CN112271016A - Touch screen - Google Patents
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- CN112271016A CN112271016A CN202011252553.8A CN202011252553A CN112271016A CN 112271016 A CN112271016 A CN 112271016A CN 202011252553 A CN202011252553 A CN 202011252553A CN 112271016 A CN112271016 A CN 112271016A
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- electrode lead
- layer
- conductive
- metal
- molding layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The touch screen comprises a glass panel, a first molding layer, a first metal conducting layer, a first electrode lead, a transparent insulating film, a second molding layer, a second metal conducting layer and a second electrode lead, wherein the first molding layer is formed on one side of the glass panel, the first metal conducting layer is embedded in the first molding layer, the second molding layer is formed on the second surface of the transparent insulating film, the second metal conducting layer is embedded in the second molding layer, and then the first surface of the transparent insulating film is attached to one side, formed with the first molding layer, of the glass panel. Therefore, etching forming is not needed when the conducting layer is formed, material waste is avoided, the manufacturing process is simplified, the yield is improved, metal is adopted to replace ITO, and cost is reduced.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a touch screen.
Background
A touch screen is an inductive device that can receive input signals such as touch. The touch screen gives brand-new appearance to information interaction, and is brand-new information interaction equipment. In a conventional touch screen, an Indium Tin Oxide (ITO) conductive layer is an important component of a touch screen sensing module.
Generally, when an ITO layer is prepared, an ITO film is coated on the entire surface of a substrate, then an ITO pattern is formed to obtain an electrode, and finally a transparent electrode silver lead is manufactured. In the process of forming an ITO pattern, an etching process is needed to etch the formed ITO film, the manufacturing process is complicated, ITO is an expensive material, a large amount of ITO is wasted during pattern forming, and the production cost is high.
Disclosure of Invention
In view of the above, it is necessary to provide a touch panel that can reduce the cost, in order to solve the problem of high production cost.
A touch screen, comprising:
a glass panel;
the first molding layer is formed on one side of the glass panel, a first metal conducting layer is embedded in the first molding layer, and the first metal conducting layer comprises mutually insulated first conducting strips;
a first electrode lead formed on the first molding layer and electrically connected to the first conductive strip;
the transparent insulating film comprises a first surface and a second surface opposite to the first surface, and the first surface is close to the first molding layer;
the second molding layer is formed on the second surface of the transparent insulating film, a second metal conducting layer is embedded in the second molding layer, and the second metal conducting layer comprises second conducting strips which are mutually insulated;
a second electrode lead formed on the second molding layer and electrically connected to the second conductive strip.
In one embodiment, a first notch is formed at a free end of the transparent insulating film facing the first electrode lead, a second notch is formed at a free end of the second molding layer facing the first electrode lead, and a free end of the second electrode lead is disposed at the periphery of the second notch.
In one embodiment, the glass panel further comprises an optical transparent adhesive layer, the optical transparent adhesive layer is arranged between the glass panel and the first surface of the transparent insulating film, and a third notch is arranged at the free end, facing the first electrode lead, of the optical transparent adhesive layer.
In one embodiment, the silicon-oxygen groups of the glass panel are exposed on the surface of the glass panel close to the first molding layer.
In one embodiment, the surface roughness of the glass panel close to the first molding layer is 5-10 nm.
In one embodiment, the first metal conductive layer and the second metal conductive layer each include a conductive mesh formed by intersecting conductive fine lines, and a projection of the conductive mesh of the first metal conductive layer on the second metal conductive layer overlaps with the conductive mesh of the second metal conductive layer.
In one embodiment, one end of the first electrode lead near the first conductive strip is provided with a strip-shaped first connection portion, the first connection portion is wider than other portions of the first electrode lead, one end of the second electrode lead near the second conductive strip is provided with a strip-shaped second connection portion, and the second connection portion is wider than other portions of the second electrode lead.
In one embodiment, the first electrode lead and the second electrode lead are both of a mesh structure formed by connecting conductive thin wires in a mesh cross manner.
