CN1174461C - Plasma display - Google Patents
Plasma display Download PDFInfo
- Publication number
- CN1174461C CN1174461C CNB001286439A CN00128643A CN1174461C CN 1174461 C CN1174461 C CN 1174461C CN B001286439 A CNB001286439 A CN B001286439A CN 00128643 A CN00128643 A CN 00128643A CN 1174461 C CN1174461 C CN 1174461C
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- circuit board
- substrate
- electrodes
- bonding electrodes
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Abstract
The present invention relates to a plasma display, which comprises a base board and a circuit board, wherein the base board is provides with a base board edge; a plurality of engagement electrodes which are not electrically connected with each other are arranged on the base board; each engagement electrode is a distance away from the base board edge; a plurality of circuit board electrodes are also arranged on the circuit board in the mode of non-electric connection; the positions of the circuit board electrodes corresponds to the positions of the engagement electrodes; an auxiliary engagement pad is additionally arranged on the base board and is arranged between the engagement electrodes and the base board edge. When the base board and the circuit board are sealed, the auxiliary engagement pad can reduce gaps between the front ends of the engagement electrodes and conductive adhesive, prevent air bubbles and make the base board and the circuit board fixed and combined tightly.
Description
Technical field
(Plasma Display Panel PDP), particularly relates to a kind of plasma scope with assist in engagement pad to the present invention relates to a kind of plasma scope.
Background technology
Along with the development of electronics and information industry, and flat-panel screens (flat panel display, FPD) application and demand constantly enlarge, and plasma scope (PDP) is quite to have a kind of of development potentiality in each flat-panel screens.General plasma scope is behind the discharge cell (discharge cell) with front substrate and back substrate involution (sealing) formation sealing, more a plurality of circuit boards is connected on front or the back substrate.Because circuit board is used for externally forming being electrically connected, so the intensity that engages with each substrate of circuit board and the reliability quality that will influence plasma scope.
Please refer to Fig. 1 and Fig. 2, Fig. 1 is engaging zones 16 schematic diagrames of the back substrate 12 of existing plasma scope 10.Fig. 2 is the back substrate 12 of existing plasma scope 10 and the schematic diagram of circuit board 22 sealing methods.As shown in Figure 1, existing plasma scope 10 includes a front substrate (not shown), and a back substrate 12, is located at the below of front substrate abreast.Back substrate 12 is provided with an engaging zones 16 with the zone of front substrate involution is outer, and this engaging zones is used for being connected with a circuit board 22.Be provided with a plurality of bonding electrodes 14 in the engaging zones 16, be used for being electrically connected with circuit board 22 formation.As shown in Figure 2, circuit board 22 is provided with a plurality of circuit board electrodes that are not electrically connected each other 24, and each circuit board electrode 24 corresponds to a bonding electrodes 14 and is provided with.Wherein, one anisotropic conducting resinl (the Anisotropic Conductive Film that contains the conducting particles composition is set between back substrate 12 and the circuit board 22, ACF) 26 filled, except keeping being electrically connected of back substrate 12 and circuit board 22, more be used to connect back substrate 12 and circuit board 22.
Refer again to Fig. 3, Fig. 3 is connected the schematic diagram of finishing for the back substrate 12 of existing plasma scope 10 with circuit board 22.Last at connection procedure also can apply one deck silica gel 29 between substrate 12 and the circuit board 22 overleaf, contact with atmosphere with protection and isolate conductive glue 26, and being connected of reinforcement back substrate 12 and circuit board 22.But because in the existing plasma scope of making 10, to have a void area 27 between bonding electrodes 14 front ends and the conducting resinl 26, inboard silica gel 291 does not contact with circuit board electrode 24 or substrate 12, and can't reach the effect of adhesion circuit board 22 and substrate 12, so the intensity of involution is very not good.Have now in addition when after involution is finished, inserting silica gel 29, void area 27 contain air at bonding electrodes 14 front ends, and airborne moisture can destroy the material behavior of conducting resinl 26, make conducting resinl 26 by coming off on bonding electrodes 14 or the circuit board electrode 24, or make between bonding electrodes 14 and the circuit board electrode 24 and can't be electrically connected, perhaps destroy the effect of silica gel 29 involutions, and influence the reliability of product.
