CN108255338B - Flexible touch screen, touch panel, touch substrate and manufacturing method thereof - Google Patents

Flexible touch screen, touch panel, touch substrate and manufacturing method thereof Download PDF

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Publication number
CN108255338B
CN108255338B CN201810031662.3A CN201810031662A CN108255338B CN 108255338 B CN108255338 B CN 108255338B CN 201810031662 A CN201810031662 A CN 201810031662A CN 108255338 B CN108255338 B CN 108255338B
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layer
ito
metal
flexible
substrate
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CN108255338A (en
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王庆浦
谢涛峰
范文金
贺晓悦
王准
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The invention discloses a flexible touch screen, a touch panel, a touch substrate and a manufacturing method thereof, wherein the flexible touch substrate comprises: the method comprises the following steps: a binding region; the binding region comprises a flexible substrate, and a first indium tin oxide semiconductor (ITO) layer, a metal layer and a second ITO layer which are sequentially arranged on the flexible substrate. The invention can enhance the FPC drawing force in the binding area of the flexible touch screen and ensure the quality of the flexible touch screen.

Description

Flexible touch screen, touch panel, touch substrate and manufacturing method thereof
Technical Field
The invention relates to the technical field of display, in particular to a flexible touch screen, a touch panel, a touch substrate and a manufacturing method thereof.
Background
Along with the development of science and technology, electronic communication equipment is changed, and flexible equipment gradually comes into the field of vision of the public. As a convenient and fast man-machine interaction mode, the application of the touch screen is more and more extensive. With the rapid development of OLED technology, flexible OLED (Organic Light-Emitting Diode) technology gradually comes into the field of vision, which also puts demands on flexible touch technology.
At present, the flexible touch technology is mainly used for out-of-band touch, and a PET (Polyethylene terephthalate)/COP (cyclic Olefin Polymer) substrate is mostly adopted, and then a bridging structure or a DITO (double ITO) structure is formed on the substrate to form a touch electrode. In the out-hanging type bridging scheme, the Bonding (binding) area mostly adopts a Metal + ITO structure, as shown in fig. 2: a Metal layer is deposited on a PET/COP substrate, and an ITO (indium tin oxide semiconductor) layer is covered on the Metal layer to protect the underlying Metal layer.
However, in practical applications, the inventors of the present invention found that the Bonding area of the existing flexible touch screen has a disadvantage of insufficient FPC (flexible circuit board) drawing force, which causes a problem of product quality of the flexible touch screen.
Disclosure of Invention
In view of this, the present invention is directed to a flexible touch screen, a touch panel, a touch substrate and a manufacturing method thereof, which can enhance the FPC drawing force in the Bonding area of the flexible touch screen and ensure the quality of the flexible touch screen.
The present invention provides a flexible touch substrate for the above purpose, including: a binding region; the binding region comprises a flexible substrate, an
A first indium tin oxide semiconductor (ITO) layer, a metal layer, and a second ITO layer disposed on the flexible substrate in sequence.
Further, the binding region further includes: an insulating layer (OC) disposed between the metal layer and the second ITO layer;
the OC layer is provided with a via hole, and the second ITO layer is connected with the metal layer through the via hole.
Preferably, the aperture of the via hole of the OC layer covering the metal layer is larger than the set first aperture;
the through hole of the OC layer covering the flexible substrate is smaller than the set second aperture;
wherein the second aperture is smaller than the first aperture.
The first ITO layer comprises a plurality of first ITO subblocks arranged on the flexible substrate in an array manner; and
the metal layer comprises a plurality of metal sheets which are respectively laid on each first layer of ITO subblocks, and the area of each metal sheet is smaller than that of the first layer of ITO subblocks below the metal sheet.
The second ITO layer comprises a plurality of second ITO subblocks which are respectively positioned above the metal sheets; and the area of the second layer of ITO subblocks above the metal sheet is larger than that of the first layer of ITO subblocks below the metal sheet.
The invention also provides a manufacturing method of the flexible touch substrate, which comprises the following steps:
depositing and etching an ITO layer on the flexible base material of the binding area of the flexible touch substrate to obtain a pattern of the first ITO layer;
depositing a metal layer on the flexible substrate and etching to obtain a pattern of the metal layer on the first ITO layer;
and depositing an ITO layer on the flexible substrate and etching to obtain a pattern of a second ITO layer.
