CN109890188A - Package assembling and electronic equipment - Google Patents
Package assembling and electronic equipment Download PDFInfo
- Publication number
- CN109890188A CN109890188A CN201910118194.8A CN201910118194A CN109890188A CN 109890188 A CN109890188 A CN 109890188A CN 201910118194 A CN201910118194 A CN 201910118194A CN 109890188 A CN109890188 A CN 109890188A
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- China
- Prior art keywords
- cover board
- bracket
- substrate
- package assembling
- electro
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Abstract
The embodiment of the present application provides a kind of package assembling and electronic equipment, the package assembling includes: substrate, packed device, bracket and cover board, the substrate includes opposite first surface and second surface, and the side of the connection first surface and the second surface, the packed device is located at the first surface of the substrate, and the bracket is located at the first surface of the substrate and around the packed device；The first surface of the substrate, the cover board and the bracket form enclosure space, and the packed device is contained in the enclosure space；Wherein, ground pad is provided on the second surface of the substrate, the cover board includes: first area；The surface of the bracket and external contact, the side of the substrate and the first area are equipped with electro-magnetic screen layer, and the electro-magnetic screen layer of the first area is electrically connected by the electro-magnetic screen layer on the bracket and the substrate with the ground pad.
Description
Technical field
This application involves field of photoelectric technology more particularly to a kind of package assemblings and electronic equipment.
Background technique
Electromangnetic spectrum refers to that the electromagnetic armouring structure made of conductive or permeability magnetic material limits electromagnetic interference energy
In a certain range, to control the induction or radiation of electric field, magnetic field and electromagnetic wave by a region to another region.Tool
For body, exactly electronic component or the isolation of the interference source of whole system are got up by electromagnetic armouring structure, prevented by the external world
The influence of electromagnetic field or interference electromagnetic field are outwardly spread.
Currently, package assembling in the electronic equipments such as mobile phone using more more and more universal, it is contemplated that some packed devices
Light transmission, ventilative demand, need that transparent area, air hole etc. are arranged on package assembling.However, these packed devices are transmitting
When electric signal, can external devices be generated with interference or by the interference of external devices, therefore, it is necessary to electricity is arranged for package assembling
Magnet shielding structure.
Summary of the invention
The embodiment of the present application provides a kind of package assembling and electronic equipment, to improve the electromagnetic wave shielding of package assembling
Can, avoid electromagnetic interference.
In order to achieve the above objectives, embodiments herein adopts the following technical scheme that
In a first aspect, providing a kind of package assembling, which includes: substrate, packed device, bracket and lid
Plate,
The substrate includes opposite first surface and second surface, and connects the first surface and second table
The side in face, the packed device are located at the first surface of the substrate, and the bracket is located at the first surface of the substrate
And around the packed device, the first surface of the substrate, the cover board and the bracket form enclosure space, the quilt
Packaging is contained in the enclosure space, wherein ground pad, the cover board packet are provided on the second surface of the substrate
Include: the surface of first area, the bracket and external contact, the side of the substrate and the first area are equipped with electricity
Magnetic masking layer, and the electro-magnetic screen layer of the first area by electro-magnetic screen layer on the bracket and the substrate with it is described
Ground pad electrical connection.The ground pad of electro-magnetic screen layer and substrate together forms electromagnetic shield regions as a result, is packaged device
Part is isolated in the electromagnetic shield regions, is avoided and is generated electromagnetic interference between packed device and external magnetic field, improves
The shielding properties of package assembling.
In optional implementation, the electro-magnetic screen layer be conduction, the Transparent shielding film of magnetic conduction, metallic shield film or
Shield glue film.Thus, it is possible to which electro-magnetic screen layer to be directly covered on to the surface of package assembling, thickness is only micron level, is occupied
Space is small, is conducive to the miniaturization of package assembling.
In optional implementation, the packed device includes optical device, and the cover board includes for light transmission
Two regions, the region that the second area is covered by angular field of view of the optical device on the cover board, firstth area
Domain is the region on the cover board except second area.Thus, it is possible to which according to whether light transmission is to first area and the secondth area
Domain carries out different shielding processings, so that package assembling had not only been able to satisfy the light transmission demand of the optical device, but also is able to achieve electromagnetic screen
It covers.
In optional implementation, the cover board is transparent panel, and the second area is covered with the Transparent shielding film.
Second area covering Transparent shielding film realizes while meeting optical device light transmission demand to the full frame of package assembling as a result,
It covers.
In optional implementation, the material of the Transparent shielding film are as follows: tin indium oxide.Due to tin indium oxide material
Transparent shielding film can either light transmission, it is also conductive, therefore can light transmission, additionally it is possible to shield electromagnetic interference.
In optional implementation, the packed device includes pressure sensor, humidity sensor, on the cover board
Equipped with the air hole being connected to outside, the first area is the region on the cover board except the air hole.As a result, saturating
Electro-magnetic screen layer can not be covered at stomata, reduced costs.
In optional implementation, the material of the cover board is metal, glass.Herein with no restrictions to cover board material,
As long as the intensity requirement of package assembling can be reached, the packed device being arranged in package assembling can protect.
