一側114a、連接線160a可從第一側114a延伸至第二側114b或連接線160b位於第一側114a或者其它合適的位置。 The contact pads 150 are disposed on the peripheral region 114 of the substrate 110. The connection lines 160a, 160b are disposed on the peripheral region 114 of the substrate 110 and between the contact pads 150 and the transition structures 130a, 130b for connecting the via structures 130a, 130b and the contact pads 150. In detail, the contact pad 150 is electrically connected to a circuit board 180 such as a flexible printed circuit board (FPC), such that the driving signal is transmitted to the touch via the contact pad 150, the connection lines 160a, 160b, and the transfer structures 130a, 130b. The sensing layer 120 and the touch sensing layer 120 transmit the sensed signals (ie, capacitance values) to the circuit via the transfer structures 130a, 130b, the connection lines 160a, 160b, and the contact pads 150. The circuit or back end circuit of the board 180 performs the operation of the touch position. In the present embodiment, the contact pad 150 and the circuit board 180 are, for example, located on the second side 114b of the peripheral region 114, such that a portion of the connecting line 160a (or referred to as the first connecting line) extends from the first side 114a to the second side. The side 114b is connected to the transfer structure 130a and the contact pad 150, and a part of the connection line 160b (or referred to as a second connection line) is located at the second side 114b of the peripheral region 114 to connect the transfer structure 130b and the contact pad 150. , but not limited to this. In other embodiments, the contact pads 150 can be located at other locations, such as the first side 114a, the connecting line 160a can extend from the first side 114a to the second side 114b or the connecting line 160b can be located at the first side 114a or other suitable location. .

接下來將以觸控面板100的一種製造流程為例來進行說明,以清楚說明各構件的膜層關係,但必須注意的是,所說明的製造流程僅是製作觸控面板100的多種方法中的一種例示方法,因此本發明不以此為限。請同時參照圖1A至圖1D,首先,於基 板110上形成第一導體材料層M1(未繪示),第一導體材料層M1例如是包括位於周邊區114的第一導體電極132以及位於感測區112的多個第一橋接部122b。在另一實施例中,第一導體材料層M1也可以是包括位於周邊區114的第一導體電極132以及位於感測區112的多個第二橋接部124b。換言之,第一橋接部122b或第二橋接部124b的材料可以與第一導體電極134的材料實質上相同,此材料例如是金屬或合金。再者,第一導體材料層M1可以更包括接觸墊150與連接線160a、160b。也就是說,接觸墊150、連接線160a、160b以及第一導體電極132的材料例如實質上相同。其中,接觸墊150與連接線160a、160b可以是一體成形。 Next, a manufacturing process of the touch panel 100 will be taken as an example to clearly illustrate the film layer relationship of each component, but it must be noted that the illustrated manufacturing process is only a plurality of methods for manufacturing the touch panel 100. An exemplary method, and thus the invention is not limited thereto. Please refer to FIG. 1A to FIG. 1D at the same time. First, Yu Ji A first conductor material layer M1 (not shown) is formed on the board 110. The first conductor material layer M1 includes, for example, a first conductor electrode 132 located in the peripheral region 114 and a plurality of first bridge portions 122b located in the sensing region 112. In another embodiment, the first conductive material layer M1 may also include a first conductor electrode 132 located in the peripheral region 114 and a plurality of second bridge portions 124b located in the sensing region 112. In other words, the material of the first bridging portion 122b or the second bridging portion 124b may be substantially the same as the material of the first conductor electrode 134, such as a metal or an alloy. Furthermore, the first conductor material layer M1 may further include a contact pad 150 and connection lines 160a, 160b. That is, the materials of the contact pads 150, the connection lines 160a, 160b, and the first conductor electrode 132 are, for example, substantially the same. Wherein, the contact pad 150 and the connecting wires 160a, 160b may be integrally formed.

