WO2020164497A1

WO2020164497A1 - Packaging assembly and electronic device

Info

Publication number: WO2020164497A1
Application number: PCT/CN2020/074793
Authority: WO
Inventors: 郭学平; 吴鹏
Original assignee: 华为技术有限公司
Priority date: 2019-02-15
Filing date: 2020-02-12
Publication date: 2020-08-20
Also published as: CN109890188A; CN109890188B

Abstract

Embodiments of the present application provide a packaging assembly and an electronic device. The packaging assembly comprises: a substrate, a packaged device, a support, and a cover plate. The substrate comprises a first surface and a second surface that are opposite to each other, and side surfaces connecting the first surface to the second surface. The packaged device is located on the first surface of the substrate. The support is located on the first surface of the substrate and surrounds the packaged device. The first surface of the substrate, the cover plate, and the support form a closed space, and the packaged device is accommodated in the closed space. The second surface of the substrate is provided with a grounding pad. The cover plate comprises: a first area, the surface of the support contacting the outside, and the side surfaces of the substrate, wherein an electromagnetic shielding layer is provided on the first area, and the electromagnetic shielding layer of the first area is electrically connected to the grounding pad by means of the support and an electromagnetic shielding layer on the substrate.

Description

Package components and electronic equipment

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office of China, the application number is 201910118194.8, and the invention title is "Packaging Components and Electronic Equipment" on February 15, 2019, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the field of optoelectronic technology, and in particular to a packaging component and electronic equipment.

Background technique

Electromagnetic shielding technology refers to the electromagnetic shielding structure made of conductive or magnetic materials to limit the electromagnetic interference energy within a certain range to control the induction or radiation of electric fields, magnetic fields and electromagnetic waves from one area to another. Specifically, the electromagnetic shielding structure isolates the electronic components or the interference source of the entire system to prevent the influence of the external electromagnetic field or the diffusion of the interference electromagnetic field to the outside world.

At present, the application of packaging components in electronic devices such as mobile phones is becoming more and more popular. Considering the light transmission and ventilation requirements of some packaged devices, it is necessary to provide light transmission areas and vents on the packaging components. However, when these packaged devices transmit electrical signals, they will interfere with or be interfered by external devices. Therefore, it is necessary to provide an electromagnetic shielding structure for the packaged component.

Summary of the invention

The embodiments of the present application provide a package assembly and electronic equipment, which are used to improve the electromagnetic shielding performance of the package assembly and avoid electromagnetic interference.

In order to achieve the foregoing objectives, the embodiments of the present application adopt the following technical solutions:

In a first aspect, a package assembly is provided, which includes: a substrate, a packaged device, a support, and a cover plate,

The substrate includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface, the packaged device is located on the first surface of the substrate, and the support is located on the The first surface of the substrate surrounds the packaged device, the first surface of the substrate, the cover plate and the bracket form a closed space, and the packaged device is contained in the closed space, wherein the substrate A grounding pad is provided on the second surface of the, the cover plate includes: a first area, the surface of the support contacting the outside, the side surface of the substrate, and an electromagnetic shielding layer is provided on the first area, and The electromagnetic shielding layer of the first region is electrically connected to the ground pad through the electromagnetic shielding layer on the support and the substrate. Therefore, the electromagnetic shielding layer and the grounding pad of the substrate jointly form an electromagnetic shielding area, and the packaged device is isolated in the electromagnetic shielding area, avoiding electromagnetic interference between the packaged device and the external magnetic field, and improving the packaging assembly Shielding performance.

In an optional implementation manner, the electromagnetic shielding layer is a conductive and magnetic transparent shielding film, a metal shielding film or a shielding glue film. As a result, the electromagnetic shielding layer can be directly covered on the surface of the package component with a thickness of only micrometers, which occupies a small space and is beneficial to the miniaturization of the package component.

In an optional implementation manner, the packaged device includes an optical device, the cover plate includes a second area for transmitting light, and the second area is a viewing angle range of the optical device on the cover plate For the covered area, the first area is an area outside the second area on the cover plate. Therefore, different shielding treatments can be performed on the first area and the second area according to whether light transmission is required, so that the package assembly can not only meet the light transmission requirements of the optical device, but also achieve electromagnetic shielding.

In an optional implementation manner, the cover plate is a transparent plate, and the second area is covered with the transparent shielding film. As a result, the second area is covered with the transparent shielding film, which not only meets the light transmission requirements of the optical device, but also realizes full shielding of the package assembly.

In an optional implementation manner, the material of the transparent shielding film is: indium tin oxide. Since the transparent shielding film made of indium tin oxide can not only transmit light but also has conductivity, it can transmit light and shield electromagnetic interference.

In an optional implementation manner, the packaged device includes a pressure sensor and a humidity sensor, the cover plate is provided with vent holes communicating with the outside, and the first area is one of the vent holes on the cover plate. Outside the area. Therefore, the electromagnetic shielding layer may not be covered at the vent hole, which reduces the cost.

