CN208819182U - Touch module - Google Patents
Touch module Download PDFInfo
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- CN208819182U CN208819182U CN201821313678.5U CN201821313678U CN208819182U CN 208819182 U CN208819182 U CN 208819182U CN 201821313678 U CN201821313678 U CN 201821313678U CN 208819182 U CN208819182 U CN 208819182U
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- China
- Prior art keywords
- conductive adhesive
- protective layer
- adhesive layer
- signal transmission
- circuit board
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Abstract
A kind of touch module, the touch module include touch panel unit, conductive adhesive layer and circuit board.Touch panel unit includes substrate, the touch-control sensing structure for being set to the substrate, is set to the substrate and connects the signal transmission structure of the touch-control sensing structure; and the protective layer of the part of the surface of the covering signal transmission structure, the protective layer are located at two opposite sides of the signal transmission structure with the substrate.Conductive adhesive layer includes the main part being covered at the not set protective layer of the signal transmission structure, and is extended over by the main part to the shielding part of the protective layer.The circuit board is set at corresponding conductive adhesive layer, and is located at two opposite sides of the conductive adhesive layer with the signal transmission structure.The circuit board includes plate body and is set to the plate body and connects the conductive structure of the conductive adhesive layer.By the shielding part of conductive adhesive layer, the implementation of dispensing processing procedure can be omitted, improve process rate and reduces manufacturing cost.
Description
Technical field
The utility model helps to reduce cost, improves yield in being related to a kind of touch module more particularly to a kind of
Touch module.
Background technique
In view of touch interface in operational intuitive and convenience, current numerous electronic products can all integrate touch module
Using the operation interface as user.General touch module is with transparent conductive film or other materials production for detecting touch-control position
The touch-control sensing structure set, sensor signal caused by gesture can be by such as metal depending on the user's operation for touch-control sensing structure
Conducting wire is conducted at weld pad (bond pad), and sensor signal is delivered to control chip by the circuit board being electrically connected with weld pad,
To carry out relevant analysis and Control.Wherein, between the conductive terminal (golden finger) of the weld pad and circuit board of touch module
It can be electrically conducted by the formation of the conducting mediums such as conducting resinl, though conducting medium, which is distributed on weld pad, will not usually be covered with weld pad
Whole surface, therefore weld pad is exposed to outer part and may be influenced by the harmful components in environment and lead to electrical property or in appearance
Exception, influence touch-control performance and product yield.Though the problem of above-mentioned electrical property or abnormal appearance, can be by dispensing processing procedure in conduction
Medium does not cover at weld pad formation colloid, and so as to improving the protection to weld pad, however to belong to wet process not easily-controllable for dispensing processing procedure
Precision machining processed, the unusual condition of starved or excessive glue can still be generated by leading to colloid sometimes, influence the protecting effect to weld pad.This
Outside, the process apparatus for dispensing processing procedure is expensive, and in script manufacturing process be added dispensing processing procedure need to expend it is additional
Material, time lead to the increase of production cost.
Utility model content
Therefore, a wherein purpose of the utility model is providing a kind of touch module that can solve foregoing problems.
Then, the utility model touch module includes touch panel unit, conductive adhesive layer and circuit in some state sample implementations
Plate.The touch panel unit includes substrate, the touch-control sensing structure for being set to the substrate, is set to the substrate and connects institute
The signal transmission structure of touch-control sensing structure is stated, and covers the protective layer of the part of the surface of the signal transmission structure, the guarantor
Sheath and the substrate are located at two opposite sides of the signal transmission structure.The conductive adhesive layer includes covering the signal transmission
Main part at the not set protective layer of structure, and extended over by the main part to the shielding part of the protective layer.
The circuit board is set at corresponding conductive adhesive layer, and is located at the two opposite of the conductive adhesive layer with the signal transmission structure
Side.The circuit board includes plate body and is set to the plate body and connects the conductive structure of the conductive adhesive layer.
In some state sample implementations, the circuit board and the protective layer are underlapped.
In some state sample implementations, between the plate edge of the neighbouring protective layer and the layer edge of the protective layer of the plate body
Spacing range between 100 to 400 microns.
In some state sample implementations, the conductive structure and the protective layer of the circuit board are underlapped, the plate body
Plate edge it is Chong Die with the shielding part of the conductive adhesive layer, and the plate edge and the protective layer are located at the two of the shielding part
Opposite side.
In some state sample implementations, the shielding part of the conductive adhesive layer cover the width range of the protective layer between
500 to 700 microns.