In one embodiment, the grid period of the first electrode lead and the grid period of the second electrode lead are both smaller than the grid period of the first metal conductive layer and the second metal conductive layer.
In one embodiment, a first electrode patch cord is disposed between the first electrode lead and the first conductive strip, a second electrode patch cord is disposed between the second electrode lead and the second metal conductive layer, and the first electrode patch cord and the second electrode patch cord are both continuous thin conductive wires.
In one embodiment, the first conductive strip and the second conductive strip each include a plurality of conductive fine wires, the first electrode patch cord is connected to the ends of at least two conductive fine wires of the first conductive strip and the first electrode lead at the same time, and the second electrode patch cord is connected to the ends of at least two conductive fine wires of the second conductive strip and the second electrode lead at the same time.
According to the touch screen, the first molding layer is formed on one side of the glass panel, the first metal conducting layer is embedded in the first molding layer, the second molding layer is formed on the second surface of the transparent insulating film, the second metal conducting layer is embedded in the second molding layer, and then the first surface of the transparent insulating film is attached to one side, formed with the first molding layer, of the glass panel. Therefore, etching forming is not needed when the conducting layer is formed, material waste is avoided, the manufacturing process is simplified, the yield is improved, metal is adopted to replace ITO, and cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a touch screen;
FIG. 2 is a schematic view of another perspective structure of the touch screen;
FIG. 3 is a schematic view of another perspective structure of the touch screen;
FIG. 4 is a schematic view of the enlarged partial structure of FIG. 3A;
FIG. 5 is a schematic structural diagram of a glass panel of a touch screen;
FIG. 6 is a schematic structural diagram of a second metal conductive layer of the touch screen;
FIG. 7 is a schematic diagram of a first electrode lead of a touch panel;
fig. 8 is a schematic structural diagram of a second electrode lead of the touch screen.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
"transparent" in a transparent insulating film is understood to be "transparent" and "substantially transparent" in the present invention; the "insulation" in the transparent insulating film is understood to be "insulation" and "dielectric (dielectric)" in the present invention, and thus the "transparent insulating film" in the present invention is understood to include, but not limited to, a transparent insulating film, a substantially transparent insulating film, a transparent dielectric film, and a substantially transparent dielectric film.
In the embodiment shown in fig. 1, 2 and 3, a touch screen includes a glass panel 110, a first molding layer 120, a first metal conductive layer 130, a first electrode lead 140, a transparent insulating film 150, a second molding layer 160, a second metal conductive layer 170 and a second electrode lead 180.
The first molding layer 120 is formed on one side of the glass panel 110, a first metal conductive layer 130 is embedded in the first molding layer 120, and the first metal conductive layer 130 includes first conductive strips 132 insulated from each other; a first electrode lead 140 formed on the first molding layer 120 and electrically connected to the first conductive strip 132; the transparent insulating film 150 comprises a first surface 152 and a second surface 154 opposite to the first surface 152, the first surface 152 is close to the first molding layer 120, the second molding layer 160 is formed on the second surface 154 of the transparent insulating film 150, the second molding layer 160 is embedded with a second metal conducting layer 170, and the second metal conducting layer 170 comprises second conducting strips 172 insulated from each other; a second electrode lead 180 is formed on the second molding layer 160 and electrically connected to the second conductive strip 172.
In the touch panel, the first molding layer 120 is formed on one side of the glass panel 110, the first metal conductive layer 130 is embedded in the first molding layer 120, the second molding layer 160 is formed on the second surface 154 of the transparent insulating film 150, the second metal conductive layer 170 is embedded in the second molding layer 160, and then the first surface 152 of the transparent insulating film 150 is attached to one side of the glass panel 110 on which the first molding layer 120 is formed. Therefore, etching forming is not needed when the conducting layer is formed, material waste is avoided, the manufacturing process is simplified, the yield is improved, metal is adopted to replace ITO, and cost is reduced. And because the production engineering of the touch screen does not need to carry out an etching process, the use of chemical substances in the production process can be avoided, and the pollution to the environment is avoided.
