CN110796948B - Display module, electronic equipment and display module processing method - Google Patents
Display module, electronic equipment and display module processing method Download PDFInfo
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- CN110796948B CN110796948B CN201911044544.7A CN201911044544A CN110796948B CN 110796948 B CN110796948 B CN 110796948B CN 201911044544 A CN201911044544 A CN 201911044544A CN 110796948 B CN110796948 B CN 110796948B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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Abstract
The invention provides a display module, electronic equipment and a processing method of the display module. This display module assembly is applied to electronic equipment, includes: the module body comprises a first metal connecting layer; the circuit board comprises a second metal connecting layer, and a waterproof isolating layer covers the surface of the second metal connecting layer; the waterproof isolation layer is fixedly connected with the first metal connecting layer through the conductive adhesive layer, and conductive particles of the conductive adhesive layer penetrate through the waterproof isolation layer so that the second metal connecting layer is conductively connected with the first metal connecting layer through the conductive adhesive layer. Compared with the prior art, the embodiment of the invention can more effectively realize the water resistance of the metal connecting layer of the circuit board on the premise of ensuring the normal work of the display module, thereby improving the water resistance and corrosion resistance of the display module and further ensuring the service performance of the display module.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a display module, electronic equipment and a display module processing method.
Background
With the rapid development of the communication technology field, the use of electronic devices such as mobile phones is more and more common. Electronic equipment generally includes the display module assembly, and the display module assembly can include the module body and the circuit board of conductive connection, and the circuit board can be used to realize the signal transmission between other devices in module body and the electronic equipment. It should be pointed out that the metal connecting layer department that circuit board and air contacted is moldy because of the infiltration of steam sweat etc. very easily, can influence whole display module assembly's performance like this, and the solution that is used commonly at present is to glue in order to realize waterproofly in metal connecting layer department of circuit board, but, because glue the uniformity, glue some local fretwork scheduling problem, the water-proof effects of the mode of gluing is relatively poor.
Disclosure of Invention
The embodiment of the invention provides a display module, electronic equipment and a display module processing method, and aims to solve the problems that in the prior art, when a dispensing mode is adopted for water prevention, the water prevention effect is poor, and the metal connecting layer of a circuit board in the display module still becomes mildewed.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a display module applied to an electronic device, including:
a module body including a first metal connection layer;
the circuit board comprises a second metal connecting layer, and a waterproof isolating layer covers the surface of the second metal connecting layer;
the waterproof isolation layer passes through the conductive adhesive layer with first metal connecting layer fixed connection, the conductive particle puncture of conductive adhesive layer the waterproof isolation layer, so that the second metal connecting layer passes through the conductive adhesive layer with first metal connecting layer conductive connection.
In a second aspect, an embodiment of the invention provides an electronic device, which includes the display module.
In a third aspect, an embodiment of the present invention provides a display module processing method applied to an electronic device, including:
providing a module body and a circuit board; the module body comprises a first metal connecting layer, and the circuit board comprises a second metal connecting layer;
covering the surface of the second metal connecting layer with a waterproof isolating layer;
fixedly connecting the waterproof isolation layer with the first metal connecting layer through a conductive adhesive layer; and the conductive particles of the conductive adhesive layer penetrate the waterproof isolation layer, so that the second metal connecting layer is in conductive connection with the first metal connecting layer through the conductive adhesive layer.
In the display module provided by the embodiment of the invention, the surface of the second metal connecting layer of the circuit board is covered with the waterproof isolating layer, and compared with dispensing, the waterproof isolating layer can play a better waterproof and anti-corrosion effect so as to effectively protect the second metal connecting layer of the circuit board, and the second metal connecting layer of the circuit board cannot be directly contacted with air, so that the second metal connecting layer of the circuit board can be prevented from mildewing due to the permeation of water vapor, sweat and the like. In addition, waterproof isolation layer is still through the first metal connection layer fixed connection of conductive adhesive layer with the module body, the conductive particle puncture waterproof isolation layer of conductive adhesive layer, so that the second metal connection layer of circuit board passes through the first metal connection layer conductive connection of conductive adhesive layer with the module body, that is to say, although the surface on the second metal connection layer of circuit board is covered by waterproof isolation layer, under the puncture effect of conductive particle of conductive adhesive layer, circuit board and module body still can conductive connection, can carry out the transmission of the signal of telecommunication between circuit board and the module body, can guarantee display module's normal work like this. Therefore, compared with the prior art, the embodiment of the invention can more effectively realize the water resistance of the metal connecting layer of the circuit board on the premise of ensuring the normal work of the display module, thereby improving the water resistance and corrosion resistance of the display module and further ensuring the service performance of the display module.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a display module provided in an embodiment of the present invention at a viewing angle;
fig. 2 is a schematic structural diagram of a display module according to another view angle provided in the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display module according to another view angle provided in the embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is another enlarged partial view of FIG. 3;
FIG. 6 is a further enlarged fragmentary view of FIG. 3;
fig. 7 is a flowchart of a display module processing method according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following first describes a display module provided in an embodiment of the present invention.
