CN205792909U - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN205792909U CN205792909U CN201620497657.8U CN201620497657U CN205792909U CN 205792909 U CN205792909 U CN 205792909U CN 201620497657 U CN201620497657 U CN 201620497657U CN 205792909 U CN205792909 U CN 205792909U
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- China
- Prior art keywords
- camera module
- layer
- adhesion agent
- substrate
- agent layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
This utility model relates to a kind of camera module, including substrate, image sensing wafer, lens barrel and microscope base, described lens barrel is housed in microscope base, described image sensing wafer is covered on substrate, described substrate is mutually bonding away from the end face of described lens barrel with described microscope base, described substrate includes opposing upper surface, lower surface and side, described side connects described upper surface and described lower surface, described image sensing wafer is arranged on described upper surface, described lower surface is covered with electromagnetic interference shielding thin film, and described electromagnetic interference shielding thin film is covered with ground plane.
Description
Technical field
This utility model relates to a kind of camera module, particularly relates to a kind of for electromagnetic protection, heat radiation and lighttight low
Highly substrate design.
Background technology
Owing to CIS (Sensor) is in the confined space of camera module, the image sense when opening image procossing
Survey device and can produce thermal source；And camera module is easily subject to external electromagnetic wave doing image high frequency signal transmission when and does
Disturbing, therefore heat radiation and electromagnetic interference shielding are the most important problems of camera module.
In order to solve the two problem, the traditional way of camera model is to conduct electricity at the back designs of substrate or adapter
Glue and stainless-steel sheet, steel plate is close to the thermal source of substrate back therefore CIS generation and can be dispelled the heat away by steel plate.
Owing to steel plate uses conducting resinl to be attached to substrate back, therefore substrate back can be effectively prevented electromagnetic interference.
But design cost that conducting resinl adds steel plate is higher, and processing procedure is complicated, along with the development of science and technology, on market urgently
Need a kind of simplicity, price the cheapest the heat radiation of camera module and electromagnetic interference protection structure.
Utility model content
In view of this, it is necessary to a kind of camera module solving above-mentioned technical problem is provided.
A kind of camera module, including substrate, image sensing wafer, lens barrel and microscope base, described lens barrel is housed in microscope base, institute
Stating image sensing wafer to be covered on substrate, described substrate is mutually bonding away from the end face of described lens barrel with described microscope base, described base
Plate includes opposing upper surface, lower surface and side, and described side connects described upper surface and described lower surface, described image sense
Surveying wafer and be arranged on described upper surface, described lower surface is covered with electromagnetic interference shielding thin film, described electromagnetic interference shielding thin film
On be covered with ground plane.
Compared to prior art, the camera module that this utility model provides, the camera module that this utility model provides, at base
Plate lower surface pastes described electromagnetic interference shielding thin film, pastes ground plane on electromagnetic interference shielding thin film, due in ground plane
Being respectively provided with multiple conducting particles, multiple conducting particles can penetrate the insulating barrier electrical connection electromagnetic interference of electromagnetic interference shielding thin film
Protect thin film and ground plane, and as electromagnetic protection and the path of heat radiation, there is comprehensive electromagnetic protection function and good
Heat radiation performance, its processing procedure is relatively simple, and steel plate the most traditional in material cost pastes cheaply.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the camera module that this utility model better embodiment provides.
Fig. 2 is the partial cutaway schematic of the camera module in Fig. 1.
Fig. 3 is the generalized section being coated with light tight conductive silver glue around the camera module group substrates in Fig. 2.
Fig. 4 is the generalized section of the electromagnetic interference shielding thin film that this utility model embodiment provides.
Fig. 5 is the generalized section of the ground plane that this utility model embodiment provides.
Fig. 6 is that the electroconductive particle of the ground plane that this utility model embodiment provides penetrates in electromagnetic interference shielding thin film
The schematic diagram ground plane of insulating barrier.
Fig. 7 is the part section signal that the ground plane in the camera module in Fig. 2 is covered with conducting foam and metal frame
Figure.
Main element symbol description
Following detailed description of the invention will further illustrate this utility model in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
This utility model embodiment will be described in further detail below in conjunction with the accompanying drawings.
Refer to Fig. 1, the camera module 100 provided for this utility model embodiment.Described camera module 100 includes one
20, packing ring of 10, CIS of individual substrate, 40, voice coil motor 50 of 30, infrared fileter and receipts
Hold the camera lens module 60 in described voice coil motor 50.
Incorporated by reference to Fig. 2, described substrate 10 is circuit board.Described substrate 10 includes 12, lower surface 14 of a upper surface
And a side 16.In present embodiment, described upper surface 12 is parallel to described lower surface 14, and described side 16 is perpendicular to described
Upper surface 12 and described lower surface 14.
