CN103208024A - Smart card - Google Patents
Smart card Download PDFInfo
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- CN103208024A CN103208024A CN2013101019123A CN201310101912A CN103208024A CN 103208024 A CN103208024 A CN 103208024A CN 2013101019123 A CN2013101019123 A CN 2013101019123A CN 201310101912 A CN201310101912 A CN 201310101912A CN 103208024 A CN103208024 A CN 103208024A
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- smart card
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Abstract
The invention discloses a smart card. The smart card comprises a substrate and chips arranged in the substrate, wherein the a coil is arranged in the substrate; outgoing lines are arranged on the coil; and the two chips are welded on the outgoing lines, are connected in series and accord with an international standardization organization (ISO) 14443 communication protocol and an ISO 15693 communication protocol respectively. Due to the adoption of the mode, the smart card can accord with the two protocols, and is small in thickness and low in manufacturing cost.
Description
Technical field
The present invention relates to the REID field, particularly relate to a kind of smart card that can identify two kinds of different agreements.
Background technology
Smart card (Smart Card) is the common name of the plastic clip (the normally size of a credit card) that is embedded with microchip.Some smart cards comprise a RFID chip, can not identify the holder so they do not need just to contact with any physics of read write line.In order to realize the function of the two agreements of a card, both met the ISO14443 agreement, meet ISO 15693 agreements again, prior art is that two coils are put into a sheet smart card simultaneously, one of them coil connects the chip that meets the ISO14443 agreement, another coil connects and meets the chip of ISO 15693 agreements, and then is laminated into a card.Above-mentioned smart card makes production run become loaded down with trivial details owing to implant two kinds of coils that specification is different at substrate, has reduced production efficiency.Simultaneously owing to need to implant two coils in a card, so the thickness of product just can't guarantee to meet the requirement in the ISO7810 standard, becomes nonstandard card, just can't be general on a lot of common apparatus.
Summary of the invention
At above-mentioned deficiency of the prior art, fundamental purpose of the present invention provides a kind of smart card, and this smart card can satisfy two kinds of agreements simultaneously, and the thickness of finished product card is lower, and cost of manufacture is lower.
For achieving the above object, the technical solution used in the present invention is: a kind of smart card comprises substrate and places the interior chip of substrate, it is characterized in that described substrate is built-in with coil, described coil is provided with extension line, be welded with two chips on the described extension line, described two chips serial connection.
Preferably, described two chips satisfy ISO14443 communications protocol and ISO15693 communications protocol respectively.Two chips described in the present invention satisfy two different communications protocol respectively, to distinguish reading distance and playing the anti-collision effect of two chips.Can make a smart card satisfy the different function of a plurality of chips.
Preferably, the number of turns of described coil is 2～6 circles.
Preferably, described outermost layer coil is of a size of 78.9x48.1mm, and the line-spacing between adjacent two coils is 0.8mm.
Preferably, the number of turns of described coil is 4 circles.
Preferably, described two chip frequencies of utilization are 15.0-15.6MHz.
Preferably, described substrate adopts pvc material to make.
Among the present invention, in order to overcome the existing in prior technology problem, material and cost of labor when the two protocol-intelligent cards of saving are produced, smart card therefore of the present invention reduces the quantity of coil, use a kind of coil to weld the chip of two different agreements simultaneously, reduce the thickness of finished product card simultaneously, solved the existing in prior technology problem completely, and the result of use of smart card is good.
The invention has the beneficial effects as follows: smart card of the present invention can satisfy two kinds of agreements simultaneously, and the thickness of finished product card is lower, and cost of manufacture is lower.
Description of drawings
Fig. 1 is the structural representation of smart card one preferred embodiment of the present invention;
The mark of each parts is as follows in the accompanying drawing: 1-substrate, 2-coil, 3-extension line, 4-the first chip, 5-the second chip.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also Fig. 1, the embodiment of the invention: a kind of smart card, comprise substrate 1 and place the interior chip of substrate, described substrate 1 is built-in with coil 2, and described coil 2 is provided with extension line 3, is welded with two chips on the described extension line 3, described two chips serial connection.In the present embodiment, two one of chips are first chips 4, and another is that second chip, 5, the first chips 4 and second chip 5 are serially connected on the extension line.
In the present embodiment, first chip 4 satisfies the ISO14443 communications protocol, and second chip 5 satisfies the ISO15693 communications protocol.In the present embodiment first chip 4 being welded to the frequency of measuring on the coil is 24.2-24.8MHz; It is 19.3-19.9MHz that second chip 5 is welded to the frequency of measuring on the coil, recording final frequency after two chips weld simultaneously is 15.0-15.6MHz, frequency mutual inductance between this moment two chips influence minimum, can satisfy the test request of agreement separately respectively, namely second chip 5 satisfies the ISO15693 communications protocol, reach 13.56MHz, first chip 4 satisfies the ISO14443 communications protocol and reaches 17.5MHz.