Wherein a first electrode lead 140 is formed on the first molding layer 120 and electrically connected to the first conductive strip 132; a second electrode lead 180 is formed on the second molding layer 160 and electrically connected to the second conductive strip 172. In the preparation of the touch screen, the first electrode lead 140 is used to electrically connect the first metal conductive layer 130 with a Printed Circuit Board (FPCB) 210 of the touch screen, and the second electrode lead 180 is used to electrically connect the second metal conductive layer 170 with the FPCB210 of the touch screen, so that the FPCB210 senses an operation on the touch screen.
The material used for preparing the first metal conductive layer 130 and the second metal conductive layer 170 may be one of gold, silver, copper, aluminum, nickel, zinc, or an alloy of at least two of the foregoing. It can be understood that the first metal conductive layer 130 and the second metal conductive layer 170 are made of an electrical conductor, such as carbon nanotube, graphene, conductive polymer, etc., to achieve corresponding functions.
The material forming the first molding layer 120 and the second molding layer 160 may be solvent-free uv-curable acryl resin, photo-curable adhesive, thermosetting adhesive, or self-drying adhesive. Wherein the light-cured adhesive is prepared from a prepolymer, a monomer, a photoinitiator and an auxiliary agent according to the molar ratio: 30-50%, 40-60%, 1-6% and 0.2-1%, light-curing glue, heat-curing glue and self-drying glue. Wherein, the prepolymer is selected from at least one of epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate and acrylic resin; the monomer is at least one of monofunctional (IBOA, IBOMA, HEMA, etc.), difunctional (TPGDA, HDDA, DEGDA, NPGDA, etc.), trifunctional and multifunctional (TMPTA, PETA, etc.); the photoinitiator is benzophenone, benzophenone and the like. Furthermore, an auxiliary agent with the molar ratio of 0.2-1% can be added into the mixture. The auxiliary agent can be hydroquinone, p-methoxyphenol, p-benzoquinone, 2, 6-di-tert-butyl cresol and the like.
The transparent insulating film 150 may be made of a polyethylene terephthalate (PET) film. It should be noted that in other embodiments, the transparent insulating film 150 may also be a film made of other materials, such as polybutylene terephthalate (PBT), polymethyl methacrylate (PMMA), polycarbonate Plastic (PC), glass, and the like.
In the embodiment shown in fig. 1 and 5, the first molding layer 120 is formed on one side of the glass panel 110, and the first metal conductive layer 130 is embedded in the first molding layer 120. A first groove with a predetermined shape is formed on a side of the first molding layer 120 away from the glass panel 110, and the first metal conductive layer is accommodated in the first groove, such that the shape of the first metal conductive layer 130 matches with the shape of the first groove. The first molding layer 120 is formed on one side of the glass panel 110, a first groove is formed on one side of the first molding layer 120 away from the glass panel 110 by an imprinting method using an imprinting mold 230, and then the first groove is filled with a material for forming the first metal conductive layer 130, and the first metal conductive layer 130 is formed by a sintering process. Since the first groove can be stamped into a predetermined shape according to the shape of the electrode, the first metal conductive layer 130 accommodated in the first groove can be in the predetermined shape without etching, thereby simplifying the manufacturing process and achieving the purpose of reducing the cost.
In order to prevent the first metal conductive layer 130 from breaking during the sintering process after the first groove is filled with the material, a ratio of a depth of the first groove to a width of the first groove may be reasonably set to be not less than 1.
