CN108255338A - Flexible touch screen, touches substrate and preparation method thereof at touch panel - Google Patents
Flexible touch screen, touches substrate and preparation method thereof at touch panel Download PDFInfo
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- CN108255338A CN108255338A CN201810031662.3A CN201810031662A CN108255338A CN 108255338 A CN108255338 A CN 108255338A CN 201810031662 A CN201810031662 A CN 201810031662A CN 108255338 A CN108255338 A CN 108255338A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a kind of flexible touch screen, touch panel, substrate and preparation method thereof is touched, the flexible touch substrate includes：Including：Bind area；The binding area includes flexible parent metal and first indium tin oxide semiconductor (ITO) floor, metal layer and the second ITO layer that are set in turn on the flexible parent metal.The FPC pulling capacities in flexible touch screen Bonding areas can be enhanced using the present invention, ensure the quality of flexible touch screen.
Description
Technical field
The present invention relates to display technology fields, particularly relate to a kind of flexible touch screen, touch panel, touch substrate and its system
Make method.
Background technology
With development in science and technology, electronics also changes therewith, and flexible apparatus gradually enters into the visual field of the public.Make
For convenience of efficiently man-machine interaction mode, the application of touch screen is also increasingly wider.It is flexible with the fast development of OLED technology
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) technology gradually comes into the visual field of people, this
Demand is proposed to flexible touch technology.
Current flexible touch technology is based on external hanging type touch-control, mostly using PET (Polyethylene
Terephthalate, polyethylene terephthalate)/COP (Cyclo Olefin Polymer, cyclic olefin polymer) etc.
Base material, then forms bridging structure on base material or DITO (double ITO) structure forms touch control electrode.In external hanging type bridge formation scheme
In, Bonding (binding) area uses the structure of Metal+ITO more, as shown in Figure 2：In the deposited on substrates such as PET/COP Metal
(metal) layer covers ITO (indium tin oxide semiconductor) layers to protect following Metal layers on Metal.
However, in practical applications, it was found by the inventors of the present invention that the Bonding areas of existing flexible touch screen have
The hypodynamic shortcoming of FPC (flexible PCB) drawing, and flexible touch screen is caused product quality problem occur.
Invention content
In view of this, it is an object of the invention to propose a kind of flexible touch screen, touch panel, touch substrate and its making
Method enhances the FPC pulling capacities in flexible touch screen Bonding areas, ensures the quality of flexible touch screen.
A kind of flexible touch substrate is provided based on the above-mentioned purpose present invention, including：Bind area；The binding area includes flexibility
Base material and
First indium tin oxide semiconductor (ITO) layer, the metal layer and second being set in turn on the flexible parent metal
ITO layer.
Further, the binding area further includes：The insulating layer (OC) being set between the metal layer and the second ITO layer；
Wherein, it is provided with via for described OC layers, the second ITO layer is connect by the via with the metal layer.
Preferably, the aperture for being covered in the via of the OC layers of the metal layer is more than the first aperture of setting；
The via for being covered in the OC layers above the flexible parent metal is less than the second aperture of setting；
Wherein, second aperture is less than the first aperture.
Wherein, first ITO layer includes several first layer ITO being arranged in array on the flexible parent metal
Block；And
The metal layer is layed in including several sheet metals in each first layer ITO sub-blocks respectively, the area of the sheet metal
Less than the area of the first layer ITO sub-blocks below the sheet metal.
Wherein, second ITO layer includes several second layer ITO sub-blocks and is located at each sheet metal top respectively；Wherein, it is described
The area of second layer ITO sub-blocks above sheet metal is more than the area of the first layer ITO sub-blocks below the sheet metal.
The present invention also provides a kind of production method of flexible touch substrate, including：
A floor ITO layer is deposited on the flexible parent metal in the binding area of the flexible touch substrate and is etched, obtains the first ITO
The figure of layer；
One layer of metal layer is deposited on the flexible parent metal and is etched, obtains the figure for the metal layer being located in the first ITO layer
Shape；
It redeposited one layer of ITO layer and is etched on the flexible parent metal, obtains the figure of the second ITO layer.
Further, it is further included before redeposited one layer of ITO layer on the flexible parent metal：
A layer insulating and etching vias are deposited on the flexible parent metal, obtains the figure of the OC layers with via；With
And
Second ITO layer is connect by via OC layers described with the metal layer.
A layer insulating is deposited on the flexible parent metal and etching vias specifically includes preferably, described：
After depositing a layer insulating on the substrate, it is more than in the aperture for the via that the metal layer etches and sets
The first fixed aperture；
The via etched above the flexible parent metal is being covered in less than the second aperture set；
Wherein, second aperture is less than the first aperture.
