TWM507017U - Sensing panel and display device - Google Patents

Abstract

The present invention discloses a sensing panel and a display device. The sensing panel includes a substrate, a plurality of electrodes, a plurality connection pads and a circuit board. The substrate has a sensing area and a bonding area. The electrodes are disposed in the sensing area. The connecting pads are disposed in the bonding area and electrically connected with the electrodes. The connecting pads at least include a first connecting pad, a second connecting pad and a third connecting pad. The third connecting pad is disposed between the first connecting pad and the second connecting pad. The circuit board has at least a conductive pattern. The conductive pattern connects the first connecting pad and the second connecting pad in the bonding area, and the conductive pattern is electrically insulated with the third connecting pad in the bonding area.

Description

Sensing panel and display device

This creation is about a sensing panel and display device.

With the development of sensing technology and display technology, the application of touch has been popularized on display devices, so that the application of touch-enabled display devices can be seen everywhere, such as smart phones, tablet computers and other electronic devices have touch The function is convenient for the user's operation. Generally, a display device equipped with a sensing function is provided with a sensing electrode on a substrate to sense an electrical change after being touched to achieve the purpose of touch.

However, in order to make the substrate have higher touch sensitivity, a considerable number of sensing electrodes are generally disposed, and the signals of each sensing electrode are connected through conductive lines disposed on a connecting circuit board to sense The test signal is transmitted to a control circuit that processes the sensing signal for subsequent processing. However, in the prior art, the connection circuit board is generally a double-layer circuit board, and is disposed on the outer side of the substrate, so that the layout of the connection line is quite complicated, and the cost of the sensing panel and the display device is relatively relatively high. high

Therefore, compared with the prior art, how to provide a sensing panel and a display device, which has lower cost and improved product competitiveness, has become one of the important topics.

The purpose of the present invention is to provide a sensing panel and a display device that can increase product competitiveness at a lower cost than conventional techniques.

To achieve the above object, a sensing panel according to the present invention includes a substrate, a plurality of electrodes, a plurality of connection pads, and a circuit board. The substrate has a sensing area and a bonding area. The electrodes are disposed in the sensing region. The connection pads are disposed in the bonding area and electrically connected to the electrodes, and the connection pads comprise at least a first connection pad, a second connection pad and a third connection pad, and the third connection pad is disposed in the Between a connection pad and a second connection pad. The circuit board has at least one conductive pattern The conductive pattern connects the first connection pad and the second connection pad in the bonding region, and the conductive pattern is electrically insulated from the third connection pad in the bonding region.

In order to achieve the above object, a display device according to the present invention includes a first substrate, a second substrate, a display layer, a plurality of electrodes, a plurality of connection pads, and a circuit board. The first substrate has a sensing area and a bonding area. The second substrate is disposed opposite to the first substrate. The electrodes are disposed in the sensing region. The connection pads are disposed in the bonding area and electrically connected to the electrodes, and the connection pads comprise at least a first connection pad, a second connection pad and a third connection pad, and the third connection pad is disposed in the Between a connection pad and a second connection pad. The circuit board has at least one conductive pattern, and the conductive pattern connects the first connection pad and the second connection pad in the bonding region, and the conductive pattern is electrically insulated from the third connection pad in the bonding region.

In an embodiment, the electrodes are contact sensing electrodes, pressure sensing electrodes, light sensing electrodes or electromagnetic sensing electrodes.

In one embodiment, the conductive pattern is connected to the first connection pad and the second connection pad by at least one conductive material.

In one embodiment, the electrodes comprise a first electrode group and a second electrode group, and the connection pads comprise a first connection pad group and a second connection pad group, and the first electrode group The xth electrode arranged in sequence is a first electrode and is connected to the first connection pad, and the xth electrode arranged in the second electrode group is a second electrode and is connected to the second connection pad. And a third electrode is connected between the first electrode and the second electrode to the third connection pad, wherein x is a positive integer.

