CN110853527A - Transparent LED display device and manufacturing method thereof - Google Patents
Transparent LED display device and manufacturing method thereof Download PDFInfo
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- CN110853527A CN110853527A CN201810864734.2A CN201810864734A CN110853527A CN 110853527 A CN110853527 A CN 110853527A CN 201810864734 A CN201810864734 A CN 201810864734A CN 110853527 A CN110853527 A CN 110853527A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a transparent LED display device and a manufacturing method thereof, the transparent LED display device is composed of a plurality of LED particles arranged in a matrix, the anode or the cathode of each LED particle is respectively and electrically connected with an anode driving wire or a cathode driving wire, the anode driving wire adopts metal wiring to electrically connect the anode of each LED particle, the cathode driving wire adopts ITO transparent wiring to electrically connect the cathode of each LED particle, or the anode driving wire adopts ITO wiring to electrically connect the anode of each LED particle, and the cathode driving wire adopts metal wiring to electrically connect the cathode of each LED particle. The transparent LED display equipment is realized by adopting the ITO transparent material on the driving connecting line for realizing the driving connection of the anode or the cathode of each LED particle, because the ITO transparent material is adopted as the driving line, and the transparent printed circuit board is also used, the area of a non-transparent area in the transparent LED display equipment is reduced, the transparency of the transparent LED display equipment is improved, and the transparent LED display equipment is close to the transparent effect of holographic projection.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to transparent LED display equipment and a manufacturing method thereof.
Background
Transparent LED display devices are becoming more common in our daily lives with great use advantages in some special areas. For example, a transparent display device used in an outdoor advertisement display device is a matrix composed of a plurality of single LEDs, fig. 1 is a schematic diagram (only a partial structure is shown) illustrating an LED circuit connection principle structure of the transparent LED display device in the prior art, as shown in fig. 1, the transparent LED display device is composed of a matrix composed of single LEDs 10 arranged on a substrate 90, anode pads 20 of LEDs 10 are electrically connected through horizontal driving wires, cathode pads 30 are electrically connected through vertical driving wires, and the composed LED matrix controls brightness and gray scale of the single LEDs through a driving control system, so as to form an overall display picture. One of the most important properties for measuring the transparency of the transparent LED display device is the transparency, and the higher the transparency is, the closer the display effect can be to the effect of holographic projection, but the higher the transparency is, the spacing between LED particles cannot be too small, and a certain distance is required to be kept between LED particles, so that the improvement of the resolution is limited, and the granular feeling of the display picture of the transparent LED display device is stronger. In the transparent LED display device, the horizontal driving wire and the vertical driving wire which are connected with the anode and the cathode of a single LED are all wired by metal wires, and the anode welding point 20 and the cathode welding point 30 are electrically connected with the horizontal driving wire and the vertical driving wire by metal wires, which belong to the opaque part in the transparent LED display device, so that the transparent LED display device is difficult to realize higher transparency.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention provides a technical means for replacing an anode driving wire or a cathode driving wire in the transparent LED display equipment by adopting an ITO transparent material to further improve the transparency of the transparent LED display equipment in order to solve the defects and shortcomings of the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a transparent LED display device is composed of a plurality of LED particles arranged in a matrix, wherein the anode and the cathode of each LED particle are respectively and electrically connected with an anode driving wire or a cathode driving wire, and the anode and the cathode welding points of the LED particles are respectively and vertically positioned on the anode driving wire and the cathode driving wire and are electrically connected with the anode driving wire and the cathode driving wire.
As a further improved technical scheme, the anode driving line adopts metal wiring to electrically connect the anodes of the LED particles, the cathode driving line adopts ITO transparent wiring to electrically connect the cathodes of the LED particles, or the anode driving line adopts ITO transparent wiring to electrically connect the anodes of the LED particles, and the cathode driving line adopts metal wiring to electrically connect the cathodes of the LED particles.