In some state sample implementations, the plate edge of the plate body and the overlapping widths of the protective layer are between 50 to 700
Micron.
The utility model has the beneficial effects that: the conductive adhesive layer is in addition to as the signal transmission structure and the electricity
Outside conductive media between the plate of road, also cooperate the surface for covering the signal transmission structure, therefore energy jointly with the protective layer
Good protecting effect is provided to the signal transmission structure, avoids the signal transmission structure from occurring electrical or apparent different
Often.By conductive adhesive layer to be produced to the shielding part extended over to the protective layer, the reality of dispensing processing procedure can be omitted
It applies, and can ensure that the signal transmission structure can be by complete covering protection, therefore process rate can be improved and reduce system
Cause this.
Detailed description of the invention
Other features and effect of the utility model will be clearly presented in the embodiment referring to schema, in which:
Fig. 1 is a schematic elevation view, illustrates the first embodiment of the utility model touch module；
Fig. 2 is the schematic side view of the first embodiment；
Fig. 3 is a flow chart, illustrates the execution process of the manufacturing method of the first embodiment；
Fig. 4 to fig. 6 is schematic side view, illustrates the structure fabrication process of the manufacturing method of the first embodiment；
Fig. 7 is side view diagram, illustrates the second embodiment of the utility model touch module；And
Fig. 8 is side view diagram, illustrates the manufacturing process of the second embodiment.
Specific embodiment
Before the utility model is described in detail, it shall be noted that in the following description content, similar component be with
It is identically numbered to indicate.
Refering to fig. 1, Fig. 2 and Fig. 4 is the first embodiment of the utility model touch module 1.The touch module 1 can be with shifting
The various electronic device integration such as mobile phone, tablet computer, display uses, and specifically includes a touch panel unit 2, a conducting resinl
Layer 3 and a circuit board 4.
The touch panel unit 2 is the nuclear structure of the touch module 1, including a substrate 21, a touch-control sensing structure 22, one
Signal transmission structure 23 and a protective layer 24.
The substrate 21 includes that a sensing area 211 and one are interval in the bonding land 212 of the sensing area 211, can use glass base
Plate, plastic base, sapphire substrate (sapphire), polyethylene terephthalate thin film (PET film), polyimides are thin
The materials such as film (PI film) are made as hard or flexible substrate, using as the touch-control sensing structure 22, the signal transmission structure
23, the bearing structure of the protective layer 24.
The touch-control sensing structure 22 is set to the sensing area 211 of the substrate 21, can use tin indium oxide (ITO), nanometer
The production of the electrically conducting transparents material such as silver, carbon nanotubes, metal grill, can be according to corresponding to its capacitance variation when user's touching
The sensor signal of generation, as analysis, the control foundation for judging touch position.In addition, the touch-control sensing structure 22 can also be adopted
It is made of materials such as high molecular material, pressure drag material, piezoelectric materials, meeting after such touch-control sensing structure 22 is depressed by a user
Lead to electrical change due to its thickness change, structural bending deformation or generation direct piezoelectric effect, and in user's pressing, touching
Power can not generate corresponding electrical knots modification simultaneously, it is thus possible to press pressure is carried out according to the detecting that it electrically changes
The judgement of value.Accordingly, which can be used for detecting touching pressure other than it can be used for detecting touch position.
In the example of Fig. 1, it is the representative of the strip structure that is longitudinally extended using four as the touch-control sensing structure 22, however is implementing
The upper touch-control sensing structure 22 can use longitudinally, laterally or oblique staggered electrode structure is as sensing structure, specific structure
It makes and shape is not limited with schema disclosure.
The signal transmission structure 23 is set to the substrate 21 and connects the touch-control sensing structure 22, specifically includes a plurality of connection
In the touch-control sensing structure 22 signal conductor 231 and it is multiple connect respectively with the signal conductor 231 and be located at the engagement
The contact 232 in area 212, the contact 232 are used to be electrically connected with the circuit board 4, the sense for allowing the touch-control sensing structure 22 to generate
Answer signal that can be transmitted to the circuit board 4, so that control chip non-drawn in figure carries out analytic operation.On material selection,
The signal transmission structure 23 can use the transparent conductive materials such as metal materials or tin indium oxide such as copper, silver, gold to make, when view is practical
Depending on needing.
The protective layer 24 covers the part of the surface of the signal transmission structure 23, and is located at signal transmission with the substrate 21 and ties
Two opposite sides of structure 23, to be influenced the passivation of electrical property and appearance by external environmental factor for protecting the signal transmission structure 23 not
Layer structure (passivation).