Specifically, the second molding layer 160 is formed on the second surface 154 of the transparent insulating film 150, and the second metal conductive layer 170 is embedded in the second molding layer 160. A second groove with a predetermined shape is formed on a side of the second molding layer 160 away from the second surface 154 of the transparent insulating film 150, and the second metal conductive layer 170 is accommodated in the second groove and has a shape matching the shape of the second groove. Forming a second molding layer 160 on the second surface 154 of the transparent insulating film 150, forming a second groove on a side of the second molding layer 160 away from the second surface 154 of the transparent insulating film 150 by imprinting, filling the second groove with a material for forming a second metal conductive layer 170, and forming the second metal conductive layer 170 by a sintering process. Since the second groove can be stamped into a predetermined shape according to the shape of the electrode, the second metal conductive layer 170 accommodated in the second groove can be in a predetermined shape without etching, thereby simplifying the manufacturing process and achieving the purpose of reducing the cost.
In order to prevent the second metal conductive layer 170 from breaking during the sintering process after the second groove is filled with the material, a ratio of a depth of the second groove to a width of the second groove may be reasonably set to be not less than 1.
Referring to fig. 2 and 3, in one embodiment, a first notch 156 is formed at a position of the transparent insulating film 150 facing the free end 142 of the first electrode lead 140, a second notch 162 is formed at a position of the second molding layer 160 facing the free end 142 of the first electrode lead 140, and a free end 182 of the second electrode lead 180 is disposed at a periphery of the second notch 162. The first electrode lead 140 has one end electrically connected to the first conductive strip 132 and the other end serving as a free end 142 of the first electrode lead 140 for connection to the FPCB 210; the second electrode lead 180 has one end electrically connected to the second conductive strip 172 and the other end serving to be connected to the FPCB210 as a free end 182 of the second electrode lead 180. In the specific embodiment shown in fig. 2 and 3, the transparent insulating film 150 and the second molding layer 160 are both located above the first molding layer 120, the first electrode lead 140 is formed on the first molding layer 120, the first notch 156 and the second notch 162 are disposed so as to expose the free end 142 of the first electrode lead 140, and the free end 182 of the second electrode lead 180 is disposed at the periphery of the second notch 162, so that the purpose that the free end 142 of the first electrode lead 140 and the free end 182 of the second electrode lead 180 can be simultaneously connected with the FPCB210 is achieved, the structure of the FPCB210 is simplified, the manufacturing process is simple, and the manufacturing cost of the touch screen is further reduced.
Referring to fig. 2 and 3, in one embodiment, the optical transparent adhesive layer 190 is further included, the optical transparent adhesive layer 190 is disposed between the glass panel 110 and the first surface 152 of the transparent insulating film 150, and a third notch 192 is disposed at a position of the optical transparent adhesive layer 190, which faces the free end 142 of the first electrode lead 140. The first molding layer 120 is formed on one side of the glass panel 110, the first metal conductive layer 130 is embedded in the first molding layer 120, the second molding layer 160 is formed on the second surface 154 of the transparent insulating film 150, the second metal conductive layer 170 is embedded in the second molding layer 160, and then the first surface 152 of the transparent insulating film 150 is attached to the surface of the glass panel 110 on which the first molding layer 120 is formed through the optical transparent adhesive layer 190. The arrangement of the optical transparent adhesive layer 190 can further enhance the adhesive strength between the glass panel 110 and the transparent insulating film 150, thereby reducing the cost and improving the yield of the touch screen. The material of the optical transparent adhesive layer 190 may be OCA adhesive, UV adhesive, thermosetting adhesive, or self-drying adhesive, etc. to ensure the light transmittance of the touch screen. Meanwhile, a third notch 192 is formed at the position of the optical transparent adhesive layer 190, which faces the free end 142 of the first electrode lead 140, so as to expose the free end 142 of the first electrode lead 140.
Referring to fig. 5, in one embodiment, the silicon-oxygen groups of the glass panel 110 are exposed on the surface of the glass panel 110 near the first molding layer 120. Before the first molding layer 120 is formed on the glass panel 110, the silicon-oxygen groups on the surface of the glass panel 110 close to the first molding layer 120 are exposed, so that the first molding layer 120 is better adhered to the glass panel 110, and the yield of the touch panel is improved. The silicon-oxygen radical can be exposed by pre-treating the surface of the glass panel 110 near the first molding layer 120 with the plasma beam 220.