Described CIS 20 is arranged on described substrate 10, and electrically connects with described substrate 10.
Described packing ring 30 is arranged on described substrate 10, and covers described CIS 20.Described packing ring 30 substantially in
Oblong-shaped.Described packing ring 30 central authorities offer a groove 32.Described groove 32 runs through described packing ring 30.Described groove 32 is in length
Cube, is used for housing described infrared fileter 40.
Described infrared fileter 40 is in cuboid, and its size shape is corresponding with described groove 32.
Described voice coil motor 50 is substantially in rectangular-shaped.Described voice coil motor 50 covers in described CIS 20, institute
State on packing ring 30 and described infrared fileter 40, and electrically connect with described substrate 10.Described voice coil motor 50 central authorities are provided with one
Accepting groove 52.Described accepting groove 52 runs through the both side surface that described voice coil motor 50 is relative.Described accepting groove 52 is used for housing institute
State camera lens module 60.Described accepting groove 52 medial surface is provided with helicitic texture.
The shape size of described camera lens module 60 is corresponding with described accepting groove 52.Described camera lens module 60 lateral surface is arranged
There is the helicitic texture corresponding with described accepting groove 52 medial surface, in order to described camera lens module 60 moves in described accepting groove 52
Dynamic.
Referring to Fig. 2, described CIS 20 is arranged on described upper surface 12, is positioned at described substrate 10 central authorities.Described
Lower surface 14 is covered with electromagnetic interference shielding thin film 70.Described electromagnetic interference shielding thin film 70 is used for preventing electromagnetic wave by under described
Surface 14 enters described substrate 10.In present embodiment, the thickness of described electromagnetic interference shielding thin film 70 is 15.1 microns.
Refer to Fig. 3, described side 16 is covered with lighttight conductive silver glue 90.Described conductive silver glue 90 extends to institute
State ground plane 80, and electrically connect ground connection with described ground plane 80.Described light tight conductive silver glue 90 covers at described substrate 10
Side 16, to prevent the light within described camera module 100 from exposing from described side 16.And described conductive silver glue 90 is also
It is possible to prevent the side 16 of described substrate 10 from the impact to electromagnetic interference.
Referring to Fig. 4, the model of described electromagnetic interference shielding thin film 70 can arbitrarily select.For the ease of introducing described electricity
The structure of magnetic disturbance protection film 70, present embodiment is as a example by PC5600.Described electromagnetic interference shielding thin film 70 includes one
First anisotropy conduction adhesion agent layer 74, insulating barrier 76 of 72, metal film layer and a protecting film 78.
Please with reference to Fig. 6, described first anisotropy conduction adhesion agent layer 72 is covered on the lower surface 14 of described substrate 10.
Described first anisotropy conduction adhesion agent layer 72 electrically connects described substrate 10 and described metal film layer 74.Described first anisotropy
The thickness of conduction adhesion agent layer 72 is 17 microns.After pressing, the thickness of described first anisotropy conduction adhesion agent layer 72 becomes 10
Micron.Described first anisotropy conduction adhesion agent layer 72 is containing multiple conducting particles.Described metal film layer 74 is attached to described
In first anisotropy conduction adhesion agent layer 72.Described metal film layer 74 is by described first anisotropy conduction adhesion agent layer 72 electricity
Connect described substrate 10.Described metal film layer 74 is used for shielding electromagnetic wave.The thickness of described metal film layer 74 is 0.1 micro-
Rice.Described insulating barrier 76 is covered on described metal film layer 74.The thickness of described insulating barrier 76 is 5 microns.Described insulating barrier
76 include the first insulating barrier and the second insulating barrier.Described first insulating barrier is covered in described metal film layer 74 surface.Described guarantor
Cuticula 78 is covered on described second insulating barrier.The thickness of described protecting film is 50 microns.Described protecting film 78 is by gathering benzene two
Formic acid (PET) is made.Described protecting film 78 is for protecting the raw material of described electromagnetic interference shielding thin film 70, during use,
Described protecting film 78 need to be torn (removal) from described insulating barrier 76.
Refer to Fig. 2, described electromagnetic interference shielding thin film 70 is covered with ground plane 80.The thickness of described ground plane 80 is
13 microns.
Referring to Fig. 5, the model of described ground plane 80 can arbitrarily select.For the ease of introducing the knot of described ground plane 80
Structure, present embodiment is as a example by FGF 500.Described ground plane 80 includes a second anisotropy conduction adhesion agent layer 82,
84, electrodeposited coating 86 of copper foil layer and a protecting film 88.
