TW201031295A - Fpc connection method for protective panels with touch input function - Google Patents

Abstract

An FPC connection method for protective panels with touch input function, which is low cost and has a high degree of freedom in component mounting and materials selection, is characterized in that, when electrically connecting an FPC (10) to the lower circuit on a lower electrode panel and upper circuit on an upper electrode sheet of a protective panel with touch input function by means of through holes (9a-9d) disposed in the lower electrode panel (3), a circuit is disposed on one surface of a film substrate, as well as a fill hole (10d) that passes through both the film substrate and the circuit is formed in the connection side edge, an insulating adhesive layer (23) is disposed on the connection side edge of the FPC, and the FPC is adhered to the bottom surface of the lower electrode panel by means of the insulating adhesive layer, and then the inside of a cavity (22); opposite the fill hole is filled with conductive adhesive (15) to electrically connect the FPC to the lower circuit and the upper circuit, after which, the conductive adhesive is cured in a state with the fill hole exposed, and lastly the fill hole is sealed with a sealing member.

Description

201031295 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an action information terminal, a photocopying machine, a fax machine, and the like for a PDA, a handheld terminal, etc., a smart phone, a mobile phone, and a portable type. Flexible printed circuit board with protective panel with touch input function with low cost, high component mounting and material selection, such as game machines, electronic dictionaries, navigation systems, small pCs, and various types of 豕αβ[ Prior Art The outer casing of an electronic device such as a mobile phone or a smart phone is generally a combination of a front case and a rear case made of synthetic resin. Specifically, Lu's is welded to the surface of the front case to fix a protective panel for protecting the liquid crystal display. Then, although the protective panel is a panel using a colorless transparent resin, it can be decorated with a edging or the like by Lu printing as the electronic device is fashionable. Further, in recent years, the following interface in a mobile phone, as shown in Fig. 8, is intended to have an input device function on the protective panel, such as disclosed in Patent Document 1. For the protection panel i with the touch input function, a more detailed explanation will be given using the exploded view of Fig. 9. In the same figure, the protective panel 1 having a touch input function includes a lower transparent circuit 5 disposed on the upper surface of the non-flexible protective panel body and lower circuits 7a, 7b disposed around the lower transparent electrode 5. The lower electrode panel 3 has an upper transparent electrode 4 disposed on a lower surface of the flexible transparent insulating film 201031295 at a position facing the lower transparent electrode #5, and an upper circuit disposed around the upper transparent electrode 4. The upper electrode sheet 2a of 6d, 7c, and 7d, and the decoration for forming the transparent window portion 18 by concealing the lower circuits 7a and 7b and the upper circuits 6a to 6d, 7c, and 7d by the (4) 17 on the flexible transparent insulating film. The decorative sheet 2b of the layer is placed on the inner surfaces of the upper electrode sheet 2a and the lower electrode panel 3, and each of the transparent electrodes 4 and 5 is formed into a rectangular shape by sputtering or vacuum evaporation using 1 TG (indium oxide). On the upper electrode sheet, the strip bus bars 6a, 6" of the silver iridium which are connected to the transparent electrode are parallel, and the lower electrode panel 3 is 'in the direction orthogonal to the bus bar lines 6a, 6b. A strip-shaped M-stream line using a silver paste connected to the transparent electrode 5 is formed thereon. Each of the bus bars 63, 6b, 73, 7 has its circuit extending to the connecting portion 8 provided at the edge of the upper electrode sheet 2a, and is collected in The decorative sheet 2b is bonded to the entire front surface of the upper electrode sheet 2& (hereinafter, the laminated film of the upper electrode sheet 2a and the decorative sheet 2b is referred to as a movable sheet 2), and a finger or a pen is used. When the decorative sheet & surface is pressed, the movable sheet 2 is integrally formed and f-curved to the lower side. As a result, the transparent electrodes (1) formed on the inner surfaces of the upper electrode sheet 2a and the lower electrode panel 3 are in contact with each other to detect the output. In addition, in the ninth embodiment, the different electrode ends 6c, 7c, and 7d of the protective panel 1 are formed