CN110197248A - A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna - Google Patents
A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna Download PDFInfo
- Publication number
- CN110197248A CN110197248A CN201910417389.2A CN201910417389A CN110197248A CN 110197248 A CN110197248 A CN 110197248A CN 201910417389 A CN201910417389 A CN 201910417389A CN 110197248 A CN110197248 A CN 110197248A
- Authority
- CN
- China
- Prior art keywords
- antenna
- conductive
- rfid tag
- metal foil
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 239000011888 foil Substances 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000002309 gasification Methods 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 5
- 239000005030 aluminium foil Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 4
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910003090 WSe2 Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052961 molybdenite Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna belongs to technical field of RFID, is made of in structure substrate layer, antenna stack, printing integrated circuit, lead and conductive adhesive layer；Antenna stack and printing integrated circuit overlap joint are connected by conductive adhesive layer, conductive adhesive layer is mixed to form by electrically conductive ink and conductive particle, its conductive adhesive layer has in-plane conductive, and the electric conductivity that thickness direction is more strengthened, therefore printing integrated circuit and foil antenna are connected using Z-direction conducting reinforced conductive glue, to reduce interface resistance, compared with traditional RFID tag structure, the antenna part of RFID tag of the present invention replaces electrically conductive ink using metal foil material, and a kind of Z-direction reinforced conductive ink that angular conductive particle is mixed by silver powder is used at the electrically conductive ink of printing and metal foil antenna lapping, wedge angle conductive particle is set to pierce through the gasification layer of metal foil surface with heat pressing process to form low-impedance circuit engagement, both it reduced costs, sensitivity behaviour is improved again.
Description
Technical field
The invention belongs to technical field of RFID, are related to a kind of RFID tag structure, more particularly to one kind by printing
Semiconductor and metal foil antenna are total to the RFID tag structure of structure.
Background technique
Electronic tag can play the role of identifying identification, item tracking, information collection as data medium.Electronic tag,
The RFID system that reader, antenna and application software are constituted directly is connected with corresponding management information system.Each article is all
It can be accurately tracked, be obtained with institute under the acquisition including real time data, safe data access channel, off-line state
There is product information etc..Currently, RFID technique has been widely used in numerous necks such as industrial automation, business automation
Domain, the extensive use of RFID label tag bring more conveniences to people's lives really.
Currently, existing RFID inlay using silicon base chip by anisotropic conductive adhesive paste (ACP) and feedback carve metal foil (or print
Brush conducting resinl) day wire bonding form RFID tag electronic loop, as shown in Figure 1.Newer technology does not use silicon base chip then,
But by the logic circuit of former silicon base chip, artificial circuit or memory circuit and numerous transistors to print in a manner of printing
The mode of brush, which is printed directly on paper base material, becomes printing integrated circuit, as shown in Figure 2.Using the mode of silicon chip, oneself belongs in Fig. 1
Mature technology but high expensive, and silver paste is at high cost as antenna conductor in Fig. 2, impedance is still higher compared with aluminium foil, reliability compared with
Difference.Since chip cost accounts for the very big specific gravity of compound crystal RFID tag, it is whole that this silicon wafer chip cost also improves RFID tag
Cost.So that continuing a large amount of application markets of expanding encounters bottleneck, to reduce cost, occur with mode of printing production RFID product body
Circuit replaces the new method of silicon wafer chip as the mainstream technology of next wave.And existing developing printing-type RFID tag,
Integrated circuit part is to use electrically conductive ink (mainly silver paste) in circuit and electrode part, is used in semiconductor portions printable
Semiconductor material (such as: carbon nanotube or MoS2 (molybdenum disulfide) or WSe2)；And antenna part still directly uses electrically conductive ink
(mainly silver paste) is printed.Such RFID tag cost is still too high, because electrically conductive ink cost is still too high, and antenna
It is too big that printing with integrated circuit prints precision difference, if it is too high to be printed as its process equipment cost together in same equipment, if
Separately then equipment investment is too big for print, and processing procedure is too long.And aspect of performance is high compared with aluminium foil antenna because of its resistance of the electrically conductive ink of printing
Many is so that this its sensitivity behaviour of RFID tag and consistency are all poor.
