TWI492122B - Touch sensing device and manufacturing method thereof - Google Patents

Description

Touch sensing device and manufacturing method thereof

The invention relates to an input interface and a manufacturing method thereof, in particular to a touch sensing device and a manufacturing method thereof.

Touch technology has boomed in recent years, and many consumer electronics products have been introduced with touch functions. Currently, touch panel technology is more commonly used in the form of resistive, capacitive, and optical. Among them, capacitive touch panels have become the mainstream touch technology used in middle and high-end consumer electronic products due to their high accuracy, multi-touch, high durability and high touch resolution.

The surface area of the conventional touch sensing device can be roughly divided into a see-through portion and a peripheral portion, and the peripheral portion is located on at least one side of the see-through portion. The see-through portion is provided with components such as a sensing layer for touch sensing. Components such as peripheral leads for signal transmission are provided in the peripheral portion. Generally, the elements of the see-through portion and the peripheral portion are separately manufactured due to their functions or materials. In order to improve product quality and yield, different components need to be set up according to different requirements. For example, in order to avoid oxidation of the peripheral leads and the sensing layer or other processes, it is necessary to separately protect the peripheral leads and the sensing layer. In order to improve the visual appearance of the touch sensing device, it is necessary to provide functional components such as optical compensation in the see-through portion, which complicates the process and structure.

The invention provides a touch sensing device and a manufacturing method thereof, which utilize the same component The two purposes of use can be achieved, so that the process steps and structure can be simplified.

Accordingly, a preferred embodiment of the present invention provides a touch sensing device including a substrate, a peripheral lead, a bridging element, a conductive pattern layer, an insulating layer, and an index matching protective layer. The substrate includes a see-through portion and a peripheral portion, and the peripheral portion is located on at least one side of the see-through portion. The peripheral leads are disposed on the peripheral portion. The bridging element is disposed on the see-through portion. The conductive pattern layer is disposed on the see-through portion, and the conductive pattern layer comprises a pattern portion and a non-pattern portion, the pattern portion includes at least one first axial electrode and a plurality of second conductive units, the first axial electrode and the periphery of the portion The leads are electrically connected, the adjacent second conductive units are electrically connected through the bridge elements, and the second conductive units are electrically connected to the peripheral leads of the other portion. The insulating layer includes a first portion and a second portion. The first portion is covered on the peripheral lead, and the second portion is disposed between the bridging element and the conductive pattern layer. The index matching protective layer covers the conductive pattern layer, and the refractive index matching protective layer is disposed such that the pattern portion matches the refractive index of the non-pattern portion.

Another preferred embodiment of the present invention provides a method of fabricating a touch sensing device, including the following steps. First, a substrate is provided, the substrate including a see-through portion and a peripheral portion, the peripheral portion being located on at least one side of the see-through portion. Then, a peripheral lead is formed on the peripheral portion to form a bridging member on the see-through portion. Thereafter, a conductive pattern layer is formed on the see-through portion, the conductive pattern layer includes a pattern portion and a non-pattern portion, the pattern portion includes at least one first axial electrode and a plurality of second conductive units, the first axial electrode and the portion The peripheral leads are electrically connected, the adjacent second conductive units are electrically connected through the bridge elements, and the second conductive units are electrically connected to the peripheral leads of the other portion. Then, an insulating layer is formed. The insulating layer includes a first portion and a second portion. The first portion covers the peripheral leads, and the second portion is disposed between the bridging element and the conductive pattern layer. Finally, an index matching protective layer is formed overlying the conductive pattern layer, and the index matching protective layer is disposed such that the pattern portion matches the refractive index of the non-pattern portion.

In the touch sensing device of the present invention and the manufacturing method thereof, the first portion and the second portion of the same insulating layer are respectively located on the peripheral portion and the see-through portion, and the first portion of the insulating layer is used for the protective layer of the peripheral lead at the peripheral portion. The second portion of the insulating layer serves to insulate the first axial electrode of the conductive pattern layer from the bridging element in the see-through portion. In addition, the index matching protective layer can match the pattern portion of the conductive pattern layer with the refractive index of the non-pattern portion, and has the refractive index matching and the protective effect on the conductive pattern layer, thereby achieving two kinds of settings by using the same component. The purpose of use is to simplify the process steps and structure.