The conductive adhesive layer 3 includes the main part 31 at the not set protective layer 24 for covering the signal transmission structure 23,
And one extend to the protective layer 24 by the main part 31 and cover the shielding part 32 of the protective layer 24.The conductive adhesive layer 3 is used for
As the conductive media between the signal transmission structure 23 and the circuit board 4, while also because being covered on the signal transmission structure 23
Surface and can to the signal transmission structure 23 provide protecting effect.By the formation of the shielding part 32, the conductive adhesive layer 3 can be allowed
A part and the protective layer 24 be laminated, make the intersection of the conductive adhesive layer 3 and the protective layer 24 will not be because of structure fabrication
Error and cause the signal transmission structure 23 to there is part of the surface not covered by the conductive adhesive layer 3 with the protective layer 24, it is so real
The mode of applying can ensure that the conductive adhesive layer 3 and the protective layer 24 provide perfect protecting effect to the signal transmission structure 23.This reality
It applies in example, which made of anisotropic conductive adhesive paste (anisotropic conductive film, ACF), tool
There is simplified adhesion process and improve conductive structure density, but the material selection of the conductive adhesive layer 3 is not led with anisotropy
Electric glue is limited.In addition, in the present embodiment the shielding part 32 cover the protective layer 24 width range W1 (see Fig. 2) preferably between
It 500 to 700 microns, can ensure the covering protection effect of the conductive adhesive layer 3 within this range, and be easy control during processing procedure
The production precision for making the conductive adhesive layer 3, the problem of being not susceptible to starved, excessive glue, help to promote process rate.
The circuit board 4 is set at the corresponding conductive adhesive layer 3, and is located at the conductive adhesive layer 3 with the signal transmission structure 23
Two opposite sides.The circuit board 4 includes that a plate body 41 and one is set to the plate body 41 and connects the conductive structure of the conductive adhesive layer 3
42, the sensor signal for transmitting the signal transmission structure 23 is transferred to the devices such as external control chip.It, should in the present embodiment
Circuit board 4 is a bendable printed circuit board (flexible printed circuit, FPC), which is, for example, with poly-
Flexible base plate made by imide membrane (PI film), the conductive structure 42 then include the gold made with such as printing technology
Belong to material conducting wire and the golden finger structure (golden for being electrically connected by the conductive adhesive layer 3 with the contact 232
Finger), however according to actual needs, the embodiment of the circuit board 4 can correspond to adjustment, not be with disclosure herein
Limit.
Refering to Fig. 3~Fig. 6, illustrate the manufacturing method of the touch module 1 of the first embodiment below.
Firstly, being first to provide, prepare the touch panel unit 2 not yet assembled, the circuit board 4, Yi Jiyi in step S1
Pressing structure 5 for pressure programming as shown in Figure 5.The touch panel unit 2, the circuit board 4 specific structure as before stated
It is bright.The pressing structure 5 is, for example, the pressure head of a press equipment, and includes connecing for a plate body 41 for compressing the circuit board 4
Contacting surface 51 and one connect the contact surface 51 lateral margin 52.The contact surface 51 of the pressing structure 5 is recessed at the corresponding lateral margin 52
A Circulation Area 511 is formed, thus shows similar inverted step-like configuration.
It then, is the conductive adhesive layer 3 and the circuit board 4 to be set on the touch panel unit 2 of such as Fig. 4 in step S2,
And form structure as shown in Figure 5.Specifically, this step is that the conductive adhesive layer 3 is first arranged in the signal transmission structure 23
The not set protective layer 24 surface, and make the conductive adhesive layer 3 neighbouring and be interval in the protective layer 24.Wherein, in this step
The spacing distance D1 of the S2 conductive adhesive layer 3 and the protective layer 24 is preferably not more than 500 microns, within the scope of this spacing distance compared with
The conductive adhesive layer 3 be can be effectively controlled in the structure fabrication of down-stream, and can be compatible with the specification of press equipment, in order to life
The progress of manufacture is produced, however the setting of spacing distance D1 can regard actual needs adjustment, not be limited with disclosure herein.
On the other hand, the setting of the circuit board 4 is the circuit board 4 to be directed at the conductive adhesive layer 3, and allow the circuit board 4
The conductive structure 42 towards the conductive adhesive layer 3, to carry out that the circuit board 4 is connected to, is attached to the program of the conductive adhesive layer 3.