In an embodiment, at least some of the electrode groups of the first electrode group and the second electrode group are sequentially arranged along a first direction.

In an embodiment, the circuit board has another conductive pattern that connects the third connection pads.

In an embodiment, the circuit board further has an insulating layer, the insulating layer covers a portion of the conductive pattern, and the insulating layer has at least two openings in the conductive pattern, and the conductive pattern includes at least two connecting portions, and the connecting portions are respectively disposed on the Opening, and the connecting portions are respectively coupled to the first connecting pad and the second connecting pad.

In one embodiment, the circuit board is a single layer circuit board, and the conductive pattern is located on one side of the circuit board facing the substrate.

In an embodiment, the circuit board is a flexible circuit board.

In one embodiment, the connection pads are arranged in a second direction, and the long axis direction of the conductive pattern in the bonding region is substantially parallel to the second direction, and the first direction is substantially perpendicular to the second direction.

As described above, in the sensing panel and the display device of the present invention, the electrodes are disposed in the sensing area, and the connecting pads are disposed in the bonding area, and at least include the first connecting pad, the second connecting pad, and the first The third connection pad is disposed between the first connection pad and the second connection pad. In addition, the conductive pattern of the circuit board connects the first connection pad and the second connection pad in the bonding region, and the conductive pattern is electrically insulated from the third connection pad in the bonding region. Therefore, in connection with the conventional technology of connecting the two-layer circuit board to the outside of the substrate, the present invention uses the conductive pattern disposed on the circuit board to connect the sensing lines to the bonding area of the substrate. Therefore, the layout of the lines is relatively Simple, it can make the sensing panel and the display device have lower cost and improve product competitiveness.

1‧‧‧Sensing panel

11‧‧‧Substrate

12, 32‧‧‧ electrodes

121‧‧‧First electrode

122‧‧‧second electrode

123‧‧‧ third electrode

124‧‧‧fourth electrode

13, 33‧‧‧ connection pads

131‧‧‧First connection pad

132‧‧‧Second connection pad

133‧‧‧ third connection pad

134‧‧‧fourth connection pad

14, 34‧‧‧ circuit board

141, 341‧‧‧ conductive patterns

1411‧‧‧Link Department

142‧‧‧Insulation

2‧‧‧Control Board

3‧‧‧Display device

31‧‧‧First substrate

35‧‧‧second substrate

36‧‧‧Display layer

A‧‧‧Sensing area

A-A‧‧‧ Straight line

B‧‧‧ junction area

D1‧‧‧ first direction

D2‧‧‧ second direction

G1‧‧‧First Electrode Group

G2‧‧‧Second electrode group

O‧‧‧ openings

P1‧‧‧First connection pad group

P2‧‧‧Second connection pad group

FIG. 1 and FIG. 2 are respectively a schematic diagram and a top view of a sensing panel and a control circuit board according to a preferred embodiment of the present invention.

FIG. 3 is a schematic diagram showing the connection of the electrodes of the sensing panel of the embodiment to the connecting pads.

4 is a schematic view showing the connection of conductive patterns of a circuit board of an embodiment.

Figure 5 is a cross-sectional view taken along line A-A of Figure 4;

FIG. 6 is a schematic diagram of a display device according to a preferred embodiment of the present invention.

Hereinafter, a sensing panel and a display device according to a preferred embodiment of the present invention will be described with reference to the related drawings, wherein the same elements will be described with the same reference numerals.

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic diagram and a top view of a sensing panel 1 and a control circuit board 2 according to a preferred embodiment of the present invention.

The sensing panel 1 includes a substrate 11, a plurality of electrodes 12, a plurality of connection pads 13 and a circuit board 14 (the electrodes 12 and the shapes of the connection pads 13 are not shown in FIGS. 1 and 2).