100‧‧‧Touch sensing device

110‧‧‧Substrate

120‧‧‧ shading layer

130‧‧‧index matching layer

140‧‧‧metal layer

140B‧‧‧Bridge components

140T‧‧‧ peripheral leads

150‧‧‧Insulation

151‧‧‧Part 1

151V‧‧‧first opening

152‧‧‧Part II

152P‧‧‧Insulation block

160‧‧‧Transparent conductive layer

160P‧‧‧ conductive pattern layer

161P‧‧‧ pattern part

162P‧‧‧Non-pattern part

160X‧‧‧first axial electrode

160Y‧‧‧Second conductive unit

170‧‧‧index matching protective layer

200‧‧‧Touch sensing device

280‧‧‧bonded layer

290‧‧‧ display panel

300‧‧‧Touch sensing device

350‧‧‧Insulation

351‧‧‧Part 1

351V‧‧‧first opening

352‧‧‧Part II

352V‧‧‧second opening

400‧‧‧Touch sensing device

R1‧‧‧ Perspective

R2‧‧‧ peripherals

X‧‧‧ first direction

Y‧‧‧second direction

Z‧‧‧Vertical projection direction

1 to 4 are schematic views showing a method of fabricating a touch sensing device according to a first preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of a touch sensing device according to a first preferred embodiment of the present invention.

Figure 6 is a schematic view showing the refractive index distribution of the index matching protective layer of the present invention.

FIG. 7 is a schematic diagram of a touch sensing device according to a second preferred embodiment of the present invention.

FIG. 8 is a schematic diagram of a touch sensing device according to a third preferred embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view taken along line B-B' in Fig. 8.

FIG. 10 is a schematic diagram of a touch sensing device according to a fourth preferred embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view taken along line C-C' in Fig. 10.

Certain terms are used throughout this specification and the following claims to refer to particular elements. Those of ordinary skill in the art should understand that the manufacturer may refer to the same component by different nouns. The scope of this specification and the subsequent patent application do not make the difference between the names as the means of distinguishing the components, but the difference in function of the components as the basis for the difference. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". Furthermore, in order to make the general practitioner skilled in the art to which the invention pertains The present invention will be further understood by the following detailed description of the preferred embodiments of the invention. It should be noted that the drawings are for illustrative purposes only and are not drawn to the original dimensions. In addition, the use of the terms "first" and "second", and the like, are used to distinguish different elements only and do not limit the order.

Please refer to Figures 1 to 6. 1 to 4 are schematic views showing a method of fabricating a touch sensing device according to a first preferred embodiment of the present invention. FIG. 5 is a schematic diagram of the touch sensing device of the embodiment. Figure 6 is a schematic view showing the refractive index distribution of the index matching protective layer of the present invention. 4 is a cross-sectional view taken along the line A-A' in FIG. 5. For the convenience of description, the drawings of the present invention are only for the purpose of understanding the present invention, and the detailed proportions thereof can be adjusted according to the design requirements.

This embodiment provides a method for fabricating a touch sensing device, including the following steps. First, as shown in FIG. 1, a substrate 110 is provided. The substrate 110 includes a see-through portion R1 and a peripheral portion R2. The peripheral portion R2 is located on at least one side of the see-through portion R1. In other embodiments of the present invention, the peripheral portion R2 may need to surround the periphery of the see-through portion R1, but is not limited thereto. The substrate 110 may include a rigid substrate such as a glass substrate and a ceramic substrate or a flexible substrate such as a plastic substrate or other suitable material. In addition, the substrate 110 can also be a protective substrate such as a cover plate or a cover glass, but is not limited thereto. Then, a light shielding layer 120 is selectively formed on the peripheral portion R2 of the substrate 110. The light shielding layer 120 may include color resist, ink or other suitable light shielding material, and the light shielding layer 120 may be formed by a sputtering and photolithography process. An index matching layer 130 may be selectively formed on the see-through portion R1. The index matching layer 130 may completely cover the region of the see-through portion R1. Alternatively, the index matching layer 130 may extend to the peripheral portion R2. The index matching layer 130 located in the peripheral portion R2 region overlaps with the light shielding layer 120 in a vertical projection direction Z perpendicular to the substrate 110. In other words, the index matching layer 130 may be formed on the peripheral portion R2 before the light shielding layer 120. Or formed on the light shielding layer 120 after the light shielding layer 120 (as shown in FIG. 1). The index matching layer 130 of the present embodiment may preferably comprise a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ) or a layer of niobium pentoxide (Nb ₂ O ₅ ) and cerium oxide (SiO ₂ ). The two-layer structure is composed, and the bismuth pentoxide system is located on the side closer to the substrate 110, but is not limited thereto. In this embodiment, the refractive index matching layer 130 can be a full-face film layer, which can be formed by a process such as printing, coating or sputtering, so that the refractive index matching layer 130 can be patterned by a micro-etching process.

