CN206364008U - A kind of semiconductor package part with electro-magnetic screen function - Google Patents
A kind of semiconductor package part with electro-magnetic screen function Download PDFInfo
- Publication number
- CN206364008U CN206364008U CN201621424376.6U CN201621424376U CN206364008U CN 206364008 U CN206364008 U CN 206364008U CN 201621424376 U CN201621424376 U CN 201621424376U CN 206364008 U CN206364008 U CN 206364008U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- multilayer wiring
- electro
- semiconductor package
- ground plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model is related to a kind of semiconductor package part with electro-magnetic screen function, and it includes multilayer wiring board（300）, an at least ground plane（311）, an at least conductor block（312）, an at least chip（320）, an at least bonding wire（325）, a packing colloid（330）, a screen layer（340）；Ground plane（311）, inside it is embedded in multilayer wiring board（310）And extend laterally；Conductor block（312）, it is embedded in multilayer wiring board（310）Interior and ground plane（311）It is electrical connected；Chip（320）, it is arranged at multilayer wiring board（310）On；Packing colloid（330）Set and multilayer wiring board（310）On, screen layer（340）Cover packing colloid（330）Outer surface（330a）.A kind of semiconductor package part with electro-magnetic screen function of the utility model, it can make the metal level of follow-up packing colloid surface sputter close more preferable with multilayer wiring board shielded conductor agllutination, improve and screen layer combination reliability, enhancing shield effectiveness.
Description
Technical field
The utility model is related to a kind of semiconductor package part with electro-magnetic screen function, belongs to semiconductor packaging neck
Domain.
Background technology
The world today has been enter into the epoch that communication electronics are developed rapidly, and high frequency, hyperfrequency electromagnetic signal are applied rapid
Expansion development, meanwhile, electromagnetic interference, the influence of the electromagnetic wave of electromagnetic compatibility and leakage to the normal life of the mankind has been drawn
The attention of the mankind is played.
As Fig. 1, Chinese patent literature CN103400825A disclose a kind of semiconductor package assembly and a manufacturing method thereof.Partly lead
Body packaging part includes substrate, ground plane, chip, packaging body and screen layer.Substrate has lateral surface and bottom surface.Base is buried in ground plane
The extension of plate and transverse direction is simultaneously exposed from the lateral surface of substrate.Chip is on substrate.Packaging body coats chip and with lateral surface.
Screen layer covers lateral surface, the lateral surface of substrate and the ground plane exposed of packaging body.
Though the encapsulating structure disclosed by above-mentioned patent has the effect of shielding electromagnetic interference, its ground plane exposed or connect
The area of ground cabling is all too small, and its overcurrent capability, the reliability and shield effectiveness that are engaged with screen layer have certain limitation
Property.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of with electromagnetic shielding work(for above-mentioned prior art
The semiconductor package part of energy, conductor block is embedded between line layer adjacent with ground plane in multilayer wiring board by it, conductor block
It is electrical connected with ground plane and extends to multilayer wiring board lateral surface and expose a surface, follow-up packing colloid surface can be made
The metal level of sputter closes more preferable with multilayer wiring board shielded conductor agllutination, improves and screen layer combination reliability, enhancing shielding
Effect.
The technical scheme in the invention for solving the above technical problem is：A kind of semiconductor with electro-magnetic screen function
Packaging part, it includes multilayer wiring board, at least a ground plane, at least a conductor block, at least an at least chip, a bonding wire, one
Packing colloid, a screen layer；
Multilayer wiring board has a lateral surface；
Ground plane, is inside embedded in multilayer wiring board and extends laterally；
Conductor block, be embedded in multilayer wiring board be electrical connected and extend to multilayer wiring board lateral surface with ground plane and
Expose a surface；
Chip, is arranged on multilayer wiring board, is electrical connected by bonding wire with multilayer wiring board；
Packing colloid set with multilayer wiring board, and coating chip and bonding wire and with an outer surface；
Screen layer covers the surface of outer surface, the lateral surface of multilayer wiring board and the conductor block exposed of packing colloid.
Conductor block is using made by 0 Europe resistance or tin cream or copper billet or aluminium, copper, nickel, gold, tin, the combination of stainless steel material.
The shape of conductor block is circular, ellipse or rectangle.
Chip is electrical connected by salient point with multilayer wiring board.
The surface of the lateral surface of multilayer wiring board, the outer surface of packing colloid and conductor block is by same cutting technique shape
Into lateral surface, outer surface and surface are substantially flush.
