TW201512929A - Touch panel with conductive protection layer and method for manufacturing the same - Google Patents

Abstract

A touch panel with a conductive protection layer is provided. The touch panel includes a substrate including a bonding area and a sensing electrode layer disposed on the substrate. The touch panel also includes a signal conveying trace layer disposed over the substrate, and the signal conveying trace layer includes a plurality of signal conveying traces. An end of each of the signal conveying traces is electrically connected to the sensing electrode layer, and another end of each of the signal conveying traces is collected in the bonding area. The touch panel further includes a conductive protection layer, the conductive protection layer includes a plurality conductive blocks. Each conductive block is formed over a signal conveying trace in the bonding area, and the signal conveying traces are electrically insulated from each other. A method for manufacturing a touch panel with a conductive protection layer is also provided. The method prevents formation of cracking during attaching signal conveying trace and a soft circuit board, and the yield of the product is increased.

Description

Touch panel with conductive protective layer and manufacturing method thereof

The present invention relates to touch technology, and in particular to a touch panel having a conductive protective layer and a method of fabricating the same.

With the evolution of touch control, touch panels have been widely used in various consumer electronic devices, such as smart phones, tablets, cameras, e-books, MP3 players and other portable electronic products. Or a display screen applied to the operation control device.

The touch panel generally includes a substrate, an electrode layer, and a signal lead layer electrically connecting the electrode layer to the printed circuit board. However, when the touch panel is formed, since the signal lead layer is pressed by the conductive paste through the conductive paste, the signal lead on the signal lead layer may be fractured during the pressing process to cause the electrode layer and the printed circuit. The problem that the board cannot be turned on affects the stability of the electrical connection between the signal lead layer and the flexible circuit board in the touch panel, thereby affecting the yield of the product.

The invention provides a touch panel having a conductive protective layer, comprising: a substrate on which a bonding region is defined; a sensing electrode layer disposed on the substrate; and a signal lead layer located on the substrate The letter The lead layer includes a plurality of signal leads, and one end of each signal lead is electrically connected to the sensing electrode layer, and the other end is concentrated to the bonding region; a conductive protective layer includes a plurality of conductive blocks, and each of the conductive blocks respectively Located on each signal lead in the junction region, and the signal leads are electrically insulated from each other.

The invention further provides a touch panel with a conductive protective layer The manufacturing method is characterized in that the method for manufacturing the touch panel comprises: providing a substrate, defining a bonding region on the substrate; forming a sensing electrode layer on the substrate; forming a signal lead layer, located in the On the substrate, the signal lead layer includes a plurality of signal leads, and one end of each signal lead is electrically connected to the sensing electrode layer, and the other end is concentrated on the bonding region; and a conductive protective layer is formed, including a plurality of conductive blocks. Each of the conductive blocks is respectively located on each signal lead in the joint region, and the signal leads are electrically insulated from each other.

In the present invention, a touch panel having a conductive protective layer is provided. Since the conductive protective layer is located on the signal lead, on the one hand, in the process of pressing the signal lead layer, the conductive protective layer, the conductive adhesive and the printed circuit board, since the conductive protective layer is directly located between the signal lead layer and the conductive paste, it can be better. The isolation buffer protection can prevent the signal lead layer from being fractured during the pressing process; on the other hand, the conductive layer can provide a relatively flat and large electrical contact surface, which is beneficial to the signal lead layer and the flexible circuit board. Electrical connection between the two. Thereby, the stability of the electrical connection between the signal lead layer and the flexible circuit board in the touch panel can be improved to improve the product yield.

The above and other objects, features and advantages of the present invention are made. It is more obvious and easy to understand. The preferred embodiments are described below, and the detailed description is as follows with the accompanying drawings:

100‧‧‧ touch panel

110‧‧‧Substrate

B‧‧‧ junction area

120‧‧‧Sensing electrode layer

121X‧‧‧first electrode

130‧‧‧Signal lead layer

130a‧‧‧Signal leads

140‧‧‧ Conductive protective layer

140a‧‧‧Electrical block

150‧‧‧shading layer

170‧‧‧ Anisotropic conductive adhesive layer

180‧‧‧Soft circuit board

200‧‧‧ touch panel

210‧‧‧Substrate

B‧‧‧ junction area

220‧‧‧Sensing electrode layer

221X‧‧‧first electrode

221Y‧‧‧second electrode

222‧‧‧Connecting Department

223‧‧‧Insulation

224‧‧‧ bridging department

230‧‧‧Signal lead layer

230a‧‧‧Signal leads

240‧‧‧ Conductive protective layer

240a‧‧‧conductive block

250‧‧‧shading layer

260‧‧‧Lead protective layer

260a‧‧‧Lead protection

270‧‧‧ anisotropic conductive adhesive layer

280‧‧‧Soft circuit board

Fig. 1 is a top view showing a touch panel in accordance with an embodiment of the present invention.

