TWI622922B - Touch panel - Google Patents

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TWI622922B
TWI622922B TW106134046A TW106134046A TWI622922B TW I622922 B TWI622922 B TW I622922B TW 106134046 A TW106134046 A TW 106134046A TW 106134046 A TW106134046 A TW 106134046A TW I622922 B TWI622922 B TW I622922B
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lead
electrode
substrate
parallel
electrodes
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TW106134046A
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TW201814481A (en
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竹矢泰之
藤井正規
吉田貴義
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日商雙葉電子工業股份有限公司
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  • Coupling Device And Connection With Printed Circuit (AREA)
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Abstract

本發明關於一種單層構造的觸控面板,該觸控面板為具有:在基板的同一個面上於兩個方向正交配置的發送電極及接收電極之電極構造,削減拉出至撓性基板上的配線數量而削減製造成本。由於形成在發送用引線(15a)的表面的外覆層(14)具有接觸孔(14a),因此能夠使構成發送電極(12)的發送電極元件(12a)中之相關的電極元件形成電性連接,其中,發送用引線(15a)係與設置於基板(11)的端部的撓性基板(16)上所配置的發送用連接端子(17a)相連接。 The present invention relates to a touch panel having a single-layer structure, the touch panel having an electrode structure of a transmitting electrode and a receiving electrode disposed orthogonally in two directions on the same surface of the substrate, and reducing the pull-out to the flexible substrate The manufacturing cost is reduced by the number of wirings. Since the overcoat layer (14) formed on the surface of the transmission lead (15a) has the contact hole (14a), the relevant electrode element in the transmission electrode element (12a) constituting the transmission electrode (12) can be electrically formed. In the connection, the transmission lead (15a) is connected to the transmission connection terminal (17a) disposed on the flexible substrate (16) provided at the end of the substrate (11).

Description

觸控面板 Touch panel

本發明係關於一種能夠對指尖進行多點檢測的投射式電容觸控面板。 The invention relates to a projected capacitive touch panel capable of performing multi-point detection on a fingertip.

近年來,在手機、平板型終端、電子書閱讀器等智慧型裝置、以及車輛導航系統等電子機器中,搭載有具備面板(觸控面板)的顯示裝置(觸控面板裝置)做為界面的一種形態,該面板具備觸控感測器功能,而具備能夠憑直覺操作、耐久性優異之優點。 In recent years, in electronic devices such as mobile phones, tablet terminals, and e-book readers, and electronic devices such as car navigation systems, a display device (touch panel device) including a panel (touch panel) is mounted as an interface. In one form, the panel has a touch sensor function, and has the advantage of being intuitively operable and excellent in durability.

上述觸控面板是對手指、手寫筆等指示體的觸碰進行檢測並確定其觸碰位置的座標的位置輸入裝置。近年來,對於投射式電容觸控面板的需求逐漸擴大;該投射式電容觸控面板係當上述指示體接近時,針對上述指示體的附近的電極的電容變化,依據兩個電極列(縱向電極列以及橫向電極列)的電容變化而檢測來做為上述觸控面板上的位置座標。 The touch panel is a position input device that detects a touch of a pointer such as a finger or a stylus and determines a coordinate of the touch position. In recent years, the demand for a projected capacitive touch panel has been gradually expanded. When the indicator body is approached, the capacitance change of the electrode in the vicinity of the indicator body is based on two electrode columns (longitudinal electrodes). The capacitance of the column and the lateral electrode column is detected and detected as a position coordinate on the touch panel.

下述專利文獻1中揭示有上述投射式電容觸控面板。該觸控面板的感測器部係設置於上述玻璃基板的背面側。在上述感測器部形成有:用以檢測導電體接近 玻璃基板的表面之情況的複數個檢測電極;以及與上述檢測電極電性連接而將檢測信號傳輸至外部電路的配線電極。 The above-described projected capacitive touch panel is disclosed in Patent Document 1 below. The sensor portion of the touch panel is disposed on the back side of the glass substrate. Formed in the sensor portion: for detecting the proximity of the conductor a plurality of detecting electrodes in the case of the surface of the glass substrate; and wiring electrodes electrically connected to the detecting electrodes to transmit the detection signals to the external circuit.

專利文獻1中所揭示的電極構造是OGS(One Glass Solution:玻璃一體型)方式的電極構造。利用光刻技術而在上述玻璃基板上形成:沿著第一方向配置的電極(發送電極)、以及沿著第二方向配置的電極(接收電極),並在上述發送電極和上述接收電極的交叉部分使用能夠使各電極導通的橋接構造。因此,上述OGS方式的電極構造存在有製造成本增加的問題。另外,由於在上述OGS方式中採用的電極間的配線構造的橋接構造能以目視從外部被觀察到,因此會有可能導致做為觸控面板裝置的顯示器品質下降之虞。 The electrode structure disclosed in Patent Document 1 is an OGS (One Glass Solution) electrode structure. Forming an electrode (transmission electrode) disposed along the first direction and an electrode (receiving electrode) disposed along the second direction on the glass substrate by a photolithography technique, and intersecting the transmission electrode and the reception electrode A bridge structure capable of turning on the respective electrodes is used in part. Therefore, the above-described OGS type electrode structure has a problem that the manufacturing cost increases. Further, since the bridge structure of the wiring structure between the electrodes used in the OGS method can be visually observed from the outside, there is a possibility that the quality of the display as a touch panel device is degraded.

專利文獻2中揭示有一種如下的電極構造(例如,單層構造):在基板的同一個面上形成有:在X方向相互平行的電極、以及在與上述X方向正交的Y方向相互平行的電極。藉由採用專利文獻2中所揭示的上述單層構造,則在專利文獻1所揭示的用以形成電極構造所需要的第二層的光刻處理就不再是必要的步驟了。因此,能夠削減上述電極構造的製造成本。 Patent Document 2 discloses an electrode structure (for example, a single-layer structure) in which electrodes parallel to each other in the X direction and parallel to the Y direction orthogonal to the X direction are formed on the same surface of the substrate. Electrode. By adopting the above-described single-layer structure disclosed in Patent Document 2, the photolithography process for forming the second layer required for the electrode structure disclosed in Patent Document 1 is no longer a necessary step. Therefore, the manufacturing cost of the above electrode structure can be reduced.

《先前技術文獻》 Prior Technical Literature 《專利文獻》 Patent Literature

專利文獻1:日本特開2011-90443號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-90443

專利文獻2:日本特開2010-182277號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2010-182277

如專利文獻2中所揭示者,在採用上述單層構造的電極構造的情況下,在上述基板的同一個面上配設有兩種的電極。因此,需要拉出與上述電極的數量相當之用以使上述兩種的電極導通的引線。 As disclosed in Patent Document 2, in the case of employing the electrode structure of the single-layer structure described above, two types of electrodes are disposed on the same surface of the substrate. Therefore, it is necessary to pull out a lead wire which is equivalent to the above-mentioned number of electrodes for conducting the above two kinds of electrodes.

在專利文獻2所揭示的上述電極構造中係具有:分別從在上述基板的同一個面上所形成的複數個電極拉出的引線,上述引線係採用隔著絕緣層而重疊於撓性基板上的方法。然而,在該電極構造中,上述撓性基板的尺寸會變得大型化。因此,存在有如下的問題:因為在設置上述基板時所使用的ACF(Anisotropic Conductive Film:各向異性導電薄膜)等構件數量之增加而致使上述電極構造的製造成本提高的問題。 In the electrode structure disclosed in Patent Document 2, the lead wire is drawn from a plurality of electrodes formed on the same surface of the substrate, and the lead wire is overlapped on the flexible substrate via an insulating layer. Methods. However, in the electrode structure, the size of the flexible substrate is increased. Therefore, there is a problem in that the number of members such as ACF (Anisotropic Conductive Film) used in the case of providing the above-mentioned substrate increases, which causes a problem that the manufacturing cost of the above-described electrode structure is improved.