Thereafter, as shown in FIG. 2, a bridging element 140B is formed on the index matching layer 130 in the region of the see-through portion R1. In other words, the above-mentioned index matching layer 130 is formed between the bridging element 140B and the see-through portion R1. . In addition, the present embodiment may further form a peripheral lead 140T. The peripheral lead 140T includes two portions electrically connected to the subsequently formed first axial electrode (as shown in FIG. 5XX) and the second conductive unit. (as shown in Figure 5, Figure 160Y). The index matching layer 130 of the present embodiment can be extended to the peripheral portion R2 as described above, and the index matching layer 130 is formed on the light shielding layer 120 after the light shielding layer 120, and the index matching layer 130 is at least partially located in the light shielding layer. Between the layer 120 and the peripheral lead 140T (as shown in FIG. 2); if the index matching layer 130 is formed on the peripheral portion R2 before the light shielding layer 120, the index matching layer 130 may be located at the light shielding layer 120 and the peripheral portion R2. If the index matching layer 130 does not extend to the peripheral portion R2 region, the peripheral lead 140T may be directly formed on the light shielding layer 120, but not limited thereto, and in general, if it exists in the peripheral portion R2 region The light shielding layer 120 and/or the index matching layer 130, the light shielding layer 120 and/or the index matching layer 130 are formed between the peripheral lead 140T and the peripheral portion R2 regardless of the stacking order, but if in the peripheral portion R2 region If the light shielding layer 120 and the index matching layer 130 are absent, the peripheral lead 140T can be directly formed on the peripheral portion R2, and if the refractive index matching layer 130 is not present in the region of the see-through portion R1, the bridging element 140B can be directly formed in the perspective On the R1, this situation Example embodiments are detailed in the subsequent again. In order to make the figure clearly visible, only one bridging element 140B is depicted as representative in FIG. 2, however, the touch sensing device typically has a plurality of bridging elements 140B. It should be noted that the bridging element 140B and the peripheral lead 140T of the embodiment are preferably made of the same conductive material. The material (for example, a metal layer 140) is formed by a patterning process, but is not limited thereto, and may be formed separately by different conductive materials. The metal layer 140 may include, but is not limited to, a metal conductive material such as at least one of aluminum, copper, silver, chromium, titanium, molybdenum, a composite layer of the above materials, or an alloy of the above materials. The light shielding layer 120 of the present embodiment is formed between the peripheral portion R2 and the peripheral lead 140T, and can be used to shield the peripheral lead 140T to prevent the peripheral lead 140T from being recognized from below the substrate 110 in FIG. 2, thereby improving touch. The visual appearance of the sensing device.

Then, as shown in Fig. 3, an insulating layer 150 is formed. The insulating layer 150 includes a first portion 151 and a second portion 152. The first portion 151 covers the peripheral lead 140T and has a protective effect on the peripheral lead 140T. The second portion 152 covers the bridging element 140B, and is also disposed on the bridging element 140B. The bridging element 140B is between the subsequently formed conductive pattern layer (such as the conductive pattern layer 160P shown in FIG. 4). The insulating layer 150 may include an inorganic material such as silicon nitride, silicon oxide and silicon oxynitride, an organic material such as an acrylic resin or other suitable insulating material, and an insulating layer. 150 can be formed by a sputtering and photolithography process or a printing process. In the present embodiment, the second portion 152 includes a plurality of insulating blocks 152P separated from each other (only one of the insulating blocks 152P is shown in FIG. 3), and the insulating block 152P is located at the bridging element 140B and the subsequently formed first axial electrode (eg, Between the first axial electrodes 160X) shown in FIG. 4, the bridging element 140B and the first axial electrode are electrically insulated from each other. In addition, the first portion 151 of the insulating layer 150 includes at least one first opening 151V, and the first opening 151V exposes at least a portion of the peripheral lead 140T to enable a subsequently formed conductive pattern layer (such as the conductive pattern layer 160P shown in FIG. 4). The electrical connection can be made to the peripheral lead 140T through the first opening 151V. In addition, the first opening 151V of the insulating layer 150 can also be used to electrically connect the peripheral lead 140T to other external components such as a flexible circuit board or an integrated circuit, but is not limited thereto. It should be noted that since the same insulating layer 150 contacts and covers the bridging element 140B and the peripheral lead 140T at the same time, the peripheral lead 140T can be protected by the insulating layer 150 except for the portion exposed by the first opening 151V, so that no additional A protective layer is further formed to protect the peripheral lead 140T, and the insulating layer 150 generates an insulating block in the region of the see-through portion R1. By using the same component to achieve two purposes of use, the effect of simplifying the process steps and structure can be achieved. In addition, the insulating layer 150 of the present embodiment covers only the refractive index matching layer 130 partially located on the see-through portion R1, so that the influence of the color and refractive index of the insulating layer 150 on the appearance quality can be reduced.

