CN218277703U - Infrared module packaging structure - Google Patents
Infrared module packaging structure Download PDFInfo
- Publication number
- CN218277703U CN218277703U CN202221611280.6U CN202221611280U CN218277703U CN 218277703 U CN218277703 U CN 218277703U CN 202221611280 U CN202221611280 U CN 202221611280U CN 218277703 U CN218277703 U CN 218277703U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electromagnetic shielding
- shielding cover
- base
- infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000002791 soaking Methods 0.000 claims description 10
- 229910052755 nonmetal Inorganic materials 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The embodiment of the application provides an infrared module packaging structure, including optical lens, base, infrared detector and circuit board, optical lens infrared detector reaches the circuit board is installed in order installing on the base in order to incite somebody to action infrared detector encapsulates in the base, infrared detector with be equipped with the electromagnetic shield shroud between the circuit board. In the infrared module packaging structure, the infrared detector and the circuit board are isolated by the electromagnetic shielding cover cap, so that the electromagnetic shielding effect can be provided, and the mutual interference between the infrared detector chip and the chip or chip group on the circuit board can be prevented; the electromagnetic shielding cover base and the circuit board are in clearance fit, the shape can be adjusted according to the height of electronic components on the circuit board and the inner space of the base, the overall packaging size and height of the infrared module can not be increased, and the miniaturization design is not influenced.
Description
Technical Field
The application relates to the field of infrared technology, in particular to an infrared module packaging structure.
Background
With the development of science and technology, the requirements of various electronic devices on the size and performance of electronic devices are gradually increased, and electronic devices with infrared functions also face the problem, such as smart homes (such as smart air conditioners and smart watches), security monitoring, mobile phone infrared function accessories, tablet computers and the like. The current infrared module packaging forms are basically divided into two categories: the FPA (Focal Plane Array) chip is directly bonded with a Printed Circuit Board (PCB); the FPA chip is transited through the ceramic substrate and then bonded with the printed circuit board or the reinforcing plate.
The FPA chip is directly bonded with the printed circuit board, the process is relatively simple, but the heat conduction efficiency is extremely low, and the interference on infrared images and temperature measurement can be caused to a great extent. Meanwhile, all electronic components are exposed without any electromagnetic shielding measures, which inevitably generates electromagnetic interference to influence other equipment or systems. This type of disturbance may be a relatively mild, temporary malfunction, but may also cause malfunction and even damage to the device.
The FPA chip is bonded with the printed circuit board or the reinforcing plate after being transited by the solid ceramic substrate, so that the heat dissipation problem is solved to a certain extent, no anti-electromagnetic interference shielding means is provided, and great risk is caused by loss due to electromagnetic interference.
Therefore, it is necessary to design an infrared module package structure with good electromagnetic shielding effect to overcome the above problems.
Disclosure of Invention
For solving the technical problem that exists now, the application provides an infrared module packaging structure, can anti electromagnetic interference, possess electromagnetic shield effect.
In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
the embodiment of the application provides an infrared module packaging structure, including optical lens, base, infrared detector and circuit board, optical lens infrared detector reaches the circuit board is installed in order on the base in order to incite somebody to action infrared detector encapsulates in the base, infrared detector with be equipped with the electromagnetic shield shroud between the circuit board.
In one embodiment, the electromagnetic shielding cover is arranged on the circuit board and embedded in the base, the electromagnetic shielding cover is a metal cover made of heat-conducting metal, or the electromagnetic shielding cover is a non-metal cover with at least one surface formed with a metal shielding coating, or the electromagnetic shielding cover arranged between the bases is prepared by mixing a non-metal base material and metal particles.
In one embodiment, the optical lens is connected to one end of the base and sealed and fixed through glue injection of a glue dispensing groove; the circuit board is connected to the other end of the base, and heat-conducting glue is injected between the electromagnetic shielding cover cap and the circuit board and between the electromagnetic shielding cover cap and the base through a heat-conducting glue injection inlet.
In one embodiment, the electromagnetic shielding cover is provided with an electromagnetic shielding cover soaking surface on one surface deviating from the circuit board, and the bottom surface of the infrared detector and the soaking surface of the electromagnetic shielding cover are both in contact with the soaking layer.
In one embodiment, the electromagnetic shielding cover cap is provided with a lead through hole on one side of the soaking surface of the electromagnetic shielding cover cap, so that a lead of the infrared detector passes through the lead through hole to be connected to the circuit board.
