CN201623157U - Lead bonding reinforcing structure - Google Patents
Lead bonding reinforcing structure Download PDFInfo
- Publication number
- CN201623157U CN201623157U CN2010200205742U CN201020020574U CN201623157U CN 201623157 U CN201623157 U CN 201623157U CN 2010200205742 U CN2010200205742 U CN 2010200205742U CN 201020020574 U CN201020020574 U CN 201020020574U CN 201623157 U CN201623157 U CN 201623157U
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- CN
- China
- Prior art keywords
- glue
- bonding
- substrate
- wire
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48455—Details of wedge bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model relates to the lead bonding technology of microelectronic system packaging and semiconductor lighting field, in particular to a lead bonding reinforcing structure capable of enhancing the strength of lead bonding, which comprises a substrate (1) and a welding wire (2) welded on the end face of the substrate (1), and is characterized in that: the welding wire (2) is fixed on the substrate (1) through a welding point (3), and the root of a neck part (4) formed by the leading-out end of the welding wire (2) and the welding point (3) is coated with a reinforcing adhesive. The neck part adopts the reinforcing adhesive, a 302 adhesive or a conductive silver adhesive and other substances capable of bonding the welding point and the substrate, so that the bonding strength of bonding leads can be improved, the overcurrent capacity of the bonding leads can be increased, and the phenomena that microelectronic packaging products are broken due to insufficient strength and are rapidly aged due to insufficient overcurrent capacity can be eliminated.
Description
Technical field
The utility model relates to microelectronics system encapsulation and field of semiconductor illumination Wire Bonding Technology, particularly a kind of lead-in wire bonding reinforced structure that can strengthen the lead-in wire bond strength.
Background technology
Wire Bonding Technology is simple with its technology, and is with low cost, is suitable for multiple encapsulation; And can realize the high efficiency encapsulation, and become one of the most popular chip in current microelectronics Packaging field and substrate interconnection technique.Along with the development of great power LED, the conveyance capacity of para-linkage lead-in wire is had higher requirement.The LED of current high-power multiple chips array mainly encapsulates with the COB technology, Wire Bonding Technology is the critical process of COB packaging technology, and the COB technology can not only improve package power density, and can reduce packaging thermal resistance, therefore study Wire Bonding Technology and have great significance for the encapsulation of studying great power LED.
The lead-in wire bonding then can be divided into ball bonding (ball bonding) and wedge shape weldering (wedge bonding) according to the solder joint shape.And the bottleneck point after the wedge shape welding is exactly a neck, and in order to improve the bond strength of whole bonding line, key is exactly the intensity of reinforcement neck.Microelectronic product is after use after a while, and the reason of the significant proportion that breaks down all is bonding wire because due to not enough very fast the wearing out of undercapacity fracture or conveyance capacity.So improve the bond strength of bonding wire, the conveyance capacity that increases bonding wire has important meaning.
Summary of the invention
The purpose of this utility model provides a kind of lead-in wire bonding reinforced structure, take at the material formation coating reinforced structure of neck with can bond solder joint and substrates such as 302 glue or conductive silver glues, can improve the bond strength of bonding wire, increase the conveyance capacity of bonding wire, and can prevent that the microelectronics Packaging product is very fast aging owing to the deficiency of undercapacity fracture or conveyance capacity.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead-in wire bonding reinforced structure, comprise substrate and be welded on the welding wire of substrate end-face, it is characterized in that: this welding wire is fixed on the substrate by solder joint, and the neck butt that welding wire exit and solder joint constitute is provided with reinforcement glue.
Described reinforcement glue is 302 glue or conductive silver glue.
Described neck butt is provided with reinforcement glue and takes 302 glue signal layer coating reinforced structures or conductive silver glue signal layer coating reinforced structure or 302 glue and conductive silver glue composite coating reinforced structure.
The utility model is from improving the intensity of lead-in wire bonding, by taking the mode of butt welding point neck with 302 glue or conductive silver glue individual layer or composite construction reinforcement, on original production technology, can realize the raising of bond strength that goes between, thereby make the microelectronics system after the encapsulation more reliable; And use reinforcement glue for example conductive silver glue can also increase the conveyance capacity of neck, and the bottleneck point of the conveyance capacity of lead-in wire is also at neck, so help using this technology to carry out the encapsulation of high power device more.
Its advantage is:
1) inorganic and organic gel class strengthens the intensity of neck with 302 glue etc. at neck, thereby the bond strength of whole lead-in wire is got a promotion, and prevents that the product after mechanical oscillation are to encapsulated moulding from bringing harmful effect, has improved the shock resistance and the reliability of product.
2), and then the conveyance capacity of whole lead-in wire is got a promotion by using conducting resinl classes such as conductive silver glue to play the effect that increases the neck conveyance capacity at neck.
