TWI614797B - Electronic device and manufacturing method thereof - Google Patents

Abstract

The invention provides an electronic device, which includes a substrate, a retaining wall, and a patterned protective layer. The retaining wall is disposed on the substrate, wherein the retaining wall is formed by an exposure lithography process. The patterned protective layer is disposed on the substrate. The patterned protective layer is formed by a spray printing process, and the material of the patterned protective layer has flowability before being cured. The patterned protective layer includes a first protective pattern. And one side wall of the retaining wall is in contact with the first protection pattern.

Description

Electronic device and manufacturing method thereof

The invention relates to an electronic device and a manufacturing method thereof, in particular to a manufacturing method using an inkjet printing process and an electronic device manufactured by the method.

With the rapid development of semiconductor technology, electronic devices (such as touch panels, touch display devices, image sensing devices, etc.) have the advantages of small size, light weight, and low power consumption, and are widely used in many consumer products. Electronic products include, for example, mobile phones, GPS navigator systems, tablet PCs, and laptop PCs. In recent years, some patterning processes have been replaced by inkjet processes. The inkjet process has the advantage of directly forming the material at a specified location, and can greatly improve the disadvantage of waste of consumables. However, the raw materials used in the inkjet printing process have a certain degree of fluidity, which is likely to be further extended or diffused by capillary phenomena due to the characteristics of the substrate surface, which cannot effectively control the range of material formation, and thus cannot meet specific design specifications.

One of the main objectives of the present invention is to provide an electronic device and a method for manufacturing the same, which can be used to manufacture a retaining wall without additional process steps, so as to effectively control the material forming range of the printing process.

To achieve the above object, an embodiment of the present invention provides an electronic device including a substrate, a retaining wall, and a patterned protective layer. The retaining wall is disposed on the substrate, wherein the retaining wall is formed by an exposure lithography process. The patterned protective layer is disposed on the substrate. The patterned protective layer is formed by a spray printing process, and the material of the patterned protective layer has flowability before being cured. The patterned protective layer includes a first protective pattern. And one side wall of the retaining wall is in contact with the first protection pattern.

To achieve the above object, an embodiment of the present invention provides a method for manufacturing an electronic device, including the following steps. A substrate is provided, and an insulating layer is formed on the substrate. An exposure lithography process is performed to form a patterned insulating layer on the substrate, wherein the patterned insulating layer includes a retaining wall. A spray printing process is performed to form a patterned protective layer on the substrate, and the material of the patterned protective layer has flowability before being cured, wherein the patterned protective layer includes a first protective pattern and one of the retaining walls The side wall is in contact with the first protection pattern. A curing process is performed on the flowable patterned protective layer.

Regarding the above-mentioned electronic device of the present invention and its manufacturing method, the preferred embodiments of the present invention are enumerated below, and the accompanying drawings are used to describe in detail the composition of the electronic device of the present invention and its manufacturing method, and the desired effect. .

Please refer to Figure 1 to Figure 7. FIG. 1 to FIG. 5 are schematic diagrams of a method for manufacturing an electronic device according to an embodiment of the present invention, FIG. 6 is a flowchart of steps of the method for manufacturing an electronic device according to the present invention, and FIG. A schematic plan view of the electronic device. FIG. 5 is a schematic cross-sectional view taken along the line AA ′ in FIG. 7. In order to facilitate the description and clearly show the features of the present invention, the drawings of the present invention are only schematic and depict some elements and structures to make it easier to understand the present invention. The detailed quantity, size, proportion or position of each element can be according to the design. Needs are adjusted. The manufacturing method of the electronic device in this embodiment is an example of manufacturing a touch panel, and the touch sensing electrodes of the touch panel have a double-layer induction structure and a plurality of diamond electrode pads connected in series. For limitation, the manufacturing method of the present invention can also be applied to manufacturing other types of electronic devices. First, as shown in FIG. 1, a substrate 100 is provided. The substrate 100 defines a viewing area R1 and a surrounding area R2. The surrounding area R2 is located on at least one side of the viewing area R1 and includes a bonding area BA. For example, The surrounding area R2 of this embodiment is arranged around the periphery of the visible area R1, as shown in FIG. 7, but is not limited thereto. The substrate 100 in this embodiment may include a glass substrate, a plastic substrate, a glass film, a plastic film, a light-transmissive cover plate, a substrate for a display, or other suitable materials or substrates. Next, a decoration layer 102 is formed on the substrate 100, and the pattern of the decoration layer 102 is substantially the same as that of the surrounding area R2. The material of the decoration layer 102 may include ceramics, organic materials, mixtures of organic materials and inorganic materials, or organic-inorganic hybrid compounds, which may be a single-layer structure or a multi-layer stack structure for shielding undesired objects in electronic devices. Element or light. For example, the material of the decoration layer 102 in this embodiment may be a photosensitive resin (such as a colored photoresist) or a non-photosensitive resin (such as an ink). In addition, in this embodiment, one or more openings 104 may be selectively formed in the decoration layer 102. The openings 104 may be used to set the position of a camera lens or an infrared light detector, but the purpose is not the same. Limited. Next, a first patterned conductive layer 106 is formed on the substrate 100 and the decoration layer 102. The first patterned conductive layer 106 in this embodiment includes a plurality of bonding pads 1061 and a plurality of first touch sensing electrodes 1062. In other words, the bonding pad 1061 is integrated in the manufacturing process of the touch element, and at least a part of the touch element and the bonding pad 1061 are made of the same patterned conductive layer. For convenience of illustration, only one bonding pad 1061 and one first touch sensing electrode 1062 are shown in FIGS. 1 to 5. The bonding pad 1061 is disposed on the decoration layer 102 in the bonding area BA. The first touch sensing electrode 1062 is disposed on the substrate 100 and at least in the visible region R1, and can further extend to the decoration layer 102 of the surrounding region R2 (not shown). The first touch sensing electrode 1062 in this embodiment is an electrode string extending along the first direction D1, and includes a wider electrode pad P1 and a narrower bridge line B1. The bridge line B1 is provided in two phases. Between adjacent electrode pads P1, but not limited to this.

