CN1558386A - Bonding structure for bonding electrode and circuit board electrode and flat display device - Google Patents
Bonding structure for bonding electrode and circuit board electrode and flat display device Download PDFInfo
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- CN1558386A CN1558386A CNA2004100028836A CN200410002883A CN1558386A CN 1558386 A CN1558386 A CN 1558386A CN A2004100028836 A CNA2004100028836 A CN A2004100028836A CN 200410002883 A CN200410002883 A CN 200410002883A CN 1558386 A CN1558386 A CN 1558386A
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Abstract
The bonded structure includes the first base plate with the first surface; several bonded electrodes formed on the first base plate and with bonding area in the edge of the first base plate; conductive adhesive layer to cover the bonded area; and circuit board with at least one circuit board electrode on the adhesive layer. The circuit board electrode is contact closely with the corresponding electrode via the adhesive layer. The anisotropic conductive adhesive layer covers the bonded electrode completely to avoid exposure, and this can further raise the bonding strength between the bonded electrode and the circuit board electrode and raise the product stability.
Description
Technical field
The present invention relates to the bonding structure of a kind of bonding electrode and circuit board electrode, particularly relevant for a kind of bonding electrode of flat display apparatus and bonding structure of circuit board electrode of being used in.
Background technology
In recent years, various novel planar display device (flat panel display; FPD) constantly development and Design is come out, for example LCD (liquid crystal display; LCD), (organic light emitting diode OLED) and plasma display, and has and replaces conventional cathode ray tube (cathode ray tube gradually organic light emitting display; CRT) trend.Wherein, plasma display is a kind ofly to produce luminous flat display apparatus by gas discharge, its maximum characteristic be light, thin, easily maximize and do not have the visual angle problem.
General plasma display is behind the discharge cell (discharge cell) of prebasal plate and metacoxal plate involution (sealing) formation sealing, more a plurality of circuit board electrodes is connected to the bonding region of the bonding electrode on prebasal plate and the metacoxal plate.Because circuit board electrode is used for externally forming being electrically connected, so the intensity of the bonding structure of circuit board electrode and bonding electrode and fiduciary level will influence the quality of plasma display.
Please refer to Fig. 1, it shows the vertical view of plasma display formed bonding region behind prebasal plate and metacoxal plate involution.This plasma display 10 comprises a prebasal plate 12, and a metacoxal plate 14, be disposed at the top of this prebasal plate 12 abreast, and a plurality of bonding electrode 16 is formed between the two substrates.Bonding structure with prebasal plate 12 is an example, and this bonding electrode 16 extends to the edge of prebasal plate 12, and a dielectric layer 18 is formed on these a plurality of bonding electrodes 16, is used for protecting this bonding electrode 16; And the bonding electrode 16 that is not covered by this dielectric layer 18 wherein, have a circuit board electrode fate 22 in this bonding zone 20, and this bonding zone 20 is used for being electrically connected with a circuit board as a bonding zone 20.
And the bonding structure of the bonding electrode of traditional plasma display and circuit board electrode, please refer to Fig. 2, wherein electric connection layer 30 is disposed on the circuit board electrode fate 22, then, as shown in Figure 3A, it is the sectional view corresponding to the 3a-3a ' tangent line of Fig. 2, and the circuit board 40 that will have circuit board electrode 42 is disposed on this electric connection layer 30, and wherein each circuit board electrode 42 corresponds to a bonding electrode 16.At last, after carrying out thermocompression bonding (bonding), circuit board electrode 42 is electrically connected on this bonding electrode 16 by this electric connection layer 30.Wherein, this electric connection layer 30 is electrically connected this bonding electrode 16 and the circuit board electrode 42 except being used for, and also is used for closing admittedly prebasal plate 12 and circuit board 40.
Yet, in the bonding structure of the bonding electrode 16 of traditional plasma display and circuit board electrode 42, electric connection layer 30 exists only in the part of bonding electrode 16 and circuit board electrode 42 overlappings, even through thermocompression bonding technology, the electric connection layer 30 formed electric connection layer overflow areas 32 that overflow also can't cover the border 13 that this bonding electrode exposes district 28 or surmounts this prebasal plate 12, therefore the bond strength of this structure is very not good, as shown in Figure 3A.
