KR102288594B1 - Apparatus for manufacturing thin film flexible metal clad laminate and method of manufacturing thin film flexible metal clad laminate - Google Patents

Abstract

Disclosed are an apparatus for manufacturing a thin film flexible metal clad laminate (FMCL), which can perform generating a metal foil and coating an insulating resin layer together, a method for manufacturing a thin film FMCL, and a thin film FMCL. The apparatus for manufacturing a thin film FMCL according to the present invention includes: a metal foil generating unit which includes a drum having a cathode on the surface, an anode disposed to face the drum, and a storage container storing an electrolyte in which a portion of the drum and at least a portion of the anode are immersed, and is to create a metal foil on the surface of the drum; an insulating resin layer forming unit which is to form an insulating resin layer on the metal foil formed on the surface of the drum; and a peeling unit which includes at least one roller, and peels the metal foil on which the insulating resin layer is formed, from the drum.

Description

Thin film FMCL manufacturing apparatus and thin film FMCL manufacturing method

The present invention relates to a flexible metal clad laminate (FMCL) manufacturing technology applicable to flexible printed circuit boards (FPCBs), other electronic circuit boards, and ground foam gaskets for surface mounting. More specifically, the present invention relates to a thin film FMCL manufacturing apparatus capable of coating an insulating resin layer on a metal foil together with manufacturing a metal foil.

In addition, the present invention relates to a method for manufacturing a thin film FMCL comprising a step of coating an insulating resin layer on a metal foil.

In addition, the present invention relates to a thin film FMCL coated with an insulating resin layer on a metal foil.

With the development of various electronic devices, the demand for FPCB is increasing, and functional performance improvement is also required. In addition, a lot of research is being done on the manufacturing technology of FCCL (Flexible Copper Clad Laminate), which is a material of FPCB.

Conventional FCCL manufacturing methods include a laminated sheet method and a sputtering method.

The laminated sheet method is a method of manufacturing FCCL by laminating a polyimide film on an electrodeposited copper foil or a rolled copper foil or casting a polyimide on an electrodeposited copper foil or a rolled copper foil (eg, Patent Document 1). However, the laminated sheet method has problems such as production and handling of copper foil, and thus it is difficult to manufacture FCCL having a copper foil thickness of 10 μm or less. Accordingly, if a thin-film FCCL is required, a separate copper etching process is required.

The sputtering method is a method of manufacturing FCCL by forming a plating seed layer on a polyimide film by sputtering and performing copper plating on the plating seed layer (eg, Patent Document 2). However, in the case of the sputtering method, there is a problem that the manufacturing cost is high and the adhesion between the polyimide layer and the copper plating layer is weak compared to the laminate method.

Korean Patent Publication No. 10-2006-0129965 (published on December 18, 2006) Korean Patent Publication No. 10-2010-0117732 (published on Nov. 4, 2010)

The problem to be solved by the present invention is to provide an apparatus for manufacturing a thin film FMCL capable of coating an insulating resin layer on a metal foil together with manufacturing a metal foil.

In addition, the problem to be solved by the present invention is to provide a thin film FMCL manufacturing method capable of coating the insulating resin layer on the metal foil together with the metal foil manufacturing.

In addition, the problem to be solved by the present invention is to provide a thin film FMCL coated with an insulating resin layer on a metal foil.

A thin film FMCL manufacturing apparatus according to an embodiment of the present invention for achieving the above object is a drum having a negative electrode on the surface, a positive electrode disposed to face the drum, a part of the drum and at least a portion of the positive electrode are immersed A metal foil generating unit for generating a metal foil on the surface of the drum, including a storage container for storing the electrolyte; an insulating resin layer forming unit for forming an insulating resin layer on the metal foil formed on the surface of the drum; and a peeling part for peeling the metal foil on which the insulating resin layer is formed from the drum, including at least one roller.

Between the metal foil generating unit and the insulating resin layer forming unit, a metal foil washing unit for washing the metal foil generated on the surface of the drum with water; and a metal foil drying unit for drying the washed metal foil.

The insulating resin layer forming unit may include an applicator for applying a liquid insulating resin on the metal foil formed on the surface of the drum, and a curing unit for curing the liquid insulating resin.

