CN208654836U - The IC card chip structure of modified form double-interface card - Google Patents

The IC card chip structure of modified form double-interface card Download PDF

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Publication number
CN208654836U
CN208654836U CN201821400409.2U CN201821400409U CN208654836U CN 208654836 U CN208654836 U CN 208654836U CN 201821400409 U CN201821400409 U CN 201821400409U CN 208654836 U CN208654836 U CN 208654836U
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China
Prior art keywords
card
stainless steel
chip structure
conductive layer
antenna
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CN201821400409.2U
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Chinese (zh)
Inventor
刘瑛
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Dongguan Three Smart Card Technology Co Ltd
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Dongguan Three Smart Card Technology Co Ltd
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Abstract

The utility model discloses a kind of IC card chip structure of modified form double-interface card, it includes flexible circuit board, the integrated circuit on flexible circuit board and several stainless steel substrates being fixed on flexible circuit board by insulating cement water layer positioned at bottom, one pin of a piece of stainless steel substrates and integrated circuit electrically conducts, stainless steel substrates are in the same plane, and are formed with interval;Flexible circuit board lower end surface is equipped with first, second antenna contacts, first, second antenna contacts are electrically connected with a pin of integrated circuit respectively, and first, second antenna contacts lower end surface respectively arranged first, second thickening conductive layer protrudes from outside the flexible circuit board, so that the IC card chip structure later period is after being installed on card, this first, second, which thickeies conductive layer, directly contacts point contact with the antenna of card two respectively, it is without being welded and fixed, only IC card chip structure is adhered on card by glue, its structure is more simple, and it makes more convenient.

