CN213638363U - Camera substrate assembly, camera unit, and connection structure between lens barrel base part and sensor substrate of camera unit - Google Patents

Camera substrate assembly, camera unit, and connection structure between lens barrel base part and sensor substrate of camera unit Download PDF

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Publication number
CN213638363U
CN213638363U CN201990000554.8U CN201990000554U CN213638363U CN 213638363 U CN213638363 U CN 213638363U CN 201990000554 U CN201990000554 U CN 201990000554U CN 213638363 U CN213638363 U CN 213638363U
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China
Prior art keywords
circuit board
multilayer circuit
gnd
camera
lens barrel
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CN201990000554.8U
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Chinese (zh)
Inventor
秦野敏信
斋藤诚
中村健
竹下量史
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Panasonic Automotive Systems Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/16—Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers, or for use with projectors, e.g. objectives for projection TV
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model relates to a camera base plate subassembly, camera unit's lens cone base portion and sensor substrate's connection structure. The camera substrate assembly includes: a 1 st multilayer circuit board and a 2 nd multilayer circuit board which are arranged so as to face each other; and a 1 st flexible cable connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board. The 1 st multilayer circuit board and the 2 nd multilayer circuit board each have a GND plane in the surface layer and/or the inner layer. Electronic components and circuit wiring, which are sources of noise in the radiated electromagnetic field, are disposed on the surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board facing each other.

Description

Camera substrate assembly, camera unit, and connection structure between lens barrel base part and sensor substrate of camera unit
Technical Field
The utility model relates to a camera base plate subassembly, camera unit's lens cone base portion and sensor substrate's connection structure and connection method.
Background
In recent years, in the field of automobiles, development of sensing technology for realizing automatic driving is under active conditions. Naturally, it is desirable that a camera, which is a typical image information input device in a sensor device, is small, and that the camera can be mounted in a free arrangement where vehicle design is important without considering the installation distance and direction with other electronic devices and antenna devices when the camera is mounted in a vehicle.
Patent document 1 describes an example of a camera unit. The camera for mounting a substrate described in patent document 1 includes: a light receiving element including a light receiving element having a light receiving portion in which pixels for performing photoelectric conversion are arranged, the light receiving element being mounted on a circuit board (corresponding to the sensor board); a lens unit including a lens for forming an optical image on a light receiving portion of the light receiving unit; and a fixing member that fixes the lens unit to the circuit board in a state where the lens is aligned with respect to the light receiving portion of the sensor.
On the other hand, in a video camera image signal transmission system, a conversion from an analog video signal output system to a high-speed serial digital signal output system capable of stably outputting high-definition image information is underway, and in a video camera application system, a low-noise and noise-tolerant design in a high-frequency region of a circuit for realizing high-speed digital data transmission is becoming more important. In addition, as the size of the camera is reduced, it is becoming more important to take measures against heat caused by actual operation of the circuit, which increases the internal temperature of the camera, in accordance with the design of low noise and noise resistance.
Among electronic devices including a camera, for example, an electronic device described in patent document 2 is known as an electronic device that can achieve a thermal countermeasure against a temperature rise in the device and a low-noise and noise-resistant design. In the electronic device described in patent document 2, a noise generating component, a heat generating component, or both of them are mounted on at least one of a pair of circuit boards disposed to face each other, a metal plate having a shape covering at least the noise generating component, the heat generating component, or both of them is disposed between the pair of circuit boards, GND (ground) connection terminals provided on the respective circuit boards are connected at arbitrary positions of the metal plate, and a frame holding both circuit boards at a substantially constant interval is provided between the pair of circuit boards. The metal plate is arranged between a circuit substrate and the frame. In addition, a hole through which the GND connecting terminal passes is formed in the frame at a position facing the GND connecting terminal provided on the other circuit board.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 3932802
Patent document 2: japanese patent No. 4844883
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
However, in the board-mounted camera described in patent document 1, electromagnetic field noise radiated from the light receiving element leaks to the outside of the device, and affects other electronic devices present in the periphery. Further, since there is no structure for efficiently releasing heat generated in the circuit board to the outside, the operation quality in a high-temperature environment cannot be obtained.
In the electronic device described in patent document 2, noise shielding between the circuit boards is performed by connecting the metal plates between the pair of circuit boards to the GND of the circuit board, but the electromagnetic field noise that leaks to the outside of the device is not suppressed, and the influence of the electromagnetic field noise is exerted on other electronic devices present in the surroundings, as in the case of the substrate mounting camera described in patent document 1.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a connection structure and a connection method for a lens barrel base portion and a sensor substrate of a camera unit, which can minimize leakage of electromagnetic field noise radiated from a light receiving element to the outside of the device and can efficiently release heat generated in a circuit substrate to the outside.
Means for solving the problems
The utility model discloses a camera base plate subassembly includes: a 1 st multilayer circuit board and a 2 nd multilayer circuit board which are arranged so as to face each other; and a 1 st flexible cable connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board, wherein the 1 st multilayer circuit board and the 2 nd multilayer circuit board each have a GND plane on a surface layer and/or an inner layer, and electronic components and circuit wiring which are sources of radiation electromagnetic field noise are arranged on surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board facing each other.
According to the above configuration, the GND plane of the 1 st multilayer circuit board and the GND plane of the 2 nd multilayer circuit board are connected by the 1 st flexible cable, and the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board are the same. This can suppress the generation of electromagnetic field noise radiated from the substrate assembly due to variation between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board. Further, since the electronic component and the circuit wiring disposed between the 1 st multilayer circuit board and the 2 nd multilayer circuit board are shielded in at least three directions by the GND surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board and the 1 st flexible cable connected to the GND, electromagnetic field radiation noise from the electronic component and the circuit wiring to the outside can be suppressed, and also electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic component and the circuit wiring and affecting the electronic component and the circuit wiring. Therefore, a camera substrate assembly having low noise and excellent noise resistance can be obtained, and a small camera unit that can be freely installed in a vehicle can be realized.
In the above configuration, a GND spring contact member or an elastic GND pad for connecting GND of the 1 st multilayer circuit board and GND of the 2 nd multilayer circuit board is disposed at a position on an end side of the electronic component and the circuit wiring which are noise sources of the radiation electromagnetic field in the surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board facing each other.
According to the above configuration, the GND contacts near the end edges of the 1 st multilayer circuit board and the 2 nd multilayer circuit board are connected by the GND spring contact members or the elastic GND pads, so that the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board are the same, and the variation between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board is suppressed more effectively. This can improve the effect of suppressing the generation of electromagnetic field noise radiated from the substrate assembly due to variation between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board. In addition, it is also realized that the electronic components and circuit wiring disposed between the 1 st multilayer circuit board and the 2 nd multilayer circuit board are shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board, the 1 st flexible cable connected to GND, and the GND spring contact member or the elastic GND pad. Therefore, the low noise and noise resistance performance can be further improved.
In the above configuration, an input/output connector is disposed on a surface of the 1 st multilayer circuit board opposite to the 2 nd multilayer circuit board, and an image sensor is disposed on a surface of the 2 nd multilayer circuit board opposite to the 1 st multilayer circuit board.
The utility model discloses a camera base plate subassembly includes: a 1 st multilayer circuit board and a 2 nd multilayer circuit board which are arranged so as to face each other; a 3 rd multilayer circuit board disposed so as to face the 2 nd multilayer circuit board on a side opposite to the 1 st multilayer circuit board; a 1 st flexible cable connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board; and a 2 nd flexible cable connecting the GND of the 2 nd multilayer circuit board and the GND of the 3 rd multilayer circuit board, wherein the 1 st multilayer circuit board and the 3 rd multilayer circuit board each have a GND plane on a surface layer and/or an inner layer, and electronic components and circuit wiring which are sources of radiation electromagnetic field noise are arranged on surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board facing the 2 nd multilayer circuit board.
