KR101682569B1 - Manufacturing method of capacitive touchscreen panel - Google Patents

Abstract

The present invention relates to a method of manufacturing a capacitive touch screen panel. The manufacturing method is characterized in that the upper and lower transparent electrode arrays, which are electrically insulated and intersected, are provided on both sides in a form of being separated from each other, and a touch provided with upper and lower wiring electrodes formed on the outer periphery of each of the upper and lower transparent electrode arrays Providing a screen panel; Forming at least one through hole in a substrate region where the upper and lower wiring electrodes overlap; Covering one surface of the through hole with a conductive material; And electrically connecting the upper and lower wiring electrodes by injecting and filling the conductive material into the through holes by a vacuum suction method. Such a manufacturing method can be advantageously applied to a structure for bonding a flexible printed circuit board to one side, and by adopting a one-time bonding process, the alignment accuracy can be increased in comparison with the structure bonded on both sides. Also, unlike the prior art, the above manufacturing method is different from the prior art in that instead of the vapor deposition method such as sputtering, the inside of the through hole is filled with a conductive material into the through hole by a vacuum suction method and surface hardened, It is possible to solve problems such as occurrence of cracks and to simplify the process for the via hole forming process for single side bonding of the flexible printed circuit board and to improve the yield and reduce the production cost.

Description

TECHNICAL FIELD [0001] The present invention relates to a capacitive touch screen panel manufacturing method,

The present invention relates to a method of manufacturing a touch screen panel, and more particularly, to a method of manufacturing a capacitive touch screen panel.

2. Description of the Related Art Generally, a touch screen is widely used as an input means for detecting a touch point when an image displayed on a screen is touched with a finger or a pen, and transmitting the sensed touch point to an image control device to perform necessary commands.

The touch screen function is realized by a resistive film type, a capacitive type, a surface ultrasonic type, an infrared type, and a camera type. Of these, the capacitive type is electrically insulated on both sides of the touch screen substrate, The X and Y transparent electrode arrays are provided separately from each other, and each of the X and Y transparent electrode arrays is connected to an external circuit board on which the controller is mounted through the wiring electrodes formed in the outermost inactive regions of the substrate.

In this case, the wiring electrodes electrically connected to the respective X, Y transparent electrode arrays are provided separately on both sides of the substrate, and two flexible printed circuit boards connected to the respective wiring electrodes are bonded together. In the case of manufacturing a touch screen having a structure in which the flexible printed circuit board is bonded to both sides of the flexible printed circuit board, a separate alignment process is required before bonding each of the flexible printed circuit boards, complicating the process and lowering the product yield.

As an example for solving the problems in the manufacturing process of a touch screen of such a double-sided bonding structure, wiring electrodes for X and Y transparent electrode arrays are electrically conducted on a substrate using a via hole and guided to one surface of a substrate, A method of bonding an external flexible printed circuit board to one side of a touch screen substrate is known.

However, since the via hole is formed by sputtering a conductive material such as metal on the wall surface of the through hole to form the via hole, the single-surface bonding method may not form the film, There is a possibility that the film is cracked due to a temperature change or a physical impact, thereby being electrically disconnected. Further, film formation by sputtering has a problem that the efficiency of the process is also inferior.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a capacitive touch screen panel having a single side bonding structure with improved process efficiency and product reliability.

The gist of the present invention relating to the recognition of the above-mentioned problems and the solution means based on them is as follows.

(1) a touch screen panel having upper and lower transparent electrode arrays electrically insulated and intersecting on both sides in a form separated from each other and having upper and lower wiring electrodes formed on the outer peripheries of the upper and lower transparent electrode arrays, respectively; ; Forming at least one through hole in a substrate region where the upper and lower wiring electrodes overlap; Covering one surface of the through hole with a conductive material; And electrically connecting the upper and lower wiring electrodes by injecting and filling the conductive material into the through holes by a vacuum suction method.

(2) filling the through hole with the conductive material, and then heating the conductive material to harden the conductive material.

(3) The method of manufacturing a capacitive touch screen panel according to (1), wherein the cover of the conductive material is printed.

