CN104461101A - Touch panel with conductive protection layer and manufacturing method thereof - Google Patents
Touch panel with conductive protection layer and manufacturing method thereof Download PDFInfo
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- CN104461101A CN104461101A CN201310440213.1A CN201310440213A CN104461101A CN 104461101 A CN104461101 A CN 104461101A CN 201310440213 A CN201310440213 A CN 201310440213A CN 104461101 A CN104461101 A CN 104461101A
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- layer
- signal lead
- contact panel
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention provides a touch panel with a conductive protection layer. The touch panel with the conductive protection layer is characterized in that the touch panel comprises a substrate, a sensing electrode layer, a signal lead layer and a conductive protection layer, wherein a joint area is defined on the substrate, the sensing electrode layer is arranged on the substrate, the signal lead layer is arranged on the substrate and comprises multiple signal leads, one end of each signal lead is electrically connected to the sensing electrode layer, the other end of each signal lead is gathered to the joint area, the conductive protection layer comprises multiple conductive blocks, each conductive block is located on the corresponding signal lead in the joint area, and the signal leads are electrically insulated with one another. The invention further provides a manufacturing method of the touch panel with the conductive protection layer. The touch panel and the manufacturing method aim to solve the problem that signal leads are prone to fracturing when being attached to a flexible printed circuit in the prior art, and the product yield is increased.
Description
Technical field
Present invention is directed to touch technology, and relate to a kind of contact panel with conductive protecting layer and preparation method thereof especially.
Background technology
Along with the evolution of touch technology (Touch control), contact panel (touch panel) has been widely used in various consumer electronics device, such as: the portable electric products such as intelligent mobile phone, flat computer, camera, e-book, MP3 player, or be applied to the display screen of operational control unit.
Contact panel generally includes substrate, electrode layer, and electrode layer is electrically connected the signal lead layer of printed circuit board (PCB).But, when forming above-mentioned contact panel, because signal lead layer is by conducting resinl and printed circuit board (PCB) pressing, may occur that in bonding processes signal lead on signal lead layer is by pressure break and then cause electrode layer and printed circuit board (PCB) cannot the problem such as conducting, affect the stability of the electric connection in contact panel between signal lead layer and flexible circuit board, and then affect the yield of product.
Summary of the invention
The invention provides a kind of contact panel with conductive protecting layer, it is characterized in that, comprising: a substrate, this substrate defines a bonding land; One sensing electrode layer, is arranged on this substrate; One signal lead layer, is positioned on this substrate, and this signal lead layer comprises complex signal lead-in wire, and one end of each signal lead is electrically connected on this sensing electrode layer, and the other end converges on this bonding land; One conductive protecting layer, comprises complex conduction block, and each conducting block lays respectively on each signal lead in this bonding land, and these signal leads are electrically insulated each other.
The present invention separately provides a kind of method for making with the contact panel of conductive protecting layer, it is characterized in that, the step of the method for making of this contact panel comprises: provide a substrate, defines a bonding land on this substrate; Form a sensing electrode layer on this substrate; Form a signal lead layer, be positioned on this substrate, this signal lead layer comprises complex signal lead-in wire, and one end of each signal lead is electrically connected on this sensing electrode layer, and the other end converges on this bonding land; Form a conductive protecting layer, comprise complex conduction block, each conducting block lays respectively on each signal lead in this bonding land, and these signal leads are electrically insulated each other.
A kind of contact panel with conductive protecting layer is provided in the present invention.Because conductive protecting layer is positioned on signal lead, on the one hand at signal lead layer, conductive protecting layer, in conducting resinl and printed circuit board (PCB) bonding processes, because conductive protecting layer is located immediately between signal lead layer and conducting resinl, good isolation buffer protective effect can be got, can avoid signal lead layer in bonding processes by pressure break; Conductive layer block can provide more smooth, larger surface in electrical contact on the other hand, is conducive to the electric connection between signal lead layer and flexible circuit board.The stability of the electric connection in contact panel between signal lead layer and flexible circuit board can be improved by this, to improve product yield.
For the above and other object of the present invention, feature and advantage can be become apparent, cited below particularly go out preferred embodiment, and coordinate institute's accompanying drawings, be described in detail below:
Accompanying drawing explanation
Fig. 1 is presented at the top view of the contact panel of one embodiment of the invention.