Next, an insulating layer 108 is formed on the substrate 100 and covers the decoration layer 102 and the first patterned conductive layer 106. The insulating layer 108 in this embodiment is a photoresist material layer, such as an acrylic photoresist material layer, but is not limited thereto. Then, an exposure lithography process 110 is performed on the insulating layer 108 to form a patterned insulating layer 112 as shown in FIG. 2. The patterned insulating layer 112 in this embodiment includes a first retaining wall 1121, a second retaining wall 1122, and a plurality of insulating patterns 1123. The first retaining wall 1121 is provided along the boundary of the joint area BA. For example, a part of the first retaining wall 1121 is disposed on a part of the joint pad 1061 close to the visible area R1 and located in the joint area BA, and the other part of the first The retaining wall 1121 is disposed on the decoration layer 102 and is located outside the bonding area BA. However, the manner in which the first retaining wall 1121 is disposed on the bonding pad 1061 or the decoration layer 102 is not limited to this embodiment, and may be appropriately adjusted according to design requirements. On the other hand, the second retaining wall 1122 is disposed on the decoration layer 102 and is disposed along the outer edge of the opening 104. The height H of the first retaining wall 1121 and the second retaining wall 1122 ranges from about 1 micrometer to about 2 microns, and the width W of the bottom of the first retaining wall 1121 and the second retaining wall 1122 ranges from about 0.1 millimeters, but not more than This is limited. In addition, the insulating pattern 1123 is disposed on at least the first touch sensing electrode 1062 and covers the upper surface and the two sidewalls of the bridge line B1, but is not limited thereto. In other variant embodiments, the insulating pattern 1123 of the patterned insulating layer 112 may also cover the entire first patterned conductive layer 106 in the visible area R1, that is, the first touch sensing electrode in the visible area R1 is completely covered. 1062. For convenience of illustration, FIG. 2 to FIG. 5 only show one insulating pattern 1123.

Next, as shown in FIG. 3, a second patterned conductive layer 113 is formed on the substrate 100 and includes a plurality of second touch sensing electrodes 114. For convenience of illustration, FIG. 3 to FIG. 5 only show a second touch sensing electrode 114. The second touch-sensing electrode 114 is disposed on the substrate 100 and at least in the visible region R1, and can further extend to the decoration layer 102 in the surrounding region R2. The second touch sensing electrode 114 in this embodiment is an electrode string extending along the second direction D2, and includes a wider electrode pad P2 and a narrower bridge line B2. The bridge line B2 is provided in two phases. Between adjacent electrode pads P2, the first touch sensing electrode 1062 and the second touch sensing electrode 114 in this embodiment have at least one overlapping area OA in a direction V perpendicular to the surface of the substrate 100, In the area OA, the bridge line B1 and the bridge line B2 overlap each other, and the insulating pattern 1123 is disposed at least in the overlap area OA, and is located on the first touch sensing electrode 1062 and the second in a direction V perpendicular to the surface of the substrate 100. The touch sensing electrodes 114 prevent the first touch sensing electrode 1062 and the second touch sensing electrode 114 from contacting each other and being electrically conductive.

