CN107422551A - A kind of display device - Google Patents
A kind of display device Download PDFInfo
- Publication number
- CN107422551A CN107422551A CN201710612858.7A CN201710612858A CN107422551A CN 107422551 A CN107422551 A CN 107422551A CN 201710612858 A CN201710612858 A CN 201710612858A CN 107422551 A CN107422551 A CN 107422551A
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- China
- Prior art keywords
- subconductivity
- substrate
- display device
- chip
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
Abstract
The invention provides a kind of display device, including first substrate, first substrate includes viewing area and the non-display area around viewing area；Non-display area includes the first chip bonding area and the second chip bonding area；First chip bonding area includes multiple first conductive welding disks, and the second chip bonding area includes multiple second conductive welding disks；First conductive welding disk includes metal level, conductive layer and the insulating barrier being held and mounted between metal level and conductive layer；Conductive layer includes the first subconductivity portion and the second subconductivity portion；And chip, chip include multiple first pins and multiple second pins, the first pin is electrically connected by the first subconductivity portion with the first conductive welding disk；And conducting resinl, chip are crimped by conducting resinl with first substrate；On the direction perpendicular to first substrate, the second subconductivity portion does not overlap with chip.Relative to prior art, avoid the first conductive welding disk and leakage phenomenon occurs, improve the reliability of display device.
Description
Technical field
The present invention relates to display technology field, more particularly, to a kind of display device.
Background technology
In a kind of display device that prior art provides, including display panel, on display panel binding have IC chip, pass through
Electric signal required for IC chip processing display panel.
Fig. 1 is refer to, Fig. 1 is a kind of structural representation for display device that prior art provides.In Fig. 1, display device
Including display panel 01, conductive welding disk 02 is provided with display panel 01, display device also includes IC chip 03, and IC chip 03 has
There is pin 04, IC chip 03 is electrically connected by pin 04 with conductive welding disk 02.In the prior art, using conducting resinl 05 by IC chip
03 is crimped on display panel 01, and conducting resinl 05 includes conducting particles, and pin 04 can be made to be electrically connected with conductive welding disk 02.By
There is mobility in conducting resinl 05, conducting resinl 05 can overflow the region at the place of pin 04, reach in region 06.Due to IC chip 03
It is conductive, generally connects a low potential, conductive welding disk 02 is used for transmitting telecommunication number, and region 06 can occur conductive welding disk 02 and pass through
Resistance short circuit occurs for the side 031 of conducting resinl 05 and IC chip 03, and conductive welding disk 02 occurs leakage phenomenon, influences display surface
The function of plate.
The content of the invention
In view of this, the invention provides a kind of display device, including：First substrate, first substrate include viewing area and
Non-display area around viewing area；Non-display area includes the first chip bonding area and the second chip bonding area, viewing area, the second core
Piece binding area, the first chip bonding area are arranged in order along a first direction；First chip bonding area includes the multiple first conductive welderings
Disk, the second chip bonding area include multiple second conductive welding disks；First conductive welding disk includes metal level, conductive layer and clamping
The insulating barrier being arranged between metal level and conductive layer, metal level are electrically connected by the via in insulating barrier with conductive layer；It is conductive
Layer includes the first subconductivity portion and the second subconductivity portion；Display device also includes chip, and chip includes multiple first pins and more
Individual second pin, the first pin are electrically connected by the first subconductivity portion with the first conductive welding disk, second pin and the second conductive weldering
Disk electrically connects；Display device also includes conducting resinl, and chip is crimped by conducting resinl with first substrate；Perpendicular to first substrate
On direction, the second subconductivity portion does not overlap with chip.
In some optional embodiments, the minimum range of the first subconductivity portion and the second subconductivity portion along a first direction
For d, d >=100 μm.
In some optional embodiments, being shaped as the first subconductivity portion is circular, ellipse, quadrangle or polygon
Shape.