Referring to fig. 5, in one embodiment, in order to improve the adhesion between the glass panel 110 and the first molding layer 120, the surface roughness of the glass panel 110 near the first molding layer 120 may be set to be 5 to 10 nm. The surface of the glass panel 110 near the first molding layer 120 can be pretreated by the plasma beam 220 to achieve the surface roughness of 5-10 nm.
Referring to fig. 2 and fig. 3, in one embodiment, the first metal conductive layer 130 and the second metal conductive layer 170 each include a conductive mesh formed by intersecting conductive fine lines, and a projection of the conductive mesh of the first metal conductive layer 130 on the second metal conductive layer 170 overlaps with the conductive mesh of the second metal conductive layer 170.
Specifically, a blade coating technology can be used to fill the nano silver ink in the first groove, and then sintering is performed at 150 ℃, so that the silver simple substance in the nano silver ink is sintered into the conductive thin line of the first metal conductive grid. Wherein, the solid content of the silver ink is 35 percent, and the solvent is volatilized in the sintering process. The shape of the first groove is pre-embossed into the desired pre-set shape of the electrode. Therefore, when the conductive mesh of the first metal conductive layer 130 is formed, a forming operation is not performed, thereby saving materials and improving efficiency.
Specifically, a blade coating technology can be used to fill the second groove with nano silver ink, and then sintering is performed at 150 ℃, so that the silver simple substance in the nano silver ink is sintered into the conductive fine line of the second metal conductive grid. Wherein, the solid content of the silver ink is 35 percent, and the solvent is volatilized in the sintering process. The shape of the second groove is pre-embossed into the desired pre-set shape of the electrode. Therefore, when the conductive mesh of the second metal conductive layer 170 is formed, a forming operation is not performed, thereby saving materials and improving efficiency.
Wherein, the projection of the conductive grid of the first metal conductive layer 130 on the second metal conductive layer 170 overlaps with the conductive grid of the second metal conductive layer 170. The conductive fine lines constituting the first and second metal conductive layers 130 and 170 can be shifted from each other by a predetermined distance, thereby preventing the occurrence of a serious moire phenomenon.
Moire is an optical phenomenon that is the visual result of interference between two lines or two objects at a constant angle and frequency, and when the human eye cannot distinguish the two lines or two objects, only the interference pattern can be seen, which is the moire.
The conductive mesh of the first metal conductive layer 130 and the second metal conductive layer 170 may be a diamond, a rectangle, a parallelogram, a curved quadrilateral or a polygon, the curved quadrilateral has four curved sides, and two opposite curved sides have the same shape and curve trend. In the embodiment shown in fig. 4, the conductive mesh of the second metal conductive layer 170 is a regular hexagon. In the embodiment shown in fig. 6, the conductive mesh of the second metal conductive layer 170 is an irregular polygon.
Referring to fig. 3 and 4, in one embodiment, a strip-shaped first connection portion 144 is disposed at one end of the first electrode lead 140 close to the first conductive strip 132, the first connection portion 144 is wider than other portions of the first electrode lead 140, a strip-shaped second connection portion 184 is disposed at one end of the second electrode lead 180 close to the second conductive strip 172, and the second connection portion 184 is wider than other portions of the second electrode lead 180. Since the first connection portion 144 is wider than other portions of the first electrode lead 140 and has a larger contact area, the first electrode lead 140 is electrically connected to the plurality of thin conductive wires of the first metal conductive layer 130, and the electrical connectivity between the first electrode lead 140 and the first metal conductive layer 130 is further enhanced. Since the second connecting portion 184 has a wider contact area than other portions of the second electrode lead 180, the electrical connectivity between the second electrode lead 180 and the second metal conductive layer 170 can be enhanced. Therefore, the yield is improved, and the cost is reduced.