Fig. 2 is a top view showing a joint area of a touch panel in accordance with an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a joint region of a touch panel according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view showing a joint region of a touch panel according to another embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a touch panel in accordance with another embodiment of the present invention.

Fig. 6 is a top view showing a touch panel in another embodiment of the present invention.

Fig. 7 is a top view showing a land area of a touch panel in still other embodiments of the present invention.

Fig. 8 is a cross-sectional view showing a land area of a touch panel according to another embodiment of the present invention.

Fig. 9 is a cross-sectional view showing a land area of a touch panel according to another embodiment of the present invention.

Fig. 10 is a top view showing a touch panel in another embodiment of the present invention.

Fig. 11 is a top view showing a touch panel in another embodiment of the present invention.

Figure 12 is a cross-sectional view showing a touch panel in accordance with another embodiment of the present invention.

Figures 13A to 13F show cross-sectional views of various stages of forming a touch panel.

Several different embodiments are provided for different features of the invention. The specific components and arrangements of the present invention are for simplicity, but the present invention does not The examples are limited. For example, a description of forming a first element on a second element can include an embodiment in which the first element is in direct contact with the second element, and also includes having additional elements formed between the first element and the second element such that An embodiment in which one element is not in direct contact with the second element. In addition, the present invention is represented by the repeated reference numerals and/or letters in the different examples for the sake of brevity, but does not represent a particular relationship between the various embodiments and/or structures.

FIG. 1 shows a touch panel 100 according to an embodiment of the invention. view. For the sake of brevity, only some of the elements of touch panel 100 that are directly related to embodiments of the present invention are depicted in FIG. Referring to FIG. 1 , the touch panel 100 includes a substrate 110 . The material of the substrate 110 is ethylene terephthalate (PET), polyether oxime (PES), polyacrylate (PAR), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), Polyallylate, polycarbonate (PC), or the like. The substrate 110 can be a rigid substrate or a flexible substrate. The substrate 110 may be a planar shape, a curved shape, or other irregular shape.

The sensing electrode layer 120 is disposed on the substrate 110. Sensing electrode layer 120 There is a plurality of first electrodes 121X. In another embodiment, the pattern of the sensing electrode layer 120 is not limited thereto, and the sensing electrode layer 120 may be an electrode having only one direction on one surface of the substrate in this embodiment. The aspect may also be an aspect of the electrode having two different directions on one surface of the substrate. In this embodiment, only the sensing electrode layer 120 is an electrode having only one direction on one surface of the substrate. It is to be noted that the sensing electrode layer 120 further has a second electrode 121Y (not shown), and the second electrode 121Y may be disposed on the other side of the substrate 110 with respect to the first electrode 121X, or may be disposed in another On a piece of substrate. The transparent conductive material used to form the sensing electrode layer 120 includes indium tin oxide (indium) Tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO) ), zinc oxide, cadmium oxide (CdO), hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium (indium gallium zinc magnesium) Oxide, InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO), nano silver wire, carbon nanotube, graphene, and the like.

a signal lead layer 130 disposed on the substrate 110 and having signal leads The layer 130 includes a plurality of signal leads 130a. One end of each signal lead 130a is electrically connected to the first electrode 121X of the sensing electrode layer 120, and the other end is concentrated to an edge region of the substrate 110 to form a bonding region B. 130a is electrically insulated from each other. The material of the signal lead layer 130 is, for example, silver (Ag), gold (Au), copper (Cu), aluminum (Al) or a combination thereof. In a preferred embodiment, the signal lead layer 130 is a molybdenum-aluminum-molybdenum three-layer laminate. a structure in which an aluminum layer is interposed between the two layers of molybdenum.

Please refer to Figure 2 and Figure 3, and Figure 2 shows the first In the figure, a top view of the land B, and Fig. 3 is a cross-sectional view of the land in Fig. 2. A conductive protective layer 140 is shown in FIG. 2 and includes a plurality of conductive bumps 140a, each of which is located on each of the signal leads 130a in the land B. The material of the conductive protective layer 140 includes a metal material, a non-metal material or a mixture of a metal material and a non-metal material, wherein the metal material is, for example, silver (Ag), gold (Au), copper (Cu), aluminum (Al) or the like. a combination; a non-metallic material such as a conductive ink, which is mainly composed of a pigment, a binder, and an additive. to make.

