CN109890188B

CN109890188B - Packaging assembly and electronic equipment

Info

Publication number: CN109890188B
Application number: CN201910118194.8A
Authority: CN
Inventors: 郭学平; 吴鹏
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-02-15
Filing date: 2019-02-15
Publication date: 2021-03-23
Anticipated expiration: 2039-02-15
Also published as: WO2020164497A1; CN109890188A

Abstract

The embodiment of the application provides a packaging assembly and electronic equipment, this packaging assembly includes: the packaging structure comprises a substrate, a packaged device, a support and a cover plate, wherein the substrate comprises a first surface and a second surface which are opposite, and a side face connecting the first surface and the second surface, the packaged device is located on the first surface of the substrate, and the support is located on the first surface of the substrate and surrounds the packaged device; the first surface of the substrate, the cover plate and the bracket form an enclosed space, and the packaged device is accommodated in the enclosed space; wherein, be provided with the ground pad on the second surface of base plate, the apron includes: a first region; the surface of support and outside contact the side of base plate, and be equipped with electromagnetic shield on the first region, the electromagnetic shield of first region passes through the support with electromagnetic shield on the base plate with ground connection pad electricity is connected.

Description

Packaging assembly and electronic equipment

Technical Field

The application relates to the field of photoelectric technology, in particular to a packaging assembly and an electronic device.

Background

Electromagnetic shielding technology refers to the electromagnetic shielding structure made of conductive or magnetic conductive materials to limit the electromagnetic interference energy within a certain range, so as to control the induction or radiation of an electric field, a magnetic field and electromagnetic waves from one region to another region. Specifically, the electromagnetic shielding structure isolates the electronic component or the interference source of the whole system, and prevents the influence of an external electromagnetic field or the diffusion of the interference electromagnetic field to the outside.

At present, the application of a packaging component in electronic equipment such as a mobile phone is more and more popular, and a light-transmitting area, an air hole and the like need to be arranged on the packaging component in consideration of the light-transmitting and air-permeable requirements of some packaged devices. However, these packaged devices may generate or receive interference from external devices when transmitting electrical signals, and therefore, an electromagnetic shielding structure is required for the package assembly.

Disclosure of Invention

The embodiment of the application provides a packaging assembly and electronic equipment, which are used for improving the electromagnetic shielding performance of the packaging assembly and avoiding electromagnetic interference.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, a package assembly is provided, the package assembly comprising: a substrate, a packaged device, a bracket and a cover plate,

the substrate comprises a first surface and a second surface which are opposite to each other, and a side face connecting the first surface and the second surface, the packaged device is located on the first surface of the substrate, the support is located on the first surface of the substrate and surrounds the packaged device, the first surface of the substrate, the cover plate and the support form a closed space, the packaged device is accommodated in the closed space, wherein a grounding pad is arranged on the second surface of the substrate, and the cover plate comprises: the first region, the support with the surface of outside contact the side of base plate, and be equipped with electromagnetic shield layer in the first region, just the electromagnetic shield layer in first region passes through the support with electromagnetic shield layer on the base plate with ground connection pad electricity is connected. Therefore, the electromagnetic shielding layer and the grounding bonding pad of the substrate jointly form an electromagnetic shielding area, the packaged device is isolated in the electromagnetic shielding area, electromagnetic interference between the packaged device and an external magnetic field is avoided, and the shielding performance of the packaging assembly is improved.

In an optional implementation manner, the electromagnetic shielding layer is a conductive and magnetic conductive transparent shielding film, a metal shielding film, or a shielding adhesive film. Therefore, the electromagnetic shielding layer can be directly covered on the surface of the packaging assembly, the thickness is only in a micron level, the occupied space is small, and the miniaturization of the packaging assembly is facilitated.

In an optional implementation manner, the packaged device includes a light device, the cover plate includes a second region for transmitting light, the second region is a region covered by a viewing angle range of the light device on the cover plate, and the first region is a region outside the second region on the cover plate. From this, can be according to whether need the printing opacity to carry out different shielding processing to first region and second region to make encapsulation subassembly can satisfy this optical device's printing opacity demand, can realize the electromagnetic shield again.

In an alternative implementation, the cover plate is a transparent plate, and the second region is covered with the transparent shielding film. From this, the second region covers transparent shielding film, when satisfying the printing opacity demand of optical device, has realized the full shield to the encapsulation subassembly.

In an optional implementation manner, the transparent shielding film is made of: indium tin oxide. The transparent shielding film made of the indium tin oxide material can transmit light and has conductivity, so that the transparent shielding film can transmit light and can shield electromagnetic interference.

In an optional implementation manner, the packaged device includes a pressure sensor and a humidity sensor, the cover plate is provided with an air hole communicated with the outside, and the first area is an area outside the air hole on the cover plate. Therefore, the electromagnetic shielding layer can not be covered at the air vent, and the cost is reduced.

In an optional implementation manner, the cover plate is made of metal or glass. The cover plate is not limited in material, so long as the strength requirement of the packaging assembly can be met, and the packaged device arranged in the packaging assembly can be protected.