In some optional embodiments, being shaped as the second subconductivity portion is circular, ellipse, quadrangle or polygon
Shape.
In some optional embodiments, the first subconductivity portion includes multiple first subconductivity branches, the first subconductivity point
Portion is electrically connected with the metal layer by the via in insulating barrier；Second subconductivity portion includes multiple second subconductivity branches, the second son
Conductive sections are electrically connected with the metal layer by the via in insulating barrier.
In some optional embodiments, the material of conductive layer includes tin indium oxide or indium zinc oxide.
In some optional embodiments, display device also include second substrate and be held and mounted on first substrate and
Liquid crystal layer between second substrate.
In some optional embodiments, first substrate is array base palte, and second substrate is color membrane substrates.
In some optional embodiments, first substrate includes multiple Organic Light Emitting Diodes.
In some optional embodiments, multiple first conductive welding disks arrange in a second direction, and second direction is perpendicular to
One direction；First substrate is rectangle, and the long side of first substrate extends in a first direction, and the short side of first substrate prolongs in a second direction
Stretch.
Compared with prior art, display device provided by the invention, following beneficial effect is at least realized：
In display device provided by the invention, the conductive layer of conductive welding disk is arranged to two parts, including the first son is led
Electric portion and the second subconductivity portion, also, on the direction perpendicular to first substrate, the second subconductivity portion does not overlap with chip.Core
First pin of piece is electrically connected by the first subconductivity portion with the first conductive welding disk, because the second subconductivity portion is not handed over chip
Folded, the conducting resinl of spilling will not cause the side of chip to be electrically connected with the second subconductivity portion, and referring now to prior art, the present invention carries
In the display device of confession, when chip is crimped using conducting resinl and first substrate, the conducting resinl of spilling is not easy so that first leads
Electrical bonding pads and chip short circuit, relative to prior art, avoid the first conductive welding disk and leakage phenomenon occurs, improve display device
Reliability.
By referring to the drawings to the present invention exemplary embodiment detailed description, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
It is combined in the description and the accompanying drawing of a part for constitution instruction shows embodiments of the invention, and even
It is used for the principle for explaining the present invention together with its explanation.
Fig. 1 is a kind of structural representation for display device that prior art provides；
Fig. 2 is a kind of planar structure schematic diagram of display device provided in an embodiment of the present invention；
Fig. 3 is a kind of cross-sectional view of the AA ' lines along Fig. 2；
Fig. 4 is a kind of partial enlargement structural representation of region B in Fig. 3；
Fig. 4 a are another partial enlargement structural representations of region B in Fig. 3；
Fig. 5 is a kind of planar structure schematic diagram of first conductive welding disk provided in an embodiment of the present invention；
Fig. 6 is the planar structure schematic diagram of another first conductive welding disk provided in an embodiment of the present invention；
Fig. 7 is the planar structure schematic diagram of another the first conductive welding disk provided in an embodiment of the present invention；
Fig. 8 is the planar structure schematic diagram of another the first conductive welding disk provided in an embodiment of the present invention；
Fig. 9 is the planar structure schematic diagram of another the first conductive welding disk provided in an embodiment of the present invention；
Figure 10 is the planar structure schematic diagram of another the first conductive welding disk provided in an embodiment of the present invention；
Figure 11 is the planar structure schematic diagram of another the first conductive welding disk provided in an embodiment of the present invention；
Figure 12 is a kind of cross-sectional view of the BB ' lines along Figure 11；
Figure 13 is a kind of cross-sectional view of display device provided in an embodiment of the present invention；
Figure 14 is the cross-sectional view of another display device provided in an embodiment of the present invention；