The touch element in this embodiment includes a first touch sensing electrode 1062 and a second touch sensing electrode 114. The method for manufacturing the touch element and the bonding pad 1061 is not limited to the method in this embodiment. In a variant embodiment, the first patterned conductive layer 106 formed first includes a bridge line B1 of the bonding pad 1061 and the first touch sensing electrode 1062, and the second patterned conductive layer 113 formed subsequently includes a first contact The electrode pad P1 of the control sensing electrode 1062 and the electrode pad P2 and the bridge line B2 of the second touch sensing electrode 114. In another modified embodiment, the first patterned conductive layer 106 formed first includes a bonding pad 1061, an electrode pad P1 of the first touch sensing electrode 1062, and an electrode pad P2 of the second touch sensing electrode 114 and a bridge. Line B2, and the second patterned conductive layer 113 formed subsequently includes a bridge line B1 of the first touch sensing electrode 1062. In addition, in the above modified embodiment, the patterned insulating layer 112 preferably includes a plurality of insulating patterns 1123, which are respectively disposed in the overlapping area OA of the first touch sensing electrode 1062 and the second touch sensing electrode 114, and Each of the insulating patterns 1123 exposes at least two ends of the bridge line B1 of the first touch sensing electrode 1062 in the extending direction, so that adjacent electrode pads P1 can be electrically connected by the bridge line B1.

The materials of the first patterned conductive layer 106 and the second patterned conductive layer 113 in this embodiment may include transparent conductive metal oxides such as indium tin oxide (ITO), indium zinc oxide (IZO) Or aluminum zinc oxide (AZO) or other suitable transparent conductive materials; in addition, the first patterned conductive layer 106 and the second patterned conductive layer 113 may also be, for example, nanometer metal wires, grid-like metal layers It may be formed of other non-transparent conductive materials, or may be formed by overlapping transparent conductive metal oxides with non-transparent conductive materials such as mesh metal, and is not limited to being solely made of transparent conductive materials or non-transparent conductive materials form.

Next, as shown in FIG. 4, one or more wires 116 are formed on the decoration layer 102, wherein only one wire 116 is shown in FIGS. 4 and 5 as a schematic diagram. The lead 116 is disposed in the surrounding area R2, for example, between the bonding area BA and the visible area R1. One end of the lead 116 is connected to the bonding pad 1061, and the other end is connected to the first touch sensing electrode 1062 or the second touch sense. The sensing electrodes 114 are connected, whereby the first touch sensing electrode 1062 or the second touch sensing electrode 114 can be electrically connected to the bonding pad 1061 through the wire 116, so that the first touch sensing electrode 1062 or the second touch The signal of the control sensing electrode 114 can be transmitted to the external circuit or other electronic components for further processing through the bonding pad 1061. The lead 116 in this embodiment is exemplified by including a metal material, such as silver, but is not limited thereto. The material of the wire 116 may include non-transparent conductive materials such as silver, aluminum, copper, magnesium, molybdenum, chromium, titanium, a composite layer of the above materials, or an alloy of the above materials, or include materials such as indium tin oxide, indium zinc oxide, or aluminum oxide. Transparent conductive materials such as zinc, but not limited to this. In other variant embodiments, the conductive line 116 and the first touch sensing electrode 1062 or the second touch sensing electrode 114 may also be formed directly from the same material, for example, in forming the first patterned conductive layer 106 or the second patterned The conductive layer 113 also forms a conductive line 116. In addition, the conductive wire 116 may also include materials such as conductive particles, nano carbon tubes, nano metal wires (such as nano silver wires), graphene, or silene.

Next, as shown in FIG. 5, a patterned protective layer 118 is formed on the substrate 100 and includes a first protective pattern 1181 and a plurality of second protective patterns 1182. For convenience of illustration, FIG. 5 only shows a second protection pattern 1182. The first protection pattern 1181 and the second protection pattern 1182 are formed in a predetermined position on the substrate 100 by an inkjet process. The first protection pattern 1181 is disposed in the surrounding area R2 and is located on the decoration layer 102, and a part of the first protection pattern 1181 is also disposed on the wire 116. It should be noted that the first protection pattern 1181 does not cover the bonding area BA. Within the bonding pads 1061. In addition, at the boundary of the bonding area BA and the periphery of the opening 104, the side wall S of the first retaining wall 1121 and the second retaining wall 1122 is in direct contact with the first protection pattern 1181. In other words, the first retaining wall 1121 protects the first protection The pattern 1181 is isolated outside the bonding area BA, and the second retaining wall 1122 isolates the first protection pattern 1181 outside the opening 104. In addition, the second protection pattern 1182 is disposed in the overlapping area OA in the visible area R1 and covers at least the first touch sensing electrode 1062 and the second touch sensing electrode 114 in the overlap area OA. The first protective pattern 1181 and the second protective pattern 1182 can prevent the decorative layer 102, the conductive wire 116, the first touch sensing electrode 1062, and the second touch sensing electrode 114 covered by it from being scratched during subsequent processes or assembly. Injury, etc. The material of the patterned protective layer 118 includes a photoresist material added with a specific solvent to make it flowable to be suitable for a printing process. For example, the material of the patterned protective layer 118 may be an acrylic photoresist material, and a solvent of propylene glycol methyl ether acetate (PGMEA) is added to reduce the overall viscosity, but not limited thereto. After the patterned protective layer 118 is formed on a predetermined position of the substrate 100 by a spray printing process, a curing process is performed on the patterned protective layer 118 having flowability to cure the first protective pattern 1181 and the second protective pattern 1182. . In the curing process of this embodiment, the material can be cured by UV light or baking, but is not limited thereto.

