CN113156722A - Liquid crystal display panel and preparation method thereof - Google Patents
Liquid crystal display panel and preparation method thereof Download PDFInfo
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- CN113156722A CN113156722A CN202110361659.XA CN202110361659A CN113156722A CN 113156722 A CN113156722 A CN 113156722A CN 202110361659 A CN202110361659 A CN 202110361659A CN 113156722 A CN113156722 A CN 113156722A
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 242
- 229910052751 metal Inorganic materials 0.000 claims abstract description 195
- 239000002184 metal Substances 0.000 claims abstract description 195
- 239000011241 protective layer Substances 0.000 claims abstract description 187
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 230000003647 oxidation Effects 0.000 claims abstract description 14
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 31
- 229910052709 silver Inorganic materials 0.000 claims description 23
- 239000004332 silver Substances 0.000 claims description 23
- 238000002161 passivation Methods 0.000 claims description 16
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 7
- 238000010329 laser etching Methods 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 27
- 230000008569 process Effects 0.000 description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 22
- 239000003292 glue Substances 0.000 description 8
- 238000005240 physical vapour deposition Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The application provides a liquid crystal display panel and a preparation method thereof, the liquid crystal display panel comprises a substrate, a driving circuit layer, a metal layer and a protective layer, the driving circuit layer is arranged on one side of the substrate and comprises a connecting wire, the metal layer is arranged along the direction perpendicular to the plane of the substrate, the connecting wire is connected with the metal layer, the metal layer is used for connecting the connecting wire and a chip on film, the protective layer is attached to the metal layer, wherein the oxidation resistance of the protective layer is greater than that of the metal layer, the material of the protective layer is a conductive material, and the protective layer is used for preventing the metal layer from being oxidized. This application makes protective layer laminating metal level setting through setting up the protective layer, because the inoxidizability of protective layer is greater than the inoxidizability of metal level, can avoid the metal level to be oxidized through protective layer protection metal level, and because the protective layer is conducting material, makes flip chip film and connecting wire can switch on to improve display panel's yield.
Description
Technical Field
The application relates to the technical field of display, in particular to a liquid crystal display panel and a preparation method thereof.
Background
With the development of display technology, the existing liquid crystal display device has high requirements for products such as narrow frames, frameless products, spliced screens and the like, and due to the binding limitation of a Chip On Film (COF), the narrow frames cannot be further realized, or the COF binding difficulty is high due to the reduction of the narrow frames. Therefore, the conventional display device develops a side binding technology, and the COF is bound on the side surface of the display panel, so that the binding difficulty is reduced, and the narrow frame is realized. The existing side binding technology connects a metal wire and a COF in a driving circuit through silver, but the silver is easily oxidized, so that poor contact between the metal wire and the COF occurs, and the problem of poor display occurs during display.
Therefore, the existing side binding technology has the problems that silver is easily oxidized to cause poor contact between the metal wiring and the COF, and poor display is caused.
Disclosure of Invention
The embodiment of the application provides a liquid crystal display panel and a preparation method thereof, which are used for solving the problems of poor contact between a metal wire and a COF (chip on film) and poor display caused by easy oxidation of silver in the conventional side binding technology.
The embodiment of the application provides a liquid crystal display panel, and the liquid crystal display panel includes:
a substrate;
the driving circuit layer is arranged on one side of the substrate and comprises a connecting wire;
the metal layer is arranged along the direction vertical to the plane of the substrate, the connecting wire is connected with the metal layer, and the metal layer is used for connecting the connecting wire and the chip on film;
the protective layer is attached to the metal layer;
the oxidation resistance of the protective layer is greater than that of the metal layer, the protective layer is made of a conductive material, and the protective layer is used for preventing the metal layer from being oxidized.
In some embodiments, the material of the metal layer comprises silver.
In some embodiments, the passivation layer includes a first passivation layer disposed in a direction of the metal layer away from the connection line, and a second passivation layer disposed between the metal layer and the connection line.
