CN110041849A - A kind of conducting resinl that Z-direction electric conductivity is strengthened - Google Patents
A kind of conducting resinl that Z-direction electric conductivity is strengthened Download PDFInfo
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- CN110041849A CN110041849A CN201910338077.2A CN201910338077A CN110041849A CN 110041849 A CN110041849 A CN 110041849A CN 201910338077 A CN201910338077 A CN 201910338077A CN 110041849 A CN110041849 A CN 110041849A
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- Prior art keywords
- conducting resinl
- conducting
- strengthened
- electric conductivity
- particles
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The present invention relates to a kind of conducting resinl, the conducting resinl of specifically a kind of Z-direction electric conductivity reinforcing.Conducting resinl of the invention (or conductive coating, or conductive ink) it is the conducting particles that special shape is mixed on the basis of non-directional conducting resinl, so that Z-direction (thickness direction of the conducting resinl in wire joining, i.e. with the vertical direction of other conducting wire faying surfaces) interface resistance is greatly reduced, the present invention can be applicable to the electric and electronic component or component of various requirement low resistance or high current.
Description
Technical field
The present invention relates to a kind of conducting resinl, the conducting resinl of specifically a kind of Z-direction electric conductivity reinforcing.
Background technique
If conducting resinl in electronic material is distinguished with conductive directionality, can be divided into: general direction-free conducting resinl,
And anisotropic conductive adhesive paste (ACP or ACF, Anisotropic Conductive Paste or Film).
Anisotropic conductive adhesive paste (ACP or ACF, Anisotropic Conductive Paste or Film) or be Z
It is only conductive in the thickness direction of contact electrode to conducting resinl and the direction of parallel surface pole-face is non-conductive, it is mainly used in special small
The contact of electric current thin space connects.Such conducting resinl is advantageous to the encapsulation of fine pitch chip circuit, can ensure that
Remain to maintain two component counter electrodes conducting up and down when electrode spacing very little, and adjacent electrode pole is insulated.But such conducting resinl
Contact section very little biggish electric current as power supply (power) or is connect though being enough to transmit the voltage signal of low current amount
The earth (Ground) contact, it is just usually less applicable.And this conducting resinl can only do component interface connection and use, because of plane
Direction not conduction, so cannot use as direction-free conducting resinl as printing or deposited traces.
Direction-free conducting resinl, with graphite particulate, golden particle, silver particles, as the conducting resinl of conductive material.Its advantage is that
It can be widely used, both can be used as the conductor of electrode interface, conducting wire can also be directly printed into.If but as the conductor of electrode interface,
Bigger than normal in the interface resistance that conducting resinl is connect with metal electrode, especially not gold-plated electrode surface has a layer oxide, between electricity
Between pole and conducting resinl, increase its resistance.In the low-voltage signal transmission application of more and more general Times, this interface resistance
It will become critical disadvantage.Or as power supply (power) or ball (Ground) contact is grounded using upper in biggish electric current
It is not suitable for.
Another technology is to be made into electrically conductive ink or coating using graphene sheet nanometer conductive material, although graphite
The resistance of alkene monomer is extremely low, but is actually made into after conductive coating is printed as route, and measuring resistance is than application nano silver coating in fact
Route is much higher, and main cause is that the graphene of sheet and sheet is too thin, and overlap joint is not easy in gelatinous coating becomes low resistance
Circuit.
Summary of the invention
The purpose of the present invention is in view of the above shortcomings of the prior art, provide a kind of conducting resinl that Z-direction electric conductivity is strengthened.
Conducting resinl of the invention (or conductive coating, or conductive ink) it is incorporation special shape on the basis of non-directional conducting resinl
Conducting particles, so that conducting resinl connects in the Z-direction (thickness direction, the i.e. vertical direction with other conducting wire faying surfaces) of wire joining
Mouth resistance is greatly reduced, and the present invention can be applicable to the electric and electronic component or component of various requirement low resistance or high current.
Technical scheme is as follows:
A kind of conducting resinl that Z-direction electric conductivity is strengthened, characterized in that the conducting resinl is by mixing several lead in non-directional conducting resinl
Charged particle is constituted, and the surface of the conducting particles has several wedge angles.
Preferably, the surface of the conducting particles at least has the wedge angle there are two less than 90 °.
Preferably, the conducting particles is silver or nickel is gold-plated or copper plates WU.