The substrate 11 has a sensing area A and a bonding area B. The substrate 11 can be made of a light transmissive material, such as glass, quartz or the like, plastic, rubber, fiberglass or other polymer materials; or the substrate 11 can also be made of an opaque material. For example, it is a metal-glass fiber composite board, a metal-ceramic composite board, or a printed circuit board, or other materials, and is not limited. In addition, the sensing area A is where the sensing electrodes are disposed, and the electrodes 12 are sensing electrodes, and are single-layer electrode structures, and are disposed in the sensing area A. In addition, the electrodes 12 are, for example but not limited to, contact sensing electrodes, pressure sensing electrodes, light sensing electrodes, or electromagnetic sensing electrodes. Therefore, when the user touches the electrodes 12 on the sensing area A, the electrodes 12 can sense electrical changes, pressure changes, light changes or electromagnetic changes during the touch, and then transmit through the circuit board 14. To control circuit board 2. The control circuit board 2 may include a control circuit for sensing, such as an integrated circuit (IC), and the IC is electrically connected to the electrodes 12 through the circuit board 14; or, the processing and control may be directly performed. The IC used is disposed on the circuit board 14, and is not limited.

The connection pads 13 are disposed on the bonding area B and electrically connected to the electrodes 12 . As the name implies, the land B is the electrical connection area of the circuit board 14 and the electrodes 12. The connection pads 13 include at least a first connection pad, a second connection pad and a third connection pad (not shown), and the third connection pad is disposed between the first connection pad and the second connection pad. In other words, as long as the other connection pad between the first connection pad and the second connection pad can be regarded as a third connection pad (the first connection pad and the second connection pad are non-adjacent connection pads, and the first connection There may be one or a plurality of third connection pads between the pad and the second connection pad, which are not limited).

The circuit board 14 can be a single layer of soft or hard board and has at least one conductive pattern (not shown). The circuit board 14 of this embodiment is exemplified by a single-layer flexible circuit board, such as a flexible circuit board (FPC), and the material thereof may be a polyimide (PI) film. Herein, the single layer indicates that the conductive pattern is located only on one side of the circuit board 14 facing the substrate 11, thereby being connected to the connection pads 13, and the other side of the circuit board 14 away from the substrate 11 is not provided with a conductive pattern or line. . In some embodiments, the conductive pattern of the circuit board 14 may be disposed only in a region of the circuit board 14 that corresponds to the land B. The conductive pattern connects the first connection pad and the second connection pad in the bonding area B, and the conductive pattern is electrically insulated from the third connection pad by not connecting the third connection pad in the bonding area B. In other words, the first connection pad and the second connection pad on the sensing panel 1 of the embodiment The electrical connection is electrically connected, but since the first connection pad and the second connection pad have at least one third connection pad, the conductive pattern skips the third connection pad, so that the conductive pattern, the first connection pad and The second pads are respectively insulated from the third connection pads. The conductive pattern is connected to the first connection pad and the second connection pad by at least one conductive material, and the connection is physically contacted via the conductive material. Herein, the conductive material may be silver paste, anisotropic conductive film (ACF), anisotropic conductive plastic (ACP) or a carbon nanotube, and the like, and is not limited.

FIG. 3 is a schematic diagram of the connection of the electrodes 12 of the sensing panel of the embodiment to the connection pads 13 . Please refer to FIG. 3 to illustrate the electrical connection manner of the electrodes 12 of the sensing panel 1 and the connecting pads 13 .

The electrodes 12 of this embodiment may be, for example, a single layer of driving electrodes and sensing electrodes (ie, commonly known as Tx and Rx, the material is a transparent conductive material such as ITO), and the electrodes 12 are arranged side by side. When the user touches the electrode 12 on the sensing area A, the signal can be transmitted through the circuit board 14, and the position of the touch can be known and the corresponding action can be generated.