The present invention also provides a kind of flexible touch panel, including：Flexible touch substrate as described above.
The present invention also provides a kind of flexible touch screen, including：Flexible touch panel as described above.
In technical scheme of the present invention, increase ITO bottoming between flexible parent metal and Metal, solve Metal and base material
Between adhesive force it is bad the problem of, the FPC pulling capacities in flexible touch screen Bonding areas can be enhanced, ensure flexible touch screen
Quality.
Further, middle layer OC floor is increased in Bonding areas, and the second ITO layer sunk type is allowed to be overlapped with Metal, is kept away
Exempt from the second ITO layer and be directly overlapped in Metal to crack the problem of being difficult to effective protection Metal, so as to further enhance
Bonding areas pulling capacity.
Further, the aperture for being covered in the via OC1 of the OC layers of the metal layer is bigger, in favor of metal layer electricity
Son is conducting to the second ITO layer；Meanwhile the via for being covered in OC layers above the flexible parent metal is smaller, with improve ACF with
The contact area in Bonding areas further enhances FPC pulling capacities.
Description of the drawings
Fig. 1 is that the flexible touch screen of the prior art binds the structure diagram in area；
Fig. 2 is the cross section structure schematic diagram that a kind of flexible touch screen that the embodiment of the present invention one provides binds area；
Fig. 3 is that a kind of flexible touch screen that the embodiment of the present invention one provides binds area's production method flow chart；
Fig. 4 is the plane of structure structure diagram that a kind of flexible touch screen that the embodiment of the present invention one provides binds area；
Fig. 5 is the cross section structure schematic diagram that a kind of flexible touch screen provided by Embodiment 2 of the present invention binds area；
Fig. 6 binds area's production method flow chart for a kind of flexible touch screen provided by Embodiment 2 of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the present invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " one " used herein, " one
It is a ", " described " and "the" may also comprise plural form.Wording "and/or" used herein includes one or more associated
List items whole or any cell and all combine.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention
The non-equal entity of a same names or non-equal parameter, it is seen that " first " " second " should not only for the convenience of statement
The restriction to the embodiment of the present invention is interpreted as, subsequent embodiment no longer illustrates this one by one.
The present inventor analyzes the structure in existing flexible touch screen binding area, finds Metal and base material
Between can there are adhesive force it is bad the problem of.Since Metal is easily detached from base material, so as to cause the FPC drawings in Bonding areas
Power is insufficient；In other words, when FPC pulling capacities are larger, it is susceptible to the phenomenon that Metal is detached from base material.
The present inventor between flexible parent metal and Metal it is considered that increase by one layer of ITO layer, to solve as a result,
The problem of adhesive force is bad between Metal and base material so as to enhance the FPC pulling capacities in flexible touch screen Bonding areas, ensures soft
The quality of property touch screen.
Technical solution that the invention will now be described in detail with reference to the accompanying drawings specifically provides two implementations in technical solution of the present invention
Example.
Embodiment one
The structure in a kind of flexible touch screen binding area that the embodiment of the present invention one provides, as shown in Fig. 2, including：As lining
The flexible parent metal 201 at bottom and the first ITO layer 202 being set in turn on flexible parent metal 201, metal layer 203, OC layers 204,
And second ITO layer 205.
Wherein, OC layers 204 are provided with via, and the second ITO layer 205 is connect by the via with metal layer 203.As one kind
Preferably embodiment, the aperture for being covered in the via of the OC layers (Overcoating, insulating layer) of the metal layer are more than
First aperture of setting；The via for being covered in the OC layers above the flexible parent metal is less than the second aperture of setting；Wherein, it is described
Second aperture is less than the first aperture.
The embodiment of the present invention one provide a kind of flexible touch screen binding area production method, flow as shown in figure 3, including
Following steps：
Step S301：One layer of ITO layer is deposited on flexible parent metal and is etched, obtains the figure of the first ITO layer.
In this step, deposited on flexible parent metal in a patterning processes and etch one layer of ITO layer, obtain the first ITO
The figure of layer.For example, the obtained figure of the first ITO layer is as shown in figure 4, several first layer ITO sub-blocks are arranged in array
On flexible parent metal.
Step S302：One layer of metal layer is deposited on the flexible parent metal and is etched, obtains the gold being located in the first ITO layer
Belong to the figure of layer；
It in this step, is deposited on flexible parent metal in a patterning processes and etches one layer of metal layer, obtain being located at the
The figure of metal layer in one ITO layer.For example, deposition has a sheet metal in each first layer ITO sub-blocks as shown in Figure 2,
That is the metal layer is layed in including several sheet metals in each first layer ITO sub-blocks respectively.