Then, as shown in FIGS. 4 and 5, a conductive pattern layer 160P is formed on the region of the see-through portion R1, and the conductive pattern layer 160P includes a pattern portion 161P and a non-pattern portion 162P. Thereafter, an index matching protective layer 170 is formed on the conductive pattern layer 160P, and the index matching protective layer 170 is overlaid on the conductive pattern layer 160P. The index matching protective layer 170 may cause the pattern portion 161P of the conductive pattern layer 160P to The refractive indices of the non-pattern portions 162P are matched such that the pattern of the pattern portion 161P is not visible, thereby forming the touch sensing device 100 as shown in FIGS. 4 and 5. In this embodiment, the conductive pattern layer 160P is preferably formed by a patterning process for a transparent conductive material (for example, the transparent conductive layer 160), but is not limited thereto. The transparent conductive layer 160 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), or other suitable transparent conductive material. To further illustrate, the conductive pattern layer 160P of the present embodiment is used to form an electrode for performing touch sensing. As shown in FIG. 5, the pattern portion 161P includes a first axial electrode 160X and a plurality of second conductive units 160Y. The first axial electrode 160X extends along a first direction X, and the second conductive unit 160Y is aligned along a second direction Y. The first axial electrode 160X and the second conductive unit 160Y are electrically insulated from each other, and the first The axial electrode 160X is electrically connected to a portion of the peripheral lead 140T, the adjacent second conductive unit 160Y is electrically connected through the bridging element 140B, and the second conductive unit 160Y is electrically connected to the peripheral lead 140T of the other portion. The first direction X is substantially perpendicular to the second direction Y, but is not limited thereto. In other preferred embodiments of the present invention, the conductive pattern layer 160P may also be used to form transparent electrodes of other shapes and other arrangements. Generally, since the refractive index of the pattern portion 161P and the non-pattern portion 162P of the conductive pattern layer 160P are different, the pattern portion 161P is easily seen by the user, resulting in a poor visual appearance of the touch sensing device. The index matching protective layer 170 of the present embodiment can match the refractive index of the pattern portion 161P of the conductive pattern layer 160P with the non-pattern portion 162P, in other words, the reflected light of the pattern portion 161P and the reflected light of the non-pattern portion 162P. The uniformity and uniform emission after the refractive index matching protective layer 170 is respectively transmitted, so that the pattern visibility of the pattern portion 161P is lowered, and the index matching protective layer 170 also has a protective effect on the conductive pattern layer 160P. Also note that as shown in Figures 4 and 5, the index matching protective layer 170 preferably includes a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ). In addition, the refractive index of the index matching protective layer 170 is preferably between 1.67 and 1.68, but is not limited thereto. For example, as shown in FIGS. 4 and 6, the index matching protective layer 170 can exhibit a change in refractive index from 1.74 to 1.64 in the wavelength range of 380 nm to 800 nm. It should be noted that, in this embodiment, the material properties of the index matching layer 130 can be adjusted by the refractive index of the materials on the upper and lower sides of the respective layers. For example, when the substrate has a refractive index n _S , the index matching layer 130 has a refractive index n ₁ , and the conductive pattern layer 160P has a refractive index n _T , then n _{1 is} preferably substantially equal to n _S and n _T The product of the root number, that is, n ₁ ≒ (n _S *n _T ), whereby the effect of index matching is achieved to reduce the visibility of the conductive pattern layer 160P. The index matching protective layer 170 and the index matching layer 130 have an index matching effect on the conductive pattern layer 160P such that the visibility of the conductive pattern layer 160P is minimized or invisible. It should be noted that the index matching protective layer 170 of the present embodiment preferably does not overlap with the peripheral lead 140T in the vertical projection direction Z, so the first opening 151V of the insulating layer 150 may not be covered by the index matching protective layer 170. Therefore, the index matching protective layer 170 may not need to cover the peripheral lead 140T located at the peripheral portion R2 by a relatively complicated and costly lithography process in the region of the index matching protective layer 170 corresponding to the peripheral lead 140T. The contact opening is formed again, so that the process simplification effect can be achieved. That is to say, the index matching protective layer 170 of the present embodiment can be formed into a film by transfer only by a convex plate such as an APR (Asahikasei photosensitive resin) plate, thereby achieving the effect of simplifying the process, but the present invention does not Limited. In other preferred embodiments of the present invention, other processes such as sputtering, chemical vapor deposition (CVD), inkjet printing, and slit coating may be used as needed. The index matching protective layer 170 is formed by spin coating, spray coating, or roller coating. In addition, in other preferred embodiments of the present invention, the index matching protective layer 170 may be extended over the peripheral portion R2 and at least partially overlapped with the peripheral lead 140T in the vertical projection direction Z, thereby achieving enhanced protection. effect.