in the lower electrode panel and the touched contact described in Patent Document 1, corresponding to the connecting portion. Each of the through holes 9a to 9d in 8 is flat in the Z direction Then, corresponding to the through holes 201031295 * Λ 9a to 9d, four metal scales 11 to 14 are standing on the connection side end portion i〇a of the FPC 10, and the metal pins 11 to 14 are passed through The conductive adhesives are formed to be electrically connected to the electrode terminals 6c, 7c, 6d, and 7d. The method for manufacturing the back surface of the lower electrode panel 3 is disclosed in Patent Document 2. Patent Literature of the Prior Art [Patent Document 2] International Publication No. 2006/077784 SUMMARY OF INVENTION Technical Problem The problem to be solved by the invention is described in the FPC of the above-mentioned Patent Document 2, which is in the FPC 10 In the connection side end portion l〇a, a metal pin fixing hole 1〇e is formed in the film substrate and the circuit 10c as a conductive portion, and a metal pin is inserted from the side of the circuit l〇c on the metal pin fixing hole u~14, metal pin 丨丨 “ "" has a pin portion and a head portion which is larger than the outer diameter of the pin portion, and a cover film 1 is attached to the circuit i 〇 c and the film substrate 10 f 〇 b. Covering the above-mentioned heads of the metal pins 11 to 14 (refer to Fig. 10). However, the above-mentioned pinned FPC is costly due to the above-described metal pin processing. Further, the FPC having the above-mentioned pin has a problem that it is difficult to mount a member such as a board to board connector or an ic chip. In other words, when the solder paste for mounting the above member is printed on the circuit of the FpC, the metal pin is placed on the connection side end portion of the FPC, which causes an obstacle in the printing of the printing 201031295. For example, the screen version of the screen printing device and the wiper will encounter the above metal lock when printing. Further, the above-mentioned FPC having a pin has an advantage that an ultrasonic insertion method in which the connection strength of the FPC to the lower electrode panel is high can be used (the ultrasonic insertion method is to lock the above metal while applying ultrasonic vibration and dust force). The pin portion is inserted into the through hole 'of the lower electrode panel, whereby a mold heat is locally generated on a wall surface of the through hole, and the wall surface is melted and inserted into the iron shaft portion, and the wall surface is resolidified. The pinning portion is on the lower electrode panel.) However, the use of the ultrasonic insertion method in the prior art is limited to the protective surface of the touch input function and the use of the lower electrode panel of the upper panel. Protect a part of the panel body. For example, a thin protective panel 'ultrasonic insertion method which cannot ensure the thickness for stably fixing the pin is not applicable. - The issue of the above-mentioned technology is considered to provide an FPC connection method for a protection panel having a touch input function with a high degree of freedom in women's clothing and material selection. [Means for Solving the Problem] The present invention is directed to a flexible printed circuit board having a touch panel with a touch input function. The protective panel, the protective surface having the touch input function, the upper transparent electrode and the upper electrode sheet of the upper circuit, and the lower electrode panel having the lower transparent electrode and the lower circuit are in contact with each other. And a decorative sheet for forming a transparent window portion in a state in which the lower circuit and the upper circuit of the above-mentioned 201031295 are concealed, the flexible substrate is electrically connected to the lower circuit and the upper circuit, and the connecting method comprises the following steps: The lower electrode panel is provided with a through hole for electrically connecting the switchable substrate, the lower circuit and the upper circuit, and a thin base material penetrating the connection side end portion of the flexible substrate and formed on the single substrate a filling hole is formed in the surface of the circuit; 绝缘 an insulating adhesive layer is provided on the connection side end of the flexible substrate; Positioning the flexible substrate and the lower electrode panel to communicate the through hole with the filling hole; and connecting the flexible substrate and the lower surface of the lower electrode panel via the insulating adhesive layer; The through hole 'injects a conductive adhesive from the filling hole into the cavity of the through hole; and hardens the conductive adhesive to expose the filling hole