Further, before depositing an ITO layer on the flexible substrate, the method further comprises the following steps:
depositing an insulating layer on the flexible substrate and etching the via hole to obtain a graph of the OC layer with the via hole; and
the second ITO layer is connected with the metal layer through the via hole of the OC layer.
Preferably, the depositing an insulating layer on the flexible substrate and etching the via hole specifically includes:
after an insulating layer is deposited on the substrate, the aperture of a via hole etched above the metal layer is larger than a set first aperture;
the through hole covered above the flexible substrate is etched to be smaller than the set second aperture;
wherein the second aperture is smaller than the first aperture.
The present invention also provides a flexible touch panel including: a flexible touch substrate as described above.
The present invention also provides a flexible touch screen, comprising: a flexible touch panel as described above.
According to the technical scheme, the ITO priming is added between the flexible substrate and the Metal, so that the problem of poor adhesion between the Metal and the substrate is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
Furthermore, an OC layer as an intermediate layer is additionally arranged in the Bonding area, and the second ITO layer is connected with the Metal in a sinking mode, so that the problem that the Metal is difficult to effectively protect due to the fact that the second ITO layer is directly connected with the Metal in a lap joint mode and cracks are generated is solved, and the drawing force of the Bonding area is further enhanced.
Further, the aperture ratio of the via hole OC1 of the OC layer covering the metal layer is larger, so that the metal layer is conductive to the second ITO layer; meanwhile, the through hole of the OC layer covering the flexible substrate is smaller, so that the contact area of the ACF and the Bonding area is increased, and the drawing force of the FPC is further enhanced.
Drawings
FIG. 1 is a schematic structural diagram of a binding region of a flexible touch screen in the prior art;
fig. 2 is a schematic cross-sectional structure diagram of a flexible touch screen bonding area according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing a binding region of a flexible touch screen according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of a flexible touch screen bonding area according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional structure diagram of a flexible touch screen bonding area according to a second embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a binding area of a flexible touch screen according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
The inventor analyzes the structure of the binding region of the existing flexible touch screen, and finds that the problem of poor adhesion exists between the Metal and the base material. The Metal is easy to separate from the base material, so that the FPC drawing force in the Bonding area is insufficient; in other words, when the FPC is pulled with a large force, the Metal is likely to be separated from the substrate.
Therefore, the inventor of the invention considers that an ITO layer is added between the flexible substrate and the Metal to solve the problem of poor adhesion between the Metal and the substrate, so that the FPC drawing force of a Bonding area of the flexible touch screen is enhanced, and the quality of the flexible touch screen is ensured.
The technical scheme of the invention is described in detail below with reference to the accompanying drawings, and two embodiments are specifically provided in the technical scheme of the invention.
Example one
The structure of the flexible touch screen binding area provided by the first embodiment of the present invention, as shown in fig. 2, includes: a flexible base 201 as a substrate, and a first ITO layer 202, a metal layer 203, an OC layer 204, and a second ITO layer 205 which are sequentially disposed on the flexible base 201.
The OC layer 204 is provided with a via hole, and the second ITO layer 205 is connected to the metal layer 203 through the via hole. As a preferred embodiment, the aperture of the via hole of the OC layer (insulating layer) covering the metal layer is larger than the set first aperture; the through hole of the OC layer covering the flexible substrate is smaller than the set second aperture; wherein the second aperture is smaller than the first aperture.
The method for manufacturing the binding area of the flexible touch screen provided by the embodiment of the invention has the flow shown in fig. 3, and comprises the following steps:
step S301: and depositing an ITO layer on the flexible substrate and etching to obtain a pattern of the first ITO layer.
In the step, an ITO layer is deposited and etched on the flexible substrate in a one-step composition process, and a graph of the first ITO layer is obtained. For example, the resulting first ITO layer is patterned as shown in FIG. 4, where a plurality of first ITO sub-blocks are arranged in an array on a flexible substrate.
