WO2020024622A1

WO2020024622A1 - Transparent led display device and manufacturing method therefor

Info

Publication number: WO2020024622A1
Application number: PCT/CN2019/083302
Authority: WO
Inventors: 林健源; 历志辉
Original assignee: 深圳Tcl新技术有限公司
Priority date: 2018-08-01
Filing date: 2019-04-18
Publication date: 2020-02-06
Also published as: CN110853527A

Abstract

A transparent LED display device and a manufacturing method therefor, consisting of a plurality of LED particles (80) arranged in a matrix. An anode (50) or a cathode (60) of each LED particle (80) is electrically connected to an anode driving line (70) or a cathode driving line, respectively; the anode driving line is made of a metal wiring (70) to be electrically connected to the anode (50) of each LED particle (80), and the cathode driving line is made of an ITO transparent wiring (63) to be electrically connected to the cathode (60) of each LED particle (80); or, the anode driving line is made of the ITO wiring (63) to be electrically connected to the anode (50) of each LED particle (80) and the cathode driving line is made of the metal wiring (70) to be electrically connected to the cathode (60) of each LED particle (80). The transparent LED display device is realized by taking the ITO transparent material as a drive connecting line for drivingly connecting the anode (50) or the cathode (60) of each LED particle (80). The driving line uses the ITO transparent material while a transparent printed circuit board is also used, so that the area of a non-transparent area is reduced in the transparent LED display device, the transparency of the transparent LED display device is improved, and the transparent LED display device is close to the transparent effect of holographic projection.

Description

Transparent LED display device and manufacturing method thereof

Technical field

The invention relates to the field of LED display technology, and in particular, to a transparent LED display device and a manufacturing method thereof.

Background technique

Transparent LED display devices are becoming more and more common in our daily life and have great advantages in some special fields. For example, the transparent display device used in outdoor advertising display devices is a matrix composed of many single LEDs. Figure 1 shows a schematic structural diagram of the LED circuit connection principle of the prior art transparent LED display device (only a partial structure is shown). As shown in FIG. 1, the transparent LED display device is composed of a single LED 10 arranged on a substrate 90. The anode welding points 20 of each LED 10 are electrically connected through a horizontal driving line, and the cathode welding points 30 are electrically connected through a vertical driving line. The LED matrix controls the brightness, darkness and gray level of a single LED through a drive control system, and finally forms an overall display screen. One of the most important properties of transparent LED display devices is transparency. The higher the transparency, the closer the display can be to the effect of holographic projection. However, high transparency also requires that the spacing between LED particles cannot be too small, and the LED particles must be maintained between them. A certain distance, which limits the improvement of resolution, so that the transparent LED display device has a strong grainy display screen. In this transparent LED display device, the horizontal drive line and vertical drive line connected to a single LED anode and cathode are made of metal wires, and the anode welding point 20 and cathode welding point 30 to the horizontal drive line and vertical drive line are also made of metal. The electrical connection is an opaque part of the transparent LED display device, making it difficult for the transparent LED display device to achieve higher transparency.

Therefore, the existing technology needs to be improved and developed.

Summary of the invention

In view of the above-mentioned shortcomings of the prior art, in order to solve the shortcomings and shortcomings of the prior art, the present invention proposes a technical means of using ITO transparent material to replace the anode or cathode driving line in a transparent LED display device, further improving the transparent LED display. Device transparency.

The technical solutions adopted by the present invention to solve technical problems are as follows:

A transparent LED display device is composed of an array of a plurality of LED particles. The anode and cathode of each LED particle are electrically connected to an anode driving line or a cathode driving line, respectively. The anode and cathode welding points of the LED particles are respectively located on the anode driving. The wires and the cathode driving wires are electrically connected to the anode driving wires and the cathode driving wires in a vertical direction.

As a further improved technical solution, a substrate for mounting a plurality of LED particle matrices is further included, and an ITO transparent wiring is arranged on a mounting surface of the substrate.