Fig. 2 is presented at the top view of the bonding land of the contact panel of one embodiment of the invention.
Fig. 3 is presented at the sectional view of the bonding land of the contact panel of one embodiment of the invention.
Fig. 4 is presented at the sectional view of the bonding land of the contact panel of another embodiment of the present invention.
Fig. 5 is presented at the sectional view of the contact panel of another embodiment of the present invention
Fig. 6 is presented at the top view of the contact panel of another embodiment of the present invention.
Fig. 7 is presented at the top view of the bonding land of the contact panel in other embodiments of the present invention.
Fig. 8 is presented at the sectional view of the bonding land of the contact panel of another embodiment of the present invention.
Fig. 9 is presented at the sectional view of the bonding land of the contact panel of another embodiment of the present invention.
Figure 10 is presented at the top view of the contact panel of another embodiment of the present invention.
Figure 11 is presented at the top view of the contact panel of another embodiment of the present invention.
Figure 12 is presented at the sectional view of the contact panel of another embodiment of the present invention.
Figure 13 A to Figure 13 F shows each stage sectional view forming contact panel.
Embodiment
Several different embodiment is provided because of the different characteristic of the present invention.In the present invention, specific assembly and arrangement have been simplification, but the present invention is not limited with these embodiments.For example, the description forming the first assembly on the second assembly can comprise the embodiment that the first assembly directly contacts with the second assembly, also comprises the embodiment having extra assembly and be formed between the first assembly with the second assembly, the first assembly is not directly contacted with the second assembly.In addition, for simplicity's sake, the present invention with the element numbers repeated and/or letter representation, but does not represent between described each embodiment and/or structure and has specific relation in different example.
Fig. 1 is presented at the top view of the contact panel 100 of one embodiment of the invention.For brevity, the subelement of the contact panel 100 directly related with the embodiment of the present invention is only drawn in FIG.See Fig. 1, contact panel 100 comprises a substrate 110.The material of substrate 110 is ethylene terephthalate (PET), polyethersulfone (PES), polyacrylate (PAR), PEN (PEN), polyphenylene sulfide (PPS), polyallyl (polyallylate), polycarbonate (PC) or its analog.Substrate 110 can be hard substrate or flexible substrate.Substrate 110 can be flat shape, curve form or other are irregularly shaped.
Sensing electrode layer 120 is arranged on substrate 110.Sensing electrode layer 120 has a plurality of first electrodes 121X, in another implementation column, the pattern of sensing electrode layer 120 is not limited to this, sensing electrode layer 120 is except being the aspect only having the electrode in a direction in the present embodiment on substrate surface, also can be the aspect on a surface of substrate with the electrode of two different directions, the present embodiment only with, sensing electrode layer 120 is only have the electrode in a direction to be example on a surface of substrate.It should be noted that this sensing electrode layer 120 also has the second electrode 121Y(not shown in the figures), this second electrode 121Y can be arranged on the other one side of this substrate 110 relative to the first electrode 121X, also can be arranged on other one piece of substrate.The transparent conductive material that formation sensing electrode layer 120 adopts comprises tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), cadmium tin (cadmium tin oxide, CTO), aluminum zinc oxide (aluminum zincoxide, AZO), indium tin zinc oxide (indium tin zinc oxide, ITZO), zinc paste (zinc oxide), cadmium oxide (cadmium oxide, CdO), hafnia (hafnium oxide, HfO), indium oxide gallium zinc (indium gallium zincoxide, InGaZnO), indium oxide gallium zinc-magnesium (indium gallium zincmagnesium oxide, InGaZnMgO), indium oxide gallium magnesium (indium galliummagnesium oxide, or indium oxide gallium aluminium (indium galliumaluminum oxide InGaMgO), InGaAlO), nano-silver thread, CNT, Graphene etc.
Signal lead layer 130, be arranged on this substrate 110, signal lead layer 130 comprises complex signal lead-in wire 130a, one end of each signal lead 130a is electrically connected on the first electrode 121X of sensing electrode layer 120 respectively, the other end converges to one of substrate 110 fringe region, formed in the B of bonding land, be electrically insulated each other between signal lead 130a.The material of signal lead layer 130 is such as silver (Ag), gold (Au), copper (Cu), aluminium (Al) or above-mentioned combination, in a better implementation column, signal lead layer 130 is the stacked structure of molybdenum aluminium molybdenum three, wherein between aluminium lamination sandwiched and two layers of molybdenum layer.