Step S302: depositing a metal layer on the flexible substrate and etching to obtain a pattern of the metal layer on the first ITO layer;
in the step, a metal layer is deposited and etched on the flexible substrate in a one-step composition process, and a pattern of the metal layer on the first ITO layer is obtained. For example, as shown in fig. 2, a metal sheet is deposited on each first layer ITO sub-block, that is, the metal layer includes several metal sheets respectively laid on each first layer ITO sub-block.
Because a layer of ITO is added between the Metal (Metal) layer and the base material, the ITO has strong adhesive force with the base material, and the Metal has strong adhesive force with the ITO, the problem of poor adhesive force between the Metal and the base material is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
Preferably, the area of the first layer of ITO subblocks may be larger than the area of the metal layer laid above the first layer of ITO subblocks, that is, the boundary of the first layer of ITO subblocks below the metal sheet extends beyond the boundary of the metal sheet; so that stronger adhesive force is formed between the ITO and the base material, and the FPC drawing force of a Bonding area of the flexible touch screen is further enhanced. For example, the first layer of ITO sub-blocks is expanded to about 2um each on the two sides of the length and the width of the Metal laid on the first layer of ITO sub-blocks. And Metal Bonding W/S (Metal Bonding area width/spacing) is 100/100 um.
Step S303: and depositing an insulating layer on the flexible substrate and etching the via hole to obtain a graph of the OC layer with the via hole.
In the step, an OC layer is deposited and etched on the flexible substrate in a one-step composition process, and a graph of the OC layer with the through holes is obtained. For example, as shown in FIG. 2, the OC layer can be applied over both the metal layer and the flexible substrate without the metal layer applied.
Step S304: depositing an ITO layer on the flexible substrate and etching to obtain a pattern of a second ITO layer; the second ITO layer is connected with the metal layer through the via hole of the OC layer.
In the step, an ITO layer is deposited and etched on the flexible substrate in a one-step composition process, and a pattern of a second ITO layer is obtained. As shown in fig. 2, the second ITO layer is connected to the metal layer through the via of the OC layer.
In practical applications, the inventor of the present invention has also found that, in the prior art, when a Bonding area is fabricated, an ITO film is directly bonded to a Metal, since the Metal is thicker, about 1500-2000A, and the ITO film is thinner, about 500A, as shown in fig. 1, the ITO film is prone to form cracks at the edge of the Metal, and the Metal cannot be effectively protected, and is prone to corrosion when exposed to air, thereby causing insufficient pulling force in the Bonding area.
Therefore, in the technical scheme of the first embodiment of the invention, the middle layer OC layer is added in the Bonding area, and the second ITO layer is overlapped with the Metal in a sinking mode, so that the problem that the Metal is difficult to effectively protect due to the fact that the second ITO layer is directly overlapped with the Metal to generate cracks is avoided, and the drawing force of the Bonding area is further enhanced.
Preferably, the aperture of the via OC1 of the OC layer overlying the metal layer may be relatively large to facilitate electrical conduction from the metal layer to the second ITO layer. For example, the aperture of via OC1 of the OC layer above the metal layer may be larger than the set first aperture. For example, a first aperture of 30um is set, and the aperture of via OC1 of the OC layer overlying the metal layer can be set to 35 um.
The aperture of the via hole of the OC layer covering the flexible substrate, that is, the via hole OC2 of the OC layer laid between the metal sheets can be smaller, so as to increase the contact area between the ACF (anisotropic conductive adhesive) and the Bonding area, further enhance the FPC pull force, and improve the reliability. For example, the via OC2 of the OC layer covering the flexible substrate is smaller than the set second aperture; wherein the second aperture is smaller than the first aperture. For example, the second aperture is set to 20um, and the aperture of the via OC2 of the OC layer covering the flexible substrate can be set to 15 um.
As shown in fig. 2, the second ITO layer may include a plurality of second ITO sub-blocks respectively located above the metal sheets; preferably, the area of the second layer of ITO sub-blocks above the metal sheet may be larger than the area of the first layer of ITO sub-blocks below the metal sheet, that is, the boundary of the second layer of ITO sub-blocks above the metal sheet extends beyond the boundary of the first layer of ITO sub-blocks below the metal sheet. In this way, the second layer of ITO sub-blocks can protect the metal sheet below the second layer of ITO sub-blocks and the first layer of ITO sub-blocks.