Figure 15 is the planar structure schematic diagram of another display device provided in an embodiment of the present invention.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that：Unless have in addition
Body illustrates that the unlimited system of part and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative to be never used as to the present invention below
And its application or any restrictions that use.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
Incorporated by reference to reference to figure 2, Fig. 3, Fig. 4 and Fig. 5, Fig. 2 is a kind of plane of display device provided in an embodiment of the present invention
Structural representation, Fig. 3 are a kind of cross-sectional views of the AA ' lines along Fig. 2, and Fig. 4, which is that one kind of region B in Fig. 3 is local, to be put
Big structure schematic diagram, Fig. 5 are a kind of planar structure schematic diagrams of first conductive welding disk 30 provided in an embodiment of the present invention.This implementation
The display device that example provides includes：First substrate 100, first substrate 100 include viewing area 10 and around the non-aobvious of viewing area 10
Show area 20；Non-display area 20 includes the first chip bonding area 21 and the second chip bonding area 22, viewing area 10, the second chip bonding
Area 22, the first chip bonding area 21 are arranged in order along a first direction；First chip bonding area 21 includes the multiple first conductive welderings
Disk 30, the second chip bonding area 22 include multiple second conductive welding disks 40；First conductive welding disk 30 includes metal level 31, conductive layer
32 and the insulating barrier 33 that is held and mounted between metal level 31 and conductive layer 32, metal level 31 pass through the mistake in insulating barrier 33
Hole 331 electrically connects with conductive layer 32；Conductive layer 32 includes the first subconductivity portion 321 and the second subconductivity portion 322；Display device is also
Including chip 50, chip 50 includes multiple first pins 51 and multiple second pins 52, and the first pin 51 passes through the first subconductivity
Portion 321 electrically connects with the first conductive welding disk 30, and second pin 52 electrically connects with the second conductive welding disk 40；Display device also includes leading
Electric glue 60, chip 50 are crimped by conducting resinl 60 with first substrate 100；On the direction of first substrate 100, second is sub
Conductive part 322 does not overlap with chip 50.Wherein, the Z-direction in Fig. 4 is refer to perpendicular to the direction of first substrate 100.Need
It is bright, in order to clearly illustrate the technical scheme of the present embodiment, the structural representation for the display device that Fig. 2 embodiments provide
In, do not illustrate chip 50, the concrete structure of chip 50, crimping mode, please join with the relative position relation of first substrate 100
Examine Fig. 3.
In the display device that the present embodiment provides, first substrate 100 includes viewing area 10 and non-display area 20, viewing area 10
Function with display image information, non-display area 20 do not have display function, and non-display area 20 can be used for setting signal and walk
The structure such as line and circuit element.Chip 50 (Integrated Circuit, abbreviation IC), chip are crimped with first substrate 100
50 electric signals being used in preliminary treatment first substrate 100.Display device (is not shown also either internally or externally including processor in figure
Anticipate out), processor is further analyzed and calculated to the electric signal in chip 50.Thus chip 50 is needed in processor
Electric signal transmitted after preliminary treatment into display panel, or by the electric signal in display panel after preliminary treatment
Transmit into processor.Chip 50 includes multiple first pins 51 and multiple second pins 52, and the first pin 51 with first with leading
Electrical bonding pads 30 electrically connect, and second pin 52 electrically connects with the second conductive welding disk 40.Electric signal in processor is conductive by first
Pad 30 is transmitted into chip 50, and chip 50 is transmitted to first after preliminary treatment is carried out to electric signal by the second conductive welding disk 40
In substrate 100；Or the electric signal in first substrate 100 is transmitted into chip 50 by the second conductive welding disk 40, chip 50 is right
Electric signal is transmitted into processor after carrying out preliminary treatment by the first conductive welding disk 30.Chip 50 electrically connects with processor, example
Such as, chip 50 can be electrically connected by FPC (Flexible Printed Circuit, abbreviation FPC) with processor,
The present invention is not specifically limited for chip 50 and the specific electric connection mode of processor.