Due to increasing one layer of ITO between layer and base material in metal (Metal), and there is stronger attachment between ITO and base material
Power, while also have compared with strong adhesive force between Metal and ITO, so as to solve, adhesive force between Metal and base material is bad to ask
Topic can enhance the FPC pulling capacities in flexible touch screen Bonding areas, ensure the quality of flexible touch screen.
Preferably, the area of first layer ITO sub-blocks can be more than the area of the metal layer of side laid thereon, i.e., described gold
The boundary for belonging to the first layer ITO sub-blocks below piece is expanded except the metal sheet border；So that have between ITO and base material stronger
Adhesive force, further enhance the FPC pulling capacities in flexible touch screen Bonding areas.For example, first layer ITO sub-blocks are compared with its upper berth
If Metal expand each about 2um respectively in length and width both sides.And Metal Bonding W/S (metal binds sector width/spacing)
For 100/100um.
Step S303：A layer insulating and etching vias are deposited on the flexible parent metal, obtains the OC layers with via
Figure.
In this step, deposited on flexible parent metal in a patterning processes and etch one layer OC layers, obtained with via
OC layers figure.For example, as shown in Fig. 2, OC layers were both covered on metal layer, it can also be covered in and not be laid with the soft of metal layer
On property base material.
Step S304：It redeposited one layer of ITO layer and is etched on the flexible parent metal, obtains the figure of the second ITO layer；Institute
The second ITO layer is stated to connect with the metal layer by via OC layers described.
In this step, redeposited on flexible parent metal in a patterning processes and one layer of ITO layer of etching obtains second
The figure of ITO layer.As shown in Fig. 2, the second ITO layer is connect by via OC layers described with the metal layer.
The present inventor also found that the prior art is when making Bonding areas, directly by ITO in practical applications
Film is overlapped on Metal, since Metal is thicker, about 1500-2000A, ito film lower thickness about 500A, as shown in Figure 1, causing
Ito film easily forms crackle at Metal edges, and can not effective protection Metal, Metal exposures easily corrode in air,
And then cause Bonding areas pulling capacity insufficient.
Therefore, in the technical solution of the embodiment of the present invention one, middle layer OC floor is increased in Bonding areas, and allows second
ITO layer sunk type and Metal are overlapped, and are avoided the second ITO layer and are directly overlapped in Metal and crack and are difficult to effective protection
The problem of Metal, so as to further enhance Bonding areas pulling capacity.
Preferably, the aperture for being covered in the via OC1 of the OC layers of the metal layer can be bigger, in favor of metal
Layer electronic conduction is to the second ITO layer.For example, the aperture of the via OC1 of the OC layers of metal layer can be more than the first of setting
Aperture.For example, the aperture that the first aperture set as 30um, is covered in the via OC1 of the OC layers of the metal layer can be with
It opens up as 35um.
The via of the OC layers above the flexible parent metal is covered in, that is, the via of OC layers being layed between sheet metal
The aperture of OC2 can be smaller, to improve the contact area of ACF (different rectangular conducting resinl) and Bonding areas, further enhances
FPC pulling capacities promote reliability.For example, the via OC2 of OC layers being covered in above the flexible parent metal is less than the second of setting
Aperture；Wherein, second aperture is less than the first aperture.For example, the second aperture set is covered in as 20um on flexible parent metal
The aperture of the via OC2 of the OC layers of side can be opened up as 15um.
As shown in Fig. 2, the second ITO layer can include several second layer ITO sub-blocks, respectively above each sheet metal；Compared with
Goodly, the area of the second layer ITO sub-blocks above the sheet metal can be more than the first layer ITO sub-blocks below the sheet metal
Area, i.e., the boundary of described sheet metal top second layer ITO sub-blocks expand the boundary of the sheet metal underlying first layer ITO sub-blocks
Except.In this way, second layer ITO sub-blocks can play a protective role to sheet metal below and first layer ITO sub-blocks.
In the technical solution of the embodiment of the present invention one, increase ITO bottoming between flexible parent metal and Metal, solve
The problem of adhesive force is bad between Metal and base material can enhance the FPC pulling capacities in flexible touch screen Bonding areas, ensure soft
The quality of property touch screen.
Further, in the technical solution of the embodiment of the present invention one, middle layer OC floor is increased in Bonding areas, and allows
Two ITO layer sunk types and Metal are overlapped, and are avoided the second ITO layer and are directly overlapped in Metal and crack and are difficult to effective protection
The problem of Metal, so as to further enhance Bonding areas pulling capacity.