In an optional implementation manner, the material of the cover plate is metal or glass. The material of the cover plate is not restricted here, as long as the strength requirement of the package assembly can be met, and the packaged device arranged in the package assembly can be protected.

In an optional implementation manner, the metal shielding film includes: an adhesion layer and a shielding metal layer, the adhesion layer covering the surface of the support in contact with the outside, the side surface of the substrate, and the first On the surface of the area, the shielding metal layer is provided on the adhesion layer. Therefore, the shielding metal layer can be used for electromagnetic shielding, and the adhesive layer can bond the shielding metal layer on the surface of the support and the outside contact, the side surface of the substrate, and the surface of the first region. This composite structure improves Improve the firmness of the electromagnetic shielding layer bonding.

In an optional implementation manner, the material of the adhesion layer is titanium, and the material of the shielding metal layer is copper. The specific materials of the adhesion layer and the shielding metal layer are not limited in this embodiment.

In an optional implementation manner, the electromagnetic shielding layer further includes an anti-oxidation layer, and the anti-oxidation layer is disposed on the shielding metal layer. Thus, the anti-oxidation layer can prevent the oxidation of the shielding metal layer and improve the shielding performance.

In an optional implementation manner, the material of the anti-oxidation layer is stainless steel. This embodiment does not limit the specific material of the anti-oxidation layer.

In an optional implementation manner, the shielding adhesive film is epoxy colloid doped with ferromagnetic particles. As a result, the energy of electromagnetic waves projected by the packaged device and external devices can be absorbed or greatly reduced, thereby reducing the interference of electromagnetic waves.

In an optional implementation manner, an L-shaped groove for supporting the cover plate is provided on a side of the bracket close to the cover plate, and the cover plate is covered on the L-shaped groove of the bracket. The concave surface of the L-shaped groove of the bracket is covered with the electromagnetic shielding layer. As a result, the electromagnetic shielding layer provided on the concave surface of the L-shaped groove of the support is connected to the ground pad of the substrate through the electromagnetic shielding layer provided on the surface of the support contacting the outside, thereby further improving the shielding performance.

In an optional implementation manner, the cover plate is bonded to the concave surface of the L-shaped groove of the bracket through a conductive adhesive. Thus, while the conductive adhesive seals the gap between the cover plate and the bracket, the electromagnetic shielding layer provided on the first surface of the cover plate is electrically connected to the electromagnetic shielding layer provided on the bracket through the conductive adhesive to achieve The grounding is improved, and the shielding performance is further improved.

In an optional implementation manner, the packaged device further includes: an electrical device, and the electrical device is located in the support or the substrate. Therefore, the area occupied by the electrical device can be reduced, thereby reducing the volume of the entire package assembly.

In an optional implementation manner, the inner surface of the bracket for enclosing the enclosed space is covered with the electromagnetic shielding layer. Therefore, the horizontal interference between the packaged devices arranged in the bracket and the enclosed space is avoided, and the packaged devices arranged in the substrate are also avoided to a certain extent from the packaged devices arranged on the substrate. The electromagnetic interference improves the shielding performance of package components.

In a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes a PCB board and the packaging component as described above, and the ground pad of the packaging component is soldered on the PCB board. Therefore, the electronic device has the above-mentioned packaging assembly, which improves the electromagnetic shielding performance of the electromagnetic device.

These and other aspects of the application will be more concise and understandable in the description of the following embodiments.

Description of the drawings

FIG. 1 is a schematic structural diagram of a package assembly provided by an embodiment of the application;

2 is a schematic structural diagram of another package assembly provided by an embodiment of the application;

Figure 3 is a top view of the cover plate in Figure 2;

Figure 4 is a cross-sectional view of the cover in Figure 2;

Figure 5 is a top view of the package assembly in Figure 2;

Figure 6 is a cross-sectional view of another cover plate;

Figure 7 is a cross-sectional view of another cover plate;

FIG. 8 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer;

FIG. 9 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer;

10 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer;

FIG. 11 is a schematic structural diagram of another package assembly provided by an embodiment of the application;

FIG. 12 is a schematic structural diagram of an electronic device provided by an embodiment of this application.

detailed description

The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Among them, in order to facilitate a clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish the same or similar items with substantially the same function and effect. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and order of execution, and words such as "first" and "second" do not limit the difference.

In order to facilitate the understanding of the package assembly provided by the embodiments of the present application, the following first describes the application scenario of the package assembly. The package assembly can isolate the packaged device from the outside world and avoid the corrosion of the packaged device by impurities in the air. The packaged devices can be: optical devices and electrical devices that can receive or emit light signals, as well as pressure sensors and humidity sensors for detecting humidity and air pressure in the surrounding environment, etc. The packaged components can be structured light sensors, ambient light sensors, etc. Or devices such as cameras. Applied to electronic devices, such as mobile phones, tablet computers, digital cameras, wearable devices, automotive electronics and other common electronic devices. When in use, the optical components, electrical components, sensors, etc. in the package assembly generate electromagnetic waves, which will interact with other electronic components to cause electromagnetic interference. In order to suppress electromagnetic interference in the package assembly, an electromagnetic shielding structure must be provided for the package assembly.