As a further improved technical scheme, the transparent LED display device further includes a substrate on which a plurality of LED particle matrices are mounted, an ITO transparent trace is disposed on a mounting surface of the substrate, an insulating layer is disposed on the ITO transparent trace, a through hole is formed in the insulating layer opposite to a cathode of the LED particle, so that the cathode of the LED particle is electrically connected to the ITO transparent trace through a conductive adhesive, the metal trace is disposed at a lower end of the insulating layer opposite to an anode of the LED particle, and the anode of the LED particle is electrically connected to the metal trace through a conductive adhesive.
As a further improved technical scheme, the transparent LED display device further includes a substrate on which the LED particle matrix is mounted, wherein an ITO transparent trace is disposed on a mounting surface of the substrate, an insulating layer is disposed on the ITO transparent trace, a through hole is formed in the insulating layer opposite to an anode of the LED particle, so that the anode of the LED particle is electrically connected to the ITO transparent trace through a conductive adhesive, the metal trace is disposed at a lower end of the insulating layer opposite to the anode of the LED particle, and a cathode of the LED particle is electrically connected to the metal trace through a conductive adhesive.
As a further improved technical solution, the conductive adhesive can be replaced by tin soldering to realize the electrical connection between the anode or cathode of the LED particles and the ITO transparent trace or the metal trace.
As a further improved technical scheme, the insulating layer is made of silicon nitride materials or tree-like materials to realize insulation.
As a further improved technical scheme, the substrate adopts a transparent printed circuit board.
The invention also provides a manufacturing method of the transparent LED display device, which is used for manufacturing the transparent LED display device and comprises the following steps:
cleaning a substrate provided with LED particles;
carrying out ITO sputtering on the surface of the substrate provided with the LED particles to form an ITO transparent electrode layer, and etching an ITO transparent wire;
coating the insulating layer on the surface of the ITO transparent wiring, exposing and developing to obtain the insulating layer covering the ITO transparent wiring;
sputtering a metal electrode layer on the surface of the insulating layer and etching a metal wire;
and respectively welding or bonding the anode and the cathode of each LED particle forming the transparent LED display equipment to the metal wiring or the ITO transparent wiring to realize electric connection so as to form the transparent LED display equipment.
As a further improved technical scheme, the step of etching the ITO transparent trace after performing ITO sputtering on the surface of the substrate on which the LED particles are mounted to form the ITO transparent electrode layer specifically includes the following steps:
and carrying out photoresist coating on the ITO transparent electrode layer, and etching the ITO transparent wiring after exposing the non-ITO transparent wiring part.
As a further improved technical solution, the step of etching the metal trace after performing sputtering of the metal electrode layer on the surface of the insulating layer specifically includes the following steps:
and carrying out photoresist coating on the metal electrode layer, and etching the metal wiring after exposing the non-metal wiring part.
As a further improved technical scheme, the anode and the cathode of each LED particle are bonded to the metal trace or the ITO transparent trace by using anisotropic conductive adhesive.
Different from the prior art that metal wiring is adopted for a horizontal driving wire and a vertical driving wire in a transparent LED display screen structure, the transparent LED display device is realized by adopting ITO transparent materials on a driving connecting wire for realizing the driving connection of the anode or the cathode of each LED particle, and because the ITO transparent materials are adopted as the driving wires and the transparent printed circuit board is also used, the area of a non-transparent area in the transparent LED display device is reduced, the transparency of the transparent LED display device is improved, and the transparent LED display device is further close to the transparent effect of holographic projection.
Drawings
FIG. 1 is a schematic diagram of a prior art LED circuit connection scheme of a transparent LED display device.
FIG. 2 is a schematic diagram of the connection principle of the LED circuit of the first preferred embodiment of the transparent LED display device of the present invention.
Fig. 3 is a schematic structural diagram of the LED circuit connection principle of the second preferred embodiment of the transparent LED display device of the present invention.
Fig. 4 is a schematic diagram of a cross-sectional structure of a transparent LED display device according to the present invention in which individual LED particles are mounted on a substrate.