Referring to fig. 7 and 8, in one embodiment, the first electrode lead 140 and the second electrode lead 180 are both of a mesh structure formed by cross-connecting conductive thin wires in a mesh. Specifically, a groove for accommodating the first/second electrode lead 180 is stamped in the first/second molding layer 160, and then the material of the first/second electrode lead 180 is blade-coated into the corresponding groove. The electrode lead adopting the grid structure can ensure that the material of the electrode lead is not easy to be scraped out in the blade coating process, thereby facilitating the operation of the blade coating process. Meanwhile, the lead breakage caused by the coagulation effect generated when the material of the first/second electrode lead 180 is subjected to the sintering process can be prevented, the yield is improved, and the cost is reduced. The material of the first/second electrode lead 180 may be a nano silver paste.
It is understood that each of the first and second electrode leads 140 and 180 may also be a solid wire, and the purpose of electrically connecting each of the first and second metal conductive layers 130 and 170 with the FPCB210 may also be achieved.
Referring to fig. 3, 7 and 8, in one embodiment, the grid period of the first electrode lead 140 and the second electrode lead 180 is less than the grid period of the first metal conductive layer 130 and the second metal conductive layer 170. The grid period is the size of the grid cell. Since the first electrode lead 140 and the second electrode lead 180 are electrically connected to the first metal conductive layer 130 and the second metal conductive layer 170, misalignment is inevitable. Thus, the electrical connectivity between the first and second electrode leads 140 and 180 and the first and second metal conductive layers 130 and 170 can be enhanced, the yield can be increased, and the cost can be reduced.
Referring to fig. 7 and 8, in one embodiment, a first electrode patch cord 146 is disposed between the first electrode lead 140 and the first conductive strip 132, a second electrode patch cord 186 is disposed between the second electrode lead 180 and the second metal conductive layer 170, and the first electrode patch cord 146 and the second electrode patch cord 186 are both continuous conductive thin wires. Since the first electrode lead 140 and the second electrode lead 180 are electrically connected to the first metal conductive layer 130 and the second metal conductive layer 170, misalignment is inevitable. The first connection portion 144 is electrically connected to the first metal conductive layer 130 through the first electrode patch 146, and the second connection portion 184 is electrically connected to the second metal conductive layer 170 through the second electrode patch 186. Since the first electrode patch cord 146 and the second electrode patch cord 186 are continuous conductive thin wires, even if the grid periods of the first conductive metal layer and the second conductive metal layer are different, the first electrode lead 140 and the first metal conductive layer 130 can be electrically connected well, and the second electrode lead 180 and the second metal conductive layer 170 can be electrically connected well.
In order to further optimize the electrical connection performance between the electrode lead and the metal conductive layer, the first electrode patch 146 is connected to the ends of at least two conductive thin wires of the first conductive strip 132 and the first electrode lead 140, and the second electrode patch 186 is connected to the ends of at least two conductive thin wires of the second conductive strip 172 and the second electrode lead 180.
Fig. 7 and 8 show the first electrode patch cord 146 and the second electrode patch cord 186 in a highlighted manner, and the first electrode patch cord 146 and the second electrode patch cord 186 are thicker than the conductive thin wires constituting the first electrode lead 140 and the second electrode lead 180, but it should not be understood that the first electrode patch cord 146 and the second electrode patch cord 186 are thicker than the metal thin wires constituting the first electrode lead 140 and the second electrode lead 180. The thicknesses of the first electrode patch 146 and the second electrode patch 186 can be determined according to the application environment.