Please refer to FIG. 4, in a preferred embodiment, the conductive block The 140a can completely cover the signal lead 130a located in the land B. Therefore, with this structure, the risk that the signal lead 130a falls off under the impact of an external force such as a wind knife or a water wash during the process can be reduced.

In an embodiment, if the signal lead 130a is a metal laminate When the structure (such as molybdenum aluminum molybdenum) is relatively strong in the metal laminated structure, it is easily oxidized in the air to form a non-conductive metal oxide, which ultimately affects the conductivity of the signal lead 130a. If the signal lead 130a is completely covered by the conductive block 140a, the signal lead 130a can be isolated from the air to prevent the metal from being oxidized.

In a preferred embodiment, the conductive protective layer 140 comprises an organic material. The material is mainly a resin material, a decane material or a mixture thereof. The resin-based material mainly includes an acrylic resin, an epoxy resin, a phenol resin, an unsaturated polyester resin, an epoxy-modified vinyl resin, or an organic resin. Thereby, the adhesion relationship between the conductive protective layer 140 and the signal wiring layer 130 is improved by the high adhesion of the organic material, particularly the resin-based material, so that the conductive bump 140a is better attached to the signal lead 130a.

Please refer to FIG. 5 to show the touch surface in FIG. 1 of the present invention. A sectional view of the board. As shown in FIG. 5, in an embodiment, the touch panel 100 further includes an anisotropic conductive adhesive layer 170. The anisotropic conductive adhesive layer 170 is disposed in the bonding region B and covers the conductive protective layer 140a and the signal lead 130a located in the bonding region B. A flexible circuit board 180 is disposed on the anisotropic conductive adhesive layer 170. Adhesively fixing the flexible circuit board 180 by the anisotropic conductive adhesive layer 170 The flexible circuit board 180 can be electrically connected to the conductive protective layer 130a through the anisotropic conductive adhesive layer 170, and electrically connected to the signal lead 130a through the conductive protective layer 130. The connection relationship between the signal lead layer 130 and the flexible circuit board 180 is an adhesive fixing relationship formed by pressing the signal wiring layer 130, the conductive protective layer 140, the anisotropic conductive adhesive layer 170, and the flexible circuit board 180. The touch signal generated by the sensing electrode layer 120 can be transmitted from the signal lead layer 130 to the flexible circuit board 180, and then connected to the controller (not shown) through the flexible circuit board 180 to finally achieve touch detection. Features.

Since the conductive protective layer 140 has electrical conductivity, it is different in setting. Before the conductive adhesive layer 170, the conductive protective layer 140 is not required to be removed, and the anisotropic conductive adhesive layer 170 can be directly formed on the conductive protective layer 140, and the flexible circuit board 180 is disposed thereon to achieve electrical connection. The purpose. In addition, the conductive protective layer 140 can provide a relatively flat, large electrical contact surface, thereby facilitating electrical connection with the flexible circuit board 180.

In the above implementation column, the signal lead layer 130, the conductive protective layer 140. During the process of pressing the anisotropic conductive adhesive 170 and the printed circuit board 180, since the conductive protective layer 140 is directly located between the signal lead layer 130 and the anisotropic conductive adhesive 170, a good isolation buffer protection function can be obtained. The signal lead layer 130 is prevented from being fractured during the pressing process. Therefore, the conductive protective layer 140 has a thickness requirement. The thickness of the conductive block 140a in the corresponding conductive protective layer 140 is generally controlled to be in the range of 1 μm to 10 μm, because when the thickness of the conductive block 140a is less than 1 μm, the conductive block 140a does not have a good buffering effect due to its thickness being too thin, which easily leads to The case where the signal lead 130a is fractured together with the conductive block 140a. Of course, the thickness of the conductive block 140a is also not more than 10 um because of the thickness of the anisotropic conductive paste 170. Generally, it is less than 12um. If the thickness of the conductive block 140a is too thick (for example, greater than 10um), the height of the signal lead 130a and the conductive block 140a is likely to be too high, and the concave between the two sets of signal leads 130a and the conductive block 140a adjacent to each other is concave. If the groove is too deep, the anisotropic conductive paste 170 has no way to completely fill the groove, and finally air is generated in the unfilled region to generate bubbles, which affects the quality of the press.