In addition, because still having partly, bonding electrode 16 exposed out, and this bonding electrode exposes the often extra coating of need one deck layer of silica gel 34 of district 28, please refer to Fig. 3 B, protecting contacting of this bonding electrode 16 and isolated simultaneously atmosphere and bonding electrode 16, and then keep the stable of plasma display and by reliability testing; Moreover this layer of silica gel 34 also can further be formed between the edge 13 and circuit board 40 of prebasal plate 12, to increase bond strength.But the layer of silica gel application step that this is extra certainly will reduce the process speed of product, and increases manufacturing cost.
Therefore, do further improvement and design at the relativeness of electric connection layer, bonding electrode and circuit board electrode, with the intensity of the bonding structure that improves circuit board electrode and bonding electrode and increase the fiduciary level of flat display apparatus, be a very important problem.
Summary of the invention
In view of this, in order to address the above problem, fundamental purpose of the present invention is to improve and design at the relativeness of anisotropic conductive gluing layer and bonding electrode and circuit utmost point electrode, with the bonding electrode that a kind of high bond strength is provided and the bonding structure of circuit board electrode, except making bonding electrode and circuit board electrode be electrically connected, because this anisotropic conductive gluing layer covers bonding electrode fully to avoid it exposed, therefore can further increase the bond strength of bonding electrode and circuit board electrode.
Another object of the present invention provides a kind of flat display apparatus; it has the bonding electrode of high bond strength and the bonding structure of circuit board electrode; by the relativeness of adjusting anisotropic conductive gluing layer and bonding electrode and circuit board electrode; make the anisotropic conductive gluing layer cover this bonding electrode fully; not only increase the bond strength of bonding electrode and circuit board electrode; and the further protected key composite electrode of this anisotropic conductive gluing layer significantly improves the stability of flat display apparatus.
Flat display apparatus of the present invention, if cooperate with the formed bonding electrode of thick film (thick film) technology mode, for example contain silver electrode, then except the glue material that adds, the anisotropic conductive gluing layer that covers bonding electrode fully also constitutes a protective seam to intercept the infiltration of aqueous vapor, reduce silver atoms migration (Agmigration) effect, and then avoid the phenomenon of bonding electrode short circuit to take place; If cooperate the bonding electrode that forms with film (thinfilm) technology mode, then needn't add other glue material, what can completely cut off bonding electrode and atmosphere contacts the stability of increase product.
For reaching above-mentioned purpose, the bonding structure of bonding electrode of the present invention and circuit board electrode, comprise one first substrate, this first substrate has a first surface, and on the first surface of this first substrate, be formed with a plurality of bonding electrodes, wherein these a plurality of bonding electrodes contact with the first surface of a second surface with this first substrate, and this bonding electrode has one the 3rd surface in the opposition side of this second surface, and this bonding electrode has a bonding region in the edge of first substrate.On part the 3rd surface of these a plurality of bonding electrodes, also can further cover one second substrate, and expose this bonding region.In addition, one anisotropic conductive gluing layer is formed on the 3rd surface of the first surface of this first substrate and this bonding electrode, and cover this bonding region fully, and the circuit board with at least one circuit board electrode is formed on this anisotropic conductive gluing layer, and be fixed on this bonding electrode with this anisotropic conductive gluing layer, and the gap between this circuit board electrode and this bonding electrode is with this anisotropic conductive gluing layer driving fit.
According to the bonding structure of bonding electrode of the present invention and circuit board electrode, wherein also comprise a glue material and be formed on this anisotropic conductive gluing layer and this circuit board electrode, be used for preventing the infiltration of aqueous vapor.
According to the bonding structure of bonding electrode of the present invention and circuit board electrode, also comprise on the 3rd surface that an insulation course is formed at this bonding electrode, and this bonding region is not covered by this insulation course.