It should be noted that the display module provided by the embodiment of the invention is applied to electronic equipment. Specifically, the electronic device may be: computers (Computer), Mobile phones, Tablet Personal computers (Tablet Personal Computer), Laptop computers (Laptop Computer), Personal digital assistants (PDA for short), Mobile Internet Devices (MID), Wearable devices (Wearable Device), televisions, and the like.
In addition, the display module that the embodiment of the invention provides can be flexible display module or rigid display module, specifically, the display module can be: liquid Crystal Display (LCD) modules, Active-matrix organic light-emitting diode (AMOLED) modules, and the like; the LCD module may also be referred to as LCM for short.
Referring to fig. 1 to 6, schematic structural diagrams of a display module according to an embodiment of the present invention are shown. As shown in fig. 1 to 6, the display module includes: module body 2, circuit board 4 and conductive adhesive layer 6.
The module body 2 includes a first metal connection layer 21.
Here, the module body 2 may be a component actually providing a display function in the display module, specifically, the module body 2 may include a module upper layer 23 and a module lower layer 25 which are disposed in an overlapping manner, the first metal connection layer 21 may be located on a surface of the module upper layer 23 which is far away from the module lower layer 25, and the first metal connection layer 21 may be formed by a metal trace, a golden finger layer, and the like. Here, in the case where the display module 2 belongs to a touch module, the module upper layer 23 may be referred to as a display touch module upper layer.
The circuit board 4 includes a second metal connection layer 41, and the surface of the second metal connection layer 41 is covered with a waterproof isolation layer 43.
Here, the Circuit Board 4 may be a Flexible Printed Circuit (FPC) or a rigid Printed Circuit Board (PCB), and the second metal connection layer 41 of the Circuit Board 4 may be formed by metal traces, a gold finger layer, and the like, where the metal traces may be copper traces.
Here, the waterproof isolation layer 43 may be made of a material that is easily punctured. Alternatively, the waterproof insulation layer 43 may be a polyester layer or a resin layer, for example, the material of the waterproof insulation layer 43 may be OC polyester organic matter or resin.
Here, the waterproof insulation layer 43 may have a thickness of 0.01 to 50 micrometers. Alternatively, the thickness of the waterproof insulation layer 43 may be greater than or equal to 0.5 micrometers and less than or equal to 2 micrometers, such as 0.5 micrometers, 1 micrometer, 1.5 micrometers, or 2 micrometers.
Of course, the material and thickness of the waterproof isolation layer 43 are not limited thereto, and may be determined according to practical situations, and the embodiment of the present invention is not limited thereto.
Here, a hot pressing process may be adopted to fixedly connect the waterproof isolation layer 43 to the first metal connection layer 21 through the conductive adhesive layer 6, so as to realize the hot pressing binding of the waterproof isolation layer 43, the conductive adhesive layer 6 and the first metal connection layer 21, that is, the binding of the module body 2 and the circuit board 4.
The Conductive adhesive layer 6 may be an Anisotropic Conductive Film (ACF) layer, and the Conductive adhesive layer 6 may have Conductive particles 61 therein.
Here, the material of the conductive particles 61 may be gold (Au), silver (Ag), nickel (Ni), copper (Cu), which are metal conductive materials, or carbon (C), which is a non-metal conductive material.
Here, the diameter of the conductive particles 61 may be 0.01 to 50 micrometers. Alternatively, the diameter of the conductive case 61 may be 3 micrometers to 10 micrometers, such as 3 micrometers, 5 micrometers, 7 micrometers, 9 micrometers, and the like.