It can be known from the above that the first protection pattern 1181 and the second protection pattern 1182 in this embodiment are formed by a printing process, and the materials are flowable before being cured, and the first protection pattern 1181 and the second protection pattern The fluidity of 1182 is related to the underlying material. For example, the lead 116 of this embodiment is connected to the bonding pad 1061. When the first retaining wall 1121 is not provided, the printed first protection pattern 1181 on the lead 116 may overflow due to capillary phenomenon. It flows onto the bonding pad 1061 in the bonding area BA. However, the bonding pad 1061 in the bonding area BA is used for electrical connection with external circuits or other electronic components, so it needs good conductivity. Once the first protection pattern 1181 overflows on the bonding pad 1061, it covers the surface of the bonding pad 1061. , Will affect the bonding effect of the bonding pad 1061. Therefore, in this embodiment, the first retaining wall 1121 is formed along the boundary of the bonding area BA before the inkjet printing process, which can effectively prevent the first protection pattern 1181 from overflowing onto the bonding pad 1061 before being cured to ensure bonding. The pad 1061 is not covered with an insulating material. On the other hand, the opening 104 in this embodiment provides a position for subsequent setting of a camera lens or an infrared light detector. Therefore, a second retaining wall 1122 is formed along the outer edge of the opening 104 before the printing process is performed, which is effective. In order to prevent the first protection pattern 1181 from overflowing into the opening 104 before being cured, the first protection pattern 1181 may block the opening 104 or reduce the light transmittance of the opening 104. In addition, the first retaining wall 1121 and the second retaining wall 1122 of this embodiment belong to the same patterned insulation layer 112 as the insulation pattern 1123, and can be integrated with the inherent bridge line insulation pattern (insulation pattern 1123) process without the need for additional The photomask can be made together without increasing production costs. Furthermore, the position of the first retaining wall 1121 and the second retaining wall 1122 can be more accurately produced by the lithography process, so as to effectively isolate the printed patterned protective layer 118 from flowing to an inappropriate position.

In short, in the manufacturing method of this embodiment, at least one film layer (for example, an insulating layer, a dielectric layer, a protective layer, etc.) is selected as a patterning process (for example, an insulating layer, a dielectric layer, a protective layer, etc.) in the manufacturing process of an inherent electronic device. Exposure lithography process, lithography etching process, etc.), set up retaining walls around areas that need to be exposed or do not want to form the materials used in the printing process, and effectively control the material overflow of the printing process without increasing production costs Status of the stream. In addition, the manufacturing method of this embodiment is not limited to manufacturing a touch panel, and can also be applied to manufacturing methods of other electronic devices (such as a display panel or an image sensor) using a printing process.

In summary, the manufacturing method of the electronic device of the present invention mainly includes the steps shown in FIG. 6:

Step S10: providing a substrate;

Step S12: forming an insulating layer on the substrate;

Step S14: performing an exposure lithography process to form a patterned insulating layer on the substrate, wherein the patterned insulating layer includes a retaining wall;

Step S16: Perform a spray printing process to form a patterned protective layer on the substrate, and the material of the patterned protective layer has flowability before being cured, wherein the patterned protective layer includes a first protective pattern, and the One side wall of the wall is in contact with the first protection pattern; and

Step S18: performing a curing process on the patterned protective layer having flowability.