本發明是鑒於上述問題而研創者,其目的在於提供一種觸控面板,係在上述單層構造的電極構造中,藉由削減從上述玻璃基板上拉出至上述撓性基板的拉出端子的數量,藉此可將上述電極構造的製造成本抑制成為較廉價之觸控面板。 The present invention has been made in view of the above problems, and an object of the invention is to provide a touch panel in which an electrode structure of the single-layer structure is formed by reducing a pull-out terminal that is pulled out from the glass substrate to the flexible substrate. The number can thereby suppress the manufacturing cost of the above electrode structure into a relatively inexpensive touch panel.

為了達成上述目的,本發明之第一形態是一種觸控面板,其具備:透明的基板,該基板具有表面及背面,上述背面具有 操作區域;複數個第一電極,該複數個第一電極係構成為:在上述基板的上述背面的上述操作區域內具備有與第一方向平行地排列的複數個發送電極元件,並且上述發送電極元件的各列為以平行於與上述第一方向交叉的第二方向、且相互平行的方式配置;複數個第二電極,該複數個第二電極係構成為:在上述基板的上述背面的上述操作區域內具備有與上述第二方向平行地排列的複數個接收電極元件,並且上述接收電極元件的各列為以與上述第一方向平行、且相互平行的方式配置;第一引線,該第一引線為從上述第一電極被拉出至上述基板的上述背面側的上述操作區域的外側;第二引線,該第二引線為從上述第二電極被拉出至上述操作區域的上述外側;不透明的導通用配線,該導通用配線為用以使構成上述第一電極的上述發送電極元件中之相關的上述發送電極元件彼此相互導通;以及第一絕緣層,該第一絕緣層係形成為:無法從上述基板的上述表面側以目視觀察到被形成於上述表面的上述導通用配線。 In order to achieve the above object, a first aspect of the present invention is a touch panel including: a transparent substrate having a front surface and a back surface, wherein the back surface has An operation region; the plurality of first electrodes, wherein the plurality of first electrode electrodes are configured to include a plurality of transmitting electrode elements arranged in parallel with the first direction in the operation region of the back surface of the substrate, and the transmitting electrode Each of the elements is arranged parallel to a second direction crossing the first direction and parallel to each other; a plurality of second electrodes, the plurality of second electrodes being configured to be on the back surface of the substrate a plurality of receiving electrode elements arranged in parallel with the second direction are provided in the operation region, and each row of the receiving electrode elements is disposed in parallel with the first direction and parallel to each other; the first lead, the first lead a lead wire is pulled out from the first electrode to an outer side of the operation region on the back surface side of the substrate; and a second lead wire is pulled out from the second electrode to the outer side of the operation region; An opaque conductive wiring, wherein the conductive wiring is used to connect the transmitting electrode elements constituting the first electrode Transmitting conductive electrode elements to each other; and a first insulating layer, the first insulating layer is formed as follows: not visually observed from the front surface side of the substrate to said conduction lines are formed in the surface.

本發明之第二形態是一種觸控面板,具備:透明的基板,該基板具有表面及背面,上述背面具有操作區域; 複數個第一電極,該複數個第一電極係構成為:在上述基板的上述背面的上述操作區域內具備有與第一方向平行地排列的複數個發送電極元件,並且上述發送電極元件的各列為以平行於與上述第一方向交叉的第二方向、且相互平行的方式配置;複數個第二電極,該複數個第二電極係構成為:在上述基板的上述背面的上述操作區域內具備有與上述第二方向平行地排列的複數個接收電極元件,並且上述接收電極元件的各列為以與上述第一方向平行、且相互平行的方式配置;第一引線,該第一引線為從上述第一電極被拉出至上述基板的上述背面側的上述操作區域的外側;第二引線,該第二引線為從上述第二電極被拉出至上述操作區域的上述外側;不透明的導通用配線,該導通用配線為用以使構成上述第一電極的上述發送電極元件中之相關的上述發送電極元件彼此相互導通;第一絕緣層,該第一絕緣層係形成為:無法從上述基板的上述表面側以目視觀察到形成於上述表面的上述導通用配線,且在上述第一絕緣層的表面形成有上述第一引線及上述第二引線;以及第二絕緣層,該第二絕緣層係形成為:覆蓋上述第一絕緣層的上述表面的上述第一引線以及上述第二引線,並且在上述第二絕緣層的表面形成有導通位置; 上述導通用配線係經由形成於上述導通位置的通孔而被導通。 A second aspect of the present invention is a touch panel, comprising: a transparent substrate having a surface and a back surface, wherein the back surface has an operation area; a plurality of first electrodes, wherein the plurality of first electrode electrodes are configured to include a plurality of transmitting electrode elements arranged in parallel with the first direction in the operation region of the back surface of the substrate, and each of the transmitting electrode elements Arranging in parallel with the second direction crossing the first direction and parallel to each other; the plurality of second electrodes, the plurality of second electrodes being configured to be in the operation region of the back surface of the substrate a plurality of receiving electrode elements arranged in parallel with the second direction, wherein each row of the receiving electrode elements is disposed in parallel with the first direction and parallel to each other; and the first lead is a first lead The first electrode is pulled out to the outside of the operation region on the back surface side of the substrate; the second lead is pulled out from the second electrode to the outside of the operation region; the opaque guide a general-purpose wiring, wherein the conductive wiring is used to connect the transmitting electrode in the transmitting electrode element constituting the first electrode The first insulating layer is formed such that the conductive wiring formed on the surface is not visually observed from the surface side of the substrate, and is on the surface of the first insulating layer Forming the first lead and the second lead; and a second insulating layer formed to cover the first lead and the second lead of the surface of the first insulating layer, and a surface of the second insulating layer is formed with a conductive position; The general-purpose wiring is electrically connected via a through hole formed in the conduction position.

在本發明的觸控面板中,在具有表面及背面的上述透明的基板的上述背面的上述操作區域內,由與上述第一方向平行地排列的上述發送電極元件所構成的上述第一電極的各上述發送電極元件中之相關的上述電極元件彼此係經由形成在上述第一絕緣層的表面的上述導通用配線而相互連接。而且,在上述觸控面板中,上述導通用配線為與上述第一引線導通,其中,上述第一引線為與第一連接端子連接。因此,能夠減少設置於上述撓性基板的上述連接端子的設置數量,且能夠縮小上述撓性基板的尺寸。由此,能夠削減在將上述撓性基板設置於上述觸控面板時所使用的ACF等構件的數量。結果,能夠將製造觸控面板時的成本抑制成為較便宜。 In the touch panel of the present invention, in the operation region of the back surface of the transparent substrate having the front surface and the back surface, the first electrode formed of the transmission electrode elements arranged in parallel with the first direction The electrode elements associated with each of the transmission electrode elements are connected to each other via the conductive wiring formed on the surface of the first insulating layer. Further, in the above touch panel, the conductive wiring is electrically connected to the first lead, and the first lead is connected to the first connection terminal. Therefore, the number of the connection terminals provided on the flexible substrate can be reduced, and the size of the flexible substrate can be reduced. Thereby, the number of members such as ACF used when the flexible substrate is provided on the touch panel can be reduced. As a result, it is possible to suppress the cost at the time of manufacturing the touch panel.