In the present invention, Shangcheng~fT «Λβ Φ k IA taps the 卩 electrode panel, and has a lower transparent electrode on the upper surface of the protective panel body with a lower transparent electrode for a long time around the lower transparent electrode; the above electrode h, left #片在下下的透明的透明的透明的透明的光光

And an upper circuit disposed around the upper transparent laser for the R-moon electrode, wherein the decorative sheet forms a decorative layer on one surface of the flexible transparent insulating film and is bonded to the above The upper surface of the upper electrode sheet. In the present invention, the conductive adhesive is obtained by dispersing a conductive filler in a thermosetting type eucalyptus paste, and heating the conductive adhesive through the filling hole. Further, in the present invention, the conductive adhesive is obtained by dispersing a conductive filler in a moisture-curing type sap paste, and absorbing moisture through the filling hole to cure the conductive adhesive. Further, in the present invention, the conductive adhesive is obtained by dispersing a conductive filler in a solvent-evaporating type of sap, and heating the conductive adhesive through the filling holes. Further, in the present invention, an electronic component such as COF (Chip On Film) can be mounted on the flexible substrate. Further, in the present invention, the above protective panel system is composed of a glass plate. Further, the cavity facing the filling hole is formed by a through hole provided in the lower surface of the lower electrode panel of the FJ terminal portion of the Fpc and the lower electrode panel. [Effects of the Invention] According to the present invention, the connection FPC is provided with a circuit on one surface of the film substrate, and a filling hole that penetrates the film substrate and the circuit in common at the connection side end portion, and the pin is not provided. The following effects are obtained. In other words, since the high-cost metal pin is not reinforced, the connection of the contact f can be made low, and the member such as the B-cut B connector and the IC chip can be easily mounted without the standing pin to be printed with the solder paste. Moreover, since the glass can be formed without using the insertion of the pin, the glass plate which cannot be used by the ultrasonic insertion method can be used as the contact window of the lower electrode panel, and the position of the pin and the hole of the glass support plate of 201031295 can be omitted. Cutting of the glass support plate produced when the precision is low. Further, an insulating adhesive layer is provided around the filling hole at the connection side end portion of the FPC, and the insulating adhesive layer is applied to the lower surface of the lower electrode panel, and then the conductivity is continued. The agent is filled in the cavity facing the filling hole, and the Fpc is electrically connected to the lower circuit and the upper circuit, and then hardened in a state where the conductive hole is exposed to expose the filling hole. It is possible to increase the adhesion strength of the conductive portion to obtain the reliability of energization, which is an advantage. Moreover, deformation and deterioration of the FPC can be prevented. [Embodiment] Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. Fig. 5 is an exploded perspective view showing the basic structure of the chat 10 in which the protective panel 1 having the touch input function is removed. In the same figure, the protective panel 1 having the function of touching the input includes a lower circuit 7a provided with a lower transparent electrode 5 and a lower transparent electrode 5 on the upper surface of the non-flexible protective panel body. The lower electrode Μ 2 of b has an upper transparent electrode 4 disposed on the lower surface of the flexible transparent insulating film and facing the lower transparent electrode 5, and the upper transparent electrode 4 is disposed on the upper transparent electrode 4 In the upper part of the road, there is a decorative piece 2b in which the upper layer of the road is electrically twisted (four), and the upper insulating circuit 7a and 7b conceal the upper and lower circuits 7a and 7b and the upper circuit to form the decorative layer of the transparent window portion 18. 201031295 The material of the non-flexible protective panel body of the lower electrode panel 3 can be, for example, a glass plastic, a polycarbonate-based, a polyamine-based or a polyetherketone-based engineering plastic, an acrylic, or a polyterephthalic acid. A plastic sheet such as a polybutylene terephthalic acid system or the like, and an engineering plastic such as a polycarbonate, a polyamine or a polyether ketone is bonded to the surface of the lower transparent electrode on which the sheets are formed. The film of the acrylic, poly-terephthalic acid-based or polybutylene terephthalic acid-based film is bonded to each other to form the lower electrode panel 3. The flexible transparent insulating film of the electrode sheet 2a For the material, for example, polycarbonate, polyamine can be used. a film of engineering plastics such as polyetherketone, acryl, polyterephthalic acid, polybutylene terephthalate, etc. The upper electrode sheet 2a and the lower electrode panel 3 are on the transparent electrode 4 described above. a gap is formed between the five and five, and is disposed at the edge portion. The transparent electrodes 4 and 5 are metal oxide films such as tin oxide, indium oxide, antimony oxide, lead oxide, cadmium oxide or germanium, or the like. A composite film mainly composed of metal oxides is a metal film such as gold, silver, copper, tin, ruthenium, or enamel, etc., which is formed into a rectangular shape by a vacuum deposition method, a lining method, an ion bonding method, or a GVD method. The upper electrode sheet 2aJ1 is formed in parallel with the upper transparent electrode 4 and a strip-shaped bus bar line 6a, 6 using a conductive paste of metal, carbon, or the like, such as gold, silver, copper, or the like, as the upper circuit. (4) In the lower electrode panel, the lower transparent electrode 5 and the bus bar lines 7a and 7b which are orthogonal to the bus bar lines 6a and 6b as a lower circuit are formed. The strip-shaped bus bar 6a,牝, 7a, screen printing, offset printing A printing method such as gravure printing or flexographic printing, a 201031295 photoresist method, a brush coating method, or the like is formed. ❿ And each of the bus bars 6a, 6b, 7a, and 7b extends to the connecting portion 8 provided at the edge portion of the upper electric piece 2a. In the first embodiment, the bus bar lines 6a of the upper electrode sheets 2a are extended to the electrode terminals 6d and 6c of the connection '8, and the bus bars 7 &; 713 is extended to the lower portion 76, 7 of the lower circuit and the electrode terminal 6 (1, 6c side by side ' and is provided with an electroconductive adhesive (not shown) and an electrode end of the connecting portion 8 formed on the upper electrode sheet 2 & 7c and 7d are connected. The through holes 9a to 9d are formed in the lower electrode panel 3 corresponding to the electrode terminals m 7d of the connecting portion 8. Further, a decorative sheet 2b having a transparent window is bonded to the surface of the upper electrode sheet 2a. The decorative sheet 2b is a flexible transparent insulating film, for example, a polycarbonate-based, polyamine-based or poly-system. A film of a plastic, a gram, a polyphthalic acid, a polybutylene terephthalate or the like is shielded from the periphery of the transparent window 18, that is, the upper circuit and the lower circuit are shielded to form a frame 17 Decorative layer. The decorative layer is made of a polyethylene-based resin, a polyamine-based resin, a polyester resin, a polypropylene resin, a polyurethane foam, a polyvinyl aceton resin, a polyester vinegar resin, or A resin such as an alkyd resin is used as a binder and a colored ink using a pigment or dye of a suitable color as a colorant. The above-described method of forming the decorative layer is a general printing method such as screen printing, offset printing, gravure printing or flexographic printing. In particular, the offset printing method and the gravure printing method are applied when performing multicolor printing or gray scale expression. Further, the decorative layer is formed of a metal thin film layer, or is a frame printing 201031295 layer and a metal thin film layer group as the decorative layer, and is formed by a gold plating method or the like. σ is formed. The metal film layer exhibits metallic luster, and the vacuum evaporation method, the sputtering method, the ion plating method, or the metallic gloss color corresponding to the desired one, and the use of the gold, platinum, road iron, copper, and soapy water, Silver, titanium, boat or sub-genus or its alloys or compounds. Film of metal film layer 0. 05/z m 〇