According to the above configuration, the GND plane of the 1 st multilayer circuit board and the GND plane of the 2 nd multilayer circuit board are connected by the 1 st flexible cable, and the GND plane of the 2 nd multilayer circuit board and the GND plane of the 3 rd multilayer circuit board are connected by the 2 nd flexible cable, so that the GND potentials of the 1 st multilayer circuit board, the 2 nd multilayer circuit board, and the 3 rd multilayer circuit board are the same. Thus, the generation of radiation electromagnetic field noise from the substrate assembly due to variation between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board and variation between the GND potentials of the 2 nd multilayer circuit board and the 3 rd multilayer circuit board can be suppressed. Further, since the electronic component and the circuit wiring disposed between the 1 st multilayer circuit board and the 2 nd multilayer circuit board are shielded in at least three directions by the GND surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board and the 1 st flexible cable connected to the GND, electromagnetic field radiation noise from the electronic component and the circuit wiring to the outside can be suppressed, and also electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic component and the circuit wiring and affecting the electronic component and the circuit wiring. Similarly, since the electronic component and the circuit wiring disposed between the 2 nd multilayer circuit board and the 3 rd multilayer circuit board are also shielded in at least three directions by the GND surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board and the 2 nd flexible cable connected to GND, electromagnetic field radiation noise from the electronic component and the circuit wiring to the outside can be suppressed, and also electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic component and the circuit wiring and affecting the electronic component and the circuit wiring. Therefore, a camera substrate assembly having low noise and excellent noise resistance can be obtained, and a small camera unit that can be freely installed in a vehicle can be realized.
In the above configuration, a GND spring contact member or an elastic GND pad for connecting GND of the 1 st multilayer circuit board and GND of the 2 nd multilayer circuit board is disposed at a position on the edge side of the electronic component and the circuit wiring, which are the noise source of the radiation electromagnetic field, on the surface of the 1 st multilayer circuit board facing the 2 nd multilayer circuit board, and a GND spring contact member or an elastic GND pad for connecting GND of the 3 rd multilayer circuit board and GND of the 2 nd multilayer circuit board is disposed at a position on the edge side of the electronic component and the circuit wiring, which are the noise source of the radiation electromagnetic field, on the surface of the 3 rd multilayer circuit board facing the 2 nd multilayer circuit board.
According to the above configuration, the GND contacts near the end edges of the 1 st multilayer circuit board and the 2 nd multilayer circuit board are connected to each other by the GND spring contact members or the elastic GND pads, and the GND contacts near the end edges of the 2 nd multilayer circuit board and the 3 rd multilayer circuit board are connected to each other, so that the GND potentials of the 1 st multilayer circuit board, the 2 nd multilayer circuit board, and the 3 rd multilayer circuit board are the same, and the variation between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board and the variation between the GND potentials of the 2 nd multilayer circuit board and the 3 rd multilayer circuit board are more effectively suppressed. This can improve the effect of suppressing the generation of electromagnetic field noise radiated from the substrate assembly due to variations between the GND potentials of the 1 st multilayer circuit board and the 2 nd multilayer circuit board and variations between the GND potentials of the 2 nd multilayer circuit board and the 3 rd multilayer circuit board. Further, it is realized that the electronic components and the circuit wiring disposed between the 1 st multilayer circuit board and the 2 nd multilayer circuit board are shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board, the 1 st flexible cable and the GND spring contact member connected to the GND, or the elastic GND pad, and the electronic components and the circuit wiring disposed between the 2 nd multilayer circuit board and the 3 rd multilayer circuit board are also shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board, the 2 nd flexible cable and the GND spring contact member connected to the GND, or the elastic GND pad. Therefore, the low noise and noise resistance performance can be further improved.
In the above configuration, an input/output connector is disposed on a surface of the 1 st multilayer circuit board opposite to the 2 nd multilayer circuit board, and an image sensor is disposed on a surface of the 3 rd multilayer circuit board opposite to the 2 nd multilayer circuit board.
The utility model discloses a camera unit includes the camera base plate subassembly of above-mentioned structure and accomodates the shield shell of camera base plate subassembly.
According to the above configuration, since the outside of the camera substrate assembly is covered with the shield case, low noise and noise resistance can be further improved.
In the connection structure of the lens barrel base part and the sensor substrate of the camera unit of the present invention, the camera unit includes: a light receiving element including a light receiving element having a light receiving section in which pixels for performing photoelectric conversion are arranged, the light receiving element being mounted on the sensor substrate; a lens barrel including a lens for forming an optical image on the light receiving portion of the light receiving element; and a lens barrel base portion that supports the lens barrel, surrounds the light receiving element with a substantially cylindrical metal shield GND member provided with an opening portion for introducing light transmitted through the lens barrel to the light receiving element and an end portion connected to the GND portion of the sensor substrate, and connects the sensor substrate and the lens barrel base portion to each other.
According to the above configuration, since the electromagnetic field noise radiated from the light receiving element is absorbed by the GND potential of the metal shield GND member, the influence on the surrounding electronic devices can be minimized, and the low noise performance can be improved. Further, since the sensor substrate and the lens barrel base portion are connected by the metal shield GND member, heat generated in the sensor substrate can be released to the lens barrel base portion side which is in contact with the outside air, and the operation quality in a high-temperature environment can be improved. Further, since the lens barrel base portion is not directly connected to the sensor substrate, the effective area for mounting the electrical components on the sensor substrate can be increased. This can alleviate restrictions on the arrangement and wiring of the electrical components, minimize the wiring of the sensor substrate, and optimize the GND pattern.
In the above structure, the outer peripheral shape of the metal shield GND member is circular or quadrangular, and the shape of the opening portion is circular or quadrangular.
According to the above configuration, the shape of the light receiving element and the component mounting state of the sensor substrate can be matched, and the sensor substrate can be effectively used. For example, when the outer peripheral shape of the light receiving element is circular, the outer peripheral shape of the metal shield GND member is circular in accordance with the outer peripheral shape.
In the above configuration, the opening of the metal shield GND member has a size that blocks an optical path other than an optical path of an effective pixel toward the light receiving unit of the light receiving element.
According to the above configuration, light incident on the light receiving unit of the light receiving element other than the effective pixels can be blocked.
In the above configuration, the opening-side flat surface portion of the metal shield GND member has a larger area than the end portion connected to the GND portion of the sensor substrate and a larger area of contact with the lens barrel base portion.
According to the above configuration, by minimizing the size of the opening of the metal shield GND member within a necessary range, the area of the flat surface portion of the metal shield GND member can be increased, and heat generated in the sensor substrate can be efficiently released to the lens barrel base portion side.
In the above structure, the metal shield GND member is connected to the GND part of the sensor substrate by reflow soldering.
According to the above configuration, since the metal shield GND member is mounted on the sensor substrate simultaneously with the mounting of the electrical component on the sensor substrate, man-hours can be reduced as compared with a case where only the metal shield GND member is mounted separately from the mounting of the electrical component.
In the above structure, the metallic shield GND member is a one-piece monocoque structure obtained by an extrusion processing method from a flat plate of metal.
According to the above configuration, the metal shield GND member can be easily and inexpensively manufactured.
In the above structure, the metal shield GND member has a single-piece structure or a combined structure of two or more pieces obtained by bending a flat metal plate.
According to the above configuration, the metal shield GND member can be easily and inexpensively manufactured.