1‧‧‧觸控面板 1‧‧‧ touch panel

11‧‧‧基板 11‧‧‧Substrate

11a‧‧‧背面(操作之相反面) 11a‧‧‧Back (opposite side of operation)

11b‧‧‧表面(操作面) 11b‧‧‧Surface (operation surface)

12‧‧‧發送電極 12‧‧‧Transmission electrode

12a‧‧‧發送電極元件 12a‧‧‧Transmission electrode components

13‧‧‧接收電極 13‧‧‧ receiving electrode

13a‧‧‧接收電極元件 13a‧‧‧ Receiving electrode components

13b‧‧‧連接配線 13b‧‧‧Connecting wiring

14‧‧‧外覆層 14‧‧‧Overcoat

14a‧‧‧接觸孔 14a‧‧‧Contact hole

15‧‧‧引線 15‧‧‧ lead

15a‧‧‧發送用引線 15a‧‧‧Transmission lead

15b‧‧‧接收用引線 15b‧‧‧Receiving leads

15c‧‧‧導通用配線 15c‧‧‧General wiring

16‧‧‧撓性基板 16‧‧‧Flexible substrate

17‧‧‧連接端子 17‧‧‧Connecting terminal

17a‧‧‧發送用連接端子 17a‧‧‧Send connection terminal

17b‧‧‧接收用連接端子 17b‧‧‧Receiving connection terminal

18‧‧‧成為第一絕緣層的裝飾層 18‧‧‧Become the first insulating layer

19‧‧‧成為第二絕緣層的保護層 19‧‧‧Be the protective layer of the second insulation layer

19a‧‧‧通孔 19a‧‧‧through hole

20‧‧‧邊框部 20‧‧‧Border Department

20a‧‧‧邊框部的寬度 20a‧‧‧Width of the frame

E1‧‧‧操作區域 E1‧‧‧Operating area

E2‧‧‧引線區域 E2‧‧‧ lead area

第1圖是本發明的一個實施形態之觸控面板的概要俯視圖。 Fig. 1 is a schematic plan view of a touch panel according to an embodiment of the present invention.

第2圖(a)是表示第1圖的觸控面板中的發送電極的配線構造(形態例1)的主要部分的概要剖視圖,第2圖(b)是表示第1圖的觸控面板中的發送電極的配線構造(形態例2)的主要部分的概要剖視圖。 Fig. 2(a) is a schematic cross-sectional view showing a main part of a wiring structure (a first embodiment) of a transmitting electrode in the touch panel of Fig. 1, and Fig. 2(b) is a view showing a touch panel of Fig. 1 A schematic cross-sectional view of a main part of a wiring structure (morphological example 2) of a transmission electrode.

以下,參照附圖對用以實施本發明的形態進行詳細說明。本發明並不限定於該實形態施,凡由熟習本發明領域之技術人員等依據該形態而能夠思及之其他的可實施形態、實施例以及應用技術等全部都包含在本發明的範疇內。 Hereinafter, embodiments for carrying out the invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the embodiments, and all other embodiments, examples, and application techniques that can be considered by those skilled in the art of the present invention in view of the above are all included in the scope of the present invention. .

另外,在本說明書所附加的各圖中,為了便於進行圖示和容易理解,有時會適當地變更比例尺、縱橫的尺寸比、形狀等而對於實物進行示意性的表現,但其終究是一個例子,並不對本發明的解釋加以限定。 In addition, in each of the drawings attached to the present specification, in order to facilitate the illustration and easy understanding, the scale, the aspect ratio, the shape, and the like may be appropriately changed to express the physical object, but it is a The examples are not intended to limit the invention.

此外,在本說明書中,在參照所附加的各圖的以下說明中,在為了表示方向或位置而使用上、下、左、右的詞語的情況下,這些是如圖所示般與用戶觀察各圖時的上、下、左、右一致。 Further, in the present specification, in the following description with reference to the attached drawings, in the case where the words of the up, down, left, and right are used to indicate the direction or position, these are observed with the user as shown in the figure. The top, bottom, left, and right of each figure are the same.

本實施形態的觸控面板1是投射式電容觸控面板。當指尖接近上述觸控面板1時,則能夠依據縱向電極列以及橫向電極列的電容變化而檢測到該指尖附近的電極的電容變化,以做為上述觸控面板1上的位置座標。由此,能夠實現對上述指尖的多點檢測。當製造觸控面板裝置時,上述觸控面板1為以黏接或重疊的方式配置於顯示裝置(液晶顯示器、EL顯示器等各種顯示裝置)。 The touch panel 1 of the present embodiment is a projected capacitive touch panel. When the fingertip is close to the touch panel 1, the capacitance change of the electrode near the fingertip can be detected according to the change of the capacitance of the vertical electrode column and the lateral electrode column as the position coordinate on the touch panel 1. Thereby, multi-point detection of the above-mentioned fingertip can be achieved. When the touch panel device is manufactured, the touch panel 1 is disposed on a display device (a variety of display devices such as a liquid crystal display or an EL display) by adhesion or overlapping.

對本實施形態的上述觸控面板1的結構進行說明。就上述觸控面板1的形狀而言,可配合所製作的觸控面板設備的形狀而任意地設計成:例如矩形(長方形、正方形)、圓形、橢圓形、多邊形等。 The configuration of the touch panel 1 of the present embodiment will be described. The shape of the touch panel 1 described above can be arbitrarily designed in accordance with the shape of the touch panel device to be manufactured, for example, rectangular (rectangular, square), circular, elliptical, polygonal, or the like.

如第1圖(a)所示,本實施形態的上述觸控面板1係具備具有透光性的基板11。上述基板11具備有:成為操作面的表面11b(參照第2圖)、以及成為與上述表面11b相反的面的背面11a。例如,上述背面11a是與上述表面11b平行、且與上述表面11b相反的面。上述觸控面板1為在上述背面11a具有:成為第一電極的發送電極(TX)12、以及成為第二電極的接收電極(RX)13,且兩者為形成於同一個面上的單層構造的電極構造。另外,上述觸控面板1具備撓性基板16,該撓性基板16係設置於上述基板11的端部、且與外部的控制電路(未圖示)等連接。 As shown in FIG. 1( a ), the touch panel 1 of the present embodiment includes a substrate 11 having light transmissivity. The substrate 11 is provided with a surface 11b (see FIG. 2) serving as an operation surface, and a back surface 11a which is a surface opposite to the surface 11b. For example, the back surface 11a is a surface parallel to the surface 11b and opposite to the surface 11b. The touch panel 1 has a transmitting electrode (TX) 12 serving as a first electrode and a receiving electrode (RX) 13 serving as a second electrode on the back surface 11a, and both of which are single layers formed on the same surface Constructed electrode construction. Further, the touch panel 1 includes a flexible substrate 16 that is provided at an end of the substrate 11 and that is connected to an external control circuit (not shown) or the like.

在本實施形態中,藉由採用上述單層構造來做為上述電極構造,則就不需要採用屬於電極間之配線構造的橋接構造。因此,從外部以目視觀察時就不會看到由不透光的材料所形成的橋接配線,從而提高做為上述觸控面板裝置的上述顯示器的品質。再者,由於能夠將引線15集中配置於一邊,因此,能夠縮小用以包圍上述表面11b的操作區域E1的邊框部20的寬度20a。結果,能夠擴大上述操作區域E1的面積。 In the present embodiment, by adopting the above-described single-layer structure as the electrode structure, it is not necessary to employ a bridge structure belonging to the wiring structure between the electrodes. Therefore, the bridge wiring formed of the opaque material is not seen from the outside when viewed visually, thereby improving the quality of the above display as the touch panel device. Further, since the lead wires 15 can be collectively arranged on one side, the width 20a of the frame portion 20 for surrounding the operation region E1 of the surface 11b can be reduced. As a result, the area of the above-described operation region E1 can be enlarged.

