CN109819590B - Photoelectric device and terminal - Google Patents
Photoelectric device and terminal Download PDFInfo
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- CN109819590B CN109819590B CN201910002606.1A CN201910002606A CN109819590B CN 109819590 B CN109819590 B CN 109819590B CN 201910002606 A CN201910002606 A CN 201910002606A CN 109819590 B CN109819590 B CN 109819590B
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Abstract
The application provides a photoelectric device and a terminal, wherein the photoelectric device comprises a substrate, an electric device, an optical device, a bracket and a cover plate; the substrate comprises a first surface; the optical device is positioned on the first surface of the substrate; the bracket is positioned on the first surface of the substrate and surrounds the optical device; a closed space is formed on the substrate, the cover plate and the bracket, and the optical device is accommodated in the closed space; the electric device is embedded in the substrate or the bracket, and the electric device is electrically connected with the optical device. When adopting above-mentioned scheme, through adopting the mode that the electrical part buries in base plate or support underground to can reduce the area that the electrical part occupy, and then reduce whole photoelectric device's volume, improve the flexibility of photoelectric device when using. In addition, when the electric device and the optical device are arranged in a stacked mode, the distance between the electric device and the optical device is reduced, the length of a transmission line for connecting the electric device and the optical device is reduced, and the performance of the photoelectric device is effectively improved.
Description
Technical Field
The application relates to the technical field of photoelectricity, in particular to a photoelectric device and a terminal.
Background
With the increasing popularization of optical sensor components in electronic products such as mobile phones. The transmission requirements of electrical signals in the assembly are higher and higher; in addition, with the trend of miniaturization of electronic products, it is very important to continuously reduce the size of the optical sensor module.
In the prior art, the technical solution of the optoelectronic hybrid module is to place the optical component and the electrical device side by side on the PCB 1. As shown in fig. 1, the optical module includes an optical device 2, the optical device 2 is placed on a substrate 5, signal connection is made with a circuit layer of the substrate 5 by gold wires, and the optical device 2 is sealed using a holder 6, a glass cover plate 7, and the like. And then electrically coupled to the electrical devices (including electrically active device 3 and electrically passive device 4) via copper transmission lines in PCB 1 to the optical device 2. The mode is more applied to the traditional photoelectric hybrid modules such as an optical sensor, a structured light module and the like. However, the optoelectronic hybrid module still occupies a large space area, which is not favorable for the miniaturization development of the terminal.
Disclosure of Invention
The application provides a photoelectric device and a terminal for reducing the space occupied by the photoelectric device and facilitating the miniaturization development of the terminal.
In a first aspect, there is provided a photovoltaic device comprising a substrate, a photovoltaic device, an electrical device, a support and a cover; . In particular arrangements, the substrate includes a first surface; wherein the optical device is located on the first surface of the substrate; and the support is positioned on the first surface of the substrate and surrounds the light device; when the cover plate is arranged, a closed space is formed on the first surface of the substrate, the cover plate and the bracket, and the optical device is accommodated in the closed space, so that the optical device is sealed in the closed space. When an electric device is arranged, the electric device is embedded in the substrate or the support, and the electric device is electrically connected with the optical device. When adopting above-mentioned scheme, through adopting the mode that the electrical part buries in base plate or support underground to can reduce the area that the electrical part occupy, and then reduce whole photoelectric device's volume, improve the flexibility of photoelectric device when using. In addition, when the electric device and the optical device are arranged in a stacked mode, the distance between the electric device and the optical device is reduced, the length of a transmission line for connecting the electric device and the optical device is reduced, and the performance of the photoelectric device is effectively improved.
When an electric device is specifically arranged, the electric device is embedded in the substrate, and the projection parts of the electric device and the optical device on the substrate are partially overlapped or completely overlapped. Thereby further reducing the distance between the electric device and the optical device and improving the performance of the photoelectric device.
When an electric device is specifically arranged, a groove is formed in the substrate, and the electric device is packaged in the groove; or, the electrical device is directly prepared in the substrate during processing on the substrate. So that the electric device can be arranged in different ways.
When the electric device and the optical device are electrically connected, a conductive material is arranged in the substrate, and the electric device is electrically connected with the optical device, namely the electric device is electrically connected with the optical device through the conductive material.
When the electric device and the optical device are electrically connected, the substrate is also internally provided with a metalized through hole, and the electric device is electrically connected with the optical device by embedding the electric device in the conductive material in the substrate or arranging the metalized through hole of the substrate.
In a particular embodiment, the electrical device may comprise different devices, such as only electrically active devices, or both electrically active and electrically passive devices, the arrangement of which is described below in a sequence.
When the electric device comprises an electric active device, the electric device is embedded in the substrate or the bracket, specifically, the electric active device is embedded in the substrate or the bracket. The electrically active device is arranged in the substrate to reduce the space area occupied by the optoelectronic device.