In optional implementation, the metallic shield film includes: adhesion layer and shielding metal leve, and the adhesion layer covers
It is placed on the surface on the surface of the bracket and external contact, the side of the substrate and the first area, the shielding
Metal layer is arranged on the adhesion layer.Shielding metal leve can be used for being electromagnetically shielded as a result, and adhesion layer can be by shielding metal leve
It is bonded on the surface on the surface of bracket and external contact, the side of the substrate and the first area, this composite junction
Structure improves the fastness of electro-magnetic screen layer bonding.
In optional implementation, the material of the adhesion layer are as follows: titanium, the material of the shielding metal leve are as follows: copper.This
Embodiment to the specific material of the adhesion layer and shielding metal leve with no restriction.
In optional implementation, the electro-magnetic screen layer further include: antioxidation coating, the antioxidation coating are arranged in institute
It states in shielding metal leve.Antioxidation coating can prevent the oxidation of shielding metal leve as a result, improve shielding properties.
In optional implementation, the material of the antioxidation coating are as follows: stainless steel.The present embodiment is to the antioxidation coating
Specific material is with no restriction.
In optional implementation, the shielding glue film is the epoxy colloid doped with ferromagnetic particle.It can absorb as a result,
Or substantially weaken the energy of the electromagnetic wave of packed device and external devices projection, to reduce the interference of electromagnetic wave.
In optional implementation, the bracket is used to support the L of the cover board close to the setting of the side of the cover board
Shape slot, the cover plate lid are closed in the L-shaped groove of the bracket, and the electromagnetic screen is covered on the concave surface of the L-shaped groove of the bracket
Cover layer.The electro-magnetic screen layer being arranged on the concave surface of the L-shaped groove of bracket as a result, is by being arranged on the face of bracket and external contact
Electro-magnetic screen layer be connected with the ground pad of substrate, further improve shielding properties.
In optional implementation, the cover board is Nian Jie with the concave surface of the L-shaped groove of the bracket by conductive adhesive part.
As a result, while gap of the conductive adhesive part between seal cover board and bracket, so that the electromagnetism of cover board first surface is arranged in
Shielded layer is electrically connected by conductive adhesive part with the electro-magnetic screen layer being arranged on bracket, is realized ground connection, is further improved
Shielding properties.
In optional implementation, the packed device further include: electrical part, the electrical part are located in the branch
In frame or the substrate.As a result, so as to reduce the area of electrical part occupancy, and then reduce the volume of entire package assembling.
In optional implementation, the bracket is covered with the electricity on the medial surface for setting the enclosure space for enclosing
Magnetic masking layer.The phase being arranged between the packed device in bracket and in enclosure space in the horizontal direction is avoided as a result,
Mutually interference, also avoids the packed device being arranged in substrate to the packed device being disposed on the substrate to a certain extent
Electromagnetic interference improves the shielding properties of package assembling.
Second aspect, the embodiment of the present application provide a kind of electronic equipment, and the electronic equipment includes pcb board and institute as above
The package assembling stated, the ground pad of the package assembling are welded on the pcb board.The electronic equipment has as above as a result,
The package assembling improves the electromagnetic shielding performance of electromagnetic equipment.
These aspects or other aspects of the application can more straightforward in the following description.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of package assembling provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of another package assembling provided by the embodiments of the present application；
Fig. 3 is the top view of Fig. 2 cover plate；
Fig. 4 is the cross-sectional view of Fig. 2 cover plate；
Fig. 5 is the top view of package assembling in Fig. 2；
Fig. 6 is the cross-sectional view of another cover board；
Fig. 7 is the sectional view of another cover board；
Fig. 8 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2；
Fig. 9 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2；
Figure 10 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2；
Figure 11 is the structural schematic diagram of another package assembling provided by the embodiments of the present application；
Figure 12 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application is described.Its
In, for the ease of clearly describing the technical solution of the embodiment of the present application, in embodiments herein, use " first ", " the
The printed words such as two " distinguish function and the essentially identical identical entry of effect or similar item.It will be appreciated by those skilled in the art that
The printed words such as " first ", " second " are not defined quantity and execution order, and the printed words such as " first ", " second " are not yet
It limits certain different.
In order to facilitate understanding package assembling provided by the embodiments of the present application, illustratively the package assembling is answered first below
With scene, which can be isolated from the outside world packed device, avoid the impurity in air to packed device
Corrosion, which may is that the optical device that can receive or emit optical signal, electrical part, and for detecting
Pressure sensor and humidity sensor of humidity, the air pressure of ambient enviroment etc. etc., the package assembling can for structured light sensor,
The devices such as ambient light sensor or camera.Applied on electronic equipment, such as mobile phone, tablet computer, digital camera, wearable
The common electronic equipment such as equipment, automotive electronics.In use, the optical device, electrical part, sensor etc. in package assembling generate electricity
Magnetic wave, electromagnetic wave can be acted on other electronic components, generate electromagnetic interference phenomenon, in order to inhibit the electromagnetism in package assembling dry
It disturbs, needs that electromagnetic armouring structure is arranged for package assembling.