Of course, the material and the diameter of the conductive particles 61 are not limited thereto, and may be determined according to practical situations, and the embodiment of the present invention is not limited thereto.
In the display module provided by the embodiment of the invention, the surface of the second metal connecting layer 41 of the circuit board 4 is covered with the waterproof isolating layer 43, compared with dispensing, the waterproof isolating layer 43 can play a better waterproof and anticorrosion role so as to effectively protect the second metal connecting layer 41 of the circuit board 4, and the second metal connecting layer 41 of the circuit board 4 cannot be directly contacted with air, so that the second metal connecting layer 41 of the circuit board 4 can be prevented from mildewing due to the infiltration of water vapor and sweat and the like. In addition, waterproof isolation layer 43 still passes through conducting resin layer 6 and module body 2's first metal connecting layer 21 fixed connection, conducting particle 61 puncture waterproof isolation layer 43 of conducting resin layer 6, so that the second metal connecting layer 41 of circuit board 4 passes through conducting resin layer 6 and module body 2's first metal connecting layer 21 conductive connection, that is to say, although the surface of circuit board 4's second metal connecting layer 41 is covered by waterproof isolation layer 43, under conducting particle 61's of conducting resin layer 6 puncture effect, circuit board 4 still can conductive connection with module body 2, can carry out the transmission of signal of telecommunication between circuit board 4 and the module body 2, can guarantee display module's normal work like this. Therefore, compared with the prior art, the embodiment of the invention can more effectively realize the water resistance of the metal connecting layer of the circuit board 4 on the premise of ensuring the normal work of the display module, thereby improving the water resistance and corrosion resistance of the display module and further ensuring the service performance of the display module.
Alternatively, as shown in fig. 4 and 5, the edges of the conductive particles 61 have corners, and the corners penetrate the waterproof insulation layer 43.
Because the edge of conductive particle 61 has the edges and corners, conductive particle 61 can be thought of as special-shaped conductive particle, under the condition that the material of waterproof isolation layer 43 is not soft enough, under the effect of edges and corners, conductive particle 61 also can pierce waterproof isolation layer 43 reliably to realize the conductive connection of circuit board 4 and module body 2.
It should be noted that, in the case where the material of the waterproof insulation layer 43 is soft enough, as shown in fig. 6, the edges of the conductive particles 61 may not be provided with corners, and in this case, the conductive particles 16 are approximately spherical, which is also feasible.
Optionally, as shown in fig. 4 to 6, the circuit board 4 further includes a circuit board body 45, one end of the circuit board body 45 is provided with a groove along a thickness direction, the second metal connection layer 41 is provided at a bottom of the groove, and a sum of a thickness of the second metal connection layer 41 and a thickness of the waterproof isolation layer 43 is smaller than or equal to a depth of the groove.
Here, in the case where the circuit board 4 is a flexible circuit board, the circuit board body 45 may include a cover film made of a polyimide (i.e., PI) material.
Because the thickness of second metal connecting layer 41 and the depth that the sum of the thickness of waterproof isolation layer 43 is less than or equal to the recess, waterproof isolation layer 43 can not bulge the recess, is favorable to material saving like this, can also guarantee that the thickness that display module tied up the region does not exceed the thickness in other regions to, under the condition that circuit board 4 is flexible circuit board, still be favorable to guaranteeing flexible circuit board's pliability and bendability.
It should be noted that, in general, if the circuit board 41 is a flexible circuit board, it may be considered that the display module adopts an FPC binding manner; however, if an Integrated Circuit (IC) is fixed On the flexible circuit board, it is considered that the display module is bonded by a cof (chip On fpc).
In conclusion, in this embodiment, through the setting of this protective layer of waterproof isolation layer 43, can cover the metal connecting layer of circuit board 4 is whole, does not influence simultaneously conducting between circuit board 4 and the module body 2, can promote display module's the regional waterproof corrosion resistance who binds to thereby promote display module's corrosion resistance.
The following describes an electronic device provided in an embodiment of the present invention.
The embodiment of the invention also provides electronic equipment, and the electronic equipment further comprises the display module. The specific implementation process of the display module is described with reference to the above description, and the embodiment of the present invention is not limited thereto.
Because the display module has the technical effects, the electronic equipment with the display module also has the corresponding technical effects, which are not described in detail herein.
The following describes a method for processing a display module according to an embodiment of the present invention.