In an alternative implementation, the metallic shielding film includes: the adhesive layer covers the surface of the support, which is in contact with the outside, the side face of the substrate and the surface of the first area, and the shielding metal layer is arranged on the adhesive layer. Therefore, the shielding metal layer can be used for electromagnetic shielding, the adhesion layer can adhere the shielding metal layer to the surface of the support, which is in contact with the outside, the side surface of the substrate and the surface of the first area, and the composite structure improves the bonding firmness of the electromagnetic shielding layer.

In an optional implementation manner, the adhesion layer is made of: titanium, the shielding metal layer is made of: copper. The specific materials of the adhesion layer and the shielding metal layer are not limited in this embodiment.

In an optional implementation, the electromagnetic shielding layer further includes: an oxidation prevention layer disposed on the shielding metal layer. Therefore, the oxidation preventing layer can prevent the oxidation of the shielding metal layer, and the shielding performance is improved.

In an optional implementation manner, the oxidation preventing layer is made of: stainless steel. The specific material of the oxidation preventing layer is not limited in this embodiment.

In an alternative implementation, the masking film is an epoxy colloid doped with ferromagnetic particles. Therefore, the energy of the electromagnetic wave projected by the packaged device and the external device can be absorbed or greatly weakened, and the interference of the electromagnetic wave is reduced.

In an optional implementation mode, one side of the support, which is close to the cover plate, is provided with an L-shaped groove for supporting the cover plate, the cover plate covers the L-shaped groove of the support, and the concave surface of the L-shaped groove of the support is covered with the electromagnetic shielding layer. Therefore, the electromagnetic shielding layer arranged on the concave surface of the L-shaped groove of the support is conducted with the grounding bonding pad of the substrate through the electromagnetic shielding layer arranged on the surface of the support contacting with the outside, and the shielding performance is further improved.

In an alternative implementation, the cover plate is bonded to the concave surface of the L-shaped groove of the bracket by a conductive bonding member. From this, electrically conductive bonding piece is when sealed the gap between apron and the support for the electromagnetic shield layer that sets up on apron first surface is connected through electrically conductive bonding piece and the electromagnetic shield layer electricity that sets up on the support, has realized ground connection, has further improved shielding performance.

In an optional implementation, the packaged device further includes: an electrical device located in the support or the substrate. Therefore, the area occupied by the electric device can be reduced, and the size of the whole packaging assembly is further reduced.

In an optional implementation manner, the inner side surface of the bracket for enclosing the closed space is covered with the electromagnetic shielding layer. Therefore, mutual interference between the packaged devices arranged in the support and the closed space in the horizontal direction is avoided, electromagnetic interference of the packaged devices arranged in the substrate on the packaged devices arranged on the substrate is also avoided to a certain extent, and the shielding performance of the packaging assembly is improved.

In a second aspect, the present application provides an electronic device, which includes a PCB board and the package assembly as described above, wherein the ground pad of the package assembly is soldered on the PCB board. Therefore, the electronic device is provided with the packaging assembly, and the electromagnetic shielding performance of the electromagnetic device is improved.

These and other aspects of the present application will be more readily apparent from the following description of the embodiments.

Drawings

Fig. 1 is a schematic structural diagram of a package assembly provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of another package assembly provided in the present application;

FIG. 3 is a top view of the cover plate of FIG. 2;

FIG. 4 is a cross-sectional view of the cover plate of FIG. 2;

FIG. 5 is a top view of the package assembly of FIG. 2;

FIG. 6 is a cross-sectional view of another cover plate;

FIG. 7 is a cross-sectional view of another cover plate;

fig. 8 is a schematic view of another structure of the package assembly of fig. 2 with an electromagnetic shielding layer;

fig. 9 is a schematic view of another structure of the package assembly of fig. 2 with an electromagnetic shielding layer;

fig. 10 is a schematic view of another structure of the package assembly of fig. 2 with an electromagnetic shielding layer;

fig. 11 is a schematic structural view of another package assembly provided in the embodiments of the present application;

fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. For convenience of clear description of technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

To facilitate understanding of the package assembly provided in the embodiments of the present application, an application scenario of the package assembly is first described below, where the package assembly can isolate a packaged device from the outside, and avoid corrosion of the packaged device by impurities in the air, and the packaged device may be: the packaging component can be a device such as a structured light sensor, an ambient light sensor or a camera. The method is applied to electronic equipment, such as mobile phones, tablet computers, digital cameras, wearable equipment, automobile electronics and other common electronic equipment. In use, the optical device, the electric device, the sensor, and the like in the package member generate electromagnetic waves, which act on other electronic components to generate electromagnetic interference, and in order to suppress the electromagnetic interference in the package member, it is necessary to provide the package member with an electromagnetic shielding structure.