FIG. 6 shows a touch panel 200 according to another embodiment of the present invention. In the top view, only some of the components of the touch panel 200 directly related to the embodiment of the present invention are depicted in this embodiment. A sensing electrode layer 220 is disposed on the substrate 210. The sensing electrode layer 220 is a surface having two electrodes in different directions on one surface of the substrate 210. Specifically, the sensing electrode layer 220 may include a plurality of first electrodes 221X arranged in a column, and a plurality of rows arranged in a row. The two electrodes 221Y and the plurality of connecting portions 222 that connect the adjacent second electrodes 221Y. Above each connection portion 222 of the sensing electrode layer 220 is an insulating portion 223. In some embodiments, the insulating portion 223 is an organic or inorganic insulating material such as a polyimide, an epoxy resin, or the like. On the insulating portion 223 is a bridging portion 224, and the bridging portion 224 is electrically connected to the adjacent first electrode. The bridging portion 234 may be a metal material such as silver or aluminum, a transparent conductive material such as indium tin oxide (ITO), or a combination thereof. A signal lead layer 230 is disposed on the substrate 210. The signal lead layer 230 includes a plurality of signal leads 230a. One end of each signal lead 230a is electrically connected to the first electrode 221X or the second of the sensing electrode layer 220, respectively. The other end of the electrode 221Y is concentrated to an edge region of the substrate 210 to form a bonding region B, and the signal leads 230a are electrically insulated from each other.

In an implementation, the touch panel 200 may further include a mask The layer 250 (not shown in FIG. 6 , refer to FIG. 7 ) is disposed on the edge region of the substrate 210 In the domain, since the shielding layer 250 has a shielding effect, the shielding layer 250 is generally used to shield the peripheral components of the touch panel 200 (such as the signal lead layer 230 and the like), because if the peripheral components are not shielded, the user is using the touch panel. At 200, the presence of these peripheral components will be directly seen, which affects the aesthetics of the touch panel 200. In this embodiment, the area covered by the shielding layer 250 on the substrate 210 defines a non-visible area, and the visible area corresponds to the non-visible area. For example, the non-visible area may be located on at least one side of the visible area to form a relative positional relationship. . The land B is located in the non-visible area. The sensing electrode layer 220 is disposed on the substrate 210 and extends from the visible region onto the shielding layer 250.

The shielding layer 250 can be mainly composed of a resin, a pigment, a sensitizer, and a solvent. A colored photoresist material composed of. In some embodiments, the masking layer 220 is a black photoresist material such as a polyimide or ink material.

Please refer to Figure 7 and Figure 8, and Figure 6 shows the sixth. In the figure, a top view of the land B, and Fig. 8 is a cross-sectional view of the land in Fig. 7. A conductive protective layer 240 is shown in FIG. 7 and includes a plurality of conductive bumps 240a. Each of the conductive bumps 240a is located on each of the signal leads 230a in the bonding region B, and the signal leads 230a are electrically insulated from each other.

Please refer to Figure 9, in a preferred embodiment, the conductive block The 240a can completely cover the signal lead 230a located in the bonding area B. Therefore, with this structure, on the one hand, the risk that the signal lead 230a is impacted by an external force such as a wind knife or a water washing during the process can be reduced. On the other hand, since the signal wiring layer 230 is directly formed on the shielding layer 250, when the shielding layer 250 is printed with an ink material, problems such as surface unevenness are liable to occur, and these problems may cause the signal wiring layer 230 to be difficult to adhere to the shielding. On layer 250, ultimately resulting in signal routing layer 230 There is a problem such as dropping, so that the signal lead 230a can be further attached to the shielding layer 250 by the way that the conductive block 240a completely covers the signal lead 230a.

In an embodiment, if the signal lead 230a is a metal laminate In the structure, since the metal laminate structure is relatively active, it is easily oxidized in the air to form a non-conductive metal oxide film, which ultimately affects the conductivity of the signal lead 230a. At this time, if the conductive block 240a is used to completely cover the signal The lead 230a can be insulated from the air by the signal lead 230a to prevent oxidation of the metal therebetween.

In a preferred embodiment, the conductive protective layer 240 comprises an organic material. The material is mainly a resin material, a decane material or a mixture thereof. The resin-based material mainly includes an acrylic resin, an epoxy resin, a phenol resin, an unsaturated polyester resin, an epoxy-modified vinyl resin, or an organic resin. The adhesion relationship between the conductive protective layer 240 and the shielding layer 250 is improved by the high adhesion of the organic material, particularly the resin-based material, so that the signal wiring layer 230 is better adhered to the shielding layer 250.