接著,於第一導體材料層M1上形成第一透明導體材料層TC1(未繪示),第一透明導體材料層TC1例如是包括多個第一透明導體島狀圖案134,第一透明導體島狀圖案134配置於第一導體電極132上,其中第一透明導體島狀圖案134之間具有多個縫隙136,縫隙136暴露出第一導體電極132。在一實施例中,第一透明導體材料層TC1例如是更包括多個第一橋接部122b或多個第二橋接部124b。也就是說,由於第一橋接部122b與第二橋接部124b例如是彼此交叉(crossover)配置,因此第一橋接部122b與第二橋接部124b中一者可以由第一導體材料層M1形成,以及另一者可以由第一透明導體材料層TC1形成。因此,第一橋接部122b或第二橋接部124b的材料與第一透明導體島狀圖案134的材料可以實質上相同。在本實施例中,第一橋接部122b與第一導體電極132 例如是一起製作,以及第二橋接部124b與第一透明導體島狀圖案134例如是一起製作。 Next, a first transparent conductor material layer TC1 (not shown) is formed on the first conductive material layer M1, and the first transparent conductor material layer TC1 includes, for example, a plurality of first transparent conductor island patterns 134, a first transparent conductor island. The pattern 134 is disposed on the first conductor electrode 132, wherein the first transparent conductor island pattern 134 has a plurality of slits 136 therebetween, and the slit 136 exposes the first conductor electrode 132. In an embodiment, the first transparent conductor material layer TC1 includes, for example, a plurality of first bridging portions 122b or a plurality of second bridging portions 124b. That is, since the first bridging portion 122b and the second bridging portion 124b are, for example, crossover configurations, one of the first bridging portion 122b and the second bridging portion 124b may be formed by the first conductor material layer M1, And the other may be formed of the first transparent conductor material layer TC1. Therefore, the material of the first bridging portion 122b or the second bridging portion 124b may be substantially the same as the material of the first transparent conductor island pattern 134. In the embodiment, the first bridge portion 122b and the first conductor electrode 132 For example, they are fabricated together, and the second bridge portion 124b is formed together with the first transparent conductor island pattern 134, for example.

然後,於第一透明導體材料層TC1上形成絕緣層138,覆蓋於第一透明導體島狀圖案134上且具有多個第一開口138a,其中絕緣層138填入縫隙136中與第一導體電極132接觸且覆蓋各第一透明導體島狀圖案134的側邊134a與部份頂表面134b,各第一開口138a暴露出對應之第一透明導體島狀圖案134。在本實施例中,絕緣層138更包括多個第二開口138b,暴露出由第一導體材料層M1形成的第一橋接部122b一部份或第二橋接部124b一部份。在本實施例中,於絕緣層138中形成第一開口138a與第二開口138b的方法例如是乾式蝕刻製程。在一實施例中,形成第一開口138a與第二開口138b的蝕刻製程有可能會過度蝕刻絕緣層138,而蝕刻至經由第一開口138a暴露出來的下方膜層。此時,由於第一透明導體島狀圖案134位於第一開口138a下方且位於第一導體電極132上,因此能阻擋電漿等物質直接轟擊第一導體電極132,以避免第一導體電極132受到破壞。其中,第一開口138a、第二開口138b與第一透明導體島狀圖案134的投影形狀,可選自上述實施例中所述的投影形狀。 Then, an insulating layer 138 is formed on the first transparent conductor material layer TC1, covering the first transparent conductor island pattern 134 and having a plurality of first openings 138a, wherein the insulating layer 138 is filled in the gap 136 and the first conductor electrode The first opening 138a contacts the corresponding first transparent conductor island pattern 134. In this embodiment, the insulating layer 138 further includes a plurality of second openings 138b exposing a portion of the first bridging portion 122b or a portion of the second bridging portion 124b formed by the first conductive material layer M1. In the present embodiment, the method of forming the first opening 138a and the second opening 138b in the insulating layer 138 is, for example, a dry etching process. In an embodiment, the etching process for forming the first opening 138a and the second opening 138b may over-etch the insulating layer 138 and etch to the underlying film layer exposed through the first opening 138a. At this time, since the first transparent conductor island pattern 134 is located under the first opening 138a and located on the first conductor electrode 132, it can block the plasma and the like from directly bombarding the first conductor electrode 132 to prevent the first conductor electrode 132 from being subjected to damage. The projection shape of the first opening 138a, the second opening 138b and the first transparent conductor island pattern 134 may be selected from the projection shapes described in the above embodiments.