As shown in FIG. 3, the electrodes 12 can be divided into a plurality of electrode groups, such as a first electrode group G1 and a second electrode group G2, and each electrode group can include a plurality of electrodes 12. Although only five electrode groups are shown in FIG. 3, it is not intended to limit the number of electrode groups of the present creation. In addition, the connection pads 13 may also be divided into a plurality of connection pad groups corresponding to the grouping of the electrodes 12, for example, the first connection pad group P1 corresponding to the first electrode group G1, and corresponding to the second The second connection pad group P2 of the electrode group G2 and the like (FIG. 3 shows five connection pad groups, and each connection pad group may include a plurality of connection pads 13). The at least some of the electrodes 12 of the first electrode group G1 and the second electrode group G2 are sequentially arranged along a first direction D1. Here, the first electrode group G1 and the second electrode group G2 shown in FIG. 3 are exemplified by having six electrodes each (the shape of each electrode is "mountain"), and the electrodes are insulated from each other. And arranged side by side in the first direction D1.

Each of the first electrode group G1 and the second electrode group G2 is connected to one of the connection pads 13 (the six electrodes of the first electrode group G1 or the second electrode group G2 are connected to each other in order) 6 connection pads). The first electrode arranged in the first electrode group G1 is a first electrode 121 and is connected to the first connection pad 131, and the second electrode group The xth electrode arranged in sequence G2 is a second electrode 122 and is connected to the second connection pad 132, and at least one third electrode 123 is connected between the first electrode 121 and the second electrode 122 to the third The pad 133 is connected, and x is a positive integer (1≦x≦6). In other words, in the present embodiment, taking the first electrode group G1 as an example, when x is equal to 1, the first electrode 121 is the leftmost one electrode, and the connection pad corresponding to the first electrode 121 is the first a connection pad 131; or, in different embodiments, when x is equal to 6, the first electrode 121 is the rightmost electrode (not labeled), and the connection pad corresponding to the first electrode 121 is the first A connection pad (not labeled), and so on.

Similarly, the second electrode of the second electrode group G2 is also the same and will not be described. Therefore, the first connection pad 131 of the first connection pad group P1 may be any connection pad connected to the first electrode 121 of the first electrode group G1, and the second connection pad 132 may be the first connection pad 132. In the connection pad group P2, any one of the connection pads connected to the second electrode 122 of the second electrode group G2, and a third connection pad 133 is correspondingly connected to a third electrode 123, and the third connection pad 133 is Any one of the connection pads between the first connection pad 131 and the second connection pad 132. The third electrode 123 is an electrode (which may be any one of the first electrode group G1 or the second electrode group G2) to which the third connection pad 133 is connected.

In addition, the first electrode group G1 and the second electrode group G2 of the present embodiment further have another electrode, which is referred to as a fourth electrode 124, and the shape of the fourth electrode 124 is, for example, a comb shape, and respectively Six of the first electrode group G1 and the second electrode group G2 are arranged side by side. In addition, the first connection pad group P1 and the second connection pad group P2 further have a fourth connection pad 134, and the fourth connection pad 134 of the first connection pad group P1 and the first electrode group G1 The four electrodes 124 are connected, and the fourth connection pad 134 of the second connection pad group P2 is connected to the fourth electrode 124 of the second electrode group G2.

Although in FIG. 3, a fixed number of electrodes 12, connection pads 13, electrode groups (eg, G1 and G2), and connection pad groups (eg, P1 and P2) are illustrated, these illustrations are only used to describe this The structure of the creation, but not intended to limit the creation. Further, although in Fig. 3, the electrodes 121 and 122 are "mountain"-shaped, and the electrode 124 is a comb-like structure, it is known to those skilled in the art that electrodes of different shapes do not affect the main spirit of the present creation. Further, in an embodiment, the electrodes 121 and 122 are, for example, drive electrodes (Tx), and the electrodes 124 are sensed The electrode (Rx), but in another embodiment, the electrodes 121 and 122 may also be the sensing electrode (Rx), and the electrode 124 is the driving electrode (Tx), which is not limited in this creation.

Please refer to FIG. 3 and FIG. 4 and FIG. 5 . FIG. 4 is a schematic diagram showing the connection of the conductive patterns of the circuit board 14 of the embodiment, and FIG. 5 is a cross-sectional view along line AA of FIG. 4 . schematic diagram. FIG. 4 does not show the electrodes 12 in the sensing area A, nor does it show the connecting lines of the electrodes 12 and the connecting pads 13. The connection between the electrodes 12 and the connection pads 13 can be referred to FIG. 3 and will not be described.