As shown in FIG. 4 and FIG. 5 , the touch sensing device 100 of the present embodiment includes a substrate 110 , a light shielding layer 120 , an index matching layer 130 , a bridging element 140B , a peripheral lead 140T , an insulating layer 150 , and a conductive pattern layer . The 160P and the index match the protective layer 170. The substrate 110 includes a see-through portion R1 and a peripheral portion R2, and the peripheral portion R2 is located on at least one side of the see-through portion R2. The light shielding layer 120 is disposed on the peripheral portion R2 and located between the peripheral portion R2 and the peripheral lead 140T. The index matching layer 130 is disposed on the substrate 110 and located between the bridging element 140B and the see-through portion R1. In this embodiment, the index matching layer 130 extends to the peripheral portion R2, and the index matching layer 130 is at least partially disposed between the light shielding layer 120 and the peripheral lead 140T, but is not limited thereto. The bridging element 140B is disposed on the index matching layer 130 and above the see-through portion R1. The peripheral lead 140T is disposed on the light shielding layer 120 and located on the peripheral portion R2. The insulating layer 150 includes a first portion 151 covering the peripheral lead 140T, a second portion 152 disposed between the bridging element 140B and the conductive pattern layer 160P, and a second portion 152 including a plurality of Insulating blocks 152P separated from each other. Each of the insulating blocks 152P is located between the bridging element 140B and the first axial electrode 160X to electrically insulate the first axial electrode 160X from the bridging element 140B. The conductive pattern layer 160P is disposed at least partially on the region of the see-through portion R1. In the embodiment, the conductive pattern layer 160P is disposed on the index matching layer 130 and the insulating layer 150. The conductive pattern layer 160P includes the pattern portion 161P and the non-pattern portion. 162P, the pattern portion 161P includes at least one first axial electrode 160X and a plurality of second conductive units 160Y. The first axial electrode 161X is electrically connected to a portion of the peripheral lead 140T, and the adjacent second conductive unit 160Y is transmitted through the bridging element. The 140B is electrically connected, and the second conductive unit 160Y is electrically connected to the peripheral lead 140T of the other portion. The index matching protective layer 170 is overlaid on the conductive pattern layer 160P, and the refractive index matching protective layer 170 is disposed so that the pattern portion The minute 161P matches the refractive index of the non-pattern portion 162P. The features and material characteristics of the components in the touch sensing device 100 of the present embodiment are described in the above manufacturing method, and thus will not be described herein.

In the touch sensing device 100 of the present embodiment, the first portion 151 and the second portion 152 of the same insulating layer 150 are respectively located in the region where the peripheral portion R2 and the see-through portion R1 are located, and the first portion 151 of the insulating layer 150 is in the peripheral portion R2 region. For the function of the protective layer of the peripheral lead 140T, the second portion 152 of the insulating layer 150 serves to insulate the first axial electrode 160X of the conductive pattern layer 160P from the bridging element 140B in the region of the see-through portion R1. In addition, the index matching protective layer 170 is provided to have both an index matching and a protective effect on the conductive pattern layer 160P, whereby two uses can be achieved by the same element arrangement, so that the process steps and structures can be simplified. Further, in the present embodiment, the conductive pattern layer 160P forms a protective effect with the index matching protective layer 170, and the peripheral lead 140T forms a protective effect with the first portion 151 of the insulating layer 150. In addition, before the formation of the conductive pattern layer 160P, the peripheral lead 140T is mostly covered by the first portion 151 of the insulating layer 150, and the insulating layer 150 can protect the peripheral lead 140T, so that the process pair for forming the conductive pattern layer 160P can be reduced. The formed peripheral lead 140T has an effect, thereby improving the yield.

