CN201311648Y

CN201311648Y - High-frequency dual-protocol radio frequency identification combined card

Info

Publication number: CN201311648Y
Application number: CNU2008201565150U
Authority: CN
Inventors: 徐坚强
Original assignee: Shanghai Fine Electronics Co Ltd
Current assignee: Shanghai Fine Electronics Co Ltd
Priority date: 2008-12-04
Filing date: 2008-12-04
Publication date: 2009-09-16
Anticipated expiration: 2018-12-04

Abstract

The utility model relates to a high-frequency dual-protocol radio frequency identification combined card, which comprises a radio frequency identification inlay layer, wherein two sides of the radio frequency identification inlay layer are sequentially laminated with an upper and a lower card body layers, an upper and a lower printing layers and an upper and a lower protecting layers. The radio frequency identification inlay layer attaches tag chips of the ISO 14443 Type A protocol and the ISO 15693 protocol on different positions of an antenna, enables inlays of two tags to have large enough antennas to obtain enough energy, simultaneously greatly lowers same frequency interference, thereby being capable of being read and written by two card reading devices in different occasions and realizing one card compatible with the two protocols in the true sense.

Description

A kind of high-frequency dual-protocol radio frequency identification composite card

Technical field

The utility model relates to a kind of radio frequency identification composite card, is specifically related to a kind of high-frequency dual-protocol radio frequency identification composite card.

Background technology

As shown in Figure 1, a kind of radio frequency identification composite card of the prior art, the inlay 101 that satisfies ISO 14443 home control network communication protocols has less aerial coil, the one side of base material 103 in the middle of being fitted in, the inlay 102 that satisfies ISO 15693 home control network communication protocols has bigger aerial coil, be fitted in the another side of middle base material 103, and then compound respectively upper clamp slice substrate layer is pressed into card on the two sides.This composite card in use, when composite card during through 14443 read write lines, 14443 inlays in the composite card need be sensed the energy and the work of read write line, but if this moment 14443 inlays during just back to this read write line, because of radio-frequency (RF) energy is absorbed by 15693 inlay antennas in the face of the read write line one side, 14443 inlay antenna inductions to energy shortage and can't be identified or distance of reaction very near, the requirement that does not reach compound card system.

As shown in Figure 2, another kind of radio frequency identification composite card of the prior art, inlay one the first from left right side of two kinds of agreements is arranged in the same one side of base material, 14443 inlays 201 have less aerial coil, the left side of base material 203 in the middle of being fitted in, 15693 inlay 202 has bigger aerial coil, is fitted in the right of middle base material 203, and then compound respectively upper clamp slice substrate layer is pressed into card on the two sides.The energy shortage that this composite card then exists 15693 inlays to sense because of antenna is too little, thereby can't be identified or can't realize the read-write operation and the steady operation of distance greatly.

All there are two independently problem of co-channel interference between the inlay antenna in above-mentioned two kinds of composite cards, make that the radio-frequency card inductive effects is poor, be difficult to steady operation.

The utility model content

The purpose of this utility model provides a kind of high-frequency dual-protocol radio frequency identification composite card, and inductive effects is good, and co-channel interference is little, and stability is strong.

In order to achieve the above object; the technical solution of the utility model is: a kind of high-frequency dual-protocol radio frequency identification composite card; comprise radio frequency identification inlay layer, compound successively upper and lower card body layer, upper and lower printed layers and upper and lower protective seam on the both sides of described radio frequency identification inlay layer.

Above-mentioned high-frequency dual-protocol radio frequency identification composite card, wherein, described radio frequency identification inlay layer comprises:

Aerial coil, described aerial coil are printed on the base material of radio frequency identification inlay layer;

15693 label chips and 14443 label chips, described 15693 label chips are connected with the pin of aerial coil respectively with 14443 label chips;

First conduction is passed a bridge, and described first conduction is passed a bridge and is imprinted on the substrate backside of radio frequency identification inlay layer, connects aerial coil top and aerial coil end;

First connects bridge, and described first connects bridging connects 15693 label chips and aerial coil end;

Second conduction is passed a bridge, and the described substrate backside that is imprinted on radio frequency identification inlay layer connects 2 points on the aerial coil;

Second connects bridge, and the described second connection bridging connects a bit on 14443 label chips and the aerial coil.

Above-mentioned high-frequency dual-protocol radio frequency identification composite card, wherein, described radio frequency identification inlay layer also comprises first build-out resistor, and described first build-out resistor is in parallel with 15693 label chips, and described point in parallel is connected with the pin of aerial coil.

Above-mentioned high-frequency dual-protocol radio frequency identification composite card, wherein, described radio frequency identification inlay layer also comprises second build-out resistor, and described second build-out resistor is in parallel with 14443 label chips, and described point in parallel is connected with the pin of aerial coil.

Above-mentioned high-frequency dual-protocol radio frequency identification composite card, wherein, described aerial coil is made by conducting metal.

The utility model is owing to adopt technique scheme, make it compared with prior art, have the following advantages and good effect: the utility model high-frequency dual-protocol radio frequency identification composite card designs big aerial coil to greatest extent in the range of size of a standard card, and the label chip of ISO 14443 Type A and 15,693 two kinds of agreements of ISO is fitted in the diverse location of antenna, make the inlay of two labels all have enough big antenna and can obtain enough energy, greatly reduce simultaneously co-channel interference again, can be read and write by two kinds of card-reading apparatus in different occasions easily, realize the all-purpose card of two kinds of agreements of compatibility truly, and have realization simply, flexible design, economical and practical characteristics.