The package assembly provided by the embodiment of the present application will be described below in conjunction with the accompanying drawings. FIG. 1 is a schematic structural diagram of a package assembly provided by an embodiment of the application. FIG. 2 is a schematic structural diagram of another package assembly provided by an embodiment of the application. Fig. 3 is a top view of the cover plate in Fig. 2. 4 is a cross-sectional view of the cover plate in FIG. 2; FIG. 5 is a top view of the package assembly in FIG. 2. FIG. 11 is a schematic structural diagram of another package assembly provided by an embodiment of the application. As shown in Figure 1, Figure 2, Figure 3, Figure 4, Figure 11, the package assembly includes: a substrate 22, packaged devices (20, 21), a support 23 and a cover 24, the substrate 22 includes opposite first surfaces And the second surface, and the side surface connecting the first surface and the second surface, the packaged device (20, 21) is located on the first surface of the substrate 22; the support 23 is located on the first surface of the substrate 22 and surrounds the packaged device ( 20, 21); The first surface of the substrate 22, the cover plate 24 and the bracket 23 form a closed space, and the packaged device (20, 21) is accommodated in the closed space.

Wherein, a grounding pad is provided on the second surface of the substrate 22, and the cover plate 24 includes: a first area. In order to avoid electromagnetic interference, an electromagnetic shielding layer can be provided on the surface of the support 23 in contact with the outside, the side surface of the substrate 22, and the first area of the cover plate 24, and the electromagnetic shielding layer can be connected to the ground pad of the substrate 22. Therefore, the packaged devices (20, 21) are located in the shielding area formed by the electromagnetic shielding layer and the grounding pad on the substrate 22. Wherein, the area of the first area 241 of the cover plate 24 is less than or equal to the area of the cover plate 24. This is because considering the characteristics of the packaged device, it is often necessary to provide ventilation holes, light transmission areas, etc. on the cover plate 24. An electromagnetic shielding layer is provided in the holes, light-transmitting areas, etc., or a special electromagnetic shielding layer needs to be set.

Wherein, the cover plate 24 includes at least a first surface and a second surface which are arranged oppositely. When the electromagnetic shielding layer is provided in the first area of the cover plate 24, the electromagnetic shielding layer can be provided only in the first area of the first surface of the cover plate 24. As the shielding layer, the electromagnetic shielding layer may be provided only on the first area of the second surface of the cover plate 24, or the electromagnetic shielding layer may be provided on both the first surface and the first area of the second surface of the cover plate 24. As shown in FIG. 2, the electromagnetic shielding layer is provided only in the first area of the first surface of the cover plate 24.

When working, the electromagnetic wave generated by the packaged device radiates to the surroundings. When the electromagnetic wave encounters the electromagnetic shielding layer, part of it is reflected back, and part is absorbed by the electromagnetic shielding layer, so that the electric field is terminated on the surface of the electromagnetic shielding layer and the charge is transferred. In the same way, the electromagnetic waves emitted by external devices will be shielded when they reach the electromagnetic shielding layer on the surface of the package component, thereby realizing the shielding of the package component.

In the package assembly provided by the embodiments of the present application, an electromagnetic shielding layer is provided on the first area of the cover plate and on the side surface of the support and the substrate contacting the outside, and the electromagnetic shielding layer is electrically connected to the grounding pad of the substrate, so that the electromagnetic The shielding layer and the grounding pad of the substrate jointly form an electromagnetic shielding area, which improves the shielding performance of the package assembly.

Among them, the number of packaged devices may be one or multiple, and the embodiment of the present application does not limit the number of packaged devices. The packaged device may be, for example, an optical device, or a pressure sensor, humidity sensor, etc.

If the packaged device is a pressure sensor, a humidity sensor, etc., the cover plate 24 can be made of metal, glass and other materials when specifically set up. FIG. 1 is a schematic structural diagram of a package assembly provided by an embodiment of the application. As shown in FIG. 1, a ventilation hole 240 is provided on the cover plate 24 to communicate with the outside. The area outside the vent 240 on the cover plate 24 is, for example, the first area. An electromagnetic shielding layer is provided on the first area, the support and the side surface of the substrate in contact with the outside. The electromagnetic shielding layer provided on the first area of the cover 24 and on the outer surface of the substrate 22 and the support 23 can be, for example, a transparent shielding film, a metal shielding film or a shielding glue film. The first area 241 of the cover 24 can be, for example, Do not do any treatment or cover the transparent shielding film.

The transparent shielding film may be made of, for example, indium tin oxide material. The transparent shielding film can transmit light and also has conductivity, and can shield electromagnetic interference.