The insulating resin layer forming unit is rotated in engagement with the drum, and a laminating roller for laminating a film including an insulating resin layer and a point/adhesive layer on the metal foil generated on the surface of the drum, and the point/adhesive layer for curing the It may include a hardening part.

A pattern corresponding to a printed circuit pattern may be formed on the outer peripheral surface of the drum.

A thin film FMCL manufacturing method according to an embodiment of the present invention for achieving the above object comprises the steps of (a) generating a metal foil on a rotating drum by an electrolytic plating method; (b) forming an insulating resin layer on the metal foil generated on the rotating drum; and (c) peeling the metal foil on which the insulating resin layer is formed from the rotating drum.

The step (a) may further include drying the produced metal foil after washing with water.

The forming of the insulating resin layer may be performed by applying a liquid insulating resin on the metal foil, followed by drying and curing.

The application of the liquid insulating resin may be performed by a method selected from various methods of applying the liquid insulating resin to the film, such as a comma knife method, a doctor blade method, a T-die method, and a spray method.

The forming of the insulating resin layer may be performed by attaching the insulating resin layer on the metal foil using a point/adhesive agent.

The insulating resin layer may be attached using a laminating roller that rotates in engagement with the drum.

The thin film FMCL according to an embodiment of the present invention for achieving the above object has a thickness of 0.5 to 15 μm, copper (Cu), iron (Fe), tin (Sn), gold (Au), silver (Ag), nickel a metal layer including at least one of (Ni), zinc (Zn) and aluminum (Al); and disposed on the metal layer, having a thickness of 5 to 500 μm, polyimide (PI), polyamideimide (PAI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), polypropylene At least one of (PP), ethylene vinyl acetate (EVA), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), polycarbonate (PC), polyurethane (PU), acrylic resin, fluororesin, and silicone resin It is characterized in that it comprises an insulating resin layer comprising a.

According to the thin film FMCL manufacturing apparatus and manufacturing method according to the present invention, after the production of the electrodeposited copper foil and the coating or adhesion of the insulating resin layer are performed on the drum, the laminate including the electrodeposited copper foil and the insulating resin layer is peeled off from the drum. Through this, a thin film FMCL including a metal layer having a thickness of 15 μm or less can be manufactured.

In particular, according to the thin film FMCL manufacturing apparatus and manufacturing method according to the present invention, since the thin film FMCL having a thickness of 15 μm or less can be peeled off from the drum in a state supported by the insulating resin layer, the metal foil of the FMCL is torn at the time of peeling and after peeling loss problem can be reduced. In the case of manufacturing thin film FMCL by coating or attaching an insulating resin layer to the metal foil in a continuous or separate process after peeling the metal foil, there is a time difference from peeling the metal foil from the drum to coating the insulation resin layer. While the possibility of tearing is high, in the present invention, since the insulating resin layer and the metal foil are peeled off from the drum in a bonded state, the tearing problem of the metal foil can be greatly improved.

According to the thin-film FMCL manufacturing method according to the present invention, it is possible to manufacture a thin-film metal foil of 10 μm or less, which cannot be realized without a separate process such as etching after manufacturing the FMCL with the conventional laminate method, and also, compared to the sputtering method, the metal foil It is possible to manufacture thin-film FMCL with high adhesion strength of the insulating resin layer, a simple manufacturing process, and low manufacturing cost.

1 schematically shows a thin film FMCL manufacturing apparatus according to an embodiment of the present invention.
FIG. 2 shows a cross-section of a thin film FMCL manufactured using the device shown in FIG. 1 .
Figure 3 schematically shows a thin film FMCL manufacturing apparatus according to another embodiment of the present invention.
FIG. 4 shows a cross section of a thin film FMCL manufactured using the device shown in FIG. 3 .

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, a thin film FMCL manufacturing apparatus, a thin film FMCL manufacturing method and a thin film FMCL according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 schematically shows a thin film FMCL manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 1 , the thin film FMCL manufacturing apparatus according to an embodiment of the present invention includes a metal foil generating unit 110 to 130 , an insulating resin layer forming unit 160 to 180 , and a peeling unit 190 to 195 .

The metal foil generating units 110 to 130 are for generating the metal foil 101 on the drum 110 . The insulating resin layer forming units 160 to 180 are for forming the insulating resin layer 102 on the metal foil 101 created on the surface of the drum 110 . The peeling parts 190 to 195 are for peeling the metal foil 101 on which the insulating resin layer 102 is formed from the drum 110 .