As a further improved technical solution, the anode driving line uses a metal wiring to electrically connect the anode of each LED particle, and the cathode driving line uses an ITO transparent wiring to electrically connect the cathode of each LED particle.

As a further improved technical solution, the anode driving line uses ITO transparent wiring to electrically connect the anode of each LED particle, and the cathode driving line uses a metal wiring to electrically connect the cathode of each LED particle.

As a further improved technical solution, an insulating layer is provided on the ITO transparent wiring, and the insulating layer has a through hole opposite to the cathode of the LED particles, so that the cathode of the LED particles is electrically connected to the ITO transparent wiring through a conductive adhesive. The metal wiring is disposed on the insulating layer opposite to the anode end of the LED particle, and the anode of the LED particle is electrically connected to the metal wiring through a conductive adhesive.

As a further improved technical solution, an insulating layer is provided on the ITO transparent wiring, and the insulating layer has a through hole opposite to the anode of the LED particles, so that the anode of the LED particles is electrically connected to the ITO transparent wiring through a conductive adhesive. The metal wiring is disposed on the insulating layer opposite to the anode end of the LED particles, and the cathode of the LED particles is electrically connected to the metal wiring through a conductive adhesive.

As a further improved technical solution, the conductive adhesive may be replaced with tin soldering to realize the electrical connection between the anode or cathode of the LED particles and the transparent ITO or metal wiring.

As a further improved technical solution, the insulating layer uses silicon nitride-based materials or resin-based materials to achieve insulation.

As a further improved technical solution, the substrate is a transparent printed circuit board.

As a further improved technical solution, the ITO transparent wiring uses an ITO conductive film.

The invention also provides a method for manufacturing a transparent LED display device, which is used for manufacturing the transparent LED display device, and includes the following steps:

Cleaning the substrate on which the LED particles are installed;

After the ITO sputtering is performed on the surface of the substrate on which the LED particles are mounted to form an ITO transparent electrode layer, the ITO transparent wiring is etched;

After coating the insulating layer on the surface of the ITO transparent wiring, exposing and developing an insulating layer covering the ITO transparent wiring;

Etch metal traces after sputtering the metal electrode layer on the surface of the insulating layer;

The anode and cathode of each LED particle constituting the transparent LED display device are respectively welded or bonded to the metal wiring or the ITO transparent wiring to realize electrical connection, so as to form a transparent LED display device.

As a further improved technical solution, after the ITO sputtering on the surface of the substrate on which the LED particles are mounted to form an ITO transparent electrode layer, the step of etching the ITO transparent wiring specifically includes the following steps:

Photoresist coating is performed on the ITO transparent electrode layer, and the ITO transparent wiring is etched after exposing the non-ITO transparent wiring portion.

As a further improved technical solution, the step of etching metal traces after sputtering the metal electrode layer on the surface of the insulating layer specifically includes the following steps:

Photoresist coating is performed on the metal electrode layer, and the metal wiring is etched after exposing the non-metal wiring portion.

As a further improved technical solution, the anode and cathode of each LED particle are bonded to the metal wiring or ITO transparent wiring by using an anisotropic conductive adhesive for bonding.

Different from the prior art in which the horizontal and vertical drive lines in the transparent LED display structure use metal wiring, the transparent LED display device of the present invention is adopted on a drive connection line for drivingly connecting the anode or cathode of each LED particle. ITO transparent material is used to realize it, because the adoption of ITO transparent material as the drive line, and the use of transparent printed circuit boards also reduce the area of non-transparent areas in transparent LED display devices and improve the transparency of transparent LED display devices. The transparent LED display device is further brought closer to the transparent effect of holographic projection.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of an LED circuit connection principle of a prior art transparent LED display device.

FIG. 2 is a schematic structural diagram of the LED circuit connection principle of the first preferred embodiment of the transparent LED display device of the present invention.

FIG. 3 is a schematic structural diagram of the LED circuit connection principle of the second preferred embodiment of the transparent LED display device of the present invention.

FIG. 4 is a schematic sectional view of a single LED particle mounted on a substrate in a transparent LED display device of the present invention.