Description of drawings

Fig. 1 is a kind of radio frequency identification composite card of the prior art.

Fig. 2 is an another kind of radio frequency identification composite card of the prior art.

Fig. 3 is the structural representation of the utility model high-frequency dual-protocol radio frequency identification composite card.

Fig. 4 is the structural representation of the radio frequency identification inlay layer of the utility model high-frequency dual-protocol radio frequency identification composite card.

Fig. 5 is the simple equivalent circuit figure of the utility model high-frequency dual-protocol radio frequency identification composite card.

Embodiment

Below further specify better embodiment of the present utility model with reference to the accompanying drawings:

Referring to Fig. 3; a kind of high-frequency dual-protocol radio frequency identification composite card comprises radio frequency identification inlay layer 304, the compound successively upper and lower card body layer 303,305 on the both sides of described radio frequency identification inlay layer 304; upper and lower printed layers 302,306, upper and lower protective seam 301,307.

Referring to Fig. 4, described radio frequency identification inlay layer 304 comprises:

Aerial coil 403 is made by conducting metal, is imprinted on the radio frequency identification inlay layer 304 by printing of silver slurry or etched mode;

15693 label chips 401 connect bridge 408 by first and are connected with aerial coil terminal 404;

First conduction passes a bridge 405, is imprinted on the substrate backside of described radio frequency identification inlay layer 304;

Aerial coil top 406 is connected with aerial coil terminal 404 by the first conduction gap bridge 405;

First build-out resistor 407, in parallel with 15693 label chips 401, described point in parallel is connected with the pin of aerial coil 403;

Second conduction passes a bridge 411, is imprinted on the substrate backside of described radio frequency identification inlay layer 304; The described second conduction gap bridge 411 connects 2: 410 and 412 on the aerial coils 403;

14443 label chips 402 connect bridge 409 by second and are connected with point 410 on the aerial coil 403;

Second build-out resistor 413, in parallel with 14443 label chips 402, described point in parallel is connected with the pin of aerial coil 403.

Referring to Fig. 5, the simple equivalent circuit of the utility model high-frequency dual-protocol radio frequency identification composite card, when work, 15693 label chips and 14443 label chips are equivalent to two electric capacity 501,502, aerial coil is equivalent to inductive coil, shows as inductance (503,504) during work.When 15693 work, whole loop

antenna coil inductance

503 and 504 is connected with 15693 label chip electric capacity 502,14443 label chip equivalent capacitys 501 simultaneously in parallel, two distributed

parasitic capacitance

505 and 506, this equivalence circuit can allow 15693 label chips obtain bigger inductive energy, realizes the longer-distance radio-frequency communication with read write line.When 14443 label chips are worked, whole loop antenna coil inductance has only inductance 503 to connect with 14443 label chip equivalent capacitys 501, inductance 504 is with in parallel with it again after 15693 label chip equivalent capacitys 502 are connected, therefore, this equivalence circuit can allow same acquisition of 14443 label chips realize perfect communication than big inductive energy.

The utility model high-frequency dual-protocol radio frequency identification combined card is in loop aerial coil next door, inside Perhaps there is not complicated magnetic interference in the side, greatly reduces co-channel interference, and again can be to greatest extent The acquisition inductive energy, inductive effects is good, can satisfy the demand of remote identification, manufactures simultaneously This is lower, has bigger technological innovation and practical value.

Claims

1, a kind of high-frequency dual-protocol radio frequency identification composite card; it is characterized in that; comprise radio frequency identification inlay layer (304); the compound successively upper and lower card body layer (303,305) on the both sides of described radio frequency identification inlay layer (304), upper and lower printed layers (302,306) and upper and lower protective seam (301,307).

2, high-frequency dual-protocol radio frequency identification composite card as claimed in claim 1 is characterized in that, described radio frequency identification inlay layer (304) comprising:

Aerial coil (403), described aerial coil (403) are printed on the base material of radio frequency identification inlay layer (304);

15693 label chips (401) and 14443 label chips (402), described 15693 label chips (401) are connected with the pin of aerial coil (403) respectively with 14443 label chips (402);

First conduction is passed a bridge (405), and the described first conduction gap bridge (405) is imprinted on the substrate backside of radio frequency identification inlay layer (304), connects aerial coil top (406) and aerial coil end (404);

First connects bridge (408), and described first connects bridge (408) connects 15693 label chips (401) and aerial coil end (404);

Second conduction is passed a bridge (411), and the described substrate backside that is imprinted on radio frequency identification inlay layer (304) connects two point (410) and (412) on the aerial coil (403);

Second connects bridge (409), and described second connects a bit (410) on bridge (409) connection 14443 label chips (402) and the aerial coil (403).

3, high-frequency dual-protocol radio frequency identification composite card as claimed in claim 2, it is characterized in that, described radio frequency identification inlay layer (304) also comprises first build-out resistor (407), described first build-out resistor (407) is in parallel with 15693 label chips (401), and described point in parallel is connected with the pin of aerial coil (403).

4, high-frequency dual-protocol radio frequency identification composite card as claimed in claim 2, it is characterized in that, described radio frequency identification inlay layer (304) also comprises second build-out resistor (413), described second build-out resistor (413) is in parallel with 14443 label chips (402), and described point in parallel is connected with the pin of aerial coil (403).

5, as claim 2,3 or 4 described high-frequency dual-protocol radio frequency identification composite cards, it is characterized in that described aerial coil (403) is made by conducting metal.