上述基板11係使用一種由具有透光性的絕緣性材料形成的基板,例如為玻璃式的基板或薄膜式的基板。就上述玻璃式的基板而言,例如可使用無鹼玻璃、鈉鈣玻璃、鋁矽酸鹽玻璃等。另外,就上述薄膜式的基板而言,可使用聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)等透明樹脂材料。 The substrate 11 is made of a substrate made of a light-transmitting insulating material, for example, a glass substrate or a film substrate. As the glass substrate, for example, an alkali-free glass, a soda lime glass, an aluminosilicate glass or the like can be used. Further, as the film type substrate, a transparent resin material such as polyethylene terephthalate (PET) or polycarbonate (PC) can be used.

上述基板11的上述背面11a係相當於屬於操作者之觀察區域的上述操作區域E1。在上述背面11a形成有:用來做為電極部之上述發送電極12和上述接收電極13。此外,在本實施形態中,上述操作區域E1不僅表示上述操作者實際操作的上述基板11的表面(上述操作面)11b,而且還表示與上述操作面11b相反的上述背面11a的電極形成區域;在該上述背面11a形成有上述發送電極12以及上述接收電極13。 The back surface 11a of the substrate 11 corresponds to the operation area E1 belonging to the observation area of the operator. The transmitting electrode 12 and the receiving electrode 13 serving as electrode portions are formed on the back surface 11a. Further, in the present embodiment, the operation region E1 indicates not only the surface (the operation surface) 11b of the substrate 11 actually operated by the operator but also the electrode formation region of the back surface 11a opposite to the operation surface 11b. The transmitting electrode 12 and the receiving electrode 13 are formed on the back surface 11a.

在上述基板11的上述背面11a中,上述發送電極12係由做為第一電極元件的上述發送電極元件12a所構成。上述發送電極元件12a係能夠藉由在由光阻劑形成圖案之後,再利用光刻技術等對例如ITO(Indium Tin Oxide:氧化銦錫)等透明導電材料進行蝕刻處理而形成,由此能夠在與屬於第一方向的X方向(第1圖中的左右(橫向)方向)平行地配置複數個。另外,在上述基板11上,上述發送電極12為平行於與上述X方向交叉的第二方向之上述Y方向(第1圖中的上下(縱向)方向)、且相互平行地配置。 In the back surface 11a of the substrate 11, the transmitting electrode 12 is constituted by the transmitting electrode element 12a as a first electrode element. The transmission electrode element 12a can be formed by etching a transparent conductive material such as ITO (Indium Tin Oxide) by a photolithography technique or the like after forming a pattern by a photoresist. A plurality of them are arranged in parallel with the X direction (the horizontal direction (lateral direction) in the first drawing) belonging to the first direction. Further, on the substrate 11, the transmitting electrode 12 is arranged in parallel with the Y direction (upper and lower (longitudinal) direction in the first drawing) in the second direction intersecting the X direction, and is parallel to each other.

第1圖(a)為如下例子:構成上述發送電極12的上述發送電極元件12a為在與上述X方向平行的方向橫向地配置三個而形成行,並且上述發送電極12的上述之行中的各發送電極元件12a分別與上述Y方向平行地配置成三列。對於上述發送電極12的上述之行中的每行分別描畫不同的陰影線來顯現上述三列的上述發送電極12的上 述行。另外,上述發送電極元件12a的形狀並不限定於第1圖所示的菱形,可任意地設計為圓形、矩形、多邊形等。 1(a) is an example in which the transmission electrode element 12a constituting the transmission electrode 12 is formed by arranging three laterally in a direction parallel to the X direction, and forming a row in the above-described row of the transmission electrode 12. Each of the transmission electrode elements 12a is arranged in three rows in parallel with the Y direction. Each of the above-described rows of the transmitting electrodes 12 is drawn with a different hatching to visualize the above-mentioned three rows of the transmitting electrodes 12 Said. Further, the shape of the transmitting electrode element 12a is not limited to the rhombic shape shown in Fig. 1, and may be arbitrarily designed as a circle, a rectangle, a polygon, or the like.

在上述基板11的上述背面11a中,上述接收電極13係由做為第二電極元件的接收電極元件13a所構成。上述接收電極元件13a係能夠藉由在由光阻劑形成圖案之後,再利用光刻技術等對例如上述ITO等上述透明導電材料進行蝕刻處理而形成,由此能夠與上述Y方向平行地配置複數個。另外,在上述基板11上,上述接收電極13為與上述X方向平行、且相互平行地配置。並且,上述接收電極13的各列中的相鄰的上述接收電極元件13a彼此之間係利用例如上述ITO等之上述透明導電材料所構成的連接配線13b來連接。 In the back surface 11a of the substrate 11, the receiving electrode 13 is constituted by a receiving electrode element 13a as a second electrode element. The receiving electrode element 13a can be formed by etching a transparent conductive material such as ITO or the like by a photolithography technique or the like after forming a pattern by a photoresist, whereby the plural can be arranged in parallel with the Y direction. One. Further, on the substrate 11, the receiving electrodes 13 are arranged in parallel with the X direction and parallel to each other. Further, the adjacent receiving electrode elements 13a in the respective rows of the receiving electrodes 13 are connected to each other by a connecting wiring 13b made of, for example, the above-mentioned transparent conductive material such as ITO.

在第1圖(a)中,上述接收電極元件13a係分別以空白圖表示,以與上述Y方向平行且使連接配線13b介於其間的方式配置三個而形成列,進一步地與上述X方向平行地配置三行。此外,上述接收電極元件13a的形狀並不限定於第1圖所示的菱形,可任意地設計為圓形、矩形、多邊形等。 In the first diagram (a), the receiving electrode elements 13a are respectively shown in a blank view, and three rows are arranged in parallel with the Y direction and the connection wiring 13b is interposed therebetween, and further, the X direction is further formed. Configure three lines in parallel. Further, the shape of the receiving electrode element 13a is not limited to the rhombic shape shown in Fig. 1, and may be arbitrarily designed as a circle, a rectangle, a polygon, or the like.

另外,在上述發送電極12及上述接收電極13的表面,可藉由使用網版印刷法等一般的製膜方法來形成做為絕緣層的外覆層14。就上述外覆層14的材料而言,較佳為使用耐熱性、耐化學品性、平滑性、透明性、耐擦傷性、以及與做為上述發送電極12和上述接收電極13的上述ITO之間的密接性優異的絕緣性材料。就上述絕緣性 材料而言,例如可使用丙烯酸系樹脂、聚酯系樹脂、環氧系樹脂、聚胺基甲酸酯樹脂、三聚氰胺樹脂等。 Further, on the surface of the transmitting electrode 12 and the receiving electrode 13, an overcoat layer 14 as an insulating layer can be formed by a general film forming method such as a screen printing method. As the material of the overcoat layer 14, it is preferable to use heat resistance, chemical resistance, smoothness, transparency, scratch resistance, and the above-described ITO as the above-mentioned transmitting electrode 12 and the above-mentioned receiving electrode 13. Insulating material with excellent adhesion. Insulation as described above As the material, for example, an acrylic resin, a polyester resin, an epoxy resin, a polyurethane resin, a melamine resin or the like can be used.

如第1圖(a)所示,形成在上述基板11上的上述發送電極12和上述接收電極13的各自的端部係經由引線15而從上述基板11上的上述操作區域E1被拉出至位於上述操作區域E1的外側的引線區域E2。而且,上述發送電極12以及上述接收電極13係連接於與被設置於撓性基板16的連接端子17(發送用連接端子17a以及接收用連接端子17b)中之相對應的端子。 As shown in FIG. 1(a), the respective end portions of the transmitting electrode 12 and the receiving electrode 13 formed on the substrate 11 are pulled out from the operation region E1 on the substrate 11 via the lead wires 15 to A lead region E2 located outside the above-described operation region E1. Further, the transmitting electrode 12 and the receiving electrode 13 are connected to a terminal corresponding to the connection terminal 17 (the transmitting connecting terminal 17a and the receiving connecting terminal 17b) provided in the flexible board 16.