Please refer to Figure 7 and Figure 5 together. The present invention provides an electronic device manufactured according to the method of the foregoing embodiment, and the electronic device of this embodiment uses a touch panel as an example, but is not limited thereto, and may also be an electronic device such as a display panel or an image sensor. Device. The structure of the touch panel in this embodiment is described as follows. As shown in FIGS. 5 and 7, the electronic device 1 of this embodiment includes a substrate 100, a decoration layer 102 (not shown in FIG. 7), a patterned insulating layer 112, a patterned protective layer 118, and a first patterned pattern. The conductive layer 106, the second patterned conductive layer 113, and the plurality of conductive lines 116. The substrate 100 defines a viewing area R1 and a surrounding area R2. The surrounding area R2 is located on at least one side of the viewing area R1 and includes a bonding area BA. The decoration layer 102 is disposed in the peripheral region R2 of the substrate 100 and optionally has an opening 104. The electronic device 1 of this embodiment further includes a plurality of touch elements, which are disposed on the substrate 100 and at least within the visible region R1. At least a part of the touch elements and the bonding pad 1062 are formed of the same patterned transparent conductive layer. . For example, the first patterned conductive layer 106 in this embodiment includes a first touch sensing electrode 1062 and a bonding pad 1061, and the second patterned conductive layer 113 includes a second touch sensing electrode 114. Limited. In a variant embodiment, the first patterned conductive layer 106 may include the bridge line B1 and the bonding pad 1061 of the first touch sensing electrode 1062, and the second patterned conductive layer 113 includes the first touch sensing electrode 1062 The electrode pad P1 and the electrode pad P2 of the second touch sensing electrode 114 and the bridge line B2. In another modified embodiment, the first patterned conductive layer 106 includes a bonding pad 1061, an electrode pad P1 of the first touch sensing electrode 1062, an electrode pad P2 of the second touch sensing electrode 114, and a bridge line B2. The second patterned conductive layer 113 includes a bridge line B1 of the first touch sensing electrode 1062. In the above modified embodiment, the electrode pads P1 of the adjacent first touch-sensing electrodes 1062 are electrically connected through the bridge line B1 of the first touch-sensing electrode 1062 of another patterned conductive layer. In addition, the bonding pad 1061 of this embodiment is disposed on the decoration layer 102 in the bonding area BA. The first touch sensing electrode 1062 and the second touch sensing electrode 114 are both disposed on the substrate 100 and at least in the visible area. Within R1, and can extend to the surrounding area R2. The first touch-sensing electrode 1062 and the second touch-sensing electrode 114 respectively extend in two non-parallel directions, and the first touch-sensing electrode 1062 and the second touch-sensing electrode 114 are perpendicular to the substrate surface. The direction V has a plurality of overlapping portions, and is provided in the overlapping area OA. For example, the first touch sensing electrode 1062 may extend along the first direction D1, the second touch sensing electrode 114 may extend along the second direction D2, and the first direction D1 is not parallel to the second direction D2, for example The two are perpendicular to each other, but not limited to this. The lead 116 is disposed on the decoration layer 102 and is located between the bonding area BA and the visible area R1. One end of the lead 116 is connected to the bonding pad 1061, and the other end is connected to the first touch sensing electrode 1062 or the second touch sense. The measuring electrode 114 is connected. Thereby, the wire 116 electrically connects the first touch sensing electrode 1062 or the second touch sensing electrode 114 to the corresponding bonding pad 1061, respectively. The wire 116 in this embodiment is an opaque wire, but is not limited thereto. In other variant embodiments, the conductive line 116 may have the same material as the first patterned conductive layer 106 and the second patterned conductive layer 113, such as a transparent conductive material. The first touch-sensing electrode 1062 and the second touch-sensing electrode 114 in this embodiment include a plurality of rhombus electrodes connected in series, but the shape is not limited to the rhombus, but may be rectangular, triangular, or other Suitable geometry. In addition, the touch element in this embodiment includes a double-layered induction structure composed of a first touch sensing electrode 1062 and a second touch sensing electrode 114, but is not limited thereto. In other variant embodiments, the touch element may also be a one-layer sensor (OLS) structure.

The patterned insulating layer 112 includes an insulating pattern 1123 (not shown in FIG. 7), a first retaining wall 1121 and a second retaining wall 1122. The insulating patterns 1123 are respectively disposed at least in the overlapping areas OA, and are located between the first touch sensing electrode 1062 and the second touch sensing electrode 114 in a direction V perpendicular to the surface of the substrate 100 to avoid the first touch sensing The electrode 1062 and the second touch sensing electrode 114 are in contact with each other and are electrically conductive. In addition, the insulating pattern 1123 of the patterned insulating layer 112 in this embodiment may also cover the entire first touch sensing electrode 1062 in the visible area R1. The first retaining wall 1121 is provided along the boundary of the joining area BA. A part of the first retaining wall 1121 is provided on the joining pad 1061 on one side of the joining area BA adjacent to the visible area R1, and the remaining first retaining wall 1121 is It is disposed on the decoration layer 102 and adjacent to the bonding pad 1061, for example, on the periphery of the bonding pad 1061. The second retaining wall 1122 is disposed along the outer edge of the opening 104, and the second retaining wall 1122 is disposed on the decorative layer. The height H of the first retaining wall 1121 and the second retaining wall 1122 in this embodiment ranges from about 1 micrometer to about 2 microns, and the width W of the bottom of the first retaining wall 1121 and the second retaining wall 1122 ranges from about 0.1 millimeters. , But not limited to this. The material of the patterned insulating layer 112 in this embodiment is a photoresist material and is formed by an exposure lithography process, but is not limited thereto.