When the electric device comprises an electric active device and an electric passive device, the electric device is embedded in the substrate or the bracket, specifically, the electric active device is embedded in the substrate, and the electric passive device is embedded in the bracket; or the electric active device is embedded in the bracket, and the electric passive device is embedded in the substrate; the electrically active device and the electrically passive device are embedded in the substrate;
the electrical device is electrically connected with the optical device, specifically, the electrical passive device is electrically connected with the optical device and the electrical active device respectively.
The number of the electric passive devices can also be multiple, for example, the electric devices comprise an electric active device and a first electric passive device, a second electric passive device;
the electric device is embedded in the substrate or the bracket, specifically, the first electric passive device is embedded in the bracket, and the second electric passive device and the electric active device are embedded in the substrate; or the first electric passive device and the electric active device are embedded in the bracket, and the second electric passive device is embedded in the substrate;
the electric device is electrically connected with the optical device, specifically, the first electric passive device is electrically connected with the second electric passive device, and the second electric passive device is electrically connected with the electric active device; the first electrically passive device is electrically connected to the optical device.
When the electrical passive device is specifically configured, the electrical passive device refers to a capacitor, an inductor, and the like. The number of the electrically passive devices may be different, such as one or two or more. And when the electrically passive device is specifically arranged, the arrangement position of the electrically passive device can be determined according to the requirement.
In a particular embodiment, the optical device includes a first optical device and a second optical device, and the first optical device and the second optical device are electrically connected to the electrical device, respectively. At this time, the correspondence relationship between the electric device and the optical device is one-to-many.
In a specific embodiment, the number of the electric devices is two, and the two electric devices are respectively electrically connected with the optical device. At this time, the corresponding relationship between the electric device and the optical device is many-to-one.
In order to improve the performance of the photoelectric device, the photoelectric device further comprises a shielding layer, and the shielding layer is located on the outer side of the support and the substrate. The shielding layer can shield interference signals, and the shielding effect of the photoelectric device is further improved.
In a second aspect, there is provided a terminal comprising a circuit board and an optoelectronic device according to any one of the preceding claims, wherein the optoelectronic device is provided on a first surface of the circuit board. When the scheme is adopted, the electric active device is embedded in the substrate or the bracket, so that the occupied area of the electric active device can be reduced, the size of the whole photoelectric device is reduced, and the flexibility of the photoelectric device in use is improved. In addition, when the electric active device and the optical device are stacked, the distance between the electric active device and the optical device is reduced, the length of a transmission line for connecting the electric active device and the optical device is reduced, and the performance of the photoelectric device is effectively improved, so that the thickness of the terminal is effectively reduced, and the overall performance of the terminal is improved.
In a particular embodiment, the terminal further comprises an electrical device disposed on the first surface of the circuit board; and the electrical devices are electrically connected with the electrical devices in the optoelectronic devices and the optical devices in the optoelectronic devices respectively.
Drawings
FIG. 1 is a schematic diagram of a prior art optoelectronic device;
fig. 2 is a schematic structural diagram of a photovoltaic device provided by an embodiment of the present application;
fig. 3 is a schematic structural diagram of another optoelectronic device provided by an embodiment of the present application;
fig. 4 is a reference diagram illustrating a usage state of a photovoltaic device provided by an embodiment of the present application;
fig. 5 is a reference view of a usage state of a photoelectric device provided by an embodiment of the present application;
fig. 6 is a top view of an optoelectronic device provided by an embodiment of the present application;
fig. 7 is a reference view of a usage state of another optoelectronic device provided by an embodiment of the present application;
FIG. 8 is a top view of another optoelectronic device provided by an embodiment of the present application;
fig. 9 is a reference view of a usage state of another optoelectronic device provided by an embodiment of the present application;
fig. 10 is a top view of another optoelectronic device provided by an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
In order to facilitate understanding of the optoelectronic device provided in the embodiments of the present application, an application scenario of the optoelectronic device is first described below, where the optoelectronic device is configured to receive or emit an optical signal, and the optoelectronic device may be a structured light sensor or a camera. The method is applied to terminals, such as common terminals of mobile phones, tablet computers, digital cameras, wearable equipment, automobile electronics and the like. And above-mentioned terminal along with the proposition of miniaturized requirement, terminal inner space is narrower and narrower, consequently, this application embodiment provides photoelectric device to improve photoelectric device's occupation space.
First, the names referred to in the embodiments of the present application are explained for the sake of understanding.
Generally, devices include active devices and passive devices. The active device can work only by external energy, and the passive device can work without external energy.
The Electrical devices (Electrical devices) include electrically active devices and electrically passive devices. Electrically active devices, such as electrical chips, electrically passive devices, such as inductors, capacitors, resistors, and the like.