而後,於絕緣層138上形成第二透明導體材料層TC2(未繪示),第二透明導體材料層TC2包括位於周邊區114的第二透明導體層140,以及位於感測區112的多個第一電極部122a、多個第二電極部124a以及連接第二電極部124a的多個第二橋接部 124b。也就是說,在本實施例中,第二電極部124a與第二橋接部124b例如是一體成型以形成第二感測電極124。當然,在另一實施例中,也可以是第一電極部122a與第一橋接部122b一體成型以形成第一感測電極122。在本實施例中,第二透明導體層140經由第一開口138a與第一透明導體島狀圖案134電性連接,第一導體電極132、多個第一透明導體島狀圖案134、絕緣層138以及第二透明導體層140形成轉接結構130a、130b。第一電極部122a經由第二開口138b與第一橋接部122b電性連接,其中多個第一電極部122a與多個第一橋接部122b形成第一感測電極122,多個第二電極部124a與多個第二橋接部124b形成第二感測電極124。在本實施例中,轉接結構130a的第二透明導體層140例如是實質上與第一電極部122a一體成形,以電性連接轉接結構130a與第一感測電極122。轉接結構130b的第二透明導體層140例如是實質上與第二電極部124a一體成形,以電性連接轉接結構130b與第二感測電極124。 Then, a second transparent conductor material layer TC2 (not shown) is formed on the insulating layer 138. The second transparent conductor material layer TC2 includes a second transparent conductor layer 140 located in the peripheral region 114, and a plurality of regions located in the sensing region 112. a first electrode portion 122a, a plurality of second electrode portions 124a, and a plurality of second bridge portions connecting the second electrode portions 124a 124b. That is, in the present embodiment, the second electrode portion 124a and the second bridge portion 124b are integrally molded, for example, to form the second sensing electrode 124. Of course, in another embodiment, the first electrode portion 122a and the first bridge portion 122b may be integrally formed to form the first sensing electrode 122. In this embodiment, the second transparent conductor layer 140 is electrically connected to the first transparent conductor island pattern 134 via the first opening 138a, the first conductor electrode 132, the plurality of first transparent conductor island patterns 134, and the insulating layer 138. And the second transparent conductor layer 140 forms the transition structures 130a, 130b. The first electrode portion 122a is electrically connected to the first bridge portion 122b via the second opening 138b, wherein the plurality of first electrode portions 122a and the plurality of first bridge portions 122b form the first sensing electrode 122, and the plurality of second electrode portions The second sensing electrode 124 is formed by 124a and the plurality of second bridges 124b. In the present embodiment, the second transparent conductor layer 140 of the adapter structure 130a is substantially integrally formed with the first electrode portion 122a to electrically connect the adapter structure 130a and the first sensing electrode 122. The second transparent conductor layer 140 of the via structure 130b is substantially integrally formed with the second electrode portion 124a to electrically connect the via structure 130b and the second sensing electrode 124.

然後,於第二透明導體材料層TC2(未繪示)上形成保護層170,以覆蓋第一感測電極122、第二感測電極124以及轉接結構130a、130b。 Then, a protective layer 170 is formed on the second transparent conductor material layer TC2 (not shown) to cover the first sensing electrode 122, the second sensing electrode 124, and the transit structures 130a, 130b.

