TW200634903A - Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate - Google Patents

Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate

Info

Publication number
TW200634903A
TW200634903A TW094145585A TW94145585A TW200634903A TW 200634903 A TW200634903 A TW 200634903A TW 094145585 A TW094145585 A TW 094145585A TW 94145585 A TW94145585 A TW 94145585A TW 200634903 A TW200634903 A TW 200634903A
Authority
TW
Taiwan
Prior art keywords
stacked body
cof
cof substrate
insulating layer
conductor
Prior art date
Application number
TW094145585A
Other languages
Chinese (zh)
Other versions
TWI400742B (en
Inventor
Katsuya Kishida
Akira Shimada
Yuichi Tokuda
Taeko Takarabe
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200634903A publication Critical patent/TW200634903A/en
Application granted granted Critical
Publication of TWI400742B publication Critical patent/TWI400742B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Abstract

A stacked body which permits wiring of a driver IC chip to be recognized through an insulating layer, has strong adhesion between a conductor and the insulating layer and excellent electromigration resistivity, and to which fine processing, for example, that of a pitch of 30 m or less, can be performed, and a method for manufacturing such stacked body. The stacked body for COF substrate is provided with the insulating layer composed of an insulating resin on one plane of the conductor composed of a conductive metal foil. In the stacked body, the conductor thickness is 1-8 m, the surface roughness Rz of a plane touching the insulating layer of the conductor is 1.0 m or less, and the surface roughness Rz of a plane not touching the insulating layer of the conductor is 1.0 m or less. In the method for manufacturing the stacked body for COF substrate, the insulating layer is formed on the one plane of the conductive metal foil, which has a thickness of at least 10 m and a surface roughness Rz of 1.0 m or less on the one plane, a plane of the conductive metal foil not touching the insulating layer is chemically polished to have a conductive metal foil thickness of 1-8 m and a surface roughness Rz of 1.0 m or less to form the conductor.
TW94145585A 2004-12-22 2005-12-21 COF substrate laminate and a method for producing the same, and a COF film carrier tape formed by laminating a COF substrate TWI400742B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004371080 2004-12-22

Publications (2)

Publication Number Publication Date
TW200634903A true TW200634903A (en) 2006-10-01
TWI400742B TWI400742B (en) 2013-07-01

Family

ID=36601601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94145585A TWI400742B (en) 2004-12-22 2005-12-21 COF substrate laminate and a method for producing the same, and a COF film carrier tape formed by laminating a COF substrate

Country Status (5)

Country Link
JP (1) JP5064035B2 (en)
KR (1) KR101169829B1 (en)
CN (1) CN100468675C (en)
TW (1) TWI400742B (en)
WO (1) WO2006068000A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568322B (en) * 2011-03-23 2017-01-21 大日本印刷股份有限公司 Heat dissipation substrate and element using same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4823884B2 (en) * 2006-12-11 2011-11-24 新日鐵化学株式会社 Method for producing flexible copper-clad laminate
JP4828439B2 (en) * 2007-01-15 2011-11-30 新日鐵化学株式会社 Method for producing flexible laminate
US8238114B2 (en) 2007-09-20 2012-08-07 Ibiden Co., Ltd. Printed wiring board and method for manufacturing same
CN103442511A (en) * 2013-08-20 2013-12-11 珠海亚泰电子科技有限公司 High frequency substrate
JP6572083B2 (en) * 2015-09-30 2019-09-04 大日本印刷株式会社 Light emitting element substrate, module, and method for manufacturing light emitting element substrate
CN110868799A (en) * 2019-11-15 2020-03-06 江苏上达电子有限公司 Transparent COF design method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100381537C (en) * 1998-08-31 2008-04-16 日立化成工业株式会社 Abrasive liquid for metal and method for polishing
EP1150341A4 (en) * 1998-12-28 2005-06-08 Hitachi Chemical Co Ltd Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
TW591089B (en) * 2001-08-09 2004-06-11 Cheil Ind Inc Slurry composition for use in chemical mechanical polishing of metal wiring
JP4522039B2 (en) * 2002-03-28 2010-08-11 旭化成イーマテリアルズ株式会社 Manufacturing method of wiring board for COF
CN1301046C (en) * 2002-05-13 2007-02-14 三井金属鉱业株式会社 Flexible printed wiring board for chip-on-film
JP2004119961A (en) * 2002-09-02 2004-04-15 Furukawa Techno Research Kk Copper foil for chip-on film, plasma display panel, and high-frequency printed wiring board
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568322B (en) * 2011-03-23 2017-01-21 大日本印刷股份有限公司 Heat dissipation substrate and element using same

Also Published As

Publication number Publication date
KR20070091027A (en) 2007-09-06
CN101076885A (en) 2007-11-21
WO2006068000A1 (en) 2006-06-29
TWI400742B (en) 2013-07-01
CN100468675C (en) 2009-03-11
JPWO2006068000A1 (en) 2008-08-07
KR101169829B1 (en) 2012-07-30
JP5064035B2 (en) 2012-10-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees