M423306 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種電子裝置，且特別是有關於-種 觸控面板。 【先前技術】 隨著電子技術_勃發展，以及祕通訊與網路的 普及化，各式各樣的電子裝置逐漸成為生活不可或缺的工 具。然而，一般常見的輸入與輸出（input/〇utput，1/〇)界面， 像疋鍵盤或疋滑鼠’具有相當程度的操作困難。相形之下， 觸控面板是一種直觀、簡單的輸入與輸出界面。因此，觸 控面板常被應用作為人與電子裝置之間的溝通界面，以執 行控制。 一般來說，觸控面板會透過電路板而與驅動裝置電性 連接’以使觸控面板的觸控訊號能夠傳遞至驅動裝置中。 而目前觸控面板根據實際應用所需可分成單邊入力形式以 及雙邊入力形式。一般來說，所謂的單邊入力形式之觸控 面板指的是觸控面板之訊號線只有單一端點與電路板電性 接觸。而所謂的雙邊入力形式之觸控面板指的是觸控面板 之訊號線之兩端都分別與電路板電性接觸。 對於上述單邊入力形式觸控面板以及雙邊入力形式 觸控面板來說，通常需要各自設計對應的一組光罩來形成 所需的元件，而無法共用光罩。因而使得光罩成本無法節 省下來。 4 M423306 【新型内容】 本創作提供一種觸控面板，其可以解決傳統單邊入力 形式觸控面板以及雙邊入力形式觸控面板因光罩無法共用 而無法降低製造成本之問題。 本創作提出一種觸控面板，其包括基板、觸控元件陣 列接塾、引線、第一對位標記、第一接觸電極、第二接 觸電極、第二對位標記位以及電路板。基板具有主動區以 及周邊電路區，且周邊電路區中具有接合區。觸控元件陣 列設置於基板之主祕，觸控元件陣列包括多條訊號線， 訊號線從主動區延伸至周邊電路區。引線位於周邊電路區 中，其中每-引線與對應的其中一條訊號線之—端電性^ 接。接塾位於接合區令，且每一接墊與對應的其中 線電性連接。第-對位標記位於接塾的兩側 極位於第—接墊上方且與第—接塾電性連接。第二 極設置於第-翻電極之兩側，且第 對位標記位於第二接觸電極 5 &區中與第一接觸電極電性連接。 本^之—實施例中，上述之第一對位標記與一部 伤的第一接觸電極重疊。 在本創作之一實施例中， 部份的第二接觸電極的正下方Μ以驗標錄於一 f本創作之-實施例中， 以及第二對位標記屬於同—顧。㈣^對位“ 在本創作之一實施例令，上述之接塾與第一對位標記 5 M423306 以及第二對位標記的材質包括金屬。 在本創作之一實施例中，上述之觸控面板更包括絕緣 層’覆蓋接墊，且絕緣層中具有多個第一接觸窗開口以及 第二接觸窗開口，第一接觸電極藉由第一接觸窗開口而與 接墊電性連接。 在本創作之一實施例中，上述之第二接觸電極填入第 二接觸窗開口中。 在本創作之一實施例中，上述之第二接觸電極為浮置 狀態。 在本創作之一實施例中，上述之第一接觸電極與第二 接觸電極屬於同—膜層。 在本創作之一實施例中，上述之第一接觸電極與第二 接觸電極之材質包括透明導電材料。 基於上述’本創作之觸控面板在接合區之中設置有接 墊 *二第一對位標記、第二對位標記位、第一接觸電極以及 第二接觸電極。當此觸控硫是應祕單邊人力形式之觸 控面板m利用第—對位標記來進行各膜層以及電路 板接合之雜。若此觸控面板是應驗雙邊人力形式之觸 f面板時’其是抑第二對位標絲進行各膜層以及電路 接合之對位。g此本創作可使得單邊人力面板的製 仏、，又邊人力觸控面板的製造僅需替換第—個光罩即 觸本創作可以使單邊人 罩能夠共用，進而達到降低製造;本大部分的光 M423306 為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1疋依照本創作之一實施例之單邊入力形式之觸控 面板的上視示意圖。圖2是圖1之接合區C的局部放大示 意圖。圖3疋圖2之沿著剖面線1_1’以及剖面線η—〗〗，的剖 面示意圖。圖4是圖1之觸控面板與電路板接合之後的示 意圖。 請參照圖1、圖2、圖3以及圖4，本實施例之觸控面 板包括基板1〇〇、觸控元件陣列AR、引線U/L2、接墊 BP1、第厂對位標記M1、第一接觸電極m、第二接觸電 極E2、第二對位標記位河2以及電路板Fpc。 基板100具有主動區A以及周邊電路區B，且周邊電 路區B中具有接合區c。根據本實施例，基板刚可為硬 質基板或是軟性基板。周邊電路區B位於主動區A之周 圍。接合區C位於周邊電路w中，因此接合區c是位於 主動區A的其中一側邊處。 觸控元件陣列AR設置於基板1〇〇之主動區a中。在 此，觸控兀件陣列AR包括多條訊號線XL、YL，且訊號 線XL、YL從主動區a延伸至周邊電路區B。更詳細來說二 觸控兀件陣列AR包括多個觸控元件，其例如是陣列排列 的觸控電極。訊號線XL、YL與上述之觸控元件電性連接， 以使得觸控元件所產生_控_可以透過喊線紅、 7 M423306 YL而傳遞到驅動裝置或是控制裝置中。在此，訊號線XL 指的是沿著X方向延伸之訊號線，訊號線YL指的是沿著 Y方向延伸之訊號線。因此訊號線XL與訊號線YL彼此 交越設置且彼此電性絕緣。 引線L1以及引線L2位於周邊電路區B中，其中引線 L1以及引線L2與對應的訊號線Xl、YL之一端電性連接。 更詳細來說’每一條引線L1是與其中一條訊號線YL的一 端電性連接，每一條引線L2是與其中一條訊號線XL的一 端電性連接。而引線L1以及引線L2從周邊電路區B中延 伸到接合區C。 接墊BP1位於接合區c中，且每一接墊BP1與對應 的其中一條引線L1/L2電性連接。換言之，引線LI、L2 之末端都會與對應的一個接墊BP1連接在一起。 第一對位標記Ml位於接墊BP1的兩側。在本實施例 中，第一對位標記Ml是對稱地形成在整個接墊Βρι的兩 側。特別是，本實施例更包括在基板1〇〇上設置第二對位 標記位M2。第二對位標記位M2是設置在接合區c之邊 緣0 承上所述，上述之第一對位標記M1、第二對位標記 位M2、接墊BP1以及引線U、L2是屬於同一層膜層， 因此，上述之第一對位標記厘卜第二對位標記位M2、接 墊BP1以及引線LI、L2是位於基板1〇〇之表面上。在本 實施例中，第一對位標記Ml、第二對位標記位m2、接墊 BP1以及引線L1、L2是採用同一道光罩（第—道光罩)製程 M423306 所形成的。基於引線Li、L2之導電性之考量，上述之第 對位“ β己Ml、第一對位標記位M2、接塾Βρι以及引線 LI、L2材質例如是包括金屬。 在基板100上形成上述之元件之後，接著在基板1〇〇 上形成絕緣層102 ’以覆蓋第一對位標記M1、第二對位標 記位M2、接塾BP1以及引線U、L2。在此，絕緣層1〇2 中具有多個第一接觸窗開口 V1以及第二接觸窗開口 V2， 鲁 每一個第一接觸窗開口 VI暴露出對應的一個接墊BP1， 而第二接觸窗開口 V2則是暴露出基板100。上述於絕緣層 1〇2所形成的第一及第二接觸窗開口 V1、V2是採用第二 道光罩製程所形成。 第一接觸電極E1位於接墊BP1上方且與接墊Bp丨電 性連接。更詳細來說，第一接觸電極E1位於絕緣層102 上，並且設置於接墊BP1之正上方。而且第一接觸電極 E1透過絕緣層1〇2中之第一接觸窗開口 V1而與接墊Βρι 電性連接。 鲁 第二接觸電極E2設置於第一接觸電極E1之兩側。而 第二對位標記M2位於第二接觸電極E2之兩側。更詳細來 說，第二接觸電極E2位於絕緣層1〇2上，且設置在第一 接觸電極E1之兩側。另外，第二接觸電極拉更填入第二 接觸_開口 V2中。在此，第一接觸電極Ei與第二接觸電 極E2都是位於絕緣層1〇2上，且屬於同一膜層。因此， 第二接觸電極E2設置於第一接觸電極E1是採用同一道光 罩（第二道光罩)製程所形成。根據本實施例，第一接觸電 9 M423306 極El與第二接觸電極E2之材質包括透明導電材料，其例 如是金屬氧化物。 值得一提的是，在本實施例中，第一接觸電極E1位 於接墊BP1上方且透過第一接觸窗開口 V1與接墊Βρι電 性連接。但是，第二接觸電極E1之下方沒有設置接墊， 因此即使第二接觸電極E2填入第二接觸窗開口 V2内，第 二接觸電極E2仍不會與其他元件或是線路有電性連接之 關係’因而其為浮置狀態。 此外，在本實施例中，有一部份的第二接觸電極 會與第一對位標記Ml重疊。換言之，第一對位標記M1 是位於一部份的第二接觸電極E2的正下方。在此，因第 二接觸電極E2不會與其他元件或是線路有電性連接之關 係，因而其為浮置狀態，因此即使第二接觸電極E2填入 第二接觸窗開口 V2内而與第一對位標記M1接觸，也不 對觸控面板之運作造成影響。 