The optoelectronic device provided by the embodiment of the present application is described below with reference to the accompanying drawings. As shown in fig. 2 and fig. 3, fig. 2 shows a schematic structural diagram of an optoelectronic device provided in an embodiment of the present application. Fig. 3 shows a schematic structural diagram of another optoelectronic device provided by the embodiment of the present application.
As shown in fig. 2 to 5, the optoelectronic device mainly includes a base plate 22, an optoelectronic device 21, a support 23, a cover plate 24, and electrical devices 30 (including an electrical device 31, an electrical device 32, and an electrical device 33). For convenience of description, the substrate 22, the bracket 23, and the cover plate are divided into the optical assembly 20. In use, the optical device 21 in the optical assembly 20 is arranged to receive an optical signal and convert the received optical signal into an electrical signal before passing the electrical signal to the electrical device 30, and the electrical device 30 is arranged to send the electrical signal to the processor of the terminal. As shown in fig. 4, fig. 4 shows a using state diagram of the optoelectronic device, the optoelectronic device is disposed on a circuit board 10 when in use, the circuit board 10 is used for connecting the optical component 20 and the electrical device 30, and the circuit board 10 is used as a bearing component of the optical component 20 and the electrical device 30, and the optical component 20 is fixed on the circuit board 10 and connected with the circuit board 10. The circuit board 10 may be a common printed circuit board.
With continued reference to fig. 2 and 3, the optical assembly 20 includes an optical device 21, the optical device 21 being configured to receive or transmit an optical signal. The number of the optical devices 21 of the optical module 20 in the embodiment of the present application is not limited, and as shown in fig. 4, one optical device 21 is shown, and as shown in fig. 5, two optical devices 21 may be used. When two optical devices 21 are used, the optical devices 21 are connected to the electrical devices 30 in the same manner, and therefore, only one of the optical devices 21 is shown connected to one of the electrical devices 30 in the illustration of fig. 5, and the connection lines between the other optical device 21 and the corresponding electrical device 30 are not shown. In the setting, whether one optical device 21 or two optical devices 21 are adopted, the optical device is arranged on a substrate 22, the substrate 22 comprises a first surface and a second surface which are opposite, wherein the bracket 23 and the optical device 21 are arranged on the first surface of the substrate 22. And when the substrate 22 is connected to the circuit board 10, the second surface of the substrate 22 is opposite to the first surface of the circuit board 10. In addition, the substrate 22 is provided with a circuit layer for transmitting signals of the optical device 21, and when the optical device 21 is connected to the circuit layer of the substrate 22, gold wires may be used for connection, or solder balls may be used for connection. When the optical devices 21 are connected to the substrate 22, as shown in fig. 5, one of the optical devices 21 is connected by bonding, and the other optical device 21 is fixedly connected to the substrate 22 by using solder balls.
When the substrate 22 is specifically disposed, the substrate 22 is located on one surface of the circuit board 10 and is fixedly connected with the circuit board 10, and the placement direction of the optoelectronic device shown in fig. 5 is taken as a reference direction, when the substrate 22 is disposed, the substrate 22 is located on the first surface of the circuit board 10 and is fixedly connected with the circuit board 10 through solder balls, it should be understood that the soldering between the substrate 22 and the circuit board 10 shown in fig. 4 is only a specific embodiment, and other connection manners can be adopted in the embodiments of the present application. In addition, a substrate made of a different material such as silicon, ceramic, or an organic substrate may be used for the substrate 22.
Referring also to fig. 5, the holder 23 of the optical assembly 20 is disposed on the first surface of the substrate 22 and is fixedly connected to the substrate 22. The specific fixing method can be welding, bonding, snap-fit connection or connection by using a connecting piece (such as a bolt or a screw), and the bracket 23 can be fixed on the substrate by injection molding and integral molding or the bracket 23 can be formed on the substrate directly by using a molding process. Referring also to fig. 6, fig. 6 shows a top view of the optoelectronic device from top to bottom of the structure of the optoelectronic device shown in fig. 5. As can be seen from fig. 6, the support 23 is an annular support 23 and is arranged around the light device 21 when the support 23 is fixedly connected to the substrate 22. When the optical device 21 is fixed, as shown in fig. 5, the optical device 21 is located in a space surrounded by the holder 23, so that the optical device 21 is protected by the holder 23. In addition, when the optical assembly 20 is in use, it should be avoided that external dust falls on the optical device 21 to affect the photosensitive effect of the optical device 21. Therefore, in the light module 20 provided in the embodiment of the present application, a cover plate 24 is further provided. As shown in fig. 5, the cover plate 24 covers the support 23 and encloses a sealed space together with the substrate 22 to seal the optical device 21. When the optical device 21 is fixed to the substrate 22, as shown in fig. 4, a Field of view (FOV) of the optical device 21 is as shown in the figure, and a range of the Field angle α is not blocked by the holder 23. In the specific arrangement of the cover plate 24, as shown in fig. 5, the bracket 23 is provided with a ring of grooves, the cover plate 24 is embedded in the grooves, and the cover plate 24 and the bracket 23 are fixedly, hermetically and adhesively bonded together by glue. When the cover plate 24 is specifically disposed, different materials may be adopted, for example, the cover plate 24 is made of different materials such as glass and transparent resin, and of course, other transparent materials may also be adopted.