5 is a flowchart of a preferred embodiment of a method for manufacturing a transparent LED display device according to the present invention.

detailed description

In order to make the objectives, technical solutions, and advantages of the present invention more clear and specific, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

Transparent LED display devices have absolute advantages in special fields. The most familiar and common in people's lives are the increasingly popular outdoor LED advertising screens and outdoor decoration screens for urban buildings. This type of LED display composed of several LED particles is used outdoors. The visual effect is very good, but because the drive line connecting the LED needs to adopt metal wiring, including horizontal drive line and vertical drive line, the use of metal drive line makes the transparent LED display can not achieve high transparency during display. It has a certain effect on the display. In order to further improve the transparency of the transparent LED display device, the present invention proposes a new type of transparent LED display device, which can further improve the transparency of the transparent LED display on the basis of the existing technology.

As shown in the schematic structural diagram of the LED circuit connection principle of the first preferred embodiment of the transparent LED display device of the present invention, the transparent LED display device of the first preferred embodiment of the present invention is composed of a plurality of LED particles 80 arranged in a matrix and is arranged on the transparent LED display device. On the substrate 90, the arrangement matrix of the LED particles needs to be determined according to the size of the display device. FIG. 2 only shows a partial area of the arrangement matrix of the partial LED particles for explanation. The anode and cathode of each LED particle 80 are electrically connected to the anode driving line and the cathode driving line, respectively. Wherein, the anode driving line and the cathode driving line both use metal wires to electrically connect the welding points of the anode 50 and the cathode 60 of the LED particles, and the welding points of the anode 50 and the cathode 60 of the LED particles are located at the anodes, respectively. The drive line and the cathode drive line are electrically connected to the anode drive line and the cathode drive line in a vertical direction. Therefore, when the transparent LED display device is viewed from a front perspective, the connection between the anode and cathode welding points and the drive line can be hidden, further improving The transparency rate. The welding method of each LED particle can be described together with reference to the following preferred embodiment 2.

As shown in the schematic structural diagram of the LED circuit connection principle of the second preferred embodiment of the transparent LED display device of the present invention, as shown in FIG. 3, the transparent LED display device of the second preferred embodiment of the present invention is composed of a plurality of LED particles 80 arranged in a matrix, and is arranged on the transparent LED display device. On the substrate 90, the arrangement matrix of the LED particles needs to be determined according to the size of the display device. FIG. 3 shows only a partial area of the arrangement matrix of the partial LED particles for explanation. The anode 50 and the cathode 60 of each LED particle 80 are electrically connected to an anode driving line or a cathode driving line, respectively, wherein the anode driving line 70 uses a metal wiring to electrically connect the anode 50 of each LED particle, and the cathode driving line is ITO transparent The wires are electrically connected to the cathode 60 of each LED particle (the anode driving wire and the cathode driving wire of the first preferred embodiment of the transparent LED display device both use metal wires). It should be noted that because the cathode driving wire is ITO conductive The film is made of a transparent material, and therefore, the cathode driving line is not shown in the figure. As another embodiment, or the anode driving line uses ITO transparent wiring to electrically connect the anode of each LED particle, and the cathode driving line uses a metal wiring to electrically connect the cathode of each LED particle.

FIG. 4 shows a schematic cross-sectional structure principle diagram of a single LED particle mounted on a substrate in a transparent LED display device (including the above-mentioned preferred embodiment 1 and preferred embodiment 2 of the transparent LED display device) of the present invention. The LED particles 80 are mounted on the substrate 90 as an example. In the second preferred embodiment, the anode driving wire is preferably a metal wire, and the cathode driving wire is an ITO transparent wire. The first preferred embodiment is preferably an anode driving wire and a cathode driving wire. All are metal traces. The following is a description of a preferred embodiment 2 of a transparent LED display device. The LED particles 80 have a light-emitting chip 81 therein. The specific structure of the LED particles 80 disposed on the substrate 90 is that ITO is transparent on the mounting surface of the substrate 90. Line 63. In order to isolate the cathode driving line connected with the LED particles from the anode driving line, an insulating layer 62 is provided on the ITO transparent wiring 63. The insulating layer 62 has a through hole opposite to the cathode 60 of the LED particle, so that The cathode of the LED particle 80 is electrically connected to the ITO transparent trace 63 through a conductive adhesive 61, and the metal trace 70 is disposed on the insulating layer 62 at the lower end of the anode 50 of the LED particle 80, and the anode 50 of the LED particle is electrically conductive The glue 51 is electrically connected to the metal wiring 52.