上述引線15是從上述操作區域E1延伸至上述引線區域E2的配線,其中,該引線區域E1為供構成上述發送電極12的發送電極元件12a、及構成上述接收電極13的接收電極元件13a形成的區域。 The lead wire 15 is a wire extending from the operation region E1 to the lead wire region E2, which is formed by the transmission electrode element 12a constituting the transmission electrode 12 and the reception electrode element 13a constituting the reception electrode 13. region.

在本實施形態中,可將從上述發送電極12的各上述發送電極元件12a拉出的配線設定為相當於第一引線的發送用引線15a。而且,可將從上述接收電極13的各列的端部(第1圖(a)中距上述撓性基板16最近的上述接收電極元件13a的端部)拉出的配線,設定為相當於第二引線的接收用引線15b。發送用引線15a及接收用引線15b係可使用例如ITO等之透明導電材料,於藉由濺射法成膜之後,再藉由蝕刻法而將指定的圖案形成於上述基板11的端部而形成。 In the present embodiment, the wiring drawn from each of the transmitting electrode elements 12a of the transmitting electrode 12 can be set as the transmitting lead 15a corresponding to the first lead. Further, the wiring drawn from the end of each row of the receiving electrodes 13 (the end of the receiving electrode element 13a closest to the flexible substrate 16 in Fig. 1(a)) can be set to be equivalent to the first The lead wire 15b for receiving the two leads. The transmission lead 15a and the reception lead 15b can be formed by using a transparent conductive material such as ITO, and then forming a film by a sputtering method, and then forming a predetermined pattern on the end portion of the substrate 11 by an etching method. .

上述發送用引線15a係從構成上述發送電極12的各上述發送電極元件12a分別被拉出至上述引線區 域E2,並在上述基板11的上述背面11a上形成第2圖(a)或第2圖(b)所示的任意的配線構造。 The transmission lead wires 15a are respectively pulled out from the respective transmission electrode elements 12a constituting the transmission electrode 12 to the lead region. In the field E2, an arbitrary wiring structure shown in Fig. 2(a) or Fig. 2(b) is formed on the back surface 11a of the substrate 11.

接下來,對上述發送用引線15a的配線構造進行說明。在本實施形態的觸控面板1中,可採取如第2圖(a)或第2圖(b)所示之上述發送用引線15a的配線構造的兩種形態。這些形態係可依據上述觸控面板1的結構而任意地選擇。此外,第2圖(a)、第2圖(b)是從與上述Y方向平行的方向觀察各形態的配線構造的主要部分剖面(將第1圖(a)中由虛線包圍的區域放大後的第1圖(b)中之A-B-C-D線處的截面)的圖。 Next, the wiring structure of the above-described transmission lead 15a will be described. In the touch panel 1 of the present embodiment, two types of wiring structures of the above-described transmission lead 15a as shown in Fig. 2(a) or Fig. 2(b) can be adopted. These forms can be arbitrarily selected in accordance with the structure of the touch panel 1 described above. In addition, in the second figure (a) and the second figure (b), the main part of the wiring structure of each form is observed from the direction parallel to the Y direction (the area surrounded by the broken line in Fig. 1(a) is enlarged. A diagram of a cross section at the ABCD line in Fig. 1(b).

(形態例1) (Form 1)

第2圖(a)中顯示形態例1的配線構造。在第2圖(a)中,從上述發送電極12的各上述發送電極元件12a拉出的上述發送用引線15a,係被拉繞至形成於上述引線區域E2的後述的裝飾層18的表面。而且,在上述外覆層14的導通位置形成有:用以使上述發送用引線15a之各者分別露出的接觸孔14a。另外,經由相當於第三引線的導通用配線15c,使上述發送用引線15a彼此相互形成電性連接。就上述導通用配線15c的材料而言,可選擇使用例如銀(Ag)、銅(Cu)等不透明(亦即,透光性較低、容易地從上述基板11的表面側目視觀察到)之材料。 The wiring structure of the first embodiment is shown in Fig. 2(a). In the second diagram (a), the transmission lead 15a drawn from each of the transmission electrode elements 12a of the transmission electrode 12 is drawn to the surface of the decorative layer 18 which will be described later formed on the lead region E2. Further, at the conduction position of the overcoat layer 14, a contact hole 14a for exposing each of the transmission leads 15a is formed. Moreover, the above-described transmission leads 15a are electrically connected to each other via the conductive wiring 15c corresponding to the third lead. The material of the conductive wiring 15c may be selected to be opaque such as silver (Ag) or copper (Cu) (that is, the light transmittance is low and is easily observed from the surface side of the substrate 11). material.

此外,在第2圖(a)的例子中,藉由按照從上述發送電極元件12a拉出至上述引線區域E2時的配線長度成為最 短的方式,從距發送用連接端子17a最近的上述接觸孔14a起拉繞上述發送用引線15a。 Further, in the example of Fig. 2(a), the length of the wiring when pulling out from the transmitting electrode element 12a to the lead region E2 becomes the most In a short manner, the transmission lead 15a is pulled from the contact hole 14a closest to the transmission connection terminal 17a.

藉由採用形態例1的配線構造,就不需要如以往的配線構造那樣地在上述撓性基板16設置與上述發送電極元件12a的數量相對應的數量的上述發送用連接端子17a。因此,能夠縮小上述撓性基板16的尺寸,因此能夠將上述撓性基板設置於觸控面板等時所使用之ACF等構件的數量抑制成較少量。結果,在製造上述觸控面板的情況下,能夠實現製造成本的削減。 By using the wiring structure of the first embodiment, it is not necessary to provide the number of the transmission connection terminals 17a corresponding to the number of the transmission electrode elements 12a on the flexible substrate 16 as in the conventional wiring structure. Therefore, since the size of the flexible substrate 16 can be reduced, the number of members such as ACF used when the flexible substrate is mounted on a touch panel or the like can be suppressed to a small amount. As a result, in the case of manufacturing the above touch panel, it is possible to reduce the manufacturing cost.

(形態例2) (Form 2)

第2圖(b)係顯示形態例2的配線構造。在第2圖(b)中,利用形態例1的配線構造,並且在相當於上述第一絕緣層的上述裝飾層18的表面所形成的上述發送用引線15a上,進一步形成相當於上述第二絕緣層的保護層19。而且,在上述保護層19的上述導通用配線15c與上述發送用引線15a的導通位置形成有通孔19a。另外,形成與上述通孔19a連通的接觸孔14a,係經由上述通孔19a及上述接觸孔14a,且能夠將上述導通用配線15c和上述發送用引線15a予以導通。 Fig. 2(b) shows the wiring structure of the morphological example 2. In the second diagram (b), the wiring structure of the first embodiment is used, and the transmission lead 15a formed on the surface of the decorative layer 18 corresponding to the first insulating layer is further formed to correspond to the second A protective layer 19 of the insulating layer. Further, a through hole 19a is formed in the conduction position of the conductive common line 15c of the protective layer 19 and the transmission lead 15a. Further, the contact hole 14a that communicates with the through hole 19a is formed to pass through the through hole 19a and the contact hole 14a, and the conductive wiring 15c and the transmission lead 15a can be electrically connected.

此外,在本實施形態中,使用與上述裝飾層18相同材質的材料來做為上述保護層19。但是,保護層19的材料只要是至少具有絕緣性,且在製作成觸控面板裝置時不會對產品造成影響的材料即可,並沒有特別限定。 Further, in the present embodiment, the same material as the decorative layer 18 is used as the protective layer 19. However, the material of the protective layer 19 is not particularly limited as long as it has at least insulating properties and does not affect the product when it is formed into a touch panel device.