The different embodiments of the present invention are described below, and the following description is mainly for the sake of simplification of the description of the embodiments, and the details are not repeated. In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

Please refer to Figure 7. FIG. 7 is a schematic diagram of a touch sensing device according to a second preferred embodiment of the present invention. As shown in FIG. 7 , the difference between the touch sensing device 200 of the present embodiment and the first preferred embodiment is that the touch sensing device 200 further includes a display panel 290 and a bonding layer 280 . The bonding layer 280 is disposed between the display panel 290 and the index matching protective layer 170. In other words, the manufacturing method of the touch sensing device 200 of the present embodiment further includes providing the display panel 290, and forming a bonding layer 280 between the index matching protective layer 170 and the display panel 290 for bonding the display panel 290. With the substrate 110. The display panel 290 may include a liquid crystal display panel, an organic light emitting diode (OLED) display panel, an electro-wetting display panel, an e-ink display panel, a plasma display panel, or a single emission. (FED) display panel, but not limited to this. The bonding layer 280 can include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), or other suitable bonding material. In addition, it should be noted that in the present embodiment, the material properties of the index matching protective layer 170 may be adjusted in accordance with the refractive index of the materials on the upper and lower sides of the respective layers. For example, when the conductive pattern layer 160P has a refractive index n _T , the index matching protective layer 170 has a refractive index n ₂ , and the bonding layer 280 has a refractive index n _P , then n _{2 is} preferably substantially equal to n _P The product of n _T is the root number, which is n ₂ ≒ (n _P *n _T ), thereby achieving the effect of refractive index matching to reduce the visibility of the conductive pattern layer 160P, but is not limited thereto. In addition, the touch sensing device 200 of the present embodiment can be regarded as a touch display device, and the display panel 290 and the bonding layer 280 of the embodiment can be disposed as needed in subsequent embodiments.

Please refer to Figure 8 and Figure 9. FIG. 8 is a schematic diagram of a touch sensing device according to a third preferred embodiment of the present invention. Fig. 9 is a schematic cross-sectional view taken along line B-B' in Fig. 8. As shown in FIG. 8 and FIG. 9 , the touch sensing device 300 of the present embodiment includes a substrate 110 , a light shielding layer 120 , an index matching layer 130 , a bridging element 140B , a peripheral lead 140T , an insulating layer 350 , and a conductive pattern. Layer 160P and index matching protective layer 170. The insulating layer 350 is disposed on the index matching layer 130, the bridging element 140B and the peripheral lead 140T, and the insulating layer 350 directly contacts the peripheral lead 140T and the bridging element 140B. The insulating layer 350 includes a first portion 351 covering the peripheral lead 140T and a second portion 352 disposed between the bridging element 140B and the conductive pattern layer 160P. The difference from the first preferred embodiment described above is that the insulating layer 350 of the present embodiment is formed on the substrate 110 in a full-coverage manner, and the first portion 351 of the insulating layer 350 includes a plurality of first openings 351V, and is insulated. Layer 350 The second portion 352 includes at least one second opening 352V. The first opening 351V exposes at least a portion of the peripheral lead 140T, and the conductive pattern layer 160P is electrically connected to the peripheral lead 140T through the first opening 351V. The bridging element 140B is electrically connected to the adjacent second conductive unit 160Y through the second opening 352V. In addition to the shape and distribution of the insulating layer 350, the touch sensing device 300 of the present embodiment has similar arrangement positions, material characteristics, and manufacturing methods of the components, and is similar to the above-described first preferred embodiment, and therefore will not be described herein. .

It should be noted that, in the above embodiments, the bridging element 140B may be formed by patterning a transparent conductive material, but not limited thereto, by forming the bridging element in the see-through portion R1 with a transparent conductive material. 140B, the recognizability of the bridging element 140B in the see-through portion R1 can be further reduced, thereby achieving the purpose of improving visual appearance.