Wherein, the conductive adhesive layer 3 is to use anisotropic conductive adhesive paste, therefore to allow the circuit board 4 adjacent to the protective layer 24 in the present embodiment
But it is not Chong Die with the protective layer 24, especially to allow the conductive structure 42 of the circuit board 4 not Chong Die with the protective layer 24, it is former
If following process allows the conductive adhesive layer 3 to flow on the protective layer 24 because being that the conductive structure 42 is Chong Die with the protective layer 24
And after being contacted with the conductive structure 42, conducting particles in the conductive adhesive layer 3 is easy by the circuit board 4, the protective layer 24
It squeezes and concentrations, aggregation, be so easy to produce electrically conducting for horizontal direction and lead to the exception of signal transmission.Therefore,
The present embodiment configures the circuit board 4 to not be overlapped with the protective layer 24, wherein the one of the neighbouring protective layer 24 of the plate body 41
Spacing range D2 between plate edge 411 and this layer of edge 241 of the protective layer 24 is preferably between 100 to 400 microns, so compared with energy
The exception for effectively avoiding signal from transmitting.However, when the conductive adhesive layer 3 is using conductive material other than anisotropic conductive adhesive paste, it should
The set-up mode of circuit board 4 is not limited then with above embodiment.
After completing above procedure, it is to be pressed by the pressing structure 5 to the circuit board 4 in step S3, this is allowed to lead
The electric flowing of glue-line 3 extends on the protective layer 24, is changed into the conductive adhesive layer 3 as the state sample implementation of Fig. 5 and forms this such as Fig. 6
The state sample implementation of main part 31 and the shielding part 32.Specifically, step S3 is first as shown in figure 5, the pressing structure 5 is right
The quasi- circuit board 4, the conductive adhesive layer 3 and the protective layer 24, and the Circulation Area 511 of the pressing structure 5 is directed at the conducting resinl
3 at the protective layer 24 and the protective layer 24 is at the conductive adhesive layer 3 for layer.Wherein, lateral margin at the Circulation Area 511
The 241 spacing W2 of layer edge of the neighbouring conductive adhesive layer 3 of 52 orthographic projection and the protective layer 24 is preferably not more than 500 microns, and
The layer of the neighbouring conductive adhesive layer 3 of the orthographic projection and protective layer 24 of the inner edge 512 far from the lateral margin 52 of the Circulation Area 511
Space D 3 between edge 241 is preferably not more than 100 microns, and structure configuration so and alignment settings are each contributed to the conduction
The machining control of glue-line 3.After completing alignment operation, which can be pressed toward the touch panel unit 2 and the conductive adhesive layer 3
It closes, allows the pressing structure 5 to apply pressure to the plate body 41 of the circuit board 4 as shown in Figure 6 with the contact surface 51, and make the contact surface 51
The Circulation Area 511 and the protective layer 24, the signal transmission structure 23 keep interval and formed a flowing space 6.The pressing knot
Structure 5 can allow the conductive adhesive layer 3 to flow via the flowing space 6 toward the protective layer 24 extrusion of the circuit board 4 and form covering
The shielding part 32 of the protective layer 24.In this way, by the pressing of the pressing structure 5 and the Circulation Area 511, the flowing space 6
Configuration, the flow regime that can be effectively controlled the conductive adhesive layer 3 and the conductive adhesive layer 3 allow this to the covering state of the protective layer 24
Conductive adhesive layer 3 will not lead to the problem of starved or excessive glue, enable the cooperation of the conductive adhesive layer 3 and the protective layer 24 to the signal
Transmission structure 23 provides perfect structural defence effect, occurs to avoid the signal transmission structure 23 electrical or apparent different
Often, so as to promoting process rate.In addition, above-mentioned manufacturing method can be effectively controlled the machining state of the conductive adhesive layer 3, this is avoided to lead
The exception of starved occurs for electric glue-line 3, therefore does not need additionally to carry out again in order to avoid starved after the conductive adhesive layer 3 completes
Program for dispensing glue can so simplify processing procedure and save the equipment of dispensing processing procedure, materials'use, manufacturing cost is greatly reduced and saves
Save manufacturing time.
It is the second embodiment of the utility model touch module 1 refering to Fig. 7.Most structures of the second embodiment and the
One embodiment is identical, though main difference is that in second embodiment the conductive structure 42 of the circuit board 4 not with the protective layer 24
Overlapping, but the plate edge 411 of the plate body 41 is then Chong Die with the protective layer 24, the shielding part 32 of the conductive adhesive layer 3, and the plate edge
411 are located at two opposite sides of the shielding part 32 with the protective layer 24, thus formed a kind of protective layer 24, the conductive adhesive layer 3, this
The structure that the plate edge 411 of plate body 41 is from bottom to top sequentially laminated.In the present embodiment, the plate edge 411 of the plate body 41 and the guarantor
The overlapping widths W3 of sheath 24 is preferably between 50 to 700 microns, so as to the machining control for the conductive adhesive layer 3.
