CN100369533C - Wire soldering method for circuit board package - Google Patents

Wire soldering method for circuit board package Download PDF

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Publication number
CN100369533C
CN100369533C CNB200410002808XA CN200410002808A CN100369533C CN 100369533 C CN100369533 C CN 100369533C CN B200410002808X A CNB200410002808X A CN B200410002808XA CN 200410002808 A CN200410002808 A CN 200410002808A CN 100369533 C CN100369533 C CN 100369533C
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China
Prior art keywords
bonding wire
circuit board
ball
weld
welded
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Expired - Fee Related
Application number
CNB200410002808XA
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Chinese (zh)
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CN1642391A (en
Inventor
彭育民
蔡铭山
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Dunnan Science And Tech Co Ltd
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Dunnan Science And Tech Co Ltd
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Priority to CNB200410002808XA priority Critical patent/CN100369533C/en
Publication of CN1642391A publication Critical patent/CN1642391A/en
Application granted granted Critical
Publication of CN100369533C publication Critical patent/CN100369533C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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Abstract

The present invention relates to a wire welding method for packaging a circuit board, which is characterized in that firstly, a planting ball is welded on the welding point of a printed circuit board, one end of a welding wire is welded on the welding point of a chip on the printed circuit board, the welding wire is pulled, and the other end of the welding wire is welded to the planting ball of the printed circuit board, wherein before one planting ball is welded on the welding point in advance, the front end of the welding wire is knotted into a welding ball, and the planting ball is formed after the welding ball is welded on the welding point of the base board; after one planting ball is welded on the welding point in advance, the welding wire and the planting ball are separated; before the welding wire is welded to the welding point of the chip on the base board, a welding ball is formed at the front end of the welding wire in advance to cause the welding ball to be welded to the welding point of the chip on the base board; after the other end of the welding wire is welded to the planting ball of the base board, the welding wire behind the planting ball is separated from the planting ball. Thus, the combined area of the welding wire and the printed circuit board can be increased to enhance the connection strength to prevent the welding wire and the printed circuit board from being disengaged because of other external factors.