Please refer to Figure 10 and Figure 11. FIG. 10 is a schematic diagram of a touch sensing device according to a fourth preferred embodiment of the present invention. Fig. 11 is a schematic cross-sectional view taken along line C-C' in Fig. 10. As shown in FIG. 10 and FIG. 11 , the touch sensing device 400 of the present embodiment includes a substrate 110 , a bridging element 140B , a peripheral lead 140T , an insulating layer 150 , a conductive pattern layer 160P , and an index matching protective layer 170 . That is to say, the touch sensing device 400 of the present embodiment does not include a light shielding layer and an index matching layer, as compared with the first preferred embodiment. Therefore, the manufacturing method of the touch sensing device 400 of the embodiment includes the following steps. First, a substrate 110 is provided. The substrate 110 includes a see-through portion R1 and a peripheral portion R2, and the peripheral portion R2 is located on at least one side of the see-through portion R1. Then, a peripheral lead 140T is formed on the peripheral portion R2, and a bridging element 140B is formed on the see-through portion R1. Thereafter, a conductive pattern layer 160P is formed on the see-through portion R1. The conductive pattern layer 160P includes a pattern portion 161P and a non-pattern portion 162P. The pattern portion 161P includes at least one first axial electrode 160X and a plurality of second conductive units 160Y, first The axial electrode 160X is electrically connected to a portion of the peripheral lead 140T, the adjacent second conductive unit 160Y is electrically connected through the bridge member 140B, and the second conductive unit 160Y is electrically connected to the other portion of the peripheral lead 140T. Then, an insulating layer 150 is formed, The insulating layer 150 includes a first portion 151 overlying the perimeter lead 140T and a second portion 152 disposed between the bridging element 140B and the conductive pattern layer 160P. Finally, an index matching protective layer 170 is formed over the conductive pattern layer 160P, and the index matching protective layer 170 covers the see-through portion R1. The touch sensing device 400 of the present embodiment may be formed of a transparent conductive material except that the light shielding layer and the index matching layer are not provided, so that the visibility of the peripheral lead 140T is lowered, and the bridging element 140B may be transparent or The non-transparent conductive material is formed. When the peripheral lead 140T and the bridging element 140B are made of the same material, the peripheral lead 140T and the bridging element 140B can be formed in the same step. The arrangement positions, material characteristics, and manufacturing methods of the other components are similar to those of the first preferred embodiment described above, and thus are not described herein again. In the present embodiment, the second portion 152 of the insulating layer 150 includes a plurality of insulating blocks 152P separated from each other. However, in another embodiment, the insulating layer 150 may also be as in the third embodiment (such as FIG. 8 and FIG. 9). The structure shown in the figure, that is, the insulating layer 350 is formed on the substrate 110 in a full-coverage manner, and the first portion of the insulating layer 350 includes a plurality of first openings, and the second portion of the insulating layer 350 includes at least one second opening.

In summary, the touch sensing device of the present invention and the manufacturing method thereof use a single insulating layer to simultaneously cover the peripheral leads of the bridging element and the peripheral portion respectively located in the see-through portion region, and the first portion of the insulating layer is used in the peripheral portion. The second portion of the insulating layer serves to insulate the first axial electrode of the conductive pattern layer from the bridging element in the see-through portion as a function of the protective layer of the peripheral lead. In addition, the index matching protective layer has both an index matching and a protective effect on the conductive pattern layer, whereby two purposes of use can be achieved by the arrangement of the same element, so that the process steps and structures can be simplified. In addition, the refractive index matching protective layer can be used to cover the peripheral leads without using a complicated and costly lithography etching process, thereby achieving the simplification of the process.

100‧‧‧Touch sensing device

110‧‧‧Substrate

120‧‧‧ shading layer

130‧‧‧index matching layer

140‧‧‧metal layer

140B‧‧‧Bridge components

140T‧‧‧ peripheral leads

150‧‧‧Insulation

151‧‧‧Part 1

151V‧‧‧first opening

152‧‧‧Part II

160‧‧‧Transparent conductive layer

160P‧‧‧ conductive pattern layer

170‧‧‧index matching protective layer

R1‧‧‧ Perspective

R2‧‧‧ peripherals

Z‧‧‧Vertical projection direction

Claims (25)