In one embodiment, a heat conducting pad is disposed between the heat generating component on the circuit board and the electromagnetic shielding cover, and two side surfaces of the heat conducting pad are respectively attached to the heat generating component and the electromagnetic shielding cover.
In one embodiment, at least one cavity is formed on one side of the electromagnetic shielding cover facing the circuit board, and the electronic component on the circuit board is placed in the at least one cavity; the end face of the electromagnetic shielding cover facing the circuit board is a shielding cover closed end face attached to the circuit board.
In one embodiment, there are a plurality of the cavities, the depths of the cavities are different, and each cavity accommodates an electronic component or a group of electronic components on the circuit board, which is height-matched with the cavity.
In one embodiment, the circuit board is provided with at least one through-thickness via hole, and the via hole leads to the electromagnetic shielding cover; one side of the circuit board, which faces away from the electromagnetic shielding cover, is provided with a grounding metal ball and a conducting metal ball, and the electromagnetic shielding cover is connected to a grounding circuit through the conducting hole, the grounding metal ball and the conducting metal ball.
In one embodiment, the base is made of a thermally conductive metal material.
The infrared module packaging structure of this application has following beneficial effect at least: in the infrared module packaging structure, the infrared detector and the circuit board are isolated by the electromagnetic shielding cover cap, so that the electromagnetic shielding effect can be provided, and the mutual interference between the infrared detector chip and the chip or chip group on the circuit board can be prevented; the electromagnetic shielding cover is arranged in the gap between the base and the circuit board, and the shape (namely each containing cavity of the electromagnetic shielding cover) can be adjusted according to the height of the electronic component on the circuit board and the inner space of the base, so that the overall packaging size and height of the infrared module can not be increased, and the miniaturization design is not influenced.
Drawings
Fig. 1 is a schematic perspective exploded view of an infrared module package structure according to an embodiment of the present disclosure;
fig. 2 is a cross-sectional view of an electromagnetic shield cover of the infrared module packaging structure of fig. 1;
fig. 3 is another sectional view of the electromagnetic shielding cover of the infrared module package structure in fig. 1;
fig. 4 is a cross-sectional view of the infrared module package structure in fig. 1.
The elements in the figures are numbered as follows:
an optical lens 10;
a base 20 (wherein, the thermal conductive glue injection inlet 21 and the glue injection slot 22);
an infrared detector 30 (among others, an infrared detector bottom surface 31, a lead wire 32);
a uniform thermal layer 40;
the electromagnetic shielding cover 50 (wherein, the lead wire via hole 51, the electromagnetic shielding cover soaking surface 52, the first cavity 53, the second cavity 54, the third cavity 55, and the shielding cover closed end surface 56);
a heat conductive paste 60 (wherein a paste injection gate 61);
a thermal pad 70;
the circuit board 80 (among them, a contact 81, a heat generating component 82, a first height component 83, a second height component 84, a via hole 85, a via metal ball 86, and a ground metal ball 87).
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments of the specification.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of implementations of the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present application. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In order to solve the problem of anti-electromagnetic interference of the infrared module, the application provides an infrared module packaging structure. Referring to fig. 1, an infrared module package structure according to an embodiment of the present invention includes an optical lens 10, a base 20, and an infrared detector 30, a soaking layer 40, an electromagnetic shielding cover 50, a thermal pad 70, and a circuit board 80 sequentially bonded to each other. The base 20 is an assembly of the correcting component and the optical base, the optical lens 10 is installed at one end of the base 20, the infrared detector 30, the soaking layer 40, the electromagnetic shielding cover 50, the heat conducting pad 70 and the circuit board 80 are installed at the other end of the base 20, and the infrared detector 30 is packaged in the base 20. The infrared detector 30 is arranged on the surface of the electromagnetic shielding cover 50, which is far away from the circuit board 80, through the heat equalizing layer 40, and two sides of the heat equalizing layer 40 are respectively contacted with the infrared detector 30 and the electromagnetic shielding cover 50. The electromagnetic shielding cover 50 is covered on the circuit board 80 and embedded in the accommodating cavity at the other end of the base 20. A thermal pad 70 may be disposed between the electromagnetic shielding cover 50 and the heat generating elements on the circuit board 80 for conducting heat.