(4) The method of manufacturing a capacitive touch screen panel according to the above (1), further comprising a step of bonding a flexible printed circuit board electrically connected to the upper and lower wiring electrodes on one side of the panel .

(5) The step of charging and filling the conductive material into the through hole is performed by mounting the touch screen panel on the jig, wherein the jig includes a first suction part for sucking and fixing the touch screen panel, The touch panel of claim 1, wherein the first suction unit is formed to correspond to the through hole and the suction unit sucks the conductive material.

(6) The electrostatic capacity type touch screen panel manufacturing method according to (5), further comprising filling the conductive material into the through-hole by the second suction part and applying heat to the jig, Way.

The method of manufacturing a capacitive touch screen panel according to the present invention can be effectively applied to a structure for bonding a flexible printed circuit board to a single surface. By adopting a single bonding process, the alignment accuracy can be improved .

Also, unlike the prior art, the above manufacturing method is different from the prior art in that instead of the vapor deposition method such as sputtering, the inside of the through hole is filled with a conductive material into the through hole by a vacuum suction method and surface hardened, It is possible to solve problems such as occurrence of cracks and to simplify the process for the via hole forming process for single side bonding of the flexible printed circuit board and to improve the yield and reduce the production cost.

1 is a plan view of a capacitive touch screen panel having a one-side bonding structure according to the present invention.
2 is a manufacturing process diagram of a capacitive touch screen panel according to the present invention.
Fig. 3 is a plan view and a perspective view of a jig used in the manufacturing process of Fig. 2; Fig.
Fig. 4 is a plan view and a cross-sectional view of a portion A in Fig. 3;
FIG. 5 is a schematic view showing a state in which a flexible printed circuit board is one-side bonded to a capacitive touch screen panel according to the present invention. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same or similar reference numerals are given to the same or similar parts.

In addition, throughout the specification, when an element is referred to as including an element, it is understood that the element may include other elements, not the exclusion of any other element, unless specifically stated otherwise.

Also, it is to be understood that when an element is referred to as being " selectively " provided, included, or included, it is not necessarily an essential component for solving the problem of the present invention, it means.

1 is a plan view of a capacitive touch screen panel having a one-side bonding structure according to the present invention.

The touch screen panel 10 includes a substrate 100, upper and lower transparent electrode arrays 110 and 120, and upper and lower wiring electrodes 130 and 140.

The substrate 100 may be provided in the form of a transparent dielectric film, and may be formed of a material such as glass, polyimide, acryl, PET, PEN, or the like.

On both sides of the substrate 100, the upper and lower transparent electrode arrays 110 and 120 are electrically insulated from each other. Each of the transparent electrode arrays 110 and 120 has a pattern structure in which array units having a structure in which the vertices of a plurality of polygonal sensing pads are mutually connected are arranged spaced apart from one another in the longitudinal direction or the transverse direction. The upper and lower transparent electrode arrays 110 and 120 are arranged on the upper and lower surfaces of the substrate 100 so as to intersect each other.

The transparent electrode arrays 110 and 120 may be formed in a film form using, for example, ITO, IZO, AZO, CNT, or a conductive polymer.

The upper and lower wiring electrodes 130 and 140 are electrically connected at the outsides of the upper and lower transparent electrode arrays 110 and 120 and are wired along the inactive regions on the upper and lower surfaces of the substrate 100, 100, that is, the lower portion of the substrate 100 in the figure.

In this case, a via hole 150 is formed in a lower region of the substrate 100 where the upper and lower wiring electrodes 130 and 140 are induced to overlap with each other. The via hole 150 is formed on the substrate 100 The conductive material 160 is filled with the inside of the through hole. The conductive material 160 is electrically connected to the upper and lower wiring electrodes 130 and 140 formed on the lower and upper surfaces of the through hole.

The outer flexible printed circuit board 30 including the controller is one-side bonded on the upper or lower surface of the substrate 100. The compressed portion 170 is electrically connected to the via hole 150 .

FIG. 2 shows a manufacturing process diagram of a capacitive touch screen panel according to the present invention. Hereinafter, as a feature of the present invention, the following will specifically be described in connection with a via hole forming process for single side bonding of an external flexible printed circuit board.