Description

The IC card chip structure of modified form double-interface card
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of IC card chip structure of modified form double-interface card.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist It plays an important role in people's daily life.
The antenna contacts that the IC card chip structure of double-interface card is all made of two planes in the prior art are contacted with antenna, and It needs to fix and be connected using scolding tin in the later period, this assembling structure is relatively complicated, and operates and be inconvenient, and the later period is also It needs to adhere to IC card chip structure on card by glue.In addition, the IC card chip structure of double-interface card in the prior art Be all made of copper sheet and carry out contact with the external world as terminal and be connected, but copper sheet material is at high cost, intensity not enough and wear-resisting property not Enough ideals, it is easy to wear, so that influencing conducting quality due to wearing larger after long-term use, and then influence communication quality.
In view of this, the present inventor proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of IC card core of modified form double-interface card Chip architecture.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the modified form double-interface card IC card chip structure includes the flexible circuit board positioned at bottom, the integrated circuit that is set on flexible circuit board and several passes through Insulating cement water layer is fixed on the flexible circuit board and the stainless steel substrates as terminal, and the one of a piece of stainless steel substrates and integrated circuit A pin electrically conducts, and the stainless steel substrates are in the same plane, and is formed with interval between adjacent two stainless steel substrates;It is described soft Property circuit board lower end surface is additionally provided with first antenna contact and the second antenna contacts, the first antenna contact and the second antenna contacts It is electrically connected respectively with a pin of integrated circuit, and the first antenna contact and the second antenna contacts lower end surface are respectively set There is the first thickening conductive layer and second to thicken conductive layer, to protrude from this soft for the first thickening conductive layer and the second thickening conductive layer Outside property circuit board.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are vacuum Plating filmed metals layer is fixed on the first antenna contact and the second antenna contacts lower end surface by vacuum coating mode.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are tin cream Layer, passes through a process of tin and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, stainless steel substrates upper surface vacuum coating has one layer brassy to lead Electrolemma.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel substrates is six or eight.
Furthermore, in above-mentioned technical proposal, band body two sides are provided with several location holes, which is in Rectangle.
Furthermore, in above-mentioned technical proposal, pass through welding gold between the stainless steel substrates and the pin of integrated circuit Line connection, and formed and electrically conducted
Furthermore, in above-mentioned technical proposal, the stainless steel substrates with a thickness of 0.02mm-0.07mm.
Furthermore, in above-mentioned technical proposal, the conductive film with a thickness of 0.005mm-0.01mm.
After adopting the above technical scheme, the utility model has the following beneficial effects: compared with prior art
1, the utility model is used as terminal using stainless steel substrates and the external world connects, and the cost of material is low for the stainless steel substrates, intensity Big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, so that can guarantee conducting quality, into And communication quality is improved, and the utility model structure is relatively simple, enable the utility model that there is the extremely strong market competitiveness.It is described The vacuum coating of stainless steel substrates upper surface has one layer of brassy conductive film, and the electric conductivity of the utility model is further increased with this Energy.
2, the utility model is additionally provided with first antenna contact and the second antenna contacts in flexible circuit board lower end surface, this One antenna contacts and the second antenna contacts are electrically connected with a pin of integrated circuit respectively, and the first antenna contact and the Two antenna contacts lower end surfaces are respectively arranged with the first thickening conductive layer and second and thicken conductive layer, this first thickeies conductive layer and the Two thickening conductive layers protrude from outside the flexible circuit board, so that the IC card chip structure later period after being installed on card, is somebody's turn to do First thickening conductive layer and the second thickening conductive layer directly contact point contact with the antenna of card two respectively, without welding It is fixed, only IC card chip structure is adhered on card by glue, structure is more simple, and makes more square Just.
Detailed description of the invention:
Fig. 1 is the perspective view of the utility model;
Fig. 2 be Fig. 1 along A-A to cross-sectional view.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It is the IC card chip structure of modified form double-interface card as shown in Fig. 1-2, which includes being located at bottom The flexible circuit board 21 in portion, the integrated circuit 22 being set on flexible circuit board 21 and several to pass through insulating cement water layer 23 fixed In on the flexible circuit board 21 and being used as the stainless steel substrates 24 of terminal, a pin of a piece of stainless steel substrates 24 and integrated circuit 22 It electrically conducts, the stainless steel substrates 24 are in the same plane, and are formed with interval between adjacent two stainless steel substrates 24.This is practical new Type is used as terminal using stainless steel substrates 24 and connects with the external world, and the cost of material is low for the stainless steel substrates 24, and intensity is big and wear-resisting property is managed Think, it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, and then improves communication quality, And the utility model structure is relatively simple, and the utility model is enabled to have the extremely strong market competitiveness.
21 lower end surface of flexible circuit board is additionally provided with first antenna contact 28 and the second antenna contacts 29, this is first day Line contact 28 and the second antenna contacts 29 are electrically connected with a pin of integrated circuit 22 respectively, and the first antenna contact 28 Be respectively arranged with the first thickening conductive layer 281 and second with 29 lower end surface of the second antenna contacts and thicken conductive layer 291, this first plus Thick conductive layer 281 and the second thickening conductive layer 291 protrude from outside the flexible circuit board 21, so that after the IC card chip structure 2 Phase after being installed on card, this first thicken conductive layer 281 and second thicken conductive layer 291 respectively directly with the antenna of card Two contact point contacts are only adhered to IC card chip structure 2 on card by glue without being welded and fixed, Structure is more simple, and makes more convenient.
The first thickening conductive layer 281 and the second thickening conductive layer 291 are vacuum coating metal layer, are passed through true Empty plated film mode is fixed on 29 lower end surface of the first antenna contact 28 and the second antenna contacts.Either, first thickening is led Electric layer 281 and the second thickening conductive layer 291 are tin paste layer, pass through a process of tin and are fixed on 28 He of first antenna contact Second antenna contacts, 29 lower end surface.
The 24 upper surface vacuum coating of stainless steel substrates has one layer of brassy conductive film 25, further increases this reality with this With novel electric conductivity.Certainly, not only can be with the brassy conductive film 25 of vacuum coating, it equally can be according to actual requirement vacuum The conductive film 25 of the various different colours of plated film, these are all easily achieved.
The quantity of the stainless steel substrates 24 is six or eight.The pin of the stainless steel substrates 24 and integrated circuit 22 it Between by welding gold thread connection, and formed electrically conduct.
The stainless steel substrates 24 with a thickness of 0.02mm-0.07mm.The conductive film 25 with a thickness of 0.005mm- 0.01mm。
It is connected in conclusion the utility model is used as terminal using stainless steel substrates 24 with the external world, 24 material of stainless steel substrates At low cost, intensity is big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, so that can guarantee Quality is connected, and then improves communication quality, and the utility model structure is relatively simple, enables the utility model that there is extremely strong market Competitiveness.The 24 upper surface vacuum coating of stainless steel substrates has one layer of brassy conductive film 25, further increases this reality with this With novel electric conductivity.In addition, 21 lower end surface of flexible circuit board is additionally provided with first antenna contact 28 and the second antenna Contact 29, the first antenna contact 28 and the second antenna contacts 29 are electrically connected with a pin of integrated circuit 22 respectively, and The first antenna contact 28 and 29 lower end surface of the second antenna contacts are respectively arranged with the first thickening conductive layer 281 and the second thickening is led Electric layer 291, the first thickening conductive layer 281 and the second thickening conductive layer 291 protrude from outside the flexible circuit board 21, so that should 2 later period of IC card chip structure, the first thickening conductive layer 281 and second thickeied the difference of conductive layer 291 after being installed on card Point contact directly is contacted with the antenna of card two, without being welded and fixed, only passes through glue for 2 cementation of IC card chip structure In on card, structure is more simple, and makes more convenient.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (8)