In the technical scheme of the first embodiment of the invention, the ITO priming is added between the flexible substrate and the Metal, so that the problem of poor adhesive force between the Metal and the substrate is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
Furthermore, in the technical scheme of the first embodiment of the invention, the middle layer OC layer is added in the Bonding area, and the second ITO layer is overlapped with the Metal in a sinking mode, so that the problem that the Metal is difficult to effectively protect due to the fact that the second ITO layer is directly overlapped with the Metal to generate cracks is avoided, and the drawing force of the Bonding area is further enhanced.
Further, in the first technical solution of the embodiment of the present invention, the aperture ratio of the via hole OC1 of the OC layer covering the metal layer is relatively large, so that the metal layer is electrically conducted to the second ITO layer; meanwhile, the through hole of the OC layer covering the flexible substrate is smaller, so that the contact area of the ACF and the Bonding area is increased, and the drawing force of the FPC is further enhanced.
Example two
A simpler flexible touch screen binding region structure provided by the second embodiment of the present invention, as shown in fig. 5, includes: a flexible base 501 as a substrate, and a first ITO layer 502, a metal layer 503, and a second ITO layer 505 sequentially disposed on the flexible base 501.
The first ITO layer 502 includes a plurality of first ITO sub-blocks arranged in an array on the flexible substrate; the metal layer 503 comprises a plurality of metal sheets which are respectively paved on the first layer of ITO subblocks; the second ITO layer 505 includes a plurality of second ITO sub-blocks respectively laid on the metal sheets of the metal layer 503 and covering the metal sheets and the first ITO sub-blocks under the metal sheets.
The manufacturing method of the binding area of the flexible touch screen provided by the second embodiment of the invention has a process shown in fig. 6, and comprises the following steps:
step S601: an ITO layer is deposited on the flexible substrate and etched to obtain a pattern of the first ITO layer 502.
In this step, an ITO layer is deposited and etched on the flexible substrate in a one-step patterning process to obtain a pattern of the first ITO layer 502. The resulting first ITO layer 502 may include a first layer of ITO sub-blocks arranged in an array on a flexible substrate.
Step S602: and depositing a metal layer on the flexible substrate and etching to obtain a pattern of the metal layer 503 on the first ITO layer 502.
In this step, a metal layer is deposited and etched on the flexible substrate in a one-step patterning process to obtain a pattern of the metal layer 503 on the first ITO layer 502. The metal layer 503 may include a plurality of metal sheets, which are respectively laid on the first ITO sub-blocks.
Because a layer of ITO is added between the Metal (Metal) layer and the base material, the ITO has strong adhesive force with the base material, and the Metal has strong adhesive force with the ITO, the problem of poor adhesive force between the Metal and the base material is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
Preferably, the area of the metal sheet of the metal layer 503 may be smaller than the area of the first layer ITO sub-block under the metal sheet, that is, the boundary of the first layer ITO sub-block under the metal sheet of the metal layer 503 extends beyond the boundary of the metal sheet. So that the first layer of ITO subblock has stronger adhesive force with the base material, and the FPC drawing force of the Bonding area of the flexible touch screen is further enhanced.
Step S603: and depositing an ITO layer on the flexible substrate and etching to obtain a pattern of a second ITO layer 505 covering the first ITO layer 502 and the metal layer 503.
In this step, a layer of ITO is deposited and etched on the flexible substrate in a one-step patterning process to obtain a pattern of the second ITO layer 505. The second ITO layer 505 may include a plurality of second ITO sub-blocks, which are respectively laid on the metal sheets of the metal layer 503 and cover the metal sheets and the first ITO sub-blocks under the metal sheets.
Preferably, the area of the second layer of ITO sub-blocks is larger than the area of the first layer of ITO sub-blocks of the first ITO layer 502 below it, i.e., the boundaries of the second layer of ITO sub-blocks extend beyond the boundaries of the first layer of ITO sub-blocks below it. In this way, the second layer of ITO sub-blocks can protect the metal sheet below the second layer of ITO sub-blocks and the first layer of ITO sub-blocks.