The package assembly provided by the embodiment of the present application is described below with reference to the accompanying drawings. Fig. 1 is a schematic structural diagram of a package assembly according to an embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of another package assembly provided in the present application. Fig. 3 is a top view of the cover plate of fig. 2. FIG. 4 is a cross-sectional view of the cover plate of FIG. 2; fig. 5 is a top view of the package assembly of fig. 2. Fig. 11 is a schematic structural diagram of another package assembly according to an embodiment of the present disclosure. As shown in fig. 1, 2, 3, 4 and 11, the package assembly includes: a substrate 22, packaged devices (20, 21), a support 23 and a cover plate 24, the substrate 22 comprising a first surface and a second surface opposite to each other and a side connecting the first surface and the second surface, the packaged devices (20, 21) being located on the first surface of the substrate 22; a support 23 located on the first surface of the substrate 22 and surrounding the packaged device (20, 21); the first surface of the substrate 22, the cover plate 24 and the support 23 form an enclosed space in which the packaged device (20, 21) is accommodated.

Wherein a ground pad is disposed on the second surface of the substrate 22, and the cover plate 24 includes: a first region. To avoid electromagnetic interference, an electromagnetic shielding layer may be disposed on the surface of the support 23 contacting the outside, on the side of the substrate 22, and in the first region of the cover plate 24, and the electromagnetic shielding layer may be made conductive with the ground pad of the substrate 22, so that the packaged device (20, 21) is located in the shielding region formed by the electromagnetic shielding layer and the ground pad on the substrate 22. The area of the first region 241 of the cover plate 24 is smaller than or equal to the area of the cover plate 24, which is to take the characteristics of the packaged device into consideration, and it is often necessary to provide air holes, light-transmitting regions, etc. on the cover plate 24, and it is not necessary to provide electromagnetic shielding layers on the air holes, light-transmitting regions, etc., or to provide special electromagnetic shielding layers.

The cover plate 24 includes at least a first surface and a second surface that are disposed opposite to each other, and when the electromagnetic shielding layer is disposed in the first area of the cover plate 24, the electromagnetic shielding layer may be disposed only in the first area of the first surface of the cover plate 24, may be disposed only in the first area of the second surface of the cover plate 24, or may be disposed in both the first area of the first surface and the first area of the second surface of the cover plate 24. Fig. 2 shows that the electromagnetic shielding layer is provided only in a first area of the first surface of the cover plate 24.

When the electromagnetic shielding layer is arranged on the surface of the packaging component, the electromagnetic wave emitted by an external device can be shielded when reaching the electromagnetic shielding layer on the surface of the packaging component, so that the packaging component is shielded.

The encapsulation subassembly that this application embodiment provided through the first region at the apron to and set up the electromagnetic shield layer on support and base plate and the side of outside contact, and make the electromagnetic shield layer be connected with the ground connection pad electricity of base plate, make the electromagnetic shield layer form the electromagnetic shield region with the ground connection pad of base plate jointly, improved the shielding performance of encapsulation subassembly.

The number of the packaged devices may be 1 or multiple, and the number of the packaged devices is not limited in the embodiments of the present application. The packaged device may be, for example, an optical device, and may also be a pressure sensor, a humidity sensor, or the like.

If the packaged device is a pressure sensor, a humidity sensor, etc., the cover plate 24 may be made of metal, glass, etc. when it is specifically disposed, fig. 1 is a schematic structural diagram of a package assembly according to an embodiment of the present disclosure. As shown in fig. 1, the cover plate 24 is provided with a vent 240 to communicate with the outside. The areas of the cover plate 24 other than the vent holes 240 are, for example, the first areas. Electromagnetic shielding layers are arranged on the first area, the bracket and the side face of the substrate, which is in contact with the outside. The electromagnetic shielding layers provided in the first region of the cover plate 24 and outside the base plate 22 and the support 23 may be, for example: a transparent shielding film, a metallic shielding film or a shielding adhesive film, for example, the first region 241 of the cover plate 24 may be free of any treatment or covering the transparent shielding film.

The transparent shielding film may be made of indium tin oxide, for example, and the transparent shielding film can transmit light and has conductivity, and can shield electromagnetic interference.

The transparent shielding film can be made by adopting a magnetron vacuum sputtering process method, or a vacuum evaporation coating process method, a chemical vapor deposition process method, a radio frequency sputtering coating process method and the like. For example, the transparent shielding film can be obtained by sputtering an indium tin oxide conductive film coating on the cover plate and performing high-temperature annealing treatment by using a planar magnetron technology.

The metallic shielding film may be, for example, a multilayer composite structure, for example, a metallic shielding film including, for example: the substrate comprises an adhesion layer and a shielding metal layer, wherein the adhesion layer covers the surface of the support, which is in contact with the outside, the side face of the substrate and the surface of the first area, and the shielding metal layer is arranged on the adhesion layer. When the metal shielding film is specifically disposed, for example, an adhesion layer may be formed on the surface of the region to be shielded in the package assembly by evaporation, physical vapor deposition or sputtering, and then a shielding metal layer may be formed on the adhesion layer by evaporation, physical vapor deposition or sputtering.

The material of the adhesion layer may be, for example: titanium. The shielding metal layer can be made of various materials, such as: any one of copper, nickel, chromium, aluminum, silver, gold, iron and tin, wherein the copper has high conductivity, good shielding effect on electromagnetic interference, low cost and easy molding, so the copper can be selected as the main material of the shielding metal layer.