In the above configuration, the lens barrel base portion has a ferrule having a hollow portion with a size substantially equal to that of the opening portion of the metal shield GND member on a surface side opposite to the opening side of the metal shield GND member.
According to the above configuration, heat generated in the sensor substrate can be efficiently released to the lens barrel side.
In the connection method of the lens barrel base part and the sensor substrate of the camera unit of the present invention, the camera unit includes: a light receiving element including a light receiving element having a light receiving section in which pixels for performing photoelectric conversion are arranged, the light receiving element being mounted on the sensor substrate; a lens barrel including a lens for forming an optical image on the light receiving portion of the light receiving element; and a lens barrel base portion that supports the lens barrel, and that attaches a substantially cylindrical metal shield GND member, which is provided with an opening for introducing light transmitted through the lens barrel to the light receiving element and an end portion connected to the GND portion of the sensor substrate, to the sensor substrate so as to surround the light receiving element, and that further connects the sensor substrate and the lens barrel base portion via the metal shield GND member.
According to the above method, since the electromagnetic field noise radiated from the light receiving element is absorbed by the GND potential of the metal shield GND member, the influence on the surrounding electronic devices can be minimized, and the low noise performance can be improved. Further, since the sensor substrate and the lens barrel base portion are connected by the metal shield GND member, heat generated in the sensor substrate can be released to the lens barrel base portion side which is in contact with the outside air, and the operation quality in a high-temperature environment can be improved. Further, since the lens barrel base portion is not directly connected to the sensor substrate, the effective area for mounting the electrical components on the sensor substrate can be increased. This can alleviate restrictions on the arrangement and wiring of the electrical components, minimize the wiring of the sensor substrate, and optimize the GND pattern.
Effect of the utility model
According to the present invention, leakage of electromagnetic field noise radiated from the light receiving element to the outside of the device can be minimized, and heat generated in the circuit board can be efficiently released to the outside. That is, it is possible to provide a camera unit that can achieve both low noise performance and excellent heat resistance performance.
Drawings
Fig. 1 is a sectional view of a camera substrate assembly of embodiment 1.
Fig. 2 is a cross-sectional view of a camera unit including the camera substrate assembly shown in fig. 1.
Fig. 3 is a diagram for explaining a shielding effect of electromagnetic field radiation noise of the camera substrate assembly shown in fig. 1.
Fig. 4 is a sectional view of the camera substrate assembly of embodiment 2.
Fig. 5A is a sectional view of the camera unit of embodiment 1.
Fig. 5B is a graph showing a spectrum of a radiation electromagnetic field measured in the vicinity of the camera unit of embodiment 1 (an antenna is provided in a horizontal direction).
Fig. 5C is a graph showing a spectrum of a radiation electromagnetic field measured in the vicinity of the camera unit of embodiment 1 (an antenna is provided in the vertical direction).
Fig. 6A is a sectional view of the camera unit of embodiment 2.
Fig. 6B is a graph showing a spectrum of a radiation electromagnetic field measured in the vicinity of the camera unit of embodiment 2 (an antenna is provided in the horizontal direction).
Fig. 6C is a graph showing a spectrum of a radiation electromagnetic field measured in the vicinity of the camera unit of embodiment 2 (an antenna is provided in the vertical direction).
Fig. 7A is a sectional view of a camera unit of a comparative example.
Fig. 7B is a graph showing a spectrum of a radiation electromagnetic field measured in the vicinity of the camera unit of the comparative example (an antenna is provided in the horizontal direction).
Fig. 7C is a graph showing a spectrum of a radiated electromagnetic field measured in the vicinity of the camera unit of the comparative example (an antenna is provided in the vertical direction).
Fig. 8 is a sectional view showing the structure of the camera unit according to embodiment 3 of the present invention.
Fig. 9A to 9C are diagrams showing various forms of the metal shield GND member used in the camera unit of fig. 8.
Fig. 10 is a sectional view showing the structure of the camera unit according to embodiment 4 of the present invention.
Fig. 11 is a plan view showing an example of a ferrule used in the camera unit of fig. 10.
Fig. 12 is a sectional view showing the structure of the camera unit according to embodiment 5 of the present invention.
Fig. 13 is a sectional view showing a structure of a camera using the camera unit of fig. 8.
Detailed Description
Specific examples of the embodiments will be described below in detail with reference to the drawings. In the drawings, the same reference numerals are given to components having the same functions, and detailed description of the components having the same reference numerals will not be repeated.
(embodiment 1)
Fig. 1 is a sectional view of a camera substrate assembly 10 of embodiment 1. Fig. 2 is a cross-sectional view of the camera unit 40 including the camera substrate assembly 10 shown in fig. 1.
As shown in fig. 2, the camera unit 40 of the present embodiment includes: a lens 45; a housing 43; a camera substrate assembly 10 disposed inside the housing 43; a spacer 42 disposed between the camera substrate assembly 10 and the lens 45; a shield case 41 that houses the camera substrate assembly 10; and a housing cover 44 that covers the housing 43.
The housing 43 is made of, for example, resin and has a cylindrical shape. The spacer 42 is provided at the bottom of the case 43, and the camera substrate assembly 10 housed in the case 43 is supported by the spacer 42.
The housing-side shield connector 46 is provided to the housing cover 44 so as to penetrate the housing cover 44. When the housing cover 44 is attached to the opening of the housing 43, the housing-side shield connector 46 provided in the housing cover 44 is electrically connected to the substrate-side shield connector 26 provided in the camera substrate assembly 10.
The shield case 41 covering the camera substrate assembly 10 is made of metal such as aluminum or copper, and is electrically connected to the shield conductor of the housing-side shield connector 46 to have GND potential.
As shown in fig. 1, the camera substrate assembly 10 of embodiment 1 has a 1 st flexible cable 15 and a 1 st multilayer circuit substrate 11 and a 2 nd multilayer circuit substrate 12 arranged in a manner to face each other.
The 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 each have a GND plane (GND plane) on the surface layer and/or the inner layer. The 1 st flexible cable 15 is disposed outside the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12, and connects the GND of the 1 st multilayer circuit board 11 and the GND of the 2 nd multilayer circuit board 12.
In actual electrical operation, since a resistance component is present in the GND pattern, the GND potential varies due to the operating current. When electronic components different from each other are mounted on the two substrates, the operating currents in the two substrates are different from each other, and the GND potentials also vary from each other. Further, there is a possibility that radiation electromagnetic field noise is generated due to variation between GND potentials of the two substrates.
In contrast, in the present embodiment, the GND plane of the 1 st multilayer circuit board 11 and the GND plane of the 2 nd multilayer circuit board 12 are electrically connected by the 1 st flexible cable 15, and the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 become the same potential. This can suppress the generation of electromagnetic field noise radiated from the substrate assembly 10 due to variation between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12.
As shown in FIG. 1, electronic components 21 to 25, 31 to 34 and circuit wiring (not shown) having a relatively large current change Δ i and serving as a noise source of a radiation electromagnetic field are arranged on the surfaces of a 1 st multilayer circuit board 11 and a 2 nd multilayer circuit board 12 facing each other.
In the illustrated example, the coil 21, the bypass capacitor 22, the resistor 23 on the signal line, and the IC components 24 and 25, which have a relatively large current change Δ i, are disposed on the surface of the 1 st multilayer circuit board 11 facing the 2 nd multilayer circuit board 12. The coil 27, the bypass capacitor 28, and the resistor 29, which are relatively small in current change Δ i, may be disposed on the surface of the 1 st multilayer circuit board 11 opposite to the 2 nd multilayer circuit board 12.