Package assembling provided by the embodiments of the present application is illustrated with reference to the accompanying drawing.Fig. 1 mentions for the embodiment of the present application
A kind of structural schematic diagram of the package assembling supplied.Fig. 2 is the structural representation of another package assembling provided by the embodiments of the present application
Figure.Fig. 3 is the top view of Fig. 2 cover plate.Fig. 4 is the cross-sectional view of Fig. 2 cover plate；Fig. 5 is the top view of package assembling in Fig. 2.
Figure 11 is the structural schematic diagram of another package assembling provided by the embodiments of the present application.As shown in Figure 1, Figure 2, Fig. 3, Fig. 4, Tu11Suo
Show, which includes: substrate 22, packed device (20,21), bracket 23 and cover board 24, and substrate 22 includes opposite the
One surface and second surface, and the side of connection first surface and second surface, packed device (20,21) are located at substrate
22 first surface；Bracket 23 is located at the first surface of substrate 22 and around packed device (20,21)；The first of substrate 22
Surface, cover board 24 and bracket 23 form enclosure space, which is contained in the enclosure space.
Wherein, ground pad is provided on the second surface of substrate 22, cover board 24 includes: first area.To avoid electromagnetism
Electromagnetism can be arranged on the surface of bracket 23 and external contact, the side of substrate 22, and in the first area of cover board 24 in interference
Shielded layer, and the electro-magnetic screen layer and the ground pad of substrate 22 are connected, so that packed device (20,21) are in
In the shielding area that ground pad on the electro-magnetic screen layer and substrate 22 is formed.Wherein, the face of the first area 241 of cover board 24
Product is less than or equal to the area of cover board 24, this allows for the characteristic of packed device, generally requires to be arranged on cover board 24 saturating
Stomata, transparent area etc. can not install electro-magnetic screen layer in air hole, transparent area equipotential, or need to set special electricity
Magnetic masking layer.
Wherein, cover board 24 includes at least the first surface and second surface being oppositely arranged, and sets in the first area of cover board 24
When setting the electro-magnetic screen layer, the electro-magnetic screen layer only can be set in the first area of the first surface of cover board 24, it can also be only
The electro-magnetic screen layer is set in the first area of the second surface of cover board 24, or can also be in the first surface of cover board 24 and
The first area on two surfaces is respectively provided with the electro-magnetic screen layer.Shown in Figure 2 is only in the firstth area of the first surface of cover board 24
The electro-magnetic screen layer is arranged in domain.
When work, the electromagnetic wave that packed device generates radiates around, when electromagnetic wave encounters electro-magnetic screen layer, part
It is reflected back, part is then electromagnetically shielded by the grounding wire layer absorption, transfers electric field termination on the surface of electro-magnetic screen layer, and charge
Enter ground, likewise, the electromagnetic wave of external devices transmitting can also be shielded when reaching the electro-magnetic screen layer on package assembling surface,
It is achieved in the shielding to package assembling.
Package assembling provided by the embodiments of the present application, by the first area of cover board, and in bracket and substrate and outer
Electro-magnetic screen layer is set on the side of portion's contact, and electro-magnetic screen layer is electrically connected with the ground pad of substrate, so that electromagnetism
The ground pad of shielded layer and substrate together forms electromagnetic shield regions, improves the shielding properties of package assembling.
Wherein, the quantity for being packaged device can be 1, be also possible to multiple, and the embodiment of the present application is to packed device
Number without limitation.The packed device for example can be optical device, can also be pressure sensor, humidity sensor etc..
If the packed device is pressure sensor, humidity sensor etc., cover board 24, can be using gold in specific setting
The materials such as category, glass are made, and Fig. 1 is a kind of structural schematic diagram of package assembling provided by the embodiments of the present application.As shown in Figure 1,
Air hole 240 is provided on cover board 24 to be connected to outside.Region on cover board 24 except air hole 240 is for example firstth area
Domain.Electro-magnetic screen layer is provided on the side of the first area, bracket and substrate and external contact.It is arranged in the of cover board 24
One region, and the electro-magnetic screen layer of 23 lateral surface of substrate 22 and bracket is set and for example may is that Transparent shielding film, metal screen
Cover film or shielding glue film, the first area 241 of cover board 24 for example with no treatment or can cover the Transparent shielding film.
The Transparent shielding film for example can be tin indium oxide material etc., Transparent shielding film can either light transmission, also there is conduction
Property, electromagnetic interference can be shielded.
Wherein, which can for example use magnetron vacuum sputtering technology method or vacuum vapor plating, change
The processes such as vapor deposition, radio-frequency sputtering plated film are learned to be made.For example, plane magnetic control technology can be used, on the cover board
Tin indium oxide conductive film coating and through the high temperature anneal is sputtered, the Transparent shielding film can be obtained.
Metallic shield film for example can be multi-layer compound structure, for example, metallic shield film for example, adhesion layer and
Shielding metal leve, wherein adhesion layer is covered in the surface of bracket and external contact, the side of the substrate and described first
On the surface in region, shielding metal leve is arranged on adhesion layer.When the metallic shield film is specifically arranged, such as can first use
One layer of adhesion layer is formed on the surface in package assembling region to be shielded by way of vapor deposition, physical vapour deposition (PVD) or sputtering,
Then, one layer of shielding metal is formed on adhesion layer by modes such as vapor deposition, physical vapour deposition (PVD) or sputterings on the adhesion layer
Layer.