In some embodiments, a projected area of the first protective layer on a plane perpendicular to the substrate is equal to a projected area of the metal layer on a plane perpendicular to the substrate.
In some embodiments, the liquid crystal display panel further includes a sealant, the second protection layer is attached to the connection line and the sealant, and a projection area of the second protection layer on a plane perpendicular to the substrate is equal to a projection area of the sealant and the connection line on the plane perpendicular to the substrate.
In some embodiments, a surface roughness of a side of the second protective layer contacting the connection line is greater than a surface roughness of a side of the second protective layer contacting the metal layer.
In some embodiments, the first protective layer is the same material as the second protective layer.
In some embodiments, the material of the first protective layer comprises one of indium tin oxide and indium zinc oxide.
In some embodiments, the first protective layer has a thickness in a range of 1300 nm to 1500 nm.
Meanwhile, the embodiment of the application provides a preparation method of the liquid crystal display panel, and the preparation method of the liquid crystal display panel comprises the following steps:
providing a first substrate and a second substrate; the first substrate comprises a substrate and a driving circuit layer, and the driving circuit layer comprises a connecting wire;
the first substrate and the second substrate are paired, and liquid crystal is arranged in a liquid crystal box formed by the paired boxes;
after one side of a first substrate is processed, a protective layer and a metal layer are formed on the side face of the first substrate; the metal layer is connected with the connecting wire and is used for connecting the connecting wire and the chip on film; the oxidation resistance of the protective layer is greater than that of the metal layer, the protective layer is made of a conductive material and is used for preventing the metal layer from being oxidized;
curing the protective layer and the metal layer;
and carrying out laser etching on the protective layer and the metal layer to obtain metal patterns of the metal layer and the protective layer, and forming the liquid crystal display panel.
Has the advantages that: the application provides a liquid crystal display panel and a preparation method thereof, the liquid crystal display panel comprises a substrate, a driving circuit layer, a metal layer and a protective layer, the driving circuit layer is arranged on one side of the substrate and comprises a connecting wire, the metal layer is arranged along the direction perpendicular to the plane of the substrate, the connecting wire is connected with the metal layer, the metal layer is used for connecting the connecting wire and a chip on film, the protective layer is attached to the metal layer, wherein the oxidation resistance of the protective layer is greater than that of the metal layer, the material of the protective layer is a conductive material, and the protective layer is used for preventing the metal layer from being oxidized. This application makes protective layer laminating metal level setting through setting up the protective layer, because the inoxidizability of protective layer is greater than the inoxidizability of metal level, can avoid the metal level to be oxidized through protective layer protection metal level, and because the protective layer is conducting material, makes flip chip film and connecting wire can switch on to improve display panel's yield.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic view of a conventional liquid crystal display device.
Fig. 2 is another schematic view of a conventional liquid crystal display device.
Fig. 3 is a schematic diagram of a liquid crystal display device corresponding to each stage in a conventional liquid crystal display device manufacturing process.
Fig. 4 is a schematic diagram of a liquid crystal display panel according to an embodiment of the present disclosure.
Fig. 5 is another schematic diagram of a liquid crystal display panel according to an embodiment of the present application.
Fig. 6 is another schematic diagram of a liquid crystal display panel according to an embodiment of the present application.
Fig. 7 is a schematic view of a liquid crystal display device according to an embodiment of the present application.
Fig. 8 is a flowchart of a method for manufacturing a liquid crystal display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 and 2, a conventional display device using a side bonding technology includes a first glass substrate 111, a thin film transistor 112, a passivation layer 113, a sealant 114, a second substrate 12, and a silver layer 13, specifically, the thin film transistor 112 includes a first metal layer 141, a second metal layer 142, and an insulating layer 143, the second substrate includes a common electrode layer 121 and a second glass substrate 122, when the thin film transistor 112 is connected to a chip on film 16, the second metal layer 142 is connected to the silver layer 13, and then the silver layer 13 is connected to the chip on film 16 through an anisotropic conductive adhesive 15, so as to connect the thin film transistor 112 to the chip on film 16, and a driving chip can drive a display panel to display.