上述的觸控面板100可以進一步與顯示面板組合成觸控顯示面板。圖3為根據本發明之一實施例的一種觸控顯示面板的剖面示意圖。請參照圖3,觸控顯示面板300包括觸控面板100與顯示面板200,觸控面板100的結構如前一實施例中所述,於此 不贅述。顯示面板200與觸控面板100疊置,顯示面板200包含第一基板210、第二基板230及夾設於第一基板210與第二基板230間的顯示介質層240。顯示面板200具有多個子畫素220,每個子畫素220至少具有訊號線(未標示)、畫素電極PE以及連接畫素電極PE與訊號線的主動元件TFT。其中,顯示介質層240的材料包含液晶材料、電泳材料、電潤濕材料、可被電磁波激發材料或其它合適的材料;主動元件TFT的類型包含底閘型電晶體、頂閘型電晶體、或其它合適的類型;上述電晶體中的半導體層可為單層或多層結構,且其材料包含非晶矽、多晶矽、單晶矽、微晶矽、奈米晶矽、氧化物半導體材料、其它合適的材料。在本實施例中,訊號線包括掃描線SL與資料線DL。在本實施例中,觸控顯示面板300例如是更包括黏著層250或其它合適的方式,配置於顯示面板200與觸控面板100之間,以疊置顯示面板200與觸控面板100。此外,於本實施例中,觸控面板100是設置於顯示面板200之上,則觸控面板100中的保護層170係最接近顯示面板200之第二基板230之外表面。於其它實施例中,觸控面板100是設置於顯示面板200之下,則觸控面板100中的保護層170係最接近顯示面板200之第一基板210之外表面。 The touch panel 100 described above can be further combined with the display panel to form a touch display panel. FIG. 3 is a cross-sectional view of a touch display panel according to an embodiment of the invention. Referring to FIG. 3 , the touch display panel 300 includes a touch panel 100 and a display panel 200 . The structure of the touch panel 100 is as described in the previous embodiment. Do not repeat them. The display panel 200 is stacked on the touch panel 100. The display panel 200 includes a first substrate 210, a second substrate 230, and a display medium layer 240 interposed between the first substrate 210 and the second substrate 230. The display panel 200 has a plurality of sub-pixels 220 each having at least a signal line (not labeled), a pixel electrode PE, and an active device TFT connecting the pixel electrode PE and the signal line. Wherein, the material of the display medium layer 240 comprises a liquid crystal material, an electrophoretic material, an electrowetting material, an electromagnetic wave excitation material or other suitable material; the active device TFT type includes a bottom gate type transistor, a top gate type transistor, or Other suitable types; the semiconductor layer in the above transistor may be a single layer or a multilayer structure, and the material thereof comprises amorphous germanium, polycrystalline germanium, single crystal germanium, microcrystalline germanium, nanocrystalline germanium, oxide semiconductor material, other suitable s material. In this embodiment, the signal line includes the scan line SL and the data line DL. In this embodiment, the touch display panel 300 is disposed between the display panel 200 and the touch panel 100 to overlap the display panel 200 and the touch panel 100 , for example. In addition, in the embodiment, the touch panel 100 is disposed on the display panel 200 , and the protective layer 170 in the touch panel 100 is closest to the outer surface of the second substrate 230 of the display panel 200 . In other embodiments, the touch panel 100 is disposed under the display panel 200 , and the protective layer 170 in the touch panel 100 is closest to the outer surface of the first substrate 210 of the display panel 200 .