Based on another order of the present invention, the flat display apparatus of the bonding structure of a kind of bonding electrode with high bond strength of the present invention and circuit board electrode, at least comprise one first substrate, this first substrate has a first surface, and on the first surface of this first substrate, be formed with a plurality of bonding electrodes, wherein these a plurality of bonding electrodes contact with the first surface of a second surface with this first substrate, and this bonding electrode has one the 3rd surface in the opposition side of this second surface.On part the 3rd surface of these a plurality of bonding electrodes, also be coated with one second substrate, and other the 3rd surface that is not covered by this second substrate is defined as a bonding region.In addition, one anisotropic conductive gluing layer is formed on the 3rd surface of the first surface of this first substrate and this bonding electrode, and cover this bonding region fully, and the circuit board with at least one circuit board electrode is formed on this anisotropic conductive gluing layer, and be fixed on this bonding electrode with this anisotropic conductive gluing layer, and the system of the gap between this circuit board electrode and this bonding electrode is with this anisotropic conductive gluing layer driving fit.
According to flat display apparatus of the present invention, wherein this first substrate can be a header board, and this second substrate can be a back plate; On the other hand, this first substrate also can be a back plate, and this second substrate also can be a header board.
For above-mentioned purpose of the present invention, feature can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 shows the vertical view of existing plasma display formed bonding region behind prebasal plate and metacoxal plate involution;
Fig. 2 shows the bonding electrode of traditional plasma display and the bonding structure vertical view of circuit board electrode;
Fig. 3 A and Fig. 3 B show the bonding electrode of traditional plasma display and the bonding structure sectional view of circuit board electrode;
Fig. 4 A to Fig. 4 C shows the bonding structure vertical view according to its bonding electrode of plasma display of the present invention and circuit board electrode;
Fig. 5 shows the bonding structure sectional view according to its bonding electrode of plasma display of the present invention and circuit board electrode;
Fig. 6 A to Fig. 6 C shows the section of structure of plasma display system according to the preferred embodiment of the invention;
Fig. 7 shows the section of structure of the plasma display system of other preferred embodiment according to the present invention; And
Fig. 8 shows the skeleton view of flat display apparatus according to the preferred embodiment of the invention.
Description of reference numerals
10 plasma displays, 12 prebasal plates
16 bonding electrodes, 18 insulation courses
22 circuit board electrode fates, 20 bondings zone
28 bonding electrodes expose district's 30 electric connection layers
32 electric connection layer overflow areas, 40 circuit boards
42 circuit board electrodes, 100 plasma displays
102 first substrates, 104 second substrates
115 first interfaces, border of 113 first substrates
116 bonding electrodes, 118 insulation courses
120 bondings zone, 128 bonding electrodes expose the district
130 anisotropic conductive gluing layers, 140 circuit boards
142 circuit board electrodes, 200 flat display apparatus
The profile line of 3a-3a ' along the profile line 5-5 ' of 3a-3a ' along 5-5 '
Embodiment
The bonding structure of bonding electrode of the present invention and circuit board electrode and comprise the flat display apparatus of this structure, its characteristics are to make the anisotropic conductive gluing layer to cover the formed bonding electrode of the bonding electrode that does not link to each other with circuit board electrode fully to expose the district, and this anisotropic conductive gluing layer also can further cover the edge of this bonding electrode fully, its interelectrode bond strength will significantly improve thus, and can avoid the short circuit of bonding electrode.Below, be example with conjunction with figs. and with the plasma display system, describe the bonding electrode of high bond strength of the present invention and the bonding structure of circuit board electrode in detail.
At first, please refer to Fig. 4 A, it shows the vertical view of its bonding structure that designs of plasma display system of the present invention on substrate, is used for further explaining the definition and the relativeness of each parts among the present invention by this.This plasma display device 100 comprises one first substrate 102 and one second substrate 104, and this second substrate 104 is arranged at the top of this first substrate 102 after to bit pattern abreast.Bonding structure with first substrate 102 is an example, be provided with a bonding zone 120 outside the involution place of this first substrate 102 and second substrate 104, be provided with a plurality of parallel to each other and bonding electrode (not shown)s that can not be electrically connected each other in bonding zone 120, the shape of each bonding electrode is approximately elongated.Wherein, on a plurality of bonding electrode (not shown)s beyond this bonding zone 120, also can optionally form an insulation course 118, to be used for protecting this bonding electrode.This insulation course 118 can be a dielectric layer; And the material of this bonding electrode can be the electrode of argentiferous, also can be any one or more formed alloys or the laminated thing of chromium, copper, aluminium, nickel, tungsten and cobalt, and the manufacture craft mode of this bonding electrode can be photosensitive thick film method, photosensitive film method or silk screen print method.