In the manufacturing process of the display device, as shown in fig. 3, after the first substrate 11 and the second substrate 12 are boxed, the side surfaces of the first substrate 11 and the second substrate 12 are side-ground by using a grinding member 17, the process is shown as (a) in fig. 3, then the side-ground first substrate 11 and second substrate 12 are cleaned, the process is shown as (b) in fig. 3, then a silver layer 13 is formed by printing, the process is shown as (c) in fig. 3, then the silver layer 13 is cured, the process is shown as (d) in fig. 3, then the silver layer is etched to obtain a silver pattern, the process is shown as (e) in fig. 3, then the silver is bonded with the flip-chip film 16, the process is shown as (f) in fig. 3, when the silver layer is formed, since the silver is easily oxidized, the subsequent silver traces and the flip-chip film are connected, because silver is oxidized, the metal wiring and the chip on film have poor contact, and the display device has poor display.
The embodiments of the present application are directed to the above technical problems, and are used to solve the above technical problems.
As shown in fig. 4 and 5, an embodiment of the present application provides a liquid crystal display panel, including:
a substrate 211;
a driving circuit layer disposed on one side of the substrate 211, the driving circuit layer including a connection line 212;
the metal layer 25 is arranged along a direction perpendicular to the plane of the substrate 211, the connection line 212 is connected with the metal layer 25, and the metal layer 25 is used for connecting the connection line 212 and the chip on film;
a protective layer 24 attached to the metal layer 25;
wherein the oxidation resistance of the protective layer 24 is greater than that of the metal layer 25, and the protective layer 24 is used to prevent the metal layer 25 from being oxidized.
The embodiment of the application provides a liquid crystal display panel, this liquid crystal display panel is through setting up the protective layer, and make protective layer and metal level laminating setting, and because the inoxidizability of protective layer is greater than the inoxidizability of metal level, then in the formation process of liquid crystal display panel, the protective layer can be protected the metal level, avoid the metal level to be oxidized, simultaneously because the material of protective layer is conducting material, the connecting wire can normally switch on with cover brilliant film, thereby the effect of switching on of connecting wire and cover brilliant film has been improved, the yield of display panel has been improved.
It should be noted that, in order to illustrate the positions between the layers more clearly, a gap exists between the protection layer and the connection line in fig. 4, and the actual connection line and the protection layer are attached to each other as shown in fig. 5, so that the connection line is conducted with the flip chip film through the protection layer and the metal layer.
In one embodiment, the material of the metal layer includes silver, that is, in order to solve the problem that silver is easily oxidized, the silver is protected by providing a protection layer, so that silver is prevented from being oxidized.
The problem that the metal layer is oxidized in the processes of printing, forming and etching is solved, and two surfaces of the metal layer are oxidized. In one embodiment, as shown in fig. 4, the passivation layer 24 includes a first passivation layer 242 and a second passivation layer 241, the first passivation layer 242 is disposed in a direction away from the connection line 212 of the metal layer 25, and the second passivation layer 241 is disposed between the metal layer 25 and the connection line 212. All set up the protective layer through the both sides at the metal level for first protective layer and second protective layer set up on two surfaces of metal level, when contacting with the air, two surfaces of metal level can not contact with the air, thereby avoid the metal level to be by oxidation.
In the above embodiment, the two surfaces of the metal layer, the connection line and the flip-chip film are protected, so that a via is formed between the connection line, the metal layer and the flip-chip film, and the connection line and the flip-chip film can be conducted. However, it is considered that other surfaces of the metal layer are also oxidized, and the conductive performance of the metal layer is degraded after the other surfaces of the metal layer are oxidized. In one embodiment, the second protective layer extends towards the first protective layer to form a closed pattern. Make first protective layer and second protective layer all cover six surfaces of metal level promptly to make the metal level can not contact with the outside air, avoid the metal level oxidation to lead to the impedance increase.