In the second technical scheme of the embodiment of the invention, the ITO priming is added between the flexible substrate and the Metal, so that the problem of poor adhesive force between the Metal and the substrate is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
The flexible touch screen provided by the invention can comprise the Bonding area in the first embodiment or the second embodiment.
According to the technical scheme, the ITO priming is added between the flexible substrate and the Metal, so that the problem of poor adhesion between the Metal and the substrate is solved, the FPC drawing force of a Bonding area of the flexible touch screen can be enhanced, and the quality of the flexible touch screen is ensured.
Furthermore, an OC layer as an intermediate layer is additionally arranged in the Bonding area, and the second ITO layer is connected with the Metal in a sinking mode, so that the problem that the Metal is difficult to effectively protect due to the fact that the second ITO layer is directly connected with the Metal in a lap joint mode and cracks are generated is solved, and the drawing force of the Bonding area is further enhanced.
Further, the aperture ratio of the via hole OC1 of the OC layer covering the metal layer is larger, so that the metal layer is conductive to the second ITO layer; meanwhile, the through hole of the OC layer covering the flexible substrate is smaller, so that the contact area of the ACF and the Bonding area is increased, and the drawing force of the FPC is further enhanced.
Those of skill in the art will appreciate that various operations, methods, steps in the processes, acts, or solutions discussed in the present application may be alternated, modified, combined, or deleted. Further, various operations, methods, steps in the flows, which have been discussed in the present application, may be interchanged, modified, rearranged, decomposed, combined, or eliminated. Further, steps, measures, schemes in the various operations, methods, procedures disclosed in the prior art and the present invention can also be alternated, changed, rearranged, decomposed, combined, or deleted.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.

Claims (8)

1. A flexible touch substrate comprising: a binding region; the binding region comprises a flexible substrate, an
A first indium tin oxide semiconductor (ITO) layer, a metal layer, and a second ITO layer sequentially disposed on the flexible substrate;
the binding region further includes: the insulating layer is arranged between the metal layer and the second ITO layer; the insulating layer is provided with a through hole, and the second ITO layer is connected with the metal layer through the through hole.
2. The flexible touch substrate of claim 1,
the aperture of a via hole of the insulating layer covering the upper part of the metal layer is larger than a set first aperture;
the through hole of the insulating layer covering the upper part of the flexible substrate is smaller than the set second aperture;
wherein the second aperture is smaller than the first aperture.
3. The flexible touch substrate according to claim 1 or 2, wherein the first ITO layer comprises a plurality of first ITO sub-blocks arranged in an array on the flexible substrate; and
the metal layer comprises a plurality of metal sheets which are respectively laid on each first layer of ITO subblocks, and the area of each metal sheet is smaller than that of the first layer of ITO subblocks below the metal sheet.
4. The flexible touch substrate of claim 3, wherein the second ITO layer comprises a plurality of second ITO sub-blocks respectively located above the metal sheets; and the area of the second layer of ITO subblocks above the metal sheet is larger than that of the first layer of ITO subblocks below the metal sheet.
5. A method of making a flexible touch substrate, comprising:
depositing and etching an ITO layer on the flexible base material of the binding area of the flexible touch substrate to obtain a pattern of the first ITO layer;
depositing a metal layer on the flexible substrate and etching to obtain a pattern of the metal layer on the first ITO layer;
depositing an ITO layer on the flexible substrate and etching to obtain a pattern of a second ITO layer;
before depositing an ITO layer on the flexible substrate, the method further comprises the following steps:
depositing an insulating layer on the flexible substrate and etching the via hole to obtain a pattern of the insulating layer with the via hole; and
the second ITO layer is connected with the metal layer through the through hole of the insulating layer.
6. The method of claim 5, wherein depositing an insulating layer on the flexible substrate and etching vias specifically comprises:
after an insulating layer is deposited on the substrate, the aperture of a via hole etched above the metal layer is larger than a set first aperture;
the through hole covered above the flexible substrate is etched to be smaller than the set second aperture;
wherein the second aperture is smaller than the first aperture.