Further, in the technical solution of the embodiment of the present invention one, it is covered in the via OC1 of the OC layers of the metal layer
Aperture it is bigger, in favor of metal layer electronic conduction to the second ITO layer；Meanwhile it is covered in the OC above the flexible parent metal
The via of layer is smaller, to improve the contact area of ACF and Bonding areas, further enhances FPC pulling capacities.
Embodiment two
A kind of more simple flexible touch screen binding plot structure that the embodiment of the present invention two provides, as shown in figure 5, packet
It includes：As substrate flexible parent metal 501 and be set in turn on flexible parent metal 501 the first ITO layer 502, metal layer 503,
And second ITO layer 505.
Wherein, the first ITO layer 502 includes several first layer ITO being arranged in array on the flexible parent metal
Block；Metal layer 503 includes several sheet metals, is layed in respectively in first layer ITO sub-blocks；Second ITO layer 505 includes several second
Layer ITO sub-blocks are layed in respectively above each sheet metal of metal layer 503, and cover below the sheet metal and the sheet metal the
One layer of ITO sub-block.
A kind of production method in flexible touch screen binding area provided by Embodiment 2 of the present invention, flow as shown in fig. 6, including
Following steps：
Step S601：One layer of ITO layer is deposited on flexible parent metal and is etched, obtains the figure of the first ITO layer 502.
In this step, deposited on flexible parent metal in a patterning processes and etch one layer of ITO layer, obtain the first ITO
The figure of layer 502.It can include first layer ITO being arranged in array on flexible parent metal in the first obtained ITO layer 502
Block.
Step S602：One layer of metal layer is deposited on the flexible parent metal and is etched, obtains being located in the first ITO layer 502
Metal layer 503 figure.
It in this step, is deposited on flexible parent metal in a patterning processes and etches one layer of metal layer, obtain being located at the
The figure of metal layer 503 in one ITO layer 502.Wherein, metal layer 503 can include several sheet metals, be layed in each the respectively
In one layer of ITO sub-block.
Due to increasing one layer of ITO between layer and base material in metal (Metal), and there is stronger attachment between ITO and base material
Power, while also have compared with strong adhesive force between Metal and ITO, so as to solve, adhesive force between Metal and base material is bad to ask
Topic can enhance the FPC pulling capacities in flexible touch screen Bonding areas, ensure the quality of flexible touch screen.
Preferably, the area of the sheet metal of metal layer 503 can be less than the face of the first layer ITO sub-blocks below the sheet metal
Product, i.e. the boundary of the first layer ITO sub-blocks of the lower section of the sheet metal of metal layer 503 is expanded except the metal sheet border.So that
Obtaining has stronger adhesive force between first layer ITO sub-blocks and base material, the FPC for further enhancing flexible touch screen Bonding areas is drawn
Pull out force.
Step S603：It redeposited one layer of ITO layer and is etched on the flexible parent metal, obtains covering 502 He of the first ITO layer
The figure of second ITO layer 505 of metal layer 503.
In this step, redeposited on flexible parent metal in a patterning processes and one layer of ITO layer of etching obtains second
The figure of ITO layer 505.The second obtained ITO layer 505 can include several second layer ITO sub-blocks, be layed in metal layer respectively
Above 503 each sheet metals, and cover the first layer ITO sub-blocks below the sheet metal and the sheet metal.
Preferably, the area of second layer ITO sub-blocks is more than the first layer ITO sub-block areas of the first ITO layer 502 below,
That is the boundary of second layer ITO sub-blocks is expanded except first layer ITO sub-block boundaries below.In this way, second layer ITO sub-blocks can be with
It plays a protective role to sheet metal below and first layer ITO sub-blocks.
In the technical solution of the embodiment of the present invention two, increase ITO bottoming between flexible parent metal and Metal, solve
The problem of adhesive force is bad between Metal and base material can enhance the FPC pulling capacities in flexible touch screen Bonding areas, ensure soft
The quality of property touch screen.
A kind of flexible touch screen provided by the invention can include the Bonding areas of above-described embodiment one or embodiment two.
In technical scheme of the present invention, increase ITO bottoming between flexible parent metal and Metal, solve Metal and base material
Between adhesive force it is bad the problem of, the FPC pulling capacities in flexible touch screen Bonding areas can be enhanced, ensure flexible touch screen
Quality.
Further, middle layer OC floor is increased in Bonding areas, and the second ITO layer sunk type is allowed to be overlapped with Metal, is kept away
Exempt from the second ITO layer and be directly overlapped in Metal to crack the problem of being difficult to effective protection Metal, so as to further enhance
Bonding areas pulling capacity.