承上所述，由於圖1所示之觸控面板是單邊入力形式 之觸控面板，也就是訊號線XL、YL只有單一端點透過^ 線LI、L2而與接墊BP1連接在一起。因此，在此實施例 之觸控面板主要是透過接墊BP1以及位於接墊Βρι上方的 第一接觸電極Ml來與電路板FPC：電性連接，如圖4所示。 在本實施例中，當將電路板PFC接合至基板1〇〇上時，是 透過第一對位標記M1來進行電路板pFC與接墊Βρι 的對位。 间 承上所述，在上述之實施例中，觸控面板是採用單邊 M423306 入力形式。而當觸控面板欲採用雙邊入力形式時，只需要 將上述第一光罩替換掉，並採用相同的第二光罩以及第三 光罩即可使觸控面板形成雙邊入力形式，詳細說明如下。 圖5是依照本創作之一實施例之雙邊入力形式之觸控 面板的上視示意圖。圖6是圖5之接合區C的局部放大示 意圖。圖7是圖5之觸控面板與電路板接合之後的示意圖。 請參照圖5、圖6以及圖7，在此實施例中，與上述圖1 φ 至圖4相同的元件以相同的符號表示，且不再重複說明。 在此實施例中，由於此觸控面板是採用雙邊入力形式，因 此’此觸控面板除了上述圖1至圖4所示之構件之外(但不 包含第一對位標記Ml)，還進一步包括引線、L4以及 接墊BP2。 類似地’引線L3及L4與引線L1及L2都是位於周 邊電路區B中。引線L1及L2與對應的訊號線XL、YL 之一端電性連接，且引線L3及L4與對應的訊號線xl、 YL之另一端電性連接。更詳細來說，每一條訊號線YL的 鲁一端疋與其中一條引線L1電性連接，且所述訊號線YL之 另一端則是與其中一條引線L3電性連接。一條訊號線XL 的-端是與其中-條引線L2電性連接，且所述訊號線XL 之另-端則是與其中-條引線L4電性連接。而引線u及 L2以及引線L3及L4皆由周邊電路區b中延伸到接合區c 中。 此外，接墊BP1以及接墊BP2都位於接合區c中。 特別是，且每-接塾BP1與對應的其中一條引線li/l2電 M423306 性連接，每一接墊BP2則是與對應的其中一條引線l3/L4 電性連接。換言之，引線L1、L2之末端都會與對應的一 個接墊BP1連接在一起，且引線^、14之末端都會與對 應的一個接墊BP2連接在一起。 、 承上所述，由於此雙邊入力形式之觸控面板在接合區 C中除了接墊BP1之外還進一步包括接墊BP2，換言之， 此雙邊入力觸控面板不需要第一對位標記M1。因此，在 此雙邊入力形式之觸控面板之第一道光罩上，主要是設計 了有對應第一對位標§己位M2 '接塾BP1、接墊BP2、引 線LI、L2以及引線L3、L4之圖案。 之後，於基板100上形成具有第一及第二接觸窗開口 VI、V2之絕緣層1〇2 ’特別是，因上述圖i至圖4之實施 例中所採用的第二道光罩即已經設計有對應第一及第二接 觸窗開口 VI、V2之圖案。因此，此步驟可以直接採用圖 1至圖4之實施例中所採用的第二道光罩。當於進行上述 第二道光罩製程之後’即可在基板100上形成具有接觸窗 開口 VI、V2之絕緣層1〇2，其中接觸窗開口 VI、V2分 別暴露出接墊BP1以及接墊BP2。 之後’於絕緣層102上形成第一接觸電極E1以及第 二接觸電極E2 ’特別是，因上述圖1至圖4之實施例中所 採用的第三道光罩即已經設計有對應第一接觸電極Ei以 及第一接觸電極E2之圖案，因此此步驟可以直接採用上 述圖1至圖4之實施例中所採用的第三道光罩。當於進行 上述第三道光罩製程之後，即可在絕緣層102上形成第— 12M423306 V. New description: [New technical field] This creation is related to an electronic device, and in particular to a touch panel. [Prior Art] With the development of electronic technology and the popularization of secret communication and networks, various electronic devices have gradually become an indispensable tool for life. However, the common input and output (input/〇utput, 1/〇) interface, such as the keyboard or the mouse, has a considerable degree of operational difficulty. In contrast, the touch panel is an intuitive and simple input and output interface. Therefore, the touch panel is often used as a communication interface between a person and an electronic device to perform control. Generally, the touch panel is electrically connected to the driving device through the circuit board to enable the touch signal of the touch panel to be transmitted to the driving device. At present, the touch panel can be divided into a single-sided input form and a bilateral input form according to actual application requirements. Generally speaking, the touch panel of the so-called single-sided input type refers to that the signal line of the touch panel has only a single end point and electrical contact with the circuit board. The touch panel of the bilateral input type means that both ends of the signal line of the touch panel are electrically contacted with the circuit board respectively. For the above-mentioned single-sided input type touch panel and the bilateral input-type touch panel, it is usually required to design a corresponding set of masks to form desired components, and the mask cannot be shared. Therefore, the cost of the mask cannot be saved. 4 M423306 [New Content] This product provides a touch panel that can solve the problem that the traditional unilateral input type touch panel and the bilateral input type touch panel cannot reduce the manufacturing cost because the reticle cannot be shared. The present invention proposes a touch panel comprising a substrate, a touch element array interface, a lead, a first alignment mark, a first contact electrode, a second contact electrode, a second alignment mark bit, and a circuit board. The substrate has an active area and a peripheral circuit area, and has a land in the peripheral circuit area. The array of touch elements is disposed on the substrate. The array of touch elements includes a plurality of signal lines, and the signal lines extend from the active area to the peripheral circuit area. The leads are located in the peripheral circuit area, wherein each of the leads is electrically connected to the corresponding one of the signal lines. The pads are located in the land, and each pad is electrically connected to the corresponding center line. The first-alignment mark is located on both sides of the interface and is located above the first pad and electrically connected to the first port. The second pole is disposed on both sides of the first flip electrode, and the bit mark is electrically connected to the first contact electrode in the second contact electrode 5 & In the embodiment, the first alignment mark overlaps with a damaged first contact electrode. In one embodiment of the present invention, a portion of the second contact electrode is directly underneath the embodiment of the present invention, and the second alignment mark belongs to the same. (4) Alignment "In one embodiment of the present invention, the material of the above-mentioned interface and the first alignment mark 5 M423306 and the second alignment mark includes a metal. In an embodiment of the present invention, the above touch The panel further includes an insulating layer covering pad, and the insulating layer has a plurality of first contact window openings and a second contact window opening, and the first contact electrode is electrically connected to the pad by the first contact window opening. In one embodiment, the second contact electrode is filled in the second contact opening. In one embodiment of the present invention, the second contact electrode is in a floating state. In one embodiment of the present writing The first contact electrode and the second contact electrode belong to the same film layer. In one embodiment of the present invention, the material of the first contact electrode and the second contact electrode includes a transparent conductive material. The touch panel is provided with a pad*2 first alignment mark, a second alignment mark position, a first contact electrode and a second contact electrode in the bonding area. When the touch sulfur is a secret unilateral human form It The control panel m utilizes the first-alignment mark to perform the bonding of the film layers and the circuit board. If the touch panel is a touch panel of the bilateral human form, it is a second alignment mark for each film layer. And the alignment of the circuit joints. This creation can make the unilateral human panel manufacturing, and the manufacture of the human touch panel only needs to replace the first reticle, that is, the touch creation can make the unilateral cover share. In order to achieve a reduction in manufacturing; the majority of the light M423306 is to make the above-mentioned features and advantages of the present invention more obvious and easy to understand. The following specific embodiments are described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a partially enlarged schematic view of a junction area C of FIG. 1. FIG. 3 is a cross-sectional view taken along line 1_1' and a section of FIG. Figure 4 is a schematic view of the touch panel of Figure 1 after being joined to the circuit board. Referring to Figures 1, 2, 3 and 4, the touch panel of the present embodiment includes a substrate. 