In the present embodiment, described outermost layer coil is of a size of 78.9x48.1mm, and the line-spacing between adjacent two coils is 0.8mm.
In the present embodiment, the number of turns of described coil is 4 circles.
In the present embodiment, described two chip frequencies of utilization are 15.0-15.6MHz.
In the present embodiment, described substrate adopts pvc material to make.
The difference of embodiment two, present embodiment and embodiment one is that the number of turns of described coil is 2 circles.
The difference of embodiment three, present embodiment and embodiment one is that the number of turns of described coil is 6 circles.
The difference of embodiment four, present embodiment and embodiment one is that the number of turns of described coil is 5 circles.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (7)
1. a smart card comprises substrate and places the interior chip of substrate, and it is characterized in that described substrate is built-in with coil, described coil is provided with extension line, is welded with two chips on the described extension line, described two chips serial connection.
2. smart card according to claim 1 is characterized in that, described two chips satisfy ISO14443 communications protocol and ISO15693 communications protocol respectively.
3. a kind of smart card according to claim 1 and 2 is characterized in that, the number of turns of described coil is 2～6 circles.
4. a kind of smart card according to claim 3 is characterized in that, described outermost layer coil is of a size of 78.9x48.1mm, and the line-spacing between adjacent two coils is 0.8mm.
5. a kind of smart card according to claim 4 is characterized in that, the number of turns of described coil is 4 circles.
6. a kind of smart card according to claim 1 is characterized in that, described two chip frequencies of utilization are 15.0-15.6MHz.
7. a kind of smart card according to claim 1 is characterized in that, described substrate adopts pvc material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101019123A CN103208024A (en) | 2013-03-27 | 2013-03-27 | Smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101019123A CN103208024A (en) | 2013-03-27 | 2013-03-27 | Smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103208024A true CN103208024A (en) | 2013-07-17 |
Family
ID=48755241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101019123A Pending CN103208024A (en) | 2013-03-27 | 2013-03-27 | Smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103208024A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004151968A (en) * | 2002-10-30 | 2004-05-27 | Toppan Forms Co Ltd | Noncontact data transmitter/receiver |
| CN1877610A (en) * | 2005-06-09 | 2006-12-13 | 株式会社Ntt都科摩 | Non-contact ic apparatus and control method |
| CN200976243Y (en) * | 2006-12-03 | 2007-11-14 | 蔡小如 | Dual-core UHF electronic label |
| KR20080013215A (en) * | 2006-08-07 | 2008-02-13 | 전자부품연구원 | Rfid tag |
| CN201311648Y (en) * | 2008-12-04 | 2009-09-16 | 上海孚恩电子科技有限公司 | High-frequency dual-protocol radio frequency identification combined card |
| CN101770600A (en) * | 2009-12-31 | 2010-07-07 | 北京握奇数据系统有限公司 | Contactless smart card and fabrication method thereof |
| CN201716753U (en) * | 2010-07-14 | 2011-01-19 | 中科院成都信息技术有限公司 | Dual-protocol same-frequency combination card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| KR101129561B1 (en) * | 2010-10-19 | 2012-03-29 | (주)크리노 | Dual rfid card |
| CN203217605U (en) * | 2013-03-27 | 2013-09-25 | 上海东方磁卡工程有限公司 | An intelligent card |
-
2013
- 2013-03-27 CN CN2013101019123A patent/CN103208024A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004151968A (en) * | 2002-10-30 | 2004-05-27 | Toppan Forms Co Ltd | Noncontact data transmitter/receiver |
| CN1877610A (en) * | 2005-06-09 | 2006-12-13 | 株式会社Ntt都科摩 | Non-contact ic apparatus and control method |
| KR20080013215A (en) * | 2006-08-07 | 2008-02-13 | 전자부품연구원 | Rfid tag |
| CN200976243Y (en) * | 2006-12-03 | 2007-11-14 | 蔡小如 | Dual-core UHF electronic label |
| CN201311648Y (en) * | 2008-12-04 | 2009-09-16 | 上海孚恩电子科技有限公司 | High-frequency dual-protocol radio frequency identification combined card |
| CN101770600A (en) * | 2009-12-31 | 2010-07-07 | 北京握奇数据系统有限公司 | Contactless smart card and fabrication method thereof |
| CN201716753U (en) * | 2010-07-14 | 2011-01-19 | 中科院成都信息技术有限公司 | Dual-protocol same-frequency combination card |
| KR101129561B1 (en) * | 2010-10-19 | 2012-03-29 | (주)크리노 | Dual rfid card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN203217605U (en) * | 2013-03-27 | 2013-09-25 | 上海东方磁卡工程有限公司 | An intelligent card |
Non-Patent Citations (1)
| Title |
|---|
| 赵秀萍: "《特种印刷技术》", 31 December 2006, article "非接触式IC卡制作" * |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130717 |