In the display device that the present embodiment provides, the first conductive welding disk 30 has at least three-decker, respectively metal level
31st, insulating barrier 33, conductive layer 32, metal level 31 are electrically connected by the via 331 in insulating barrier 33 with conductive layer 32.First substrate
Signal lead in 100 usually using metal material, the metal level 31 of the first conductive welding disk 30 can with first substrate 100
Signal lead makes formation using identical material in same manufacture craft.Because metal is easily by the steam and oxygen in air
Gas corrosion, therefore metal level 31 should not be directly exposed in air, thus set gradually insulating barrier 33 on metal level 31 and lead
Electric layer 32, metal level 31 are electrically connected by the via 331 in insulating barrier 33 with conductive layer 32.Insulating barrier 33 and conductive layer 32 have
The effect of guard metal layer 31.In first conductive welding disk 30, conductive layer 32 includes the first subconductivity portion 321 and the second subconductivity portion
322, the first subconductivity portion 321 and the second subconductivity portion 322 are physically two independent structures.Perpendicular to first substrate
On 100 direction, the second subconductivity portion 322 does not overlap with chip 50.Specifically, the first subconductivity portion 321 passes through insulating barrier 33
In via 331 electrically connected with conductive layer 32, the second subconductivity portion 322 passes through the via 331 in insulating barrier 33 and conductive layer 32
Electrical connection.For dotted line a in Fig. 4 perpendicular to first substrate 100, dotted line a is located at the place straight line of side 501 of chip 50, dotted line a with
Second subconductivity portion 322 is without intersecting, and in other words, the second subconductivity portion 322 and the side 501 of chip 50 also do not overlap.
It should be noted that the display device that the present embodiment provides, can be the display base plate for being crimped with chip 50, such as
It is crimped with the array base palte of chip 50；It can also be the display panel for being crimped with chip 50, such as be crimped with the liquid crystal of chip 50
Display panel or organic electroluminescence display panel；Can also be terminal display device, for example, mobile phone, computer, TV etc., this implementation
Example is not specifically limited for the concrete structure of display device.
In the display device that the present embodiment provides, the conductive layer 32 of conductive welding disk is arranged to two parts, including first
Subconductivity portion 322 of subconductivity portion 321 and second, also, on the direction of first substrate 100, the second subconductivity portion 322
Do not overlapped with chip 50.First pin 51 of chip 50 is electrically connected by the first subconductivity portion 321 with the first conductive welding disk 30, by
Do not overlapped with chip 50 in the second subconductivity portion 322, the conducting resinl 60 of spilling will not cause of side 501 and second of chip 50
Conductive part 321 electrically connects, referring now to prior art, in display device provided by the invention, when chip 50 uses the He of conducting resinl 60
When first substrate 100 crimps, the conducting resinl 60 of spilling can be spilled at the side 501 of chip 50, due to the second subconductivity portion 322
Do not overlapped with chip 50, on the direction perpendicular to first substrate, conducting resinl can not connect the subconductivity portion of chip 50 and second
322, thus relative to prior art, the conducting resinl 60 of spilling is not easy so that the first conductive welding disk 30 and the short circuit of chip 50, phase
For prior art, avoid the first conductive welding disk 30 and leakage phenomenon occurs, improve the reliability of display device.
It should be noted that display device provided in an embodiment of the present invention goes for two kinds of chips of different sizes.
Fig. 4 only illustrates the situation that the first pin 51 is electrically connected by the first subconductivity portion 321 with the first conductive welding disk 30；First pin
51 refer to Fig. 4 a by the second subconductivity portion 322 with the situation that the first conductive welding disk 30 electrically connects, and Fig. 4 a are region B in Fig. 3
Another partial enlargement structural representation, Fig. 4 a and Fig. 4 difference is that the first pin 51 passes through the second subconductivity portion
322 electrically connect with the first conductive welding disk 30.In the prior art, according to the of different sizes of chip 50, the first pin 51 of chip 50
It can electrically connect, can also be electrically connected with the second subconductivity portion 322 with the first subconductivity portion 321.The display that the present embodiment provides
Device, go for two kinds of chips of different sizes, make the scope of application of display device more extensive.