Further, the decorative sheet 2b is bonded to the entire front surface of the upper electrode sheet 2a to constitute the movable sheet 2. When the decorative sheet surface is pressed by a finger, a pen, or the like, the movable sheet 2 is integrally formed and bent downward, and as a result, the transparent sheets 4, 5 of the inner surface of the upper electrode sheet and the lower electrode panel 3 are formed. The input position is detected by contact. The adhesive layer to be bonded is, for example, a polypropylene-based resin polystyrene resin or a polyamine-based resin, ethylene oxide, vinyl acetate or an acrylic-based cohesive body. Next, the method of forming the layer is a general printing method such as screen printing, offset printing, gravure printing or flexographic printing.

In the above description, the basic structure of the protective panel 1 having the touch input function of the electronic device display window will be described. The feature of the present invention is transmitted through the lower electrode panel 3 via the touch input function protective panel 1 . The holes 9a to 9d electrically connect the FPC 10 to the lower circuit and the upper circuit, and have the following processes (Figs. 1 to 4). [First Embodiment] First, the above-mentioned FPC 10' is provided with a circuit 10c on one surface of a film substrate 10f, and 'prepared to be provided with a common through 12 201031295 at the connection side end 10a. The material i〇f and the filling hole 1〇d of the above-described circuit 10c (refer to Fig. 6). Further, in general, the FPC, as shown in Fig. 6, the film substrate i〇f having the circuit i〇c is covered by the cover film i〇b for insulating the protective conductor circuit 1〇c, for the above-mentioned connection side end portion 10a exposes the circuit 10C because it must be connected to the electrode end 'so does not cover'. As the film substrate 10f and the cover film 1b, for example, a ruthenium film (pi), a polyethylene terephthalate film (PET), a polyphthalic acid naphthalene film (PEN), or the like can be used. A flexible insulating film. The above circuit l〇c is formed using a metal such as gold, silver, copper or nickel or a conductive paste such as carbon. The above-described circuit 10c can be formed by a printing method such as screen printing, offset printing, gravure printing or flexographic printing, or a photoresist forming method. Further, a method of forming the above-described filling hole 10 d is a drilling method. An insulating back layer 23 is provided on the connection side end portion 10a of the FPC 10 around the filling hole 10a, and is connected to the lower surface of the lower electrode panel 3 by the insulating adhesive layer 23 (see ^) . The space between the connection-side end portion 1A of the FPC 10 and the lower surface of the lower electrode panel 3 and the through-holes 9a to 9d provided in the lower electrode panel 3 are formed toward the filling hole 22 . Each of the regions formed by the insulating adhesive layer 23 is formed larger than each of the through holes 9a to 9d provided in the lower electrode panel 3, whereby the position of the FPC 10 is shifted, that is, by insulation. When the respective regions surrounded by the subsequent agent u are offset from the subsequent positions of the respective through holes 9a to 9d, 13 201031295 can be obtained to be reliably electrically connected. As the insulating connecting (four) layer 23, a frame-shaped double-sided tape that punches the filling hole IGd can be used. Further, it is also possible to replace the double-sided tape with a printing paste such as water-based or acrylic-based ink. Further, reference numeral 16 in Fig. 1 denotes an adhesive layer in which the upper electrode 2a of the movable piece 2 and the lower electrode panel 3 are bonded to each other. Each of the connection holes for injecting the above-mentioned conductive contacts (four) 15 on the adhesive layer 16 must be formed corresponding to the above-mentioned respective electrode terminals 6c, 7c, 6d, and 7d at the above-described connecting portion 8.