Similarly, on the surface of the 2 nd multilayer circuit board 12 facing the 1 st multilayer circuit board 11, a coil 31, a bypass capacitor 32, a resistor 33 on a signal line, and an image signal processor 34, which have relatively large current changes Δ i, are disposed. The resistors 36 and 37 having relatively small current change Δ i may be disposed on the surface of the 2 nd multilayer circuit board 12 opposite to the 1 st multilayer circuit board 11.
Fig. 3 is a diagram for explaining the shielding effect of electromagnetic field radiation noise of the camera substrate assembly 10 according to the present embodiment. In fig. 3, the electronic components other than the electronic components denoted by reference numerals 21, 24, 31, and 34 among the electronic components 21 to 25 and 31 to 34 serving as noise sources of the radiation electromagnetic field are not shown.
As shown in fig. 3, in the present embodiment, the electronic components 21, 24, 31, 34 and the circuit wiring disposed between the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are shielded in at least three directions (up, down, and right directions in fig. 3) by the GND plane of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and the 1 st flexible cable 15 connected to the GND. Therefore, electromagnetic field radiation noise radiated from the electronic components 21, 24, 31, and 34 and the circuit wiring is absorbed by the GND surfaces of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and the 1 st flexible cable 15, and leakage to the outside of the camera substrate assembly 10 is suppressed. In addition, electromagnetic field radiation noise radiated from an external device toward the camera substrate assembly 10 is also absorbed by the GND plane of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and the 1 st flexible cable 15, and reaches the electronic components 21, 24, 31, and 34 and the circuit wiring, thereby suppressing the influence thereof.
In the present embodiment, as shown in fig. 1, GND spring contact members or elastic GND pads 61 for connecting the GND of the 1 st multilayer circuit board 11 and the GND of the 2 nd multilayer circuit board 12 are disposed at positions on the sides of the electronic components 21 to 25, 31 to 34 and circuit wiring (not shown) which are noise sources of the radiation electromagnetic field on the surfaces of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 facing each other. In the illustrated example, the GND spring contact member or the elastic GND pad 61 is arranged in a different direction (for example, in the opposite direction) from the 1 st flexible cable 15 when viewed from the center of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12.
The size of the GND spring contact member or the elastic GND pad 61 is not particularly limited, and a plurality of members may be mounted as small-sized members, or may be mounted as long members in a shape surrounding the entire circumference of the multilayer circuit boards 11 and 12. When a plurality of components are mounted as small-sized components, a plurality of GND spring contact members or elastic GND pads 61 may be disposed so as to surround the electronic components 21 to 25, 31 to 34 and circuit wiring (not shown) that are sources of noise in the radiation electromagnetic field over the entire circumference of the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 facing each other. When the GND spring contact member or the elastic GND pad 61 is attached so as to surround the entire circumference of the multilayer circuit boards 11 and 12, the camera board assembly 10 functions as a shield assembly, and therefore the shield case 41 (see fig. 2) attached to the outside of the camera board assembly 10 may be omitted.
As shown in fig. 3, electromagnetic field radiation noise radiated in the left direction in fig. 3 from the electronic components 21, 24, 31, 34 and the circuit wiring disposed between the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 is absorbed by the GND spring contact member or the elastic GND pad 61, and leakage to the outside of the camera substrate assembly 10 is suppressed. In addition, electromagnetic field radiation noise radiated from an external device and incident from the left side in fig. 3 toward the camera substrate assembly 10 is also absorbed at the GND spring contact part or the elastic GND pad 61, and the situation that the electromagnetic field radiation noise reaches the electronic parts 21, 24, 31, 34 and the circuit wiring to affect the electronic parts is suppressed.
As shown in fig. 2, the substrate-side shield connector 26 as an input/output connector is disposed on the surface of the 1 st multilayer circuit board 11 opposite to the 2 nd multilayer circuit board 12, and is electrically connected to the case-side shield connector 46 provided on the case cover 44.
Further, an image sensor 35 is disposed on the surface of the 2 nd multilayer circuit board 12 opposite to the 1 st multilayer circuit board 11. The image sensor 35 is disposed so as to face the lens 45, and light condensed by the lens 45 enters the image sensor 35.
The above-described embodiments will be described in more detail below with reference to examples, but the present embodiments are not limited to the following examples.
First, as embodiment 1, as shown in fig. 5A, a camera unit is prepared in which GND in the vicinity of the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are contact-connected by an elastic GND pad 61, but the outside of the board assembly 10 is not covered by the shield case 41. Then, the spectrum analyzer measures the electromagnetic field spectrum in the vicinity of the camera unit. Fig. 5B is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the horizontal direction, and fig. 5C is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the vertical direction.
In embodiment 2, as shown in fig. 6A, a camera unit is prepared in which GND in the vicinity of the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are contact-connected by an elastic GND pad 61, and the outside of the substrate assembly 10 is covered with a shield case 41. Then, the spectrum analyzer measures the electromagnetic field spectrum in the vicinity of the camera unit. Fig. 6B is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the horizontal direction, and fig. 6C is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the vertical direction.
As a comparative example, as shown in fig. 7A, a camera unit was prepared in which the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 were arranged so as to form a right angle and GND near the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 were not contact-connected by the elastic GND pads 61. Then, the spectrum analyzer measures the electromagnetic field spectrum in the vicinity of the camera unit. Fig. 7B is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the horizontal direction, and fig. 7C is a graph showing the measurement result of the radiated electromagnetic field spectrum when the antenna is installed in the vertical direction.
In fig. 5B to 7C, "AV" represents a curve of average value detection, and "PK" represents a curve of peak value detection.
As for the measurement result of the spectrum of the radiated electromagnetic field when the antenna is disposed in the horizontal direction, comparing the measurement result of example 1 (fig. 5B) with the measurement result of the comparative example (fig. 7B), it is understood that the noise level is significantly reduced in the frequency region of about 100MHz to 200MHz in example 1. Similarly, as for the measurement result of the spectrum of the radiated electromagnetic field when the antenna is provided in the vertical direction, comparing the measurement result of example 1 (fig. 5C) with the measurement result of the comparative example (fig. 7C), it is understood that the noise level is significantly reduced in the frequency region of about 100MHz to 300MHz in example 1.
As for the measurement result of the spectrum of the radiated electromagnetic field when the antenna is disposed in the horizontal direction, comparing the measurement result of example 1 (fig. 5B) with the measurement result of example 2 (fig. 6B), it is understood that the noise level in the frequency region of about 100MHz to 200MHz is further reduced in example 2. Similarly, as for the measurement result of the spectrum of the radiated electromagnetic field when the antenna is provided in the vertical direction, comparing the measurement result of example 1 (fig. 5C) with the measurement result of example 2 (fig. 6C), it is clear that the noise level is also reduced in the frequency region of about 90MHz to 100MHz in example 2.
As described above, according to the present embodiment, the GND plane of the 1 st multilayer circuit board 11 and the GND plane of the 2 nd multilayer circuit board 12 are electrically connected by the 1 st flexible cable 15, and the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 become the same potential. This can suppress the generation of electromagnetic field noise radiated from the substrate assembly 10 due to variation between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12. Further, since the electronic components 21 to 25, 31 to 34 and the circuit wiring disposed between the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are shielded in at least three directions by the GND surfaces of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and the 1 st flexible cable 15 connected to GND, electromagnetic field radiation noise from the electronic components 21 to 25, 31 to 34 and the circuit wiring to the outside can be suppressed, and electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic components 21 to 25, 31 to 34 and the circuit wiring and affecting the same. Therefore, the camera substrate assembly 10 having low noise and excellent noise resistance can be obtained, and a small camera unit that can be freely installed in a vehicle can be realized.