Further, the aperture for being covered in the via OC1 of the OC layers of the metal layer is bigger, in favor of metal layer electricity
Son is conducting to the second ITO layer；Meanwhile the via for being covered in OC layers above the flexible parent metal is smaller, with improve ACF with
The contact area in Bonding areas further enhances FPC pulling capacities.
Those skilled in the art of the present technique are appreciated that in the various operations crossed by discussion in the present invention, method, flow
Steps, measures, and schemes can be replaced, changed, combined or be deleted.Further, it is each with having been crossed by discussion in the present invention
Other steps, measures, and schemes in kind operation, method, flow may also be alternated, changed, rearranged, decomposed, combined or deleted.
Further, it is of the prior art have with disclosed in the present invention various operations, method, the step in flow, measure, scheme
It may also be alternated, changed, rearranged, decomposed, combined or deleted.
Those of ordinary skills in the art should understand that：The discussion of any of the above embodiment is exemplary only, not
It is intended to imply that the scope of the present disclosure is limited to these examples (including claim)；Under the thinking of the present invention, above example
Or can also be combined between the technical characteristic in different embodiments, step can be realized with random order, and be existed such as
Many other variations of the different aspect of the upper present invention, for simplicity, they are not provided in details.Therefore, it is all
Within the spirit and principles in the present invention, any omission for being made, modification, equivalent replacement, improvement etc. should be included in the present invention's
Within protection domain.
Claims (10)
1. a kind of flexible touch substrate, including：Bind area；It is described binding area include flexible parent metal and
First indium tin oxide semiconductor (ITO) layer, metal layer and the 2nd ITO being set in turn on the flexible parent metal
Layer.
2. flexible touch substrate according to claim 1, which is characterized in that the binding area further includes：It is set to described
Insulating layer (OC) between metal layer and the second ITO layer；
Wherein, it is provided with via for described OC layers, the second ITO layer is connect by the via with the metal layer.
3. flexible touch substrate according to claim 2, which is characterized in that
The aperture for being covered in the via of the OC layers of the metal layer is more than the first aperture of setting；
The via for being covered in the OC layers above the flexible parent metal is less than the second aperture of setting；
Wherein, second aperture is less than the first aperture.
4. according to any flexible touch substrates of claim 1-3, which is characterized in that first ITO layer include be in
Array is arranged in several first layer ITO sub-blocks on the flexible parent metal；And
The metal layer is layed in including several sheet metals in each first layer ITO sub-blocks respectively, and the area of the sheet metal is less than
The area of first layer ITO sub-blocks below the sheet metal.
5. flexible touch substrate according to claim 4, which is characterized in that second ITO layer includes several second layers
ITO sub-blocks are located above each sheet metal respectively；Wherein, the area of the second layer ITO sub-blocks above the sheet metal is more than the gold
Belong to the area of the first layer ITO sub-blocks below piece.
6. a kind of production method of flexible touch substrate, including：
A floor ITO layer is deposited on the flexible parent metal in the binding area of the flexible touch substrate and is etched, obtains the first ITO layer
Figure；
One layer of metal layer is deposited on the flexible parent metal and is etched, obtains the figure for the metal layer being located in the first ITO layer；
It redeposited one layer of ITO layer and is etched on the flexible parent metal, obtains the figure of the second ITO layer.
7. according to the method described in claim 6, it is characterized in that, on the flexible parent metal before redeposited one layer of ITO layer,
It further includes：
A layer insulating and etching vias are deposited on the flexible parent metal, obtains the figure of the OC layers with via；And
Second ITO layer is connect by via OC layers described with the metal layer.
8. the method according to the description of claim 7 is characterized in that described deposit a layer insulating simultaneously on the flexible parent metal
Etching vias specifically includes：
After depositing a layer insulating on the substrate, it is more than setting in the aperture for the via that the metal layer etches
First aperture；
The via etched above the flexible parent metal is being covered in less than the second aperture set；
Wherein, second aperture is less than the first aperture.
9. a kind of flexible touch panel, including：Flexible touch substrate as described in claim 1-5 is any.
10. a kind of flexible touch screen, including：Flexible touch panel as claimed in claim 9.
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| CN201810031662.3A CN108255338B (en) | 2018-01-12 | 2018-01-12 | Flexible touch screen, touch panel, touch substrate and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111769080A (en) * | 2020-06-24 | 2020-10-13 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN112701129A (en) * | 2021-01-07 | 2021-04-23 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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