Fig. 5 is a flowchart of a preferred embodiment of a method of manufacturing a transparent LED display device of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Transparent LED display device has absolute advantage in special field, people are familiar with and the most common outdoor LED advertising screen and city mansion outdoor decoration screen that are becoming popular in life, this kind of LED display screen that comprises a plurality of LED granules is very good at outdoor visual effect, but owing to connect LED's drive wire need take the walking line of metal, including horizontal drive wire and vertical drive wire, the use of metal drive wire makes transparent LED display screen can't accomplish very high transparency when showing, has certain influence to showing in the vision. In order to further improve the transparency of the transparent LED display device, the invention provides a novel transparent LED display device which can further improve the transparency of a transparent LED display screen on the basis of the prior art.
As shown in fig. 2, which is a schematic diagram of a schematic structure of an LED circuit connection principle of a first preferred embodiment of the transparent LED display device according to the present invention, the transparent LED display device according to the first preferred embodiment of the present invention is composed of a plurality of LED particles 80 arranged in a matrix and is disposed on a substrate 90 of the transparent LED display device, wherein the matrix of the LED particles is determined according to the size of the display device, and fig. 2 only shows a local area of a local LED particle arrangement matrix for description. The anode and cathode of each LED particle 80 are electrically connected to the anode driving line and the cathode driving line, respectively. The anode driving wire and the cathode driving wire are both metal wiring wires to electrically connect the welding points of the anode 50 and the cathode 60 of each LED particle, and the welding points of the anode 50 and the cathode 60 of each LED particle are respectively positioned in the vertical direction of the anode driving wire and the cathode driving wire and are electrically connected with the anode driving wire and the cathode driving wire, so that the connecting wire of the anode welding point, the cathode welding point and the driving wire can be hidden when the transparent LED display device is observed from the front view, and the transparency is further improved. The soldering method of each LED particle is also described with reference to the second preferred embodiment.
As shown in fig. 3, which is a schematic diagram of a schematic structure of an LED circuit connection principle of a second preferred embodiment of the transparent LED display device according to the present invention, the transparent LED display device according to the second preferred embodiment of the present invention is composed of a plurality of LED particles 80 arranged in a matrix and is disposed on a substrate 90 of the transparent LED display device, wherein the matrix of the LED particles is determined according to the size of the display device, and fig. 3 only shows a local area of a local LED particle arrangement matrix for description. The anode 50 and the cathode 60 of each LED particle 80 are electrically connected to an anode driving line or a cathode driving line, respectively, wherein the anode driving line 70 adopts a metal wire to electrically connect the anode 50 of each LED particle, and the cathode driving line adopts an ITO transparent wire to electrically connect the cathode 60 of each LED particle (both the anode driving line and the cathode driving line of the first preferred embodiment of the transparent LED display device adopt metal wires). As another embodiment, alternatively, the anode driving line uses an ITO transparent wire to electrically connect the anode of each LED particle, and the cathode driving line uses a metal wire to electrically connect the cathode of each LED particle.
Fig. 4 shows a schematic diagram of a cross-sectional structure of a transparent LED display device (including the first preferred embodiment and the second preferred embodiment of the transparent LED display device) according to the present invention, in which a single LED particle 80 is mounted on a substrate 90, as can be seen from fig. 4, the second preferred embodiment preferably uses an anode driving line as a metal trace and a cathode driving line as an ITO transparent trace, and the first preferred embodiment preferably uses the anode driving line and the cathode driving line as metal traces. Taking a second preferred embodiment of the transparent LED display device as an example, the LED particle 80 has a light emitting chip 81 therein, and the specific structure of the LED particle 80 disposed on the substrate 90 is that an ITO transparent trace 63 is disposed on the mounting surface of the substrate 90, an insulating layer 62 is disposed on the ITO transparent trace 63 for insulating and isolating a cathode driving line and an anode driving line connected to the LED particle, a through hole is formed in the insulating layer 62 opposite to the cathode 60 of the LED particle, so that the cathode of the LED particle 80 is electrically connected to the ITO transparent trace 63 through a conductive adhesive 61, the metal trace 70 is disposed on the insulating layer 62 opposite to the lower end of the anode 50 of the LED particle 80, and the anode 50 of the LED particle is electrically connected to the metal trace 52 through a conductive adhesive 51.