Still please refer to Fig. 4 A, bonding structure of the present invention is to be connected with first substrate 102 with a circuit board 140.Please refer to Fig. 5, it is the sectional view corresponding to 5-5 ' tangent line among Fig. 4 A, this circuit board 140 has a plurality of circuit board electrodes 142, wherein, this circuit board 140 also is connected with bonding electrode 116 on first substrate 102 with circuit board electrode 142, and this circuit board electrode 142 closes on the part surface of bonding electrode 116 corresponding with it admittedly by anisotropic conductive gluing layer 130, and realizes the electrical connection of circuit board electrode 142 and bonding electrode 116 by this anisotropic conductive gluing layer 130.Wherein, this anisotropic conductive gluing layer 130 is electrically connected by pressing place at it, can be an anisotropy conductiving glue that contains the conducting particles composition (anisotropic conductive film, ACF), and this conducting particles can be the metallics that the surface plates gold, silver or nickel; This circuit board electrode 142, it can tape automated bonding mode or flip-chip bonding mode, is connected with bonding electrode 116 by this anisotropic conductive gluing layer 130, to be formed on this bonding electrode 116.
Focusing on of its design of bonding structure of the present invention; be used as the anisotropic conductive gluing layer 130 of connecting circuit plate electrode 142 and bonding electrode 116; after first substrate 102 carries out hot pressing technique with circuit board 140; this anisotropic conductive gluing layer 130 cover fully this bonding electrode 116 not by this second substrate 104; the bonding electrode that insulation course 118 and circuit board electrode 142 are covered exposes district 128; in other words; in bonding structure of the present invention; this anisotropic conductive gluing layer 130 is also as a bonding electrode protective seam, and covers the bonding electrode 116 in this bonding zone 120 fully.Therefore, bonding structure of the present invention is except having stronger bond strength, this anisotropic conductive gluing layer 130 covers bonding electrode fully with isolated with extraneous contacting, if cooperate the bonding electrode that forms with film (thin film) technology mode, then needn't add other glue material, can completely cut off contacting of bonding electrode and atmosphere, increase the stability of product.In addition, this anisotropic conductive gluing layer 130 also can interlink, shown in Fig. 4 B; And the bonding structure of bonding electrode of the present invention and circuit board electrode also is applicable to the insulation course 118 with non-linear shapes edge, shown in Fig. 4 C of institute.
Please refer to Fig. 6 A to Fig. 6 C, show the diagrammatic cross-section of other preferred embodiment of the present invention.Wherein this anisotropic conductive gluing layer 130 covers this bonding electrode 116 fully, and this anisotropic conductive gluing layer 130 also can further be covered on this insulation course 118 or this circuit board 140, as shown in Figure 6A; On the other hand, in bonding structure of the present invention, this anisotropic conductive gluing layer 130 also can overflow one first interface 115 fully, shown in Fig. 6 B, wherein this first interface 115 is for comprising this first substrate boundaries 113, and perpendicular to the plane of this circuit board electrode 142; Another aspect, this anisotropic conductive gluing layer 130 also can partly overflow this first interface 115, shown in Fig. 6 C.Thus, this bonding electrode 116 will have preferred bond strength with this circuit board electrode 142.
In another preferred embodiment of the present invention, the bonding structure of bonding electrode of the present invention and circuit board electrode, please refer to Fig. 7, also can add a glue material 134 and be disposed on this anisotropic conductive gluing layer and this circuit board electrode, be used for preventing the infiltration of aqueous vapor.The bonding structure of above-mentioned plasma display can reduce silver atoms migration (Ag migration) effect, and then avoids the phenomenon of bonding electrode short circuit to take place, and especially is fit to the formed bonding electrode of thick-film technique mode.