The metal shielding film further includes, for example: the oxidation preventing layer may be formed on the shield metal layer by, for example, vapor deposition, physical vapor deposition, sputtering, or the like. The oxidation-resistant layer may be made of, for example: stainless steel.

The thickness of the adhesion layer may be, for example, 0.05 to 0.5 μm, the thickness of the shield metal layer may be, for example, 3 to 15 μm, and the thickness of the oxidation preventing layer may be, for example, 0.05 to 2 μm. The thickness of electromagnetic shield layer is micron level, and its occupation space is negligible basically, has reduced the size of encapsulation subassembly occupation space.

The material of the masking film may be, for example: epoxy colloid doped with ferromagnetic particles, wherein the ferromagnetic particles can absorb electromagnetic waves. The epoxy colloid may be doped with other materials capable of absorbing electromagnetic waves, and specifically may be: ferrite, magnetic iron nano-materials, or graphene, graphite, carbon black, carbon fibers, carbon nanotubes, and the like. When the metal shielding film is specifically arranged, for example, a shielding adhesive film may be formed on the surface of the region to be shielded of the packaging component by spraying, so as to absorb or greatly reduce the energy of the electromagnetic wave projected by the packaged device and the external device, thereby reducing the interference of the electromagnetic wave.

The specific material of the electromagnetic shielding layer is not limited in the present application, and those skilled in the art can select a suitable material as the electromagnetic shielding layer according to the needs, which all belong to the protection scope of the present application.

The electromagnetic shield layer that this application embodiment provided can direct coverage on the surface of encapsulation subassembly, and thickness only is the micron level, and occupation space is little, is favorable to the miniaturization of encapsulation subassembly.

If the packaged device is an optical device, when the package assembly is specifically configured, the cover plate 24 may be made of a transparent material, such as glass or transparent resin, or may be made of other transparent materials, in consideration of the light transmission requirement of the optical device.

The cover plate 24 may be divided into a first area 241 and a second area 241 according to a Field of view (FOV) of the optical device on the cover plate, the optical device receiving or emitting optical signals through the second area 242, the first area being an area of the substrate other than the second area. The second region is, for example, greater than or equal to a region covered by a viewing angle range of the optical device on the cover plate.

When the number of the optical devices is 1, the second area includes an area covered by the viewing angle range of the 1 optical device on the cover plate 24, and the remaining area on the cover plate 24 is the first area. When the number of the optical devices is plural, the second region includes a region covered by the entire viewing angle range of the plurality of optical devices on the cover plate 24, and the remaining region on the cover plate 24 is the first region. Taking 2 optical devices as an example, as shown in fig. 1, the optical device includes: referring to fig. 1, the first optical device 20 and the second optical device 21, wherein the field angle of the first optical device 20 is β, the field angle of the optical device 21 is α, as shown in fig. 2, the second area 242 is equal to the area covered by the field angle range of the first optical device 20 and the second optical device 21 on the cover plate 24, and the other area on the cover plate 24 is the first area 241.

When the electromagnetic shielding structure of the package assembly is specifically disposed, the second region of the cover plate 24, the outer side surfaces of the substrate 22 and the bracket 23 may be covered with the electromagnetic shielding layer of the same material, or may be covered with the electromagnetic shielding layer of different materials, or the first region of the cover plate 24 may be covered with the transparent conductive film, or may not be processed at all.

Referring next to fig. 2, fig. 3, fig. 4, and fig. 5, in a specific embodiment of the present application, a transparent shielding film 1 covers a first region 241 of the first surface of the cover plate 24, and the first region 241 of the first surface of the cover plate 24, the substrate 22, and the side of the bracket 23 contacting with the outside are covered with the electromagnetic shielding layer 2, where the electromagnetic shielding layer 2 may be, for example, a metal shielding film or a conductive adhesive film. The materials and processing techniques of the transparent shielding film 1 and the electromagnetic shielding layer 2 are referred to above, and will not be described below. The transparent shielding film 1 arranged in the first area of the cover plate 24, the metal shielding film 2 arranged in the second area of the cover plate 24, and the metal shielding films 2 arranged outside the substrate and the bracket are electrically connected with the grounding pad of the substrate, so that an electromagnetic shielding area is formed together, and the full shielding of the packaging assembly is realized. The transparent shielding film 1 has a high cost, and the cost can be reduced by covering the electromagnetic shielding layer 2 on the second region 242.

Alternatively, for convenience of processing, in one implementation of the present application, the transparent shielding film 1 may be further covered on both the first region and the second region of the cover plate 24. Fig. 6 is a cross-sectional view of another cover plate. As shown in fig. 6, the first region 241 and the second region 242 of the first surface of the cover plate 24 are covered with the transparent shielding film 1. Wherein, transparent shielding film 1 and the electromagnetic shielding layer 2 that sets up in the base plate on apron 24 and support outside all conduct with the ground connection pad of base plate, have formed the electromagnetic shielding region jointly, have realized the full shielding of encapsulation subassembly from this.