The adhesive layer 16 can be used to input a portion (a transparent crucible 18 in Fig. 5) and a frame-shaped double-faced tape which penetrates at least the above-mentioned respective connecting holes, for example, using a facet of see-through (10) or the like. X, it is also possible to replace the double-sided tape with an insulating adhesive, for example, a printing paste such as water-based, acryl-based or hot-melt. Next, the conductive adhesive 15 is filled in the cavity 22 facing the filling hole 10d, and the FPC 10 is electrically connected to the lower circuit and the upper circuit (see Fig. 2). A thermosetting conductive adhesive can be used as the conductive adhesive 15 filled in the cavity 22. The thermosetting conductive adhesive is obtained by dispersing a conductive filler in a thermosetting resin paste, heating and hardening, and the hardened molecules generally form a three-dimensional network. The thermosetting resin can be composed of a thermosetting resin component such as an acryl compound, an acryl resin, a urethane resin, a urethane compound, an unsaturated polyester resin, an epoxide or an epoxy resin. Further, the form of the hardening reaction of the thermosetting resin may be any one of a superposed form in which the double layer is superposed, and the epoxy resin is ion-exposed or re-added. Further, the conductive filler is silver, gold, copper, nickel, platinum, sharp, etc. 14 i 201031295 * Electrical metal powder, nuclear material is inorganic insulator such as Ming, glass, etc., and organic such as polyethylene, polyethylidene, etc. The surface of the polymer and the surface of the nuclear material covered with a conductive layer such as gold or nickel is carbon or graphite. Further, the conductive filler may have a shape such as a flake shape, a spherical shape, or a neofilament shape. The filling method of the above-mentioned conductive adhesive 15 is a dispensing method or the like. Then, the conductive adhesive 15 is cured in a state where the filling hole 10d is exposed (see Fig. 3). 24 in the figure is a hardened Φ conductive adhesive. The thermosetting conductive adhesive is electrically connected to the FPC by a general method, that is, as shown in Fig. 7, after the application of the thermosetting conductive adhesive, it is subsequently fixed to a commercially available one. The FPC filling the hole l〇d is basically dependent on heat conduction due to hardening, the Fpc becomes an obstacle, the hardening speed is slowed, the production speed cannot be improved, and the internal strength cannot be hardened to the inside, and the bonding strength of the conductive portion cannot be improved, and the inside cannot be improved. Get electrical reliability. Moreover, it is unavoidable that the FPC is deformed and deteriorated due to heat. Further, in order to harden the inside, the thermosetting conductive adhesive is hardened after application, and is hardened before the FPC is fixed, and the conductivity cannot be generated with the FPC. In the present invention, the thermosetting conductive adhesive is accelerated to the inside by the direct heating of the adhesive hole 1 〇d to promote hardening. Therefore, compared with the configuration of the preceding paragraph, the subsequent strength of the conductive portion is lifted, and electrical reliability can be obtained even inside. However, since the adhesive is directly heated, the influence on the heat of the FPC is also small, and deformation and deterioration of the FPC can be prevented. Further, after the FpC solid 15 201031295 through which the filling hole 1 〇d is inserted is placed on the lower surface of the lower electrode panel, the thermosetting conductive adhesive is filled in the cavity 22 facing the filling hole Id. It hardens, so it is fully achieved with the conductivity of the FPC. Finally, the filling hole l〇d is sealed by the sealing member 21 (see Fig. 4). The sealing material 21 can be formed, for example, of a thermosetting resin component such as an acrylic compound, an acrylic resin, a urethane resin, a urethane compound, an unsaturated polyester resin, an epoxidized human, or an epoxy resin. The purpose of sealing after the above-mentioned conductive adhesive 15 is cured is to ensure insulation and prevent deterioration. The means for sealing the filling hole i〇d by using the sealing material 21 is a 分配 distribution method. <Example 1> On one surface of a PET film having a thickness of 0.1 mm, a ΙΤ0 film having a thickness of 20 mm was formed on the entire surface by a sputtering method, and a transparent electrode having a rectangular shape with a large width of the ΙΤ0 film was removed. Arranged in the lateral direction on opposite sides

The bus bar and the wires output from the bus bar to the outside are formed by screen printing with silver paste. Further, a substrate having a thickness of 0.7 mm and a thickness of 0.7 mm in the same direction as the PET film and a surface of the transparent electrode on which the pET film is formed is bonded to the substrate of 0 to 025 mm with a transparent adhesive, and then drilled; Four through holes of 1.5 mm were bored to obtain a lower electrode panel. In addition, the same size as the lower electrode panel is used, and a PET film having a thickness of i25# is used, and an m film of thickness ^ 2 is formed on the entire surface by sputtering on the one side to remove the edge portion of the IT0 film to form a large width. The 透明-shaped transparent electrode is connected to the bus bar line disposed on the opposite sides of the transparent electrode in the longitudinal direction and the wire output from the bus bar line to the outside (thickness 16 201031295 is 35'm). The silver paste of a plurality of conductive fillers formed of finely divided silver powder (diameter 1 〇 &quot; m) contained in the adhesive formed of the grease was screen-printed to obtain an upper electrode.