Specifically, carry out the sculpture to the second protective layer after forming the second protective layer, make the second protective layer form the recess for the metal level forms in the recess, then forms first protective layer on the metal level, thereby makes first protective layer and second protective layer form the closed pattern, wraps up the metal level in first protective layer and second protective layer, makes the metal level can not contact with the outside air, thereby avoids the metal level oxidation to lead to the impedance increase.
In one embodiment, a projected area of the first protective layer on a plane perpendicular to the substrate is equal to a projected area of the metal layer on a plane perpendicular to the substrate. The first protection layer is arranged in the direction of the metal layer away from the connecting line, so that when the metal layer positioned on the outer side is not oxidized, the outer surface of the metal layer can be prevented from being oxidized by covering the surface of the metal layer positioned on the outer side by the first protection layer, and therefore the projection area of the first protection layer on the plane perpendicular to the substrate can be equal to the projection area of the metal layer on the plane perpendicular to the substrate.
Specifically, when the first protection layer and the metal layer are formed, the first protection layer and the metal layer can be carved or etched through the same process, so that the formed first protection layer protects the metal layer, and the process flow in the display panel preparation process cannot be increased due to the fact that the first protection layer and the metal layer adopt the same process.
In an embodiment, a projected area of the first protection layer on a plane perpendicular to the substrate is smaller than a projected area of the metal layer on a plane perpendicular to the substrate, and during the formation of the first protection layer and the metal layer, the first protection layer may also protect a partial region of the metal layer, so as to prevent the metal layer from being oxidized, and during the preparation, the formation of the first protection layer is facilitated.
In one embodiment, a projected area of the first protective layer on a plane perpendicular to the substrate is larger than a projected area of the metal layer on a plane perpendicular to the substrate, and the metal layer is further protected by increasing an area of the first protective layer while reducing contact of the metal layer with oxygen. Meanwhile, when the stability of the first protective layer is considered, the first protective layer may be disposed on the upper side of the metal layer in the manner described in the above embodiments, thereby protecting each surface of the metal layer.
The problem that the side of the metal layer, which is in contact with the connecting wire, is oxidized is solved. In an embodiment, as shown in fig. 4, the liquid crystal display panel further includes a sealant 231, the second protection layer 241 is attached to the connection line 212 and the sealant 231, and a projection area of the second protection layer 241 on a plane perpendicular to the substrate 211 is equal to a projection area of the sealant 231 and the connection line 212 on the plane perpendicular to the substrate 211. When the second protective layer is formed, the area of the second protective layer is equal to the area of the frame glue and the connecting line, when the second protective layer is in contact with the frame glue and the connecting line, the second protective layer can be better attached to the connecting line and the frame glue, the adhesive capacity of the second protective layer, the frame glue and the connecting line is increased, and a metal layer can be better protected.
The adhesive capacity of the frame glue of the metal layer and the connecting line is poor, so that the metal layer, the connecting line and the frame glue fall off, and the connecting line and the metal layer are not connected after the metal layer is etched or engraved, so that poor display is generated. In one embodiment, the surface roughness of the side of the second protective layer in contact with the connection line is greater than the surface roughness of the side of the second protective layer in contact with the metal layer. The surface roughness of one side of the second protective layer in contact with the connecting wire is increased, so that the adhesion capacity of the second protective layer and the connecting wire is increased, and the problem that the connecting wire and the metal layer fall off to cause abnormal display can be avoided in the preparation process of the display panel and the use process of the display panel.
In one embodiment, the connecting line is formed with a groove, and the second protective layer is formed with a protrusion, the groove and the protrusion cooperating. When the adhesion capacity of the second protective layer and the connecting line is increased, the connecting line and the second protective layer can be attached through the protrusions and the grooves.
Specifically, when the thickness of the connecting wire is small and the groove is difficult to form, the second protective layer and the insulating layer arranged on the connecting wire can be connected through the protrusion and the groove, and therefore the adhesion capacity of the connecting wire and the second protective layer is improved.
Specifically, considering that it is difficult for the connection line to form a protrusion, a groove is formed on the connection line and a protrusion is formed on the second protective layer, but the embodiment of the present application is not limited thereto, and the protrusion may be formed on the connection line in order to improve the adhesion between the connection line and the second protective layer.