The metal foil generating unit 110 to 130 includes a drum 110 , an anode 120 , and an electrolyte storage container 130 for storing the electrolyte 135 .

The drum 110 is provided with a cathode on the surface, and rotates at a constant speed. The drum 110 itself may be made of an electrode material, or the surface of the drum 110 may be made of an electrode material. The material of the drum 110 may be selected from stainless steel, titanium, or the like. Titanium is more advantageous in peelability and corrosion resistance of the electrodeposited copper foil. On the other hand, as the surface of the cylindrical outer peripheral surface of the drum 110 on which the metal is deposited is smoother through chemical polishing, super polishing, etc., it is advantageous for peeling.

As another example of the drum 110, if a printed circuit pattern is formed on the cylindrical outer peripheral surface of the drum and then plated, the thin film FMCL with the printed circuit diagram completed can be manufactured, so the overall manufacturing process of the FPCB using the thin film FMCL is greatly shortened. can be

The anode 120 is disposed to face the drum 110 . More specifically, the anode 120 is disposed to maintain a constant distance from the drum 110 . The anode 120 may apply a current while supplying metal ions to the electrolyte 135 by inputting a metal ball to a metal plate, stainless steel, or titanium mesh to be plated, preferably, putting the metal ball into the titanium mesh It is advantageous to supply a constant current and metal ions while maintaining a constant distance between the drum 110 and the anode 120 . The current density applied to the anode 3 is preferably ^{0.5-100 A/dm 2 .} The metal plate or metal ball is one or two of copper (Cu), iron (Fe), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn) and aluminum (Al). It can be determined depending on the type of metal thin film to be plated.

The electrolyte storage container 130 stores the electrolyte 135 in which a portion of the drum 110 and at least a portion of the anode 120 are immersed. The entire anode 120 may be immersed in the electrolyte 135 , and a portion of the anode 120 may be immersed in the electrolyte 135 as in the example shown in FIG. 1 . The electrolyte solution 135 may be continuously supplied to the electrolyte storage container 130 while maintaining a certain level, and the electrolyte solution 135 may be circulated.

The electrolyte 135 is composed of 50 to 200 g/l of copper sulfate, 20 to 150 g/l of sulfuric acid, 5 to 100 mg/l of Cl, and other additives when manufacturing the electrodeposited copper foil, and the temperature is maintained at a constant temperature of 25 to 80 ° C, and the drum It is preferable to flow between the 110 and the anode 120 at a constant speed so that the gas is removed while the metal is deposited on the drum and the concentration of the electrolyte is kept constant. Meanwhile, the electrolyte 135 is one or two of copper (Cu), iron (Fe), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn) and aluminum (Al). It may contain the metal to be plated on paper.

Cooling water may flow in the drum 110 to prevent heat applied in the process of forming the insulating resin layer from being transferred to the electrolyte 135 through the drum 110, and the cooling water is circulated in an external chiller and maintained at a constant temperature. it is preferable

When a voltage is applied to the anode 120 , a metal such as copper is deposited on the surface of the drum 110 due to a potential difference between the anode 120 and the drum 110 serving as the cathode to form the metal foil 101 .

Between the drum 110 of the metal foil generating unit 110 to 130 and the insulating resin layer forming unit 160 to 180, the metal foil washing unit 140 for washing the metal foil 101 generated on the surface of the drum 110 with water 140 and It may further include a metal foil drying unit 150 for drying the washed metal foil.

The metal foil washing unit 140 is for washing the electrolyte remaining on the metal foil, and may include a washing water injection port 145 for jetting washing water such as distilled water or exclusive washing water. Meanwhile, the washing water may be recovered by a rubber knife at the upper end of the washing water injection hole 145 in close contact with the electrodeposited copper foil 101 , and the metal foil water detail unit 140 may be installed in two or more stages.

The metal foil drying unit 150 may be provided with an air dryer such as an air knife.