Further, the PET substrate cured film having a thickness of u75 coffee was used in the same size as the lower electrode, and the decorative layer having a transparent window portion was obtained by a gravure printing surface on the surface opposite to the hardened surface. Thereafter, the surface of the decorative sheet on the side of the decorative layer is thick. A substrate transparent adhesive of 25 μm was bonded to the opposite surface to the side of the transparent electrode on which the upper electrode was formed to obtain a movable sheet. Then, the electrode gap formed by the lower electrode and the movable piece (four) is oppositely arranged, and #+ swims to form a transparent ir and a double-sided gusset of the fore edge of each of the above-mentioned connecting holes (the thickness of the roof ς, L is 50^m) fit and cut along the inner edge of the decorative layer. On the other hand, a circuit as a conductive portion is formed of a silver paste on one side of a polyimide film having a thickness of 〇.〇75 mm, and four diameters of ffim are filled by an iron hole method at the connection side end portion of such an FPC. And the above-mentioned circuit covering the Fpc and the head of the metal lock are removed from the hole. The adhesion thickness is 〇. 5 with the polyimide film to obtain FPC with filled pores. Next, the filling hole is left at the connection side end portion of the FPC: a circumference (diameter, a δ edge 9 adhesive layer formed of an epoxy resin is provided by a screen printing method. The Fpc is overlapped with the lower electrode panel described above. And the lower surface is formed by the insulating adhesive layer corresponding to the through hole, and then the ink is filled in the cavity facing the filling hole. The lower circuit and the upper circuit are electrically connected to each other. The thermosetting conductive adhesive is mixed with a silver-like powder having a particle size of 10 μm in a binder composed of an acrylic resin. The thermosetting conductive adhesive is cured by direct heating in a state where the thermosetting conductive adhesive is exposed to the filling hole. Finally, the * distributor uses a sealing material composed of acrylic trees. It is applied to the filling hole, and the filling hole is sealed to complete the connection of the protective panel to the FPC with the touch panel #. [Second embodiment] The above-described cavity 22 is filled. The electric adhesive 15 is used in place of the thermosetting conductive adhesive of the first embodiment, and a moisture-curable conductive adhesive is used. The moisture-curable conductive adhesive is conductively dispersed in the moisture-curing type W. The filler is used to promote the hardening reaction in the presence of moisture, and the adherend is subsequently fixed. Unlike the first embodiment, heating is not required. The moisture-curable resin is a dream-based adhesive, a variant stone-based adhesive. The material of the D μ upper conductive filler such as a urethane-based adhesive and the filling method of the conductive adhesive 15 are the same as in the first embodiment. The above-mentioned moisture hardening + &amp;&gt; And a conductive adhesive is electrically connected to the FPC in a general manner, that is, as shown in Fig. 7 ^ Fig. 7, after applying the above-mentioned moisture-curable conductive adhesive, in the fixed market When the FPC which does not have the above-mentioned filling hole l〇d is sold, the ppp-free use-type type Thundering pick-up #C hinders the moisture from soaking to the above-mentioned moisture hardening.