Summary of the invention
The object of the present invention is to provide a kind of plasma scope, to solve above-mentioned existing issue with assist in engagement pad.
The object of the present invention is achieved like this, and a kind of plasma scope (PlasmaDisplay Panel) promptly is provided, and it includes: a substrate, and this substrate has a substrate edges; A plurality of bonding electrodes (bonding pad) are arranged on this substrate in the mode that is not electrically connected each other, and this each bonding electrodes is apart from this substrate edges one spacing; One assist in engagement pad is arranged on this substrate and between this bonding electrodes and this substrate edges; One circuit board; A plurality of circuit board electrodes are arranged on this circuit board in the mode that is not electrically connected each other, and the position of these a plurality of circuit board electrodes is corresponding with the position of these a plurality of bonding electrodes; One conduction tack coat places between this bonding electrodes and this circuit board electrode, in order to this substrate and this circuit board of boning, and makes this bonding electrodes and this circuit board electrode keep being electrically connected; And one the protection tack coat; be arranged on this substrate edges, between this substrate and this circuit board, this protection tack coat also is connected with this conduction tack coat and this assist in engagement pad; to protect this conduction tack coat, this conduction tack coat is not contacted with outside air.
Description of drawings
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Fig. 1 is the engaging zones schematic diagram of the back substrate of existing plasma scope;
Fig. 2 is the back substrate of existing plasma scope and the schematic diagram of circuit board sealing method;
Fig. 3 is connected the schematic diagram of finishing for the back substrate of existing plasma scope with circuit board;
Fig. 4 is the schematic diagram of the engaging zones of the back substrate of plasma scope of the present invention;
Fig. 5 is the back substrate of plasma scope of the present invention and the schematic diagram of circuit board sealing method;
Fig. 6 is connected the schematic diagram of finishing for the back substrate of plasma scope of the present invention with circuit board.
Embodiment
Please refer to Fig. 4, the schematic diagram of the engaging zones that Fig. 4 designs on substrate for plasma scope of the present invention.With the back substrate is example, and as shown in Figure 4, plasma scope 30 of the present invention includes a front substrate (not shown), and a back substrate 32 is located at the below of front substrate abreast.Back substrate 32 is provided with an engaging zones 36 outward with the regional (not shown) of front substrate involution, be provided with a plurality of parallel to each other and bonding electrodes 34 of not being electrically connected in the engaging zones 36, the shape of each bonding electrodes 34 is approximately elongated, and this each bonding electrodes 34 is apart from substrate edges 31 1 spacings.Be provided with an assist in engagement pad 38 on the back substrate 32 in addition, between bonding electrodes 34 and substrate edges 31.A plurality of bonding electrodes 34 are divided into array, are one group with three bonding electrodes 34 in this embodiment, the about Cheng Chengmen shape of the shape of assist in engagement pad 38, be surrounded on a set of bond electrode 34 around three limits, as shown in Figure 4.
Please refer to Fig. 5 and Fig. 6, Fig. 5 is the back substrate 32 of plasma scope 30 of the present invention and the schematic diagram of circuit board 42 sealing methods, and Fig. 6 is connected the schematic diagram of finishing for the back substrate 32 of plasma scope 30 of the present invention with circuit board 42.As shown in Figure 5, circuit board 42 is a flexible circuit board (Flexible Printed Circuit, FPC), also be provided with a plurality of parallel to each other and circuit board electrodes 44 of not being electrically connected on circuit board 42, each bonding electrodes 34 and a circuit board electrode 44 are arranged at corresponding position.42 of back substrate 32 and circuit boards also comprise a conduction tack coat 46, and it contains the anisotropy conductiving glue (ACF) 46 of conducting particles composition for one deck, in order to bonding back substrate 32 and circuit board 42, and keep being electrically connected.During use, the conducting particles of anisotropy conductiving glue 46 can embed after heating and pressurizing in the bonding electrodes 34 and circuit board electrode 44 of back substrate.Therefore, the conducting particles that uses in an embodiment of the present invention is metallic surface plated with nickel/gold (Ni/Au) metal conductive particles, plate metal and can increase the ductility of conducting particles, plated with nickel can increase the hardness of conducting particles, make the hardness of conducting particles need be better than the hardness of assist in engagement pad 38, be beneficial to the involution of back substrate 32 and circuit board 42.