Referring to FIG. 2, first, a substrate 100 on which upper and lower transparent electrode arrays and upper and lower wiring electrodes 130 and 140 are formed according to a predetermined pattern is provided (FIG. 2A). However, in the drawings, the pattern formation process for the upper and lower transparent electrode arrays and the upper and lower wiring electrodes constituting the touch screen panel may be performed using a conventionally known deposition, coating, printing, or lithography process. And a detailed description thereof has been omitted. The substrate 100 shown in FIG. 2 is a partial view of a region where the upper and lower wiring electrodes 130 and 140 are overlapped in FIG. 1 and the upper and lower wiring electrodes 130 and 140 are connected to the via hole 150, The illustration of the upper and lower transparent electrode arrays 110 and 120 is omitted for the sake of clarity.

Next, a through hole for forming the via hole 150 is formed in the region of the substrate 100 where the upper and lower wiring electrodes 130 and 140 overlap with each other (FIG. 2 (b)). These through holes may be formed in a plurality of one or more and may be formed through a mechanical process such as a drill or a laser.

Next, a via hole 150 is formed through the process of filling the conductive material 160 according to the present invention into the through hole ((c) to (e) of FIG. 2). In the present invention, the filling process of the conductive material 160 is basically performed by a vacuum suction method. For this purpose, a jig 20 having a predetermined shape and structure to which the touch screen panel 10 is attached is used.

3 and 4, the jig 20 includes a first suction unit 210 for sucking and fixing the touch screen panel 10, And a second suction part 220 arranged to correspond to at least one through hole formed in the first conductive part 160 and vacuum-sucking the conductive material 160.

The first suction part 210 may be formed into a hole shape and communicate with external vacuum suction means through the inside of the jig 20, though not shown in the figure. The second suction unit 220 has a structure in which an annular vacuum suction port 223 is formed around a plurality of circular protrusions 222 in a plan view and the vacuum suction port 213 is connected to the inside of the jig 20 And communicates with external vacuum suction means not shown in the drawing. In this case, the external vacuum suction means communicating with each of the first suction portion 210 and the second suction portion 220 may be common or separate. The jig 20 is made of a thermally conductive material such as metal, and external heat supply means for applying heat to the conductive material is connected (not shown).

2 (c), when the touch screen panel 10 is seated in the jig 20, at least one through-hole formed in the step (b) (Not shown) is operated to align the touch screen panel 10 with the jig 20 after aligning the respective circular protrusions 222 and the vacuum suction port 223 constituting the panel unit 220, And the first suction portion 210 of the first suction portion 210 is fixed by suction.

Next, referring to FIG. 2D, a conductive material 160 is applied to one surface of the through hole of the fixed substrate 100 of the jig 20. In the embodiment, the surface to which the conductive material 160 is applied is the top surface of the substrate 100, that is, the surface on which the upper wiring electrode 130 is formed. The conductive material 160 may be, for example, Ag, Au, Cu, or the like. The conductive material 160 may be applied by, for example, a printing method.

Next, referring to FIG. 2E, by operating the external vacuum suction means (not shown) and reducing the pressure through the vacuum suction port 223, the conductive material 160 applied to the outside of the through hole is discharged to the inside of the through hole So that the via hole 150 is formed.

In this case, since the upper surface of the circular protrusion 222 is lower in height than the upper surface of the main body of the jig 20, a part of the conductive material 160, which leaks through the through hole, And the upper surface of the circular protrusion 222, thereby applying the lower wiring electrode 140. [

As a result, the upper wiring electrode 130 and the lower wiring electrode 140 are electrically connected through the conductive material 160 formed in the via hole 150.

2 (e), the process of forming the via hole 150 by filling the conductive material 160 into the through hole allows the jig 20 of the thermally conductive material to be formed by using external heat supply means (not shown) Or selectively applying heat to the circular protrusions 222 to harden them.

The thermal hardening step for the conductive material 160 can be understood as a kind of aging process for guiding the state of the conductive material 160 to a surface hardened state so that the conductive material 160 has a thickness and shape of a predetermined specification .