Meanwhile, the electrolyte injection hole 137 may be disposed at the lower end of the metal foil water detail unit 140 , that is, between the metal foil water detail unit 140 and the metal foil generating unit 110 to 130 . In order to prevent staining on the electrolytic metal foil, it is preferable to spray the electrolytic solution on the surface of the metal foil through the electrolyte injection port 137 so that the surface of the metal foil 101 does not dry until it reaches the metal foil water detail 140 . Meanwhile, the electrolyte may be recovered by a rubber-made knife at the upper end of the electrolyte injection hole 137 in close contact with the electrodeposited copper foil 101 .

The insulating resin layer forming units 160 to 180 are for forming the insulating resin layer 102 on the metal foil 101 created on the surface of the drum 110 . The thin film FMCL manufacturing apparatus according to the present invention sequentially forms the metal foil 101 and the insulating resin layer 102 on the drum 110, and then peels it off from the drum in a state in which the insulating resin layer and the metal foil are combined. Accordingly, the thin film FMCL can be peeled off from the drum in a state supported by the insulating resin layer, and thus, even if a metal foil having a thickness of 15 μm or less is formed on the drum, the tearing problem of the metal foil can be greatly improved.

Referring to FIG. 1 , the insulating resin layer forming units 160 to 180 may include a liquid insulating resin storage unit 160 , an application unit 170 , and a curing unit 180 . The liquid insulating resin storage unit 160 stores the liquid insulating resin.

The applicator 170 applies a liquid insulating resin on the metal foil 101 created on the surface of the drum 110 . Although a comma knife is presented as an example of the application unit 170 in FIG. 1 , various other means for applying a liquid insulating resin may be used. The liquid insulating resin may be in a state in which the insulating resin is dissolved in a solvent, or may be a liquid resin before synthesis into a polymer resin.

The curing unit 180 cures the liquid insulating resin to form the insulating resin layer 102 . The hardening unit 180 may further include a drying unit.

The curing unit 180 may be a sheath heater, an IR heater, a quartz tube heater, a fin heater, a hot air blower, or the like, when the insulating resin layer or the point/adhesive layer of FIG. 3 is a thermosetting type. In this case, it may be a UV lamp.

The peeling parts 190 to 195 include at least one roller 190 and 195 .

The metal foil 101 on which the insulating resin layer 102 is formed is peeled off from the drum 110 by changing the direction of the metal foil 101 on which the insulating resin layer 102 is formed through the roller 195 . In addition, the winding roller 190 maintains the tension of the metal foil 101 on which the insulating resin layer 102 is formed by winding the peeled product.

A thin film FMCL manufacturing method according to an embodiment of the present invention comprises the steps of (a) forming a metal foil on a rotating drum by an electrolytic plating method, (b) forming an insulating resin layer on the metal foil created on the rotating drum and (c) peeling the metal foil on which the insulating resin layer is formed from the rotating drum. This can be achieved by using the thin film FMCL manufacturing apparatus shown in FIGS. 1 and 3 .

After generating the metal foil on the rotating drum by the electroplating method, after washing the generated metal foil with water, the step of drying may be further included. Electrolytic copper foil can be produced by applying a constant current to the drum rotating at a constant speed.

The forming of the insulating resin layer may be performed by applying a liquid insulating resin on the metal foil, then drying and curing.

Application of the liquid insulating resin may be performed by a method selected from among several methods of applying the liquid to the film, such as a comma knife method, a doctor blade method, a T-die method, and a spray method.

As another example, the forming of the insulating resin layer may be performed by attaching the insulating resin layer on the metal foil using a pressure-sensitive adhesive or an adhesive (hereinafter, point/adhesive).

The insulating resin layer may be attached using a laminating roller (360 in FIG. 3) that rotates in engagement with the drum.

As an example of copper foil formation, when the drum 110 is rotated at a constant speed and a constant current is applied to the anode 120, Cu ²⁺ cations in the electrolyte are deposited as a metal on the drum 110, which is the cathode, as the electrodeposited copper foil 101. This is generated, and the electrolyte remaining on the copper foil surface is cleaned while passing through the multi-stage metal foil water detail 140 in the electrolyte 135 by the rotation of the drum 110, and passes through the metal foil drying unit 150 such as an air dryer. Thus, the electrodeposited copper foil 101 is dried. After coating the liquid insulating resin on the outer surface of the electrodeposited copper foil, the insulating resin layer is attached to the electrodeposited copper foil while passing through the curing unit 180 . Then, the copper foil is peeled off from the drum in the peeling part.