In most preferred embodiment of the present invention, assist in engagement pad 38 uses the electric conducting material identical with bonding electrodes 34 to make, and so can make bonding electrodes 34 and assist in engagement pad 38 simultaneously in manufacturing process, thus the cost of saving manufacturing process.Because assist in engagement pad 38 utilizes the conductive material manufacturing process identical with bonding electrodes 34, therefore 44 surfaces of the circuit board electrode on the circuit board 42 need be provided with an insulating barrier 48 in addition, are short-circuited between circuit board electrode 44 and the assist in engagement pad 38 when preventing involution.In addition, assist in engagement pad 38 also can use insulating material to be made, and does not so just need the insulating barrier 48 on the circuit board manufacturing electrode 44.
As shown in Figure 6, after utilizing conducting resinl 46 that back substrate 32 and circuit board 42 are adhered, then utilize a protection tack coat 50 isolate conductive glue and outside airs, and assist driving fit.This protection tack coat 50 is a silica gel (silicon paste) 50, can be with the in addition driving fit of the gap at back substrate 32 and circuit board 42 two ends, to improve moisture-proof, resistance to water and the adaptation of plasma scope 30 involutions.Because assist in engagement pad 38 can reduce bonding electrodes 34 front ends on the back substrate 32 and the space between the conducting resinl 46, even can make this two complete fluid-tight engagement fully, therefore can effectively prevent entrapped air pockets between the silica gel 50 of involution and bonding electrodes 34 front ends and the conducting resinl 46, and make back substrate 32 closely with fixedly driving fit of circuit board 42.
The present invention's remaining bubble when mainly utilizing the assist in engagement pad 38 that is surrounded on around the bonding electrodes 34 to reduce substrate and circuit board involution, and the intensity and the reliability of enhancing involution.Plasma scope 30 of the present invention has following two advantages:
(1) improve sealing strength (bonding strength): as shown in Figure 6, the void area of assist in engagement pad 38 between bonding electrodes 34 front ends and conducting resinl 46.In the conventional method, conducting resinl 46 only has the contact area of 34 of conducting resinl 46 and bonding electrodes in order to the surface area of adhesion substrate 32 and circuit board 42, the contact area of the present invention adhesion also comprises the contact area of 38 on conducting resinl 46 and assist in engagement pad, so can improve the intensity of substrate 32 and 42 involutions of circuit board.
(2) reliability of raising involution: have now when after utilizing conducting resinl 26 involutions to finish, inserting silica gel, void area 27 normal easily hiding bubbles at bonding electrodes 14 front ends, destroy the involution effect of silica gel 29, and conducting resinl 26 is contacted with outside air, and influence the reliability of product.The present invention inserts assist in engagement pad 38 in the zone of aforementioned easy generation bubble, make conducting resinl 46, assist in engagement pad 38 and 50 states that present driving fit of silica gel, is difficult for having air or aqueous vapor to infiltrate, and therefore can improve the reliability of product.
The advantage of apparatus of the present invention is, compares with the existing plasma scope of making 10, and the present invention's remaining bubble when mainly utilizing the assist in engagement pad 38 that is positioned at around the bonding electrodes 34 to reduce involution is with the intensity that strengthens involution and the reliability of product.