Summary of the invention
The purpose of the present invention is being directed to above-mentioned disadvantage existing in the prior art, propose one kind by printed semiconductor and metal
Foil antenna is total to the RFID tag structure of structure, which can effectively solve the deficiencies in the prior art, can make to print in performance
Integrated circuit reduces the impedance of entire antenna, improves sensitive, reduction production cost.
Technical solution of the present invention: a kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna, including
Substrate layer, which is characterized in that the substrate layer is equipped with antenna stack and printing integrated circuit, and the antenna stack is by metal material system
At the printing integrated circuit is equipped with lead, and the lead is made of electrically conductive ink, and the lead passes through with the antenna stack
Conductive adhesive layer is connected, and conductive particle is equipped in the conductive adhesive layer, so that conductive particle is pierced through the lead by heat pressing process
With the gasification layer of antenna layer surface, and make lead and antenna stack forms low-impedance overlap joint connection.
The metal material of the antenna stack is aluminium foil or copper foil.
The conductive adhesive layer is that reinforced conductive glue is connected in the Z-direction being made of electrically conductive ink and conductive particle mixing.
The conductive particle is the metal particulate with acute angle.
The invention has the benefit that a kind of RFID for being total to structure by printed semiconductor and metal foil antenna proposed by the present invention
Tag structure is made of substrate layer, antenna stack, printing integrated circuit, lead and conductive adhesive layer in structure；Made by conductive adhesive layer
Antenna stack and printing integrated circuit overlap joint connect, and conductive adhesive layer is mixed to form by electrically conductive ink and conductive particle, conducting resinl
Layer has in-plane conduction, and the electric conductivity that thickness direction is more strengthened, therefore reinforced conductive glue is connected to connect in application Z-direction
Integrated circuit and foil antenna are printed, to reduce interface resistance, compared with traditional RFID tag structure, RFID tag's of the present invention
Antenna part replaces electrically conductive ink using metal foil material, and one is used at the electrically conductive ink of printing and metal foil antenna lapping
Kind is mixed the Z-direction reinforced conductive ink of angular conductive particle by silver powder, so that wedge angle conductive particle is pierced through metal with heat pressing process
The gasification layer on foil surface was not only reduced costs, but also improve sensitivity behaviour with forming low-impedance circuit engagement.
Detailed description of the invention
Fig. 1 is traditional RFID tag structural schematic diagram one.
Fig. 2 is traditional RFID tag structural schematic diagram two.
Fig. 3 is RFID tag schematic view of the front view of the present invention.
Fig. 4 is RFID tag overlooking structure diagram of the present invention.
Fig. 5 is the enlarged structure schematic diagram in Fig. 3 at A.
In figure: substrate layer 1, antenna stack 2, lead 3, conductive adhesive layer 4, printing integrated circuit 5, conductive particle 6.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings:
As in Figure 3-5, a kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna, including substrate layer 1, base
Material layer 1 is equipped with antenna stack 2 and printing integrated circuit 5, and antenna stack 2 is made of metal material, and printing integrated circuit 5, which is equipped with, draws
Line 3, lead 3 are made of electrically conductive ink, and lead 3 is connected with antenna stack 2 by conductive adhesive layer 4, and conduction is equipped in conductive adhesive layer 4
Particle 6 makes conductive particle 6 pierce through the gasification layer of lead 3 and 2 surface of antenna stack, and makes lead 3 and antenna stack by heat pressing process
2 form low-impedance overlap joint connection.
As in Figure 3-5, a kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna, antenna stack 2
Metal material is aluminium foil or copper foil；Conductive adhesive layer 4 is that reinforced conductive is connected in the Z-direction being made of electrically conductive ink and conductive particle mixing
Glue；Conductive particle 6 is the metal particulate with acute angle.