Wherein, the transparent shielding film can be made by, for example, a magnetron vacuum sputtering process method, or a process method such as vacuum evaporation coating, chemical vapor deposition, or radio frequency sputtering coating. For example, the planar magnetron technology can be used to sputter the indium tin oxide conductive thin film coating on the cover plate and subject it to high temperature annealing to obtain the transparent shielding film.

The metal shielding film may be a multilayer composite structure, for example, the metal shielding film includes, for example, an adhesive layer and a shielding metal layer, wherein the adhesive layer covers the surface of the support in contact with the outside, the side surface of the substrate, and On the surface of the first region, a shielding metal layer is provided on the adhesion layer. When the metal shielding film is specifically set up, for example, an adhesion layer can be formed on the surface of the area to be shielded by evaporation, physical vapor deposition, or sputtering, and then pass on the adhesion layer. A shielding metal layer is formed on the adhesion layer by evaporation, physical vapor deposition or sputtering.

Wherein, the material of the adhesion layer may be, for example, titanium. The material of the shielding metal layer can be selected from a variety of materials, such as copper, nickel, chromium, aluminum, silver, gold, iron, and tin. Among them, copper has a higher conductivity and has a better shielding effect on electromagnetic interference. Good, low cost, easy to shape, therefore, you can choose copper as the main material of the shielding metal layer.

The metal shielding film further includes, for example, an anti-oxidation layer. The anti-oxidation layer can be formed on the shielding metal layer, for example, by evaporation, physical vapor deposition, or sputtering. The material of the anti-oxidation layer may be, for example, stainless steel.

The thickness of the adhesion layer may be, for example, between 0.05-0.5 μm, the thickness of the shielding metal layer may be, for example, between 3-15 μm, and the thickness of the anti-oxidation layer may be, for example, between 0.05-2 μm. The thickness of the electromagnetic shielding layer is micron level, and the space occupied by it is basically negligible, which reduces the size of the space occupied by the package component.

The material of the shielding adhesive film may be, for example, epoxy colloid doped with ferromagnetic particles, wherein the ferromagnetic particles can absorb electromagnetic waves. The epoxy colloid may be doped with other materials capable of absorbing electromagnetic waves, specifically: ferrite, magnetic iron nanomaterials, or graphene, graphite, carbon black, carbon fibers, carbon nanotubes, etc. When the metal shielding film is specifically set up, for example, a layer of shielding adhesive film can be formed on the surface of the area to be shielded by spraying, so as to absorb or greatly reduce the energy of electromagnetic waves projected by the packaged device and external devices. Thereby reducing the interference of electromagnetic waves.

This application does not limit the specific material of the electromagnetic shielding layer, and those skilled in the art can select suitable materials as the electromagnetic shielding layer according to needs, and these all fall within the protection scope of the application.

The electromagnetic shielding layer provided by the embodiments of the present application can directly cover the surface of the package component, with a thickness of only micrometers, and occupy a small space, which is beneficial to the miniaturization of the package component.

If the packaged device is an optical device, when the package assembly is specifically set, taking into account the light transmission requirements of the optical device, the cover 24 can be made of transparent materials, such as glass, transparent resin, and other materials. Of course, it can also be made of other transparent materials.

According to the field of vision (FOV) of the optical device on the cover plate, the cover plate 24 can be divided into a first area 241 and a second area 241. The optical device receives or emits through the second area 242. For optical signals, the first area is an area on the substrate excluding the second area. The second area is, for example, greater than or equal to the area covered by the viewing angle range of the optical device on the cover plate.

When there is one optical device, the second area includes the area covered by the viewing angle range of the one optical device on the cover plate 24, and the remaining area on the cover plate 24 is the first area. When there are multiple optical devices, the second area includes the area covered by the entire viewing angle range of the multiple optical devices on the cover plate 24, and the remaining area on the cover plate 24 is the first area. Taking two optical devices as an example, as shown in FIG. 1, the optical devices include: a first optical device 20 and a second optical device 21. Referring to FIG. 1, the field of view of the first optical device 20 is β, and the optical device The field of view angle of 21 is α. As shown in Fig. 2, the second area 242 is equal to the area covered by the viewing angle range of the first optical device 20 and the second optical device 21 on the cover 24, and other areas on the cover 24 The area is the first area 241.

When the electromagnetic shielding structure on the package assembly is specifically set, the second area on the cover 24, the substrate 22, and the outer surface of the bracket 23 can be covered with electromagnetic shielding layers of the same material, or electromagnetic shielding layers of different materials can be covered, and The first area on the cover plate 24 is covered with a transparent conductive film, and no treatment is required.