Above-described preferred embodiment is an example with the bonding structure of first substrate 102, and similarly, the bonding structure of bonding electrode of the present invention and circuit board electrode also is applicable to the bonding structure corresponding to second substrate 104 of this first substrate 102.
Please refer to Fig. 8, it shows that one meets the skeleton view of the flat display apparatus 200 of bonding structure of the present invention, and wherein this first substrate 102 can be a prebasal plate, and this second substrate 104 then can be a metacoxal plate.Learn that by knowing among the figure bonding structure of the present invention is applicable in the connection of the circuit board that prebasal plate or metacoxal plate are corresponding with it simultaneously.Wherein, this circuit board 140 can be a flexible PCB (flexible printed circuit, FPC).
The bonding structure of bonding electrode of the present invention and circuit board electrode, be not only applicable to plasma display system, improve the bond strength of its substrate and additional circuit, this bonding structure also be applicable to other need with the flat display apparatus of adding the circuit bonding on, for example LCD and organic light emitting display all are applicable to bonding structure of the present invention.
Though the present invention is open in conjunction with the preferred embodiments as above; so it is not to be used for limiting scope of the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can doing various changes and retouching, so protection scope of the present invention is with appended being as the criterion that claim was defined.
Claims (19)
1. the bonding structure of bonding electrode and circuit board electrode comprises:
One first substrate, this first substrate has a first surface;
A plurality of bonding electrodes, these a plurality of bonding electrodes are formed on the first surface of this first substrate with a second surface, and this bonding electrode has one the 3rd surface in the opposition side of this second surface, and wherein these a plurality of bonding electrodes have the bonding region in the edge of first substrate;
One anisotropic conductive gluing layer is formed on the 3rd surface of the first surface of this first substrate and this bonding electrode, and covers this bonding region fully; And
Circuit board with at least one circuit board electrode, be formed on this anisotropic conductive gluing layer, wherein this circuit board electrode is fixed on the corresponding bonding electrode with this anisotropic conductive gluing layer, and between this circuit board electrode bonding electrode corresponding with this with this anisotropic conductive gluing layer driving fit.
2. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode wherein also comprises a glue material and is formed on this anisotropic conductive gluing layer and this circuit board electrode.
3. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode also comprises on part the 3rd surface that an insulation course is formed at these a plurality of bonding electrodes, and exposes this bonding region.
4. the bonding structure of bonding electrode as claimed in claim 3 and circuit board electrode, wherein this insulation course is a dielectric material.
5. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode also comprises on part the 3rd surface that one second substrate is formed at these a plurality of bonding electrodes, and exposes this bonding region.
6. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode, wherein the outward extending border of this first surface is one first boundary line, be positioned at this corresponding position of first boundary line and this circuit board electrode has one second boundary line, and this anisotropic conductive gluing layer exceeds one first interface that comprises this first boundary line and this second boundary line between the part of this circuit board electrode and this bonding electrode along normal direction in circuit board electrode.
7. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode, wherein this anisotropic conductive gluing layer is an anisotropy conductiving glue.
8. the bonding structure of bonding electrode as claimed in claim 1 and circuit board electrode, wherein this circuit board is a flexible PCB.
9. flat display apparatus comprises:
One first substrate, this first substrate has a first surface;
A plurality of bonding electrodes, these a plurality of bonding electrodes are formed on the first surface of this first substrate with a second surface, and this bonding electrode has one the 3rd surface in the opposition side of this second surface;
One second substrate covers on part the 3rd surface of these a plurality of bonding electrodes, and the 3rd surface portion that is not covered by this second substrate is defined as a bonding region;
One anisotropic conductive gluing layer is formed on the 3rd surface of the first surface of this first substrate and this bonding electrode, and covers this bonding region fully; And
Circuit board with at least one circuit board electrode, be formed on this anisotropic conductive gluing layer, wherein this circuit board electrode is fixed on the corresponding bonding electrode with this anisotropic conductive gluing layer, and between this circuit board electrode bonding electrode corresponding with this with this anisotropic conductive gluing layer driving fit
Wherein one of this first substrate and this second substrate person is the front board structure of a flat display apparatus, and another person is the back plate structure of a flat display apparatus.