在本實施形態的上述觸控面板1中,例如通過網版印刷法而形成上述裝飾層18。因此,上述裝飾層18的表面有時並不是平滑而是形成有微細的凹凸。上述發送用引線15a係形成於上述裝飾層18的表面。因此,若在上述裝飾層18的表面形成有凹凸,則上述發送用引線15a的表面也會變為凹凸形狀。因此,有時會產生如下的部位:覆蓋上述發送用引線15a的外覆層14產生剝離的部位;上述發送用引線15a未被正確地覆蓋而露出上述配線15a的表面的部位。在該情況下,可能會有因絕緣不良而導致應當絕緣的上述發送用引線15a與上述導通用配線15c短路之虞。 In the touch panel 1 of the present embodiment, the decorative layer 18 is formed, for example, by a screen printing method. Therefore, the surface of the decorative layer 18 may not be smooth but may be formed with fine irregularities. The transmission lead 15a is formed on the surface of the decorative layer 18. Therefore, when irregularities are formed on the surface of the decorative layer 18, the surface of the transmitting lead 15a also has an uneven shape. Therefore, a portion where the outer covering layer 14 of the transmitting lead 15a is peeled off may be formed, and the transmitting lead 15a is not properly covered to expose the surface of the wiring 15a. In this case, there is a possibility that the above-described transmission lead 15a to be insulated and the above-described conductive wiring 15c are short-circuited due to poor insulation.

因此,藉由採用上述形態例2的配線構造,假設即使在因上述外覆層14的剝離等而使上述發送用引線15a的表面露出的情況下,也能夠利用保護層19來覆蓋上述外覆層14、上述配線15a的表面。因此,可確保應當絕緣的上述發送用引線15a和上述導通用配線15c的絕緣狀態。因此,不需要擔心會引起上述的短路問題,並且能夠維持觸控面板的品質。 Therefore, by using the wiring structure of the second aspect, it is assumed that the protective layer 19 can cover the outer cover even when the surface of the transmitting lead 15a is exposed by peeling of the outer covering layer 14 or the like. The layer 14 and the surface of the wiring 15a described above. Therefore, the insulation state of the above-described transmission lead 15a and the above-described conductive wiring 15c which should be insulated can be ensured. Therefore, there is no need to worry about causing the short-circuit problem described above, and the quality of the touch panel can be maintained.

相當於上述第二引線的上述接收用引線15b是:從沿著上述Y方向延伸的上述接收電極13中之最靠近上述撓性基板16側的上述接收電極元件13a的端部起被拉出至上述引線區域E2。而且,上述接收用引線15b為通過上述裝飾層18的表面而連接於相對應的上述接收用連接端子17b。 The receiving lead 15b corresponding to the second lead is pulled out from the end of the receiving electrode element 13a closest to the flexible substrate 16 side of the receiving electrode 13 extending in the Y direction to The lead region E2 described above. Further, the receiving lead 15b is connected to the corresponding receiving connecting terminal 17b through the surface of the decorative layer 18.

上述撓性基板16係設置於上述基板11的指定部位(端部附近),並與未圖示的外部的控制電路(例如,成為觸控面板設備時的顯示裝置的IC電路)連接。在上述撓性基板16排列設置有如第1圖所示與上述引線15連接的上述連接端子17。就上述連接端子17而言,可列舉例如做為上述第一連接端子之與上述發送用引線15a連接的上述發送用連接端子17a、以及做為第二連接端子之與上述接收用引線15b連接的上述接收用連接端子17b。 The flexible substrate 16 is provided at a predetermined portion (near the end portion) of the substrate 11, and is connected to an external control circuit (for example, an IC circuit of a display device when the touch panel device is used). The connection terminals 17 connected to the lead wires 15 as shown in Fig. 1 are arranged in line on the flexible substrate 16. The connection terminal 17 is, for example, the transmission connection terminal 17a connected to the transmission lead 15a as the first connection terminal, and the connection terminal 15b connected to the reception lead 15b as a second connection terminal. The receiving connection terminal 17b described above.

上述裝飾層18是一種藉由例如網版印刷法而被設置在上述基板11的上述背面11a側中的上述操作區域E1的外側(例如,上述基板11的上述背面11a中的外緣端部周圍)的絕緣層。與上述發送用引線15a、上述接收用引線15b相比較之下,上述裝飾層18的透光性較低。因此,藉由設置上述裝飾層18,能夠防止從上述操作面11b側以目視觀察到:容易從上述操作面11b側被目視觀察到的上述導通用配線15c。 The decorative layer 18 is provided on the outer side of the operation region E1 on the side of the back surface 11a of the substrate 11 by, for example, a screen printing method (for example, around the outer edge end portion of the back surface 11a of the substrate 11). The insulation layer. The decorative layer 18 has low light transmittance as compared with the above-described transmitting lead 15a and the receiving lead 15b. Therefore, by providing the decorative layer 18, it is possible to prevent the above-described conductive wiring 15c which is easily visually observed from the side of the operation surface 11b from the side of the operation surface 11b.

就上述裝飾層18的材料而言,較佳為能夠遮蔽住在上述引線區域E2中從各電極拉繞的引線的遮蔽率、耐熱性、耐壓性以及耐化學品性優異的絕緣性材料。就這樣的材料而言,可採用例如聚酯系樹脂、環氧系樹脂、酚醛樹脂、聚矽氧樹脂、聚醯亞胺樹脂等。另外,可在確保絕緣性的條件下,在上述裝飾層18中混合已調整過含量的顏料等,由此能夠對上述裝飾層18的色彩進行調整,以與未圖示的框體部的色調相匹配。 The material of the decorative layer 18 is preferably an insulating material which is excellent in the shielding rate, heat resistance, pressure resistance, and chemical resistance of the lead drawn from each electrode in the lead region E2. As such a material, for example, a polyester resin, an epoxy resin, a phenol resin, a polyoxymethylene resin, a polyimide resin, or the like can be used. Further, under the condition that the insulating property is ensured, the pigment or the like having the adjusted content can be mixed in the decorative layer 18, whereby the color of the decorative layer 18 can be adjusted to the color of the frame portion (not shown). Match.

接下來,對上述發送電極12、上述接收電極13的形成方法進行說明。在此,分別對於做為如上所述的上述引線15的配線構造之上述形態例1及上述形態例2進行說明。 Next, a method of forming the above-described transmitting electrode 12 and the above-described receiving electrode 13 will be described. Here, each of the first aspect and the second aspect of the wiring structure of the lead 15 described above will be described.

(上述形態例1的形成方法) (Formation method of the above aspect example 1)

在上述形態例1的製造方法中,首先在上述基板11的上述背面11a上的上述引線區域E2的指定部位形成上述裝飾層18。接下來,相對於上述基板11的上述背面11a,與上述Y方向平行、且相互平行地形成複數個上述發送電極12,在上述發送電極12配置有複數個與上述X方向平行的上述發送電極元件12a。除了形成有上述發送電極12之外,亦在上述基板11的同一個面上,與上述X方向平行、且相互平行地形成上述接收電極13,上述接收電極13係以與上述Y方向平行之方式經由連接配線13b連續配置有複數個上述接收電極元件13a。 In the manufacturing method of the first aspect, the decorative layer 18 is first formed on a predetermined portion of the lead region E2 on the back surface 11a of the substrate 11. Then, a plurality of the transmitting electrodes 12 are formed in parallel with the Y direction and parallel to the Y surface of the substrate 11, and the transmitting electrode 12 is provided with a plurality of the transmitting electrode elements parallel to the X direction. 12a. In addition to the above-described transmitting electrode 12, the receiving electrode 13 is formed on the same surface of the substrate 11 in parallel with the X direction and parallel to each other, and the receiving electrode 13 is parallel to the Y direction. A plurality of the above-described receiving electrode elements 13a are continuously disposed via the connection wiring 13b.