FIG. 2 shows a cross-section of a thin film FMCL manufactured using the device shown in FIG. 1 .

Referring to FIG. 2 , the thin film FMCL has a structure in which an insulating resin layer 102 is laminated on a metal foil 101 .

The metal foil 101 includes at least one of copper (Cu), iron (Fe), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), and aluminum (Al). can do. The metal foil 101 may be formed to a thickness of 0.5-15 μm through the apparatus shown in FIG. 1 or FIG. 3 to be described later.

Insulation resin layer 102 is polyimide (PI), polyamideimide (PAI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), ethylene vinyl acetate (EVA) ), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), polycarbonate (PC), polyurethane (PU), acrylic resin, fluorine resin, and may include one or more of a silicone resin. The insulating resin layer 102 may have a thickness of 5 to 500 μm.

Figure 3 schematically shows a thin film FMCL manufacturing apparatus according to another embodiment of the present invention.

Referring to FIG. 3 , the thin film FMCL manufacturing apparatus shown in FIG. 1 is similar to the thin film FMCL manufacturing apparatus shown in FIG. ) is included.

The metal foil generating units 310 to 330 are for generating the metal foil 301 on the drum 310 . The insulating resin layer forming units 360 to 380 are for forming the insulating resin layer 302 on the metal foil 301 formed on the surface of the drum 310 . The peeling parts 390 to 395 are for peeling the metal foil 301 on which the insulating resin layer 302 is formed from the drum 310 .

In addition, between the drum 310 of the metal foil generating unit 310 to 330 and the insulating resin layer forming unit 360 to 380, the metal foil washing unit 340 for washing the metal foil 301 generated on the surface of the drum 310 with water. ) and may further include a metal foil drying unit 350 for drying the washed metal foil. The metal foil water detail 340 may include a washing water spray hole 345 .

Meanwhile, the electrolyte injection hole 337 may be disposed at the lower end of the metal foil water detail unit 340 , that is, between the metal foil water detail unit 340 and the metal foil generation units 310 to 330 .

However, in the thin film FMCL manufacturing apparatus shown in FIG. 3 , the insulating resin layer forming units 360 to 380 are different from the insulating resin layer forming units 160 to 180 of FIG. 1 .

The insulating resin layer forming unit shown in FIG. 3 may include a laminating roller 360 . The laminating roller 360 is rotated in engagement with the drum 110 while laminating the film including the insulating resin layer 302 and the adhesive layer 303 on the metal foil 301 created on the surface of the drum 310. . The film including the insulating resin layer 302 and the adhesive layer 303 may be supplied to the laminating roller 360 from a separate roller 370 . A direction change roller 375 may be included if necessary. A heating means such as a heater may be provided on the laminating roller 360 .

3 shows an example in which the film including the insulating resin layer 302 and the adhesive layer 303 has a two-layer structure. As another example, a release layer may be disposed on the point/adhesive layer 303 of the film including the insulating resin layer 302 and the point/adhesive layer 303 . The release layer may be peeled off from the film before being fed to the laminating roller 360 .

In addition, the insulating resin layer forming unit shown in FIG. 3 may include a curing unit 380 for curing the adhesive layer 303 . When the point/adhesive layer 303 is a thermosetting type, the curing unit 380 may include a means for applying heat to the point/adhesive layer 303 . When the adhesive layer 303 is an ultraviolet curing type, the curing unit 380 may include a UV irradiation means.

FIG. 4 shows a cross section of a thin film FMCL manufactured using the device shown in FIG. 3 .

Referring to FIG. 4 , the thin film FMCL has a structure in which an insulating resin layer 302 is laminated on a metal foil 301 . In addition, a point/adhesive layer 303 is disposed between the metal foil 301 and the insulating resin layer 302 .

The metal foil 301 includes at least one of copper (Cu), iron (Fe), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), and aluminum (Al). can do. The metal foil 301 may be formed to a thickness of 0.5-15 μm through the apparatus shown in FIG. 3 .

Insulation resin layer 302 is polyimide (PI), polyamideimide (PAI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), ethylene vinyl acetate (EVA) ), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), polycarbonate (PC), polyurethane (PU), acrylic resin, fluorine resin, and may include one or more of a silicone resin. The insulating resin layer 302 may have a thickness of 5 to 500 μm.