Fig. 7 is a cross-sectional view of another cover plate. As shown in fig. 7, in order to save electromagnetic shielding material, the electromagnetic shielding layer 2 may be disposed only on the first region 241 of the cover plate 24, and the second region 242 of the first surface of the cover plate 24 is not processed. The electromagnetic shielding layer 2 may be, for example, a transparent conductive film, a metal shielding film, or a conductive adhesive film. The area of the shielding film can be saved while ensuring the light transmission of the optical device 21, and the miniaturization of the assembly is realized.

When the transparent shielding film or the metal shielding film is only disposed in the first region, a surface sacrificial layer technology may be used to process the shielding layer in the first region. For example, when the shielding layer is specifically disposed, the shielding film can be obtained by first covering the second region with a thin film, then spraying or depositing the desired shielding film on the thin film, and then etching away the thin film with a chemical etchant.

The encapsulation subassembly that this application embodiment provided through set up transparent shielding film on the apron, can satisfy optical device's printing opacity demand, has realized the electromagnetic shield of encapsulation subassembly simultaneously. And all shielding structures are formed by adopting semiconductor processing technologies such as spraying, sputtering, deposition and the like, so that the processing precision is higher.

In the package assemblies of fig. 1 and 2, only the structures of the lid portions are different, and the structures of the rest portions are completely the same, and only the structure of the rest portion of the package assembly of fig. 2 is described as an example below.

With continued reference to fig. 2, in particular to provide packaged devices, the first packaged device 20 and the second packaged device 21 are both provided on the substrate 22, wherein the support 23, the optical device 21 are provided on the first surface of the substrate 22. In addition, the substrate 22 is provided with a circuit layer for transmitting signals of the packaged device, and when the packaged device is connected with the circuit layer of the substrate 22, gold wires can be used for connection, and solder balls can also be used for connection. When the optical device 21 is connected to the substrate 22, gold wires are used for connection in both optical devices as shown in fig. 2. In addition, a substrate made of a different material such as silicon, ceramic, or an organic substrate may be used for the substrate 22.

When the support 23 is specifically provided, the support 23 may be provided on the first surface of the substrate 22 and fixedly connected to the substrate 22. The specific fixing method can be welding, bonding, snap-fit connection or connection by using a connecting piece (such as a bolt or a screw), and the bracket 23 can be fixed on the substrate by injection molding and integral molding or the bracket 23 can be formed on the substrate directly by using a molding process. The top view of fig. 5 is a top down view of the structure of the packaged device shown in fig. 2. As can be seen from fig. 2, the support 23 is a ring-shaped support 23 and is disposed around the packaged device when the support 23 is fixedly connected to the substrate 22. When the packaged device is fixed, as shown in fig. 2, the packaged device is located in a space surrounded by the support 23, so that the packaged device is protected by the support 23.

The package assembly further includes: an electrical device, in use, the packaged device in the packaging assembly may deliver an electrical signal to the electrical device, and the electrical device is for sending the electrical signal to a processor of the electronic device. Also shown in fig. 2 and 5 are electrical devices provided by embodiments of the present application, which are embedded in the substrate 22 or the support 23, where the electrical device includes an electrically active device 31, the electrically active device 31 may be a bare chip (unpackaged chip), and where the electrically active device 31 is disposed, the electrically active device 31 may be disposed in the substrate 22 or the support 23. As shown in fig. 2, an electrically active device 31 is embedded within the substrate 22. It should be noted that, when the support 23 or the substrate 22 is selected to embed the electrically active device 31, the height of the electrically active device 31 shown in fig. 2 may be smaller than the thickness of the substrate 22, depending on the size of the particular electrically active device 31. The electrical components disposed in the substrate and support are not visible from a top view, and are shown in top view in fig. 5 of the packaging assembly to facilitate viewing of the particular arrangement of the electrical components.

Also shown in fig. 2 is a structure employing an electrically passive device 32, the electrically passive device 32 shown in fig. 2 having a height greater than the thickness of the substrate 22 and less than the thickness of the support 23, and the electrically passive device 32 being disposed within the support 23 in a manner similar to the electrically active device 31. Of course, fig. 2 only shows an embodiment of a specific electrically passive device, and when the electrically passive device 32 is embedded in the support 23, the electrically passive device 32 may be connected to the electrically active device 31 and the optical device 21 through the conductive material embedded in the support 23 and/or the metalized via provided on the substrate 22. That is, when the electrical passive device 32 is connected to the electrical active device 31 and the optical device 21, the electrical passive device may be connected by using a conductive material or a metalized via, or may be connected by using a combination of a portion of the conductive material and a portion of the metalized via, and the specific connection mode may be set according to actual conditions.

Specifically, when the cover plate 24 is disposed, as shown in fig. 2, a ring of L-shaped grooves for supporting the cover plate 24 is disposed on one side of the bracket close to the cover plate, the L-shaped grooves match with the shape of the edge of the cover plate, the opening of the L-shaped grooves faces the enclosed space formed by the first surface of the substrate 22, the cover plate 24 and the bracket 23, the cover plate 24 covers the L-shaped grooves of the bracket 23, and the concave surface of the L-shaped grooves of the bracket includes a "-" surface 231 parallel to the first surface of the substrate 22 and a "-" surface 232 perpendicular to the first surface of the substrate 22. Wherein the first surface of the cover plate 24 contacts the "-" surface 231 of the L-shaped groove of the support 23, and encloses a sealed space together with the substrate 22 and the support 23 to seal the optical device 21. Therefore, the influence of external dust on the light device 21 on the photosensitive effect of the light device 21 can be avoided.