In one embodiment, the first protective layer and the second protective layer are the same material. When the first protective layer and the second protective layer are selected to protect the metal layer, the conductivity of the metal layer, the first protective layer and the second protective layer is considered to be better, so that the signal transmission of the connecting line and the chip on film does not generate voltage drop, the first protective layer and the second protective layer are formed by the same material, the first protective layer and the second protective layer have better conductivity, in the forming process of the first protective layer and the second protective layer, the first protective layer and the second protective layer are formed by the same process, and the process difficulty is reduced.
The metal layer is easily oxidized during the formation process, and the silver is soft and easily deformed, resulting in poor display. In one embodiment, the material of the first protective layer includes one of indium tin oxide and indium zinc oxide. Specifically, the material of the first protective layer includes indium tin oxide. Because the indium tin oxide has high permeability and low resistance, the conductive performance of the metal layer can be improved when the indium tin oxide is adopted to form the first protective layer; meanwhile, the indium tin oxide has good acid etching and photoetching performances, and the indium tin oxide has good mechanical strength, wear resistance and alkali-resistant chemical stability, so that the first protective layer and the second protective layer prevent the metal layer from deforming, the metal layer is in good contact with the connecting wire, and the yield of the display panel is improved. And the indium tin oxide has better adhesive capacity with the connecting wire and the frame glue, and the adhesive capacity of the metal layer with the connecting wire and the frame glue is improved.
In an embodiment, the thickness of the first protection layer ranges from 1300 nm to 1500 nm, and when the metal layers are protected by the first protection layer and the second protection layer, the thicknesses of the first protection layer and the second protection layer are not too large, so that a larger frame of the display panel caused by the first protection layer and the second protection layer is avoided. And because the first protective layer and the second protective layer are made of conductive materials, the first protective layer and the second protective layer can reduce the impedance of the metal layer, and the conductivity of the metal layer is further improved.
As shown in fig. 4, the liquid crystal display panel further includes a passivation layer 213 and a color filter substrate 22, and fig. 4 shows a schematic diagram of the contact between the connection line and the metal layer. The specific structure of the liquid crystal display panel is shown in fig. 6, the liquid crystal display panel includes an array substrate 21, a color filter substrate 22, and a liquid crystal layer 23 disposed between the array substrate 21 and the color filter substrate 22, where the array substrate 21 includes a substrate 211, a barrier layer 214, an active layer 215, a gate insulating layer 216, a gate layer 217, an interlayer insulating layer 218, a source/drain layer 212 (the source/drain layer forms a connection line, and therefore the same reference numeral is used), a passivation layer 213, and a pixel electrode layer 219; the liquid crystal layer 23 includes sealant 231 and liquid crystal 232; the color filter substrate 22 includes a common electrode layer 221, a color resist layer 222, a black matrix layer 223, and a substrate 224.
In the process of connecting the driving circuit and the chip on film, the gate layer forms a connecting line on the source drain layer through the overline in the process of connecting the gate layer and the chip on film, so that the connecting line is illustrated by the source drain layer in fig. 6, and the connecting line is connected with the metal layer, thereby realizing the conduction between the connecting line and the chip on film.
In the above embodiment, the liquid crystal display panel includes an Array substrate and a Color filter substrate, but the liquid crystal display panel may be a display panel including a COA (Color On Array, where a Color filter is disposed On an Array layer) substrate, which is not limited to this, and the display panel that uses the metal layer for side binding may all use the above technical scheme.
As shown in fig. 7, an embodiment of the present application provides a liquid crystal display device, including:
the liquid crystal display panel comprises a substrate 211, a driving circuit layer, a metal layer 25 and a protective layer 24, wherein the driving circuit layer is arranged on one side of the substrate 211 and comprises a connecting line 212, the metal layer 25 is arranged along a direction perpendicular to the plane of the substrate 211, the connecting line 212 is connected with the metal layer 25, the protective layer 24 is attached to the metal layer 25, the oxidation resistance of the protective layer 24 is greater than that of the metal layer 25, and the protective layer 24 is used for preventing the metal layer 25 from being oxidized;
the chip on film 31 is connected to the connection line 212 through the metal layer 25.