In addition, according to the present embodiment, the GND contacts near the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are connected by the GND spring contact members or the elastic GND pads 61, so that the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 become the same potential, and the variation between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 is more effectively suppressed. This can improve the effect of suppressing the generation of electromagnetic field noise radiated from the substrate assembly 10 due to variation between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12. Further, since the GND spring contact members or the elastic GND pads 61 are arranged at positions closer to the end sides than the electronic components 21 to 25 and 31 to 34 and the circuit wirings, it is also achieved that the electronic components 21 to 25 and 31 to 34 and the circuit wirings are shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12, the 1 st flexible cable 15 connected to GND, and the GND spring contact members or the elastic GND pads 61. Therefore, the low noise and noise resistance performance can be further improved.
Further, according to the present embodiment, since the outside of the camera substrate assembly 10 is covered with the shield case 41, low noise and noise resistance can be further improved.
In addition, various modifications can be made to the above-described embodiments. An example of the modification is described below with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals as those used for corresponding portions of the above-described embodiment may be used for portions that can be configured similarly to the above-described embodiment, and redundant description may be omitted.
(embodiment 2)
Fig. 4 is a sectional view of the camera substrate assembly 100 of embodiment 2.
As shown in fig. 4, the camera substrate assembly 100 according to embodiment 2 includes the 1 st to 3 rd multilayer circuit boards 11 to 13, the 1 st flexible cable 15, and the 2 nd flexible cable 16.
The 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are disposed so as to face each other, and the 3 rd multilayer circuit board 13 is disposed so as to face the 2 nd multilayer circuit board 12 on the side opposite to the 1 st multilayer circuit board 11. That is, the 1 st to 3 rd multilayer circuit boards 11 to 13 are sequentially arranged to be overlapped with a space therebetween.
The 1 st to 3 rd multilayer circuit boards 11 to 13 each have a GND plane (GND plane) on the surface layer and/or the inner layer. The 1 st flexible cable 15 is disposed outside the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12, and connects the GND of the 1 st multilayer circuit board 11 and the GND of the 2 nd multilayer circuit board 12. The 2 nd flexible cable 16 is disposed outside the end edges of the 3 rd multilayer circuit board 13 and the 2 nd multilayer circuit board 12, and connects the GND of the 3 rd multilayer circuit board 13 and the GND of the 2 nd multilayer circuit board 12.
As shown in fig. 4, on the surface of the 1 st multilayer circuit board 11 facing the 2 nd multilayer circuit board 12, a coil 21, a bypass capacitor 22, a resistor 23 on a signal line, and IC components 24 and 25, which have a relatively large current change Δ i and become a noise source of a radiation electromagnetic field, are arranged.
Similarly, on the surface of the 3 rd multilayer circuit board 13 facing the 2 nd multilayer circuit board 12, a coil 51, a bypass capacitor 52, and a resistor 53 on a signal line are arranged, which have a relatively large current change Δ i and become a noise source of a radiation electromagnetic field.
The arrangement of the electronic components and the circuit wiring on the 2 nd multilayer circuit board 12 is not particularly limited, but in the illustrated example, the coil 31, the bypass capacitor 32, the resistor 33 on the signal line, and the IC component 38 are arranged on the surface of the 2 nd multilayer circuit board 12 facing the 1 st multilayer circuit board 11, and the image signal processor 34 is arranged on the surface facing the 3 rd multilayer circuit board 13.
In the present embodiment, as shown in fig. 4, GND spring contact members or elastic GND pads 61 for connecting the GND of the 1 st multilayer circuit board 11 and the GND of the 2 nd multilayer circuit board 12 are disposed at positions on the end sides of the electronic components 21 to 25, 31 to 33, and 38 and circuit wiring (not shown) which are sources of noise in the radiation electromagnetic field on the surfaces of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 facing each other. In the illustrated example, the GND spring contact member or the elastic GND pad 61 is arranged in a different direction (for example, in the opposite direction) from the 1 st flexible cable 15 when viewed from the center of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12.
A plurality of GND spring contact members or elastic GND pads 61 may be arranged so as to surround the electronic components 21 to 25, 31 to 33, and 38 and circuit wiring (not shown) that are sources of radiation electromagnetic field around the entire periphery of the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 facing each other.
Similarly, a GND spring contact member or an elastic GND pad 62 for connecting the GND of the 2 nd multilayer circuit board 12 and the GND of the 3 rd multilayer circuit board 13 is disposed on the side of the facing surfaces of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13 with respect to the electronic components 34, 51 to 53 and circuit wiring (not shown) which are sources of noise in the radiation electromagnetic field. In the illustrated example, the GND spring contact member or the elastic GND pad 62 is arranged in a different direction (for example, in the opposite direction) from the 2 nd flexible cable 16 when viewed from the center of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13.
A plurality of GND spring contact members or elastic GND pads 62 may be arranged so as to surround the electronic components 34, 51 to 53 and circuit wiring (not shown) that are sources of noise in the radiation electromagnetic field over the entire circumference of the end edges of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13 facing each other.
As shown in fig. 4, the substrate-side shield connector 26 as an input/output connector is disposed on the surface of the 1 st multilayer circuit board 11 on the opposite side to the 2 nd multilayer circuit board 12, and when the camera substrate assembly 100 is disposed inside the housing 43 of the camera unit 40, the substrate-side shield connector 26 is electrically connected to the housing-side shield connector 46 provided on the housing cover 44.
Further, an image sensor 35 is disposed on the surface of the 3 rd multilayer circuit board 13 opposite to the 2 nd multilayer circuit board 12. When the camera substrate assembly 100 is disposed inside the housing 43 of the camera unit 40, the image sensor 35 is disposed so as to face the lens 45, and light condensed by the lens 45 enters the image sensor 35.
According to embodiment 2 described above, the GND plane of the 1 st multilayer circuit board 11 and the GND plane of the 2 nd multilayer circuit board 12 are connected by the 1 st flexible cable 15, and the GND plane of the 2 nd multilayer circuit board 12 and the GND plane of the 3 rd multilayer circuit board 13 are connected by the 2 nd flexible cable 16, so that the GND potentials of the 1 st multilayer circuit board 11, the 2 nd multilayer circuit board 12, and the 3 rd multilayer circuit board 13 become the same potential. This can suppress the generation of electromagnetic field noise radiated from the substrate assembly 100 due to variations between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and variations between the GND potentials of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13.
In addition, according to the present embodiment, since the electronic components 21 to 25, 31 to 33, 38 and the circuit wiring disposed between the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are shielded in at least three directions (up, down, and right directions in fig. 4) by the GND surfaces of the 1 st multilayer circuit board 11 and the 3 rd multilayer circuit board 13 and the 1 st flexible cable 15 connected to the GND, electromagnetic field radiation noise from the electronic components 21 to 25, 31 to 33, 38 and the circuit wiring to the outside can be suppressed, and electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic components and the circuit wiring and affecting the electronic components and the circuit wiring.
Similarly, since the electronic components 34, 51 to 53 and the circuit wiring disposed between the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13 are also shielded in at least three directions (up, down, and left directions in fig. 4) by the GND surfaces of the 1 st multilayer circuit board 11 and the 3 rd multilayer circuit board 13 and the 2 nd flexible cable 16 connected to the GND, electromagnetic field radiation noise from the electronic components 34, 51 to 53 and the circuit wiring to the outside can be suppressed, and electromagnetic field radiation noise from an external device can be suppressed from reaching the electronic components 34, 51 to 53 and the circuit wiring and affecting the same. Therefore, the camera substrate assembly 10 having low noise and excellent noise resistance can be obtained, and a small camera unit that can be freely installed in a vehicle can be realized.
