TW200634182A - Copper foil for polyimide copper layer-built panel, polyimide copper layer-built panel and polyimide flexible printed circuit board - Google Patents
Copper foil for polyimide copper layer-built panel, polyimide copper layer-built panel and polyimide flexible printed circuit boardInfo
- Publication number
- TW200634182A TW200634182A TW095104047A TW95104047A TW200634182A TW 200634182 A TW200634182 A TW 200634182A TW 095104047 A TW095104047 A TW 095104047A TW 95104047 A TW95104047 A TW 95104047A TW 200634182 A TW200634182 A TW 200634182A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- polyimide
- clad laminate
- copper foil
- copper clad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/02—Terminal devices
- H04W88/04—Terminal devices adapted for relaying to or from another terminal or user
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W8/00—Network data management
- H04W8/26—Network addressing or numbering for mobility support
- H04W8/28—Number portability ; Network address portability
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W84/00—Network topologies
- H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W92/00—Interfaces specially adapted for wireless communication networks
- H04W92/16—Interfaces between hierarchically similar devices
- H04W92/18—Interfaces between hierarchically similar devices between terminal devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Databases & Information Systems (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
To provide a polyimide flexible copper clad laminate which has a high adhesive strength between a copper foil and a polyimide resin layer and has a superior insulation reliability, etching characteristics at the time of forming a wiring pattern, and bending property; and also to provide the copper foil for the polyimide flexible copper clad laminate and a polyimide flexible printed wiring board made by processing the copper clad laminate. At least the surface of the copper foil consisting of a granular crystalline structure which is in contact with the polyimide resin layer is formed with a surface treatment layer. The surface treatment layer is a Ni layer and/or a Ni alloy layer which has the Ni content of 0.03 to 3.0 mg/dm<SP>2</SP>; or a chromate layer, a Cr layer and/or a Cr alloy layer which has the Cr content of 0.03 to 1.0mg/dm<SP>2</SP>, or formed onto the above-mentioned Ni layer and/or Ni alloy layer, and formed onto the above-mentioned chromate layer, Cr layer or Cr alloy layer whose lower layer is Ni layer and/or Ni alloy layer. The copper clad laminate is provided with the surface-treated copper foil which is bonded to the polyimide resin layer to constitute the flexible copper clad laminate, the flexible copper clad laminate using the copper foil, and the polyimide flexible printed wiring board made by processing the copper clad laminate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005032631A JP2006222185A (en) | 2005-02-09 | 2005-02-09 | Polyimide flexible copper clad laminate, copper foil therefor, and polyimide flexible printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200634182A true TW200634182A (en) | 2006-10-01 |
TWI394870B TWI394870B (en) | 2013-05-01 |
Family
ID=36919361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104047A TWI394870B (en) | 2005-02-09 | 2006-02-07 | A polyimide-based flexible copper foil laminated sheet copper foil, a polyimide-based flexible copper foil laminated sheet, and a polyimide-based flexible printed wiring board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006222185A (en) |
KR (1) | KR101208310B1 (en) |
CN (1) | CN1819741A (en) |
TW (1) | TWI394870B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI414215B (en) * | 2009-06-30 | 2013-11-01 | Jx Nippon Mining & Metals Corp | A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board |
TWI421026B (en) * | 2008-02-14 | 2013-12-21 | Asia Electronic Material Co | A mask structure and a flexible printed circuit board having the mask structure |
US8808873B2 (en) | 2010-10-21 | 2014-08-19 | Industrial Technology Research Institute | Carrier-attached copper foil and method for manufacturing the same |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008065890A1 (en) * | 2006-11-29 | 2008-06-05 | Nippon Mining & Metals Co., Ltd. | Bilayer copper clad laminate |