Next, referring to Figures 2, 3, 4, and 5, in a specific embodiment of the present application, the first area 241 of the first surface of the cover plate 24 is covered with a transparent shielding film 1, and the cover plate 24 The first area 241 of the first surface, the side surface of the substrate 22 and the support 23 contacting the outside are covered with the electromagnetic shielding layer 2, which may be a metal shielding film or a conductive adhesive film, for example. The material and processing technology of the transparent shielding film 1 and the electromagnetic shielding layer 2 refer to the above, and the description will not be given below. Among them, the transparent shielding film 1 provided in the first area of the cover plate 24, the metal shielding film 2 provided in the second area of the cover plate 24, and the metal shielding film 2 provided on the outside of the substrate and the support are all electrically connected to the ground pad of the substrate. The connection together forms an electromagnetic shielding area, thereby realizing the full shielding of the packaged components. The cost of the transparent shielding film 1 is relatively high, and the electromagnetic shielding layer 2 is covered on the second area 242, which can reduce the cost.

Or, in order to facilitate processing, in an implementation manner of the present application, both the first area and the second area of the cover plate 24 may be covered with the transparent shielding film 1. Figure 6 is a cross-sectional view of another cover plate. As shown in FIG. 6, the first area 241 and the second area 242 of the first surface of the cover plate 24 are both covered with the transparent shielding film 1. Among them, the transparent shielding film 1 provided on the cover plate 24 and the electromagnetic shielding layer 2 provided on the outside of the substrate and the bracket are both connected to the ground pad of the substrate to form an electromagnetic shielding area, thereby realizing the entire package assembly. shield.

Figure 7 is a cross-sectional view of another cover plate. As shown in FIG. 7, in order to save electromagnetic shielding materials, the electromagnetic shielding layer 2 can also be provided only in the first area 241 of the cover plate 24, and the second area 242 of the first surface of the cover plate 24 is not treated. The electromagnetic shielding layer 2 can be, for example, a transparent conductive film, a metal shielding film, or a conductive adhesive film. While ensuring the light transmission of the optical device 21, the area of the shielding film can be saved, and the miniaturization of the assembly is realized.

Wherein, when the transparent shielding film or the metal shielding film is only provided in the first area, the surface sacrificial layer technology can be used to process the shielding layer in the first area. For example, when the shielding layer is specifically set up, you can first cover a layer of film on the second area, then spray or deposit the required shielding film on the layer of film, and then use a chemical etchant to etch away the layer of film , You can get the shielding film.

In the package assembly provided by the embodiment of the present application, by providing a transparent shielding film on the cover plate, the light transmission requirements of the optical device can be met, and the electromagnetic shielding of the package assembly can be realized at the same time. In addition, all shielding structures are formed by semiconductor processing techniques including spraying, sputtering, and deposition, with higher processing accuracy.

Only the structure of the cover part of the package assembly in FIG. 1 and FIG. 2 is different, and the structure of the other parts is completely the same. The following only takes the structure of the remaining part of the package assembly in FIG. 2 as an example for description.

Continuing to refer to FIG. 2, when the packaged device is specifically set, the first packaged device 20 and the second packaged device 21 are both arranged on the substrate 22, wherein the bracket 23 and the optical device 21 are arranged on the first surface of the substrate 22 . In addition, the substrate 22 is provided with a circuit layer for transmitting the signal of the packaged device. When the packaged device is connected to the circuit layer of the substrate 22, it can be connected by gold wire or solder ball. Either way, it only needs to be able to realize electrical connection. When the optical device 21 is connected to the substrate 22, the two optical devices as shown in FIG. 2 are both connected by gold wires. In addition, for the substrate 22, substrates of different materials such as silicon, ceramics, and organic substrates can be used.

When the bracket 23 is specifically set, the bracket 23 can be arranged on the first surface of the substrate 22 and fixedly connected to the substrate 22. The specific fixing method can be welded, bonded, snap-fitted or connected by connecting pieces (such as bolts or screws). The bracket 23 can be integrally molded by injection molding and then fixed to the substrate or formed directly on the substrate by a molding process. Bracket 23. The top view of FIG. 5 is a diagram when the structure of the packaged device shown in FIG. 2 is viewed from top to bottom. It can be seen from FIG. 2 that the bracket 23 is a ring-shaped bracket 23, and when the bracket 23 is fixedly connected to the substrate 22, it is arranged around the packaged device. When fixing the packaged device, as shown in FIG. 2, the packaged device is located in the space enclosed by the bracket 23, so that the packaged device is protected by the bracket 23.

The package assembly also includes an electrical device. When in use, the packaged device in the package assembly can transmit electrical signals to the electrical device, and the electrical device is used to send the electrical signal to the processor of the electronic device. Figures 2 and 5 also show an electrical device provided by an embodiment of the present application. The electrical device is embedded in the substrate 22 or the support 23. When the electrical device includes an electrically active device 31, the electrically active device 31 may It is a bare chip (unpackaged chip). When the electrically active device 31 is installed, the electrically active device 31 may be installed in the substrate 22 or the support 23. As shown in FIG. 2, the electrically active device 31 is buried in the substrate 22. It should be noted that when selecting the bracket 23 or the substrate 22 to embed the electrically active device 31, it can be determined according to the size of the specific electrically active device 31. The height of the electrically active device 31 shown in FIG. 2 is smaller than that of the substrate 22. thickness of. The electrical components arranged in the substrate and the bracket cannot be seen from the top angle. To facilitate the observation of the specific arrangement of the electrical components, the electrical components are still shown in the top view of the package assembly in FIG. 5.