The embodiment of the application provides a liquid crystal display device, this liquid crystal display device is through setting up the protective layer, and make protective layer and metal level laminating setting, and because the inoxidizability of protective layer is greater than the inoxidizability of metal level, then in liquid crystal display device's formation process, the protective layer can be protected the metal level, avoid the metal level to be oxidized, simultaneously because the material of protective layer is conducting material, the cover chip can be connected with the connecting wire through metal level and protective layer, make the connecting wire normally switch on with cover chip, avoid the connecting wire and cover chip connection failure, display panel's yield has been improved.
As shown in fig. 8, an embodiment of the present application provides a method for manufacturing a liquid crystal display panel, where the method for manufacturing a liquid crystal display panel includes:
s1, providing a first substrate and a second substrate; the first substrate comprises a substrate and a driving circuit layer, and the driving circuit layer comprises a connecting wire;
s2, the first substrate and the second substrate are paired, and liquid crystal is arranged in a liquid crystal box formed by the paired boxes;
s3, after one side of the first substrate is processed, a protective layer and a metal layer are formed on the side surface of the first substrate; the metal layer is connected with the connecting wire and is used for connecting the connecting wire and the chip on film; the oxidation resistance of the protective layer is greater than that of the metal layer, the protective layer is made of a conductive material and is used for preventing the metal layer from being oxidized;
s4, curing the protective layer and the metal layer;
and S5, performing laser etching on the protective layer and the metal layer to obtain metal patterns of the metal layer and the protective layer, and forming the liquid crystal display panel.
The embodiment of the application provides a preparation method of a liquid crystal display panel, and the preparation method of the liquid crystal display panel forms a metal layer and a protective layer simultaneously when the metal layer and the protective layer are formed, and simultaneously solidifies the metal layer and the protective layer, and then etches the protective layer and the metal layer simultaneously to obtain metal patterns of the metal layer and the protective layer, so that when the metal layer is prevented from being oxidized by adding the protective layer, the process flow is not increased.
In the above embodiment, the first substrate may be an array substrate, the second substrate may be a color filter substrate, or the first substrate may be a COA substrate.
In one embodiment, when forming the protective layer and the metal layer on the side surface of the first substrate after processing one side of the first substrate, the first protective layer, the second protective layer, and the metal layer may be formed by physical vapor deposition, and the step of forming the protective layer and the metal layer on the side surface of the first substrate after processing one side of the first substrate includes:
forming a second protective layer by adopting physical vapor deposition;
forming a metal layer on the second protective layer by adopting physical vapor deposition;
forming a first protective layer on the metal layer by adopting physical vapor deposition; the protective layer includes a first protective layer and a second protective layer. In order to form the metal layer and the protective layer at the same time, the process flow is not increased, the preparation processes of the protective layer and the metal layer are the same, and when the protective layer can adopt physical vapor deposition, the protective layer and the metal layer are simultaneously formed by adopting the physical vapor deposition, so that the process flow is not increased.
Specifically, the first protective layer and the second protective layer are both treated with indium tin oxide. Because the indium tin oxide can be prepared by adopting physical vapor deposition, when the first protective layer, the metal layer and the second protective layer are formed, the first protective layer, the metal layer and the second protective layer are formed by the physical vapor deposition; then, the first protective layer, the metal layer and the second protective layer are cured at the same time, and the curing process can be carried out at the same time without increasing the process flow; when the first protective layer, the metal layer and the second protective layer are formed, the first protective layer, the metal layer and the second protective layer can be etched simultaneously through laser to form patterns, and in the forming process of the first protective layer, the metal layer and the second protective layer, because the protective layer and the metal layer are prepared by the same process, the protective layer and the metal layer are obtained while the process flow of the display panel is not increased, so that the protective layer protects the metal layer.