Screen layer is made by the combination of single or multiple lift aluminium, copper, nickel, gold, tin, stainless steel or above-mentioned material.
The vapour deposition of screen layer applied chemistry, chemical plating, plating, printing, spraying, sputtering or vacuum-deposited technology system
Into.
The quantity of ground plane is multilayer, is respectively formed in the bottom surface of multilayer wiring board and the inside of multilayer wiring board,
Conductor block is while being connected with more grounded layers.
Also other copper of the electrical connection ground plane in multilayer wiring board are coupled while conductor block is connected with ground plane
Layer.
Compared with prior art, the utility model has the advantage of：
A kind of semiconductor package part with electro-magnetic screen function of the utility model, conductor block is embedded in multilayer wire roadbed by it
In plate between the line layer adjacent with ground plane, conductor block and ground plane are electrical connected and extend to multilayer wiring board lateral surface
And exposing a surface, the metal level and multilayer wiring board shielded conductor agllutination that can make follow-up packing colloid surface sputter are closed more
It is good（Bonded area is increased）, improve and screen layer combination reliability, enhancing shield effectiveness.
Brief description of the drawings
Fig. 1 is a kind of profile of traditional electromagnetic shielding semiconductor packages.
Fig. 2 is a kind of schematic diagram of the semiconductor package part embodiment 1 with electro-magnetic screen function of the utility model.
Fig. 3 is a kind of schematic diagram of the semiconductor package part embodiment 2 with electro-magnetic screen function of the utility model.
Fig. 4 is a kind of schematic diagram of the semiconductor package part embodiment 3 with electro-magnetic screen function of the utility model.
Wherein：
Semiconductor package part 300,400,500
Multilayer wiring board 310
Lateral surface 310a
Ground plane 311
Conductor block 312
Surface 312a
Chip 320
Bonding wire 325
Packing colloid 330
Outer surface 330a
Screen layer 340.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing embodiment.
Embodiment 1：
As shown in Fig. 2 a kind of semiconductor package part 300 with electro-magnetic screen function in the present embodiment, it includes many
Layer line base board 300, at least a ground plane 311, at least a conductor block 312, at least a chip 320, at least a bonding wire 325, one
Packing colloid 330, a screen layer 340；
Multilayer wiring board 300 has a lateral surface 310a；
Ground plane 311, is inside embedded in multilayer wiring board 310 and extends laterally；
Conductor block 312, such as 0 Europe resistance or tin cream or copper billet or aluminium, copper, nickel, gold, tin, stainless steel or above-mentioned material
Combination made by；
The embodiment of the present invention does not limit the shape of conductor block 312, can be circular, ellipse, rectangle or irregular shape.Bury
Expose in being electrical connected in multilayer wiring board 310 with ground plane 311 and extending to the lateral surface 310a of multilayer wiring board 310
One surface 312a；
Chip 320, is arranged on multilayer wiring board 310, is electrical connected by bonding wire 325 with multilayer wiring board 310；
In another embodiment, it can be electrical connected by salient point with multilayer wiring board 310；
Packing colloid 330 set with multilayer wiring board 310, and coating chip 320 and bonding wire 325 and with an appearance
Face 330a；
The lateral surface 310a of multilayer wiring board 310, the outer surface 330a of packing colloid 330 and conductor block 312 in this example
Surface 312a formed by same cutting technique, therefore lateral surface 310a, outer surface 330a and surface 312a are substantially flush；
Screen layer 340 covers outer surface 330a, the lateral surface 310a and dew of multilayer wiring board 310 of packing colloid 330
The surface 312a of the conductor block 312 gone out, screen layer 340 can be single or multiple lift aluminium, copper, nickel, gold, tin, stainless steel etc. or on
State made by the combination of material, the skill such as applied chemistry vapour deposition, chemical plating, plating, printing, spraying, sputtering or vacuum moulding machine
Art is made.
Embodiment 2：
As shown in figure 3, the difference of embodiment 2 and embodiment 1 is：The quantity of ground plane 311 is multilayer, is respectively formed in
The bottom surface of multilayer wiring board 310 and the inside of multilayer wiring board 310, the present embodiment do not limit the number of plies of ground plane 311
And forming position, conductor block 312 is while being connected with more grounded layers 311；
Embodiment 3：
As shown in figure 4, the difference of embodiment 3 and embodiment 1 is：While conductor block 312 is connected with ground plane 311
Couple other layers of copper of the electrical connection ground plane in multilayer wiring board 310.