The patterned protection layer 118 is disposed on the substrate 100 and includes a first protection pattern 1181 and a second protection pattern 1182. The first protection pattern 1181 is provided in the peripheral region R2, and the second protection pattern 1182 is provided in the visible region R1. A portion of the first protection pattern 1181 is provided on the wire 116, and the remaining portions of the first protection pattern 1181 are provided. 1181 is disposed on the decoration layer 102. The second protection pattern 1182 is disposed in the overlapping area OA in the visible area R1 and covers at least the first touch sensing electrode 1062 and the second touch sensing electrode 114 in the overlap area OA. In addition, at the boundary of the bonding area BA and the periphery of the opening 104, the side wall S of the first retaining wall 1121 and the second retaining wall 1122 is in direct contact with the first protection pattern 1181. In other words, the first retaining wall 1121 protects the first protection The pattern 1181 is isolated outside the bonding area BA, and the second retaining wall 1122 isolates the first protection pattern 1181 outside the opening 104 so that the first protection pattern 1181 does not overflow into the bonding area BA and the opening 104.

The following describes the modified embodiments of the present invention, and to simplify the description, the following description mainly describes the differences between the modified embodiments and the above embodiments, and does not repeat the same points repeatedly. In addition, the same components in the modified embodiments of the present invention as those in the above embodiments are marked with the same reference numerals, so as to facilitate comparison between the embodiments.

Please refer to FIG. 8, which is a schematic cross-sectional view of an electronic device according to a modified embodiment of the present invention. As shown in FIG. 8, this modified embodiment is different from the first embodiment in that the electronic device 2 does not have the opening 104 shown in FIG. 5 and is not provided along the outer edge of the opening as in the previous embodiment. Of the second retaining wall 1122. In addition, the first retaining wall 1121 of this modified embodiment is not provided along the boundary of the joint area BA, but has only one first retaining wall 1121 disposed on one side of the boundary of the joint area BA. In detail, the first retaining wall 1121 is disposed on a side of the bonding area BA near the visible area R1, and the first retaining wall 1121 is disposed on a part of the bonding pad 1061 near the visible area R1, that is, near the bonding pad 1061 and A portion of the junction of the wire 116 is bonded to the pad 1061. Because the problem of the overflow of the first protection pattern 1181 due to the capillary phenomenon is related to the material underneath it, when the material of the first protection pattern 1181 is printed on the wire 116, it will be printed on the surface of the decoration layer 102 than Capillary phenomenon is more likely to occur, that is, it is easier to overflow from the conductive wire 116 onto the bonding pad 1061, thereby affecting the conductive ability of the bonding pad 1061. In view of the above phenomenon, the main spirit of this modified embodiment is to place the first retaining wall 1121 on a part of the bonding pad 1061 near the junction of the bonding pad 1061 and the wire 116 to prevent the first protective pattern 1181 on the wire 116 from overflowing to Within the bonding area BA. However, the method for setting the first retaining wall 1121 in the present invention is not limited to the foregoing embodiment and this modified embodiment. The first retaining wall 1121 may also be provided on two or three sides of the boundary of the joint area BA. In addition, in this modified embodiment, an opening and a second retaining wall may be provided in the surrounding area R2 with reference to the foregoing embodiment.

In summary, according to the electronic device of the present invention and its manufacturing method, the present invention selects a patterning process (such as exposure) of at least one film layer (such as an insulating layer, a dielectric layer, a protective layer, etc.) before performing a printing process. Lithographic process, lithographic etching process, etc.), set a retaining wall around the area that needs to be exposed or does not want to form the materials used in the printing process, and effectively control the material overflow of the printing process without increasing the production cost Status of the stream. In addition, since the present invention selects a patterning process in the inherent process to form a retaining wall, no additional photomask is needed, and the manufacturing cost is not increased. In addition, the manufacturing method of the present invention is not limited to manufacturing a touch panel, and can also be applied to manufacturing methods of other electronic devices (such as a display panel or an image sensor) using a printing process. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