It should be understood that the above-mentioned bracket 23, the cover plate 24 and the base plate 22 cooperate to form a closed space for accommodating the optical device 21, which is a specific structure shown in fig. 5, and in the embodiment of the present application, the optical device 21 may be sealed in other ways to improve the working environment of the optical device 21 and prevent dust from contaminating the optical device 21.
With continuing reference to fig. 2 and 3, fig. 2 also illustrates an electrical device 30 provided in an embodiment of the present application, where the electrical device 30 is embedded in the substrate 22 or the support 23, and where the electrical device 30 includes an electrically active device 31, the electrically active device 31 may be a bare chip (unpackaged chip), and where the electrically active device 31 is disposed, the electrically active device 31 may be disposed within the substrate 22 or the support 23. As shown in fig. 2, an electrically active device 31 is embedded within the substrate 22. As shown in fig. 3, an electrically active device 31 is embedded within the support 23. And when the support 23 or the substrate 22 is selected to embed the electrically active device 31, it may be determined according to the size of the particular electrically active device 31, such as the height of the electrically active device 31 shown in fig. 2 is smaller than the thickness of the substrate 22, and the height of the electrically active device 31 shown in fig. 3 is larger than the thickness of the substrate 22 and smaller than the thickness of the support 23.
With continued reference to fig. 2, the electrically active device 31 is packaged within the substrate 22, and since the electrically active device 31 is a bare chip, it is smaller in size than the packaged electrically active device 31 shown in fig. 1, and therefore can be packaged directly within the substrate 22 of the optical assembly 20. The structure shown in fig. 2, 3 and 4 of the present application is compared with the structure of the prior art shown in fig. 1. The placement direction of the optoelectronic device shown in fig. 1, fig. 2, fig. 3 and fig. 4 is taken as a reference direction. As can be seen from fig. 1, in the prior art, the electrically active device 3 and the optical device 2 are arranged side by side, and as can be seen from fig. 1, the dimension of the electrically active device 3 in the horizontal direction is X, the dimension of the optical assembly 20 in the horizontal direction is Y (the dimension of the support 6 in the horizontal direction), and the distance between the electrically active device 3 and the support 6 in the horizontal direction is Z, then the size occupied by the optical device in the horizontal direction is at least X + Y + Z, and the size occupied by the optical device in the horizontal direction is L, where L > X + Y + Z. In the embodiment of the present application, as shown in fig. 2 and 3, the horizontal dimension of the electrically active device 31 is X, the dimension of the optical assembly 20 in the horizontal direction is Y, and the electrically active device 31 is embedded in the substrate 22 or the support 23 in the optical assembly 20, so that the optoelectronic device occupies the dimension of Y in the horizontal direction. Under the condition that the sizes and the positions of other components are unchanged, comparing fig. 1 with fig. 2 and fig. 3, it can be seen that the occupied area of the photoelectric device provided by the embodiment of the application is reduced by X + Z compared with the structure shown in fig. 1. Similarly, compared with the optoelectronic device shown in fig. 1 and 4, in the case that the size and the position of other devices except the optical device 21 and the electrically active device 31 are not changed, as can be seen from fig. 1 and 4, the size of the optoelectronic device provided by the embodiment of the present application in the horizontal direction is reduced by Z + X compared with the structure shown in fig. 1. Comparing the circuit boards in fig. 1 and fig. 4, wherein L is the size of the circuit board 1 in the horizontal direction in fig. 1, and L1 is the size of the circuit board 10 in fig. 4. L1 < L because of the reduced horizontal dimension occupied by the optoelectronic device in fig. 4.
With continued reference to fig. 4, when the electric device 30 is embedded in the substrate 22, the relative positional relationship between the electric device 30 and the optical device 21 may be various, such as taking the placement surface of the optical device 21 as a reference surface (the first surface of the substrate 22), in which case the projections of the optical device 21 and the electric device 30 on the substrate 22 partially overlap or completely overlap. In a particular embodiment, as shown in fig. 4, when the electric device 30 comprises an electrically active device 31, the electrically active device 31 may be placed in such a way that the vertical projection of the optical device 21 on the placing surface partially or completely overlaps the vertical projection of the electrically active device 31 on the placing surface. In the specific arrangement of the position of the electrically active device 31, it is necessary to overlap the optical device 21 and the electrically active device 31 for supplying an electric signal as much as possible in the vertical direction in consideration of the electrical heating performance, reliability, workability, and the like, thereby minimizing the area. As shown in fig. 4, the vertical projection of the optical device 21 on the mounting surface completely overlaps within the vertical projection of the electrically active device 31 on the mounting surface, at which time the optical device 21 and the electrically active device 31 are stacked in the vertical direction, so that the size of the substrate 22 in the horizontal direction can be reduced. Therefore, the size of the whole photoelectric device is reduced, and the occupied space of the photoelectric device is reduced.
