CN202838393U - RFID electronic tag package structure - Google Patents

RFID electronic tag package structure Download PDF

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Publication number
CN202838393U
CN202838393U CN 201220481007 CN201220481007U CN202838393U CN 202838393 U CN202838393 U CN 202838393U CN 201220481007 CN201220481007 CN 201220481007 CN 201220481007 U CN201220481007 U CN 201220481007U CN 202838393 U CN202838393 U CN 202838393U
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CN
China
Prior art keywords
rfid
electronic tag
upper substrate
antenna
rfid electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 201220481007
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Chinese (zh)
Inventor
黄平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGZHOU JIACHENG LOGISTICS CO Ltd
Original Assignee
GUANGZHOU JIACHENG LOGISTICS CO Ltd
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Publication date
Application filed by GUANGZHOU JIACHENG LOGISTICS CO Ltd filed Critical GUANGZHOU JIACHENG LOGISTICS CO Ltd
Priority to CN 201220481007 priority Critical patent/CN202838393U/en
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Publication of CN202838393U publication Critical patent/CN202838393U/en
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Abstract

The utility model discloses an RFID electronic tag package structure. The RFID electronic tag package structure comprises an RFID chip, an upper substrate, a lower substrate and antennas respectively arranged on the upper substrate and the lower substrate, wherein the RFID chip is fixed between the upper substrate and the lower substrate, and the RFID chip is connected with the antenna by conductive pins. Because one upper substrate with antenna is added, the range of the RFID electronic tag for receiving an inquiry signal is greatly expanded, an RFID reader more easily reads the information of the RFID electronic tag, the reading success rate of the RFID reader for the RFID electronic tag is greatly improved, and moreover the structure is simple and easy to implement. The RFID electronic tag package structure is widely used in an RFID system.

Description

A kind of RFID electronic label seal assembling structure
Technical field
The utility model relates to the RFID encapsulation technology, relates in particular to a kind of RFID electronic label seal assembling structure.
Background technology
RFID is a kind of contactless automatic identification technology, utilizes wireless radio frequency mode to carry out the noncontact bi-directional transfer of data between reader and RFID electronic tag (radio-frequency card), and then reaches the purpose of target information identification and exchanges data.And for the encapsulation technology of traditional RFID electronic tag, it normally directly is embedded in the RFID chip on the substrate, easy to make and low cost of manufacture although it is so, but find after testing in rfid system, the RFID reader only is about 60% to the successful read rate of the RFID electronic tag of this encapsulating structure, and utilizing the conventional package technology that the RFID chip is encapsulated, its electric conductivity and steadiness are all relatively poor.
The utility model content
In order to solve the problems of the technologies described above, the purpose of this utility model provides a kind of RFID electronic label seal assembling structure that can improve the successful read rate of RFID reader.
The technical scheme that the utility model adopts is: a kind of RFID electronic label seal assembling structure, comprise a RFID chip, upper substrate, infrabasal plate and be separately positioned on upper substrate and the antenna of infrabasal plate, described RFID chip is fixedly installed between upper substrate and the infrabasal plate, and described RFID chip is connected by conductive pin and then with antenna.
Further, be provided with between described upper substrate and the infrabasal plate and seal glue-line, the described glue-line of sealing is wrapped in junction between described RFID chip and conductive pin and the antenna.
Further, be provided with the first solid glue-line between described RFID chip and the upper substrate, be provided with the second solid glue-line between described RFID chip and the infrabasal plate (9).
The beneficial effects of the utility model are: because the utility model has increased a upper substrate that is provided with antenna, therefore greatly enlarge the scope that the RFID electronic tag can receive interrogating signal, thereby make the RFID reader can be easier to read the information of RFID electronic tag, greatly improve the RFID reader to the successful read rate of RFID electronic tag, and the utility model is simple in structure and be easy to realize.Also have, owing to adopt conductive pin directly to be connected with antenna, therefore good conductivity of the present utility model and resistance are little.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described further:
Fig. 1 is the synoptic diagram of a kind of RFID electronic label seal of the utility model assembling structure.
Upper substrate 1; The first antenna 2; The first solid glue-line 3; The second antenna 4; Third antenna 5; Seal glue-line 6; The second solid glue-line 7; RFID chip 8; Infrabasal plate 9; Conductive pin 10; The 4th antenna 11.
Embodiment
By shown in Figure 1, a kind of RFID electronic label seal assembling structure, comprise a RFID chip 8, upper substrate 1, infrabasal plate 9 and be separately positioned on upper substrate 1 and the antenna of infrabasal plate 9, described RFID chip 8 is fixedly installed between upper substrate 1 and the infrabasal plate 9, and described RFID chip 8 is connected by conductive pin 10 and then with antenna.Described antenna comprises first day line 2, the second antenna 4, third antenna 5 and the 4th antenna 11, described the first antenna 2 and the second antenna 4 are separately positioned on the lower surface of upper substrate 1, described third antenna 5 and 11 upper surfaces that are separately positioned on infrabasal plate 9 of the 4th antenna.
Be further used as preferred embodiment, be provided with between described upper substrate 1 and the infrabasal plate 9 and seal glue-line 6, the described glue-line 6 of sealing is wrapped in junction between described RFID chip 8 and conductive pin 10 and the antenna.Because the utility model is provided with and seals glue-line 6, therefore can make conductive pin 10 be connected more firmly with antenna and also can not cause RFID chip 8 to come off in the situation of folding rubbing, greatly improve the steadiness of integral body.
Be further used as preferred embodiment, be provided with the first solid glue-line 3 between described RFID chip 8 and the upper substrate 1, be provided with the second solid glue-line 7 between described RFID chip 8 and the infrabasal plate 9, can improve further steadiness of the present utility model like this.
More than be that better enforcement of the present utility model is specified, but the utility model is created and is not limited to described embodiment, those of ordinary skill in the art make all equivalent variations or replacement also can doing under the prerequisite of the utility model spirit, the distortion that these are equal to or replace all is included in the application's claim limited range.