10. flat display apparatus as claimed in claim 9, wherein this bonding electrode is a thick membrane electrode.
11. flat display apparatus as claimed in claim 9, wherein this bonding electrode is one to contain silver electrode.
12. flat display apparatus as claimed in claim 9 wherein also comprises a glue material and is formed on this anisotropic conductive gluing layer and this circuit board electrode.
13. flat display apparatus as claimed in claim 9, wherein this bonding electrode is a membrane electrode.
14. flat display apparatus as claimed in claim 9, wherein the material of this bonding electrode is selected in the alloy of free chromium, copper, aluminium, nickel, tungsten and cobalt or the group that laminated thing is formed.
15. flat display apparatus as claimed in claim 9 also comprises on part the 3rd surface that an insulation course is formed at these a plurality of bonding electrodes, and exposes this bonding region.
16. flat display apparatus as claimed in claim 9, wherein this insulation course is a dielectric material.
17. flat display apparatus as claimed in claim 9, wherein the outward extending border of this first surface is one first boundary line, be positioned at this corresponding position of first boundary line and this circuit board electrode has one second boundary line, and this anisotropic conductive gluing layer exceeds one first interface that comprises this first boundary line and this second boundary line between the part of this circuit board electrode and this bonding electrode along normal direction in circuit board electrode.
18. flat display apparatus as claimed in claim 9, wherein this anisotropic conductive gluing layer is an anisotropy conductiving glue.
19. flat display apparatus as claimed in claim 9, wherein this circuit board is a flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100028836A CN100416624C (en) | 2004-01-20 | 2004-01-20 | Bonding structure for bonding electrode and circuit board electrode and flat display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100028836A CN100416624C (en) | 2004-01-20 | 2004-01-20 | Bonding structure for bonding electrode and circuit board electrode and flat display device |
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| Publication Number | Publication Date |
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| CN1558386A true CN1558386A (en) | 2004-12-29 |
| CN100416624C CN100416624C (en) | 2008-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100028836A Expired - Fee Related CN100416624C (en) | 2004-01-20 | 2004-01-20 | Bonding structure for bonding electrode and circuit board electrode and flat display device |
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| CN (1) | CN100416624C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332231A (en) * | 2011-10-26 | 2012-01-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
| CN103928415A (en) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | Structure of pin region |
| CN104008979B (en) * | 2014-04-21 | 2017-01-04 | 中国电子科技集团公司第五十五研究所 | The two-dimentional townhouse method for designing of package casing lead-in wire |
| CN107422551A (en) * | 2017-07-25 | 2017-12-01 | 武汉天马微电子有限公司 | A kind of display device |
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001305570A (en) * | 2000-04-24 | 2001-10-31 | Nec Corp | Display panel module and its manufacturing method |
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| CN1174461C (en) * | 2000-09-18 | 2004-11-03 | 友达光电股份有限公司 | Plasma display |
| JP3963843B2 (en) * | 2002-03-22 | 2007-08-22 | シャープ株式会社 | CIRCUIT BOARD CONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME, AND DISPLAY DEVICE HAVING CIRCUIT BOARD CONNECTION STRUCTURE |
-
2004
- 2004-01-20 CN CNB2004100028836A patent/CN100416624C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332231A (en) * | 2011-10-26 | 2012-01-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
| CN103928415A (en) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | Structure of pin region |
| CN104008979B (en) * | 2014-04-21 | 2017-01-04 | 中国电子科技集团公司第五十五研究所 | The two-dimentional townhouse method for designing of package casing lead-in wire |
| CN107422551A (en) * | 2017-07-25 | 2017-12-01 | 武汉天马微电子有限公司 | A kind of display device |
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110796948B (en) * | 2019-10-30 | 2022-03-22 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
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| Publication number | Publication date |
|---|---|
| CN100416624C (en) | 2008-09-03 |
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