Please coordinate referring to figs. 2 and 3, what show in Fig. 2 is the top view of bonding land B in Fig. 1, and Fig. 3 is the sectional view of bonding land in Fig. 2.Show a conductive protecting layer 140 in fig. 2, comprise complex conduction block 140a, each conducting block 140a lays respectively on each signal lead 130a in the B of this bonding land.The material of conductive protecting layer 140 comprises the potpourri of metal material, nonmetallic materials or metal material and nonmetallic materials, and wherein metal material is such as silver (Ag), gold (Au), copper (Cu), aluminium (Al) or above-mentioned combination; Nonmetallic materials are such as electrically conductive ink, and it formed with auxiliary agent (additives) primarily of pigment (pigment), binder (binder).
Please coordinate with reference to figure 4, in a better implementation column, conducting block 140a can cover the signal lead 130a being arranged in bonding land B completely.Therefore adopt this structure, the risk come off under signal lead 130a is subject to the external impacts such as air knife or washing in processing procedure can be reduced.
In an implementation column, if when signal lead 130a employing metallic stacked structure (as molybdenum aluminium molybdenum), because in this metallic stacked structure, the activity of metal is stronger, easily oxidized in atmosphere and form the nonconducting metal oxide of one deck, the final electric conductivity affecting signal lead 130a, if the mode now adopting conducting block 140a to cover signal lead 130a completely can, by signal lead 130a and air exclusion, prevent metal oxidized.
In a better implementation column, conductive protecting layer 140 comprises organic material, and wherein organic material is mainly resinous material, silane or its potpourri etc.And this resinous material mainly comprises acryl resin, epoxy resin, phenolics, unsaturated polyester resin, epoxide modified vinylite or organic siliconresin etc.Improve the attachment relationship between conductive protecting layer 140 and signal lead layer 130 by the high adhesion force of organic material particularly resinous material by this, be better attached on signal lead 130a to make conducting block 140a.
Please coordinate with reference to figure 6, be presented at the sectional view of contact panel in Fig. 1 of the present invention.As shown in figure 11, in an implementation column, contact panel 100 further comprises anisotropy conductiving glue layer 170.Anisotropy conductiving glue layer 170 is arranged at the conductive protecting layer 140a and the signal lead 130a that also cover in the B of bonding land and be positioned at bonding land B.Anisotropy conductiving glue layer 170 is provided with flexible circuit board 180.Stick together fixing flexible circuit board 180 by anisotropy conductiving glue layer 170, flexible circuit board 180 is electrically connected with conductive protecting layer 130a by anisotropy conductiving glue layer 170, then is electrically connected with signal lead 130a by conductive protecting layer 130.Annexation between signal lead layer 130 and flexible circuit board 180 is by pressing signal lead layer 130, conductive protecting layer 140, anisotropy conductiving glue layer 170 and flexible circuit board 180 4 and formed stick together fixed relationship.The touching signals produced by sensing electrode layer 120 by this can be transferred on flexible circuit board 180 by signal lead layer 130, then is connected with controller (not shown) by flexible circuit board 180, finally reaches touch detection function.
Because conductive protecting layer 140 has electric conductivity; therefore before anisotropy conductiving glue layer 170 is set; do not need to remove conductive protecting layer 140; and directly anisotropy conductiving glue layer 170 can be formed at conductive protecting layer 140; and flexible circuit board 180 is set thereon, the object of electric connection can be reached.In addition, conductive protecting layer 140 can provide more smooth, larger surface in electrical contact, therefore is conducive to the electric connection between flexible circuit board 180.