3) use compound coating structure, use conducting resinl classes such as one deck conductive silver glue earlier, being mainly used in increases its conveyance capacity, re-uses inorganic and organic gel class such as one deck 302 glue and strengthens the intensity of neck, thereby the conveyance capacity of bonding wire and bond strength are all got a promotion.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, this lead-in wire bonding reinforced structure comprises substrate 1 and is welded on the welding wire 2 of substrate 1 end face, and wherein: this welding wire 2 is fixed on the substrate 1 by solder joint 3, and the neck 4 butts point that welding wire 2 exits and solder joint 3 constitute scribbles reinforcement glue.Described reinforcement glue is 302 glue or conductive silver glue.
Described the signal layer coating reinforced structure that reinforcement glue is taked spot printing 302 glue is set, this inorganic glue can make the bond strength of whole lead-in wire (welding wire) get a promotion, prevent that the product after mechanical oscillation are to encapsulated moulding from bringing harmful effect, improved the shock resistance and the reliability of product.
The above-mentioned signal layer coating reinforced structure that reinforcement glue is set or takes the spot printing conductive silver glue, this conducting resinl play the effect that increases neck 4 conveyance capacities, and then the conveyance capacity of whole lead-in wire (welding wire) is got a promotion.
Above-mentionedly reinforcement glue is set or takes the composite coating reinforced structure, using one deck conductive silver glue, this conducting resinl class to be mainly used in earlier increases its conveyance capacity; Re-use one deck 302 glue, this inorganic and organic gel class strengthens the intensity of neck, thereby the conveyance capacity of bonding wire and bond strength are all got a promotion.Therefore, take this composite coating reinforced structure can access better reinforcing effect.
Being formed on lead-in wire is bonded on substrate 1 or the chip promptly to accuse of lead-in wire bond strength finished.
The mode of above-mentioned coating reinforcement glue is the mode by a glue, does not need to change original production equipment and technology.
The utility model uses the material effect of can bond solder joint and substrates such as 302 glue or conductive silver glue to be at neck 4:
1) improves the intensity of lead-in wire bonding, prevented the harmful effect that the product after mechanical oscillation are to encapsulated moulding brings, improved the shock resistance and the reliability of product, prolonged the useful life of device.
2) conducting resinl class such as conductive silver glue can also play the effect that increases the neck conveyance capacity, and the also bottleneck point of whole often lead-in wire conveyance capacity of the conveyance capacity of neck, so with the encapsulation that is more suitable for after the binding agent reinforcement in high power device.
Claims (3)
1. lead-in wire bonding reinforced structure, comprise substrate (1) and be welded on the welding wire (2) of substrate (1) end face, it is characterized in that: this welding wire (2) is fixed on the substrate (1) by solder joint (3), and neck (4) butt that welding wire (2) exit and solder joint (3) constitute is provided with reinforcement glue.
2. a kind of lead-in wire bonding reinforced structure according to claim 1, it is characterized in that: described reinforcement glue is 302 glue or conductive silver glue.
3. a kind of lead-in wire bonding reinforced structure according to claim 1 is characterized in that: described neck (4) butt is provided with reinforcement glue and takes 302 glue signal layer coating reinforced structures or conductive silver glue signal layer coating reinforced structure or 302 glue and conductive silver glue composite coating reinforced structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200205742U CN201623157U (en) | 2010-01-19 | 2010-01-19 | Lead bonding reinforcing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200205742U CN201623157U (en) | 2010-01-19 | 2010-01-19 | Lead bonding reinforcing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623157U true CN201623157U (en) | 2010-11-03 |
Family
ID=43026614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200205742U Expired - Fee Related CN201623157U (en) | 2010-01-19 | 2010-01-19 | Lead bonding reinforcing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623157U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104461101A (en) * | 2013-09-25 | 2015-03-25 | 宸鸿科技(厦门)有限公司 | Touch panel with conductive protection layer and manufacturing method thereof |
| CN107731772A (en) * | 2017-09-13 | 2018-02-23 | 北京无线电测量研究所 | A kind of wedge bonding lead ruggedized construction and reinforcement means |
-
2010
- 2010-01-19 CN CN2010200205742U patent/CN201623157U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104461101A (en) * | 2013-09-25 | 2015-03-25 | 宸鸿科技(厦门)有限公司 | Touch panel with conductive protection layer and manufacturing method thereof |
| CN107731772A (en) * | 2017-09-13 | 2018-02-23 | 北京无线电测量研究所 | A kind of wedge bonding lead ruggedized construction and reinforcement means |
| CN107731772B (en) * | 2017-09-13 | 2020-08-04 | 北京无线电测量研究所 | Wedge-shaped bonding lead reinforcing structure and reinforcing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20110119 |