1〇〇, touch element array Column AR, lead U/L2, pad BP1, first factory alignment mark M1, first contact electrode m, second contact electrode E2, second alignment mark bit 2, and circuit board Fpc. Substrate 100 has active area A And the peripheral circuit area B, and the peripheral circuit area B has a junction area c. According to the embodiment, the substrate can be a rigid substrate or a flexible substrate. The peripheral circuit area B is located around the active area A. The junction area C is located in the peripheral circuit In the w, the junction area c is located at one side of the active area A. The touch element array AR is disposed in the active area a of the substrate 1 . Here, the touch element array AR includes a plurality of signal lines. XL, YL, and the signal lines XL, YL extend from the active area a to the peripheral circuit area B. In more detail, the two touch element arrays AR comprise a plurality of touch elements, such as arrays of touch electrodes. The signal lines XL and YL are electrically connected to the touch elements, so that the touch elements can be transmitted to the driving device or the control device through the red line and the 7 M423306 YL. Here, the signal line XL refers to a signal line extending along the X direction, and the signal line YL refers to a signal line extending along the Y direction. Therefore, the signal line XL and the signal line YL are placed across each other and electrically insulated from each other. The lead L1 and the lead L2 are located in the peripheral circuit area B, wherein the lead L1 and the lead L2 are electrically connected to one end of the corresponding signal line X1, YL. More specifically, each of the leads L1 is electrically connected to one end of one of the signal lines YL, and each of the leads L2 is electrically connected to one end of one of the signal lines XL. Lead L1 and lead L2 extend from peripheral circuit region B to junction region C. The pads BP1 are located in the bonding region c, and each of the pads BP1 is electrically connected to a corresponding one of the leads L1/L2. In other words, the ends of the leads LI, L2 are connected to a corresponding one of the pads BP1. The first alignment mark M1 is located on both sides of the pad BP1. In the present embodiment, the first alignment mark M1 is symmetrically formed on both sides of the entire pad Βρι. In particular, the present embodiment further includes providing a second alignment mark bit M2 on the substrate 1A. The second alignment mark bit M2 is disposed on the edge 0 of the junction area c, and the first alignment mark M1, the second alignment mark bit M2, the pad BP1, and the leads U, L2 belong to the same layer. The film layer, therefore, the first alignment mark, the second alignment mark M2, the pads BP1, and the leads LI, L2 are located on the surface of the substrate 1 . In the present embodiment, the first alignment mark M1, the second alignment mark bit m2, the pads BP1, and the leads L1, L2 are formed by the same mask (first pass mask) process M423306. Based on the conductivity of the leads Li and L2, the above-mentioned parallel "β·M1, the first alignment mark M2, the contact ρι, and the leads LI, L2 are made of, for example, a metal. The above-described substrate 100 is formed. After the element, an insulating layer 102' is then formed on the substrate 1 to cover the first alignment mark M1, the second alignment mark M2, the interface BP1, and the leads U, L2. Here, the insulating layer 1〇2 There are a plurality of first