Referring to FIG. 3 again, the first electrode group G1, the second electrode group G2, the first connection pad group P1, and the second connection pad group P2 are taken as an example, except for the fourth connection pad 134. The first connection pad group P1 and the second connection pad group P2 respectively have m (in this embodiment, m=6) connection pads, and the m connection pads in the first connection pad group P1 are respectively The m electrodes in the electrode group G1 are electrically connected, and the m connection pads in the second connection pad group P2 are electrically connected to the m electrodes in the second electrode group G2, respectively. The m electrodes of the first electrode group G1 are electrically insulated from each other, and the m electrodes of the second electrode group G2 are also electrically insulated from each other, and the m electrodes of the first electrode group G1 are The m electrodes of the second electrode group G2 are also electrically insulated from each other, and the fourth electrode 124 connected to the fourth connection pad 134 is also electrically insulated from the m electrodes.

In addition, as shown in FIG. 4, the number of conductive patterns 141 is the same as the number of electrodes in the first electrode group G1 or the second electrode group G2 (FIG. 4 shows six conductive patterns 141 indicating the first electrode group G1 or The number of electrodes of the second electrode group G2 is also six, and the conductive patterns 141 are electrically insulated from each other. The connecting pads 13 of the embodiment are arranged along a second direction D2, and the second direction D2 is substantially perpendicular to the first direction D1, and the conductive pattern 141 is substantially in the long axis direction in the bonding region B. It is parallel to the second direction D2. However, in different embodiments, the number of conductive patterns 141 may be different from the number of electrodes in the first electrode group G1 or the second electrode group G2, for example, may include a dummy conductive pattern such that the conductive pattern The number of electrodes is larger than the number of electrodes in the first electrode group G1 or the second electrode group G2, and the creation is not limited.

The circuit board 14 has at least m (m=6) conductive patterns 141, and the conductive patterns 141 are respectively connected to the nth connection pad and the second connection pad group in the first connection pad group P1. The nth connection pad in P2, m is a positive integer greater than or equal to 2, and n is a positive integer less than or equal to m. Here, when n is equal to 1, it indicates that the conductive pattern 141 (the rightmost conductive pattern 141 of FIG. 4) is connected to the first connection pad in the first connection pad group P1 except for the fourth connection pad 134. The first connection pad in the second connection pad group P2, ...; when n is equal to 2, indicates that the conductive pattern 141 except the fourth connection pad 134 (the second right conductive pattern of the far right to the left of FIG. 4) 141) connecting the second connection pad in the first connection pad group P1, the second connection pad in the second connection pad group P2, ... and so on.

In detail, taking the conductive pattern 141 on the far right side of FIG. 4 as an example, in addition to the conductive pattern 141, as shown in FIG. 4 and FIG. 5, the circuit board 14 may further have an insulating layer 142, and the insulating layer 142 covers a portion. Conductive pattern 141. The insulating layer 142 has at least two openings O on the conductive pattern 141, and the conductive pattern 141 includes at least two connecting portions 1411, and the connecting portions 1411 are respectively disposed in the openings O, such that the connecting portions 1411 respectively The first connection pad 131 and the second connection pad 132 are coupled. The number of the openings O is the same as the number of the electrode groups and the connecting portions 1411 , and the third connecting pads 133 can be any one of the connecting pads between the first connecting pads 131 and the second connecting pads 132 . However, in different embodiments, the number of openings O and the number of electrode groups and connecting portions 1411 may be different, and are not limited. In addition, the circuit board 14 may further have another conductive pattern 141 (FIG. 4 shows the leftmost conductive pattern 141) to connect the third connection pad 133. In addition, the circuit board 14 further has a plurality of connection traces (not shown), and the control circuit board 2 is electrically connected to the fourth connection pads 134 of the connection pad group through the connection traces (and Fourth electrode 124).