除此之外,將從上述發送電極12的各上述發送電極元件12a拉出的上述發送用引線15a係被拉繞至上述引線區域E2。與此同時,將從上述接收電極13的上述接收電極元件13a拉出的上述接收用引線15b係與上述撓性基板16的相對應的上述連接端子17連接。此時,上述發送用引線15a以及上述接收用引線15b係形成於上述裝飾層18的表面。另外,在上述發送用引線15a中,只有從構成上述發送電極12的上述發送電極元件12a中的一個 拉出的上述發送用引線15a是連接於對應的上述發送用連接端子17a。 In addition, the transmission lead 15a pulled out from each of the transmission electrode elements 12a of the transmission electrode 12 is drawn to the lead region E2. At the same time, the receiving lead 15b pulled out from the receiving electrode element 13a of the receiving electrode 13 is connected to the corresponding connecting terminal 17 of the flexible board 16. At this time, the transmitting lead 15a and the receiving lead 15b are formed on the surface of the decorative layer 18. Further, in the above-described transmission lead 15a, only one of the above-described transmission electrode elements 12a constituting the transmission electrode 12 is provided. The above-mentioned transmission lead 15a is connected to the corresponding transmission connection terminal 17a.

接下來,當形成上述發送電極12以及上述接收電極13時,在這些電極的表面形成有外覆層14。 Next, when the above-described transmitting electrode 12 and the above-mentioned receiving electrode 13 are formed, an overcoat layer 14 is formed on the surface of these electrodes.

之後,在形成於各上述發送用引線15a的上方之成為上述外覆層14的導通位置的部位,利用例如光刻來形成上述接觸孔14a。而且,經由上述接觸孔14a而使上述導通用配線15c導通。由此,經由上述接觸孔14a而使構成上述發送電極12的各上述發送電極元件12a相互導通。 Thereafter, the contact hole 14a is formed by, for example, photolithography at a portion of the upper surface of the overcoat layer 14 formed above each of the transmission leads 15a. Then, the conductive wiring 15c is electrically connected via the contact hole 14a. Thereby, each of the transmission electrode elements 12a constituting the transmission electrode 12 is electrically connected to each other via the contact hole 14a.

然後,當配設好上述導通用配線15c時,面板製造步驟即完成。上述導通用配線15c係藉由例如網版印刷法而形成在外覆層14的上方。 Then, when the above-described conductive wiring 15c is disposed, the panel manufacturing step is completed. The conductive wiring 15c is formed above the overcoat layer 14 by, for example, a screen printing method.

(上述形態例2的形成方法) (Formation method of the above aspect example 2)

直到從上述發送電極12及上述接收電極13拉繞的上述引線15與上述連接端子17連接、且在除了上述連接端子17之外的上述觸控面板1的表面形成上述外覆層14的步驟為止,上述形態例2的製造方法係與上述形態例1的製造方法兩者均為相同。在上述形態例2中,在形成上述外覆層14之後,按照將上述引線15的一部分覆蓋遮蔽的方式,進一步在上述外覆層14的表面形成上述保護層19。 Until the step of connecting the lead electrode 15 wound by the transmitting electrode 12 and the receiving electrode 13 to the connection terminal 17 and forming the overcoat layer 14 on the surface of the touch panel 1 excluding the connection terminal 17 The manufacturing method of the second aspect is the same as the manufacturing method of the first aspect. In the second aspect, after the outer covering layer 14 is formed, the protective layer 19 is further formed on the surface of the outer covering layer 14 so that a part of the lead wire 15 is covered.

接下來,為了使被拉出至上述裝飾層18之上的上述發送用引線15a分別導通,因而在各上述發送用 引線15a的上方所形成的成為上述保護層19的導通位置的部位,形成上述通孔19a。除了形成上述通孔19a以外,還在上述外覆層14上以與上述通孔19a連通的方式另外形成上述接觸孔14a。 Next, in order to electrically connect the transmission leads 15a pulled out onto the decorative layer 18, respectively, each of the above transmissions is used. The through hole 19a is formed in a portion which is formed above the lead 15a and which is a conduction position of the protective layer 19. In addition to the formation of the through hole 19a, the contact hole 14a is additionally formed on the outer cover 14 so as to communicate with the through hole 19a.

而且,當上述導通用配線15c為藉由例如網版印刷法形成,而配線在上述保護層19的上方時,即可經由上述通孔19a和上述接觸孔14a,使構成上述發送電極12的各上述發送電極元件12a相互導通,從而完成面板製造步驟。 Further, when the conductive wiring 15c is formed by, for example, a screen printing method, and the wiring is over the protective layer 19, each of the transmitting electrodes 12 can be formed via the through hole 19a and the contact hole 14a. The above-described transmitting electrode members 12a are electrically connected to each other, thereby completing the panel manufacturing step.

如以上說明,本實施形態的上述觸控面板1係在上述外覆層14形成有用來做為上述發送電極12和上述接收電極13的配線構造之接觸孔14a,其中,上述外覆層14係形成在與上述發送用連接端子17a連接的上述發送用引線15a的表面。而且,經由上述接觸孔14a而將上述發送用引線15a與上述導通用配線15c導通。由此,能夠使構成上述發送電極12的上述發送電極元件12a中之相關的電極元件彼此電性連接。 As described above, in the touch panel 1 of the present embodiment, the contact layer 14a for forming the wiring structure of the transmitting electrode 12 and the receiving electrode 13 is formed on the overcoat layer 14, wherein the overcoat layer 14 is The surface of the transmission lead 15a connected to the transmission connection terminal 17a is formed. Then, the transmission lead 15a and the conductive common line 15c are electrically connected via the contact hole 14a. Thereby, the related electrode elements among the above-described transmitting electrode elements 12a constituting the above-described transmitting electrode 12 can be electrically connected to each other.

由此,就不需要如以往的配線構造般在上述撓性基板16設置與上述發送電極元件12a的數量相對應之數量的上述發送用連接端子17a。因此,就不需要增大上述撓性基板16的尺寸。另外,由於能夠減少將上述撓性基板16設置於上述觸控面板1時所使用的ACF等構件的數量,因此能夠將觸控面板1的製造成本抑制成比較低廉。 Thus, it is not necessary to provide the number of the transmission connection terminals 17a corresponding to the number of the transmission electrode elements 12a on the flexible substrate 16 as in the conventional wiring structure. Therefore, it is not necessary to increase the size of the above flexible substrate 16. Further, since the number of members such as ACF used when the flexible substrate 16 is placed on the touch panel 1 can be reduced, the manufacturing cost of the touch panel 1 can be suppressed to be relatively low.

另外,就配線構造的上述形態例2而言,在成為上述第一絕緣層的上述裝飾層18的表面上所形成 的上述引線15的上方,進一步形成有成為上述第二絕緣層的上述保護層19。而且,在上述保護層19之與上述發送用引線15a導通的位置形成有上述通孔19a。另外,形成與上述通孔19a連通的上述接觸孔14a,經由上述通孔19a及上述接觸孔14a而使上述導通用配線15c與上述發送用引線15a導通。 Further, in the second aspect of the wiring structure, the surface of the decorative layer 18 which is the first insulating layer is formed. The protective layer 19 serving as the second insulating layer is further formed above the lead 15 . Further, the through hole 19a is formed at a position of the protective layer 19 that is electrically connected to the transmission lead 15a. Further, the contact hole 14a that communicates with the through hole 19a is formed, and the common wiring 15c and the transmission lead 15a are electrically connected via the through hole 19a and the contact hole 14a.