The inner AN# of the meta-electrical adhesive is time-consuming, and the vicinity of the FPC side of the above-mentioned moisture-curable conductive type 201031295 adhesive is rapidly hardened by the wetness of the wet, and then Due to the moisture infiltration inside, the inside is still not hardened for a long time, so that the strength of the conductive portion cannot be improved. There is a problem that the reliability of the electrical appliance cannot be obtained in the inner Qiuhe. Further, in order to be hardened to the inside, it is time-consuming to take moisture after the application of the moisture-curable conductive adhesive, and it is hardened before fixing the Fpc, so that it is impossible to conduct conductivity with the FPC. In the present invention, the fish-vapor-curable conductive adhesive is exposed to the filling hole 10d, and the moisture present in the air reaches the adhesive through the filling hole 1Gd, which promotes hardening and accelerates hardening to the inside. . Therefore, the adhesion strength of the conductive portion is improved as compared with the configuration of the previous paragraph, and there is an advantage that electrical reliability can be obtained even inside. Further, after the FPC having the filling hole 10d is fixed to the lower surface of the lower electrode, the cavity 22 facing the filling hole 填充d is filled with the moisture-type conductive adhesive. It is hardened, and the conductivity with FpC is then sufficient. Φ <Example 2> Instead of the thermosetting conductive adhesive described in Example 1, a moisture-curable conductive adhesive is filled, and the wetness is made. The same as in the first embodiment except that the gas-curable conductive adhesive was cured by moisture absorption in a state where the filling hole was exposed. The moisture-curable conductive adhesive contains a fragmented silver powder having a particle diameter of 10 &quot; 5J in a binder composed of a resin. [Third Embodiment] The conductive adhesive 15 filled in the cavity 22 may be a solvent-evaporable conductive adhesive in addition to the thermosetting conductivity of the first embodiment of 201031295. The solvent-evaporable conductive conductive filler is dispersed in a solvent volatilization type gamma paste, and the hardening reaction is promoted by volatilizing the solvent to cause the adherend to be subsequently fixed. The solvent volatile wax is composed of a polymyol polyol, a polyisocyanate adhesive, a poly-polyol, and a polyisocyanate adhesive. The material of the above-mentioned conductive filler and the method of filling the above-mentioned conductive adhesive 15 are the same as those of the first embodiment. The FPC is electrically connected in a usual manner by using the solvent-evaporable conductive adhesive described above, that is, as described in the seventh mju, FIG. 7 and 7F', after the application of the solvent-volatile conductive conductive adhesive, the commercially available one is not fixed. In the case of the FPC having the filling hole 10d, the FPC becomes an obstacle and it takes time to evaporate the solvent, or the solvent remains and is not hardened for a long period of time, and the bonding strength of the conductive portion cannot be improved, which may cause an inability to obtain electrical reliability. . Further, the solvent-evaporable conductive adhesive may shrink in volume at the time of curing, or may be prevented from being deformed or deteriorated in a portion where Fpc is in contact with the solvent-evaporable conductive adhesive by the generation of outgas. Further, in order to harden it, it takes time to absorb moisture after application of the solvent-volatile conductive adhesive, and it hardens before FPC, and it cannot be electrically connected with Fpc. In the present invention, the solvent-evaporable conductive adhesive exposing the filling hole 10d allows the solvent to be volatilized via the filling hole 1〇d, thereby promoting hardening and accelerated curing to the inside. Therefore, the adhesion strength of the conductive portion is improved as compared with the structure of the previous stage, and there is an advantage that electrical reliability can be obtained even in the case of internal defects. However, at the time of hardening, the volume shrinkage J is due to the above-mentioned filling hole of the FPC. The solvent volatilization type 20 201031295 is in contact with the conductive adhesive, and the influence on the shrinkage of the FPC is changed to 4, and the degassing is also performed from the above filling. The hole 1 Od is taken out to prevent deformation and deterioration of the FPC. After the FPC penetrating the filling hole l〇d is fixed to the lower surface of the lower electric panel, the cavity is closed due to the filling hole 1〇d. The solvent-evaporable conductive adhesive is filled and hardened, and the conductivity of the FPC is sufficiently increased. Further, in the first embodiment to the third embodiment, • In the case of the FPC connection method according to the present invention, since the metal pin processing of the high-definition: is not performed, the protective panel having the touch input function and the Fpc=connection can be performed at low cost. Further, since there is no stand-up pin that becomes a solder paste barrier, components such as a BtoB connection or a 1C wafer are easily mounted. Further, the FPC connecting method of the present invention can be connected to the FPC by using a protective panel having a touch input function of the glass supporting plate in the lower electrode because it is not necessary to be fixed by the insertion of the pin. <Example 3> In place of the thermosetting conductive adhesive described in the first embodiment, the solvent-evaporable conductive adhesive is filled in a state in which the solvent-volatile conductive adhesive is exposed to the filling hole. The hardening 'other than this' by drying (solvent evaporation) is the same as in Example i4. The solvent-evaporable conductive adhesive contains a flaky silver powder having a particle diameter of 1 〇/zm in a binder composed of a polyether polyol resin. The protective panels having the touch input function of the above-described first to third embodiments have a low cost and a high degree of freedom in component mounting and material selection, and are reliable in connection with the Fpc. 21 201031295 Further, by appropriately combining any of the above-described various embodiments, an individual effect can be obtained. Although the present invention has been described in detail with reference to the accompanying drawings, and FIG. This deformation and correction can be understood without departing from the scope of the invention. Industrial Applicability The present invention can be applied to mobile information terminals such as PDAs, hand-held terminals, video printers, fax machines, etc., smart phones, mobile phones, portable game machines, electronic dictionaries, navigation systems, A display for small PCs, various home appliances, and the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an enlarged cross-sectional view showing the construction of a protective panel having a touch input function of the present invention connected to an FPC. Fig. 2 is an enlarged cross-sectional view showing the construction of the protective panel with the touch wheeling function of the present invention connected to the FPC. Fig. 3 is an enlarged cross-sectional view showing the construction of the protective panel with the touch input function of the present invention connected to the FPC. Fig. 4 is an enlarged cross-sectional view showing the construction of the protective panel having the touch input function of the present invention connected to the FPC. Fig. 5 is an enlarged cross-sectional view showing the construction of the protective panel having the touch input function of the present invention connected to the FPC. Figure 6 is a perspective view of the fpc used in the present invention. Fig. 7 is an enlarged view showing a main part of a connection structure 22 when the Fpc is not pierced. Fig. 8 is a perspective view showing an application example of the protective panel having the touch input function of the present invention. Fig. 9 is an exploded perspective view showing the construction of a protective panel having a touch input function of the prior art. Fig. 10 is an enlarged view of a main portion of a conventional protective panel with a touch input function connected to an FPC. [Description of main component symbols] 1 to protective panel 2 with movable touch input function 2 to movable sheet 2a to upper electrode sheet 2b to decorative sheet 3 to lower electrode panel 4 to upper transparent electrode® 5 to lower transparent electrode 6 a, 6 b - bus bar line 6c, 6d - electrode end 7a, 7b - bus bar line 7c, 7d - electrode line, 7f ~ circuit 8 from the bus bar line extension - connection portion