1. the IC card chip structure of modified form double-interface card, it is characterised in that: the IC card chip structure (2) includes being located at bottom Flexible circuit board (21), the integrated circuit (22) being set on flexible circuit board (21) and several by insulating cement water layer (23) It is fixed on the flexible circuit board (21) and is used as the stainless steel substrates (24) of terminal, a piece of stainless steel substrates (24) and integrated circuit (22) a pin electrically conducts, and the stainless steel substrates (24) are in the same plane, and between adjacent two stainless steel substrates (24) It is formed with interval;Flexible circuit board (21) lower end surface is additionally provided with first antenna contact (28) and the second antenna contacts (29), the first antenna contact (28) and the second antenna contacts (29) electrically connect with a pin of integrated circuit (22) respectively It connects, and the first antenna contact (28) and the second antenna contacts (29) lower end surface are respectively arranged with the first thickening conductive layer (281) Conductive layer (291) are thickeied with second, this first thickeies conductive layer (281) and the second thickening conductive layer (291) to protrude from this soft Property circuit board (21) is outside.
2. the IC card chip structure of modified form double-interface card according to claim 1, it is characterised in that: described first thickeies Conductive layer (281) and the second thickening conductive layer (291) are vacuum coating metal layer, are fixed on by vacuum coating mode The first antenna contact (28) and the second antenna contacts (29) lower end surface.
3. the IC card chip structure of modified form double-interface card according to claim 1, it is characterised in that: described first thickeies Conductive layer (281) and the second thickening conductive layer (291) are tin paste layer, pass through a process of tin and are fixed on first antenna touching Point (28) and the second antenna contacts (29) lower end surface.
4. the IC card chip structure of modified form double-interface card according to claim 1 to 3, it is characterised in that: institute Stating stainless steel substrates (24) upper surface vacuum coating has one layer of brassy conductive film (25).
5. the IC card chip structure of modified form double-interface card according to claim 4, it is characterised in that: the stainless steel The quantity of piece (24) is six or eight.
6. the IC card chip structure of modified form double-interface card according to claim 4, it is characterised in that: the stainless steel substrates (24) it is connect between the pin of integrated circuit (22) by welding gold thread, and is formed and electrically conducted.
7. the IC card chip structure of modified form double-interface card according to claim 4, it is characterised in that: the stainless steel substrates (24) with a thickness of 0.02mm-0.07mm.
8. the IC card chip structure of modified form double-interface card according to claim 7, it is characterised in that: the conductive film (25) with a thickness of 0.005mm-0.01mm.
CN201821400409.2U 2018-08-28 2018-08-28 The IC card chip structure of modified form double-interface card Active CN208654836U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821400409.2U CN208654836U (en) 2018-08-28 2018-08-28 The IC card chip structure of modified form double-interface card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821400409.2U CN208654836U (en) 2018-08-28 2018-08-28 The IC card chip structure of modified form double-interface card

Publications (1)

Publication Number Publication Date
CN208654836U true CN208654836U (en) 2019-03-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821400409.2U Active CN208654836U (en) 2018-08-28 2018-08-28 The IC card chip structure of modified form double-interface card

Country Status (1)

Country Link
CN (1) CN208654836U (en)

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