Further, according to the present embodiment, the GND contacts near the end edges of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 are connected by the GND spring contact members or the elastic GND pads 61 and 62, and the GND contacts near the end edges of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13 are connected, so that the GND potentials of the 1 st multilayer circuit board 11, the 2 nd multilayer circuit board 12, and the 3 rd multilayer circuit board 13 become the same potential, and the variation between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and the variation between the GND potentials of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13 are more effectively suppressed. This can improve the effect of suppressing the generation of electromagnetic field noise radiated from the substrate assembly 100 due to variations between the GND potentials of the 1 st multilayer circuit board 11 and the 2 nd multilayer circuit board 12 and variations between the GND potentials of the 2 nd multilayer circuit board 12 and the 3 rd multilayer circuit board 13.
In addition, according to the present embodiment, since the GND spring contact members or the elastic GND pads 61 are arranged at positions closer to the end sides than the electronic components 21 to 25, 31 to 33, and 38 and the circuit wirings, the electronic components 21 to 25, 31 to 33, and 38 and the circuit wirings are shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board 11 and the 3 rd multilayer circuit board 13, the 1 st flexible cable 15 connected to the GND, and the GND spring contact members or the elastic GND pads 61. Similarly, since the GND spring contact members or the elastic GND pads 62 are arranged at positions closer to the end sides than the electronic components 34, 51 to 53 and the circuit wirings, the electronic components 34, 51 to 53 and the circuit wirings are shielded in at least four directions by the GND surfaces of the 1 st multilayer circuit board 11 and the 3 rd multilayer circuit board 13, the 2 nd flexible cable 16 connected to GND, and the GND spring contact members or the elastic GND pads 62. This can further improve low noise and noise resistance.
(embodiment 3)
Fig. 8 is a sectional view showing the structure of the camera unit 101 according to embodiment 3 of the present invention. In the figure, a camera unit 101 of the present embodiment includes: a 1 st multilayer circuit substrate (corresponding to the sensor substrate) 102 and a 2 nd multilayer circuit substrate 103 disposed opposite to each other; a flexible cable 104 connecting a GND plane (not shown) of the 1 st multilayer circuit board 102 and a GND plane of the 2 nd multilayer circuit board 103; a light receiving element 105 disposed on an upper surface of the 1 st multilayer circuit board 102 (hereinafter, the upper surface is referred to as an "upper surface" and the opposite surface is referred to as a "lower surface"); a lens barrel 106 including a lens for forming an optical image on a light receiving portion of the light receiving element 105; a lens barrel base part 107 that supports the lens barrel 106; and a metal shield GND member 108 having an opening 108b for introducing light transmitted through the lens barrel 106 to the light receiving element 105, and absorbing noise radiated from the light receiving element 105.
The 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 have GND surfaces (not shown) on the surface layer and/or the inner layer thereof, respectively. On the surfaces of the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 facing each other (the lower surface of the 1 st multilayer circuit board 102 and the upper surface of the 2 nd multilayer circuit board 103), electric components and circuit wiring which are sources of electromagnetic field noise are mounted. In this case, the 1 st multilayer circuit board 102 has the light receiving element 105 mounted on the upper surface side and the electric components and the circuit wiring mounted on the lower surface side. In addition, circuit wiring is also present inside the 1 st multilayer circuit board 102. The 2 nd multilayer circuit board 103 is mounted with electric components and circuit wiring on the upper surface side, and mounted with a substrate-side shield connector 109 on the lower surface side.
The flexible cable 104 connects the GND plane of the 1 st multilayer circuit board 102 and the GND plane of the 2 nd multilayer circuit board 103, and sets the GND potentials of the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 to the same potential. By setting the GND potentials of the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 to the same potential, it is possible to suppress generation of electromagnetic field noise from the electric components and the circuit wiring due to variation between the GND potentials. Further, since the electrical components and the circuit wiring disposed between the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 can be shielded in three directions by the GND surfaces of the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103 and the flexible cable 104 connecting between the GND surfaces of the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103, electromagnetic noise can be suppressed from outside the electrical components and the circuit wiring mounted on the 1 st multilayer circuit board 102 and the 2 nd multilayer circuit board 103, respectively. In addition, it is possible to suppress the electromagnetic field noise from the external electronic device from reaching the electric component and the circuit wiring and affecting the electric component and the circuit wiring.
The light receiving element 105 includes a light receiving element in which a light receiving portion (not shown) in which pixels for performing photoelectric conversion are arranged is mounted on the upper surface side of the 1 st multilayer circuit board 102. The outer peripheral shape of the light receiving element 105 is circular or quadrangular. In addition, the light receiving element 105 is also referred to as a sensor PKG. The lens barrel base part 107 is formed of a metal material having a good thermal conductivity, and is formed in a disk shape or a square plate shape having a thickness. A fitting hole 107a into which the lower end portion of the lens barrel 106 is fitted is formed on the upper surface side of the lens barrel base portion 107. The lens barrel base part 107 is connected to the 1 st multilayer circuit board 102 via a metal shield GND member 108 attached to the 1 st multilayer circuit board 102. An adhesive 110 is used for connecting the lens barrel base part 107 and the metal shield GND member 108. In the connection between the lens barrel base part 107 and the metal shield GND member 108, the optical axis of the lens barrel 106 is positioned so as to coincide with the center of the light receiving part of the light receiving element 105. In this case, since the metal-shielded GND member 108 is fixed to the 1 st multilayer circuit board 102, the position adjustment between the substrate side including the metal-shielded GND member 108 and the lens barrel base portion 107 is performed.
The metal shield GND member 108 absorbs electromagnetic field noise radiated from the light receiving element 105, and is formed of a metal material having high electric conductivity and thermal conductivity, such as copper material, so as to cover the outer periphery of the light receiving element 105. The metal shield GND member 108 is formed in a substantially cylindrical shape having one end side open and having a flange portion (end portion) 108a extending outward and the other end side having the opening portion 108b described above. In addition, the other end side of the metal shield GND member 108 is flat except for the opening 108 b. This flat portion is referred to as a flat surface portion 108 c.
The size of the opening 108b of the metal shield GND member 108 is, for example, a size that shields an optical path other than an optical path of effective pixels toward the light receiving portion of the light receiving element 105. By setting the size of the opening 108b of the metal shield GND member 108 to a size that blocks an optical path other than the optical path of the effective pixel toward the light receiving unit of the light receiving element 5, it is possible to block light incident on a portion other than the effective pixel of the light receiving unit of the light receiving element 105. Further, by setting the size of the opening 108b of the metallic shield GND member 108 to a size that blocks an optical path other than an optical path of effective pixels toward the light receiving unit 105, the size of the flat surface portion 108c of the metallic shield GND member 108 can be made larger than the area of the flange portion 108 a. This can increase the contact area with the lens barrel base part 107, and can improve the bonding strength.
The metal shield GND member 108 is mounted on the 1 st multilayer circuit board 102 by reflow soldering, and the flange portion 108a is connected to the GND portion (not shown) of the 1 st multilayer circuit board 102. The electromagnetic field noise radiated from the light receiving element 105 is mainly radiated from the logic portion and the I/O wiring of the light receiving element 105, but the metal shield GND member 108 becomes the GND potential, and therefore absorbs the electromagnetic field noise radiated from the light receiving element 105.
For example, an extrusion method or a bending method is used for manufacturing the metal shield GND member 108. A single-piece monocoque structure is obtained by using an extrusion processing method, and a single-piece structure or a combined structure of two or more pieces is obtained by using a bending processing method. By using the above-described processing method, the metal shield GND member 8 can be easily and inexpensively manufactured.