Wherein, the material of adhesion layer for example may is that titanium.Multiple material can be selected in the material of shielding metal leve, such as:
Any one of copper, nickel, chromium, aluminium, silver, gold, iron, tin, wherein the conductivity of copper is higher, to the shielding action of electromagnetic interference compared with
It is good, and cost is relatively low, it is easy to form, it is thereby possible to select main material of the copper as shielding metal leve.
Metallic shield film is for example further include: antioxidation coating, antioxidation coating for example can by vapor deposition, physical vapour deposition (PVD) or
The modes such as sputtering are formed in shielding metal leve.Wherein, the material of antioxidation coating for example can be with are as follows: stainless steel.
Adhesion layer thickness for example can between 0.05-0.5 μm, the thickness of shielding metal leve for example can 3-15 μm it
Between, antioxidation coating thickness for example can be between 0.05-2 μm.Electro-magnetic screen layer with a thickness of micron level, occupied space
Substantially it can be ignored, reduce the size of package assembling occupied space.
The material for shielding glue film for example can be with are as follows: doped with the epoxy colloid of ferromagnetic particle, wherein the ferromagnetic particle can be with
Electromagnetic wave absorption.Other materials for capableing of electromagnetic wave absorption can be for example adulterated in the epoxy colloid, specifically may is that iron oxygen
Body, magnetic ferrum nano material or graphene, graphite, carbon black, carbon fiber, carbon nanotube etc..The metallic shield film is specifically being set
When, such as one layer of shielding glue film can be formed on the surface in package assembling region to be shielded by the way of through spraying, from
And the energy of the electromagnetic wave of packed device and external devices projection can be absorbed or substantially weaken, to reduce the dry of electromagnetic wave
It disturbs.
With no restrictions to the specific material of electro-magnetic screen layer, those skilled in the art can select properly the application as needed
Material as electro-magnetic screen layer, these belong to the protection scope of the application.
Electro-magnetic screen layer provided by the embodiments of the present application, can directly overlay the surface of package assembling, and thickness is only micro-
Meter level is other, occupies little space, and is conducive to the miniaturization of package assembling.
If the packed device is optical device, when package assembling is specifically arranged, it is contemplated that the light transmission demand of optical device, cover board
24, in specific setting, can be made of transparent material, such as are prepared using the different material of glass, transparent resin,
Certainly it can also prepare to be formed using other transparent materials.
According to optical device the upper angular field of view (Field of Vision, abbreviation FOV) of the cover board can be by cover board 24
It is divided into first area 241 and second area 241, which receives via the second area 242 or emit optical signal, institute
Stating first area is the region on the substrate in addition to the second area.The second area is greater than or is equal to optical device
The region of angular field of view covering on the cover board.
When optical device is 1, which includes that the angular field of view of 1 optical device on cover board 24 is covered
Region, remaining region on cover board 24 are the first area.When optical device is multiple, which includes multiple smooth device
The region that whole angulars field of view of the part on cover board 24 are covered, remaining region on cover board 24 are the first area.With 2 light
For device, as shown in Figure 1, optical device includes: the first optical device 20 and the second optical device 21, with reference to Fig. 1, wherein the first light
The field angle of device 20 is β, and 21 field angle of optical device is α, as shown in Fig. 2, second area 242 is equal to the first optical device 20
The region covered with angular field of view of second optical device 21 on cover board 24, other regions on cover board 24 are first area
241。
It, can be in second area, the substrate 22 on cover board 24 in the electromagnetic armouring structure on specifically setting package assembling
And the electro-magnetic screen layer of 23 lateral surface of bracket covering same material, the electro-magnetic screen layer of unlike material can also be covered, and
Transparent conductive film can be covered in the first area on cover board 24, it can also be without any processing.
Referring next to Fig. 2, Fig. 3, Fig. 4, Fig. 5, in a kind of specific embodiment of the application, the first table of cover board 24
Transparent shielding film 1, first area 241, substrate 22 and the bracket of the first surface of cover board 24 are covered on the first area 241 in face
23 are then covered with the electro-magnetic screen layer 2 with the side of external contact, which for metallic shield film or can for example lead
Electric glue film.The material and processing technology of the Transparent shielding film 1 and the electro-magnetic screen layer 2 are with reference to above-mentioned, and it will not be described below.
Wherein, the Transparent shielding film 1 of 24 first area of cover board is set, the metallic shield film 2 of 24 second area of cover board is set, and
The metallic shield film 2 that substrate and stent outer is arranged in is electrically connected with the ground pad of substrate, together forms electromagnetic shielding
Region, it is thus achieved that the full-shield of package assembling.Wherein, 1 higher cost of Transparent shielding film covers on second area 242
Electro-magnetic screen layer 2 can reduce cost.
Alternatively, in order to easy to process, in a kind of implementation of the application, can also cover board 24 first area and
Second area covers Transparent shielding film 1.Fig. 6 is the cross-sectional view of another cover board.As shown in fig. 6, the first surface of cover board 24
First area 241 and second area 242 be all covered with the Transparent shielding film 1.Wherein, the Transparent shielding on cover board 24 is set
Film 1 and substrate is set and the electro-magnetic screen layer 2 of stent outer is connected with the ground pad of substrate, together forms electromagnetism
Shielding area, it is thus achieved that the full-shield of package assembling.