The circumference of the other end of the base 20 is provided with a heat-conducting glue-injecting inlet 21, so that the heat-conducting glue 60 can be injected between the outer side of the electromagnetic shielding cover 50 and the inner wall of the base 20 through the heat-conducting glue-injecting inlet 21, thereby realizing conductive heat dissipation between the two. The optical lens 10 is assembled on the base 20 through the internal thread at one end of the base 20, the dispensing groove 22 is arranged outside the internal thread, and the fixing, sealing and dust prevention between the optical lens 10 and the base 20 are realized through glue injection at the dispensing groove 22. In order to achieve the uniform heat and heat dissipation effect, the housing of the base 20 is made of high thermal conductivity metal materials such as copper, aluminum, silver, gold, etc.
The thermal equalization layer 40 is arranged between the infrared detector 30 and the electromagnetic shielding cover 50 to realize conductive heat dissipation between the infrared detector and the electromagnetic shielding cover. Specifically, the bottom surface 31 of the infrared detector 30 is disposed on the corresponding heat equalizing surface 52 of the electromagnetic shielding cover 50 through the heat equalizing layer 40, and the heat of the infrared detector 30 is conducted out through the heat equalizing layer 40, so that the heat transfer speed is high, the temperature distribution at the bottom of the infrared detector 30 is uniform, and the imaging and temperature measurement are facilitated. The infrared detector 30 and the electromagnetic shielding cover 50 are both located in the base 20, and the infrared detector 30 is connected to the circuit board 80 through the lead 32, so as to realize electrical connection.
Referring to fig. 2 and fig. 3, in order to achieve the electromagnetic shielding effect, the electromagnetic shielding cover 50 is a metal cover or a non-metal cover. If the electromagnetic shielding lid 50 is a metal lid with thermal conductivity, the material thereof can be selected from high thermal conductivity metals such as copper, aluminum, silver, gold, etc. If the electromagnetic shielding cover 50 is a non-metal cover, a metal shielding coating can be selectively formed on at least one surface of the electromagnetic shielding cover, or the non-metal cover is prepared by doping metal particles into a non-metal base material. The base 20 can also be made of high thermal conductivity metal materials such as copper, aluminum, silver, gold, etc., the thermal conductive glue 60 is injected between the base 20 and the electromagnetic shielding cover 50 through the thermal conductive glue injection inlet 21, the thermal conductive glue 60 forms the glue injection gate 61 at the thermal conductive glue injection inlet 21, and the conductive heat dissipation between the base 20 and the electromagnetic shielding cover 50 can be better realized through the thermal conductive glue 60.
The electromagnetic shielding cover 50 is provided with a lead via hole 51 at one side of the heat equalizing surface 52 of the electromagnetic shielding cover, so that the lead 32 of the infrared detector 30 passes through the lead via hole 51 to be connected to the circuit board 80.
The electromagnetic shielding cover 50 is formed with a first cavity 53, a second cavity 54 and a third cavity 55 on one side facing the circuit board 80, the depths of the first cavity 53, the second cavity 54 and the third cavity 55 are different and can be adjusted according to the arrangement requirement of electronic components on the circuit board 80, the number, the positions and the shapes of the cavities can be increased or reduced according to the design requirement, the freedom of PCB layout is realized, and the miniaturization of the module is realized. The end surface of the electromagnetic shielding cover 50 facing the circuit board 80 is a shielding cover closed end surface 56, which can be attached to the circuit board 80, so as to close the electronic component or the electronic component group on the circuit board 80. Preferably, the cavities are not communicated with each other, so that the electronic components or electronic component groups in different cavities on the circuit board 80 can be prevented from interfering with each other.
The circuit board 80 is provided with contacts 81 for connecting the leads 32 of the infrared detector 30. The heat-generating component 82 on the circuit board 80 may be added with the thermal pad 70, and the thermal pad 70 is attached between the heat-generating component 82 and the electromagnetic shielding cover 50, thereby realizing conductive heat dissipation.
The circuit board 80 is provided with a first height component 83 and a second height component 84 in addition to the heat generating component 82. The heating element 82, the first height element 83 and the second height element 84 may correspond to the first cavity 53, the second cavity 54 and the third cavity 55 of the electromagnetic shielding cover 50 according to different positions and heights.