FIG. 2 also shows a structure using an electrically passive device 32. The height of the electrically passive device 32 shown in FIG. 2 is greater than the thickness of the substrate 22 and smaller than the thickness of the support 23, and the electrically passive device 32 uses The arrangement in the bracket 23 is similar to the electrically active device 31. Of course, FIG. 2 only shows a specific embodiment of an electrically passive device. When the electrically passive device 32 is buried in the bracket 23, the electrically passive device 32 can be embedded in the conductive material and /Or the metallized vias provided on the substrate 22 are connected to the electrically active device 31 and the optical device 21. That is, when the electrically passive device 32 is connected to the electrically active device 31 and the optical device 21, it can be connected using conductive materials or metalized vias, or a combination of a part of conductive material and a part of metalized vias. The specific connection method can be set according to the actual situation.

When the cover plate 24 is specifically set, as shown in FIG. 2, a ring of L-shaped grooves for supporting the cover plate 24 is provided on the side of the bracket close to the cover plate. The L-shaped grooves match the shape of the edge of the cover plate. The opening of the L-shaped groove faces the closed space formed by the first surface of the base plate 22, the cover plate 24, and the bracket 23. The cover plate 24 covers the L-shaped groove of the bracket 23, and the concave surface of the L-shaped groove of the bracket includes The “-” surface 231 parallel to the first surface of the substrate 22 and the “丨” surface 232 perpendicular to the first surface of the substrate 22. Wherein, the first surface of the cover plate 24 is in contact with the "-" surface 231 of the L-shaped groove of the bracket 23, and forms a sealed space with the base plate 22 and the bracket 23 to seal the optical device 21. As a result, it is possible to prevent dust from outside from falling on the optical device 21 and affecting the photosensitive effect of the optical device 21.

When the electromagnetic shielding structure of the package component is specifically set, in order to improve the shielding effect of the package component, the electromagnetic shielding layer can also be provided on both the "—" surface 231 and the "丨" surface 232 of the L-shaped groove of the bracket 23, and The electromagnetic shielding layer on the "-" surface 231 and the "丨" surface 232 of the L-shaped groove of the bracket 23 is connected to the ground pad of the substrate, which further improves the shielding performance.

In order to further improve the shielding performance of the package assembly, a conductive adhesive 3 can be provided at the contact position between the first surface of the cover plate 24 and the "-" surface 231 of the L-shaped groove of the bracket 23, and the sealing cover plate 24 and the bracket 23 At the same time, the electromagnetic shielding layer provided on the first surface of the cover plate is electrically connected to the electromagnetic shielding layer 2 provided on the bracket 23 through the conductive adhesive 3, thereby achieving grounding and further improving the shielding performance.

In another embodiment of the present application, the electromagnetic shielding layer may also be provided only on the second surface of the cover plate 24. In this case, the electromagnetic shielding layer provided on the second surface of the cover plate and the L-shaped groove provided in the bracket The electrical connection structure of the electromagnetic shielding layer 2 on the surface should be adjusted.

FIG. 8 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer. As shown in Figure 8, the second surface of the cover plate 24 is provided with an electromagnetic shielding layer 2, and the contact position between the first surface of the cover plate 24 and the "-" surface 231 of the L-shaped groove of the bracket is provided with a conductive adhesive 3, and the cover A metalized via 4 is provided on the board 24. One end of the metalized via 4 is electrically connected to the electromagnetic shielding layer on the second surface of the cover plate, and the other end is connected to the “-” surface 231 of the L-shaped groove of the bracket 23. The conductive adhesive 3 is electrically connected, so that the electromagnetic shielding layer provided on the first surface of the cover plate 24 is electrically connected to the electromagnetic shielding layer 2 provided on the support through the metalized via 4 and the conductive adhesive 3 in turn, to achieve The grounding is improved, and the shielding performance is further improved. When specifically setting the metalized via hole, the via hole can be processed on the glass cover plate by laser processing or sandblasting, and then conductive metal is filled in the via hole by hole filling electroplating method to form the metalized via hole.