Fig. 7 is the cross-sectional view of another cover board.As shown in fig. 7, in order to save electromagnetic shielding material, it can also be only in cover board
The electro-magnetic screen layer 2 is arranged in 24 first area 241, and the second area 242 of the first surface of cover board 24 is then without any processing.
The electro-magnetic screen layer 2 for example can be transparent conductive film, metallic shield film or conductive adhesive film.Guaranteeing the same of 21 light transmission of optical device
When, the area of screened film can be saved, the miniaturization of component is realized.
Wherein, surface sacrificial layer can only be used when the Transparent shielding film or the metallic shield film is arranged in first area
Technology processes shielded layer in first area.For example, in specifically setting shielded layer, one first can be covered in second area
Layer film, the screened film needed for then spraying or deposit on the layer film, then corroded the layer film with chemical etchant
Fall, the screened film can be obtained.
Package assembling provided by the embodiments of the present application is both able to satisfy optical device by the way that Transparent shielding film is arranged on the cover board
Light transmission demand, while realizing the electromagnetic shielding of package assembling.Also, all shielding constructions be all made of including spraying, sputtering,
The forming of the semiconducter process such as deposition, machining accuracy are higher.
Only the structure of deck portion is had any different in package assembling in Fig. 1 and Fig. 2, the structure of rest part then complete phase
Together, it is only illustrated by taking the rest part structure of package assembling in Fig. 2 as an example below.
With continued reference to Fig. 2, in the packed device of specific setting, the first packed device 20 and the second packed device 21
It is respectively provided on substrate 22, wherein the first surface of substrate 22 has been arranged in bracket 23, optical device 21.In addition, on the substrate 22
Circuit layer is provided with to be used for transmission the signal of packed device, it, can when packed device is connect with the circuit layer of substrate 22
It to be attached using gold thread, can also be attached using soldered ball, no matter which kind of mode be used, it is only necessary to can be realized and be electrically connected
It connects.When optical device 21 is connect with substrate 22, in two optical devices as shown in Figure 2, it is all made of gold thread and is attached.
In addition, the substrate of such as silicon, ceramics, organic substrate unlike material can be used for the substrate 22.
In specifically setting bracket 23, bracket 23 can be arranged in the first surface of substrate 22, and fixed with substrate 22
Connection.Specific fixed form can be used welding, be bonded, is connected together or be connected using connector (such as bolt or screw)
It connects, which can be fixed on substrate again using being integrally formed or directly be formed on substrate using moulding technology
Bracket 23.If the top view of Fig. 5 is attached drawing when overlooking the structure of packed device shown in Fig. 2 from top to bottom.It can be with by Fig. 2
Find out, which is an annular bracket 23, and when bracket 23 is fixedly connected with substrate 22, around packed device
Setting.In fixed packed device, as shown in Figure 2, packed device is located in the space that bracket 23 surrounds, to pass through
Bracket 23 protects packed device.
Package assembling further include: electrical part, when in use, the packed device in package assembling can transmit electric signal
To electrical part, and electrical part is used to for electric signal being sent to the processor of electronic equipment.The application is also shown in Fig. 2 and Fig. 5
The electrical part that embodiment provides, it includes electrically active device in the electrical part which, which is embedded in substrate 22 or bracket 23,
When 31, which can be a bare chip (unencapsulated chip), when the electrically active device 31 is arranged, the electricity
Active device 31 can be set in substrate 22 or bracket 23.As shown in Figure 2, electrically active device 31 has been embedded in substrate 22
It is interior.It should be noted that when selecting bracket 23 or substrate 22 to bury electrically active device 31, it can be according to specific electrically active device
The size of part 31 is determined, and the height of electrically active device 31 shown in Fig. 2 is less than the thickness of substrate 22.It is arranged in substrate and bracket
In electrical part can not see in depression angle, the specific set-up mode of electrical part in order to facilitate observation of, in the vertical view of package assembling
Electrical part is still illustrated in figure Fig. 5.
The structure using electric passive device 32 is also shown in Fig. 2, the height of electricity passive device 32 shown in Fig. 2 is greater than
The thickness of substrate 22 and the thickness for being less than bracket 23, and the electricity passive device 32 is using similar with electrically active device 31
Mode in bracket 23 is set.Certainly, Fig. 2 illustrate only a kind of embodiment of specific electric passive device, will be electric
When passive device 32 is embedded in bracket 23, electric passive device 32 can by the conductive material that is embedded in bracket 23 and/or
The metallization VIA being arranged on substrate 22 is connect with electrically active device 31 and optical device 21.I.e. electric passive device 32 has with electricity
It when source device 31 and optical device 21 connect, can be attached using conductive material or metallization VIA, one can also be used
Partially electronically conductive material and the mode of a part of metallization VIA combination are attached, and specific connection type can be according to actual
Situation is configured.