The circuit board 80 is further provided with at least one via hole 85 which penetrates through the thickness of the circuit board 80 and opens into the shield cover closed end face 56 of the electromagnetic shield cover 50. While the side of the circuit board 80 facing away from the electromagnetic shield cover 50 is provided with a plurality of metal balls including a grounding metal ball 86 and a conductive metal ball 87. The grounding metal balls 86 and the conducting metal balls 87 are disposed on a side of the circuit board 80 facing away from the electromagnetic shielding cover 50 for electrically connecting to the electromagnetic shielding cover 50 through the via holes 85, so that the electromagnetic shielding cover 50 is connected to other grounding circuits through the via holes 85, the grounding metal balls 86 and the conducting metal balls 87.
In order to realize the dustproof effect of the infrared module, the optical lens 10 is assembled through the base 20 in a threaded manner, and the optical lens 10 is fixed and dustproof through glue injection at the glue dispensing groove 22; the base 20 and the circuit board 80 are fixed and dustproof by injecting the heat-conducting glue 60 at the heat-conducting glue injection inlet 21; therefore, the inner cavity of the infrared module can be totally closed and dustproof.
The infrared module packaging structure utilizes the electromagnetic shielding cover cap made of metal, the electromagnetic shielding cover cap made of the nonmetal base material mixed with metal particles, or the electromagnetic shielding cover cap with the metal shielding coating to package the infrared module electronic component, so that the electromagnetic shielding effect can be provided, and the mutual interference between an infrared detector chip and a chip or a chip set on a circuit board can be prevented; the electromagnetic shielding shroud sets up in the space between lens mount (base) and the circuit board, and the shape (each appearance chamber of electromagnetic shielding shroud) can be according to components and parts height and inner space adjustment, can not increase the holistic encapsulation size of infrared module and height, does not influence miniaturized design, can also realize the conductivity heat dissipation and the dustproof effect between electromagnetic shielding shroud and the metal base through the connection of high-efficient heat conduction glue simultaneously, improves radiating efficiency and dustproof ability. The utility model provides an infrared module packaging structure provides the dustproof packaging structure of miniature module that has electromagnetic shield and heat dissipation function, applicable in the miniature infrared module development of small-area array.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one of 8230, and" comprising 8230does not exclude the presence of additional like elements in a process, method, article, or apparatus comprising the element.
The above description is only for the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall cover the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides an infrared module packaging structure, its characterized in that, includes optical lens (10), base (20), infrared detector (30) and circuit board (80), optical lens (10) infrared detector (30) and circuit board (80) are installed in order on base (20) with infrared detector (30) encapsulation is in base (20), infrared detector (30) with be equipped with electromagnetic shield shroud (50) between circuit board (80), electromagnetic shield shroud (50) cover is established on circuit board (80) and embedding in base (20).
2. The infrared module package structure of claim 1, wherein: the electromagnetic shielding cover (50) is a metal cover made of heat-conducting metal, or the electromagnetic shielding cover (50) is a non-metal cover with at least one surface formed with a metal shielding coating.
3. The infrared module package structure of claim 2, wherein: the optical lens (10) is connected to one end of the base (20) and sealed and fixed through glue injection of a glue dispensing groove (22); the circuit board (80) is connected to the other end of the base (20), and heat-conducting glue (60) is injected between the electromagnetic shielding cover (50) and the circuit board (80) and between the electromagnetic shielding cover (50) and the base (20) through a heat-conducting glue injection inlet (21).
4. The infrared module package structure of claim 2, wherein: electromagnetic shield shroud (50) is deviating from the one side of circuit board (80) is equipped with electromagnetic shield shroud soaking face (52), infrared detector bottom surface (31) of infrared detector (30) with electromagnetic shield shroud soaking face (52) all contact with soaking layer (40).
5. The infrared module package structure of claim 4, wherein: and one side of the heat equalizing surface (52) of the electromagnetic shielding cover (50) is provided with a lead through hole (51) so that a lead (32) of the infrared detector (30) passes through the lead through hole (51) to be connected to the circuit board (80).
6. The infrared module package structure of claim 2, wherein: a heat conducting pad (70) is arranged between a heating element (82) on the circuit board (80) and the electromagnetic shielding cover cap (50), and two side faces of the heat conducting pad (70) are respectively attached to the heating element (82) and the electromagnetic shielding cover cap (50).