1, 2‧‧‧ electronic devices

100‧‧‧ substrate

102‧‧‧Decorative layer

104‧‧‧ opening

106‧‧‧ the first patterned conductive layer

1061‧‧‧Joint pad

1062‧‧‧First touch sensing electrode

108‧‧‧ Insulation

110‧‧‧ exposure lithography process

112‧‧‧patterned insulation layer

1121‧‧‧First retaining wall

1122‧‧‧Second retaining wall

1123‧‧‧ insulation pattern

113‧‧‧Second patterned conductive layer

114‧‧‧Second touch sensing electrode

116‧‧‧Wire

118‧‧‧patterned protective layer

1181‧‧‧first protection pattern

1182‧‧‧Second Protective Pattern

B1, B2‧‧‧bridge

BA‧‧‧Joint Area

D1‧‧‧ first direction

D2‧‧‧ Second direction

H‧‧‧ height

OA‧‧‧ overlapping area

R1‧‧‧Viewable Area

R2‧‧‧Area around

P1, P2‧‧‧ electrode pads

S‧‧‧ sidewall

S10, S12, S14, S16, S18‧‧‧ steps

V‧‧‧ direction

W‧‧‧Width

FIG. 1 to FIG. 5 are schematic diagrams illustrating a method for manufacturing an electronic device according to an embodiment of the present invention. FIG. 6 is a flowchart of steps in a method for manufacturing an electronic device according to the present invention. FIG. 7 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of an electronic device according to a modified embodiment of the present invention.

1‧‧‧ electronic device

100‧‧‧ substrate

102‧‧‧Decorative layer

104‧‧‧ opening

106‧‧‧ the first patterned conductive layer

1061‧‧‧Joint pad

1062‧‧‧First touch sensing electrode

112‧‧‧patterned insulation layer

1121‧‧‧First retaining wall

1122‧‧‧Second retaining wall

1123‧‧‧ insulation pattern

113‧‧‧Second patterned conductive layer

114‧‧‧Second touch sensing electrode

116‧‧‧Wire

118‧‧‧patterned protective layer

1181‧‧‧first protection pattern

1182‧‧‧Second Protective Pattern

B1, B2‧‧‧bridge

BA‧‧‧Joint Area

H‧‧‧ height

OA‧‧‧ overlapping area

R1‧‧‧Viewable Area

R2‧‧‧Area around

P1, P2‧‧‧ electrode pads

S‧‧‧ sidewall

V‧‧‧ direction

W‧‧‧Width

Claims (20)