A touch sensing device includes: a substrate comprising a see-through portion and a peripheral portion, the peripheral portion being located on at least one side of the see-through portion; a peripheral lead disposed on the peripheral portion; a bridging element disposed on the On the see-through portion, an index matching layer is disposed between the bridging element and the see-through portion; a conductive pattern layer is disposed on the see-through portion, the conductive pattern layer includes a pattern portion and a non-pattern portion, The pattern portion includes at least one first axial electrode and a plurality of second conductive units. The first axial electrode is electrically connected to a portion of the peripheral lead, and the second conductive unit is electrically connected through the bridging element. And the second conductive unit is electrically connected to the peripheral lead of the other portion; an insulating layer includes a first portion and a second portion, the first portion covers the peripheral lead, and the second portion Provided between the bridging element and the conductive pattern layer; and an index matching protective layer overlying the conductive pattern layer, and the refractive index matching protective layer is disposed such that Case portion matches the refractive index of the non-patterned portion. The touch sensing device of claim 1, further comprising a light shielding layer disposed between the peripheral portion and the peripheral lead. The touch sensing device of claim 1, wherein the index matching layer extends further to the peripheral portion, and the index matching layer is at least partially disposed between the light shielding layer and the peripheral lead. The touch sensing device of claim 1, wherein the substrate has a refractive index n _S , the index matching layer has a refractive index n ₁ , the conductive pattern layer has a refractive index n _T , and n ₁ is equal to The product of n _S and n _T is the root number. The touch sensing device of claim 1, further comprising a display panel and a bonding layer, wherein the bonding layer is disposed between the display panel and the index matching protective layer. The touch sensing device of claim 5, wherein the conductive pattern layer has a refractive index n _T , the index matching protective layer has a refractive index n ₂ , and the adhesive layer has a refractive index n _P , and n ₂ is equal to the product of n _P and n _T opening the root number. The touch sensing device of claim 1, wherein the index matching protective layer comprises a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ). The touch sensing device of claim 1, wherein the index matching layer comprises a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ) or a bismuth pentoxide (Nb ₂ O ₅ ) A two-layer structure composed of cerium oxide (SiO ₂ ). The touch sensing device of claim 1, wherein the first portion of the insulating layer comprises at least one first opening, the first opening is at least partially exposed to the peripheral lead, and the conductive pattern layer is transmitted through the first The opening is electrically connected to the peripheral lead. The touch sensing device of claim 1, wherein the second portion of the insulating layer comprises a plurality of insulating blocks separated from each other, each insulating block being located between the bridging element and the first axial electrode The first axial electrode and the bridging element are electrically insulated from each other. The touch sensing device of claim 1, wherein the second portion of the insulating layer comprises a plurality of second openings, and the bridging element is electrically connected to the adjacent second conductive units through the second openings . The touch sensing device of claim 1, wherein the bridging element has the same conductive material as the peripheral lead. A method for manufacturing a touch sensing device includes the steps of: providing a substrate, the substrate comprising a see-through portion and a peripheral portion, wherein the peripheral portion is located on at least one side of the see-through portion; and forming a portion on the peripheral portion a peripheral lead; forming a bridging element on the see-through portion; forming an index matching layer between the bridging element and the see-through portion; forming a conductive pattern layer on the see-through portion, the conductive pattern layer comprising a pattern portion and a non-pattern portion, the pattern portion includes at least one first axial electrode and a plurality of second conductive units, the first axial electrode being electrically connected to a portion of the peripheral lead, adjacent to the second conductive unit The bridging elements are electrically connected, and the second conductive units are electrically connected to the peripheral lead of another portion; forming an insulating layer, the insulating layer includes a first portion and a second portion, the first portion is covered by The second portion is disposed between the bridging element and the conductive pattern layer; and an index matching protective layer is formed over the conductive pattern layer On, and the refractive index of the protective layer is provided so that the matching portion of the pattern matches the refractive index of the non-patterned portion. The manufacturing method of claim 13, further comprising forming a light shielding layer between the peripheral portion and the peripheral lead. The method of claim 13, wherein the index matching layer extends further to the peripheral portion, and the index matching layer is at least partially located between the light shielding layer and the peripheral lead. The method of claim 13, wherein the substrate has a refractive index n _S , the refractive index matching layer has a refractive index n ₁ , the conductive pattern layer has a refractive index n _T , and n ₁ is equal to n _S and The product of n _T is the root number. The method of claim 13, further comprising: providing a display panel; forming a bonding layer between the index matching protective layer and the display panel for bonding the display panel and the substrate. The method of claim 17, wherein the conductive pattern layer has a refractive index n _T , the index matching protective layer has a refractive index n ₂ , the bonding layer has a refractive index n _P , and n ₂ is equal to n The product of _P and n _T is the root number. The method of claim 13, wherein the index matching protective layer comprises a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ). The method of claim 13, wherein the index matching layer comprises a compound of titanium dioxide (TiO ₂ ) and cerium oxide (SiO ₂ ) or a cerium oxide (Nb ₂ O ₅ ) and cerium oxide. A two-layer structure composed of (SiO ₂ ). The method of claim 13, wherein the first portion of the insulating layer further comprises at least one first opening, the first opening is at least partially exposed to the peripheral lead, and the conductive pattern layer is transmitted through the first opening The peripheral leads form an electrical connection. The method of claim 13, wherein the second portion of the insulating layer comprises a plurality of insulating blocks separated from each other, each insulating block being located between the bridging element and the first axial electrode to enable the first An axial electrode is electrically insulated from the bridging element. The method of claim 13, wherein the first portion of the insulating layer comprises a plurality of second openings, and the bridging elements are electrically connected to the adjacent second conductive units through the second openings. The manufacturing method according to claim 13, wherein the index matching protective layer is formed by a convex plate in a transfer manner. The method of claim 13, wherein the bridging element and the peripheral lead are formed by a patterning process of the same conductive material.