7. The infrared module package structure of claim 2, wherein: at least one containing cavity is formed in one side, facing the circuit board (80), of the electromagnetic shielding cover (50), and electronic components on the circuit board (80) are placed in the at least one containing cavity; the end face, facing the circuit board (80), of the electromagnetic shielding cover (50) is a shielding cover closed end face (56) attached to the circuit board (80).
8. The infrared module package structure of claim 7, wherein: the circuit board is characterized in that the number of the accommodating cavities is multiple, the depths of the accommodating cavities are different, and electronic components or electronic component groups which are matched with the circuit board (80) in height are accommodated in the accommodating cavities.
9. The infrared module package structure of claim 2, wherein: the circuit board (80) is provided with at least one through-thickness via hole (85), and the via hole (85) leads to the electromagnetic shielding cover (50); one side of the circuit board (80), which faces away from the electromagnetic shielding cover (50), is provided with a grounding metal ball (86) and a conducting metal ball (87), and the electromagnetic shielding cover (50) is connected to a grounding circuit through the conducting hole (85), the grounding metal ball (86) and the conducting metal ball (87).
10. The infrared module package structure of any one of claims 1 to 9, wherein: the base (20) is made of a heat-conducting metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221611280.6U CN218277703U (en) | 2022-06-24 | 2022-06-24 | Infrared module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221611280.6U CN218277703U (en) | 2022-06-24 | 2022-06-24 | Infrared module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218277703U true CN218277703U (en) | 2023-01-10 |
Family
ID=84757115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221611280.6U Active CN218277703U (en) | 2022-06-24 | 2022-06-24 | Infrared module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218277703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117590025A (en) * | 2024-01-19 | 2024-02-23 | 中国工程物理研究院电子工程研究所 | Piezoresistive acceleration sensor |
-
2022
- 2022-06-24 CN CN202221611280.6U patent/CN218277703U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117590025A (en) * | 2024-01-19 | 2024-02-23 | 中国工程物理研究院电子工程研究所 | Piezoresistive acceleration sensor |
| CN117590025B (en) * | 2024-01-19 | 2024-03-19 | 中国工程物理研究院电子工程研究所 | Piezoresistive acceleration sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1646271B1 (en) | Control device and method of manufacturing thereof | |
| US6777819B2 (en) | Semiconductor package with flash-proof device | |
| TW529323B (en) | Method for producing electronic device and electronic device and resin filling method | |
| EP3134797B1 (en) | Thermal solutions for system-in-package assemblies in portable electronic devices | |
| US5436203A (en) | Shielded liquid encapsulated semiconductor device and method for making the same | |
| EP2696575B1 (en) | Solid-state image pickup device, and method for manufacturing solid-state image pickup device | |
| US7999371B1 (en) | Heat spreader package and method | |
| US6580167B1 (en) | Heat spreader with spring IC package | |
| US20160181125A1 (en) | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | |
| US20040061138A1 (en) | Power semiconductor device with high radiating efficiency | |
| JP2011528176A (en) | Electronic unit and manufacturing method thereof | |
| JP2008537333A (en) | Layered structure of integrated circuits on other integrated circuits | |
| CN211879389U (en) | Photosensitive module | |
| KR102149387B1 (en) | Electronic component module | |
| CN108701681A (en) | Shield the integrated antenna package and and its manufacturing method of EMI | |
| US6562655B1 (en) | Heat spreader with spring IC package fabrication method | |
| CN218277703U (en) | Infrared module packaging structure | |
| WO2020017582A1 (en) | Module | |
| EP4236642A1 (en) | Heat dissipation apparatus and electronic device | |
| US20180053719A1 (en) | Semiconductor package and electronic device module using the same | |
| US11410977B2 (en) | Electronic module for high power applications | |
| US20050104164A1 (en) | EMI shielded integrated circuit packaging apparatus method and system | |
| JP6517296B2 (en) | Portable electronic device, image capturing module and mounting unit | |
| JPH05160312A (en) | Module for electronic package | |
| US20130140664A1 (en) | Flip chip packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: INFIRAY TECHNOLOGIES CO.,LTD. Assignor: Yantai Airui Photo-Electric Technology Co.,Ltd. Contract record no.: X2024980006380 Denomination of utility model: Infrared module packaging structure Granted publication date: 20230110 License type: Common License Record date: 20240530 |