When the electrical active device 31 is embedded in the substrate 22, a groove or a direct preparation method may be adopted to embed the electrical device in the substrate 22 so that the bonding pad of the electrical device is electrically connected with the corresponding bonding pad on the substrate 22, and the electrical device is further electrically connected with the optical device 21.
Specifically, the electric device (an electric active device or an electric passive device) is buried in the substrate in a grooving mode, a groove for accommodating the electric device can be formed in the substrate in a digging mode, the electric device is placed in the groove (the welding point of the electric device is electrically connected with a corresponding welding pad on the substrate), then the substrate is packaged, then a through hole is processed on the packaged substrate, the welding pad of the electric device is exposed through the through hole, then the through hole is subjected to metallization treatment to form a metallized through hole, the metallized through hole is connected with the welding pad of the electric device, the metallized through hole is connected with a conductive material (such as a copper wire) on the substrate, the conductive material is connected with the welding pad or the welding point on one side of the substrate, and then the welding pad or the welding point on one side of the substrate is welded with a gold wire of the optical device, so that the electric device is electrically. When the direct preparation is carried out, each layer of structure in the substrate is paved layer by layer, when the bonding pad is paved, the electric device is placed on the bonding pad, and then materials of other layers are continuously paved to package the electric device. The subsequent processing is the same as the processing of the packaged substrate, and is not described herein again. Of course, in addition to the electrical connection between the electrical device and the optical device described above, the optical device 21 and the electrical device provided in the embodiment of the present application may also be connected by using other known conductive materials.
It should be understood that, in the above-described embodiment, the description has been made taking the case where the electrically active device 31 is buried in the substrate 22 as an example. Of course, in addition to the case of embedding the electrically active device 31 in the substrate 22, the electrically active device 31 may be embedded in the support 23 in a manner similar to the manner in which the electrically active device 31 is embedded in the substrate 22, and details thereof are not described here. And in either way, the electrical device 30 is electrically connected to the optical device 20, specifically the electrical device 30 is electrically connected to the optical device 20 through the conductive material embedded in the substrate. Alternatively, the electrical device 30 is connected to the optical device 20 through a conductive material embedded in the substrate or a metalized via provided in the substrate.
The electric device 30 provided in the embodiment of the present application includes, in addition to the above-mentioned electric active device 31, an electric passive device, which may be a common electric active device such as a capacitor, a resistor, an inductor, and the like. When the electric device 30 is connected to the optical device 21, the electrically passive device is connected to the optical device 21 and the electrically active device 31 is electrically connected.
When the electric device 30 includes an electrically active device 31 and an electrically passive device, the embedding of the electric device 30 in the substrate 22 or the support 23 may include different cases, such as the embedding of the electrically active device 31 in the substrate 22 and the embedding of the electrically passive device in the support 23; or the electric active device 31 is embedded in the bracket 23, and the electric passive device is embedded in the substrate 22; the electrically active device 31 and the electrically passive device may be embedded in the substrate 22; however, in any of the above-described arrangements, the electrically active device 31 and the electrically passive device may be arranged in the mount 23 or the substrate 22, respectively, in the above-described preparation method of embedding the electrically active device 31 in the substrate 22.
When the electrical passive devices are specifically arranged, the number of the electrical passive devices in the electrical device 30 may be different, such as one or two or more, and the electrical passive devices may be specifically arranged according to actual needs. In addition, the arrangement position for the electrically passive components may also be arranged at a different position.
As shown in fig. 5, the structure employing one first electrically passive device 32 is shown in fig. 5, and the first electrically passive device 32 is disposed in the substrate 22 in a similar manner to the electrically active device 31. Of course, fig. 5 shows only one specific embodiment of the electrically passive device, which is named as the first electrically passive device 32 for convenience of description, and when the first electrically passive device 32 is embedded in the substrate 22, the first electrically passive device 32 may be connected to the electrically active device 31 and the optical device 21 through a conductive material embedded in the substrate 22 and/or a metalized via provided on the substrate 22. That is, when the first electrically passive device 32 is connected to the electrically active device 31 and the optical device 21, the first electrically passive device may be connected by using a conductive material or a metalized via, or may be connected by using a combination of a part of the conductive material and a part of the metalized via, and the specific connection manner may be set according to actual conditions.