JP2008248269A (en) * | 2007-03-29 | 2008-10-16 | Hitachi Chem Co Ltd | Copper surface treatment method, and wiring board using the method |
JP5181618B2 (en) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | Metal foil laminated polyimide resin substrate |
JP5215631B2 (en) * | 2007-10-24 | 2013-06-19 | 三井金属鉱業株式会社 | Surface treated copper foil |
KR100974368B1 (en) * | 2008-03-26 | 2010-08-05 | 엘에스엠트론 주식회사 | Copper foil for printed circuit improved in color deviation and peel strength property |
MY150825A (en) * | 2008-11-25 | 2014-02-28 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
JP5712349B2 (en) * | 2009-04-23 | 2015-05-07 | パナソニックIpマネジメント株式会社 | Method for producing flexible laminate |
WO2010140540A1 (en) * | 2009-06-05 | 2010-12-09 | Jx日鉱日石金属株式会社 | Copper foil for semiconductor package substrate and subsrate for semiconductor package |
WO2011024286A1 (en) * | 2009-08-28 | 2011-03-03 | トヨタ自動車株式会社 | Battery, vehicle and battery-mounted device |
WO2012066658A1 (en) * | 2010-11-17 | 2012-05-24 | Jx日鉱日石金属株式会社 | Copper foil for printed wiring board |
TWI408049B (en) * | 2010-11-17 | 2013-09-11 | Jx Nippon Mining & Metals Corp | Copper foil for printed wiring board |
KR101771662B1 (en) * | 2012-12-21 | 2017-08-25 | 에스케이이노베이션 주식회사 | Flexible metal clad laminate including a fluorinated polyimide resin layer |
JP5576514B2 (en) * | 2013-01-11 | 2014-08-20 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, laminated board, printed wiring board and printed circuit board |
US9673646B1 (en) * | 2016-08-19 | 2017-06-06 | Chang Chun Petrochemical Co., Ltd. | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JP3292774B2 (en) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | Copper foil for printed wiring board and method for producing the same |
JPH08125295A (en) * | 1994-10-20 | 1996-05-17 | Mitsui Toatsu Chem Inc | Metal base circuit board |
JPH08296082A (en) * | 1995-04-21 | 1996-11-12 | Nikko Gould Foil Kk | Production of copper foil for printed circuit |
JP2000340911A (en) * | 1999-05-25 | 2000-12-08 | Mitsui Mining & Smelting Co Ltd | Copper foil for printed wiring board |
JP3342479B2 (en) * | 2000-04-14 | 2002-11-11 | 福田金属箔粉工業株式会社 | Copper foil surface treatment method |
GB2361713B (en) * | 2000-04-14 | 2003-09-24 | Fukuda Metal Foil Powder | Method for surface treatment of copper foil |
JP3374127B2 (en) * | 2000-11-27 | 2003-02-04 | 古河サーキットフォイル株式会社 | Metal foil, laminated board for circuit boards using it |
JP2002280684A (en) * | 2001-03-16 | 2002-09-27 | Sumitomo Electric Printed Circuit Inc | Copper clad flexible circuit board and its manufacturing method |
JP2003324258A (en) * | 2002-05-01 | 2003-11-14 | Nippon Mektron Ltd | Copper-clad board for printed wiring board |
JP2004241427A (en) * | 2003-02-03 | 2004-08-26 | Kyocera Corp | Method of manufacturing wiring board |
JP2004263300A (en) * | 2003-02-12 | 2004-09-24 | Furukawa Techno Research Kk | Copper foil for fine pattern printed circuit and manufacturing method therefor |
JP4273309B2 (en) * | 2003-05-14 | 2009-06-03 | 福田金属箔粉工業株式会社 | Low rough surface electrolytic copper foil and method for producing the same |
JP4202840B2 (en) * | 2003-06-26 | 2008-12-24 | 日鉱金属株式会社 | Copper foil and method for producing the same |
JP2005023340A (en) * | 2003-06-30 | 2005-01-27 | Nihon Kagaku Sangyo Co Ltd | Etching method for printed circuit board and etching liquid |
-
2005
- 2005-02-09 JP JP2005032631A patent/JP2006222185A/en active Pending
-
2006
- 2006-02-07 TW TW095104047A patent/TWI394870B/en active
- 2006-02-09 CN CNA200610003768XA patent/CN1819741A/en active Pending
- 2006-02-09 KR KR1020060012336A patent/KR101208310B1/en active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421026B (en) * | 2008-02-14 | 2013-12-21 | Asia Electronic Material Co | A mask structure and a flexible printed circuit board having the mask structure |
TWI414215B (en) * | 2009-06-30 | 2013-11-01 | Jx Nippon Mining & Metals Corp | A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board |
US8808873B2 (en) | 2010-10-21 | 2014-08-19 | Industrial Technology Research Institute | Carrier-attached copper foil and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI394870B (en) | 2013-05-01 |
JP2006222185A (en) | 2006-08-24 |
KR20060090619A (en) | 2006-08-14 |
CN1819741A (en) | 2006-08-16 |
KR101208310B1 (en) | 2012-12-05 |
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