在上述的實施例中,轉接結構130a、130b包括多個第一透明導體島狀圖案134配置於第一導體電極132與絕緣層138之間,且位於絕緣層138的第一開口138a下方。詳細地說,絕緣層138會填入第一透明導體島狀圖案134之間的縫隙136中與第一導 體電極132接觸,且覆蓋各第一透明導體島狀圖案134的側邊134a與部份頂表面134b。若,透明導體層是以一大片形式覆蓋於第一導體電極132上且與本實施例的轉接結構130a、130b是將多個第一透明導體島狀圖案134配置於第一導體電極132上來相互比較。本發明之實施例可減少第一透明導體島狀圖案134在第一導體電極132上的面積,但大幅增加絕緣層138與第一透明導體島狀圖案134之間的接觸面積,以及使絕緣層138與第一導體電極132直接接觸,因而絕緣層138與第一透明導體島狀圖案134之間具有良好的附著。故,在進行後段撕膜製程(諸如移除可剝膠或移除製程中暫時使用的保護膜等製程)時,由於轉接結構130a、130b中的絕緣層138與第一透明導體島狀圖案134之間具有良好附著,因此絕緣層138不會受外力影響而由第一透明導體島狀圖案134剝離,使得轉接結構130a、130b能保持完好結構。 In the above embodiment, the via structures 130a, 130b include a plurality of first transparent conductor island patterns 134 disposed between the first conductor electrode 132 and the insulating layer 138 and under the first opening 138a of the insulating layer 138. In detail, the insulating layer 138 is filled in the gap 136 between the first transparent conductor island patterns 134 and the first guide The body electrode 132 is in contact with and covers the side 134a and the partial top surface 134b of each of the first transparent conductor island patterns 134. If the transparent conductor layer covers the first conductor electrode 132 in a large form and the plurality of first transparent conductor island patterns 134 are disposed on the first conductor electrode 132 with the adapter structures 130a and 130b of the present embodiment. Compare with each other. The embodiment of the present invention can reduce the area of the first transparent conductor island pattern 134 on the first conductor electrode 132, but greatly increase the contact area between the insulating layer 138 and the first transparent conductor island pattern 134, and the insulating layer 138 is in direct contact with the first conductor electrode 132, so that the insulating layer 138 has good adhesion to the first transparent conductor island pattern 134. Therefore, during the subsequent tear film process (such as the process of removing the peelable glue or removing the protective film temporarily used in the process), the insulating layer 138 and the first transparent conductor island pattern in the transfer structure 130a, 130b are used. There is good adhesion between the 134, so that the insulating layer 138 is not affected by the external force and is peeled off by the first transparent conductor island pattern 134, so that the adapter structures 130a, 130b can maintain a good structure.

另一方面,由於第一透明導體島狀圖案134位於絕緣層138的第一開口138a下方,因此第一透明導體島狀圖案134可以作為第一導體電極132的保護墊。舉例來說,形成第一開口138a的蝕刻製程有可能會過度蝕刻絕緣層138,而蝕刻至經由第一開口138a暴露出來的下方膜層,此時,第一透明導體島狀圖案134能作為第一導體電極132的阻擋層,以避免第一導體電極132受到電漿等直接轟擊而被破壞,因此第一導體電極132能保持良好的電特性。故,轉接結構130a、130b能具有良好的轉接功能,進而使得觸控面板以及採用此觸控面板的觸控顯示面板具有較佳的良 率與良好的觸控功能。 On the other hand, since the first transparent conductor island pattern 134 is located under the first opening 138a of the insulating layer 138, the first transparent conductor island pattern 134 can serve as a protective pad of the first conductor electrode 132. For example, the etching process for forming the first opening 138a may over-etch the insulating layer 138 and etch to the lower film layer exposed through the first opening 138a. At this time, the first transparent conductor island pattern 134 can be used as the first The barrier layer of the conductor electrode 132 prevents the first conductor electrode 132 from being damaged by direct bombardment by plasma or the like, so that the first conductor electrode 132 can maintain good electrical characteristics. Therefore, the transfer structure 130a, 130b can have a good transfer function, so that the touch panel and the touch display panel using the touch panel have better good performance. Rate with good touch function.