In addition, please refer to FIG. 6, which is a schematic diagram of a display device 3 of the preferred embodiment.

The display device 3 includes a first substrate 31, a second substrate 35, a display layer 36, a plurality of electrodes 32, a plurality of connection pads 33, and a circuit board 34.

The first substrate 31 has a sensing area A and a bonding area B. The second substrate 35 is disposed opposite to the first substrate 31, and the display layer 36 is disposed between the first substrate 31 and the second substrate 35. The first substrate 31 or the second substrate 35 may be made of a light transmissive material, such as glass, quartz or the like, plastic, rubber, fiberglass or other polymer materials; or, the first substrate 31 Or the second substrate 35 can also be made of an opaque material, and is, for example, gold. Generic-glass fiber composite panels, metal-ceramic composite panels, or printed circuit boards, or other materials. In this embodiment, the materials of the first substrate 31 and the second substrate 35 are both permeable to light. In addition, the display layer 36 may include a liquid crystal molecule, an organic light emitting diode, or a non-volatile display material (for example, an electrophoretic substance), so the display device 3 of the embodiment may be a liquid crystal display device, an organic light emitting diode display device, or Electronic paper. Here, it is not limited.

The electrodes 32 are disposed in the sensing area A. The connection pads 33 are disposed in the bonding area B and electrically connected to the electrodes 32, and the connection pads 33 include at least a first connection pad, a second connection pad and a third connection pad, and the third connection The pad is disposed between the first connection pad and the second connection pad. In addition, the circuit board 34 has at least one conductive pattern 341, and the conductive pattern 341 connects the first connection pad and the second connection pad in the bonding area B, and the conductive pattern 341 is electrically insulated from the third connection pad in the bonding area B.

The first substrate 31, the electrodes 32, the connection pads 33, and the circuit board 34 can refer to the substrate 11, the electrodes 12, the connection pads 13 and the circuit board 14, and variations thereof. The content can be referred to above, and will not be described here.

In summary, in the sensing panel and the display device of the present invention, the electrodes are disposed in the sensing area, and the connecting pads are disposed in the bonding area, and at least include the first connecting pad, the second connecting pad, and the first The third connection pad is disposed between the first connection pad and the second connection pad. In addition, the conductive pattern of the circuit board connects the first connection pad and the second connection pad in the bonding region, and the conductive pattern is electrically insulated from the third connection pad in the bonding region. Therefore, in connection with the conventional technology of connecting the two-layer circuit board to the outside of the substrate, the present invention uses the conductive pattern disposed on the circuit board to connect the sensing lines to the bonding area of the substrate. Therefore, the layout of the lines is relatively Simple, it can make the sensing panel and the display device have lower cost and improve product competitiveness.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of this creation shall be included in the scope of the appended patent application.

1‧‧‧Sensing panel

11‧‧‧Substrate

12‧‧‧ electrodes

13‧‧‧Connecting mat

131‧‧‧First connection pad

132‧‧‧Second connection pad

133‧‧‧ third connection pad

134‧‧‧fourth connection pad

14‧‧‧ boards

141‧‧‧ conductive pattern

1411‧‧‧Link Department

A‧‧‧Sensing area

A-A‧‧‧ Straight line

B‧‧‧ junction area

D1‧‧‧ first direction

D2‧‧‧ second direction

P1‧‧‧First connection pad group

P2‧‧‧Second connection pad group

Claims (20)