FIG. 9 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer. As shown in Figure 9, the second surface of the cover plate 24 is provided with an electromagnetic shielding layer 2. The cover plate 24 also includes a side surface connecting the first surface of the cover plate and the second surface of the cover plate. An electromagnetic shielding layer 2 is provided, and the side surface is in contact with the "丨" surface 232 of the L-shaped groove of the bracket, and a conductive adhesive is provided between the side surface of the cover plate 24 and the "丨" surface 232 of the L-shaped groove of the bracket 3, so that the electromagnetic shielding layer provided on the first surface of the cover plate 24 is electrically connected to the electromagnetic shielding layer 2 provided on the bracket through the electromagnetic shielding layer and the conductive adhesive 3 provided on the side of the cover plate 24 in turn to achieve The grounding is improved, and the shielding performance is further improved. When the conductive adhesive is specifically set up, the same process can be used to form an electromagnetic shielding layer on the first surface and the side surface of the cover plate 24, and then the cover plate 24 is buckled on the bracket 23, and the side surface of the cover plate 24 and A conductive adhesive 3 is arranged between the brackets 23.

Among them, the material of the conductive adhesive can be, for example, conductive glue, solder, nano-silver, etc. The conductive adhesive may be composed of a resin matrix, conductive filler, etc., for example. The material of the resin matrix may be, for example, epoxy resin, acrylic resin, polychloride, etc. The conductive filler can be, for example, powder of gold, silver, copper, aluminum, zinc, iron, nickel, graphite and some conductive compounds. When in use, the conductive glue can be applied to the first surface of the cover and/or the second surface of the cover and the contact surface of the support, and then the cover is covered on the support, and the conductive glue is cured. Seal the cover and the bracket together. At the same time, after the conductive adhesive is cured and dried, the conductive fillers are connected to each other in a chain shape, showing conductivity, which can connect the shielding structure on the first surface of the cover plate and the shielding layer on the concave surface of the L-shaped groove of the bracket together, thereby making The shielding structure on the first surface of the cover plate and the shielding layer on the bracket are connected to the grounding pad of the substrate, thereby realizing the full shielding of the package assembly.

When using solder as the conductive adhesive layer, the solder can be melted first, so that the solder flows to the position to be soldered between the cover plate and the bracket, and the cover plate and the bracket are electrically connected together.

The bonding method of the conductive adhesive layer made of nano-silver material can refer to the bonding of the conductive adhesive layer made of solder material.

FIG. 10 is a schematic diagram of another structure of the package assembly in FIG. 2 provided with an electromagnetic shielding layer. As shown in FIG. 10, for example, an electromagnetic shielding layer can also be covered on the inner side of the bracket 23 for enclosing the enclosed space, so as to avoid the horizontal interaction between the packaged devices arranged in the bracket and the enclosed space. Interference also avoids to a certain extent the electromagnetic interference of the packaged device arranged in the substrate to the packaged device arranged on the substrate, and improves the shielding performance of the package assembly.

It should be understood that the enclosed space that the bracket 23 cooperates with the cover 24 and the base plate 22 to enclose the optical device 21 is a specific structure shown in FIG. 1. In the embodiment of the present application, other methods may also be used. The optical device 21 is sealed to improve the working environment of the optical device 21 and prevent dust from contaminating the optical device 21. However, no matter what the sealing method, the above-mentioned electromagnetic shielding structure is provided on the package assembly.

The above description only takes the first surface and the second surface of the cover plate 24 as an example. Of course, the electromagnetic shielding layer can also be provided on the first surface and the second surface of the cover plate at the same time, and the electromagnetic shielding layer can be provided on the first surface and the second surface of the cover plate. The electromagnetic shielding layer on the surface and the second surface is electrically connected to the electromagnetic shielding layer on the concave surface of the L-shaped groove of the bracket through the conductive adhesive, so that the electromagnetic shielding layer is provided on the first surface and the second surface of the cover plate Conduction with the ground pad of the substrate improves the shielding performance of the package assembly. In the embodiment of the present application, the manner of providing the electromagnetic shielding layer on the first surface and the second surface of the cover plate 24 at the same time is not specifically described here, and these all fall within the protection scope of the present application.

In the package assembly provided by the embodiments of the present application, the cover plate and the bracket are connected together through a conductive adhesive, so that the shielding structure of the cover plate and the shielding structure of the bracket are connected, and are connected to the ground pad of the substrate, thereby realizing the package assembly Of full shielding.

In addition, FIG. 11 also provides a packaging component. As shown in FIG. 11, the cover plate 24 is directly covered on the bracket 23, and the cover plate 24 is flush with the outer edge of the bracket 23, and the rest of the structure is the same as that of FIG. In order to avoid electromagnetic interference, an electromagnetic shielding layer can be provided on the surface of the support 23 in contact with the outside, the side surface of the substrate 22, and the first area of the first surface of the cover 24, and the electromagnetic shielding layer can be grounded to the substrate 22. The disk is turned on, so that the packaged device (20, 21) is in the shielding area formed by the electromagnetic shielding layer and the grounding pad on the substrate 22.

In addition, the bracket 23 includes a first surface that is in contact with the cover plate 24, and an electromagnetic shielding layer 2 may be provided on the first surface of the bracket 23, and a conductive adhesive may be provided between the first surface of the bracket 23 and the cover plate 24. The electromagnetic shielding layer provided on the first surface of the cover plate 24 is electrically connected to the electromagnetic shielding layer 2 provided on the first surface of the bracket through the conductive adhesive 3, thereby achieving grounding and further improving the shielding performance.