由此,即使是在以網版印刷法而形成的上述裝飾層18的上方所形成之用來覆蓋上述發送電極12、上述接收電極13的上述外覆層14發生剝離現象、或露出有上述發送用引線15a的表面時,則也能夠藉由利用上述保護層19覆蓋住上述外覆層14、上述發送用引線15a的表面,從而確保上述發送用引線15a和上述導通用配線15c的絕緣狀態。因此,就不需要擔心會有引起上述的短路問題,進而能夠維持觸控面板的品質。 Thereby, even the overcoat layer 14 formed to cover the transmitting electrode 12 and the receiving electrode 13 formed above the decorative layer 18 formed by the screen printing method is peeled off or exposed. When the surface of the lead 15a is used, the surface of the outer covering layer 14 and the transmitting lead 15a can be covered by the protective layer 19, and the insulating state of the transmitting lead 15a and the conductive lead 15c can be ensured. Therefore, there is no need to worry about the above-mentioned short-circuit problem, and the quality of the touch panel can be maintained.

Claims (2)

一種觸控面板,係具備:透明的基板,該基板具有表面及背面,前述背面具有操作區域;複數個第一電極,該複數個第一電極係構成為:在前述基板的前述背面的前述操作區域內具備有與第一方向平行地排列的複數個發送電極元件,並且前述發送電極元件的各列為以平行於與前述第一方向交叉的第二方向且相互平行的方式配置;複數個第二電極,該複數個第二電極係構成為:在前述基板的前述背面的前述操作區域內具備有與前述第二方向平行地排列的複數個接收電極元件,並且前述接收電極元件的各列為以與前述第一方向平行且相互平行的方式配置;第一引線,該第一引線為從前述第一電極被拉出至前述基板的前述背面側的前述操作區域的外側;第二引線,該第二引線為從前述第二電極被拉出至前述操作區域的前述外側;不透明的導通用配線,該導通用配線為用以使構成前述第一電極的前述發送電極元件中之相關的前述發送電極元件彼此相互導通;以及第一絕緣層,該第一絕緣層係形成為:無法從前述基板的前述表面側以目視觀察到被形成於前述表面的前述導通用配線。 A touch panel includes: a transparent substrate having a front surface and a back surface; the back surface having an operation region; a plurality of first electrodes, wherein the plurality of first electrodes are configured to be in the operation of the back surface of the substrate a plurality of transmitting electrode elements arranged in parallel with the first direction are provided in the region, and each row of the transmitting electrode elements is arranged parallel to a second direction crossing the first direction and parallel to each other; In the two electrodes, the plurality of second electrodes are configured to include a plurality of receiving electrode elements arranged in parallel with the second direction in the operation region of the back surface of the substrate, and the respective columns of the receiving electrode elements are Arranging in parallel with the first direction and parallel to each other; a first lead, the first lead being pulled out from the first electrode to an outer side of the operation area on the back side of the substrate; and a second lead The second lead is pulled out from the second electrode to the outer side of the operation area; the opaque conductive wiring is The common wiring is used to electrically connect the related transmitting electrode elements of the transmitting electrode elements constituting the first electrode to each other; and a first insulating layer formed to be incapable of being from the aforementioned surface of the substrate The above-described conductive wiring formed on the aforementioned surface was visually observed on the side. 一種觸控面板,係具備:透明的基板,該基板具有表面及背面,前述背面具有操作區域;複數個第一電極,該複數個第一電極係構成為:在前述基板的前述背面的前述操作區域內具備有與第一方向平行地排列的複數個發送電極元件,並且前述發送電極元件的各列為以平行於與前述第一方向交叉的第二方向且相互平行的方式配置;複數個第二電極,該複數個第二電極係構成為:在前述基板的前述背面的前述操作區域內具備有與前述第二方向平行地排列的複數個接收電極元件,並且前述接收電極元件的各列為以與前述第一方向平行且相互平行的方式配置;第一引線,該第一引線為從前述第一電極被拉出至前述基板的前述背面側的前述操作區域的外側;第二引線,該第二引線為從前述第二電極被拉出至前述操作區域的前述外側;不透明的導通用配線,該導通用配線為用以使構成前述第一電極的前述發送電極元件中之相關的前述發送電極元件彼此相互導通;第一絕緣層,該第一絕緣層係形成為:無法從前述基板的前述表面側以目視觀察到形成於前述表面的前述導通用配線,且在前述第一絕緣層的表面形成有前述第一引線及前述第二引線;以及 第二絕緣層,該第二絕緣層係形成為:覆蓋前述第一絕緣層的前述表面的前述第一引線及前述第二引線,且在前述第二絕緣層的表面形成有導通位置,前述導通用配線係經由形成於前述導通位置的通孔而被導通。 A touch panel includes: a transparent substrate having a front surface and a back surface; the back surface having an operation region; a plurality of first electrodes, wherein the plurality of first electrodes are configured to be in the operation of the back surface of the substrate a plurality of transmitting electrode elements arranged in parallel with the first direction are provided in the region, and each row of the transmitting electrode elements is arranged parallel to a second direction crossing the first direction and parallel to each other; In the two electrodes, the plurality of second electrodes are configured to include a plurality of receiving electrode elements arranged in parallel with the second direction in the operation region of the back surface of the substrate, and the respective columns of the receiving electrode elements are Arranging in parallel with the first direction and parallel to each other; a first lead, the first lead being pulled out from the first electrode to an outer side of the operation area on the back side of the substrate; and a second lead The second lead is pulled out from the second electrode to the outer side of the operation area; the opaque conductive wiring is The common wiring is used to electrically connect the transmitting electrode elements associated with the transmitting electrode elements constituting the first electrode to each other; the first insulating layer is formed such that the first insulating layer cannot be formed from the front surface side of the substrate The conductive wiring formed on the surface is visually observed, and the first lead and the second lead are formed on a surface of the first insulating layer; a second insulating layer, the second insulating layer is formed to cover the first lead and the second lead of the surface of the first insulating layer, and a conductive position is formed on a surface of the second insulating layer, and the guiding The general wiring is electrically connected via a through hole formed in the above-described conduction position.
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JP2011090443A (en) * 2009-10-21 2011-05-06 Optrex Corp Projection type capacitance touch panel, method of manufacturing the same, and electronic equipment
TWI492122B (en) * 2013-05-19 2015-07-11 Tpk Glass Solutions Xiamen Inc Touch sensing device and manufacturing method thereof
TWI503714B (en) * 2013-02-27 2015-10-11 Tpk Touch Solutions Xiamen Inc Touch panel and manufacturing method thereof
TWI521405B (en) * 2013-02-22 2016-02-11 宸鴻光電科技股份有限公司 Touch panel and manufacturing method thereof

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JP6233689B2 (en) * 2013-09-09 2017-11-22 大日本印刷株式会社 Touch panel sensor, touch panel sensor manufacturing method, and display device with touch position detection function
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US20100253646A1 (en) * 2009-01-09 2010-10-07 Rohm Co., Ltd. Position input device
JP2011090443A (en) * 2009-10-21 2011-05-06 Optrex Corp Projection type capacitance touch panel, method of manufacturing the same, and electronic equipment
TWI521405B (en) * 2013-02-22 2016-02-11 宸鴻光電科技股份有限公司 Touch panel and manufacturing method thereof
TWI503714B (en) * 2013-02-27 2015-10-11 Tpk Touch Solutions Xiamen Inc Touch panel and manufacturing method thereof
TWI492122B (en) * 2013-05-19 2015-07-11 Tpk Glass Solutions Xiamen Inc Touch sensing device and manufacturing method thereof

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