Please refer to Figure 10, and include a further embodiment. A lead protection layer 260 covers the signal leads 230a outside the land B. The lead protective layer 260 may be made of a conductive material or made of an insulating material. It should be noted that the formation of the lead protection layer 260 is not limited by the pattern of the sensing electrode layer 220. In other embodiments, the lead protection layer 260 may also be formed in the touch as shown in FIG. The structure of the panel 100.

Please refer to FIG. 10 when the lead protection layer 260 is a conductive material. The lead protection layer 260 includes a plurality of lead protections 260a, each of which protects each signal lead 230a located outside the junction area B, and The signal leads 230a are electrically insulated from each other. The lead protective layer 260 includes an organic material, wherein the organic material is mainly a resin material, a decane-based material, a mixture thereof, or the like. The resin-based material mainly includes an acrylic resin, an epoxy resin, a phenol resin, an unsaturated polyester resin, an epoxy-modified vinyl resin, or an organic resin. The adhesion relationship between the lead protective layer 260 and the shielding layer 250 is improved by the high adhesion of the organic material, particularly the resin material, so that the signal wiring layer 230 is better adhered to the shielding layer 250. At the same time, the lead protective layer 260 having a conductive function can be used to prevent the signal transmission function of the signal lead when the signal lead 230a is partially broken.

Please refer to FIG. 11 when the lead protection layer 260 is an insulating material. The lead protection layer 260 is entirely overlaid on the entire signal wiring layer 230. The material of the lead protective layer 260 may be a colored photoresist material mainly composed of a resin, a pigment, a sensitizer, and a solvent. In some embodiments, the masking layer 250 is a black photoresist material such as a polyimide or ink material. Thereby, the shielding property of the shielding layer 150 is increased by the presence of the wire protection layer 260, and the visual problem of other peripheral components such as the signal wiring layer 130 is further reduced.

Please refer to FIG. 12 to show the touch surface in FIG. 6 of the present invention. A sectional view of the board. As shown in FIG. 12, the touch panel 200 further includes a shielding layer 250 in the embodiment, and the area covered by the shielding layer 250 defines a non-visible area, and the visible area corresponds to the fifth embodiment. The non-visible area exists, the bonding area B is on the shielding layer 250, the sensing electrode layer 220 is disposed on the substrate 210 and extends from the visible area V to the shielding layer 250, and the corresponding signal wiring layer 230, the conductive protection layer 240, The positional relationship between the anisotropic conductive adhesive layer 270 and the flexible circuit board 880 is the same as that of FIG. 5, and therefore will not be described again.

Please refer to Figures 13A to 13F for reference. Figures 13A to 13F show one. A cross-sectional view of each stage in which the touch panel 100 is formed is implemented in the column.

As shown in FIG. 13A, a substrate 110 is provided on the upper boundary of the substrate A bonding region B is formed; as shown in FIG. 13B, a first electrode 121X forming a sensing electrode layer 120 is formed on the substrate 110; and a signal wiring layer 130 is formed as shown in FIG. 13C. The signal wiring layer 130 is formed. A plurality of signal leads 130a are included, and one end of each signal lead 130a is electrically connected to the first electrode 121X on the sensing electrode layer 120, and the other end is concentrated to the bonding area B; as shown in FIG. 13D, A conductive protective layer 140 includes a plurality of conductive bumps 140a. Each of the conductive bumps 140a is located on each of the signal leads 130a in the bonding region B, and the signal leads 130a are electrically insulated from each other.

As shown in FIG. 13E, in a preferred embodiment, further included An anisotropic electro-adhesive layer 170 is formed in the bonding region B and covers the conductive protective layer 140a and the signal lead 130a located in the bonding region B.

As shown in FIG. 13F, a flexible circuit board 180 is formed, the softness The circuit board 180 is adhesively fixed by the anisotropic conductive adhesive layer 170 and electrically connected to the signal leads 130a through the anisotropic conductive adhesive layer 170.

It is worth noting that the formation of the touch panel 200 and the touch surface The board 100 is formed in the same manner. The only difference is that the mask layer 250 is formed in a step before the sensing electrode layer 200 is formed. The area covered by the mask layer 250 defines a non-visible area, and the visible area corresponds to the presence of the non-visible area. The bonding layer B is disposed on the shielding layer 250, and the sensing electrode layer 220 is disposed on the substrate 210 and extends from the visible region to the shielding layer 250. The other steps are the same as those of the 13A to 13F, and therefore will not be described again.