A sensing panel includes: a substrate having a sensing region and a bonding region; a plurality of electrodes disposed in the sensing region; a plurality of connection pads disposed in the bonding region and electrically connected to the electrodes, and The connection pads at least include a first connection pad, a second connection pad and a third connection pad, the third connection pad being disposed between the first connection pad and the second connection pad; and a circuit board, The conductive pattern has at least one conductive pattern, and the conductive pattern connects the first connection pad and the second connection pad in the bonding region, and the conductive pattern is electrically insulated from the third connection pad in the bonding region. The sensing panel of claim 1, wherein the electrodes are contact sensing electrodes, pressure sensing electrodes, light sensing electrodes or electromagnetic sensing electrodes. The sensing panel of claim 1, wherein the conductive pattern is connected to the first connection pad and the second connection pad by at least one conductive material. The sensing panel of claim 1, wherein the electrodes comprise a first electrode group and a second electrode group, the connection pads comprising a first connection pad group and a second connection In the pad group, the xth electrode sequentially arranged in the first electrode group is a first electrode, and is connected to the first connection pad, and the xth electrode array sequentially arranged in the second electrode group is a second electrode is connected to the second connection pad, and a third electrode is connected between the first electrode and the second electrode to the third connection pad, where x is a positive integer. The sensing panel of claim 4, wherein at least some of the electrode groups of the first electrode group and the second electrode group are sequentially arranged along a first direction. The sensing panel of claim 1, wherein the circuit board has another conductive pattern connecting the third connection pad. The sensing panel of claim 1, wherein the circuit board further has an insulating layer covering a portion of the conductive pattern, and the insulating layer has at least two openings on the conductive pattern, the conductive pattern The at least two connecting portions are respectively disposed on the openings, and the connecting portions are respectively coupled to the first connecting pad and the second connecting pad. The sensing panel of claim 1, wherein the circuit board is a single layer circuit a plate, and the conductive pattern is located on a side of the circuit board facing the substrate. The sensing panel of claim 1, wherein the circuit board is a flexible circuit board. The sensing panel of claim 5, wherein the connecting pads are arranged along a second direction, and the long axis direction of the conductive pattern in the bonding region is substantially parallel to the second direction, and The first direction is substantially perpendicular to the second direction. A display device includes: a first substrate having a sensing region and a bonding region; a second substrate disposed opposite the first substrate; a display layer disposed on the first substrate and the second substrate a plurality of electrodes disposed in the sensing region; a plurality of connection pads disposed in the bonding region and electrically connected to the electrodes, and the connection pads at least including a first connection pad and a second connection pad And a third connection pad disposed between the first connection pad and the second connection pad; and a circuit board having at least one conductive pattern, the conductive pattern connecting the first in the bonding area Connecting the pad and the second connection pad, and the conductive pattern is electrically insulated from the third connection pad in the bonding region. The display device of claim 11, wherein the electrodes are contact sensing electrodes, pressure sensing electrodes, light sensing electrodes or electromagnetic sensing electrodes. The display device of claim 11, wherein the conductive pattern is connected to the first connection pad and the second connection pad by at least one conductive material. The display device of claim 11, wherein the electrodes comprise a first electrode group and a second electrode group, the connection pads comprising a first connection pad group and a second connection pad The first x-th electrode in the first electrode group is a first electrode and is connected to the first connection pad, and the x-th electrode in the second electrode group is sequentially arranged. a second electrode is connected to the second connection pad, and a third electrode is connected between the first electrode and the second electrode to the third connection pad, where x is a positive integer. The display device of claim 14, wherein at least some of the electrode groups of the first electrode group and the second electrode group are sequentially arranged along a first direction. The display device of claim 11, wherein the circuit board has another conductive The pattern connects the third connection pad. The display device of claim 11, wherein the circuit board further has an insulating layer covering a portion of the conductive pattern, and the insulating layer has at least two openings on the conductive pattern, the conductive pattern comprising The at least two connecting portions are respectively disposed on the openings, and the connecting portions are respectively coupled to the first connecting pad and the second connecting pad. The display device of claim 11, wherein the circuit board is a single-layer circuit board, and the conductive pattern is located on a side of the circuit board facing the first substrate. The display device of claim 11, wherein the circuit board is a flexible circuit board. The display device of claim 15, wherein the connection pads are arranged along a second direction, and the long axis direction of the conductive pattern in the joint region is substantially parallel to the second direction, and the The first direction is substantially perpendicular to the second direction.