As another embodiment, the connection with the anode and the cathode of the LED particles is only reversed with the embodiment in FIG. 4, so it is not shown in the drawings. That is, in the LED particle arrangement matrix, the anode of each LED particle can be electrically connected through the ITO transparent wiring LED, and the cathode can be electrically connected through the metal wiring. Specifically, an ITO transparent trace is provided on the mounting surface of the substrate, and an insulating layer is provided on the ITO transparent trace. The insulating layer has a through hole with respect to the anode of the LED particles, so that the anode of the LED particles passes a conductive adhesive. It is electrically connected to the ITO transparent wiring, and the metal wiring is disposed on the insulating layer opposite to the anode end of the LED particles, and the cathode of the LED particles is electrically connected to the metal wiring through a conductive adhesive.

In the above embodiment, the conductive adhesive may be replaced with tin soldering to realize the electrical connection between the anode or cathode of the LED particles and the transparent ITO or metal wiring. In addition, the insulating layer may be insulated using a silicon nitride-based material or a resin-based material.

In order to further improve the transparency of the transparent LED display device, the substrate may be implemented by using a transparent printed circuit board.

In the transparent LED display device of the present invention, because the ITO conductive film is used, the driving line is replaced by a transparent material, and a transparent printed circuit board is also used, so that the area of the non-transparent area is reduced and the transparency is improved in the transparent LED display device. The transparency of the LED display device further makes the transparent LED display device close to the transparent effect of holographic projection.

The present invention also provides a method for manufacturing a transparent LED display device, which is used to manufacture the transparent LED display device according to the second preferred embodiment. As shown in FIG. 5, the method includes the following steps:

In step S100, the substrate on which the LED particles are mounted is cleaned.

In step S200, ITO sputtering is performed on the surface of the substrate on which the LED particles are mounted to form an ITO transparent electrode layer, and then the ITO transparent wiring is etched. Specifically, a method for etching the ITO transparent wiring is to perform photoresist coating on the ITO transparent electrode layer, and then expose the non-ITO transparent wiring to expose the ITO transparent wiring after exposure.

In step S300, the surface of the transparent ITO line is coated with an insulating layer, and then exposed and developed to cover the transparent layer of the ITO.

In step S400, metal traces are etched after the metal electrode layer is sputtered on the surface of the insulating layer. Specifically, the method of etching the metal trace is to perform photoresist coating on the metal electrode layer, and then etch the metal trace after exposing the non-metal trace portion.

The anode and the cathode of each LED particle are bonded to the metal wiring or the ITO transparent wiring by using an anisotropic conductive adhesive for bonding.

In step S500, the anode and the cathode of each LED particle constituting the transparent LED display device are respectively welded or bonded to the metal wiring or the ITO transparent wiring to realize electrical connection, so as to form a transparent LED display device.

It should be understood that the above descriptions are only the preferred embodiments of the present invention and are not sufficient to limit the technical solutions of the present invention. For those of ordinary skill in the art, within the spirit and principles of the present invention, it can be based on the The description adds, subtracts, replaces, changes, or improves, and all these added, subtracted, replaced, changed, or improved technical solutions should belong to the protection scope of the appended claims of the present invention.