The embodiment of the application also provides an electronic device. FIG. 12 is a schematic structural diagram of the electronic device provided by the embodiment of the application. As shown in FIG. 12, the electronic device includes a PCB board 10 and the above-mentioned packaging assembly. The ground pad of the component is soldered on the PCB board 10. Wherein, the PCB board 10 may be a common printed circuit board.

When the package component is specifically set, the package component is located on a surface of the PCB board 10 and is fixedly connected to the PCB board 10. The placement direction of the package component shown in FIG. 12 is taken as the reference direction. When the package component is set, the package component It is located on the first surface of the PCB board 10 and is fixedly connected to the PCB board 10 through solder balls or pads. It should be understood that the soldering between the package assembly and the PCB board 10 shown in FIG. 10 is only a specific implementation In the embodiment of the present application, other connection methods can also be used for connection, which will not be repeated here.

Of course, when setting up a mobile electronic device, for example, the PCB board 10 is also provided with other separate electrical components, and the electrical components are provided on the first surface of the PCB board 10. In specific settings, the electrical components can be separated from the package assembly. Electrically active devices and optical devices in the connection.

Although the application has been described in combination with specific features and embodiments, it is obvious that various modifications and combinations can be made without departing from the spirit and scope of the application. Accordingly, this specification and drawings are merely exemplary descriptions of the application defined by the appended claims, and are deemed to have covered any and all modifications, changes, combinations or equivalents within the scope of the application. Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. In this way, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application also intends to include these modifications and variations.

Claims

A packaging component, characterized in that the packaging component comprises: a substrate, a packaged device, a support and a cover plate,

The substrate includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface, the packaged device is located on the first surface of the substrate, and the support is located on the The first surface of the substrate surrounds the packaged device;

The first surface of the substrate, the cover plate and the bracket form a closed space, and the packaged device is contained in the closed space;

Wherein, a grounding pad is provided on the second surface of the substrate, and the cover plate includes: a first area;

An electromagnetic shielding layer is provided on the surface of the support in contact with the outside, the side surface of the substrate, and the first area, and the electromagnetic shielding layer of the first area passes through the electromagnetic shielding on the support and the substrate The layer is electrically connected to the ground pad.
The package assembly according to claim 1, wherein the electromagnetic shielding layer is a transparent shielding film, a metal shielding film, or a shielding adhesive film.
The package assembly according to claim 2, wherein the packaged device comprises an optical device, the cover plate further comprises a second area for light transmission, and the second area is where the optical device is located. For the area covered by the viewing angle range on the cover plate, the first area is an area outside the second area on the cover plate.
The package assembly of claim 3, wherein the cover plate is a transparent plate, and the second area is covered with the transparent shielding film.
The package assembly according to any one of claims 2 to 4, wherein the material of the transparent shielding film is: indium tin oxide.
The package assembly according to claim 2, wherein the packaged device comprises a pressure sensor and a humidity sensor, the cover plate is provided with vent holes, and the first area is the vent hole on the cover plate. The area outside the hole.
The package assembly of claim 6, wherein the material of the cover plate is metal or glass.
The package assembly according to any one of claims 2-7, wherein the metal shielding film comprises: an adhesion layer and a shielding metal layer, the adhesion layer covering the surface of the bracket in contact with the outside, On the side surface of the substrate and the surface of the first region, the shielding metal layer is disposed on the adhesion layer.
8. The package assembly of claim 8, wherein the adhesive layer is made of titanium, and the shielding metal layer is made of copper.
The package assembly according to claim 8 or 9, wherein the electromagnetic shielding layer further comprises: an anti-oxidation layer, and the anti-oxidation layer is provided on the shielding metal layer.
The package assembly of claim 10, wherein the material of the anti-oxidation layer is stainless steel.
The package assembly according to any one of claims 2-11, wherein the shielding adhesive film is epoxy colloid doped with ferromagnetic particles.
The package assembly according to any one of claims 1-12, wherein the bracket is provided with an L-shaped groove for supporting the cover plate on a side close to the cover plate, and the cover plate is covered with On the L-shaped groove of the bracket, the concave surface of the L-shaped groove of the bracket is covered with the electromagnetic shielding layer.
The package assembly of claim 13, wherein the cover plate is bonded to the concave surface of the L-shaped groove of the bracket through a conductive adhesive.
The package assembly according to any one of claims 1-14, wherein the inner side of the bracket for enclosing the enclosed space is covered with the electromagnetic shielding layer.
The package assembly according to any one of claims 1-15, wherein the packaged device further comprises: an electrical device, and the electrical device is located in the support or the substrate.
An electronic device, characterized in that the electronic device comprises a PCB board and the package assembly according to any one of claims 1-16, and the ground pad of the package assembly is soldered on the PCB board.