TW200700221A - Copper clad laminated sheet and its manufacturing method - Google Patents

Copper clad laminated sheet and its manufacturing method

Info

Publication number
TW200700221A
TW200700221A TW095116743A TW95116743A TW200700221A TW 200700221 A TW200700221 A TW 200700221A TW 095116743 A TW095116743 A TW 095116743A TW 95116743 A TW95116743 A TW 95116743A TW 200700221 A TW200700221 A TW 200700221A
Authority
TW
Taiwan
Prior art keywords
copper foil
laminated sheet
clad laminated
copper
copper clad
Prior art date
Application number
TW095116743A
Other languages
Chinese (zh)
Other versions
TWI342827B (en
Inventor
Shigeaki Tauchi
Hiroyuki Morita
Daisuke Taniguchi
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200700221A publication Critical patent/TW200700221A/en
Application granted granted Critical
Publication of TWI342827B publication Critical patent/TWI342827B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

This invention provide a copper clad laminated sheet susceptible to fine circuit processing of a pitch of 30 [mu]m or below and superior in bending resistance and method for manufacturing the same. One side of the copper foil is formed of an insulating copper clad laminated sheet composed of polyimide resin. An electrolytic copper foil with a thickness of 5 [mu]m or above and a crystal particle size before heat treatment of below 2 [mu]m is used as the copper foil. After a polyimide precursor resin solution is directly applied to one side of the copper foil, the coated copper foil is heat-treated at 100-400 DEG C to form the insulating layer as well as to set the crystal particle size of the copper foil to 2 [mu]m or above and the surface not contacting with the insulating layer of the copper foil is chemically polished so as to remove 10-90% of the thickness of the copper foil and set the surface roughness Rz of the copper foil to 2.5 [mu]m or below to obtain the copper clad laminated sheet.
TW095116743A 2005-06-13 2006-05-11 Copper clad laminated sheet and its manufacturing method TW200700221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005172060A JP4804806B2 (en) 2005-06-13 2005-06-13 Copper-clad laminate and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200700221A true TW200700221A (en) 2007-01-01
TWI342827B TWI342827B (en) 2011-06-01

Family

ID=37518512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116743A TW200700221A (en) 2005-06-13 2006-05-11 Copper clad laminated sheet and its manufacturing method

Country Status (4)

Country Link
JP (1) JP4804806B2 (en)
KR (1) KR101009825B1 (en)
CN (1) CN1880061B (en)
TW (1) TW200700221A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101909877B (en) * 2007-12-27 2013-03-06 Jx日矿日石金属株式会社 Method for manufacturing double layer copper clad laminated board, and double layer copper clad laminated board
KR100958976B1 (en) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 A High Flexuous Copper Foil And Method For Producing The Same
KR100965327B1 (en) * 2008-02-28 2010-06-22 엘에스엠트론 주식회사 Flexible copper clad laminate improved in vibration resistance property
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP2010221586A (en) * 2009-03-24 2010-10-07 Asahi Kasei E-Materials Corp Metal foil polyimide laminate
CN102298998A (en) * 2010-06-23 2011-12-28 比亚迪股份有限公司 Insulating material and preparation method for the same
JP6782561B2 (en) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
JP6058182B1 (en) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6006445B1 (en) * 2015-07-27 2016-10-12 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6190500B2 (en) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6339636B2 (en) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6200042B2 (en) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
CN108133886A (en) * 2017-12-11 2018-06-08 上海申和热磁电子有限公司 A kind of method of DBC substrate backs grinding
KR102288594B1 (en) 2021-02-26 2021-08-11 주식회사 이송이엠씨 Apparatus for manufacturing thin film flexible metal clad laminate and method of manufacturing thin film flexible metal clad laminate
CN115179638B (en) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 Manufacturing method of flexible copper-clad plate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985325B2 (en) * 1991-02-18 1999-11-29 三菱瓦斯化学株式会社 Manufacturing method of thin copper-clad circuit board
JPH06232553A (en) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd Single-sided flexible copper plated board for lamination
JP3210796B2 (en) * 1993-12-28 2001-09-17 株式会社日鉱マテリアルズ High temperature stretched copper foil for printed circuits
JPH09272994A (en) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The Electrolytic copper foil for fine pattern
JP3856582B2 (en) * 1998-11-17 2006-12-13 日鉱金属株式会社 Rolled copper foil for flexible printed circuit board and method for producing the same
JP3271757B2 (en) * 1999-03-01 2002-04-08 日本電気株式会社 Method for manufacturing semiconductor device
JP3964073B2 (en) * 1999-04-27 2007-08-22 株式会社フジクラ Flexible printed circuit board and manufacturing method thereof
JP2003193211A (en) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd Rolled copper foil for copper-clad laminate
JP2004017571A (en) 2002-06-19 2004-01-22 Mitsui Chemicals Inc Polymide copper clad laminate and manufacturing method therefor
JP4219721B2 (en) * 2003-03-31 2009-02-04 新日鐵化学株式会社 Manufacturing method of laminate
JP4325337B2 (en) * 2003-09-19 2009-09-02 日立化成工業株式会社 Resin composition, prepreg, laminate and multilayer printed wiring board using the same

Also Published As

Publication number Publication date
TWI342827B (en) 2011-06-01
KR101009825B1 (en) 2011-01-19
CN1880061A (en) 2006-12-20
JP2006346874A (en) 2006-12-28
KR20060129965A (en) 2006-12-18
JP4804806B2 (en) 2011-11-02
CN1880061B (en) 2011-07-20

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