It should be noted that even if the first electrode patch 146 and the second electrode patch 186 are not provided, the first electrode lead 140 can be electrically connected to the first metal conductive layer 130, and the second electrode lead 180 can be electrically connected to the second metal conductive layer 170.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A touch screen, comprising:
a glass panel;
the first molding layer is formed on one side of the glass panel, a first metal conducting layer is embedded in the first molding layer, and the first metal conducting layer comprises mutually insulated first conducting strips;
a first electrode lead formed on the first molding layer and electrically connected to the first conductive strip;
the transparent insulating film comprises a first surface and a second surface opposite to the first surface, and the first surface is close to the first molding layer;
the second molding layer is formed on the second surface of the transparent insulating film, a second metal conducting layer is embedded in the second molding layer, and the second metal conducting layer comprises second conducting strips which are mutually insulated;
a second electrode lead formed on the second molding layer and electrically connected to the second conductive strip;
the first conductive strip and the second conductive strip both comprise a plurality of conductive fine wires, the first electrode patch cord is simultaneously connected with the end portions of the first conductive strip and the at least two conductive fine wires of the first electrode lead, and the second electrode patch cord is simultaneously connected with the end portions of the second conductive strip and the at least two conductive fine wires of the second electrode lead.
2. The touch panel according to claim 1, wherein a first notch is formed at a free end of the transparent insulating film facing the first electrode lead, a second notch is formed at a free end of the second molding layer facing the first electrode lead, and a free end of the second electrode lead is disposed at a periphery of the second notch.
3. The touch screen of claim 2, further comprising an optically clear adhesive layer disposed between the glass panel and the first surface of the transparent insulating film, wherein a third notch is disposed at a free end of the optically clear adhesive layer facing the first electrode lead.
4. The touch screen of claim 1, wherein the silicon-oxygen-based layer of the glass panel is exposed on a surface of the glass panel adjacent to the first molding layer.
5. The touch screen of claim 1, wherein the surface roughness of the glass panel near the first molding layer is 5-10 nm.
6. The touch screen of claim 1, wherein the first metal conductive layer and the second metal conductive layer each comprise a conductive mesh formed by intersecting conductive fine lines, and a projection of the conductive mesh of the first metal conductive layer on the second metal conductive layer overlaps with the conductive mesh of the second metal conductive layer.
7. The touch screen of claim 6, wherein the first electrode lead has a first connection portion in the shape of a strip provided at an end thereof adjacent to the first conductive strip, the first connection portion being wider than other portions of the first electrode lead, and the second electrode lead has a second connection portion in the shape of a strip provided at an end thereof adjacent to the second conductive strip, the second connection portion being wider than other portions of the second electrode lead.
8. The touch screen of claim 6, wherein the first electrode lead and the second electrode lead are each a mesh structure formed by cross-connecting conductive thin wires in a mesh.
9. The touch screen of claim 8, wherein the first electrode lead and the second electrode lead each have a grid period that is less than the grid period of the first metal conductive layer and the second metal conductive layer.
10. The touch screen of claim 9, wherein a first electrode patch cord is disposed between the first electrode lead and the first conductive strip, a second electrode patch cord is disposed between the second electrode lead and the second metal conductive layer, and the first electrode patch cord and the second electrode patch cord are both continuous thin conductive wires.
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| CN202011252553.8A CN112271016A (en) | 2020-11-11 | 2020-11-11 | Touch screen |
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| CN202011252553.8A CN112271016A (en) | 2020-11-11 | 2020-11-11 | Touch screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115220607A (en) * | 2022-07-27 | 2022-10-21 | 四川省利任元创新科技有限责任公司 | OGS capacitive touch screen and manufacturing method thereof |
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| CN103345317A (en) * | 2013-03-25 | 2013-10-09 | 深圳欧菲光科技股份有限公司 | Touch screen |
| CN103226414A (en) * | 2013-05-02 | 2013-07-31 | 深圳欧菲光科技股份有限公司 | Touch screen and preparation method thereof |
| CN103677406A (en) * | 2013-08-30 | 2014-03-26 | 友达光电股份有限公司 | Touch Panel and Touch Display Panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115220607A (en) * | 2022-07-27 | 2022-10-21 | 四川省利任元创新科技有限责任公司 | OGS capacitive touch screen and manufacturing method thereof |
| CN115220607B (en) * | 2022-07-27 | 2022-11-29 | 四川省利任元创新科技有限责任公司 | OGS capacitive touch screen and manufacturing method thereof |
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Application publication date: 20210126 |