The temporary curing step is preferably carried out within a temperature range of 40 to 80 DEG C within 1 minute. If the temperature is lower than 40 ° C, the surface may be uncured, and if it exceeds 80 ° C, damage may occur to the transparent electrode sensor, which is not preferable.

2 (f), the process of forming the via hole 150 in the capacitive touch screen panel for one-side bonding is completed by separating the touch screen panel 10 from the jig 20 .

Finally, the manufacturing process of the touch screen panel 10 according to the present invention is completed by one-side bonding the flexible printed circuit board 30 to the bonding portion 170 formed on the upper surface of the substrate 100. 5 is a schematic view showing a state in which the flexible printed circuit board 30 is one-side-bonded to the capacitive touch screen panel according to the present invention. However, the bonding process of the flexible printed circuit board 30 can be performed by a separate process, and the touch screen panel 10 in a state in which the via hole 150 is formed in the step (f) The present invention is not limited thereto.

The method of manufacturing a capacitive touch screen panel according to the present invention simplifies a process for a via hole process for single side bonding of a flexible printed circuit board by introducing a conductive material into a through hole by a vacuum suction method, And the production cost can be reduced.

While the foregoing is directed to a specific embodiment of the present invention, it is to be understood that the above-described embodiment of the present invention has been disclosed for the purpose of illustration and is not to be construed as limiting the scope of the present invention, It should be understood that various changes and modifications may be made to the disclosed embodiments without departing from the spirit of the invention.

For example, although the substrate 100 has been described as one in the proposed embodiment, it is also possible to separately form the substrate on which the upper and lower transparent electrode arrays 110 and 120 are formed, It is also possible to form the surfaces of the optical fibers by using optical transparent adhesive (OCA).

Although the process of covering the conductive material 160 on one side of the through hole in the embodiment is performed in a state where the substrate 100 is placed on the jig 20, It is also possible.

In addition, although the upper surface of the substrate 100 is intended to be bonded to the flexible printed circuit board in the embodiment, it may be bonded to the lower surface of the substrate 100. In this case, the surface on which the bonding portion 170 is formed can be formed in the opposite direction to that of the embodiment. Further, in the process of forming the via hole 150, the direction in which the substrate 100 is mounted on the jig 20, The state of being applied to one surface of the through hole may be opposite to that of the embodiment.

It is therefore to be understood that all such modifications and alterations are intended to fall within the scope of the invention as disclosed in the following claims or their equivalents.

10: touch screen panel 100: substrate
110, 120: upper and lower transparent electrode arrays 130, 140: upper and lower wiring electrodes
150: via hole 160: conductive material
170: crimping portion 20: jig
210: first suction portion 220: second suction portion
222: circular protrusion 223: vacuum inlet
30: Flexible printed circuit board

Claims (6)

There is provided a touch screen panel provided with upper and lower transparent electrode arrays which are electrically insulated from each other and are provided on both sides in an isolated form, and upper and lower wiring electrodes formed on the outer periphery of each of the upper and lower transparent electrode arrays step;
Forming at least one through hole in a substrate region where the upper and lower wiring electrodes overlap;
Covering one surface of the through hole with a conductive material; And
And electrically connecting the upper and lower wiring electrodes by filling the conductive material from the other surface of the through hole into the through hole by vacuum suction,
The step of filling and filling the conductive material into the through hole includes a first suction part for sucking and fixing the touch screen panel and a second suction part formed corresponding to the at least one through hole to suck the conductive material from the other surface of the through hole. The touch screen panel is mounted on a jig having a second suction unit,
Wherein the second suction part has a structure in which a vacuum suction port is formed around a circular protrusion aligned with the through hole, and the circular protrusion is formed to be lower in height than an upper surface of the jig body.
The method of claim 1, further comprising filling the conductive material into the through hole, and then heating the conductive material to harden the conductive material.
The method of claim 1, wherein the cover of the conductive material is printed.
The method of claim 1, further comprising adhering a flexible printed circuit board electrically connected to the upper and lower wiring electrodes on one side of the panel.
delete The method of claim 1, further comprising filling the conductive material into the through hole by the second suction unit, and heating the jig to harden the conductive material.

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