Description

The bonding wire method of circuit board encapsulation
Technical field
The present invention relates to the bonding wire method of a kind of circuit board encapsulation, particularly a kind ofly improve the bonding wire method that circuit board and the circuit board that is connected area and intensity of bonding wire encapsulate.
Background technology
Known semiconductor packages engineering, particularly in the encapsulation process (chipon board) of chip on printed circuit board (PCB), need utilize the bonding wire method of circuit board encapsulation, to utilize routing system (wire bondsystem) that bonding wire is connected on this chip and this seal circuit board, so make this chip be electrically connected (seeing also Fig. 1 to shown in Figure 3) with this printed circuit board (PCB), the step of the bonding wire method of this circuit board encapsulation is:
1. the bonding wire 11a front end that runs through the magnetic mouth 10a of this routing system is formed soldered ball 12a in advance.
2. utilize this magnetic mouth 10a to compress the weld 31a of the chip 30a (chip) of soldered ball 12a on this printed circuit board (PCB) 20a of this bonding wire 11a, to weld this soldered ball 12a thereon;
3. this magnetic mouth 10a is moved a distance, and make this magnetic mouth 10a draw this bonding wire 11a simultaneously and compress the weld 21a of this bonding wire 11a, to weld this bonding wire 11a other end thereon in this printed circuit board (PCB) 20a;
4. the bonding wire 11a on the weld 21a of this printed circuit board (PCB) 20a is separated with bonding wire 11a on this magnetic mouth 10a.
So bonding wire 11a can be welded in this printed circuit board (PCB) 20a and this chip 30a (chip), with so that bonding wire 11a as the electric connection line of this printed circuit board (PCB) 20a and this chip 20a.
The bonding wire method of above-mentioned known circuit board encapsulation still has following shortcoming:
1. see also shown in the 3rd A figure, wherein this bonding wire is connected with the weld of printed circuit board (PCB) end with wedge shape binding site (wedge bond) form, and the gluing area power of this wedge shape binding site and weld is few, and connection power a little less than, therefore break away from mutually because of external force easily.
2. this printed circuit board (PCB) is in the processing procedure of electroplating process or surface mount technology (SMT), because the weld on this printed circuit board (PCB) is easily because of poor plating, pollution or scratch, cause bonding wire soldered thereon the time, cause the area that sticks together of bonding wire and weld more to reduce, so that produce the adhesion deficiency of bonding wire and printed circuit board (PCB), and disengaging and influence reliability mutually easily.
Therefore, the present invention proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.
Summary of the invention
One purpose of the present invention provides the bonding wire method of circuit board encapsulation, with the area that sticks together of raising printed circuit board (PCB) and bonding wire, and strengthens its bonding strength.
Its two purpose of the present invention provides the bonding wire method of circuit board encapsulation, so that the chip and the bonding wire that are exposed on the printed circuit board (PCB) do not need to utilize the sealing seal protection again, so save many processing procedure times and cost.
According to aforementioned goal of the invention, the present invention is a kind of bonding wire method of circuit board encapsulation, and its step comprises:
Plant ball prior to the weld welding one of substrate before bonding wire being welded in the weld of this chip;
Again an end of bonding wire is soldered to the weld of the chip on this substrate, and draw this bonding wire, make the other end of this bonding wire be soldered to planting on the ball of this substrate, wherein, weld one in advance in this weld and make the bonding wire front end form a soldered ball earlier before planting ball, and be welded in and form this behind the weld of this substrate and plant ball; This weld welds one in advance and plants and make this bonding wire and this plant ball again behind the ball to separate; Before this bonding wire is soldered to the weld of the chip on this substrate, form a soldered ball prior to this bonding wire weldering front end, so that this soldered ball is soldered to the weld of the chip on this substrate; In the other end of this bonding wire be soldered to this substrate plant ball after, make this plant bonding wire behind the ball and plant ball with this and separate; This substrate is a printed circuit board (PCB), and this weld is a weld pad.The bonding wire method of this circuit board encapsulation utilizes the ultrasonic waves wire bonder to finish.The bonding strength that the welding that increases this bonding wire and this substrate like this is touched, and chip is permitted in saving and bonding wire utilizes processing procedure and the cost of sealing seal protection in substrate.
In order further to understand feature of the present invention and technology contents, see also following relevant detailed description of the present invention and accompanying drawing, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is a known bonding wire when desiring to be welded in chip, forms the schematic diagram of a soldered ball earlier.
Fig. 2 is that known magnetic mouth makes bonding wire be welded in chip and printed circuit board (PCB) schematic diagram.
Fig. 3 is that the bonding wire on the weld of known printed circuit board (PCB) separates schematic diagram with bonding wire on the magnetic mouth.
Fig. 3 A is the bonding wire end partial schematic diagram on the weld of printed circuit board (PCB) of Fig. 3.
Fig. 4 is a bonding wire of the present invention when desiring to be welded in the weld of printed circuit board (PCB), forms a soldered ball schematic diagram earlier.
Fig. 5 plants the ball schematic diagram on the weld that is welded in printed circuit board (PCB) of the present invention.
Fig. 6 is that magnetic mouth of the present invention compresses and weld the schematic diagram of soldered ball on chip.
Fig. 7 is that an end of bonding wire of the present invention is welded in chip, and the other end be welded in printed circuit board (PCB) plant the ball schematic diagram.
Fig. 7 A is welded in the partial schematic diagram of planting ball for bonding wire end among Fig. 7.
Wherein, description of reference numerals is as follows:
Magnetic mouth 10a magnetic mouth 10
Bonding wire 11a bonding wire 11
Soldered ball 12a soldered ball 12
Printed circuit board (PCB) 20a printed circuit board (PCB) 20
Weld 21a weld 21 (first bond)
Chip 30a (chip) plants ball 22
Weld 31a chip 30 (chip)
Weld 31 (second bond)
Embodiment
See also Fig. 4 to shown in Figure 7, the present invention is a kind of bonding wire method of circuit board encapsulation, before chip 30 (chip) and printed circuit board (PCB) 20 welding, weld one in advance prior to the weld 21 (first bond) of printed circuit board (PCB) 20 and plant ball 22, the soldered ball 12 that welds bonding wire 11 front ends again is on chip 30 (chip), and draw the weld 21 (first bond) of this bonding wire 11 to this printed circuit board (PCB) 20, and bonding wire 11 compressed be welded in this and plant on the ball 22, so increase the bonding area of bonding wire 11 and printed circuit board (PCB) 20.
See also Fig. 4 to shown in Figure 5, utilize ultrasonic waves wire bonder welding chip 30 (chip) and printed circuit board (PCB) 20, therefore in advance form a soldered ball 12 prior to the bonding wire 11 of magnetic mouth 10 front ends that run through this ultrasonic waves wire bonder, and utilize magnetic mouth 10 to compress the weld 21 (firstbond) of this soldered ball 12 in this printed circuit board (PCB) 20, with welding thereon, separate this soldered ball 12 and this bonding wire 11 again, so form and plant ball 22 on this weld 21 (first bond), make this plant ball 22 again and separate with this bonding wire 11.
See also Fig. 6 to shown in Figure 7, form a soldered ball 12 in the bonding wire 11 of these magnetic mouth 10 front ends again, and make magnetic mouth 10 compress this soldered ball 12 on the weld 31 (second bond) of this chip 30 (chip), this weld 31 (second bond) is a weld pad, draw this bonding wire 11 again and plant ball 22 to this printed circuit board (PCB) 20, and this bonding wire 11 is compressed and be welded in this plant on the ball 22, the weld 21 (first bond) of this bonding wire 11 and this printed circuit board (PCB) 20 is formed conduct, this bonding wire 11 of planting behind the ball 22 is separated with bonding wire 11 on this magnetic mouth 10.So increase this bonding wire 11 and this printed circuit board (PCB) 20 weld 21 (first bond) stick together area (shown in Fig. 7 A); therefore make the enhancing of sticking together of this bonding wire 11 and weld 21 (first bond); to avoid external force factor to make this bonding wire 11 break away from this weld 21 (first bond); and when applying in the electronic product of consumer; because of the connectivity of this bonding wire 11 with this chip 30 (chip) and this printed circuit board (PCB) 20 strengthens; therefore make the chip 30 (chip) and the bonding wire 11 thereof that are exposed on this printed circuit board (PCB) 20 not need to utilize the sealing seal protection again, so save many processing procedure times and cost.
In sum; therefore improve the area that sticks together of printed circuit board (PCB) and bonding wire by the bonding wire method of circuit board encapsulation of the present invention; and strengthen its bonding strength; and make the chip that is exposed on the printed circuit board (PCB) and on bonding wire do not need to utilize the sealing seal protection again, so save many processing procedure times and cost.
Above-mentioned only is preferable possible embodiments of the present invention, and non-so inflexible limit claim of the present invention so the equivalent structure that all utilizations specification of the present invention and accompanying drawing content are done changes, all in like manner is contained in the scope of the present invention.