Refering to Fig. 8, the view for being similar to Fig. 5, Fig. 6 for one, for illustrating the manufacturing process of the second embodiment.According to
The embodiment of the circuit board 4 in two embodiments, since when the circuit board 4 is arranged, the plate edge 411 of the plate body 41 is i.e. to hang down
The mode for being directly interval in the protective layer 24 is Chong Die with the protective layer 24, therefore will form one between the plate body 41 and the protective layer 24
Space, it is subsequent by the pressing structure 5 to the circuit board 4 press when, originally with the preferable spacing distance D4 of protective layer 24 be not
The conductive adhesive layer 3 greater than 500 microns can flow to the protective layer 24, and via between the circuit board 4 and the protective layer 24
On spatial flow to the protective layer 24, the conductive adhesive layer 3 is allowed to form the shielding part 32 for covering the protective layer 24.In this way,
Via the embodiment of the plate edge 411 of the plate body 41, it also can be effectively controlled the process of the conductive adhesive layer 3, avoid excessive glue
Or the abnormal of starved occurs, so as to promoting process rate, simplifying processing procedure and reducing manufacturing cost.
In conclusion the conductive adhesive layer 3 of the utility model touch module 1 is in addition to as the signal transmission structure 23 and this
Outside conductive media between circuit board 4, also cooperate the surface for covering the signal transmission structure 23 jointly with the protective layer 24, it can be right
The signal transmission structure 23 provides good protecting effect.It extends over by conductive adhesive layer 3 is produced to the protective layer 24
The shielding part 32, the implementation of dispensing processing procedure can be omitted, and can ensure that the signal transmission structure 23 can be covered completely
Protection, therefore process rate can be improved and reduce cost.Be therefore, the utility model touch module 1 and its manufacturing method, really
The purpose of this utility model can be reached.
Claims (6)
1. a kind of touch module, which is characterized in that the touch module includes:
Touch panel unit including substrate, the touch-control sensing structure that is set to the substrate, is set to the substrate and connects described
The signal transmission structure of touch-control sensing structure, and cover the protective layer of the part of the surface of the signal transmission structure, the protection
Layer is located at two opposite sides of the signal transmission structure with the substrate；
Conductive adhesive layer, the main part at the not set protective layer including covering the signal transmission structure, and by the master
Body portion is extended over to the shielding part of the protective layer；And
Circuit board is set at the corresponding conductive adhesive layer, and is located at the two of the conductive adhesive layer with the signal transmission structure
Opposite side, the circuit board include plate body and are set to the plate body and connect the conductive structure of the conductive adhesive layer.
2. touch module according to claim 1, it is characterised in that: the circuit board and the protective layer are underlapped.
3. touch module according to claim 2, it is characterised in that: the plate edge of the neighbouring protective layer of the plate body with
Spacing range between the layer edge of the protective layer is between 100 to 400 microns.
4. touch module according to claim 1, it is characterised in that: the conductive structure of the circuit board and the guarantor
Sheath is underlapped, and the plate edge of the plate body and the shielding part of the conductive adhesive layer are Chong Die, and the plate edge and the protection
Layer is located at two opposite sides of the shielding part.
5. touch module according to any one of claim 1 to 4, it is characterised in that: the screening of the conductive adhesive layer
Cover covers the width range of the protective layer between 500 to 700 microns.
6. touch module according to claim 4, it is characterised in that: the plate edge of the plate body and the protective layer
Overlapping widths are between 50 to 700 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821313678.5U CN208819182U (en) | 2018-08-15 | 2018-08-15 | Touch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821313678.5U CN208819182U (en) | 2018-08-15 | 2018-08-15 | Touch module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208819182U true CN208819182U (en) | 2019-05-03 |
Family
ID=66273252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821313678.5U Active CN208819182U (en) | 2018-08-15 | 2018-08-15 | Touch module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208819182U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110244876A (en) * | 2019-06-19 | 2019-09-17 | 业成科技（成都）有限公司 | Circuit board, touch module, touch screen and electronic equipment |
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
-
2018
- 2018-08-15 CN CN201821313678.5U patent/CN208819182U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110244876A (en) * | 2019-06-19 | 2019-09-17 | 业成科技（成都）有限公司 | Circuit board, touch module, touch screen and electronic equipment |
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110796948B (en) * | 2019-10-30 | 2022-03-22 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
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