In the camera unit 101 of the present embodiment, the shape of the metal shield GND member 108 is circular at the flange portion 108a, the opening portion 108b, and the flat surface portion 108c, but for example, only the flange portion 108a may be a square, or all of the flange portion 108a, the opening portion 108b, and the flat surface portion 108c may be a square. Fig. 9A to 9C are diagrams showing various forms of the metal shield GND member 108, fig. 9A is an example in which all of the flange portion 108a, the opening portion 108B, and the flat surface portion 108C are circular, fig. 9B is an example in which the flange portion 108a is rectangular and the opening portion 108B and the flat surface portion 108C are circular, and fig. 9C is an example in which all of the flange portion 108a, the opening portion 108B, and the flat surface portion 108C are rectangular. By forming the metal shield GND member 108 in the shape as shown in fig. 9A to 9C, the shape can be adapted to the shape of the light receiving element 105 to be used.
The metal-shielded GND member 108 is mounted on the 1 st multilayer circuit board 102 by reflow soldering together with the light-receiving element 105 and other electrical components, and the metal-shielded GND member 108 is mounted on the 1 st multilayer circuit board 102 simultaneously with the mounting of the electrical components on the 1 st multilayer circuit board 102, whereby the number of steps can be reduced as compared with the case where the electrical components are mounted separately.
By adopting the structure in which the lens barrel base part 107 is connected to the 1 st multilayer circuit board 102 via the metal shield GND member 108, the mounting effective area of the electrical components on the 1 st multilayer circuit board 102 is enlarged, the arrangement of the electrical components and the wiring restrictions are relaxed, and the shortest wiring and the appropriate GND pattern of the 1 st multilayer circuit board 102 can be optimized. This improves the shielding performance in response to absorption of electromagnetic field noise radiated from the light receiving element 105, and minimizes the influence of the electromagnetic field noise on external devices.
In addition, the metal shield GND member 108 can release heat generated at the 1 st multilayer circuit board 102 to the lens barrel 106 side. In this case, the lens barrel 106 is in contact with the outside air, and therefore, heat can be efficiently released. By releasing the heat generated at the 1 st multilayer circuit substrate 102, the temperature rise in the camera unit 101 can be suppressed low. The heat generated in the 1 st multi-layer circuit board 102 also includes heat generated in an isp (image Signal processor) mounted on the lower surface side of the 1 st multi-layer circuit board 102. The metal shield GND member 108 is connected to the GND part of the 1 st multilayer circuit board 102, and therefore, heat generated at the ISP can be efficiently released to the lens barrel 106 side.
As described above, according to the camera unit 101 of the present embodiment, since the light receiving element 105 is surrounded by the substantially cylindrical metal-shielded GND member 108 having the opening 108b for introducing light transmitted through the lens barrel 106 to the light receiving element 105 and the flange 108a connected to the GND part of the 1 st multilayer circuit board 102, and the connection between the 1 st multilayer circuit board 102 and the lens barrel base part 107 is performed, the influence of electromagnetic field noise on surrounding electronic devices can be minimized, and the low noise performance can be improved.
Further, since the 1 st multilayer circuit board 102 and the lens barrel base part 107 are connected by the metal shield GND member 108, heat generated in the 1 st multilayer circuit board 102 can be released to the lens barrel 106 side which is in contact with the outside air, and the operation quality in a high-temperature environment can be improved.
Further, since the lens barrel base part 107 is not directly connected to the 1 st multilayer circuit board 102, the effective area for mounting electric components on the 1 st multilayer circuit board 102 can be increased. This can relax restrictions on the arrangement and wiring of the electric components, minimize the wiring of the 1 st multilayer circuit board 102, and optimize the GND pattern.
(embodiment 4)
Fig. 10 is a sectional view showing the structure of the camera unit 115 according to embodiment 4 of the present invention. In the figure, the same reference numerals are given to parts common to the camera unit 101 of embodiment 3 described above. The camera unit 115 according to embodiment 4 includes a lens barrel base portion 116 to which a metal ring 117 is attached on a lower surface side. Fig. 11 is a plan view showing an appearance of the ferrule 117. The size of the metal ring 117 is the same as the size of the lens barrel base portion 116. For example, when the lens barrel base portion 116 has a circular plate shape, the diameter of the metal ring 117 is the same as the diameter of the lens barrel base portion 116. For example, when the opening 108b of the metal shield GND member 108 is circular, the diameter of the hollow 117a of the ferrule 117 is the same as the diameter of the opening 108b of the metal shield GND member 108.
In this way, the lens barrel base part 116 has the ferrule 117 having the size of the hollow part 117a substantially equal to the size of the opening 108b of the metal shield GND member 108 on the surface side facing the opening side of the metal shield GND member 108, and therefore, the heat generated in the 1 st multilayer circuit board 102 can be efficiently released to the lens barrel 106 side.
(embodiment 5)
Fig. 12 is a sectional view showing the structure of the camera unit 120 according to embodiment 5 of the present invention. In the figure, the same reference numerals are given to parts common to the camera unit 101 of embodiment 3 described above. The camera unit 120 of embodiment 5 includes a metal shield GND member 121 whose planar portion is enlarged as compared with the metal shield GND member 108. The size of the opening-side flat part 121c of the metal shield GND member 121 is the same as the size of the lens barrel base part 107. The size of the flange portion (end portion) 121a of the metal shield GND member 121 is the same as the size of the flange portion 108a of the metal shield GND member 108. The size of the opening 121b of the metal shield GND member 121 is larger than the size of the opening 108b of the metal shield GND member 108. The metal shield GND member 121 has a flat surface portion 121c larger than the flat surface portion 108c of the metal shield GND member 108, so that the bonding with the lens barrel base portion 107 can be made stronger, and heat generated at the 1 st multilayer circuit substrate 102 can be released more efficiently to the lens barrel 106 side.
Fig. 13 is a sectional view showing a structure of a camera 125 including the camera unit 101 according to embodiment 3 of the present invention. The camera 125 includes: a shield case 126 covering the camera unit 101; and an outer case 127 having a through hole 127a exposing the lens barrel 106, and housing the camera unit 101 in a state where the camera unit 101 is covered with the shield case 126. By having the shield case 126, a shielding effect against electromagnetic field noise and a heat radiation effect of heat generated inside the camera unit 101 can be obtained. A metal material having high electric conductivity and thermal conductivity such as copper material is used for the shield case 126.
The outer case 127 has a through hole 127a formed in one end, a main body 127b having a japanese character コ -shaped cross section and an opening at the other end, and a lid 127c closing the opening end of the main body 127 b. The lid portion 127c is joined to the body portion 127b by laser welding. The lid 127c is formed with a through hole 127d through which the housing-side shielded connector 128 connected to the substrate-side shielded connector 109 is inserted, and a cylindrical connector protection portion 127e for protecting the housing-side shielded connector 128 around the through hole 127 d. A part of the upper surface of the lens barrel base part 107 is joined to the inner wall surface of the outer case 127 on the through hole 127a side by laser welding. A metal material having high thermal conductivity such as aluminum is used for the housing case 127. By joining the lens barrel base part 107 to the outer case 127, heat generated inside the camera unit 101 can be released from the lens barrel base part 107 to the outer case 127. In this way, the camera 125 is an excellent device having both low noise performance and heat resistance.
The disclosure of the above-described embodiments and drawings is merely an example for explaining the technical means described in the claims, and the technical means described in the claims is not limited to the disclosure of the above-described embodiments or drawings. The components of the above embodiments can be arbitrarily combined without departing from the scope of the invention.
While the present invention has been described with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention.