As another embodiment, the connection of the anode and the cathode of the LED particle is merely reversed with respect to the embodiment in fig. 4, and thus is not illustrated. In the LED particle array matrix, anodes of the LED particles can be electrically connected through ITO transparent wires and LEDs, and cathodes of the LED particles can be electrically connected through metal wires. Specifically, an ITO transparent wiring is arranged on the mounting surface of the substrate, an insulating layer is arranged on the ITO transparent wiring, a through hole is formed in the insulating layer relative to the anode of the LED particles, the anode of the LED particles is electrically connected with the ITO transparent wiring through a conductive adhesive, the metal wiring is arranged at the lower end of the insulating layer relative to the anode of the LED particles, and the cathode of the LED particles is electrically connected with the metal wiring through the conductive adhesive.
In the above embodiments, the conductive paste may be replaced by solder to electrically connect the anode or cathode of the LED particle and the ITO transparent trace or the metal trace. In addition, the insulating layer can be made of a silicon nitride material or a resin material.
In order to further improve the transparency of the transparent LED display device, the substrate may be implemented using a transparent printed circuit board.
In the transparent LED display equipment, the ITO conductive film is adopted, so that the driving wire is replaced by the transparent material, and the transparent printed circuit board is also used, so that the area of a non-transparent area in the transparent LED display equipment is reduced, the transparency of the transparent LED display equipment is improved, and the transparent LED display equipment is further close to the transparent effect of holographic projection.
The present invention further provides a method for manufacturing a transparent LED display device, which is used for manufacturing the transparent LED display device of the second preferred embodiment, as shown in fig. 5, and includes the following steps:
step S100, cleaning the substrate on which the LED particles are mounted.
Step S200, carrying out ITO sputtering on the surface of the substrate provided with the LED particles to form an ITO transparent electrode layer, and etching an ITO transparent wire. Specifically, the method for etching the ITO transparent trace includes the steps of coating photoresist on the ITO transparent electrode layer, and etching the ITO transparent trace after exposing the non-ITO transparent trace.
And step S300, coating the insulating layer on the surface of the ITO transparent wiring, exposing and developing to obtain the insulating layer covering the ITO transparent wiring.
Step S400, sputtering the metal electrode layer on the surface of the insulating layer, and etching the metal wiring. Specifically, the metal trace is etched by coating a photoresist on the metal electrode layer and exposing the non-metal trace portion to etch the metal trace.
And the anodes and the cathodes of the LED particles are bonded to the metal wiring or the ITO transparent wiring by using anisotropic conductive adhesive.
And S500, respectively welding or bonding the anode and the cathode of each LED particle forming the transparent LED display device to the metal wiring or the ITO transparent wiring to realize electric connection so as to form the transparent LED display device.
It should be understood that the above-mentioned embodiments are merely preferred examples of the present invention, and not restrictive, but rather, all the changes, substitutions, alterations and modifications that come within the spirit and scope of the invention as described above may be made by those skilled in the art, and all the changes, substitutions, alterations and modifications that fall within the scope of the appended claims should be construed as being included in the present invention.
Claims (11)
1. A transparent LED display device is composed of a plurality of LED particles arranged in a matrix, wherein the anode and the cathode of each LED particle are respectively and electrically connected with an anode driving wire or a cathode driving wire.
2. The transparent LED display device of claim 1, wherein the anode driving line uses metal wires to electrically connect the anodes of the LED particles, and the cathode driving line uses ITO transparent wires to electrically connect the cathodes of the LED particles, or the anode driving line uses ITO transparent wires to electrically connect the anodes of the LED particles, and the cathode driving line uses metal wires to electrically connect the cathodes of the LED particles.