The above preferred embodiment only of the present invention, all equalizations of doing according to claim of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (8)
1. plasma scope, it includes:
One substrate, this substrate has a substrate edges;
A plurality of bonding electrodes are arranged on this substrate in the mode that is not electrically connected each other, and this each bonding electrodes is apart from this substrate edges one spacing;
One assist in engagement pad is arranged on this substrate and between this bonding electrodes and this substrate edges;
One circuit board;
A plurality of circuit board electrodes are arranged on this circuit board in the mode that is not electrically connected each other, and the position of these a plurality of circuit board electrodes is corresponding with the position of these a plurality of bonding electrodes;
One conduction tack coat places between this bonding electrodes and this circuit board electrode, in order to this substrate and this circuit board of boning, and makes this bonding electrodes and this circuit board electrode keep being electrically connected; And
One protection tack coat is arranged on this substrate edges, and between this substrate and this circuit board, this protection tack coat also is connected with this conduction tack coat and this assist in engagement pad, to protect this conduction tack coat, this conduction tack coat is not contacted with outside air.
2. plasma scope as claimed in claim 1, wherein this conduction tack coat is an anisotropy conductiving glue, this anisotropy conductiving glue contains the conducting particles composition, this bonding electrodes is produced with this circuit board electrode be electrically connected.
3. plasma scope as claimed in claim 2, wherein this protection tack coat is a silica gel, in order to this substrate and this circuit board of boning, and the gap between this substrate of driving fit and this circuit board.
4. plasma scope as claimed in claim 3, wherein this assist in engagement pad is between this bonding electrodes and this silica gel, to prevent to apply in the process of this silica gel, between this silica gel and this anisotropy conductiving glue, produce bubble, and destroy the material behavior of this anisotropy conductiving glue.
5. plasma scope as claimed in claim 1, wherein this assist in engagement pad uses with this bonding electrodes identical materials and makes, include an insulating barrier on this circuit board in addition and be arranged on this circuit board electrode, be used for preventing being short-circuited between this circuit board electrode and this assist in engagement pad.
6. plasma scope as claimed in claim 1, wherein this assist in engagement pad is made with insulating material.
7. plasma scope as claimed in claim 1, wherein respectively these a plurality of circuit board electrodes are approximately elongated with the shape of these a plurality of bonding electrodes respectively, and the shape of this assist in engagement pad is " Jiong " shape approximately.
8. plasma scope as claimed in claim 1, wherein this circuit board is a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001286439A CN1174461C (en) | 2000-09-18 | 2000-09-18 | Plasma display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001286439A CN1174461C (en) | 2000-09-18 | 2000-09-18 | Plasma display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1344002A CN1344002A (en) | 2002-04-10 |
| CN1174461C true CN1174461C (en) | 2004-11-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001286439A Expired - Fee Related CN1174461C (en) | 2000-09-18 | 2000-09-18 | Plasma display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1174461C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183751A (en) * | 2003-12-22 | 2005-07-07 | Sony Chem Corp | Surface processing method for wiring board and method for manufacturing electric apparatus |
| CN100416624C (en) * | 2004-01-20 | 2008-09-03 | 友达光电股份有限公司 | Bonding structure for bonding electrode and circuit board electrode and flat display device |
| CN104284060B (en) * | 2013-07-12 | 2019-07-02 | 鸿富锦精密工业（深圳）有限公司 | Camera mould group |
| CN113133197A (en) * | 2021-04-08 | 2021-07-16 | 武汉华星光电半导体显示技术有限公司 | Display device |
-
2000
- 2000-09-18 CN CNB001286439A patent/CN1174461C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1344002A (en) | 2002-04-10 |
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| C10 | Entry into substantive examination | ||
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| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: YOUDA PHOTOELECTRIC CO., LTD. Free format text: FORMER OWNER: DAQI TECHNOLOGY CO., LTD. Effective date: 20030709 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20030709 Address after: Hsinchu Taiwan Science Industry Park Applicant after: AU Optronics Corporation Address before: Hsinchu Taiwan Science Industry Park Applicant before: Daqi Science and Technology Co., Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041103 Termination date: 20150918 |
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| EXPY | Termination of patent right or utility model |