When the electrically passive devices include the first and second passive devices, as shown in fig. 7 and 8, the electrically passive device 33 having a relatively large size is embedded in the support 23 having a certain height, and the other is embedded in the substrate 22. In the optoelectronic device shown in fig. 7, two electrically passive devices are included, which are designated as a first electrically passive device 33 and a second electrically passive device 32, respectively, for convenience of description, wherein the height of the first electrically passive device 33 is greater than the height of the second electrically passive device 32. In particular, when the first electrically passive device 33 and the second electrically passive device 32 are provided, as shown in fig. 7, the first electrically passive device 33 is embedded in the support 23, and the second electrically passive device 32 is embedded in the substrate 22. When the first electrically passive device 33 and the second electrically passive device 32 are specifically embedded, they may be completely embedded or partially embedded (i.e., a part of the device is embedded in the support 23 and a part of the device is exposed outside the support 23), and in the structure shown in fig. 7, both the first electrically passive device 33 and the second electrically passive device 32 are completely embedded. Any embedding method can be applied to the embodiment of the present application, and the specific setting can be performed according to actual needs. With this configuration, the connection of the electrically passive device to the optical device 21 and the electrically active device 31 can be achieved by conductive material embedded in the substrate 22 and the support 23 and/or by a second metalized via provided on the substrate 22. In fig. 7, the way of the electrically conductive material is shown in fig. 7, wherein the first electrically passive device 33 is connected with the second electrically passive device 32, and the first electrically passive device 33 is connected with the electrically active device 31, and the second electrically passive device 32 is connected with the optical device 21. When the electrical connection is implemented, the first electrically passive device 33 is electrically connected to the substrate 22, and then the bracket 33 provided with the groove is covered on the first electrically passive device 33. Alternatively, the holder 23 may be formed directly on the substrate 22 by injection molding or the like in a mold. As for the electrical connection of the second electrically passive component 32, which is similar to the electrical connection of the electrically active component 31 described above, reference may be made to the electrical connection described above with respect to the electrically active component 31.
With continued reference to fig. 7, since the electrically passive device with a larger size is embedded in the bracket 23, the space occupied by the optoelectronic device can be reduced, thereby facilitating the miniaturization development of the terminal.
It should be noted that fig. 8 is a top view of an optoelectronic device, and the electrically passive devices are embedded in the support, so that the invisible electrically passive devices 33 are indicated by dashed lines.
Referring to the structures shown in fig. 5 and fig. 7 together, since the electrically active device 31 is embedded in the substrate 22, compared with the prior art shown in fig. 1, the electrically connecting lengths of the electrically active device 31, the optical device 21 and the electrically passive device in the provided optoelectronic device can be greatly shortened, the electrical performance can be improved, and meanwhile, the occupied area of the whole optoelectronic device can be greatly reduced. It should be understood that fig. 5 and 7 only show two specific arrangements of the electrically passive devices, and the electrically passive devices in the optoelectronic device provided by the embodiment of the present application may be arranged in the substrate 22 and/or the support 23 according to requirements.
In addition, in the embodiment of the present application, regarding the correspondence relationship between the optical device 21 and the electrically active device 31, fig. 5 and 7 only show the one-to-one correspondence relationship between the optical device 21 and the electrically active device 31, but in the optoelectronic device provided in the embodiment of the present application, the correspondence relationship between the optical device 21 and the electrically active device 31 is not limited to the one-to-one correspondence relationship described above, and the optical device 21 and the electrically active device 31 may be one-to-many or many-to-one. Such as: the number of the optical devices 21 is at least two, the number of the electrically active devices 31 is one, and at least two optical devices 21 are connected to the electrically active devices 31, respectively. At this time, the corresponding relationship between the electrically active device 31 and the optical device 21 is one-to-many, for example, the optical device 21 includes a first optical device and a second optical device, and one of the optical devices (the first optical device) is an optical device that emits an optical signal, and the other optical device (the second optical device) is an optical device that receives an optical signal, such as a distance measuring sensor, and a signal emitted by the first optical device is received by the second optical device after detecting the reflection of the object; or, for both optical devices 21, supporting both transmitting optical signals and receiving optical signals, the controller may select one optical device 21 to transmit and the other optical device 21 to receive; in addition, two optical devices 21 can be used for transmitting and receiving respectively, the two optical devices 21 are controlled by the controller to measure the distance respectively, and the results of the distance measurement are compared. Alternatively, the number of the electrically active devices 31 may be two and the number of the optical devices 21 may be one, and in this case, the two electrically active devices 31 are connected to the optical devices 21. At this time, the correspondence relationship between the electrically active device 31 and the optical device 21 is many-to-one. For example, one of the electrically active devices 31 is for powering the optical device 21 and the other electrically active device 31 is for providing a signal to the optical device 21.