An electronic device includes: a substrate, wherein the substrate defines a viewing area and a surrounding area is located on at least one side of the viewing area, the surrounding area includes a bonding area; and a decorative layer is disposed on the surrounding area of the substrate; A bonding pad is disposed on the decorative layer in the bonding area; a retaining wall is disposed on the substrate, and the retaining wall is disposed on a portion of the bonding pad near the visible area, wherein the retaining wall is formed by a Formed by an exposure lithography process; and a patterned protective layer disposed on the substrate, the patterned protective layer is formed by an inkjet process, and the material of the patterned protective layer has Flowability, wherein the patterned protection layer includes a first protection pattern, and a sidewall of the retaining wall is in contact with the first protection pattern. The electronic device according to claim 1, wherein the electronic device further comprises a wire disposed on the decorative layer and located between the bonding area and the visible area, and the wire is electrically connected to the bonding pad, wherein The first protection pattern is disposed on the conductive line. The electronic device according to claim 1, wherein the retaining wall is provided along a boundary of the joint area, a part of the retaining wall is provided on the joint pad, and another part of the retaining wall is provided on the decorative layer and connected with the The bonding pads are adjacent. The electronic device according to claim 1, further comprising a plurality of touch elements disposed on the substrate and at least in the visible area, wherein at least a part of the touch elements and the bonding pad are patterned by the same pattern Consists of a conductive layer. The electronic device according to claim 4, wherein the touch elements include a plurality of first touch sensing electrodes and a plurality of second touch sensing electrodes, the first touch sensing electrodes and the first touch sensing electrodes The two touch sensing electrodes extend along two directions that are not parallel, and the first touch sensing electrodes and the second touch sensing electrodes have a plurality of overlapping areas in a direction perpendicular to the surface of the substrate. And the first touch sensing electrodes and the second touch sensing electrodes are not electrically connected to each other. The electronic device according to claim 5, further comprising a plurality of insulating patterns, which are respectively disposed in the overlapping areas and are located on the first touch sensing electrodes and the second in a direction perpendicular to the surface of the substrate. Between the touch-sensing electrodes, the insulating patterns and the retaining wall are composed of the same patterned insulating layer. The electronic device according to claim 5, wherein the patterned protection layer further includes a plurality of second protection patterns, which are respectively disposed in one of the overlapping areas and cover the first touch sense in the overlapping areas. The measuring electrode and the second touch sensing electrode. The electronic device according to claim 2, wherein the wire is a metal wire. The electronic device according to claim 1, wherein the decorative layer includes an opening, wherein the retaining wall is disposed along an outer edge of the opening, and the retaining wall and the first protection pattern are disposed on the decorative layer. . The electronic device according to claim 1, wherein the height of the retaining wall ranges from about 1 micrometer to about 2 micrometers. The electronic device according to claim 1, wherein the electronic device is a touch panel. An electronic device includes: a substrate, wherein the substrate defines a visible area and a surrounding area is located on at least one side of the visible area; a decoration layer is disposed in the surrounding area of the substrate, and the decoration layer includes an opening A retaining wall provided on the decorative layer, and the retaining wall is provided along the outer edge of the opening, wherein the retaining wall is formed by an exposure lithography process; and a patterned protective layer is provided on the On the decorative layer, the patterned protective layer is formed by an inkjet process, and the material of the patterned protective layer has flowability before being cured, wherein the patterned protective layer includes a first protective pattern And a side wall of the retaining wall is in contact with the first protection pattern. An electronic device manufacturing method includes: providing a substrate, wherein the substrate defines a viewing area and a surrounding area is located on at least one side of the viewing area, the surrounding area includes a bonding area; and a surrounding area is formed on the substrate. A decorative layer; forming a first patterned conductive layer on the substrate, the first patterned conductive layer including a bonding pad disposed on the decorative layer in the bonding area; after forming the first patterned conductive layer Forming an insulating layer on the substrate; performing an exposure lithography process to form a patterned insulating layer on the substrate, wherein the patterned insulating layer includes a retaining wall, and the retaining wall is disposed near the bonding pad A part of the visible area; an inkjet process is performed to form a patterned protective layer on the substrate, and the material of the patterned protective layer has flowability before being cured, wherein the patterned protection The layer includes a first protection pattern, and a side wall of the retaining wall is in contact with the first protection pattern; and A curing process is performed on the patterned protective layer having flowability. The method of manufacturing an electronic device according to claim 13, wherein the method of manufacturing the electronic device further comprises forming a conductive line on the decorative layer after forming the patterned insulating layer, and setting the conductive line on the bonding area and the visible area. And the wire is electrically connected to the bonding pad, wherein the first protection pattern is disposed on the wire. The method for manufacturing an electronic device according to claim 13, wherein the retaining wall is provided along a boundary of the joint area, a part of the retaining wall is provided on the joint pad, and another part of the retaining wall is provided on the decorative layer. . The method for manufacturing an electronic device according to claim 13, further comprising forming a plurality of touch elements on the substrate, the touch elements are arranged at least in the visible area, and at least a part of the touch elements is Consists of the first patterned conductive layer. The method for manufacturing an electronic device according to claim 16, wherein the touch elements include a plurality of first touch sensing electrodes and a plurality of second touch sensing electrodes, and the first touch sensing electrodes are respectively Extending along a first direction, the second touch sensing electrodes respectively extend along a second direction, wherein the first direction is not parallel to the second direction, and the first touch sensing electrodes and the first direction The two touch sensing electrodes are not electrically connected to each other, and the first touch sensing electrodes and the second touch sensing electrodes have a plurality of overlapping areas in a direction perpendicular to the surface of the substrate, where The patterned insulating layer further includes a plurality of insulating patterns, which are respectively disposed in the overlapping regions and are located on the first touch sensing electrodes and the second touch sensing electrodes in a direction perpendicular to the substrate surface. between. The method for manufacturing an electronic device according to claim 17, wherein the patterned protective layer further includes a plurality of second protective patterns, which are respectively disposed in one of the overlapping regions and cover the first in the overlapping region. The touch sensing electrode and the second touch sensing electrode. The method for manufacturing an electronic device according to claim 13, wherein the decorative layer includes an opening, wherein the retaining wall is disposed along an outer edge of the opening, and the retaining wall and the first protection pattern are disposed on the On the decorative layer. An electronic device manufacturing method includes: providing a substrate, wherein the substrate defines a visible area and a surrounding area is located on at least one side of the visible area; forming a decoration layer on the surrounding area of the substrate, and the decoration layer includes An opening; an insulating layer is formed on the substrate after the first patterned conductive layer is formed; an exposure lithography process is performed to form a patterned insulating layer on the substrate, wherein the patterned insulating layer includes A retaining wall is disposed on the decorative layer and is disposed along the outer edge of the opening; an inkjet process is performed to form a patterned protective layer on the substrate, and the patterning The material of the protective layer has flowability before being cured, wherein the patterned protective layer includes a first protective pattern, the first protective pattern is disposed on the decorative layer, and a side wall of the retaining wall is connected to the first Contacting the protective pattern; and performing a curing process on the patterned protective layer having flowability.