Claims

A transparent LED display device is composed of an array of a plurality of LED particles. The anode and cathode of each LED particle are electrically connected to an anode driving line or a cathode driving line, respectively. The anode and cathode welding points of the LED particles are respectively located at The anode driving line and the cathode driving line are electrically connected with the anode driving line and the cathode driving line in a vertical direction.
The transparent LED display device according to claim 1, further comprising a substrate on which a plurality of LED particle matrices are mounted, and an ITO transparent trace is disposed on a mounting surface of the substrate.
The transparent LED display device according to claim 2, wherein the anode driving line uses a metal wiring to electrically connect the anode of each LED particle, and the cathode driving line uses an ITO transparent wiring to electrically connect the cathode of each LED particle .
The transparent LED display device according to claim 2, wherein the anode driving line uses ITO transparent wiring to electrically connect the anode of each LED particle, and the cathode driving line uses a metal wiring to electrically connect the cathode of each LED particle. .
The transparent LED display device according to claim 3, wherein an insulating layer is provided on the ITO transparent wiring, and the insulating layer is provided with a through hole with respect to the cathode of the LED particle, so that the cathode of the LED particle passes electrical conduction. The glue is electrically connected to the ITO transparent wiring, and the metal wiring is disposed on the insulating layer opposite to the anode end of the LED particles, and the anode of the LED particles is electrically connected to the metal wiring through a conductive glue.
The transparent LED display device according to claim 4, wherein an insulating layer is provided on the ITO transparent wiring, and the insulating layer is provided with a through hole with respect to the anode of the LED particle, so that the anode of the LED particle passes electrical conduction. The glue is electrically connected to the ITO transparent wiring, and the metal wiring is disposed on the insulating layer opposite to the anode end of the LED particles, and the cathode of the LED particles is electrically connected to the metal wiring through a conductive glue.
The transparent LED display device according to claim 5, wherein the conductive adhesive can be replaced by soldering to achieve the electrical connection between the cathode of the LED particles and the transparent ITO wiring or the electrical connection between the anode of the LED particles and the metal wiring. .
The transparent LED display device according to claim 6, wherein the conductive adhesive can be replaced by soldering to achieve the anode connection of the LED particles and the ITO transparent wiring, or the cathode and metal wiring of the LED particles. Electrical connection.
The transparent LED display device according to claim 5 or 6, wherein the insulating layer is insulated by using a silicon nitride-based material or a resin-based material.
The transparent LED display device according to claim 2, wherein the substrate is a transparent printed circuit board.
The transparent LED display device according to claim 2, wherein the ITO transparent wiring is made of an ITO conductive film.
A method for manufacturing a transparent LED display device, used for manufacturing the transparent LED display device according to claims 2 to 11, comprising the following steps:

After the ITO sputtering is performed on the surface of the substrate on which the LED particles are mounted to form an ITO transparent electrode layer, the ITO transparent wiring is etched;

After coating the insulating layer on the surface of the ITO transparent wiring, exposing and developing an insulating layer covering the ITO transparent wiring;

Etch metal traces after sputtering the metal electrode layer on the surface of the insulating layer;

The anode and cathode of each LED particle constituting the transparent LED display device are respectively welded or bonded to the metal wiring or the ITO transparent wiring to realize electrical connection, so as to form a transparent LED display device.
The method for manufacturing a transparent LED display device according to claim 12, wherein the step of etching the ITO transparent wiring after the ITO sputtering on the surface of the substrate on which the LED particles are mounted to form an ITO transparent electrode layer is detailed It includes the following steps:

Photoresist coating is performed on the ITO transparent electrode layer, and the ITO transparent wiring is etched after exposing the non-ITO transparent wiring portion.
The method for manufacturing a transparent LED display device according to claim 12, wherein the step of etching metal traces after sputtering the metal electrode layer on the surface of the insulating layer comprises the following steps:

Photoresist coating is performed on the metal electrode layer, and the metal wiring is etched after exposing the non-metal wiring portion.
The method for manufacturing a transparent LED display device according to any one of claims 12 to 14, wherein the anode and cathode of each LED particle are bonded to the metal wiring or the ITO transparent wiring. Adopt anisotropic conductive adhesive for bonding.