綜上所述,本發明之觸控面板與觸控顯示面板中,轉接結構具有多個第一透明導體島狀圖案配置於第一導體電極上且位於絕緣層的第一開口下方。由於絕緣層會填入第一導體電極之間的縫隙中與第一導體電極接觸且覆蓋各第一透明導體島狀圖案的側邊與部份頂表面,因此絕緣層與第一透明導體島狀圖案之間具有良好的附著。如此一來,在後段的撕膜步驟中,能避免轉接結構中的絕緣層與第一透明導體島狀圖案發生剝離,使得轉接結構具有良好的轉接功能。此外,第一透明導體島狀圖案作為第一導體電極的保護墊,以避免外來物質經由第一開口破壞之,使第一導體電極具有良好的特性。因此,本發明之觸控面板與採用此觸控面板的觸控顯示面板具有較佳的良率與良好的觸控功能。 In summary, in the touch panel and the touch display panel of the present invention, the transfer structure has a plurality of first transparent conductor island patterns disposed on the first conductor electrode and below the first opening of the insulating layer. The insulating layer and the first transparent conductor island are formed because the insulating layer fills the gap between the first conductor electrodes and contacts the first conductor electrode and covers the side and part of the top surface of each of the first transparent conductor island patterns. There is good adhesion between the patterns. In this way, in the tearing film step of the rear stage, peeling of the insulating layer in the transfer structure from the first transparent conductor island pattern can be avoided, so that the transfer structure has a good transfer function. In addition, the first transparent conductor island pattern serves as a protective pad for the first conductor electrode to prevent foreign matter from being broken through the first opening, so that the first conductor electrode has good characteristics. Therefore, the touch panel of the present invention and the touch display panel using the touch panel have better yield and good touch function.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

110‧‧‧基板 110‧‧‧Substrate

130a‧‧‧轉接結構 130a‧‧‧Transfer structure

132‧‧‧第一導體電極 132‧‧‧First conductor electrode

134‧‧‧第一透明導體島狀圖案 134‧‧‧First transparent conductor island pattern

134a‧‧‧側邊 134a‧‧‧ side

134b‧‧‧頂表面 134b‧‧‧ top surface

136‧‧‧縫隙 136‧‧‧ gap

138‧‧‧絕緣層 138‧‧‧Insulation

138a‧‧‧第一開口 138a‧‧‧first opening

140‧‧‧第二透明導體層 140‧‧‧Second transparent conductor layer

170‧‧‧保護層 170‧‧‧Protective layer

Claims (10)