Substrate layer includes all kinds of antenna substrates such as PET, PP, paper, PI, cloth, integrated circuit and electrode part in the present invention
Using electrically conductive ink (mainly silver paste), semiconductor portions are using printable semiconductor material (for example, carbon nanotube or MoS2 are
Molybdenum disulfide, or WSe2)；And metal material (mainly aluminium foil and copper foil) is used in antenna part, in antenna and integrated circuit
Joining place obtains two parts using a kind of conducting resinl for strengthening Z-direction conductive capability between aluminium foil antenna and printing product path
Preferably conducting (reducing its interface resistance, enhance its reliability), conductive adhesive layer are mixed with the conduction of nickel alloy tool wedge angle by silver powder
The Z-direction reinforced conductive ink of particle.It is low to be formed with the gasification layer that heat pressing process makes wedge angle conductive particle pierce through metal foil surface
The circuit of impedance engages.Cost and sensitivity behaviour can be reduced, can make to print integrated circuit in performance to entire day
The impedance of line reduces, sensitive raising.Because using aluminium to replace silver paste that can reduce cost in cost.The present invention can be effectively applicable to
Mode of printing manufactures logic circuit, artificial circuit, the UHF of transistor, HF, NFC RFID inlay, RFID Label and RFID
tag。
Claims (4)
1. a kind of RFID tag structure for being total to structure by printed semiconductor and metal foil antenna, including substrate layer (1), feature exists
In, the substrate layer (1) is equipped with antenna stack (2) and printing integrated circuit (5), and the antenna stack (2) is made of metal material,
The printing integrated circuit (5) is equipped with lead (3), and the lead (3) is made of electrically conductive ink, the lead (3) with it is described
Antenna stack (2) is connected by conductive adhesive layer (4), is equipped with conductive particle (6) in the conductive adhesive layer (4), is passed through heat pressing process
So that conductive particle (6) is pierced through the gasification layer of the lead (3) and antenna stack (2) surface, and makes lead (3) and antenna stack (2) shape
It is connected at low-impedance overlap joint.
2. a kind of RFID tag structure for being total to structure by printed semiconductor and metal foil antenna according to claim 1, special
Sign is: the metal material of the antenna stack (2) is aluminium foil or copper foil.
3. a kind of RFID tag structure for being total to structure by printed semiconductor and metal foil antenna according to claim 1, special
Sign is: the conductive adhesive layer (4) is that reinforced conductive glue is connected in the Z-direction being made of electrically conductive ink and conductive particle mixing.
4. a kind of RFID tag structure for being total to structure by printed semiconductor and metal foil antenna according to claim 1, special
Sign is: the conductive particle (6) is the metal particulate with acute angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910417389.2A CN110197248A (en) | 2019-05-20 | 2019-05-20 | A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910417389.2A CN110197248A (en) | 2019-05-20 | 2019-05-20 | A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110197248A true CN110197248A (en) | 2019-09-03 |
Family
ID=67752835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910417389.2A Pending CN110197248A (en) | 2019-05-20 | 2019-05-20 | A kind of RFID tag structure being total to structure by printed semiconductor and metal foil antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110197248A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN114464340A (en) * | 2020-11-10 | 2022-05-10 | 苏州诺菲纳米科技有限公司 | Conductive paste, touch sensor and preparation method of touch sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
| CN101000658A (en) * | 2006-01-10 | 2007-07-18 | 永丰余Rfid技术有限公司 | Multi-layer combination structure containing radio-frequency identification filemark and its paper page collocation |
-
2019
- 2019-05-20 CN CN201910417389.2A patent/CN110197248A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000658A (en) * | 2006-01-10 | 2007-07-18 | 永丰余Rfid技术有限公司 | Multi-layer combination structure containing radio-frequency identification filemark and its paper page collocation |
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948A (en) * | 2019-10-30 | 2020-02-14 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN114464340A (en) * | 2020-11-10 | 2022-05-10 | 苏州诺菲纳米科技有限公司 | Conductive paste, touch sensor and preparation method of touch sensor |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190903 |
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| RJ01 | Rejection of invention patent application after publication |