When specifically setting up the electromagnetic shield structure of encapsulation subassembly, for the shielding effect that improves the encapsulation subassembly, can also all set up this electromagnetic shield layer on "-" face 231 and "|" face 232 of the L-shaped groove of support 23, and set up the electromagnetic shield layer on "-" face 231 and "|" face 232 of the L-shaped groove of support 23 and switch on with the ground pad of base plate, further improved shielding performance.

In order to further improve the shielding performance of the package assembly, the conductive adhesive 3 may be disposed at a contact position between the first surface of the cover plate 24 and the "-" surface 231 of the L-shaped groove of the bracket 23, so that the gap between the cover plate 24 and the bracket 23 is sealed, and the electromagnetic shielding layer disposed on the first surface of the cover plate is electrically connected to the electromagnetic shielding layer 2 disposed on the bracket 23 through the conductive adhesive 3, thereby achieving grounding and further improving the shielding performance.

In another embodiment of the present application, the electromagnetic shielding layer may be only provided on the second surface of the cover plate 24, and in this case, the electrical connection structure between the electromagnetic shielding layer provided on the second surface of the cover plate and the electromagnetic shielding layer 2 provided on the L-shaped groove surface of the bracket should be adjusted.

Fig. 8 is a schematic structural view of another electromagnetic shielding layer of the package assembly of fig. 2. As shown in fig. 8, an electromagnetic shielding layer 2 is disposed on the second surface of the cover plate 24, a conductive adhesive member 3 is disposed at a contact position between the first surface of the cover plate 24 and the "-" surface 231 of the L-shaped slot of the bracket, a metalized via hole 4 is disposed on the cover plate 24, one end of the metalized via hole 4 is electrically connected to the electromagnetic shielding layer on the second surface of the cover plate, and the other end of the metalized via hole 4 is electrically connected to the conductive adhesive member 3 disposed on the "-" surface 231 of the L-shaped slot of the bracket 23, so that the electromagnetic shielding layer disposed on the first surface of the cover plate 24 is electrically connected to the electromagnetic shielding layer 2 disposed on the bracket through the metalized via hole 4 and the conductive adhesive member 3 in sequence, thereby. When the metalized through hole is specifically arranged, the through hole can be machined in the glass cover plate in the modes of laser machining or sand blasting and the like, and then the through hole is filled with conductive metal in a hole filling electroplating mode to form the metalized through hole.

Fig. 9 is a schematic view of another structure of the package assembly of fig. 2 with an electromagnetic shielding layer. As shown in fig. 9, an electromagnetic shielding layer 2 is disposed on the second surface of the cover plate 24, the cover plate 24 further includes a side surface connecting the first surface of the cover plate and the second surface of the cover plate, an electromagnetic shielding layer 2 is also disposed on the side surface of the cover plate 24, and the side surface contacts with the i surface 232 of the L-shaped groove of the support, and a conductive adhesive member 3 is disposed between the side surface of the cover plate 24 and the i surface 232 of the L-shaped groove of the support, so that the electromagnetic shielding layer disposed on the first surface of the cover plate 24 is electrically connected with the electromagnetic shielding layer 2 disposed on the support sequentially through the electromagnetic shielding layer disposed on the side surface of the cover plate 24 and the conductive adhesive member 3, thereby achieving grounding and further improving shielding performance. Specifically, when the conductive adhesive member is disposed, the electromagnetic shielding layer may be formed on the first surface and the side surface of the cover plate 24 by the same process, and then the cover plate 24 is fastened to the bracket 23, and the conductive adhesive member 3 is disposed between the side surface of the cover plate 24 and the bracket 23.

The conductive adhesive may be made of, for example: conductive adhesive, soldering tin, nano silver and the like. The conductive paste may be composed of, for example, a resin matrix, a conductive filler, and the like. The resin matrix may be made of, for example: epoxy resins, acrylate resins, polyvinyl chloride, and the like. The conductive filler may be, for example, powders of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite and some conductive compounds. When the cover plate is used, the conductive adhesive can be respectively coated on the contact surfaces of the first surface of the cover plate and/or the second surface of the cover plate, which are contacted with the bracket, the cover plate is covered on the bracket, and the cover plate and the bracket can be sealed and bonded together after the conductive adhesive is cured. Simultaneously, electrically conductive filler connects into the chain each other after the conductive adhesive solidification is dried and appears electric conductivity, can be in the same place shielding structure on the first surface of apron and the shielding layer on the concave surface in support L shape groove, and then makes the shielding layer on the shielding structure on the first surface of apron and the support and the ground connection pad of base plate switch on, has realized the full shielding of encapsulation subassembly.

When the soldering tin is used as the conductive bonding layer, the soldering tin can be melted firstly, so that the soldering tin flows to a position to be welded between the cover plate and the bracket, and the cover plate and the bracket are electrically connected together.