Claims (3)

1. RFID electronic label seal assembling structure, it is characterized in that: comprise a RFID chip (8), upper substrate (1), infrabasal plate (9) and be separately positioned on upper substrate (1) and the antenna of infrabasal plate (9), described RFID chip (8) is fixedly installed between upper substrate (1) and the infrabasal plate (9), and described RFID chip (8) is connected by conductive pin (10) and then with antenna.
2. described a kind of RFID electronic label seal assembling structure according to claim 1, it is characterized in that: be provided with between described upper substrate (1) and the infrabasal plate (9) and seal glue-line (6), the described glue-line (6) of sealing is wrapped in junction between described RFID chip (8) and conductive pin (10) and the antenna.
3. described a kind of RFID electronic label seal assembling structure according to claim 2, it is characterized in that: be provided with the first solid glue-line (3) between described RFID chip (8) and the upper substrate (1), be provided with the second solid glue-line (7) between described RFID chip (8) and the infrabasal plate (9).
CN 201220481007 2012-09-18 2012-09-18 RFID electronic tag package structure Active CN202838393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220481007 CN202838393U (en) 2012-09-18 2012-09-18 RFID electronic tag package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220481007 CN202838393U (en) 2012-09-18 2012-09-18 RFID electronic tag package structure

Publications (1)

Publication Number Publication Date
CN202838393U true CN202838393U (en) 2013-03-27

Family

ID=47950043

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220481007 Active CN202838393U (en) 2012-09-18 2012-09-18 RFID electronic tag package structure

Country Status (1)

Country Link
CN (1) CN202838393U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783687A (en) * 2018-07-30 2020-02-11 群创光电股份有限公司 Packaging structure and antenna device using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783687A (en) * 2018-07-30 2020-02-11 群创光电股份有限公司 Packaging structure and antenna device using same

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