9a to 9d~through hole 10 to FPC 23 201031295 1 0a' to the connection side end portion 10b' to the cover layer 10c' to the circuit 10d' to the filling hole 10e' to the metal pin fixing hole 10f' to the film substrate 11 to 14 ~ Metal lock 14a' ~ Pin head 15 ~ Conductive adhesive 16 ~ Next layer 17 ~ Frame 18 ~ Transparent window 19 ~ Product 20 ~ - Display 21 ~ - Sealing material 22 ~ - Cavity 23 ~ Insulating adhesive layer 24- Conductive adhesive layer (after hardening)

twenty four

Claims (1)

201031295 VII. Patent application scope: 2. A method for connecting a flexible printed circuit board with a protective panel that touches an input function, and connecting a flexible substrate to a protective panel having a touch-in function, which has a touch panel The protective panel having an input input function has an upper electrode plate and an upper electrode plate of the upper circuit, and a lower electrode panel having a lower transparent electrode and a lower circuit, the protective panel having a touch input function and concealing the lower circuit and a decorative sheet in which a transparent window portion is formed in a state of the upper circuit, and the flexible substrate is electrically connected to the lower circuit and the upper circuit. The connecting method includes the following steps: · wearing on the lower electrode panel a through hole for electrically connecting the flexible substrate to the lower circuit and the upper circuit; and a film substrate penetrating the connection side end portion of the flexible substrate and a circuit formed on one side thereof a filling hole is provided; an insulating adhesive layer is provided on the connection side end of the flexible substrate; Positioning the flexible substrate with the lower electrode panel, and communicating the through hole with the filling hole; and connecting the flexible substrate and the lower surface of the lower electrode panel via the insulating adhesive layer; The hole is filled with a conductive adhesive from the filling hole to the cavity of the through hole; and the conductive portion is cured in a state in which the conductive hole is next (4). 2. The method for connecting a flexible printed circuit board of a protective panel according to the patent application scope 帛j $, wherein the lower electrode panel has a lower transparent electrode and a lower surface on the upper surface of the protective panel body. a lower circuit around the lower transparent electrode; the electrode sheet having an upper transparent electrode disposed at a position facing the lower transparent electrode and disposed around the upper transparent electrode on a lower surface of the flexible transparent insulating film The upper circuit; the decorative sheet forms a decorative layer on at least one of the surfaces of the flexible transparent insulating film, and is attached to the upper surface of the upper electrode sheet. 3. The method of connecting a flexible printed circuit board having a protective panel that touches an input function according to the invention, wherein the conductive adhesive is cured in a state in which the filling hole is exposed; The above-mentioned filling hole is sealed with a sealing material. 4. Please ask for the scope of patents! The method for connecting a flexible printed circuit board having a protective panel that touches an input function, wherein the electric charge for the towel is made by dispersing a conductive filler in the thermosetting resin paste and heating the hole through the filling hole. The conductive adhesive is cured. 5. For the flexible (four) job board connection method with the touch input function protection panel as described in the above (4), the conductive adhesive is made of conductive filler in the moisture-hardening type tree material. Dispersion, the conductive adhesive is cured by absorbing moisture through the filling holes. 6. The flexible material grafting of the protective input panel with touch input function as described in the 1st jg secret, +, Λβ music item 1 of the patent application scope, the conductive adhesive agent of the towel is made in the solvent volatile resin The conductive filler is dispersed, and the conductive adhesive is cured by heating through the filling holes. The method of connecting a flexible printed circuit board having a touch panel having a touch input function according to the first aspect of the invention, wherein the electronic component is mounted on the flexible substrate. 8. The flexible printed circuit board connecting method of the protective panel having the touch input function according to the first aspect of the invention, wherein the protective panel system comprises a glass plate. 27