When the optoelectronic device provided by the embodiment of the present application is applied in a terminal, the optoelectronic device is inevitably affected by an external electromagnetic signal, and in order to improve the using effect of the optoelectronic device, the optoelectronic device provided by the embodiment of the present application further includes a shielding layer 25, and the shielding layer 25 is wrapped on the outer sides of the support 23 and the substrate 22. As shown in fig. 9 and 10, a shield layer 25 is provided on the outer wall of the holder 23 and the outer surface of the substrate 22. The shielding layer 25 is a metal layer made of metal, and the metal layer can be formed by attaching a layer of metal or by spraying or sputtering on the outer side surfaces of the support 23 and the substrate 22, so that the optical device 21 and the electrically active device 31 are wrapped, and the metal layer can serve as the shielding layer 25 to shield a part of external interference signals, thereby improving the effect of the photoelectric device.
When specifically setting up this shielding layer 25, the apron 24 is not covered to shielding layer 25 to realize guaranteeing optical device 21 printing opacity in, holistic electromagnetic shield performance also can obtain promoting, can save the area of metal shield cover, has realized the miniaturization of subassembly.
The embodiment of the application further provides a terminal, which can be a mobile phone, a tablet computer, a notebook computer, a camera, a wearable electronic device, an automotive electronic product, or the like, and the terminal comprises the circuit board 10 and any one of the above photoelectric devices. When the photoelectric device is adopted, the mode that the electric device 20 is embedded in the substrate or the support is adopted, so that the electric device and the optical device 21 are arranged in a stacking mode, the occupied area of the electric device on the circuit board can be reduced, the size of the whole photoelectric device is reduced, and the flexibility of the photoelectric device in use is improved. In addition, when the electric device and the optical device 21 are stacked, the distance between the electric active device 31 and the optical device 21 is reduced, so that the length of a transmission line connecting the electric active device 31 and the optical device 21 is reduced, and the longer transmission line can limit the improvement of the electric performance, therefore, after the length of the transmission line is reduced, the performance of the photoelectric device can be effectively improved.
When the mobile terminal is arranged, the circuit board is also provided with an electric device, and the electric device is arranged on the first surface of the circuit board; and the electrical devices are electrically connected with the electrical devices in the optoelectronic devices and the optical devices in the optoelectronic devices respectively. When the connection of the electric device with the electric device and the optical device in the photoelectric device is specifically realized, as shown in fig. 4 and 5, the number of the electric devices 40 is 1; in a particular arrangement, the electrical device 40 is arranged on the circuit board 10. And the electric device 40 is connected to the electrically active device 31 and the optical device 21, respectively. In particular, the connection is made by means of a conductive material. As shown in fig. 4, the electrical device 40 is connected to two conductive materials (e.g. copper wires), the two conductive materials are embedded on the circuit board 10, one of the conductive materials is inserted into the substrate 22 and connected to the electrically active device 31, the other conductive material is connected to the optical device 21 after passing through the substrate 22, and after the electrically active device 31 is embedded in the substrate 22, the electrically active device 31 and the optical device 21 are electrically connected, at this time, a complete link of the optical device is formed among the electrically active device 31, the optical device 21 and the electrical device 40.
Of course, this can be achieved by the cooperation of conductive material with the metallized via in addition to the above. In a specific arrangement, two plated-through holes are provided on the substrate 22, one of the plated-through holes is connected to the gold wire of the optical device 21 by soldering, and the other plated-through hole is connected to the electrically active device 31. The electrical device 40 is connected to two conductive materials, which are connected to two metallized vias in a one-to-one correspondence, thereby achieving electrical connection of the electrical device 40 to the electrically active device 31 and the optical device 21, respectively. When the optical device 21 is used, if the optical device 21 has a transmitting function, a driving current signal generated by the electrically active chip 31 passes through the electrical device 40, then passes through the copper interconnection line (conductive material) and the metalized through hole, the welding point and the gold wire on the circuit board 10 and the substrate 22, and finally is transmitted to the optical device 21, and is modulated to form an optical signal for transmission; if the optical device 21 is in the receiving function, the optical device 21 receives the optical signal in the space, forms an electrical signal, transmits the electrical signal to the electrically active device 31 through the same link, and finally forms a data signal to transmit to the processor. Even if the electric device 40 is provided on the circuit board 10, the area of the circuit board 10 can be reduced compared with the prior art shown in fig. 4 and 1.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (7)
1. An optoelectronic device, comprising:
the device comprises a substrate, an optical device, an electric device, a bracket and a cover plate; wherein the content of the first and second substances,
the substrate comprises a first surface;
the optical device is positioned on the first surface of the substrate;
the bracket is positioned on the first surface of the substrate and surrounds the optical device;
the first surface of the substrate, the cover plate and the bracket form an enclosed space, and the optical device is accommodated in the enclosed space;
the electric device is embedded in the substrate or the bracket and is electrically connected with the optical device;
a conductive material is arranged in the substrate, and the electric device is electrically connected with the optical device, specifically, the electric device is electrically connected with the optical device through the conductive material;
the electric device comprises an electric active device, a first electric passive device and a second electric passive device;
the electric device is embedded in the substrate or the bracket, specifically, the first electric passive device is embedded in the bracket, and the second electric passive device and the electric active device are embedded in the substrate; or the first electric passive device and the electric active device are embedded in the bracket, and the second electric passive device is embedded in the substrate;
the electric device is electrically connected with the optical device, specifically, the first electric passive device is electrically connected with the second electric passive device, and the second electric passive device is electrically connected with the electric active device; the first electrically passive device is electrically connected to the optical device.