一種觸控面板,包括:一基板,具有一感測區與一周邊區;一觸控感測層,位於該基板的該感測區上;一轉接結構,位於該基板的該周邊區上,與該觸控感測層電性連接,包括:一第一導體電極,配置於該基板上;多個第一透明導體島狀圖案,配置於該第一導體電極上,其中該些第一透明導體島狀圖案之間具有多個縫隙,該些縫隙暴露出該第一導體電極;一絕緣層,覆蓋於該些第一透明導體島狀圖案上且具有多個第一開口,其中該絕緣層填入該些縫隙中與該第一導體電極接觸且覆蓋各該第一透明導體島狀圖案的側邊與部份頂表面,各該第一開口暴露出對應之一第一透明導體島狀圖案;以及一第二透明導體層,配置於該絕緣層上且經由該些第一開口與該些第一透明導體島狀圖案電性連接;一接觸墊,配置於該基板的該周邊區上;以及一連接線,配置於該基板的該周邊區上,且位於該接觸墊與該轉接結構之間,用以連接該轉接結構與該接觸墊。 A touch panel includes: a substrate having a sensing area and a peripheral area; a touch sensing layer located on the sensing area of the substrate; and a switching structure located on the peripheral area of the substrate And electrically connected to the touch sensing layer, comprising: a first conductor electrode disposed on the substrate; a plurality of first transparent conductor island patterns disposed on the first conductor electrode, wherein the first transparent a plurality of slits between the conductor island patterns, the slits exposing the first conductor electrode; an insulating layer covering the first transparent conductor island patterns and having a plurality of first openings, wherein the insulating layer Filling the gaps with the first conductor electrode and covering the side and partial top surfaces of each of the first transparent conductor island patterns, each of the first openings exposing a corresponding one of the first transparent conductor island patterns And a second transparent conductor layer disposed on the insulating layer and electrically connected to the first transparent conductor island patterns via the first openings; a contact pad disposed on the peripheral region of the substrate; And a connection line, configuration On the peripheral region of the substrate, and between the contact pad and the adapter structure for connecting the adapter with the contact pad structure. 如申請專利範圍第1項所述的觸控面板,其中該觸控感測層包括:至少一個第一感測電極,該第一感測電極在一第一方向上延伸,該第一感測電極包括多個第一電極部與多個第一橋接部,各該第一橋接部連接相鄰二個第一電極部;以及至少一個第二感測電極,該第二感測電極在一第二方向上延伸,該第二感測電極包括多個第二電極部與多個第二橋接部,各該第二橋接部連接相鄰二個第二電極部。 The touch panel of claim 1, wherein the touch sensing layer comprises: at least one first sensing electrode, the first sensing electrode extends in a first direction, the first sensing The electrode includes a plurality of first electrode portions and a plurality of first bridge portions, each of the first bridge portions connecting adjacent two first electrode portions; and at least one second sensing electrode, wherein the second sensing electrode is in the first The second sensing electrode includes a plurality of second electrode portions and a plurality of second bridge portions, and each of the second bridge portions connects the adjacent two second electrode portions. 如申請專利範圍第2項所述的觸控面板,其中該些第一橋接部或該些第二橋接部的材料與該些第一透明導體島狀圖案的材料相同。 The touch panel of claim 2, wherein the materials of the first bridging portions or the second bridging portions are the same as the materials of the first transparent conductor island patterns. 如申請專利範圍第2項所述的觸控面板,其中該些第一橋接部或該些第二橋接部的材料與該第一導體電極的材料相同。 The touch panel of claim 2, wherein the materials of the first bridges or the second bridges are the same as the material of the first conductor electrode. 如申請專利範圍第2項所述的觸控面板,其中該些第一電極部、該些第二電極部、該些第二橋接部以及該第二透明導體層的材料相同。 The touch panel of claim 2, wherein the first electrode portion, the second electrode portions, the second bridge portions, and the second transparent conductor layer are made of the same material. 如申請專利範圍第1項所述的觸控面板,其中該接觸墊、該連接線以及該第一導體電極的材料相同。 The touch panel of claim 1, wherein the contact pad, the connecting line, and the first conductor electrode are made of the same material. 如申請專利範圍第2項所述的觸控面板,其中該轉接結構經由該第二透明導體層電性連接該第一感測電極與該第二感測電極中之其中一者。 The touch panel of claim 2, wherein the switching structure is electrically connected to one of the first sensing electrode and the second sensing electrode via the second transparent conductor layer. 如申請專利範圍第1項所述的觸控面板,更包括一保護層,配置於該基板上且覆蓋該觸控感測層以及該轉接結構上。 The touch panel of claim 1, further comprising a protective layer disposed on the substrate and covering the touch sensing layer and the switching structure. 如申請專利範圍第1項所述的觸控面板,其中該轉接結構位於一黑色矩陣預備遮蔽區。 The touch panel of claim 1, wherein the transfer structure is located in a black matrix preparation masking area. 一種觸控顯示面板,包括:一如申請專利範圍第1項所述的觸控面板;以及一顯示面板,與該觸控面板疊置,該顯示面板包含一第一基板、一第二基板及一夾設於該第一基板與該第二基板間的顯示介質層,其中,該顯示面板具有多個子畫素,每個子畫素至少具有一訊號線、一畫素電極、以及一連接該畫素電極與該訊號線的主動元件。 A touch display panel comprising: the touch panel of claim 1; and a display panel stacked on the touch panel, the display panel comprising a first substrate and a second substrate a display medium layer interposed between the first substrate and the second substrate, wherein the display panel has a plurality of sub-pixels, each sub-pixel has at least one signal line, a pixel electrode, and a connection to the picture The active electrode of the element electrode and the signal line.
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