The present application is based on japanese invention patent application filed on 30/3/2018 (japanese patent application 2018-067309) and japanese invention patent application filed on 12/6/2018 (japanese patent application 2018-112134), the contents of which are incorporated herein by reference.
Industrial applicability
The present invention is useful as a camera for mounting on a vehicle.
Description of the reference numerals
10. 100, a camera substrate assembly; 11. 1 st multilayer circuit substrate; 12. a 2 nd multilayer circuit substrate; 13. a 3 rd multi-layer circuit substrate; 15. 1 st flexible cable; 16. a 2 nd flexible cable; 21. 27, 31, 51, coil; 22. 28, 32, 52, bypass capacitance; 23. 29, 33, 36, 37, 53, resistance; 24. 25, IC components; 26. a substrate-side shield connector (input/output connector); 34. an image signal processor; 40. a camera unit; 41. a shield case; 42. a spacer; 43. a housing; 44. A housing cover; 45. a lens; 46. a housing-side shielded connector; 61. 62, an elastic GND pad; 101. 115, 120, a camera unit; 102. 1 st multilayer circuit substrate; 103. a 2 nd multilayer circuit substrate; 104. a flexible cable; 105. a light receiving element; 106. a lens barrel; 107. 116, a lens barrel base part; 107a, a fitting hole; 108. 121, a metal shield GND member; 108a, 121a, flange portion; 108b, 121b, and an opening; 108c, 121c, a planar portion; 109. a substrate-side shielded connector; 110. an adhesive; 117. a metal ring; 117a, a hollow portion; 125. a camera; 126. a shield case; 127. an outer shell; 127a, 127d, through holes; 127b, a main body portion; 127c, a cover portion; 127e, a connector protection part; 128. the housing side shields the connector.

Claims (16)

1. A camera substrate assembly, comprising,
the camera substrate assembly includes:
a 1 st multilayer circuit board and a 2 nd multilayer circuit board which are arranged so as to face each other; and
a 1 st flexible cable connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board,
the 1 st multilayer circuit board and the 2 nd multilayer circuit board each have a GND surface on a surface layer and/or an inner layer,
electronic components and circuit wiring which are sources of noise in a radiation electromagnetic field are arranged on the surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board which face each other.
2. The camera substrate assembly of claim 1,
a GND spring contact member or an elastic GND pad for connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board is disposed at a position closer to an end side than the electronic component and the circuit wiring which are noise sources of the radiation electromagnetic field in the surfaces of the 1 st multilayer circuit board and the 2 nd multilayer circuit board facing each other.
3. The camera substrate assembly of claim 1 or 2,
an input/output connector is disposed on a surface of the 1 st multilayer circuit board opposite to the 2 nd multilayer circuit board,
an image sensor is disposed on a surface of the 2 nd multilayer circuit board opposite to the 1 st multilayer circuit board.
4. A camera unit, characterized in that,
the camera unit includes:
a camera substrate assembly according to any one of claims 1 to 3; and
a shield case that houses the camera substrate assembly.
5. A connection structure of a lens barrel base part and a sensor substrate of a camera unit is characterized in that,
the camera unit includes:
the camera substrate assembly of claim 1;
a light receiving element including a light receiving element having a light receiving portion on which pixels for performing photoelectric conversion are arranged, the light receiving element being mounted on a sensor substrate which is the 1 st multilayer circuit substrate of the camera substrate assembly;
a lens barrel including a lens for forming an optical image on the light receiving portion of the light receiving element; and
a lens barrel base portion that supports the lens barrel,
the sensor substrate is connected to the lens barrel base part while surrounding the periphery of the light receiving element with a substantially cylindrical metal shield GND member provided with an opening for introducing light transmitted through the lens barrel to the light receiving element and an end part connected to the GND part of the sensor substrate.
6. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5,
the outer peripheral shape of the metal shield GND member is circular or quadrangular, and the shape of the opening portion is circular or quadrangular.
7. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the opening of the metal shield GND member is sized to shield an optical path other than an optical path of an effective pixel facing the light receiving unit of the light receiving element.
8. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the opening side flat surface portion of the metal shield GND member is larger than the end portion area connected to the GND portion of the sensor substrate, and the contact area with the lens barrel base portion is larger.
9. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the metal shield GND member is connected to the GND part of the sensor substrate by reflow soldering.
10. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the metallic shielding GND member is a one-piece monocoque structure obtained from a flat plate of metal by an extrusion process.
11. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the metal shielding GND member is a single-piece structure or a combined structure of more than two pieces obtained by bending a metal flat plate.
12. The connection structure of a lens barrel base part and a sensor substrate of a camera unit according to claim 5 or 6,
the lens barrel base part has a ferrule having a hollow part with a size substantially equal to that of the opening of the metal shield GND member on a surface side facing the opening of the metal shield GND member.
13. A camera substrate assembly, comprising,
the camera substrate assembly includes:
a 1 st multilayer circuit board and a 2 nd multilayer circuit board which are arranged so as to face each other;
a 3 rd multilayer circuit board disposed so as to face the 2 nd multilayer circuit board on a side opposite to the 1 st multilayer circuit board;
a 1 st flexible cable connecting the GND of the 1 st multilayer circuit board and the GND of the 2 nd multilayer circuit board; and
a 2 nd flexible cable connecting the GND of the 2 nd multilayer circuit board and the GND of the 3 rd multilayer circuit board,
the 1 st multilayer circuit board and the 3 rd multilayer circuit board each have a GND surface on a surface layer and/or an inner layer,
electronic components and circuit wiring which are sources of noise in a radiation electromagnetic field are arranged on the surfaces of the 1 st multilayer circuit board and the 3 rd multilayer circuit board which face the 2 nd multilayer circuit board.
14. The camera substrate assembly of claim 13,
a GND spring contact member or an elastic GND pad for connecting GND of the 1 st multilayer circuit board and GND of the 2 nd multilayer circuit board are disposed at positions closer to an end side than electronic components and circuit wirings which become a noise source of the radiation electromagnetic field in a surface of the 1 st multilayer circuit board facing the 2 nd multilayer circuit board,
a GND spring contact member or an elastic GND pad for connecting the GND of the 3 rd multilayer circuit board and the GND of the 2 nd multilayer circuit board is disposed at a position closer to an end side than the electronic component and the circuit wiring which are noise sources of the radiation electromagnetic field in a surface of the 3 rd multilayer circuit board facing the 2 nd multilayer circuit board.
15. The camera substrate assembly of claim 13 or 14,
an input/output connector is disposed on a surface of the 1 st multilayer circuit board opposite to the 2 nd multilayer circuit board,
an image sensor is disposed on a surface of the 3 rd multilayer circuit board opposite to the 2 nd multilayer circuit board.
16. A camera unit, characterized in that,
the camera unit includes:
the camera substrate assembly of any one of claims 13-15; and
a shield case that houses the camera substrate assembly.
CN201990000554.8U 2018-03-30 2019-03-22 Camera substrate assembly, camera unit, and connection structure between lens barrel base part and sensor substrate of camera unit Active CN213638363U (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018067309 2018-03-30
JP2018-067309 2018-03-30
JP2018-112134 2018-06-12
JP2018112134 2018-06-12
PCT/JP2019/012258 WO2019188847A1 (en) 2018-03-30 2019-03-22 Camera board module, camera unit, structure for connecting lens barrel pedestal and sensor board in camera unit and connection method

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DE102021116319A1 (en) 2021-06-24 2022-12-29 Valeo Schalter Und Sensoren Gmbh CAMERA DEVICE FOR A VEHICLE, VEHICLE AND METHOD OF MANUFACTURING A CAMERA DEVICE

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