Referring to fig. 7, a flowchart of a display module processing method according to an embodiment of the invention is shown. As shown in fig. 7, the method includes the steps of:
703, fixedly connecting the waterproof isolation layer with the first metal connecting layer through a conductive adhesive layer; the conductive particles of the conductive adhesive layer penetrate the waterproof isolation layer, so that the second metal connecting layer is in conductive connection with the first metal connecting layer through the conductive adhesive layer.
Optionally, through conductive adhesive layer, with waterproof isolation layer and first metal connection layer fixed connection, include:
and the waterproof isolation layer is fixedly connected with the first metal connecting layer by adopting a hot pressing mode through the conductive adhesive layer.
Here, through the hot pressing mode, can realize the binding of module body and circuit board among the display module assembly very conveniently reliably.
Optionally, the edges of the conductive particles have corners that pierce the water resistant barrier layer.
Optionally, the circuit board further comprises a circuit board body; the method further comprises the following steps:
a groove is formed in one end of the circuit board body along the thickness direction, and the second metal connecting layer is arranged at the bottom of the groove; and the sum of the thickness of the second metal connecting layer and the thickness of the waterproof isolating layer is less than or equal to the depth of the groove.
Compared with the prior art, the embodiment of the invention can more effectively realize the water resistance of the metal connecting layer of the circuit board on the premise of ensuring the normal work of the display module, thereby improving the water resistance and corrosion resistance of the display module and further ensuring the service performance of the display module.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. The utility model provides a display module assembly, is applied to electronic equipment, its characterized in that includes:
a module body including a first metal connection layer;
the circuit board comprises a second metal connecting layer, and a waterproof isolating layer covers the surface of the second metal connecting layer;
the waterproof isolation layer is fixedly connected with the first metal connecting layer through the conductive adhesive layer, and conductive particles of the conductive adhesive layer penetrate through the waterproof isolation layer so that the second metal connecting layer is in conductive connection with the first metal connecting layer through the conductive adhesive layer;
the circuit board further comprises a circuit board body, a groove is formed in one end of the circuit board body in the thickness direction, the second metal connecting layer is arranged at the bottom of the groove, and the sum of the thickness of the second metal connecting layer and the thickness of the waterproof isolating layer is smaller than or equal to the depth of the groove.
2. The display module of claim 1, wherein edges of the conductive particles have corners that pierce the waterproof barrier layer.
3. The display module according to any one of claims 1 to 2, wherein the conductive particles satisfy at least one of:
the conductive particles are made of gold, silver, nickel, copper or carbon;
the diameter of the conductive particles is greater than or equal to 3 micrometers and less than or equal to 10 micrometers.
4. The display module according to any one of claims 1 to 2, wherein the waterproof isolation layer satisfies at least one of:
the waterproof isolation layer is a polyester layer or a resin layer;
the thickness of the waterproof isolation layer is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers.
5. An electronic device, comprising the display module according to any one of claims 1 to 4.
6. A processing method of a display module is applied to electronic equipment and is characterized by comprising the following steps:
providing a module body and a circuit board; the module body comprises a first metal connecting layer, and the circuit board comprises a second metal connecting layer;
covering the surface of the second metal connecting layer with a waterproof isolating layer;
fixedly connecting the waterproof isolation layer with the first metal connecting layer through a conductive adhesive layer; the conductive particles of the conductive adhesive layer penetrate the waterproof isolation layer, so that the second metal connecting layer is in conductive connection with the first metal connecting layer through the conductive adhesive layer;
the circuit board further comprises a circuit board body; the method further comprises the following steps:
a groove is formed in one end of the circuit board body in the thickness direction, and the second metal connecting layer is arranged at the bottom of the groove; wherein the sum of the thickness of the second metal connecting layer and the thickness of the waterproof isolation layer is less than or equal to the depth of the groove.
7. The processing method of claim 6, wherein the fixedly connecting the waterproof isolation layer and the first metal connecting layer through a conductive adhesive layer comprises:
and fixedly connecting the waterproof isolation layer with the first metal connecting layer by adopting a hot-pressing mode through a conductive adhesive layer.
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| CN201911044544.7A CN110796948B (en) | 2019-10-30 | 2019-10-30 | Display module, electronic equipment and display module processing method |
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| CN201911044544.7A CN110796948B (en) | 2019-10-30 | 2019-10-30 | Display module, electronic equipment and display module processing method |
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