The bonding method of the conductive adhesive layer made of nano silver material can refer to the bonding of the conductive adhesive layer made of solder.

Fig. 10 is a schematic view of another structure of the package assembly of fig. 2 with an electromagnetic shielding layer. As shown in fig. 10, for example, the inner side surface of the support 23 for enclosing the enclosed space may be covered with an electromagnetic shielding layer, so as to avoid mutual interference between the packaged devices disposed in the support and the enclosed space in the horizontal direction, and to some extent, avoid electromagnetic interference of the packaged devices disposed in the substrate with the packaged devices disposed on the substrate, and improve the shielding performance of the packaging assembly.

It should be understood that the bracket 23, the cover plate 24 and the base plate 22 cooperate to form a closed space for accommodating the optical device 21, which is a specific structure shown in fig. 1, in the embodiment of the present application, the optical device 21 may be sealed in other manners to improve the working environment of the optical device 21 and prevent dust from contaminating the optical device 21, but the package assembly is provided with the electromagnetic shielding structure in any sealing manner.

As described above, only the first surface and the second surface of the cover plate 24 are taken as an example, and it is needless to say that the electromagnetic shielding layers may be simultaneously disposed on the first surface and the second surface of the cover plate, and the electromagnetic shielding layers disposed on the first surface and the second surface of the cover plate may be electrically connected to the electromagnetic shielding layer on the concave surface of the L-shaped groove of the bracket through the conductive adhesive member, so that the electromagnetic shielding layers disposed on the first surface and the second surface of the cover plate are electrically connected to the ground pad of the substrate, thereby improving the shielding performance of the package assembly. The embodiment of the present application does not specifically describe the manner of providing the electromagnetic shielding layer on the first surface and the second surface of the cover plate 24 at the same time, and these embodiments are all within the scope of the present application.

The encapsulation subassembly that this application embodiment provided, it is in the same place apron and leg joint through electrically conductive bonding piece for the shielding structure of apron and the shielding structure of support are connected, and switch on with the ground pad of base plate, have realized the full shielding of encapsulation subassembly.

In addition, fig. 11 also provides a packaging assembly, as shown in fig. 11, the cover plate 24 is directly covered on the bracket 23, and the cover plate 24 is flush with the outer edge of the bracket 23, and the rest structure is the same as that of fig. 2. To avoid electromagnetic interference, an electromagnetic shielding layer may be disposed on the surface of the support 23 contacting the outside, the side of the substrate 22, and the first region of the first surface of the cover plate 24, and the electromagnetic shielding layer may be made conductive with the ground pad of the substrate 22, so that the packaged device (20, 21) is located in the shielding region formed by the electromagnetic shielding layer and the ground pad on the substrate 22.

In addition, the bracket 23 includes a first surface contacting with the cover plate 24, and an electromagnetic shielding layer 2 may be further disposed on the first surface of the bracket 23, and a conductive adhesive member may be disposed between the first surface of the bracket 23 and the cover plate 24, so that the electromagnetic shielding layer disposed on the first surface of the cover plate 24 is electrically connected to the electromagnetic shielding layer 2 disposed on the first surface of the bracket through the conductive adhesive member 3, thereby achieving grounding and further improving shielding performance.

Fig. 12 is a schematic structural diagram of the electronic device provided in the embodiment of the present application, and as shown in fig. 12, the electronic device includes a PCB 10 and the package assembly described above, and the ground pad of the package assembly is soldered on the PCB 10. The PCB board 10 may be a common printed circuit board.

When the packaging assembly is specifically arranged, the packaging assembly is located on one surface of the PCB 10 and fixedly connected with the PCB 10, the placing direction of the packaging assembly shown in fig. 12 is taken as a reference direction, and when the packaging assembly is arranged, the packaging assembly is located on the first surface of the PCB 10 and fixedly connected with the PCB 10 through a solder ball or a solder pad, it should be understood that the welding between the packaging assembly shown in fig. 10 and the PCB 10 is only a specific implementation manner, and other connection manners can be adopted for connection in the embodiment of the present application, which is not described herein again.

Of course, when the mobile electronic device is provided, the PCB 10 may be provided with other separate electrical devices, for example, which are provided on the first surface of the PCB 10, and when the mobile electronic device is specifically provided, the electrical devices may be connected to the electrically active devices and the optical devices in the packaging assembly, respectively.

Although the present application has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the application. Accordingly, the specification and figures are merely exemplary of the present application as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the present application. It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A package assembly, comprising: a substrate, a packaged device, a bracket and a cover plate,

the substrate comprises a first surface and a second surface which are opposite, and a side face connecting the first surface and the second surface, the packaged device is positioned on the first surface of the substrate, and the bracket is positioned on the first surface of the substrate and surrounds the packaged device;

the first surface of the substrate, the cover plate and the bracket form an enclosed space, and the packaged device is accommodated in the enclosed space;

wherein, be provided with the ground pad on the second surface of base plate, the apron includes: a first region;

electromagnetic shielding layers are arranged on the surface of the support, which is in contact with the outside, the side surface of the substrate and the first area, and the electromagnetic shielding layers in the first area are electrically connected with the grounding bonding pad through the electromagnetic shielding layers on the support and the substrate;

the electromagnetic shielding layer is a transparent shielding film, a metal shielding film or a shielding adhesive film;

wherein the packaged device comprises an optical device, the cover plate further comprises a second region for transmitting light, the second region is a region covered by a viewing angle range of the optical device on the cover plate, and the first region is a region outside the second region on the cover plate

The bracket is used for enclosing the inner side surface of the closed space and is covered with the electromagnetic shielding layer.