When specific setting cover board 24, as shown in Fig. 2, bracket, which is provided with a circle close to the side of cover board, is used to support cover board 24
L-shaped groove, the L-shaped groove that the shape of the L-shaped groove and side edge thereof matches, the opening of the L-shaped groove is towards by the first of substrate 22
The enclosure space that surface, cover board 24 and bracket 23 are formed, the lid of cover board 24 close in the L-shaped groove of bracket 23, the L-shaped groove of the bracket
Concave surface includes the face " Shu " 232 in the "-" face 231 and first surface perpendicular to substrate 22 parallel with the first surface of substrate 22.
Wherein, the first surface of cover board 24 is contacted with the "-" face 231 of the L-shaped groove of bracket 23, and is enclosed together with substrate 22, bracket 23
The space sealed at one seals optical device 21.Thereby, it is possible to avoid extraneous dust from falling on optical device 21 to influence
The photosensitive effect of optical device 21.
It, can also be for the shield effectiveness for improving package assembling in the specifically electromagnetic armouring structure of setting package assembling
It is respectively provided with the electro-magnetic screen layer on the "-" face 231 and face " Shu " 232 of the L-shaped groove of bracket 23, and the L-shaped groove of bracket 23 is set
"-" face 231 and face " Shu " 232 on electro-magnetic screen layer be connected with the ground pad of substrate, further improve shielding properties.
It, can also be in the first surface of cover board 24 and the L of bracket 23 in order to further increase the shielding properties of package assembling
Conductive adhesive part 3 is arranged in the contact position in the "-" face 231 of shape slot, the gap between seal cover board 24 and bracket 23 it is same
When, so that the electro-magnetic screen layer that cover board first surface is arranged in passes through conductive adhesive part 3 and the electromagnetic screen being arranged on bracket 23
The electrical connection of layer 2 is covered, ground connection is realized, further improves shielding properties.
In another embodiment of the application, the electromagnetic shielding can also be only equipped on the second surface of cover board 24
Layer, at this point, the electro-magnetic screen layer of cover board second surface and the electricity for the electro-magnetic screen layer 2 being arranged on bracket L-shaped groove face is arranged in
Connection structure should be adjusted.
Fig. 8 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2.As shown in figure 8, cover board 24
Second surface be equipped with electro-magnetic screen layer 2, the contact position in the "-" face 231 of the first surface and bracket L-shaped groove of cover board 24
Conductive adhesive part 3 is set, is provided with metallization VIA 4 on cover board 24, the electricity of metallization VIA 4 one end and cover board second surface
Magnetic masking layer electrical connection, the other end are electrically connected with the conductive adhesive part 3 on the "-" face 231 for the L-shaped groove that bracket 23 is arranged in, from
And the electro-magnetic screen layer being arranged on 24 first surface of cover board is made to pass sequentially through metallization VIA 4 and conductive adhesive part 3 and set
The electro-magnetic screen layer 2 set on bracket is electrically connected, and is realized ground connection, is further improved shielding properties.The metal is specifically set
When changing via hole, via hole can be processed on glass cover-plate using modes such as laser processing or sandblastings, then pass through filling perforation electricity
Plating mode fills conductive metal in through-hole, forms metallization VIA.
Fig. 9 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2.As shown in figure 9, cover board 24
Second surface be equipped with electro-magnetic screen layer 2, cover board 24 further includes the first surface of connecting cover plate and the second surface of cover board
Side also is provided with electro-magnetic screen layer 2 on the side of cover board 24, and the side is contacted with face " Shu " 232 of the L-shaped groove of bracket, and covers
It is provided with conductive adhesive part 3 between face " Shu " 232 of the L-shaped groove of the side and bracket of plate 24, so that setting is in cover board 24 the
Electro-magnetic screen layer on one surface passes sequentially through the electro-magnetic screen layer being arranged on 24 side of cover board and conductive adhesive part 3 and setting
Electro-magnetic screen layer 2 on bracket is electrically connected, and is realized ground connection, is further improved shielding properties.It is viscous that the conduction is specifically set
When fitting, electro-magnetic screen layer can be formed on the first surface of cover board 24 and side using identical technique, then by cover board
24 are fastened on bracket 23, and conductive adhesive part 3 is arranged between the side of cover board 24 and bracket 23.
Wherein, the material of conductive adhesive part for example may is that conducting resinl, scolding tin, nano silver etc..Conducting resinl for example can be by
The composition such as resin matrix, conductive filler.The material of resin matrix for example may is that epoxy resin, acrylate, polyurethane
Deng.Conductive filler for example can be gold, silver, copper, aluminium, zinc, iron, the powder of nickel and graphite and some conductive compounds.In use,
The contact surface that the second surface of the first surface and/or cover board that conducting resinl can be applied to cover board respectively is in contact with bracket
On, then cover plate lid is closed on bracket, cover board and bracket sealing can be bonded together after conductive adhesive curing.Meanwhile it leading
Conductive filler connects into chain lock shape each other after electric adhesive curing is dry, and electric conductivity is presented, can will be on the first surface of cover board
Shielded layer on the concave surface of shielding construction and bracket L-shaped groove links together, so that the shielding knot on cover board first surface
Shielded layer on structure and bracket is connected with the ground pad of substrate, realizes the full-shield of package assembling.
When using scolding tin as conductive adhesion layer, first solder can be melted, so that solder, which flows to, is placed in cover board and bracket
Between position to be welded, cover board and bracket are electrically connected.