Claims (8)

1. the bonding wire method of circuit board encapsulation, step wherein comprises:
Ball is planted in weld welding one earlier in a substrate; And
Make an end of bonding wire be welded in the weld of the chip on this substrate again, and draw this bonding wire, make the other end of this bonding wire be welded in planting on the ball of this substrate.
2. the bonding wire method of circuit board as claimed in claim 1 encapsulation wherein, is welded one in advance in this weld and is made the bonding wire front end form a soldered ball earlier before planting ball, and is welded in and forms this behind the weld of this substrate and plant ball.
3. the bonding wire method of circuit board as claimed in claim 2 encapsulation, wherein, this weld welds one in advance and plants and make this bonding wire and this plant ball again behind the ball to separate.
4. the bonding wire method of circuit board encapsulation as claimed in claim 1 wherein, before this bonding wire is soldered to the weld of the chip on this substrate, forms a soldered ball prior to this bonding wire weldering front end, so that this soldered ball is soldered to the weld of the chip on this substrate.
5. the bonding wire method of circuit board as claimed in claim 1 encapsulation, wherein, in the other end of this bonding wire be soldered to this substrate plant ball after, make this plant bonding wire behind the ball and plant ball with this and separate.
6. the bonding wire method of circuit board encapsulation as claimed in claim 1, wherein, this substrate is a printed circuit board (PCB).
7. the bonding wire method of circuit board encapsulation as claimed in claim 1, wherein, the weld of this substrate and the weld of this chip are weld pad.
8. the bonding wire method of circuit board encapsulation as claimed in claim 1 utilizes the ultrasonic waves wire bonder to finish.
CNB200410002808XA 2004-01-18 2004-01-18 Wire soldering method for circuit board package Expired - Fee Related CN100369533C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB200410002808XA CN100369533C (en) 2004-01-18 2004-01-18 Wire soldering method for circuit board package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB200410002808XA CN100369533C (en) 2004-01-18 2004-01-18 Wire soldering method for circuit board package

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Publication Number Publication Date
CN1642391A CN1642391A (en) 2005-07-20
CN100369533C true CN100369533C (en) 2008-02-13

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TW201316423A (en) * 2011-10-04 2013-04-16 Lextar Electronics Corp Enhanced method of wire bonding between substrate and semiconductor chip and soldering control system
CN103972221A (en) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 LED (light-emitting diode) light source packaging structure and method
CN107808829A (en) * 2017-10-24 2018-03-16 南京矽邦半导体有限公司 One kind is directed to the small secondary wire soldering method of pad chip

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CN1372312A (en) * 2001-02-26 2002-10-02 华泰电子股份有限公司 Wafer formation metal convex block package structure and making method thereof
CN1396799A (en) * 2001-07-11 2003-02-12 三星电子株式会社 Printed circuit board with improved pad structure
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