In above-mentioned implementation column; signal lead layer 130; conductive protecting layer 140; anisotropy conductiving glue 170 is with printed circuit board (PCB) 180 bonding processes; because conductive protecting layer 140 is located immediately between signal lead layer 130 and anisotropy conductiving glue 170; good isolation buffer protective effect can be got, can avoid signal lead layer 130 in bonding processes by pressure break.Therefore conductive protecting layer 140 has the requirement on thickness.Conducting block 140a thickness range general control in corresponding conductive protecting layer 140 is at 1 μm to 10 μm; because when the thickness of conducting block 140a is less than 1um time; this conducting block 140a does not have good buffer action because thickness is too thin, easily causes signal lead 130a together with conducting block 140a by the situation of pressure break.The thickness of certain conducting block 140a also should not be greater than 10um, because the thickness of anisotropy conductiving glue 170 is generally less than 12um, if conducting block 140a thickness blocked up (as being greater than 10um), excessive height after easily causing signal lead 130a and conducting block 140a to combine, groove between two groups of signal lead 130a of mutual vicinity and conducting block 140a combine is excessively dark, anisotropy conductiving glue 170 has no idea to fill this groove completely, finally cause non-fill area there is air and produce bubble, affect pressing quality.
Fig. 6 is presented at the top view of the contact panel 200 of another embodiment of the present invention, only draws the subelement of the contact panel 200 directly related with the embodiment of the present invention in this implementation column.One sensing electrode layer 220 is arranged over the substrate 210.Sensing electrode layer 220 is the aspects on a surface of substrate 210 with the electrode of two different directions, be specially sensing electrode layer 220 and can comprise a plurality of arrangement the first electrode 221X in column, a plurality of the second electrode 221Y be arranged in rows and the plural connecting portion 222 connecting the second adjacent electrode 221Y.Be insulation division 223 above each connecting portion 222 of sensing electrode layer 220.In certain embodiments, insulation division 223 is the insulating material of organic or inorganic, such as, be the materials such as pi (polyimide), epoxy resin.Insulation division 223 is bridge 224, bridge 224 is electrically connected the first adjacent electrode.Bridge 234 can be transparent conductive material or the aforementioned combination such as the metal material such as silver, aluminium, indium tin oxide (ITO).One signal lead layer 230, be arranged on this substrate 210, this signal lead layer 230 comprises complex signal lead-in wire 230a, on the first electrode 221X that one end of each signal lead 230a is electrically connected at this sensing electrode layer 220 respectively or the second electrode 221Y, the other end converges to one of substrate 210 fringe region, formed in the B of bonding land, be electrically insulated each other between signal lead 230a.
In an implementation column, contact panel 200 can comprise a shielding layer 250 further and be arranged at fringe region on substrate 210, because shielding layer 250 has screening effect, usually utilize shielding layer 250 to cover the perimeter component (as signal lead layer 230 etc.) of contact panel 200, because if the words of these perimeter component not cresteds, user directly can see the existence of these perimeter components when using contact panel 200, affect the attractive in appearance of contact panel 200.In the present embodiment, the region deviding that on substrate 210, crested layer 250 covers goes out a non-visible area M, and V corresponding non-visible area M in visible area exists, as non-visible area M can be positioned at least one side of visible area V, to form relative position relation.Bonding land B is positioned at non-visible area V.Sensing electrode layer 220 arranges over the substrate 210 and extends on shielding layer 250 from visible area V.
Shielding layer 250 can be the coloured photoresist primarily of resin, pigment, emulsion and solvent composition.In certain embodiments, shielding layer 220 adopts black photoresist, as pi or ink material.
Please coordinate with reference to what show in figure 7 and Fig. 8, Fig. 7 is the top view of bonding land B in Fig. 6, and Fig. 8 is the sectional view of bonding land in Fig. 7.Show a conductive protecting layer 240 in Fig. 7, comprise complex conduction block 240a, each conducting block 240a lays respectively on each signal lead 230a in the B of this bonding land, and is electrically insulated each other between these signal leads 230a.
Please coordinate with reference to figure 9, in a better implementation column, conducting block 240a can cover the signal lead 230a being arranged in land B completely.Therefore adopt this structure, on the one hand, signal lead 230a can be reduced in processing procedure, be subject to the risk that the external impacts such as air knife or washing comes off.On the other hand, because signal lead layer 230 is formed directly on shielding layer 250, when shielding layer 250 adopts ink material to print, easily there is the problems such as surface irregularity, and these problems can cause signal lead layer 230 to be difficult to be attached on shielding layer 150, finally cause signal lead layer 230 to occur problems such as coming off, therefore adopt conducting block 240a to cover the mode of signal lead 230a completely, signal lead 230a further can be attached on shielding layer 250.