In addition to the implementation, the utility model also includes other embodiment, all use equivalents or equivalent
The technical scheme of substitute mode formation, all should fall within the utility model scope of the claims.
Claims (7)
1. a kind of semiconductor package part with electro-magnetic screen function, it is characterised in that：It includes multilayer wiring board（300）、
An at least ground plane（311）, an at least conductor block（312）, an at least chip（320）, an at least bonding wire（325）, a packaging plastic
Body（330）, a screen layer（340）；
Multilayer wiring board（300）With a lateral surface（310a）；
Ground plane（311）, inside it is embedded in multilayer wiring board（310）And extend laterally；
Conductor block（312）, it is embedded in multilayer wiring board（310）Interior and ground plane（311）Electrically it is connected and extends to multilayer line
Substrate（310）Lateral surface（310a）And expose a surface（312a）；
Chip（320）, it is arranged at multilayer wiring board（310）On, pass through bonding wire（325）With multilayer wiring board（310）Electrically
It is connected；
Packing colloid（330）Set and multilayer wiring board（310）On, and coating chip（320）And bonding wire（325）And with one
Outer surface（330a）；
Screen layer（340）Cover packing colloid（330）Outer surface（330a）, multilayer wiring board（310）Lateral surface
（310a）With the conductor block exposed（312）Surface（312a）.
2. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Conductor block
（312）Shape be circular, ellipse or rectangle.
3. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Chip
（320）Pass through salient point and multilayer wiring board（310）It is electrical connected.
4. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Multilayer wire
Base board（310）Lateral surface（310a）, packing colloid（330）Outer surface（330a）With conductor block（312）Surface
（312a）Formed by same cutting technique, lateral surface（310a）, outer surface（330a）With surface（312a）It is substantially flush.
5. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Screen layer
（340）Applied chemistry vapour deposition, chemical plating, plating, printing, spraying, sputtering or vacuum-deposited technology are made.
6. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Ground plane
（311）Quantity be multilayer, be respectively formed in multilayer wiring board（310）Bottom surface and multilayer wiring board（310）Inside,
Conductor block（312）It is while and more grounded layers（311）It is connected.
7. a kind of semiconductor package part with electro-magnetic screen function according to claim 1, it is characterised in that：Conductor block
（312）With ground plane（311）Also multilayer wiring board is coupled while connected（310）Other copper of interior electrical connection ground plane
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424376.6U CN206364008U (en) | 2016-12-23 | 2016-12-23 | A kind of semiconductor package part with electro-magnetic screen function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424376.6U CN206364008U (en) | 2016-12-23 | 2016-12-23 | A kind of semiconductor package part with electro-magnetic screen function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206364008U true CN206364008U (en) | 2017-07-28 |
Family
ID=59376408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621424376.6U Active CN206364008U (en) | 2016-12-23 | 2016-12-23 | A kind of semiconductor package part with electro-magnetic screen function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206364008U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109841597A (en) * | 2017-11-24 | 2019-06-04 | 讯芯电子科技（中山）有限公司 | Subregion is electromagnetically shielded encapsulating structure and manufacturing method |
| CN109890188A (en) * | 2019-02-15 | 2019-06-14 | 华为技术有限公司 | Package assembling and electronic equipment |
| CN109920779A (en) * | 2019-03-19 | 2019-06-21 | 吴静雯 | A kind of preparation method and encapsulating products of encapsulating products electro-magnetic screen layer |
| WO2022037147A1 (en) * | 2020-08-17 | 2022-02-24 | 江苏长电科技股份有限公司 | Fan-out package structure and manufacturing method therefor |
-
2016
- 2016-12-23 CN CN201621424376.6U patent/CN206364008U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109841597A (en) * | 2017-11-24 | 2019-06-04 | 讯芯电子科技（中山）有限公司 | Subregion is electromagnetically shielded encapsulating structure and manufacturing method |
| CN109890188A (en) * | 2019-02-15 | 2019-06-14 | 华为技术有限公司 | Package assembling and electronic equipment |
| CN109920779A (en) * | 2019-03-19 | 2019-06-21 | 吴静雯 | A kind of preparation method and encapsulating products of encapsulating products electro-magnetic screen layer |
| CN109920779B (en) * | 2019-03-19 | 2020-11-24 | 吴静雯 | Preparation method of electromagnetic shielding layer of packaged product and packaged product |
| WO2022037147A1 (en) * | 2020-08-17 | 2022-02-24 | 江苏长电科技股份有限公司 | Fan-out package structure and manufacturing method therefor |
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