Please with reference to Fig. 6, described second anisotropy conduction adhesion agent layer 82 is covered in described insulating barrier 76 surface.Described
The thickness of the second anisotropy conduction adhesion agent layer 82 is 6 microns.Described copper foil layer 84 is attached to described second anisotropy conduction and connects
In oxidant layer 82.Containing multiple conducting particles 820 in described second anisotropy conduction adhesion agent layer 82.The thickness of described copper foil layer 84
Degree is 6 microns.Described copper foil layer 84 is covered in described second anisotropy conduction adhesion agent layer 82.Described electrodeposited coating 86 is covered in
Described copper foil layer 84 surface.Described electrodeposited coating 86 is used for protecting described copper foil layer 84, prevents described copper foil layer 84 from aoxidizing.Institute
The thickness stating electrodeposited coating 86 is 1 micron.Described protecting film 88 is covered on described electrodeposited coating 86.The thickness of described protecting film is 64
Micron.Described protecting film 88 is made by poly terephthalic acid (PET).Described protecting film 88 is used for protecting described ground plane 80
Raw material, assemble use time described protecting film 88 need to be torn (removal).In present embodiment, described protecting film 88 is one layer
Blue reinforcing film.
Referring to Fig. 6, described second anisotropy conduction adhesion agent layer 82 is covered in described insulating barrier 76 surface.Use described
During camera module 100, the plurality of conducting particles 820 can pierce through the insulating barrier 76 of described electromagnetic interference shielding thin film 70, electricity
Connect described second anisotropy conduction adhesion agent layer 82 and described metal film layer 74.Multiple conductive particles described in present embodiment
Son 820 can penetrate described metal film layer 74, arrives described first anisotropy conduction adhesion agent layer 72 surface.Other embodiment party
In formula, the plurality of conducting particles 820 can not penetrate through described metal film layer 74, only reaches to described metal film layer 74 table
Face.In like manner, the multiple conducting particles in described first anisotropy conduction adhesion agent layer 72 can pierce through described metallic film equally
Layer 74 and the insulating barrier 76 of described electromagnetic interference shielding thin film 70, arrive described second anisotropy conduction adhesion agent layer 82 surface,
Electrically connect described second anisotropy conduction adhesion agent layer 82.In the present embodiment, described first anisotropy conduction adhesion agent layer
Multiple conducting particles in 72 can not penetrate through described metal film layer 74, exists only in described first anisotropy conduction solid
In layer 72.
So, the dew copper in described substrate 10 can be by the conductive particle in described first anisotropy conduction adhesion agent layer 72
Metal film layer 74 in electromagnetic interference shielding thin film 70 sub, described and the conducting particles 820 in described ground plane 80 arrive altogether
The described electrodeposited coating 86 on surface.
Refer to Fig. 6, the cross sectional shape of described conducting particles 820 is positive ten cubes.The most described lead
The cross section of charged particle 820 can be other any shapes, ellipse as shown in Figure 7, but is not limited thereto.
Referring to Fig. 7, whole camera module 100 can utilize conducting foam 92 to contact described ground plane 80 altogether.Specifically
Ground, described conducting foam 92 is attached to the described electrodeposited coating 86 surface away from described electromagnetic interference shielding thin film 70.One gold medal is provided
Belong to framework 95, described metal frame 95 is fixedly connected on described electrodeposited coating 86 by described conducting foam 92.Described substrate
10 with described metal frame 95 altogether.The thermal source that described CIS 20 produces in running can pass through described electromagnetism
Interference prevention thin film 70, described ground plane 80, described conducting foam 92 and described metal frame 95 transfer out described camera module
100。
Further, in other embodiments, described ground plane 80 can need not at described camera module 100 back side
Whole attaching, it is only necessary to selecting described electromagnetic interference shielding thin film 70 needs to contact the local attaching of electronic product enclosure；Position
Design can be allocated the most freely in upper and design, it is not necessary to the lower surface 14 of whole substrate 10 reveal copper and can not cabling, fully
Utilize the lower surface 14 of whole substrate 10.
The camera module 100 that this utility model provides, pastes described electromagnetic interference shielding at described substrate 10 lower surface 14
Thin film 70, pastes described ground plane 80 on described electromagnetic interference shielding thin film 70, many owing to being respectively provided with in described ground plane 80
Individual conducting particles 820, the plurality of conducting particles 820 can penetrate the insulating barrier 76 of described electromagnetic interference shielding thin film 70 and electrically connect
Described electromagnetic interference shielding thin film 70 and described ground plane 80, and as electromagnetic protection and the path of heat radiation, have comprehensive
Electromagnetic protection function and good heat radiation performance, its thickness and weight are covered in well below traditional steel plate by conducting resinl
Thickness during design on substrate 10 and weight, steel plate the most traditional in material cost pastes cheaply, and described substrate 10
Layout cabling and the design flexibility contacted with complete machine are bigger.
It is understood that for the person of ordinary skill of the art, can be according to technology structure of the present utility model
Think to make other various corresponding changes and deformation, and all these change all should belong to this utility model claim with deformation
Protection domain.