In some optional implementations, the material of conductive layer 32 includes tin indium oxide or indium zinc oxide.Wherein, oxygen
Change indium tin (Indium Tin Oxide, abbreviation ITO), alternatively referred to as tin-doped indium oxide, be a kind of indium (III) oxide
(In2O3) mixture of and tin (IV races) oxide (SnO2), tin indium oxide be in film-form it is transparent, it is electrically conductive, and
And relative to metal material, it is not easy and the steam and oxygen reaction in air；Indium zinc oxide (Indium Zinc Oxide, referred to as
IZO), alternatively referred to as indium-doped zinc oxide, indium zinc oxide be in film-form it is transparent, it is electrically conductive, and relative to metal material
Material, is not easy and the steam and oxygen reaction in air.In the display device that the present embodiment provides, the first conductive welding disk 30 uses gold
Category layer 31 and conductive layer 32 are made, and wherein the material selection of conductive layer 32 is transparent, conductive and relative to metal material
Expect relatively stable tin indium oxide or indium zinc oxide, the metal level 31 in the first conductive welding disk 30 can be protected, and make
One conductive welding disk 30 has good conductive effect.
In some optional implementations, Fig. 6 refer to, Fig. 6 is provided in an embodiment of the present invention another first to lead
The planar structure schematic diagram of electrical bonding pads 30.In first conductive welding disk 30 of Fig. 6 signals, the first subconductivity portion 321 and the second son are led
The minimum range of electric portion 322 along a first direction is d, d >=100 μm.In the present embodiment, the first subconductivity portion 321 and the second son
Conductive part 322 keeps larger distance, specially 100 μm, and the second subconductivity portion 322 can be caused away from the first subconductivity portion
321st, the first pin 51 and the conducting resinl 60 for crimping the first subconductivity portion 321 and the first pin 51, so as to further keep away
Exempt to cause the first conductive welding disk 30 and the short circuit of chip 50 after conducting resinl 60 overflows, relative to prior art, avoided first and lead
Leakage phenomenon occurs for electrical bonding pads 30, further increases the reliability of display device.
In the embodiment that Fig. 6 is provided, with the first subconductivity portion 321 in the first conductive welding disk 30 and the second subconductivity portion 322
Shape be to illustrate exemplified by rectangle, in some optional implementations, the first subconductivity portion 321 and the second subconductivity
The shape in portion 322 can have a variety of.Below, the present invention is exemplary to the first subconductivity portion 321 and the second subconductivity portion herein
322 shape illustrates, it is to be understood that the shape in the first subconductivity portion 321 and the second subconductivity portion 322 can have more
Kind, it is not limited to that.
Fig. 7 is refer to, Fig. 7 is the planar structure signal of another the first conductive welding disk 30 provided in an embodiment of the present invention
Figure.Wherein, the first subconductivity portion 321 is shaped as circle, and optionally, the second subconductivity portion 322 is shaped as circle.At other
In optional implementation, the shape in the first subconductivity portion 321 can be ellipse, and the shape in the second subconductivity portion 322 can be with
For ellipse.
Fig. 8 is refer to, Fig. 8 is the planar structure signal of another the first conductive welding disk 30 provided in an embodiment of the present invention
Figure.Wherein, the first subconductivity portion 321 is shaped as quadrangle, and optionally, the second subconductivity portion 322 is shaped as quadrangle.
Fig. 9 is refer to, Fig. 9 is the planar structure signal of another the first conductive welding disk 30 provided in an embodiment of the present invention
Figure.Wherein, the first subconductivity portion 321 is shaped as hexagon, and optionally, the second subconductivity portion 322 is shaped as hexagon.