In the present invention, a touch panel having a conductive protective layer is provided. Since the conductive protective layer is located on the signal lead, on the one hand, in the process of pressing the signal lead layer, the conductive protective layer, the conductive adhesive and the printed circuit board, since the conductive protective layer is directly located between the signal lead layer and the conductive paste, it can be better. The isolation buffer protection can prevent the signal lead layer from being fractured during the pressing process; on the other hand, the conductive layer can provide a relatively flat and large electrical contact surface, which is beneficial to the signal lead layer and the flexible circuit board. Electrical connection between the two. Thereby, the stability of the electrical connection between the signal lead layer and the flexible circuit board in the touch panel can be improved to improve the product yield.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

210‧‧‧Substrate

120‧‧‧Sensing electrode layer

B‧‧‧ junction area

100‧‧‧ touch panel

130a‧‧‧Signal leads

140a‧‧‧ Conductive protective layer

170‧‧‧ Anisotropic conductive adhesive layer

180‧‧‧Soft circuit board

Claims (17)

A touch panel having a conductive protective layer, comprising: a sensing electrode layer disposed on a substrate; a signal lead layer disposed on the substrate, the signal lead layer comprising a plurality of signal leads, and each One end of the signal lead is electrically connected to the sensing electrode layer, and the other end is concentrated to an edge region of the substrate to form a bonding region. A conductive protective layer includes a plurality of conductive blocks, and each conductive block is located in the bonding region. Each signal lead is internal and the signal leads are electrically insulated from each other. The touch panel of claim 1, wherein the conductive protective layer comprises a metal material, a non-metal material or a mixture of a metal material and a non-metal material. The touch panel of claim 2, wherein the conductive protective layer is a conductive ink. The touch panel of claim 1, wherein the conductive protective layer comprises an organic material. The touch panel of claim 4, wherein the organic material is a resin material, a decane material, or a mixture thereof. The touch panel of claim 5, wherein the resin-based material comprises an acrylic resin, an epoxy resin, a phenol resin, an unsaturated polyester resin, an epoxy-modified vinyl resin or an organic resin. The touch panel of claim 1, wherein the conductive panel The block thickness ranges from 1 μm to 10 μm. The touch panel of claim 1, wherein the conductive block completely covers the signal lead. The touch panel of claim 1, further comprising a shielding layer disposed between the substrate and the signal wiring layer, wherein the shielding area defines the non-visible area, and the bonding area is located The non-visible area is on the shielding layer. The touch panel of claim 9, wherein the sensing electrode layer comprises: a plurality of first electrodes arranged in a column, a plurality of second electrodes arranged in a row, and a plurality of connections adjacent to the second a connecting portion of the electrode; a plurality of bridging portions for connecting the first electrodes adjacent to each other in the same column; and a plurality of insulating portions disposed between the connecting portion and the bridging portion. The touch panel of claim 1 or 9, further comprising a lead protection layer covering the signal leads outside the bonding area. The touch panel of claim 11, wherein when the lead protection layer is a conductive layer, the lead protection layer comprises a plurality of lead protection blocks, each protection block respectively covering each signal lead located outside the joint area On-line, and the signal leads are electrically insulated from each other. The touch panel of claim 11, wherein the lead protection layer is an insulating layer. The touch panel of claim 11, further comprising a flexible circuit board adhered by an anisotropic conductive adhesive layer and passing through the anisotropic conductive adhesive layer and the signal leads connection. Method for manufacturing touch panel with conductive protective layer The method for manufacturing the touch panel includes: forming a sensing electrode layer on a substrate; forming a signal lead layer on the substrate, the signal lead layer comprising a plurality of signal leads, and each signal lead One end is electrically connected to the sensing electrode layer, and the other end is concentrated into an edge region of the substrate to form a bonding region; forming a conductive protective layer, comprising a plurality of conductive blocks, each of the conductive blocks being respectively located in the bonding region Each signal lead is electrically insulated from each other. The method for fabricating a touch panel according to claim 15, further comprising forming an anisotropic electro-adhesive layer in the bonding region and covering the signal leads located in the bonding region. The method for fabricating a touch panel according to claim 16, further comprising forming a flexible circuit board, the flexible circuit board being adhered and fixed by the anisotropic conductive adhesive layer, and passing through the anisotropic conductive adhesive layer Electrically connected to the signal leads.