The bonding way of the conductive adhesion layer of nano silver material can refer to the bonding of the conductive adhesion layer of above-mentioned scolding tin material.
Figure 10 is the structural schematic diagram of the package assembling another kind setting electro-magnetic screen layer in Fig. 2.As shown in Figure 10, such as
Electro-magnetic screen layer can also be covered on the medial surface for set out enclosure space for enclosing in bracket 23, avoid be arranged in bracket and
Interfering with each other in the horizontal direction between packed device in enclosure space also avoids to a certain extent and is arranged in substrate
Interior packed device improves the shielding properties of package assembling to the electromagnetic interference for the packed device being disposed on the substrate.
It should be understood that above-mentioned bracket 23 is matched with cover board 24, substrate 22 is encircled into the enclosure space for accommodating optical device 21
Optical device 21 can also be carried out using other modes in the embodiment of the present application for a kind of specific structure shown in fig. 1
Sealing, to improve the working environment of optical device 21, avoids dust from polluteing optical device 21, however, which kind of sealing means, encapsulation
Above-mentioned electromagnetic armouring structure is equipped on component.
It is only illustrated by taking the first surface and second surface of cover board 24 as an example above, it is, of course, also possible to simultaneously in cover board
First surface and second surface on electro-magnetic screen layer is set, and will be arranged on the first surface and second surface of cover board
Electro-magnetic screen layer is electrically connected by conductive adhesive part with the electro-magnetic screen layer on the concave surface of the L-shaped groove of bracket, so that setting exists
Electro-magnetic screen layer in the first surface and second surface of cover board is connected with the ground pad of substrate, improves the shielding of package assembling
Performance.The embodiment of the present application exists for the mode of electro-magnetic screen layer is arranged in the first surface and second surface of cover board 24 simultaneously
This is not illustrated, these belong to the protection scope of the application.
Package assembling provided by the embodiments of the present application is linked together cover board and bracket by conductive adhesive part, so that
The shielding construction of cover board is connected with the shielding construction of bracket, and is connected with the ground pad of substrate, and the complete of package assembling is realized
Shielding.
In addition, Figure 11 additionally provides a kind of package assembling, as shown in figure 11, cover board 24 directly covers conjunction on bracket 23, and
Cover board 24 is concordant with the outer edge of bracket 23, remaining structure is then identical as Fig. 2.To avoid electromagnetic interference, can bracket 23 with
The surface of external contact, substrate 22 side, and electro-magnetic screen layer is arranged in the first area of the first surface in cover board 24, and
So that the electro-magnetic screen layer is connected with the ground pad of substrate 22, so that packed device (20,21) are in the electromagnetic screen
It covers in the shielding area that the ground pad on layer and substrate 22 is formed.
In addition, bracket 23 includes the first surface contacted with cover board 24, can also be set on the first surface of the bracket 23
Electro-magnetic screen layer 2 is set, and conductive adhesive part is set between the first surface and cover board 24 of the bracket 23, so that setting
Pass through conductive adhesive part 3 and the electromagnetism being arranged on the first surface on bracket in the electro-magnetic screen layer of the first surface of cover board 24
Shielded layer 2 is electrically connected, and is realized ground connection, is further improved shielding properties.
The embodiment of the present application also provides a kind of electronic equipment, Figure 12 is the knot of electronic equipment provided by the embodiments of the present application
Structure schematic diagram, as shown in figure 12, the electronic equipment include pcb board 10 and package assembling as described above, which connects
Ground pad solder is on the pcb board 10.Wherein, which can be common printed circuit board.
In specifically setting package assembling, package assembling is located on a surface of pcb board 10, and fixed with pcb board 10
Connection, using the placement direction of package assembling shown in Figure 12 as reference direction, when the package assembling is arranged, package assembling is located at
The first surface of pcb board 10, and be fixedly connected by soldered ball or pad with pcb board 10, it should be appreciated that it is shown in Fig. 10
Welding between package assembling and pcb board 10 is only a kind of specific embodiment, can also be adopted in the embodiment of the present application
It is attached with other connection types, details are not described herein.
Certainly when mobile electronic device is arranged, other individual electrical parts, the electric appliance are for example additionally provided on the pcb board 10
The first surface of pcb board 10 is arranged in part, in specific setting, can by the electrical part respectively with it is electrically active in package assembling
Device and optical device connection.
Although the application is described in conjunction with specific features and embodiment, it is clear that, do not departing from this Shen
In the case where spirit and scope please, it can be carry out various modifications and is combined.Correspondingly, the specification and drawings are only institute
The exemplary illustration for the application that attached claim is defined, and be considered as covered within the scope of the application any and all and repair
Change, change, combining or equivalent.Obviously, those skilled in the art the application can be carried out various modification and variations without
It is detached from spirit and scope.If in this way, these modifications and variations of the application belong to the claim of this application and its
Within the scope of equivalent technologies, then the application is also intended to include these modifications and variations.