Figure 10 is refer to, Figure 10 is the planar structure signal of another the first conductive welding disk 30 provided in an embodiment of the present invention
Figure.Wherein, the first subconductivity portion 321 is shaped as rectangle, and optionally, the second subconductivity portion 322 is shaped as irregular figure
Shape.
Figure 11 and Figure 12 are refer to, Figure 11 is the planar junction of another the first conductive welding disk 30 provided in an embodiment of the present invention
Structure schematic diagram, Figure 12 are a kind of cross-sectional views of the BB ' lines along Figure 11.Wherein, in some optional implementations,
First subconductivity portion 321 includes multiple first subconductivity branches 3211, and the first subconductivity branch 3211 passes through in insulating barrier 33
Via 331 electrically connects with metal level 31；Second subconductivity portion 322 includes multiple second subconductivity branches 3221, the second subconductivity
Branch 3221 is electrically connected by the via 331 in insulating barrier 33 with metal level 31.
Fig. 7 to Figure 12 provides the example of the various shapes in the first subconductivity portion 321 and the second subconductivity portion 322, with full
In the different display device of foot, for the specific setting demand in the first conductive welding disk 30, the first subconductivity portion 321 and second
The shape in subconductivity portion 322 can be configured according to the specific applicable cases of display device, be not limited only to Fig. 7 to Figure 12 offers
Embodiment.
In some optional implementations, Figure 13 is refer to, Figure 13 is a kind of display dress provided in an embodiment of the present invention
The cross-sectional view put.Wherein, display device also includes second substrate 200 and is held and mounted on the and of first substrate 100
Liquid crystal layer 300 between second substrate 200.Optionally, first substrate 100 is array base palte, and second substrate 200 is color film base
Plate.The display device that the present embodiment provides be liquid crystal display device, and first substrate 100 is array base palte, including array setting
The structures such as thin film transistor (TFT), gate line, data wire；Chip 50 is bound on array base palte, for handling in array base palte
Electric signal.
In some optional implementations, Figure 14 is refer to, Figure 14 is another display provided in an embodiment of the present invention
The cross-sectional view of device.Figure 14 is only illustrated on the basis of Fig. 3, and Figure 14 has continued to use Fig. 3 reference.Its
In, first substrate 100 includes multiple Organic Light Emitting Diodes 110.Optionally, Organic Light Emitting Diode (Organic Light-
Emitting Diode, abbreviation OLED) include anode 1101, negative electrode 1102, luminous material layer 1103.The present embodiment provides aobvious
Showing device is organic light-emitting display device, has self-luminous, wide viewing angle, high-contrast, etc. fast compared with low power consumption, reaction speed excellent
Point.
In some optional implementations, Figure 15 is refer to, Figure 15 is another display provided in an embodiment of the present invention
The planar structure schematic diagram of device.Figure 15 is only illustrated on the basis of Fig. 2, and Figure 15 has continued to use Fig. 2 reference.Its
In, multiple first conductive welding disks 30 arrange in a second direction, and second direction is perpendicular to first direction；First substrate 100 is rectangle,
The long side of first substrate 100 extends in a first direction, and the short side of first substrate 100 extends in a second direction.The present embodiment provides
Display device in, multiple first conductive welding disks 30 arrange in a second direction, optionally, multiple second conductive welding disks 40 along second
Direction arranges, and facilitates the crimping of chip 50.