contact window openings V1 and a second contact window opening V2. Each of the first contact window openings VI exposes a corresponding one of the pads BP1, and the second contact window opening V2 exposes the substrate 100. The first and second contact window openings V1 and V2 formed in the insulating layer 1〇2 are formed by a second mask process. The first contact electrode E1 is located above the pad BP1 and electrically connected to the pad Bp. In more detail, the first contact electrode E1 is located on the insulating layer 102 and disposed directly above the pad BP1. And the first contact electrode E1 passes through the first contact window opening V1 of the insulating layer 1〇2 and the pad. Βρι Electrical connection. Lu second contact electrode E2 is disposed on both sides of the first contact electrode E1, and the second alignment mark M2 is located on both sides of the second contact electrode E2. In more detail, the second contact electrode E2 is located on the insulating layer 1〇2, and is disposed on The first contact electrode E1 is further filled in the second contact opening V2. Here, the first contact electrode Ei and the second contact electrode E2 are both located on the insulating layer 1〇2. Therefore, the second contact electrode E2 is disposed on the first contact electrode E1 by using the same reticle (second reticle) process. According to the embodiment, the first contact current 9 M423306 is El and The material of the second contact electrode E2 includes a transparent conductive material, such as a metal oxide. It is worth mentioning that, in this embodiment, the first contact electrode E1 is located above the pad BP1 and passes through the first contact window opening V1. The pad 电ρι is electrically connected. However, no pad is disposed under the second contact electrode E1, so even if the second contact electrode E2 is filled in the second contact window opening V2, the second contact electrode E2 is not combined with other components or Is the line electrically In the present embodiment, a portion of the second contact electrode overlaps with the first alignment mark M1. In other words, the first alignment mark M1 is located in a portion. The second contact electrode E2 is directly under the contact electrode E2. Here, since the second contact electrode E2 is not electrically connected to other components or lines, it is in a floating state, so even if the second contact electrode E2 is filled in The second contact window opening V2 is in contact with the first alignment mark M1, and does not affect the operation of the touch panel. As described above, the touch panel shown in FIG. 1 is a touch panel of a single-sided input type. That is, only a single end point of the signal lines XL, YL is connected to the pad BP1 through the wires L1, L2. Therefore, the touch panel in this embodiment is mainly electrically connected to the circuit board FPC through the pad BP1 and the first contact electrode M1 located above the pad ,ρι, as shown in FIG. In the present embodiment, when the circuit board PFC is bonded to the substrate 1A, the alignment of the circuit board pFC and the pad Βρι is performed through the first alignment mark M1. In the above embodiments, the touch panel adopts a single-sided M423306 input form. When the touch panel is to be in the form of a bilateral input force, only the first photomask needs to be replaced, and the same second photomask and the third photomask are used to form the touch panel into a bilateral input force form, which is described in detail below. . Figure 5 is a top