2. The optoelectronic device according to claim 1, wherein the electrical device is embedded in the substrate, and projections of the electrical device and the optical device on the substrate partially overlap or completely overlap.
3. The optoelectronic device according to claim 1, wherein a metalized via is further disposed in the substrate, and the electrical device is electrically connected to the optoelectronic device by a conductive material embedded in the substrate or a metalized via disposed in the substrate.
4. The optoelectronic device according to any one of claims 1 to 3, wherein the optical device comprises a first optical device and a second optical device, and the first optical device and the second optical device are electrically connected to the electrical device, respectively.
5. The optoelectronic device according to any one of claims 1 to 3, further comprising a shielding layer, wherein the shielding layer is located outside the support and the substrate.
6. A terminal comprising a circuit board and an optoelectronic device according to any one of claims 1 to 5,
the optoelectronic device is disposed on the first surface on the circuit board.
7. A terminal as claimed in claim 6, further comprising an electrical device,
the electric device is arranged on the first surface of the circuit board; and the electrical devices are electrically connected with the electrical devices in the optoelectronic devices and the optical devices in the optoelectronic devices respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002606.1A CN109819590B (en) | 2019-01-02 | 2019-01-02 | Photoelectric device and terminal |
| PCT/CN2019/124988 WO2020140724A1 (en) | 2019-01-02 | 2019-12-13 | Photoelectric device and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002606.1A CN109819590B (en) | 2019-01-02 | 2019-01-02 | Photoelectric device and terminal |
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| Publication Number | Publication Date |
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| CN109819590A CN109819590A (en) | 2019-05-28 |
| CN109819590B true CN109819590B (en) | 2021-04-09 |
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| WO (1) | WO2020140724A1 (en) |
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| CN109819590B (en) * | 2019-01-02 | 2021-04-09 | 华为终端有限公司 | Photoelectric device and terminal |
| EP4191309A4 (en) * | 2020-08-31 | 2024-04-17 | Huawei Technologies Co., Ltd. | Optoelectronic apparatus and optoelectronic integration method |
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| CN102867836A (en) * | 2011-07-07 | 2013-01-09 | 索尼公司 | Solid-state image sensing apparatus and electronic apparatus |
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| KR100726240B1 (en) * | 2005-10-04 | 2007-06-11 | 삼성전기주식회사 | Electronic components embedded PCB and the method for manufacturing thereof |
| TWI270327B (en) * | 2005-11-10 | 2007-01-01 | Phoenix Prec Technology Corp | Circuit board with optical component embedded therein |
| US9437512B2 (en) * | 2011-10-07 | 2016-09-06 | Mediatek Inc. | Integrated circuit package structure |
| CN103281875A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
| US20150123559A1 (en) * | 2013-11-07 | 2015-05-07 | Posco Led Company Ltd. | Optical semiconductor lighting apparatus |
| CN204991348U (en) * | 2015-07-28 | 2016-01-20 | 安徽亿民照明股份有限公司 | Thin chip inductor |
| CN205542769U (en) * | 2015-11-30 | 2016-08-31 | 奥特斯(中国)有限公司 | Electronic device and electronic apparatus |
| CN107068634A (en) * | 2017-01-23 | 2017-08-18 | 合肥雷诚微电子有限责任公司 | A kind of multi-chip power amplifier architecture for minimizing high-cooling property and preparation method thereof |
| CN109819590B (en) * | 2019-01-02 | 2021-04-09 | 华为终端有限公司 | Photoelectric device and terminal |
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- 2019-12-13 WO PCT/CN2019/124988 patent/WO2020140724A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102867836A (en) * | 2011-07-07 | 2013-01-09 | 索尼公司 | Solid-state image sensing apparatus and electronic apparatus |
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| Microfluidic networks embedded in a printed circuit board;Dong, LW等;《MODERN PHYSICS LETTERS B》;20170730;第31卷(第19-21期);全文 * |
| 埋嵌式印制电路板研究与应用;杨伟等;《电子工艺技术》;20170318;第38卷(第2期);第80-83页 * |
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| WO2020140724A1 (en) | 2020-07-09 |
| CN109819590A (en) | 2019-05-28 |
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