Claims (17)
1. a kind of package assembling, which is characterized in that the package assembling includes: substrate, is packaged device, bracket and cover board,
The substrate includes opposite first surface and second surface, and connects the first surface and the second surface
Side, the packed device are located at the first surface of the substrate, and the bracket is located at the first surface and ring of the substrate
Around the packed device；
The first surface of the substrate, the cover board and the bracket form enclosure space, and the packed device is contained in institute
State enclosure space；
Wherein, ground pad is provided on the second surface of the substrate, the cover board includes: first area；
The surface of the bracket and external contact, the side of the substrate and the first area are equipped with electro-magnetic screen layer,
And the electro-magnetic screen layer of the first area passes through the electro-magnetic screen layer and the ground pad on the bracket and the substrate
Electrical connection.
2. package assembling according to claim 1, which is characterized in that the electro-magnetic screen layer is Transparent shielding film, metal
Screened film or shielding glue film.
3. package assembling according to claim 2, which is characterized in that the packed device includes optical device, the lid
Plate further includes the second area for light transmission, and the second area is covered by angular field of view of the optical device on the cover board
The region of lid, the first area are the region on the cover board except second area.
4. package assembling according to claim 3, which is characterized in that the cover board is transparent panel, and the second area covers
It is stamped the Transparent shielding film.
5. according to the described in any item package assemblings of claim 2-4, which is characterized in that the material of the Transparent shielding film are as follows:
Tin indium oxide.
6. package assembling according to claim 2, which is characterized in that the packed device includes pressure sensor, wet
Sensor is spent, the cover board is equipped with air hole, and the first area is the region on the cover board except the air hole.
7. package assembling according to claim 6, which is characterized in that the material of the cover board is metal, glass.
8. according to the described in any item package assemblings of claim 2-7, which is characterized in that the metallic shield film includes: adherency
Layer and shielding metal leve, the adhesion layer are covered on the side on the surface of the bracket and external contact, the substrate, Yi Jisuo
It states on the surface of first area, the shielding metal leve is arranged on the adhesion layer.
9. package assembling according to claim 8, which is characterized in that the material of the adhesion layer are as follows: titanium, the shielding gold
Belong to the material of layer are as follows: copper.
10. package assembling according to claim 8 or claim 9, which is characterized in that the electro-magnetic screen layer further include: anti-oxidation
Layer, the antioxidation coating are arranged in the shielding metal leve.
11. package assembling according to claim 10, which is characterized in that the material of the antioxidation coating are as follows: stainless steel.
12. according to the described in any item package assemblings of claim 2-11, which is characterized in that the shielding glue film is doped with iron
The epoxy colloid of magnetic particle.
13. -12 described in any item package assemblings according to claim 1, which is characterized in that the bracket is close to the cover board
The L-shaped groove for being used to support the cover board is arranged in side, and the cover plate lid closes the L shape of the bracket in the L-shaped groove of the bracket
The electro-magnetic screen layer is covered on the concave surface of slot.
14. package assembling according to claim 13, which is characterized in that the cover board passes through conductive adhesive part and the branch
The concave surface of the L-shaped groove of frame is bonded.
15. -14 described in any item package assemblings according to claim 1, which is characterized in that the bracket sets the envelope for enclosing
It closes on the medial surface in space and is covered with the electro-magnetic screen layer.
16. -15 described in any item package assemblings according to claim 1, which is characterized in that the packed device further include:
Electrical part, the electrical part are located in the bracket or the substrate.
17. a kind of electronic equipment, which is characterized in that the electronic equipment includes pcb board and such as any one of claim 1-16 institute
The package assembling stated, the ground pad of the package assembling are welded on the pcb board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118194.8A CN109890188B (en) | 2019-02-15 | 2019-02-15 | Packaging assembly and electronic equipment |
| PCT/CN2020/074793 WO2020164497A1 (en) | 2019-02-15 | 2020-02-12 | Packaging assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118194.8A CN109890188B (en) | 2019-02-15 | 2019-02-15 | Packaging assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109890188A true CN109890188A (en) | 2019-06-14 |
| CN109890188B CN109890188B (en) | 2021-03-23 |
Family
ID=66928298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910118194.8A Active CN109890188B (en) | 2019-02-15 | 2019-02-15 | Packaging assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109890188B (en) |
| WO (1) | WO2020164497A1 (en) |
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| WO2020164497A1 (en) * | 2019-02-15 | 2020-08-20 | 华为技术有限公司 | Packaging assembly and electronic device |
| CN112825317A (en) * | 2019-11-21 | 2021-05-21 | 环旭电子股份有限公司 | SiP module with electromagnetic protection function and manufacturing method thereof |
| CN113691230A (en) * | 2021-08-25 | 2021-11-23 | 北京超材信息科技有限公司 | Acoustic device packaging structure |
| CN113691229A (en) * | 2021-08-25 | 2021-11-23 | 北京超材信息科技有限公司 | Acoustic device packaging structure |
| CN114599189A (en) * | 2022-03-30 | 2022-06-07 | 青岛歌尔智能传感器有限公司 | Sealing structure, sealing method, and electronic apparatus |
| CN115084814A (en) * | 2022-05-11 | 2022-09-20 | 中国电子科技集团公司第十三研究所 | Transmit-receive front end packaging module, preparation method and microwave communication system |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020164497A1 (en) | 2020-08-20 |
| CN109890188B (en) | 2021-03-23 |
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