plan view of a touch panel in the form of a bilateral input force in accordance with one embodiment of the present invention. Figure 6 is a partial enlarged view of the joint area C of Figure 5. FIG. 7 is a schematic view of the touch panel of FIG. 5 after being joined to the circuit board. FIG. Referring to FIG. 5, FIG. 6, and FIG. 7, in this embodiment, the same elements as those in FIG. 1 to FIG. 4 are denoted by the same reference numerals and the description thereof will not be repeated. In this embodiment, since the touch panel is in the form of a bilateral input force, the touch panel is further than the components shown in FIG. 1 to FIG. 4 (but not including the first alignment mark M1). Includes leads, L4, and pads BP2. Similarly, the leads L3 and L4 and the leads L1 and L2 are both located in the peripheral circuit region B. The leads L1 and L2 are electrically connected to one end of the corresponding signal line XL, YL, and the leads L3 and L4 are electrically connected to the other end of the corresponding signal line x1, YL. In more detail, one end of each signal line YL is electrically connected to one of the leads L1, and the other end of the signal line YL is electrically connected to one of the leads L3. The end of one of the signal lines XL is electrically connected to the one of the leads L2, and the other end of the signal line XL is electrically connected to the one of the leads L4. The leads u and L2 and the leads L3 and L4 are both extended from the peripheral circuit region b into the land c. Further, the pads BP1 and the pads BP2 are located in the land c. In particular, each of the contacts BP1 is electrically connected to a corresponding one of the leads li/l2, and each of the pads BP2 is electrically connected to one of the corresponding leads l3/L4. In other words, the ends of the leads L1, L2 are connected to the corresponding one of the pads BP1, and the ends of the leads ^, 14 are connected to the corresponding one of the pads BP2. As described above, the touch panel of the bilateral input form further includes a pad BP2 in the bonding area C in addition to the pad BP1. In other words, the bilateral input touch panel does not require the first alignment mark M1. Therefore, on the first mask of the touch panel in the form of bilateral input, the corresponding first alignment mark M2 'connected BP1, the pad BP2, the leads LI, L2 and the lead L3 are mainly designed. , L4 pattern. Thereafter, an insulating layer 1 〇 2 ′ having first and second contact opening VIs, V2 is formed on the substrate 100. In particular, the second reticle used in the embodiments of the above FIGS. i to 4 has been designed. There are patterns corresponding to the first and second contact window openings VI, V2. Therefore, this step can directly adopt the second mask used in the embodiment of FIGS. 1 to 4. The insulating layer 1 2 having the contact opening VI, V2 may be formed on the substrate 100 after the second mask process is performed, wherein the contact openings VI, V2 respectively expose the pad BP1 and the pad BP2. Then, the first contact electrode E1 and the second contact electrode E2 are formed on the insulating layer 102. In particular, the third photomask used in the above embodiments of FIGS. 1 to 4 has been designed to correspond to the first contact electrode. Ei and the pattern of the first contact electrode E2, so this step can directly adopt the third mask used in the above embodiments of FIGS. 1 to 4. After the third mask process is performed, the first layer 12 can be formed on the insulating layer 102.