Claims (9)
1. a camera module, including substrate, image sensing wafer, lens barrel and microscope base, described lens barrel is housed in microscope base, described
Image sensing wafer is covered on substrate, and described substrate is mutually bonding away from the end face of described lens barrel with described microscope base, and its feature exists
In: described substrate includes that opposing upper surface and lower surface, described image sensing wafer are arranged on described upper surface, described following table
Face is covered with electromagnetic interference shielding thin film, and described electromagnetic interference shielding thin film is covered with ground plane.
2. camera module as claimed in claim 1, it is characterised in that described substrate includes side, and described side connects described
Upper surface and described lower surface, described camera module includes lighttight conductive silver glue, and described lighttight conductive silver glue is coated with
Ground connection is electrically connected in described side and with described ground plane.
3. camera module as claimed in claim 1, it is characterised in that described electromagnetic interference shielding thin film includes the first anisotropy
Conduction adhesion agent layer, metal film layer and insulating barrier, described first anisotropy conduction adhesion agent layer is attached to described lower surface, institute
Stating metal film layer and be attached to described first anisotropy conduction adhesion agent layer, described insulating barrier is attached to described metal film layer,
Described first anisotropy conduction adhesion agent layer, described metal film layer and described insulating barrier are towards the direction away from described substrate sequentially
Arrangement, described insulating barrier is covered with described ground plane, and described first anisotropy conduction adhesion agent layer electrically connects described substrate and institute
State metal film layer.
4. camera module as claimed in claim 3, it is characterised in that the thickness of described electromagnetic interference shielding thin film is 15.1 micro-
Rice, the thickness of described first anisotropy conduction adhesion agent layer is 10 microns, and the thickness of described metal film layer is 0.1 micron, institute
The thickness stating insulating barrier is 5 microns.
5. camera module as claimed in claim 3, it is characterised in that described ground plane includes the second anisotropy conduction solid
Layer, copper foil layer and electrodeposited coating, described second anisotropy conduction adhesion agent layer is attached on described insulating barrier, and described copper foil layer pastes
In described second anisotropy conduction adhesion agent layer, described electrodeposited coating is covered on described copper foil layer, and described second anisotropy is led
Electricity adhesion agent layer, described copper foil layer and described electrodeposited coating are towards the direction sequential away from described insulating barrier.
6. camera module as claimed in claim 5, it is characterised in that the thickness of described ground plane is 13 microns, described second
The thickness of anisotropy conduction adhesion agent layer is 6 microns, and the thickness of described metallic copper layers of foil is 6 microns, the thickness of described electrodeposited coating
It it is 1 micron.
7. camera module as claimed in claim 5, it is characterised in that described second anisotropy conduction adhesion agent layer is contained within many
Individual conducting particles, the plurality of conducting particles pierces through described insulating barrier, electrically connects described metal film layer.
8. camera module as claimed in claim 1, it is characterised in that described camera module also includes conducting foam and metal frame
Body, described metal frame is fixed on described ground plane by described conducting foam, and electrically connects described ground plane and described gold
Belong to framework.
9. camera module as claimed in claim 8, it is characterised in that described conducting foam electrically connects with described substrate, both
Common ground.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620497657.8U CN205792909U (en) | 2016-05-27 | 2016-05-27 | Camera module |
| TW105208421U TWM556336U (en) | 2016-05-27 | 2016-06-03 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620497657.8U CN205792909U (en) | 2016-05-27 | 2016-05-27 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205792909U true CN205792909U (en) | 2016-12-07 |
Family
ID=57407293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620497657.8U Expired - Fee Related CN205792909U (en) | 2016-05-27 | 2016-05-27 | Camera module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205792909U (en) |
| TW (1) | TWM556336U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110955105A (en) * | 2019-12-20 | 2020-04-03 | 青岛海信激光显示股份有限公司 | Laser projection device |
| JP7364516B2 (en) | 2020-03-27 | 2023-10-18 | 京セラ株式会社 | Circuit board and imaging module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6703313B1 (en) * | 2018-12-04 | 2020-06-03 | Smk株式会社 | Connector module for camera |
-
2016
- 2016-05-27 CN CN201620497657.8U patent/CN205792909U/en not_active Expired - Fee Related
- 2016-06-03 TW TW105208421U patent/TWM556336U/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110796948B (en) * | 2019-10-30 | 2022-03-22 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110955105A (en) * | 2019-12-20 | 2020-04-03 | 青岛海信激光显示股份有限公司 | Laser projection device |
| JP7364516B2 (en) | 2020-03-27 | 2023-10-18 | 京セラ株式会社 | Circuit board and imaging module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM556336U (en) | 2018-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20180527 |