3. The transparent LED display device of claim 2, further comprising a substrate on which the LED particle matrix is mounted, wherein an ITO transparent trace is disposed on the mounting surface of the substrate, an insulating layer is disposed on the ITO transparent trace, the insulating layer is provided with a through hole corresponding to a cathode of the LED particle, so that the cathode of the LED particle is electrically connected to the ITO transparent trace through a conductive adhesive, the metal trace is disposed on the insulating layer at a lower end of the anode corresponding to the LED particle, and the anode of the LED particle is electrically connected to the metal trace through a conductive adhesive.
4. The transparent LED display device of claim 2, further comprising a substrate for mounting the LED particle matrix, wherein an ITO transparent trace is disposed on the mounting surface of the substrate, an insulating layer is disposed on the ITO transparent trace, the insulating layer is provided with a through hole corresponding to the anode of the LED particle, so that the anode of the LED particle is electrically connected to the ITO transparent trace through a conductive adhesive, the metal trace is disposed at the lower end of the insulating layer corresponding to the anode of the LED particle, and the cathode of the LED particle is electrically connected to the metal trace through a conductive adhesive.
5. The transparent LED display device as claimed in claim 3 or 4, wherein the conductive paste can be replaced by solder to electrically connect the anode or cathode of the LED particles with the ITO transparent traces or the metal traces.
6. The transparent LED display device as claimed in claim 5, wherein the insulating layer is made of silicon nitride material or dendritic material.
7. The transparent LED display apparatus of claim 5, wherein the substrate is a transparent printed circuit board.
8. A method of manufacturing a transparent LED display device, for manufacturing the transparent LED display device according to claims 2 to 7, comprising the steps of:
cleaning a substrate provided with LED particles;
carrying out ITO sputtering on the surface of the substrate provided with the LED particles to form an ITO transparent electrode layer, and etching an ITO transparent wire;
coating the insulating layer on the surface of the ITO transparent wiring, exposing and developing to obtain the insulating layer covering the ITO transparent wiring;
sputtering a metal electrode layer on the surface of the insulating layer and etching a metal wire;
and respectively welding or bonding the anode and the cathode of each LED particle forming the transparent LED display equipment to the metal wiring or the ITO transparent wiring to realize electric connection so as to form the transparent LED display equipment.
9. The method according to claim 8, wherein the step of etching the ITO transparent trace after ITO is sputtered on the surface of the substrate on which the LED particles are mounted to form the ITO transparent electrode layer specifically comprises the following steps:
and carrying out photoresist coating on the ITO transparent electrode layer, and etching the ITO transparent wiring after exposing the non-ITO transparent wiring part.
10. The method according to claim 8, wherein the step of etching the metal trace after sputtering the metal electrode layer on the surface of the insulating layer comprises the following steps:
and carrying out photoresist coating on the metal electrode layer, and etching the metal wiring after exposing the non-metal wiring part.
11. The method of any one of claims 8 to 10, wherein the bonding of the anode and cathode of each LED particle to the metal trace or the ITO transparent trace is performed by anisotropic conductive paste.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810864734.2A CN110853527A (en) | 2018-08-01 | 2018-08-01 | Transparent LED display device and manufacturing method thereof |
| PCT/CN2019/083302 WO2020024622A1 (en) | 2018-08-01 | 2019-04-18 | Transparent led display device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810864734.2A CN110853527A (en) | 2018-08-01 | 2018-08-01 | Transparent LED display device and manufacturing method thereof |
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| CN110853527A true CN110853527A (en) | 2020-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810864734.2A Pending CN110853527A (en) | 2018-08-01 | 2018-08-01 | Transparent LED display device and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN110853527A (en) |
| WO (1) | WO2020024622A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113554972A (en) * | 2020-04-08 | 2021-10-26 | 陈学仕 | Crosstalk improving method for QLED display panel and QLED display panel |
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| WO2020024622A1 (en) | 2020-02-06 |
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Application publication date: 20200228 |