Preferably, the partial size of the conducting particles is 2000nm-5000nm or 200nm-2000nm.
Preferably, the longest shaft length of every conducting particles/most minor axis length is less than 2.
Preferably, the non-directional conducting resinl is carbon paste, elargol, nano-silver colloid, gold size, carbon nanotubes ink, graphite
One of alkene ink.
Preferably, when which is used for upper/lower electrode interface, apply pressure (0.7-3 in the Z-direction of two electrodes
MPa), the wedge angle of conducting particles is enable to be pierced into electrode surface oxidation film, to form low impedance circuit.
Preferably, when which is used for printed wire, applies rolling pressure (0.7-3 MPa) thereon, make directionless
Property conducting resinl material have the conducting particles of higher probability and larger particles close contact, to reduce the face impedance of circuit.
Conducting resinl of the invention is a kind of Z-direction reinforced conductive glue, conductive in the in-plane with circuit contact area, and is hung down
The conducting resinl that histogram is more reinforced to the conductive capability of (i.e. Z-direction) can be applied to chip package, microelectronic circuit.Of the invention leads
Electric glue is unlike ACF or ACP maximum: ACP or ACF is connected in Z-direction, but in-plane is not turned on；And it is of the invention
It is in-plane conducting, the more conducting of reinforcement Z-direction.
Detailed description of the invention
Fig. 1 is the schematic diagram that conducting resinl of the invention is used for upper/lower electrode interface；
Fig. 2 is schematic diagram when conducting resinl of the invention is used for printed wire.
Specific embodiment
A kind of conducting resinl that Z-direction electric conductivity is strengthened, by mixing leading for special multiple point in non-directional conducting resinl
Charged particle is constituted, the polyhedron (conducting particles) with surface imperfection shape, is less than at conducting particles surface at least two
90 degree of wedge angle, the non-elongated shape of conducting particles or slice-shaped, conducting particles longest shaft length/most minor axis length < 2 make it not
The conducting of in-plane, the electric conductivity of more reinforcement Z-direction contact up and down.
Applying pressure between upper/lower electrode pierces through electrode surface oxidation film by conducting particles, to reduce interface impedance.?
After circuit coating, then at rolling pressure is applied thereon, these nanometer conductive materials is made to have leading for higher probability and larger particles
Charged particle is in close contact, to reduce the face impedance of circuit.
It can be carbon paste (graphite) as the non-directional conducting resinl on basis, elargol (silver powder), nano-silver colloid (nanometer-level silver
Powder), gold size (bronze), carbon nanotubes ink, graphene ink.For example, mixing partial size 200nm- in nano conductive printing ink
The conducting particles of 2000nm optimizes the overlap joint between nano powder, reduces the face impedance of electrically conductive ink deposited traces.
For conducting resinl of the invention in upper/lower electrode interface application, it is partial size 2000nm- that special conducting particles, which is added,
Metal or alloy particle, the shapes such as silver, the nickel of 5000nm is gold-plated, copper plating WU are multiple point conducting particles, rather than elongated shape or
Slice-shaped or spheroidal.When heating presses upper/lower electrode, has the oxide skin that angular conducting particles can be pierced into metal electrode
Film can be greatly reduced between electrode terminal, perpendicular to the interface resistance of line direction, as shown in Figure 1.
In upper/lower electrode interface application, technique includes the Z-direction application pressure in two electrodes, makes special conduction
The wedge angle of particle is able to be pierced into metal surface, to form low impedance circuit, as shown in Figure 1.Generally use non-directional conductive carbon
For glue when upper and lower aluminium electrode overlaps, because the oxide layer on aluminium electrode surface obstructs, the interface electricity group of contact has 0.5 Ω -2 Ω, if
Using conducting resinl of the present invention, then apply pressure, interface resistance can be down to 0.2 Ω or less.
When conducting resinl of the invention is as graphene or nano-sized carbon printed wire, the special conducting particles of addition is partial size
The metal or alloy conducting particles such as gold-plated, the copper plating WU of silver, the nickel of 200nm-2000nm.These conducting particles sizes are larger, can be with
There is larger probability to form overlap joint between graphene platelet or form overlap joint between carbon nanotubes, can effectively drop these a kind of apple rice materials
Overlap resistance enables the characteristic of original graphene or nano-sized carbon to bring into play, reduces the face resistance (Sheet of route
Resistance), as shown in Figure 2.