According to the above embodiment:
the embodiment of the application provides a liquid crystal display panel and a preparation method thereof, and a liquid crystal display device, the liquid crystal display panel comprises a substrate, a driving circuit layer, a metal layer and a protective layer, the driving circuit layer is arranged on one side of the substrate and comprises a connecting wire, the metal layer is arranged along the direction perpendicular to the plane of the substrate, the connecting wire is connected with the metal layer, the metal layer is used for connecting the connecting wire and a chip on film, the protective layer is attached to the metal layer, wherein the oxidation resistance of the protective layer is greater than that of the metal layer, the material of the protective layer is a conductive material, and the protective layer is used for preventing the protective layer from being oxidized by the metal layer. This application makes protective layer laminating metal level setting through setting up the protective layer, because the inoxidizability of protective layer is greater than the inoxidizability of metal level, can avoid the metal level to be oxidized through protective layer protection metal level, and because the protective layer is conducting material, makes flip chip film and connecting wire can switch on to improve display panel's yield.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The liquid crystal display panel, the manufacturing method thereof, and the liquid crystal display device provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principle and the implementation manner of the present application, and the description of the embodiments above is only used to help understanding the technical scheme and the core concept of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A liquid crystal display panel, comprising:
a substrate;
the driving circuit layer is arranged on one side of the substrate and comprises a connecting wire;
the metal layer is arranged along the direction vertical to the plane of the substrate, the connecting wire is connected with the metal layer, and the metal layer is used for connecting the connecting wire and the chip on film;
the protective layer is attached to the metal layer;
the oxidation resistance of the protective layer is greater than that of the metal layer, the protective layer is made of a conductive material, and the protective layer is used for preventing the metal layer from being oxidized.
2. The liquid crystal display panel of claim 1, wherein a material of the metal layer comprises silver.
3. The liquid crystal display panel of claim 2, wherein the passivation layer comprises a first passivation layer and a second passivation layer, the first passivation layer is disposed in a direction away from the connection lines, and the second passivation layer is disposed between the metal layer and the connection lines.
4. The liquid crystal display panel according to claim 3, wherein a projected area of the first protective layer on a plane perpendicular to the substrate is equal to a projected area of the metal layer on a plane perpendicular to the substrate.
5. The liquid crystal display panel according to claim 3, wherein the liquid crystal display panel further comprises a sealant, the second protective layer is attached to the connecting line and the sealant, and a projection area of the second protective layer on a plane perpendicular to the substrate is equal to a projection area of the sealant and the connecting line on the plane perpendicular to the substrate.
6. The liquid crystal display panel according to claim 5, wherein a surface roughness of a side of the second protective layer in contact with the connection line is larger than a surface roughness of a side of the second protective layer in contact with the metal layer.
7. The liquid crystal display panel according to claim 3, wherein the first protective layer and the second protective layer are made of the same material.
8. The liquid crystal display panel of claim 7, wherein a material of the first protective layer comprises one of indium tin oxide and indium zinc oxide.
9. The liquid crystal display panel of claim 3, wherein the first protective layer has a thickness in a range of 1300 nm to 1500 nm.
10. A method for preparing a liquid crystal display panel is characterized by comprising the following steps:
providing a first substrate and a second substrate; the first substrate comprises a substrate and a driving circuit layer, and the driving circuit layer comprises a connecting wire;
the first substrate and the second substrate are paired, and liquid crystal is arranged in a liquid crystal box formed by the paired boxes;
after one side of a first substrate is processed, a protective layer and a metal layer are formed on the side face of the first substrate; the metal layer is connected with the connecting wire and is used for connecting the connecting wire and the chip on film; the oxidation resistance of the protective layer is greater than that of the metal layer, the protective layer is made of a conductive material and is used for preventing the metal layer from being oxidized;
curing the protective layer and the metal layer;
and carrying out laser etching on the protective layer and the metal layer to obtain metal patterns of the metal layer and the protective layer, and forming the liquid crystal display panel.
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Application publication date: 20210723 |