Compared with prior art, display device provided by the invention, following beneficial effect is at least realized：
In display device provided by the invention, the conductive layer of conductive welding disk is arranged to two parts, including the first son is led
Electric portion and the second subconductivity portion, also, on the direction perpendicular to first substrate, the second subconductivity portion does not overlap with chip.Core
First pin of piece is electrically connected by the first subconductivity portion with the first conductive welding disk, because the second subconductivity portion is not handed over chip
Folded, the conducting resinl of spilling will not cause the side of chip to be electrically connected with the second subconductivity portion, and referring now to prior art, the present invention carries
In the display device of confession, when chip is crimped using conducting resinl and first substrate, the conducting resinl of spilling is not easy so that first leads
Electrical bonding pads and chip short circuit, improve the reliability of display device.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel it should be understood that example above merely to illustrating, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (10)
- A kind of 1. display device, it is characterised in that including：First substrate, the first substrate include viewing area and the non-display area around the viewing area；The non-display area includes the first chip bonding area and the second chip bonding area, and the viewing area, second chip are tied up Determine area, the first chip bonding area is arranged in order along a first direction；The first chip bonding area includes multiple first conductive welding disks, and it is conductive that the second chip bonding area includes multiple second Pad；First conductive welding disk include metal level, conductive layer and be held and mounted on the metal level and the conductive layer it Between insulating barrier, the metal level electrically connected by the via in insulating barrier with the conductive layer；The conductive layer includes first Subconductivity portion and the second subconductivity portion；The display device also includes chip, and the chip includes multiple first pins and multiple second pins, and described first draws Pin is electrically connected by the first subconductivity portion with first conductive welding disk, the second pin and second conductive welding disk Electrical connection；The display device also includes conducting resinl, and the chip is crimped by the conducting resinl with the first substrate；On the direction of the first substrate, the second subconductivity portion does not overlap with the chip.
- 2. display device according to claim 1, it is characterised in thatThe minimum range of the first subconductivity portion and the second subconductivity portion along the first direction is d, d >=100 μm.
- 3. display device according to claim 1, it is characterised in thatThe first subconductivity portion is shaped as circle, ellipse, quadrangle or polygon.
- 4. display device according to claim 1, it is characterised in thatThe second subconductivity portion is shaped as circle, ellipse, quadrangle or polygon.
- 5. display device according to claim 1, it is characterised in thatThe first subconductivity portion includes multiple first subconductivity branches, and the first subconductivity branch passes through the mistake in insulating barrier Hole electrically connects with the metal level；The second subconductivity portion includes multiple second subconductivity branches, and the second subconductivity branch passes through the mistake in insulating barrier Hole electrically connects with the metal level.
- 6. display device according to claim 1, it is characterised in thatThe material of the conductive layer includes tin indium oxide or indium zinc oxide.
- 7. display device according to claim 1, it is characterised in thatThe display device also includes second substrate and is held and mounted between the first substrate and the second substrate Liquid crystal layer.
- 8. display device according to claim 7, it is characterised in thatThe first substrate is array base palte, and the second substrate is color membrane substrates.
- 9. display device according to claim 1, it is characterised in thatThe first substrate includes multiple Organic Light Emitting Diodes.
- 10. display device according to claim 1, it is characterised in thatThe multiple first conductive welding disk arranges in a second direction, and the second direction is perpendicular to the first direction；The first substrate is rectangle, described in the long edge of the first substrate first direction extend, the first substrate it is short Second direction described in edge extends.
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| CN201710612858.7A CN107422551A (en) | 2017-07-25 | 2017-07-25 | A kind of display device |
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| CN201710612858.7A CN107422551A (en) | 2017-07-25 | 2017-07-25 | A kind of display device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108375849A (en) * | 2018-04-27 | 2018-08-07 | 武汉华星光电技术有限公司 | Array substrate and chip bonding method |
| CN109407358A (en) * | 2018-10-29 | 2019-03-01 | 深圳市华星光电技术有限公司 | A kind of restorative procedure and display panel of display panel |
| CN109686765A (en) * | 2018-12-24 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Chip structure and display device |
| CN110488525A (en) * | 2019-08-30 | 2019-11-22 | 厦门天马微电子有限公司 | Display panel and display device |
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| CN109407358B (en) * | 2018-10-29 | 2020-11-24 | 深圳市华星光电技术有限公司 | Display panel and repairing method thereof |
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| CN110928079B (en) * | 2019-12-18 | 2022-10-11 | 京东方科技集团股份有限公司 | Preparation method of display panel, display panel and display device |
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