When application is as graphene or nano-sized carbon printed wire, technique is included in after circuit printing coating then at thereon
Apply rolling pressure, these nanometer conductive materials is made to have the close contact of the conducting particles of higher probability and larger particles, to be formed
Low impedance circuit.
So to belong to all directions all conductive for conducting resinl of the invention, it is parallel to route or all conductive perpendicular to line direction.
Claims (8)
1. the conducting resinl that a kind of Z-direction electric conductivity is strengthened, characterized in that the conducting resinl is several by mixing in non-directional conducting resinl
Conducting particles is constituted, and the surface of the conducting particles has several wedge angles.
2. the conducting resinl that a kind of Z-direction electric conductivity according to claim 1 is strengthened, characterized in that the conducting particles
Surface at least has the wedge angle there are two less than 90 °.
3. the conducting resinl that a kind of Z-direction electric conductivity according to claim 2 is strengthened, characterized in that the conducting particles is
Silver-colored or nickel is gold-plated or copper plates WU.
4. the conducting resinl that a kind of Z-direction electric conductivity according to claim 3 is strengthened, characterized in that the conducting particles
Partial size is 2000nm-5000nm or 200nm-2000nm.
5. the conducting resinl that a kind of Z-direction electric conductivity according to claim 2 or 4 is strengthened, characterized in that every conducting particles
Longest shaft length/most minor axis length less than 2.
6. the conducting resinl that a kind of Z-direction electric conductivity according to claim 1 or 2 is strengthened, characterized in that described non-directional
Conducting resinl is one of carbon paste, elargol, nano-silver colloid, gold size, carbon nanotubes ink, graphene ink.
7. the conducting resinl that a kind of Z-direction electric conductivity according to claim 1 is strengthened, characterized in that the conducting resinl is used for
When lower electrode interface, applies pressure in the Z-direction of two electrodes, the wedge angle of conducting particles is enable to be pierced into electrode surface oxidation
Film, to form low impedance circuit.
8. the conducting resinl that a kind of Z-direction electric conductivity according to claim 1 is strengthened, characterized in that the conducting resinl is for printing
When brush route, apply rolling pressure thereon, non-directional conducting resinl material is made to have the conducting particles of higher probability and larger particles
It is in close contact, to reduce the face impedance of circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910338077.2A CN110041849A (en) | 2019-04-25 | 2019-04-25 | A kind of conducting resinl that Z-direction electric conductivity is strengthened |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910338077.2A CN110041849A (en) | 2019-04-25 | 2019-04-25 | A kind of conducting resinl that Z-direction electric conductivity is strengthened |
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| Publication Number | Publication Date |
|---|---|
| CN110041849A true CN110041849A (en) | 2019-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910338077.2A Pending CN110041849A (en) | 2019-04-25 | 2019-04-25 | A kind of conducting resinl that Z-direction electric conductivity is strengthened |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170050036A (en) * | 2015-10-29 | 2017-05-11 | 삼성에스디아이 주식회사 | Anisotropic conductive film, a display device using thereof and the method of fabricating the display device |
| WO2018118880A1 (en) * | 2016-12-21 | 2018-06-28 | 3M Innovative Properties Company | Conductive particles, articles, and methods |
| CN207608516U (en) * | 2017-05-09 | 2018-07-13 | 3M创新有限公司 | Conductive adhesive layer |
| CN108913057A (en) * | 2017-03-27 | 2018-11-30 | 昆山雅森电子材料科技有限公司 | A kind of incorgruous type conductive fabric glue of multilayer and preparation method thereof |
-
2019
- 2019-04-25 CN CN201910338077.2A patent/CN110041849A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170050036A (en) * | 2015-10-29 | 2017-05-11 | 삼성에스디아이 주식회사 | Anisotropic conductive film, a display device using thereof and the method of fabricating the display device |
| WO2018118880A1 (en) * | 2016-12-21 | 2018-06-28 | 3M Innovative Properties Company | Conductive particles, articles, and methods |
| CN108913057A (en) * | 2017-03-27 | 2018-11-30 | 昆山雅森电子材料科技有限公司 | A kind of incorgruous type conductive fabric glue of multilayer and preparation method thereof |
| CN207608516U (en) * | 2017-05-09 | 2018-07-13 | 3M创新有限公司 | Conductive adhesive layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
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Application publication date: 20190723 |
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| RJ01 | Rejection of invention patent application after publication |