In an implementation column, if when signal lead 230a employing metallic stacked structure, because this metallic stacked structure activity is stronger, easily oxidized in atmosphere and form the nonconducting metal-oxide film of one deck, the final electric conductivity affecting signal lead 230a, if the mode now adopting conducting block 240a to cover signal lead 230a completely can, by signal lead 230a and air exclusion, prevent metal therebetween oxidized.
In a better implementation column, this conductive protecting layer 240 comprises organic material, and wherein organic material is mainly resinous material, silane or its potpourri etc.And this resinous material mainly comprises acryl resin, epoxy resin, phenolics, unsaturated polyester resin, epoxide modified vinylite or organic siliconresin etc.Improve conductive protecting layer 240 and the attachment relationship of shielding layer 250 by the high adhesion force of organic material particularly resinous material, be better attached on shielding layer 250 to make signal lead layer 230.
Please coordinate with reference to Figure 10, in a better implementation column, more comprise a lead finish 260 cover these signal leads 230a outside the B of this bonding land.This lead finish 260 can for being that conductive material is made or is made by insulating material.It should be noted that the formation of this lead finish 260 is not restricted with the pattern of sensing electrode layer 220 difference, in other implementation columns, this lead finish 260 also can be formed in the structure of contact panel 100 as shown in Figure 1.
Please coordinate with reference to Figure 10; when lead finish 260 is conductive material; this lead finish 260 comprises plural pilot protection 260a, and each pilot protection 260a covers on each signal lead 230a of being positioned at outside the B of this bonding land respectively, and these signal leads 230a is electrically insulated each other.This lead finish 260 comprises organic material, and wherein organic material is mainly resinous material, silane or its potpourri etc.And this resinous material mainly comprises acryl resin, epoxy resin, phenolics, unsaturated polyester resin, epoxide modified vinylite or organic siliconresin etc.Improve lead finish 260 and the attachment relationship of shielding layer 250 by the high adhesion force of organic material particularly resinous material, be better attached on shielding layer 250 to make signal lead layer 230.Meanwhile, when the lead finish 260 with conducting function can be used for preventing signal lead 230a local fracture, the signal transfer functions of signal lead can still be ensured.
Please coordinate with reference to Figure 11, when lead finish 260 is insulating material, lead finish 260 is covered on flood signal lead layer 230 comprehensively.The material of lead finish 260 can be the coloured photoresist primarily of resin, pigment, emulsion and solvent composition.In certain embodiments, shielding layer 250 adopts black photoresist, as pi or ink material.Increased the shielding of shielding layer 150 by this by the existence of lead finish 260, reduce the visual problem of other perimeter components such as signal lead layer 130 grade further.
Please coordinate with reference to Figure 12, be presented at the sectional view of contact panel in Fig. 6 of the present invention.As shown in figure 12; relative to Fig. 5; contact panel 200 further comprises a shielding layer 250 in the present embodiment; the region deviding that shielding layer 250 covers goes out a non-visible area M; the existence of the corresponding non-visible area M of visible area V; bonding land B is on shielding layer 250; sensing electrode layer 220 arranges over the substrate 210 and extends on shielding layer 250 from visible area V; and corresponding signal lead layer 230; conductive protecting layer 240; anisotropy conductiving glue layer 270 is identical with Fig. 5 with flexible circuit board 880 4 position relationship, therefore repeats no more.
Please coordinate with reference to Figure 13 A ~ Figure 13 F, Figure 13 A to Figure 13 F shows in an implementation column each stage sectional view forming contact panel 100.
As shown in FIG. 13A, provide a substrate 110, on this substrate, define a bonding land B; As shown in Figure 13 B, a sensing electrode layer 120 is formed on this substrate 110; Form a signal lead layer 130 as shown in fig. 13 c, this signal lead layer 130 comprises complex signal lead-in wire 130a, and one end of each signal lead 130a is electrically connected on the first electrode 121X on this sensing electrode layer 120, the other end converges on the B of this bonding land; As illustrated in figure 13d, form a conductive protecting layer 140, comprise complex conduction block 140a, each conducting block 140a lays respectively on each signal lead 130a in the B of this bonding land, and these signal leads 130a is electrically insulated each other.