2. The package assembly of claim 1, wherein the cover plate is a transparent plate and the second region is covered with the transparent shielding film.

3. The package assembly of any of claims 1-2, wherein the transparent shielding film is made of: indium tin oxide.

4. The package assembly of claim 1, wherein the packaged device comprises a pressure sensor and a humidity sensor, the cover plate is provided with air holes, and the first area is an area of the cover plate except for the air holes.

5. The package assembly of claim 4, wherein the cover plate is made of metal or glass.

6. The package assembly of any of claims 1, 2, 4, 5, wherein the metal shielding film comprises: an adhesive layer covering a surface of the bracket contacting with the outside, a side surface of the substrate, and a surface of the first region, and a shielding metal layer disposed on the adhesive layer.

7. The package assembly of claim 3, wherein the metal shielding film comprises: an adhesive layer covering a surface of the bracket contacting with the outside, a side surface of the substrate, and a surface of the first region, and a shielding metal layer disposed on the adhesive layer.

8. The package assembly of claim 6, wherein the adhesion layer is made of: titanium, the shielding metal layer is made of: copper.

9. The package assembly of claim 7, wherein the adhesion layer is made of: titanium, the shielding metal layer is made of: copper.

10. The package assembly of claim 6, wherein the electromagnetic shield layer further comprises: an oxidation prevention layer disposed on the shielding metal layer.

11. The package assembly of any of claims 7-9, wherein the electromagnetic shield layer further comprises: an oxidation prevention layer disposed on the shielding metal layer.

12. The package assembly of claim 10, wherein the oxidation preventing layer is made of: stainless steel.

13. The package assembly of claim 11, wherein the oxidation preventing layer is made of: stainless steel.

14. The package of any of claims 1, 2, 4, 5, 7-10, 12, 13, wherein the shielding adhesive film is an epoxy colloid doped with ferromagnetic particles.

15. The package assembly of claim 3, wherein the shielding adhesive film is an epoxy colloid doped with ferromagnetic particles.

16. The package assembly of claim 6, wherein the shielding adhesive film is an epoxy colloid doped with ferromagnetic particles.

17. The package assembly of claim 11, wherein the shielding adhesive film is an epoxy colloid doped with ferromagnetic particles.

18. The package assembly of any one of claims 1, 2, 4, 5, 7-10, 12, 13, 15-17, wherein an L-shaped groove for supporting the cover plate is disposed on a side of the bracket close to the cover plate, the cover plate covers the L-shaped groove of the bracket, and a concave surface of the L-shaped groove of the bracket is covered with the electromagnetic shielding layer.

19. The packaging assembly of claim 3, wherein an L-shaped groove for supporting the cover plate is formed on one side of the bracket close to the cover plate, the cover plate covers the L-shaped groove of the bracket, and the electromagnetic shielding layer covers the concave surface of the L-shaped groove of the bracket.

20. The packaging assembly of claim 6, wherein an L-shaped groove for supporting the cover plate is formed on one side of the bracket close to the cover plate, the cover plate covers the L-shaped groove of the bracket, and the electromagnetic shielding layer covers the concave surface of the L-shaped groove of the bracket.

21. The packaging assembly of claim 11, wherein an L-shaped groove for supporting the cover plate is disposed on a side of the bracket close to the cover plate, the cover plate covers the L-shaped groove of the bracket, and the electromagnetic shielding layer covers a concave surface of the L-shaped groove of the bracket.

22. The package assembly of claim 14, wherein an L-shaped groove for supporting the cover plate is disposed on a side of the bracket close to the cover plate, the cover plate covers the L-shaped groove of the bracket, and the electromagnetic shielding layer covers a concave surface of the L-shaped groove of the bracket.

23. The package of claim 18, wherein the cover plate is bonded to the recessed surface of the L-shaped slot of the bracket by a conductive bond.

24. The package of any of claims 19-22, wherein the cover plate is bonded to the recessed surface of the L-shaped slot of the bracket by a conductive bond.

25. The package assembly of any of claims 1, 2, 4, 5, 7-10, 12, 13, 15-17, 19-23, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

26. The package assembly of claim 3, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

27. The package assembly of claim 6, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

28. The package assembly of claim 11, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

29. The package assembly of claim 14, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

30. The package assembly of claim 18, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

31. The package assembly of claim 24, wherein the packaged device further comprises: an electrical device located in the support or the substrate.

32. An electronic device comprising a PCB board and the package assembly of any of claims 1-31, wherein the ground pads of the package assembly are soldered to the PCB board.