7. A flexible touch panel comprising: the flexible touch substrate of any of claims 1-4.
8. A flexible touch screen, comprising: the flexible touch panel of claim 7.
CN201810031662.3A 2018-01-12 2018-01-12 Flexible touch screen, touch panel, touch substrate and manufacturing method thereof Active CN108255338B (en)

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CN111769080B (en) * 2020-06-24 2022-07-12 武汉华星光电半导体显示技术有限公司 Display panel
CN112701129B (en) * 2021-01-07 2023-10-31 深圳市华星光电半导体显示技术有限公司 Display panel and manufacturing method thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201031295A (en) * 2008-10-31 2010-08-16 Nissha Printing Fpc connection method for protective panels with touch input function
CN102200654A (en) * 2011-06-07 2011-09-28 南京福莱克斯光电科技有限公司 Integrated touch display device and making method thereof
CN102289315A (en) * 2011-06-07 2011-12-21 南京福莱克斯光电科技有限公司 Sensor structure based on charge transfer
CN103049121A (en) * 2011-10-13 2013-04-17 宸鸿科技(厦门)有限公司 Touch control device and manufacture method thereof
CN203276233U (en) * 2013-04-24 2013-11-06 深圳市三鑫精美特玻璃有限公司 Capacitance screen and handheld electronic device
US20140124252A1 (en) * 2012-11-06 2014-05-08 Samsung Electro-Mechanics Co., Ltd. Touch sensor and method of manufacturing the same
CN103809828A (en) * 2014-02-25 2014-05-21 福建科创光电有限公司 Double-color-layer narrow frame one-chip type capacitive sensing touch screen and manufacturing method thereof
CN104298414A (en) * 2014-11-14 2015-01-21 张家港康得新光电材料有限公司 Capacitive touch screen
US9110548B2 (en) * 2012-12-19 2015-08-18 Chih-Chung Lin Touch module
CN106843616A (en) * 2017-01-03 2017-06-13 京东方科技集团股份有限公司 A kind of touch base plate and preparation method thereof, touch control display apparatus
CN107092393A (en) * 2017-04-21 2017-08-25 京东方科技集团股份有限公司 Touch base plate and preparation method thereof and touch-control display panel
CN107479753A (en) * 2017-08-15 2017-12-15 京东方科技集团股份有限公司 Flexible touch screen and preparation method thereof, display panel
CN107532961A (en) * 2015-07-31 2018-01-02 住友理工株式会社 The manufacture method of capacitive type sensor, sensor chip and capacitive type sensor

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201031295A (en) * 2008-10-31 2010-08-16 Nissha Printing Fpc connection method for protective panels with touch input function
CN102200654A (en) * 2011-06-07 2011-09-28 南京福莱克斯光电科技有限公司 Integrated touch display device and making method thereof
CN102289315A (en) * 2011-06-07 2011-12-21 南京福莱克斯光电科技有限公司 Sensor structure based on charge transfer
CN103049121A (en) * 2011-10-13 2013-04-17 宸鸿科技(厦门)有限公司 Touch control device and manufacture method thereof
US20140124252A1 (en) * 2012-11-06 2014-05-08 Samsung Electro-Mechanics Co., Ltd. Touch sensor and method of manufacturing the same
US9110548B2 (en) * 2012-12-19 2015-08-18 Chih-Chung Lin Touch module
CN203276233U (en) * 2013-04-24 2013-11-06 深圳市三鑫精美特玻璃有限公司 Capacitance screen and handheld electronic device
CN103809828A (en) * 2014-02-25 2014-05-21 福建科创光电有限公司 Double-color-layer narrow frame one-chip type capacitive sensing touch screen and manufacturing method thereof
CN104298414A (en) * 2014-11-14 2015-01-21 张家港康得新光电材料有限公司 Capacitive touch screen
CN107532961A (en) * 2015-07-31 2018-01-02 住友理工株式会社 The manufacture method of capacitive type sensor, sensor chip and capacitive type sensor
CN106843616A (en) * 2017-01-03 2017-06-13 京东方科技集团股份有限公司 A kind of touch base plate and preparation method thereof, touch control display apparatus
CN107092393A (en) * 2017-04-21 2017-08-25 京东方科技集团股份有限公司 Touch base plate and preparation method thereof and touch-control display panel
CN107479753A (en) * 2017-08-15 2017-12-15 京东方科技集团股份有限公司 Flexible touch screen and preparation method thereof, display panel

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