As shown in figure 13e, in a better implementation column, comprise formation one anisotropic electric glue-line 170 further in the B of this bonding land, also cover these conductive protecting layers 140a and the signal lead 130a that are positioned at this bonding land B.
As shown in Figure 13 F, form a flexible circuit board 180, this flexible circuit board 180 sticks together fixing by this anisotropy conductiving glue layer 170, and is electrically connected with these signal leads 130a by this anisotropy conductiving glue layer 170.
It should be noted that, the generation type of contact panel 200 is roughly the same with the generation type of contact panel 100, unique difference is that before formation induction electrode layer 200, more comprise a step forms shielding layer 250, the region deviding that shielding layer 250 covers goes out a non-visible area M, the existence of the corresponding non-visible area M of visible area V, bonding land B is on shielding layer 250, sensing electrode layer 220 arranges over the substrate 210 and extends on shielding layer 250 from visible area V, other steps are identical with Figure 13 A ~ Figure 13 F, therefore repeat no more.
A kind of contact panel with conductive protecting layer is provided in the present invention.Because conductive protecting layer is positioned on signal lead, on the one hand at signal lead layer, conductive protecting layer, in conducting resinl and printed circuit board (PCB) bonding processes, because conductive protecting layer is located immediately between signal lead layer and conducting resinl, good isolation buffer protective effect can be got, can avoid signal lead layer in bonding processes by pressure break; Conductive layer block can provide more smooth, larger surface in electrical contact on the other hand, is conducive to the electric connection between signal lead layer and flexible circuit board.The stability of the electric connection in contact panel between signal lead layer and flexible circuit board can be improved by this, to improve product yield.
Although the present invention discloses as above with several preferred embodiment; so itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the invention; when doing any change and retouching, the protection domain of therefore the present invention when depending on after the attached claim person of defining be as the criterion.
Claims (18)
1. there is a contact panel for conductive protecting layer, it is characterized in that, comprising:
One sensing electrode layer, is arranged on a substrate;
One signal lead layer, is positioned on this substrate, and this signal lead layer comprises complex signal lead-in wire, and one end of each signal lead is electrically connected on this sensing electrode layer, and the other end converges in this substrate one fringe region, forms a bonding land;
One conductive protecting layer, comprises complex conduction block, and each conducting block lays respectively on each signal lead in this bonding land, and these signal leads are electrically insulated each other.
2. contact panel according to claim 1, is characterized in that, this conductive protecting layer comprises the potpourri of metal material, nonmetallic materials or metal material and nonmetallic materials.
3. contact panel according to claim 2, is characterized in that, this conductive protecting layer is electrically conductive ink.
4. contact panel according to claim 1, is characterized in that, this conductive protecting layer comprises organic material.
5. contact panel according to claim 4, is characterized in that, this organic material is resinous material, silane or its potpourri.
6. contact panel according to claim 5, is characterized in that, this resinous material comprises acryl resin, epoxy resin, phenolics, unsaturated polyester resin, epoxide modified vinylite or organic siliconresin.
7. contact panel according to claim 1, is characterized in that, this conducting block thickness range is 1 μm to 10 μm.
8. contact panel according to claim 1, is characterized in that, this conducting block covers this signal lead completely.
9. contact panel according to claim 1, it is characterized in that, more comprise a shielding layer, be arranged between this substrate and this signal lead layer, the setting area of this shielding layer defines this non-visible area, and this bonding land be positioned at this non-visible area shielding layer on shielding layer defines one.
10. contact panel according to claim 9, is characterized in that, this sensed layer comprises: the first electrode, a plurality of the second electrode be arranged in rows that a plurality of arrangement is in column, and the connecting portion of a plurality of connection this second electrode adjacent; Plural number bridge, in order to be connected to this first electrode on same row and adjacent; And plural insulation division, be arranged between this connecting portion and this bridge.
11. contact panels according to claim 1 or 9, is characterized in that, more comprise a lead finish, cover these signal leads be positioned at outside this bonding land.
12. contact panels according to claim 11; it is characterized in that, when this lead finish is conductive layer, this lead finish comprises plural pilot protection block; each protection block covers on each signal lead of being positioned at outside this bonding land respectively, and these signal leads are electrically insulated each other.
