TW200638813A - Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board - Google Patents

Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board

Info

Publication number
TW200638813A
TW200638813A TW094144455A TW94144455A TW200638813A TW 200638813 A TW200638813 A TW 200638813A TW 094144455 A TW094144455 A TW 094144455A TW 94144455 A TW94144455 A TW 94144455A TW 200638813 A TW200638813 A TW 200638813A
Authority
TW
Taiwan
Prior art keywords
wiring board
flexible printed
printed wiring
multilayer
multilayer flexible
Prior art date
Application number
TW094144455A
Other languages
Chinese (zh)
Other versions
TWI306726B (en
Inventor
Kazuhide Kita
Hirokazu Hirai
Shuichi Fujita
Takashi Miwa
Original Assignee
Arisawa Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Seisakusho Kk filed Critical Arisawa Seisakusho Kk
Publication of TW200638813A publication Critical patent/TW200638813A/en
Application granted granted Critical
Publication of TWI306726B publication Critical patent/TWI306726B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention intends to provide a flexible printed wiring board and a multilayer flexible printed wiring board by which, in a method of laminating a substrate having non-adhesive and adhesive sections, adhering of FPC substrates to each other in a bending section may be prevented and sufficient bending strength may be maintained. The invention provides a flexible printed wiring board, having at least an electrical insulating layer and a conducting layer, the electrical insulating layer has a ten point average roughness ranging from 1.5 μm or more to less than 2.0 μm and a contact angle ranging from 60 DEG or more to less than 120 DEG, or a ten point average roughness ranging from 2.0 μm or more to less than 4.0 μm. The invention also provides a multilayer flexible printed wiring board wherein two or more flexible printed wiring boards are laminated, in a bendable status, and surfaces of electrical insulating layers of two or more flexible printed wiring boards exposed are opposite to each other in a non-adhesive status, a part of the wiring board is laminated to a first multilayer wiring board and a second multilayer wiring board, respectively.
TW094144455A 2005-01-11 2005-12-15 Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board TWI306726B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005004383A JP4162659B2 (en) 2005-01-11 2005-01-11 Flexible printed wiring board, multilayer flexible printed wiring board, and mobile phone terminal using the multilayer flexible printed wiring board

Publications (2)

Publication Number Publication Date
TW200638813A true TW200638813A (en) 2006-11-01
TWI306726B TWI306726B (en) 2009-02-21

Family

ID=36802402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144455A TWI306726B (en) 2005-01-11 2005-12-15 Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board

Country Status (4)

Country Link
JP (1) JP4162659B2 (en)
KR (1) KR100750019B1 (en)
CN (1) CN1805652B (en)
TW (1) TWI306726B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232476B2 (en) 2007-02-20 2012-07-31 Hitachi Chemical Company, Ltd. Flexible multilayer wiring board

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008010544A1 (en) 2006-07-19 2008-01-24 B-Core Inc. Optical symbol, article to which the optical symbol is attached, method for attaching optical symbol to article, and optical recognition code recognizing method
JP2008041960A (en) * 2006-08-07 2008-02-21 Nissan Chem Ind Ltd Manufacturing method of electronic circuit component
JP4845705B2 (en) * 2006-12-19 2011-12-28 日東電工株式会社 Printed wiring board, manufacturing method thereof, and electronic device
JP2008282352A (en) 2007-05-14 2008-11-20 B-Core Inc Marking method by shielding, marking method by deletion, and marking method by change of color
US8383230B2 (en) 2007-05-24 2013-02-26 Arisawa Mfg. Co., Ltd. Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
CN101801156B (en) * 2009-02-06 2013-02-27 周伯如 Method for manufacturing flexible printed circuit board and structure thereof
CN102186304A (en) * 2011-03-15 2011-09-14 珠海元盛电子科技股份有限公司 Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method
CN102529271B (en) * 2011-12-23 2014-12-24 云南云天化股份有限公司 Polyimide thin film for flexible circuit board, and preparation method thereof
DE102013202037A1 (en) * 2013-02-07 2014-08-07 Olympus Winter & Ibe Gmbh Hermetic bushing, method of making a hermetic bushing, circuit board and surgical instrument
KR20140148111A (en) * 2013-06-21 2014-12-31 삼성전기주식회사 Rigid flexible printed circuit board and method for manufacturing thereof
WO2015116076A1 (en) * 2014-01-30 2015-08-06 Hewlett-Packard Development Company, Lp Printed circuit board fluid ejection apparatus
TWI607677B (en) * 2016-11-21 2017-12-01 同泰電子科技股份有限公司 Flexible printed circuit board structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07312469A (en) * 1994-05-16 1995-11-28 Nippon Mektron Ltd Structure of bent part of multilayer flexible circuit board
JP2002261450A (en) 2001-02-28 2002-09-13 Shin Etsu Chem Co Ltd Multilayer flexible printed wiring board
KR100828520B1 (en) * 2001-11-23 2008-05-13 삼성전자주식회사 Liquid crystal display module
KR101018944B1 (en) 2003-03-04 2011-03-02 니폰 제온 가부시키가이샤 Process for producing multilayer printed wiring board and multilayer printed wiring board
KR100477378B1 (en) * 2003-03-21 2005-03-18 주식회사 에스아이 플렉스 Manufacturing method for Multi-layer Flexible Printed Circuit Board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232476B2 (en) 2007-02-20 2012-07-31 Hitachi Chemical Company, Ltd. Flexible multilayer wiring board
TWI424802B (en) * 2007-02-20 2014-01-21 Hitachi Chemical Co Ltd Flexible multilayer wiring board

Also Published As

Publication number Publication date
JP4162659B2 (en) 2008-10-08
KR100750019B1 (en) 2007-08-16
JP2006196548A (en) 2006-07-27
TWI306726B (en) 2009-02-21
KR20060082043A (en) 2006-07-14
CN1805652A (en) 2006-07-19
CN1805652B (en) 2012-04-25

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