The point/adhesive layer 303 may be formed of a material having adhesive or adhesive properties, such as a hot melt adhesive, a liquid resin adhesive, a UV adhesive, or a PSA adhesive. The thickness of the pressure-sensitive adhesive layer 303 may be 1 to 20 μm, but is not limited thereto.

As described above, using the thin film FMCL manufacturing apparatus and thin film FMCL manufacturing method according to the present invention, the electrolytic metal foil generated on the drum in the electrolyte is washed and dried, and the insulating resin is coated and dried before the electrolytic metal foil is peeled off the drum. And after curing to create an insulating resin layer, it can be peeled off the drum, through which even a thin metal foil with a thickness of 15 μm or less is attached to the insulating resin layer, so handling is easy, and the tearing problem can be reduced.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments and may be manufactured in a variety of different forms, and those of ordinary skill in the art to which the present invention pertains It will be understood that the present invention may be embodied in other specific forms without changing the spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

101, 301: metal foil
102, 302: insulating resin layer
110, 310: drum (cathode)
120, 320: positive electrode
130, 130: electrolyte storage container (plating tank)
135, 135: electrolyte
140, 340: metal foil water detail
150, 350: metal foil drying unit
160: liquid insulating resin storage unit
170: applicator
180, 380: hardened part
190, 390: winding roll
303: point adhesive layer
360: laminating roller
370: film feed roller

Claims (12)

A drum having a cathode on its surface, an anode disposed to face the drum, and a storage container for storing a portion of the drum and an electrolyte in which at least a portion of the anode is immersed, thereby generating a metal foil on the surface of the drum a metal foil generating unit for;
an insulating resin layer forming unit for forming an insulating resin layer on the metal foil formed on the surface of the drum; and
including at least one roller, and a peeling part for peeling the metal foil on which the insulating resin layer is formed from the drum;
The thin film FMCL manufacturing apparatus, characterized in that the insulating resin layer forming part is arranged so that the insulating resin layer is formed on the drum.
According to claim 1,
Between the metal foil generating unit and the insulating resin layer forming unit,
a metal foil washing portion for washing the metal foil generated on the surface of the drum; and
Thin film FMCL manufacturing apparatus, characterized in that it further comprises a metal foil drying unit for drying the washed metal foil.
According to claim 1,
The insulating resin layer forming part is a thin film FMCL manufacturing apparatus, characterized in that it comprises a coating part for applying a liquid insulating resin on the metal foil generated on the surface of the drum, and a curing part for curing the liquid insulating resin.
According to claim 1,
The insulating resin layer forming unit rotates in engagement with the drum, and a laminating roller for laminating a film including an insulating resin layer and a point/adhesive layer on the metal foil generated on the surface of the drum, and the point/adhesive layer for curing the Thin film FMCL manufacturing apparatus comprising a hardening part.
According to claim 1,
A thin film FMCL manufacturing apparatus in which a pattern corresponding to a printed circuit pattern is formed on the outer peripheral surface of the drum.
(a) generating a metal foil on a rotating drum by an electrolytic plating method;
(b) forming an insulating resin layer on the metal foil generated on the rotating drum; and
(c) peeling the metal foil on which the insulating resin layer is formed from the rotating drum,
A thin film FMCL manufacturing method, characterized in that the insulating resin layer is formed on the drum before the metal foil is peeled from the drum.
7. The method of claim 6,
The step (a) is,
After washing the produced metal foil with water, the thin film FMCL manufacturing method further comprising the step of drying.
7. The method of claim 6,
The step of forming the insulating resin layer is
A thin film FMCL manufacturing method, characterized in that it is carried out by applying a liquid insulating resin on the metal foil, followed by drying and curing.
9. The method of claim 8,
The liquid insulating resin is applied by a method selected from a comma knife method, a doctor blade method, a T-die method and a spray method.
7. The method of claim 6,
The step of forming the insulating resin layer is
A method for manufacturing a thin film FMCL, characterized in that it is carried out by attaching an insulating resin layer on the metal foil using an adhesive.
11. The method of claim 10,
The thin film FMCL manufacturing method, characterized in that the attachment of the insulating resin layer uses a laminating roller that rotates in engagement with the drum.
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