13. contact panels according to claim 11, is characterized in that, this lead finish is insulation course.
14. contact panels according to claim 1, is characterized in that, comprise an anisotropic electric glue-line further in this bonding land, also cover these signal leads being positioned at this bonding land.
15. contact panels according to claim 14, is characterized in that, more comprise a flexible circuit board, and this flexible circuit board sticks together fixing by anisotropy conductiving glue layer, and are connected with these signal leads by this anisotropy conductiving glue layer.
16. 1 kinds of method for makings with the contact panel of conductive protecting layer, it is characterized in that, the step of the method for making of this contact panel comprises:
Form a sensing electrode layer on a substrate;
Form a signal lead layer, be positioned on this substrate, this signal lead layer comprises complex signal lead-in wire, and one end of each signal lead is electrically connected on this sensing electrode layer, and the other end converges in this substrate one fringe region, forms bonding land;
Form a conductive protecting layer, comprise complex conduction block, each conducting block lays respectively on each signal lead in this bonding land, and these signal leads are electrically insulated each other.
17. contact panel method for makings according to claim 16, is characterized in that, comprise formation one anisotropic electric glue-line further in this bonding land, also cover these signal leads being positioned at this bonding land.
18. contact panel method for makings according to claim 17, it is characterized in that, comprise formation one flexible circuit board further, this flexible circuit board sticks together fixing by this anisotropy conductiving glue layer, and is electrically connected by this anisotropy conductiving glue layer and these signal leads.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310440213.1A CN104461101A (en) | 2013-09-25 | 2013-09-25 | Touch panel with conductive protection layer and manufacturing method thereof |
| TW103118535A TWI524236B (en) | 2013-09-25 | 2014-05-28 | Touch panel with conductive protection layer and method for manufacturing the same |
| TW103209338U TWM490056U (en) | 2013-09-25 | 2014-05-28 | Touch panel with conductive protection layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310440213.1A CN104461101A (en) | 2013-09-25 | 2013-09-25 | Touch panel with conductive protection layer and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN104461101A true CN104461101A (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310440213.1A Pending CN104461101A (en) | 2013-09-25 | 2013-09-25 | Touch panel with conductive protection layer and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN104461101A (en) |
| TW (2) | TWM490056U (en) |
Cited By (5)
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| CN104850295A (en) * | 2015-05-08 | 2015-08-19 | 业成光电（深圳）有限公司 | Touch control display device and color filter substrate |
| CN106155403A (en) * | 2015-04-27 | 2016-11-23 | 南昌欧菲光显示技术有限公司 | Touch control component |
| CN106886325A (en) * | 2015-12-16 | 2017-06-23 | 瀚宇彩晶股份有限公司 | Contact panel and electronic installation |
| CN108932073A (en) * | 2017-05-22 | 2018-12-04 | 祥达光学（厦门）有限公司 | Touch panel and its pin configuration |
| CN110825253A (en) * | 2018-08-13 | 2020-02-21 | 南昌欧菲光科技有限公司 | Touch control assembly and touch display screen |
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| CN106155403A (en) * | 2015-04-27 | 2016-11-23 | 南昌欧菲光显示技术有限公司 | Touch control component |
| CN104850295A (en) * | 2015-05-08 | 2015-08-19 | 业成光电（深圳）有限公司 | Touch control display device and color filter substrate |
| CN104850295B (en) * | 2015-05-08 | 2018-02-06 | 业成光电（深圳）有限公司 | Touch control display apparatus and colored filter substrate |
| CN106886325A (en) * | 2015-12-16 | 2017-06-23 | 瀚宇彩晶股份有限公司 | Contact panel and electronic installation |
| CN108932073A (en) * | 2017-05-22 | 2018-12-04 | 祥达光学（厦门）有限公司 | Touch panel and its pin configuration |
| CN110825253A (en) * | 2018-08-13 | 2020-02-21 | 南昌欧菲光科技有限公司 | Touch control assembly and touch display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201512929A (en) | 2015-04-01 |
| TWM490056U (en) | 2014-11-11 |
| TWI524236B (en) | 2016-03-01 |
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Application publication date: 20150325 |